Atmel AT24C16C Datasheet

Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016

Standard Features

 Low-voltage and Standard-voltage Operation

 VCC = 1.7V to 5.5V

 Internally Organized as 2,048 x 8 (16K)

 I

2

C-compatible (2-wire) Serial Interface

 Schmitt Trigger, Filtered Inputs for Noise Suppression

 Bidirectional Data Transfer Protocol

 1MHz (2.5V, 2.7V, 5V), 400kHz (1.7V) Compatibility

 Write Protect Pin for Hardware Data Protection

 16-byte Page Write Mode

 Partial Page Writes Allowed

 Self-timed Write Cycle (5ms Max)

 High-reliability

 Endurance: 1,000,000 Write Cycles
 Data Retention: 100 Years

 Green Package Options (Pb/Halide-free/RoHS Compliant)

 8-lead PDIP, 8-lead SOIC, 8-lead TSSOP, 8-pad UDFN, 8-pad XDFN,

5-lead SOT23, and 8-ball VFBGA

 Die Options: Wafer Form and Tape and Reel

Description

The Atmel® AT24C16C provides 16,384 bits of Serial Electrically Erasable and
Programmable Read-Only Memory (EEPROM) organized as 2,048 words of 8 bits
each. The device is optimized for use in many industrial and commercial
applications where low-power and low-voltage operation are essential.
AT24C16C is available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead
TSSOP, 8-pad UDFN, 8-pad XDFN, 5-lead SOT23, and 8-ball VFBGA packages
and is accessed via a 2-wire serial interface.

AT24C16C

I2C-Compatible, (2-Wire) Serial EEPROM

16-Kbit (2048 x 8)

DATASHEET

AT24C16C [DATASHEET]

Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016

2

1. Pin Configurations and Pinouts

Table 1. Pin Configuration

2. Absolute Maximum Ratings

Pin Name Function

NC No Connect

SDA Serial Data

SCL Serial Clock Input

WP Write Protect

GND Ground

V

CC

Power Supply

1

2

3

4

8

7

6

5

NC

NC

NC

GND

V

CC

WP

SCL

SDA

8-lead PDIP

1

2

3

5

4

SCL

GND

SDA

WP

V

CC

5-lead SOT23

V

CC

WP

SCL

SDA

NC

NC

NC

GND

1

2

3

4

8

7

6

5

8-ball VFBGA

Bottom View

Note: Drawings are not to scale.

8-pad UDFN/XDFN

Bottom View

Top ViewTop View

Top View

Top View

V

CC

WP

SCL

SDA

NC

NC

NC

GND

1

2

3

4

8

7

6

5

8-lead TSSOP

1
2
3
4

8
7
6
5

NC
NC
NC

GND

V

CC

WP
SCL
SDA

8-lead SOIC

NC

NC

NC

GND

V

CC

WP

SCL

SDA

1

2

3

4

8

7

6

5

Operating Temperature . . . . . . . . . . .-55C to +125C

Storage Temperature . . . . . . . . . . . . .-65C to +150C

Voltage on any pin

with respect to ground . . . . . . . . . . . . . -1.0V to +7.0V

Maximum Operating Voltage . . . . . . . . . . . . . . . 6.25V

DC Output Current . . . . . . . . . . . . . . . . . . . . . . .5.0mA

*Notice: Stresses beyond those listed under “Absolute

Maximum Ratings” may cause permanent damage
to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.

3

AT24C16C [DATASHEET]

Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016

3. Block Diagram

4. Pin Description

Serial Clock (SCL): The SCL input is used to positive edge clock data into each EEPROM device and negative

edge clock data out of each device.

Serial Data (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open-drain driven and may
be wire-ORed with any number of other open-drain or open-collector devices.

Device/Page Addresses: The AT24C16C does not use the device address pins, which limits the number of
devices on a single bus to one (see Section 7. “Device Addressing” on page 9).

Write Protect (WP): AT24C16C has a Write Protect pin that provides hardware data protection. The Write
Protect pin allows normal Read/Write operations when connected to Ground (GND). When the Write Protect pin
is connected to VCC, the Write Protection feature is enabled and operates as shown in Table 4-1.

Table 4-1. Write Protect

Start
Stop

Logic

Data Word

ADDR/Counter

Row Decoder

Device

Address

Comparator

Data Latches

D

OUT

/ ACK

Logic

Column
Decoder

EEPROM

Array

Serial

Control

Logic

High Voltage

Pump & Timing

Serial MUX

Read/Write

Enable

COMP

Load

INC

V

CC

GND

WP

SCL

SDA

D

OUT

D

IN

A

2

A

1

WP Pin Status Part of the Array Protected

At V

CC

Full Array

At GND Normal Read/Write Operations

AT24C16C [DATASHEET]

Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016

4

5. Memory Organization

AT24C16C, 16K Serial EEPROM: Internally organized with 128 pages of 16 bytes each, the 16K requires a

11-bit data word address for random word addressing.

5.1 Pin Capacitance

Table 5-1. Pin Capacitance

(1)

Note: 1. This parameter is characterized and is not 100% tested.

5.2 DC Characteristics

Table 5-2. DC Characteristics

Note: 1. VIL min and V

IH

max are reference only and are not tested.

Applicable over recommended operating range from T

A

= 25°C, f = 1.0MHz, VCC = 5.5V.

Symbol Test Condition Max Units Conditions

C

I/O

Input/Output capacitance (SDA) 8 pF V

I/O

= 0V

C

IN

Input capacitance (A0, A1, A2, SCL) 6 pF VIN = 0V

Applicable over recommended operating range from: TAI = -40°C to +85°C, VCC = 1.7V to 5.5V (unless otherwise noted).

Symbol Parameter Test Condition Min Typ Max Units

V

CC1

Supply Voltage 1.7 5.5 V

I

CC

Supply Current VCC = 5.0V Read at 100kHz 0.4 1.0 mA

I

CC

Supply Current VCC = 5.0V Write at 100kHz 2.0 3.0 mA

I

SB1

Standby Current VCC = 1.7V VIN = VCC or V

SS

1.0 μA

I

SB2

Standby Current VCC = 5.5V VIN = VCC or V

SS

6.0 μA

I

LI

Input Leakage Current VIN = VCC or V

SS

0.10 3.0 μA

I

LO

Output Leakage Current V

OUT

= V

CC

or V

SS

0.05 3.0 μA

V

IL

Input Low Level

(1)

–0.6 VCC x 0.3 V

V

IH

Input High Level

(1)

VCC x 0.7 VCC + 0.5 V

V

OL2

Output Low Level VCC = 3.0V IOL = 2.1mA 0.4 V

V

OL1

Output Low Level VCC = 1.7V IOL = 0.15mA 0.2 V

5

AT24C16C [DATASHEET]

Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016

5.3 AC Characteristics

Table 5-3. AC Characteristics

Note: 1. This parameter is ensured by characterization only.

Applicable over recommended operating range from T

AI

= -40C to 85C, VCC = +1.7V to 5.5V, CL = 1TTL Gate and 100pF

(unless otherwise noted).

Symbol Parameter

1.7V 2.5V, 2.7V, 5.0V

UnitsMin Max Min Max

f

SCL

Clock Frequency, SCL 400 1000 kHz

t

LOW

Clock Pulse Width Low 1.2 0.4 μs

t

HIGH

Clock Pulse Width High 0.6 0.4 μs

t

I

Noise Suppression Time 100 50 ns

t

AA

Clock Low to Data Out Valid 0.1 0.9 0.05 0.55 μs

t

BUF

Time the bus must be free before a new
transmission can start.

1.2 0.5 μs

t

HD.STA

Start Condition Hold Time 0.6 0.25 μs

t

SU.STA

Start Condition Setup Time 0.6 0.25 μs

t

HD.DAT

Data In Hold Time 0 0 μs

t

SU.DAT

Data In Setup Time 100 100 ns

t

R

Inputs Rise Time

(1)

0.3 0.3 μs

t

F

Inputs Fall Time

(1)

300 100 ns

t

SU.STO

Stop Condition Setup Time 0.6 .25 μs

t

DH

Data Out Hold Time 50 50 ns

t

WR

Write Cycle Time 5 5 ms

Endurance

(1)

3.3V, 25C, Page Mode 1,000,000 Write Cycles

AT24C16C [DATASHEET]

Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016

6

6. Device Operation

Clock and Data Transitions: The SDA pin is normally pulled high with an external device. Data on the SDA pin

may change only during SCL low time periods. Data changes during SCL high periods will indicate a Start or
Stop Condition as defined below.

Figure 6-1. Data Validity

Start Condition: A high-to-low transition of SDA with SCL high is a Start Condition which must precede any

other command.

Stop Condition: A low-to-high transition of SDA with SCL high is a Stop Condition. After a read sequence, the
Stop Condition command will place the EEPROM in a standby power mode.

Figure 6-2. Start Condition and Stop Condition Definition

SDA

SCL

Data Stable Data Stable

Data

Change

SDA

SCL

Start

Condition

Stop

Condition

7

AT24C16C [DATASHEET]

Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016

Acknowledge: All addresses and data words are serially transmitted to and from the EEPROM in eight bit
words. The EEPROM sends a zero to acknowledge that it has received each word. This happens during the
ninth clock cycle.

Figure 6-3. Output Acknowledge

Standby Mode: The AT24C16C features a low-power standby mode which is enabled:

 Upon power-up.

 After the receipt of the Stop Condition and the completion of any internal operations.

2-wire Software Reset: After an interruption in protocol, power loss or system reset, any 2-wire part can be
reset by following these steps:

1. Create a Start Condition (if possible).

2. Clock nine cycles.

3. Create another Start Condition followed by Stop Condition as shown below.

The device should be ready for the next communication after above steps have been completed. In the event
that the device is still non-responsive or remains active on the SDA bus, a power cycle must be used to reset
the device.

Figure 6-4. Software Reset

SCL

DATA IN

DATA OUT

Start

Condition

Acknowledge

9

8

1

SCL

9

Start

Condition

Start

Condition

Stop

Condition

8321

SDA

Dummy Clock Cycles

AT24C16C [DATASHEET]

Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016

8

Figure 6-5. Bus Timing

SCL: Serial Clock, SDA: Serial Data I/O

Figure 6-6. Write Cycle Timing

SCL: Serial Clock, SDA: Serial Data I/O

Note: 1. The write cycle time tWR is the time from a valid Stop Condition of a Write sequence to the end of the internal

clear/write cycle.

SCL

SDA IN

SDA OUT

t

F

t

HIGH

t

LOW

t

LOW

t

R

t

AA

t

DH

t

BUF

t

SU.STO

t

SU.DAT

t

HD.DAT

t

HD.STA

t

SU.STA

t

WR

(1)

Stop

Condition

Start

Condition

WORDn

ACK

8th bit

SCL

SDA

9

AT24C16C [DATASHEET]

Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016

7. Device Addressing

Standard EEPROM Access: The 16K EEPROM device requires an 8-bit device address word following a Start

Condition to enable the chip for a Read or Write operation. The device address word consists of a mandatory
“1010” (Ah) sequence for the first four Most Significant Bits (MSB) as shown in Figure 10. on page 12. This is
common to all the EEPROM devices.

The next three bits used for memory page addressing are the most significant bits of the data word address
which follows.

The eighth bit of the device address is the Read/Write operation select bit. A Read operation is initiated if this bit
is high and a Write operation is initiated if this bit is low.

Upon a compare of the device address, the EEPROM will output a zero. If a compare is not made, the chip will
return to a standby state.

Figure 7-1. Device Address

8. Write Operations

Byte Write: A Write operation requires an 8-bit data word address following the device address word and

acknowledgment. Upon receipt of this address, the EEPROM will again respond with a zero and then clock in
the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a zero and the
addressing device, such as a microcontroller, must terminate the Write sequence with a Stop Condition. At this
time the EEPROM enters an internally timed write cycle, tWR, to the nonvolatile memory. All inputs are disabled
during this write cycle and the EEPROM will not respond until the Write is complete.

Figure 8-1. Byte Write

Page Write: The 16K EEPROM devices are capable of a 16-byte Page Write.

A Page Write is initiated in the same way as a Byte Write, but the microcontroller does not send a Stop
Condition after the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first
data word, the microcontroller can transmit up to fifteen more data words. The EEPROM will respond with a
zero after each data word received. The microcontroller must terminate the Page Write sequence with a Stop
Condition (see Figure 8-2).

Density Access Area Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

16K EEPROM 1 0 1 0 P2 P1 P0 R/W

MSB LSB

SDA Line

S
T
A

R

T

W

R

I
T
E

S
T
O
P

Device

Address Word Address Data

M
S
B

A
C
K

A
C
K

A
C
K

R

/

W

AT24C16C [DATASHEET]

Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016

10

The data word address lower four bits are internally incremented following the receipt of each data word. The
higher data word address bits are not incremented, retaining the memory page row location. When the word
address, internally generated, reaches the page boundary, the following byte is placed at the beginning of the
same page. If more than eight data words are transmitted to the EEPROM, the data word address will roll-over
and previous data will be overwritten.

Figure 8-2. Page Write

Acknowledge Polling: Once the internally timed write cycle has started and the EEPROM inputs are disabled,

Acknowledge Polling can be initiated. This involves sending a Start Condition followed by the device address
word. The Read/Write bit is representative of the operation desired. Only if the internal write cycle has
completed will the EEPROM respond with a zero allowing the Read or Write sequence to continue.

9. Read Operations

Read operations are initiated in the same way as Write operations with the exception that the Read/Write select
bit in the device address word is set to one. There are three read operations:

 Current Address Read

 Random Address Read

 Sequential Read.

Current Address Read: The internal data word address counter maintains the last address accessed during
the last Read or Write operation, incremented by one. This address stays valid between operations as long as
the chip power is maintained. The address roll-over during Read is from the last byte of the last memory page to
the first byte of the first page. The address roll-over during Write is from the last byte of the current page to the
first byte of the same page.

Once the device address with the Read/Write select bit set to one is clocked in and acknowledged by the
EEPROM, the current address data word is serially clocked out. The microcontroller does not respond with an
input zero but does generate a following Stop Condition (see Figure 9-1).

Figure 9-1. Current Address Read

SDA Line

S
T
A
R
T

W

R

I
T
E

S
T

O

P

Device

Address

Word

Address (n) Data (n) Data (n + 1) Data (n + x)

M
S
B

A
C
K

A
C
K

A
C
K

A
C
K

A
C
K

R

/

W

SDA Line

S
T
A

R

T

R
E
A
D

S

T
O
P

Device

Address Data

M
S
B

A
C
K

N

O

A
C
K

R

/

W

11

AT24C16C [DATASHEET]

Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016

Random Read: A Random Read requires a Dummy Byte Write sequence to load in the data word address.
Once the device address word and data word address are clocked in and acknowledged by the EEPROM, the
microcontroller must generate another Start Condition. The microcontroller now initiates a Current Address
Read by sending a device address with the Read/Write select bit high. The EEPROM acknowledges the device
address and serially clocks out the data word. The microcontroller does not respond with a zero but does
generate a following Stop Condition.

Figure 9-2. Random Read

Sequential Read: Sequential Reads are initiated by either a Current Address Read or a Random Address

Read. After the microcontroller receives a data word, it responds with an Acknowledge. As long as the
EEPROM receives an Acknowledge, it will continue to increment the data word address and serially clock out
sequential data words. When the memory address limit is reached, the data word address will roll-over and the
Sequential Read will continue. The Sequential Read operation is terminated when the microcontroller does not
respond with a zero but does generate a following Stop Condition.

Figure 9-3. Sequential Read

SDA Line

S
T
A

R

T

S
T
A

R
T

R
E
A
D

W

R

I
T
E

S
T
O
P

Device

Address

Device

Address

Word

Address (n) Data (n)

M
S
B

A
C
K

A
C
K

A
C
K

N

O

A
C
K

R

/

W

Dummy Write

SDA Line

R
E
A
D

S
T
O
P

Device

Address

Data (n) Data (n + 1) Data (n + 2) Data (n + x)

A
C
K

A
C
K

A
C
K

A
C
K

N
O

A
C
K

R

/

W

AT24C16C [DATASHEET]

Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016

12

10. Ordering Code Detail

Atmel Designator

Product Family

Device Density

Device Revision

Shipping Carrier Option

Operating Voltage

16 = 16K

24C = Standard

Serial EEPROM

B = Bulk (Tubes)
T = Tape and Reel, Standard Quantity Option
E = Tape and Reel, Expanded Quantity Option

M = 1.7V to 5.5V

Package Device Grade or
Wafer/Die Thickness

H = Green, NiPdAu Lead Finish,
Industrial Temperature Range
(-40˚C to +85˚C)
U = Green, Matte Sn Lead Finish,
Industrial Temperature Range
(-40˚C to +85˚C)
11 = 11mil Wafer Thickness

Package Option

P = PDIP
SS = JEDEC SOIC
X = TSSOP
MA = UDFN
ME = XDFN
ST = SOT23
C = VFBGA
WWU = Wafer Unsawn

AT24C16C-SSHM-B

13

AT24C16C [DATASHEET]

Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016

11. Product Markings

DRAWING NO. REV. TITLE

24C16CSM

E

12/6/16

24C16CSM, AT24C16C Package Marking Information

Package Mark Contact:
[e-mail]

AAAAAAAA

###% @

ATMLHYWW

8-lead SOIC

8-lead TSSOP

AAAAAAA

###% @

ATHYWW

1.5 x 2.0 mm Body

8-ball VFBGA

PIN 1

###U
YMXX

###
YXX

8-pad XDFN

1.8 x 2.2 mm Body

8-pad UDFN

###
H%@
YXX

2.0 x 3.0 mm Body

Note 2: Package drawings are not to scale

Note 1: designates pin 1

AT24C16C: Package Marking Information

Catalog Number Truncation

AT24C16C Truncation Code ###: 16C / ##: AC

Date Codes Voltages

Y = Year M = Month WW = Work Week of Assembly % = Minimum Voltage
6: 2016 0: 2020 A: January 02: Week 2 M: 1.7V min
7: 2017 1: 2021 B: February 04: Week 4

8: 2018 2: 2022 ... ...

9: 2019 3: 2023 L: December 52: Week 52

Country of Assembly Lot Number Grade/Lead Finish Material

@ = Country of Assembly AAA...A = Atmel Wafer Lot Number H: Industrial/NiPdAu
U: Industrial/Matte Tin/SnAgCu

Trace Code Atmel Truncation

XX = Trace Code (Atmel Lot Numbers Correspond to Code) AT: Atmel

Example: AA, AB.... YZ, ZZ ATM: Atmel

ATML: Atmel

5-lead SOT-23

AAAAAAAA

###% @

ATMLUYWW

8-lead PDIP

##@%U

YMXX

Note 3: For SOT23 package with date codes before 7B, the bottom line (YMXX) is marked on the bottom side and there is no Country of Assembly (@) mark on the top line.

AT24C16C [DATASHEET]

Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016

14

12. Ordering Information

Note: 1. For Wafer sales, please contact Atmel Sales.

Atmel Ordering Code Lead Finish Package

Delivery Information

Operation

Range

Form Quantity

AT24C16C-SSHM-B

NiPdAu

(Lead-free/Halogen-free)

8S1

Bulk (Tubes) 100 per Tube

Industrial

Temperature

(-40C to 85C)

AT24C16C-SSHM-T Tape and Reel 4,000 per Reel

AT24C16C-XHM-B

8X

Bulk (Tubes) 100 per Tube

AT24C16C-XHM-T Tape and Reel 5,000 per Reel

AT24C16C-MAHM-T

8MA2

Tape and Reel 5,000 per Reel

AT24C16C-MAHM-E Tape and Reel 15,000 per Reel

AT24C16C-PUM

Matte Sn

(Lead-free/Halogen-free)

8P3 Bulk (Tubes) 50 per Tube

AT24C16C-STUM-T 5TS1 Tape and Reel 5,000 per Reel

AT24C16C-CUM-T

SnAgCu

(Lead-free/Halogen-free)

8U3-1 Tape and Reel 5,000 per Reel

AT24C16C-MEHM-T N/A 8ME1 Tape and Reel 5,000 per Reel

AT24C16C-WWU11M

(1)

N/A Wafer Sale Note 1

Package Type

8P3 8-lead, 0.300" wide, Plastic Dual Inline Package (PDIP)

8S1 8-lead, 0.150" wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8X 8-lead, 4.40mm body, Plastic Thin Shrink Small Outline Package (TSSOP)

8MA2 8-pad, 2.00mm x 3.00mm body, 0.50mm pitch, Plastic Ultra Thin Dual Flat No Lead (UDFN)

8ME1 8-lead, 1.80mm x 2.20mm body, 0.40mm pitch, Extra Thin Dual Flat No Lead (XDFN)

5TS1 5-lead, 2.90mm x 1.60mm body, Plastic Thin Shrink Small Outline (SOT23)

8U3-1 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, Die Ball Grid Array (VFBGA)

15

AT24C16C [DATASHEET]

Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016

13. Packaging Information

13.1 8P3 — 8-lead PDIP

DRAWING NO. REV. TITLE GPC

Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.

2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.

3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.

4. E and eA measured with the leads constrained to be perpendicular to datum.

5. Pointed or rounded lead tips are preferred to ease insertion.

6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

MIN

NOM

MAX

NOTE

D

D1

E

E1

e

L

b2

b

A2 A

1

N

eA

c

b3

4 PLCS

A - - 5.334 2

A1 0.381 - -

A2 2.921 3.302 4.953

b 0.356 0.457 0.559 5

b2 1.143 1.524 1.778 6

b3 0.762 0.991 1.143 6

c 0.203 0.254 0.356

D 9.017 9.271 10.160 3

D1 0.127 0.000 0.000 3

E 7.620 7.874 8.255 4

E1 6.096 6.350 7.112 3

e 2.540 BSC

eA 7.620 BSC 4

L 2.921 3.302 3.810 2

Top View

Side View

End View

Package Drawing Contact:
[e-mail]

A1

Gage Plane

.381

8P3 E

07/31/14

8P3, 8-lead, 0.300” Wide Body, Plastic Dual
In-line Package (PDIP)

PTC

v

0.254

m

C

AT24C16C [DATASHEET]

Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016

16

13.2 8S1 — 8-lead JEDEC SOIC

DRAWING NO. REV. TITLE GPC

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

MIN

NOM

MAX

NOTE

A1 0.10 – 0.25

A 1.35 – 1.75

b 0.31 – 0.51

C 0.17 – 0.25

D 4.80 – 5.05

E1 3.81 – 3.99

E 5.79 – 6.20

e 1.27 BSC

L 0.40 – 1.27

ØØ 0° – 8°

Ø

E

1

N

TOP VIEW

C

E1

END VIEW

A

b

L

A1

e

D

SIDE VIEW

Package Drawing Contact:

[e-mail]

8S1 G

6/22/11

Notes: This drawing is for general information only.
Refer to JEDEC Drawing MS-012, Variation AA
for proper dimensions, tolerances, datums, etc.

8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)

SWB

17

AT24C16C [DATASHEET]

Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016

13.3 8X — 8-lead TSSOP

DRAWING NO. REV. TITLE GPC

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL MIN NOM MAX

NOTE

A - - 1.20

A1 0.05 - 0.15

A2 0.80 1.00 1.05

D 2.90 3.00 3.10 2, 5

E 6.40 BSC

E1 4.30 4.40 4.50 3, 5

b 0.19 0.25 0.30 4

e 0.65 BSC

L 0.45 0.60 0.75

L1 1.00 REF

C 0.09 - 0.20

Side View

End View

Top View

A2

A

L

L1

D

1

E1

N

b

Pin 1 indicator

this corner

E

e

Notes: 1. This drawing is for general information only.
Refer to JEDEC Drawing MO-153, Variation AA, for proper
dimensions, tolerances, datums, etc.

2. Dimension D does not include mold Flash, protrusions or gate
burrs. Mold Flash, protrusions and gate burrs shall not exceed

0.15mm (0.006in) per side.

3. Dimension E1 does not include inter-lead Flash or protrusions.
Inter-lead Flash and protrusions shall not exceed 0.25mm
(0.010in) per side.

4. Dimension b does not include Dambar protrusion.
Allowable Dambar protrusion shall be 0.08mm total in excess
of the b dimension at maximum material condition. Dambar
cannot be located on the lower radius of the foot. Minimum
space between protrusion and adjacent lead is 0.07mm.

5. Dimension D and E1 to be determined at Datum Plane H.

Package Drawing Contact:
[e-mail]

8X E

2/27/14

8X, 8-lead 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP)

TNR

C

A1

AT24C16C [DATASHEET]

Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016

18

13.4 8MA2 — 8-pad UDFN

DRAWING NO. REV. TITLE

GPC

8MA2 G

11/26/14

8MA2, 8-pad 2 x 3 x 0.6mm Body, Thermally
Enhanced Plastic Ultra Thin Dual Flat No-Lead
Package (UDFN)

YNZ

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

MIN

NOM

MAX

NOTE

A 0.50 0.55 0.60

A1 0.0 0.02 0.05

A2 - - 0.55

D 1.90 2.00 2.10

D2 1.40 1.50 1.60

E 2.90 3.00 3.10

E2 1.20 1.30 1.40

b 0.18 0.25 0.30 3

C 1.52 REF

L 0.30 0.35 0.40

e 0.50 BSC

K 0.20 - -

TOP VIEW

SIDE VIEW

BOTTOM VIEW

Package Drawing Contact:
[e-mail]

C

E

Pin 1 ID

D

8

7

6

5

1

2

3

4

A

A1

A2

D2

E2

e (6x)

L (8x)

b (8x)

Pin#1 ID

K

1

2

3

4

8

7

6

5

Notes: 1. This drawing is for general information only. Refer to
Drawing MO-229, for proper dimensions, tolerances,
datums, etc.

2. The Pin #1 ID is a laser-marked feature on Top View.

3. Dimensions b applies to metallized terminal and is
measured between 0.15 mm and 0.30 mm from the
terminal tip. If the terminal has the optional radius on
the other end of the terminal, the dimension should
not be measured in that radius area.

4. The Pin #1 ID on the Bottom View is an orientation
feature on the thermal pad.

19

AT24C16C [DATASHEET]

Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016

13.5 8ME1 — 8-pad XDFN

Package Drawing Contact:
[e-mail]

GPC

DRAWING NO.

REV. TITLE

COMMON DIMENSIONS

(Unit of Measure = mm)

DTP

SYMBOL MIN NOM MAX NOTE

–

0.00

1.70

2.10

0.15

0.26

A

A1

D

E

b

e

e1

L

–

–

1.80

2.20

0.20

0.40 TYP

1.20 REF

0.30

0.40

0.05

1.90

2.30

0.25

0.35

End View

8ME1 B

9/10/2012

8ME1, 8-pad (1.80mm x 2.20mm body)
Extra Thin DFN (XDFN)

Top View

6

57

4

3

E

D

8

1

2

PIN #1 ID

0.10

0.15

b

L

b

e

PIN #1 ID

e1

A1

A

Side View

AT24C16C [DATASHEET]

Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016

20

13.6 5TS1 — 5-lead SOT23

DRAWING NO. REV. TITLE GPC

Package Drawing Contact:
[e-mail]

5TS1 D

5/31/12

5TS1, 5-lead 1.60mm Body, Plastic Thin
Shrink Small Outline Package (Shrink SOT)

TSZ

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

MIN

NOM

MAX

NOTE

A - - 1.00
A1 0.00 - 0.10
A2 0.70 0.90 1.00
c 0.08 - 0.20 3
D 2.90 BSC 1,2
E 2.80 BSC 1,2
E1 1.60 BSC 1,2
L1 0.60 REF
e 0.95 BSC
e1 1.90 BSC
b 0.30 - 0.50 3,4

1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash,
protrusions or gate burrs shall not exceed 0.15 mm per end. Dimension E1 does
not include interlead flash or protrusion. Interlead flash or protrusion shall not
exceed 0.15 mm per side.

2. The package top may be smaller than the package bottom. Dimensions D and E1
are determined at the outermost extremes of the plastic body exclusive of mold
flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch
between the top and bottom of the plastic body.

3. These dimensions apply to the flat section of the lead between 0.08 mm and 0.15
mm from the lead tip.

4. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion
shall be 0.08 mm total in excess of the "b" dimension at maximum material
condition. The dambar cannot be located on the lower radius of the foot. Minimum
space between protrusion and an adjacent lead shall not be less than 0.07 mm.

This drawing is for general information only. Refer to JEDEC
Drawing MO-193, Variation AB for additional information.

5

4

2

L1

L

C

END VIEW

C

A

A2

A1

b

e

PLANE

SEATING

D

SIDE VIEW

E

e1

E1

3

1

TOP VIEW

21

AT24C16C [DATASHEET]

Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016

13.7 8U3-1 — 8-ball VFBGA

DRAWING NO. REV. TITLE

GPC

Package Drawing Contact:

[e-mail]

8U3-1 F

6/11/13

8U3-1, 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch,
Very Thin, Fine-Pitch Ball Grid Array Package (VFBGA)

GXU

COMMON DIMENSIONS

(Unit of Measure - mm)

SYMBOL

MIN

NOM

MAX NOTE

A

0.73 0.79 0.85

A1 0.09 0.14 0.19

A2 0.40 0.45 0.50

b 0.20 0.25 0.30 2

D

1.50 BSC

E

2.0 BSC

e

0.50 BSC

e1

0.25 REF

d

1.00 BSC

d1

0.25 REF

1. This drawing is for general information only.

2. Dimension ‘b’ is measured at maximum solder ball diameter.

3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu.

Notes:

A2

SIDE VIEW

A

PIN 1 BALL PAD CORNER

TOP VIEW

E

D

A1

b

8 SOLDER BALLS

BOTTOM VIEW

(d1)

d

4

3

2

(e1)

6

e

5

7

PIN 1 BALL PAD CORNER

1

8

2.

AT24C16C [DATASHEET]

Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016

22

14. Revision History

Doc. Rev. Date Comments

8719D 12/2016

Part marking SOT23:

- Moved backside mark (YMXX) to front side line2.

- Added @ = Country of Assembly.

8719C 01/2015

Add the UDFN Expanded Quantity Option.

Update the 8X, 8MA2, 8P3, and 8U3-1 package outline drawings, the ordering information
section, and the disclaimer page.

8719B 07/2013

Minor grammatical corrections.

Update Atmel logos and template.

8719A 09/2010 Initial document release.

X

X

X

XXX

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© 2015 Atmel Corporation. / Rev.: Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016.

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