ATMEL AT17LV512-10JI, AT17LV512-10JC, AT17C010-10JI, AT17C010-10JC, AT17LV010-10JI Datasheet

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Features
E2 Programmable 524, 288 x 1 and 1,04 8,5 76 x 1 bit Serial Memories Designe d To Store Configuration Programs For Field Programmable Gate Arrays (FPGA)
Compatible With Atmel AT6000, AT40K FPGAs, Altera EPF8K, EPF10K, EPF6K FPGAs, ORCA FPGAs, Xilinx XC3000, XC4000, XC5200 FPGAs, Motorola MPA1000 FPGAs
Cascadable To Support Additional Configurations or Future Higher-density Arrays
Low-power CMOS EEPROM Process
Programmable Reset Polarity
Available In PLCC Package (Pin Compatable across Product Family)
In-System Programmable Via 2-Wire Bus
Emulation of 24CXX Serial EPROMs
Available in 3.3V ± 10% LV and 5V Versions
System Friendly READY Pin
FPGA Configuration
2
E
PROM
Description
The AT17C512/010 and AT17LV512/010 (high-density AT17 Series) FPGA Configu­ration EEPROMs (Configurators) provide an easy-to-use, cost-effective configuration memory for Field Program mable Gate Arrays. The high -densit y AT17 Series is pack­aged in the popular 20-pin PLCC. The hig h-densi ty AT17 S eries fam ily uses a simple serial-access procedure to configure one or more FPGA devices. The high-density AT17 Series organization supplies enou gh memory to configure one or multi ple smaller FPGAs. The user can select the polarity of the reset function by programming one EEPROM byte. The devices also support a write protection mode and a system friendly READY pin, which signifies a “good” power level to the device and can be used to ensure reliable system power-up.
The high-density AT17 Series can be program med with industry-standar d program­mers, and the Atmel ATDH2200 Programming board.
Pin Configurations
20-Pin PLCC
CLK
WP1
D A T
N
A
C
3 2 1 20 19
4
V C
N C
N
C
C
NC
18
SER_EN
17
Memory
512K and 1M
AT17C512 AT17LV512 AT17C010 AT17LV010
RESET/OE
WP2
CE
9510611712813
N
G
N
C
N D
NCN
C
C
16 15 14
NC
READY
CEO
Rev. 0944A-A–12/97
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Controlling The High-Density AT17 Series Serial EEPROMs
Most connections between the FPGA device and the Serial EEPROM are simple and self-explanatory:
• The DATA output of th e high-density AT17 Series dr ives DIN of the FPGA devices.
• The master FPGA CCLK output dr ives the CLK input of the high-density AT17 Series.
• The CEO input of the next AT17C/LV512 /010 in a ca scad e chain of PROMs.
•SER_EN ISP).
READY is available as an open-collector indicator of the device’s RESET s tatus; i t is driven L ow while the device is in its POWER-ON RESET cycle and released (tri-stated) when the cycle is complete.
There are two different wa ys to use the inp uts CE as shown in the AC Characteristics waveforms.
output of any AT17C/LV5 12/010 drives the CE
must be connected to VCC, (except during
and OE,
Condition 1
The simplest connection is to have the FPGA D/P output drive both CE
and RESET/OE in paral le l ( F ig ure 1) . Du e to
its simplicity, however, this method will fail if the FPGA receives an external reset condi tion during the configura­tion cycle. If a sy stem rese t is ap plied to the FPGA, it will abort the original configuration and then reset itself for a new configuration, as in tend ed. O f cour s e, the hig h-density AT17 Series does not see the ex ter nal r es et sig nal an d wi ll not reset its internal address counters and, consequently, will remain out of sync with the FPGA for the remainder of the configuration cycle.
Condition 2
The FPGA D/P output drives only the CE in put of t he high ­density AT17 Series, while its OE inversion of the input to the FPGA RESET connection works under all normal circumstances, even when the user aborts a configuration before D/P High. A High level on the RESET/OE AT17C/LVxxx – during FPGA reset – cl ears t he Conf igu ra­tor’s internal address pointer, so that the reconfiguration starts at the beginn ing . The high- de ns ity AT 17 Ser ies do es not require an inverter since the RESET polarity is pro­grammable.
input is driven by the
input pin. This
has gone
input to the
Block Diagram
2
AT17C/LV512/010
AT17C/LV512/010
Pin Configurations
20
PLCC Name I/O Description
2 DATA I/O Three-state DATA output for reading. Input/Output pin for programming. 4 CLK I Clock input. Used to increment the internal address and bit counter for reading and
programming.
5 WP1 I WRITE PROTECT (1). Used to protect portions of memory during programming. See
programming guide for details.
6 RESET/OE
7 WP2 I WRITE PROTECT (2). Used to protect portions of memory during programming. See
I RESET/Output Enable input (when SER_EN is High). A Low level on both the CE and
RESET/OE address and bit counters . The l ogic p olarity of t his input i s prog ra mmab l e as eithe r RESET/ OE or RESET
programming guide for details.
inputs enables the data output driver. A High level on RESET/OE resets both the
/OE. This document describes the pin as RESET/OE.
8CE
10 GND Ground pin. 14 CEO
A2 I Device selection input, A2. This is used to enable (or select) the device during programming,
15 READY O Open collector reset state indicator. Driven Low during power-up reset, released when power-
17 SER_EN I Serial enable is normally high during FPGA loading operations. Bringing SER_EN Low,
20 V
CC
I Chip Enable input. Used for device selection. A Low level on both CE and OE enables the data
output driver. A High level on CE device into a low power mode. Note this pin will not Programming mode (i.e., when SER_EN
O Chip Enable Out output. This signal is asserted Low on the clock cycle following the last bit
read from the memory. It will stay Low as long as CE and OE CE
until OE goes Hig h. There after, CEO will stay Hig h until the ent ire PR OM is read again and
senses the status of RESET polarity.
when SER_EN
up is complete. (Recommend a 4.7K Pull-up on this pin if used).
enables the two wire serial interface mode for programming. +3.3V/+5V power supply pin.
is Low (see Programming Guide for more details)
disables both the address and bit counters and forces the
enable/disable the device in 2-wire Serial
is Low).
are both Low. It will then follow
Absolute Maximum Ratings*
Operating Temperature.................................. -55°C to +125°C
Storage Temperature.....................................-65°C to +150°C
Voltage on Any Pin
with Respect to Ground............................-0.1V to V
Supply Voltage (V
).........................................-0.5V to +7.0V
CC
+ 0.5V
CC
*NOTICE: Stresses beyond those listed under Absolute Maxi-
mum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other condi­tions beyond those listed under Operating Cond itions is not implied. Exposure to Absolute Maximum Rat­ings conditions for extended periods of time may
affect device reliability.
Maximum Soldering Temp. (10 s @ 1/16 in.)..................260°C
ESD (R
= 1.5K, C
ZAP
= 100 pF)...............................2000V
ZAP
3
FPGA Master Serial Mode Summary
The I/O and logic functions of the FPGA and thei r associ­ated interconnections are establish ed by a configuration program. The program is loaded either automatically upon power up, or on command, depending on the state of the three FPGA m ode pi ns. In Mast er Mode , the F PGA a uto­matically loads the configuration program from an external memory. The Serial Configuration EEPROM has been designed for compatibility with the Master Serial Mode.
Cascading Serial Configuration EEPROMs
For multiple FPGAs configured as a daisy- chain, or for future FPGAs requiring larger configuration memories, cas­caded Configurators provide additional memory.
As the last bit from the first Configurator is read, the clock signal to the Configurator asserts its CEO disables its DATA line. The second Configurator recog­nizes the Low level on its CE output.
Figure 1.
Condition 1 Connection
input and enables its DAT A
output Low and
After configu ratio n is comp lete, the addr ess co unters o f all cascaded Configurators are reset if the reset signal drives the RESET/OE level.
If the address counters are not to be reset upon comple­tion, then the RESET/O E more details, please reference the AT17C Series Program­ming Guide.
on each Configurator to it s active (High)
inputs can be tied to ground. For
Programming Mode
The programming mode i s entered by b ringing SER_EN Low. In this mode the chip can be programmed by the 2­wire interface. The programming is done at V only. Programming super voltages are generated inside the chip. See the Programming Specification for Atmel's Con­figuration Memories Application Note for further informa­tion. The AT17C Series parts ar e read/wri te at 5V nom inal. The AT17LV parts are read/write at 3.3V nominal.
supply
CC
AT17C/ LVXXX Res et Polarity
The AT17C/LVXXX lets the user choose the reset polarity as either RESET/OE
or RESET/OE.
Operating Conditions
Symbol Description
Commercial
V
CC
Industrial
Military
Supply voltage relative to GND
-0°C to +70°C Supply voltage relative to GND
-40°C to +85°C
Supply voltage relative to GND
-55°C to +125°C
Standby Mode
The AT17C/LVXXX enters a low-power standby mode whenever CE tor consumes less than 0.5mA at 5.0 volts. The output remains in a high impedance state regardless of the state of the OE
is asserted High. In this mode, the Configura-
input.
AT17CXXX AT17LVXXX
UnitsMin/Max Min/Max
4.75 / 5.25 3.0 / 3.6 V
4.5 / 5.5 3.0 / 3.6 V
4.5 / 5.5 3.0 / 3.6 V
4
AT17C/LV512/010
AT17C/LV512/010
DC Characteristics
V
= 5V ± 5% Commercial / 5V ± 10% Ind./Mil.
CC
Symbol Description Min Max Units
V V V V V V V V I
CCA
I
L
I
CCS
IH IL OH OL OH OL OH OL
High-level input voltage 2.0 V
CC
Low-level input voltage 0 0.8 V High-level output voltage (IOH = -4 mA)
3.86 V
Commercial
Low-le vel output voltage (IOL = +4 mA) 0.32 V High-level output voltage (IOH = -4 mA)
3.76 V
Industrial
Low-le vel output voltage (IOL = +4 mA) 0.37 V High-level output voltage (IOH = -4 mA)
3.7 V
Military
Low-le vel output voltage (IOL = +4 mA) 0.4 V Supply current, active mode (at FMAX) 10 mA Input or output leakage current (VIN = VCC or GND) -10 10
Commercial 0.5 mA
Supply current, standby mode
Industrial/Military 0.5 mA
V
A
µ
DC Characteristics
VCC = 3.3V ± 10%
Symbol Description Min Max Units
V V V V V V V V I
CCA
I
L
I
CCS
IH IL OH OL OH OL OH OL
High-level input voltage 2.0 V
CC
Low-level input voltage 0 0.8 V High-level output voltage (IOH = -2.5 mA)
2.4 V
Commercial
Low-le vel output voltage (IOL = +3 mA) 0.4 V High-level output voltage (IOH = -2 mA)
2.4 V
Industrial
Low-le vel output voltage (IOL = +3 mA) 0.4 V High-level output voltage (IOH = -2 mA)
2.4 V
Military
Low-le vel output voltage (IOL = +2.5 mA) 0.4 V Supply current, active mode 5 mA Input or output leakage current (VIN = VCC or GND) -10 10
Commercial 100
Supply current, standby mode
Industrial/Military 100
V
A
µ
A
µ
A
µ
5
AC Characteristics
AC Characteristics When Cascading
6
AT17C/LV512/010
.
AC Characteristics for AT17C512/010
VCC = 5V ± 5% Commercial / VCC = 5V ± 10% Ind./Mil
Symbol Description
(2)
T T T T T T T T T T F V
OE
CE CAC
OH
DF LC HC SCE HCE HOE MAX RDY
(2)
(2) (2) (3)
OE to Data Delay 30 35 ns CE to Data Delay 45 45 ns CLK to Data Delay 50 50 ns Data Hold From CE, OE, or CLK 0 0 ns CE or OE to Data Float Delay 50 50 ns CLK Low Time 20 20 ns CLK High Time 20 20 ns CE Setup Time to CLK (to guara ntee prop er coun ting) 20 25 ns CE Hold Time to CLK (to guarantee proper counting) 0 0 ns OE High Time (Guarantees Counter Is Reset) 20 20 ns MAX Input Clock Frequency 15 15 MHz Ready Pin Ope n Collector Voltage 1.2 2.2 1.2 2.2 V
AT17C/LV512/010
Commercial/Industrial Military
UnitsMin Max Min Max
AC Characteristics for AT17C512/010 When Cascading
VCC = 5V± 5% Commercial / VCC = 5V ± 10% Ind./Mil.
Commercial/Industrial Military
Symbol Description
(3)
T
CDF
(2)
T
OCK
(2)
T
OCE
(2)
T
OOE
Notes: 1. Preliminary specifications for military operating range only.
2. AC test load = 50 pF.
3. Float delays are measured with 5 pF AC loads. Transition is measured ± 200 mV from steady state active levels.
CLK to Data Float Delay 50 50 ns CLK to CEO Delay 35 40 ns CE to CEO Delay 35 35 ns RESET/OE to CEO Delay 30 30 ns
UnitsMinMaxMinMax
7
AC Characteristics for AT17LV512/010
VCC = 3.3V ± 10%
Symbol Description
(2)
T
OE
T
CE
T
CAC
T
OH
T
DF
T
LC
T
HC
T
SCE
T
HCE
T
HOE
F
MAX
V
RDY
Notes: 1. Preliminary specifications for military operating range only.
OE to Data Delay 50 55 ns
(2)
CE to Data Delay 55 60 ns
(2)
CLK to Data Delay 55 60 ns Data Hold From CE, OE, or CLK 0 0 ns
(3)
CE or OE to Data Float Delay 50 50 ns CLK Low Time 25 25 ns CLK High Time 25 25 ns CE Setup Time to CLK (to guarantee proper counting) 30 35 ns CE Hold Time to CLK (to guarantee proper counting) 0 0 ns OE High Time (Guarantees Counter Is Reset) 25 25 ns
(4)
MAX Input Clock Frequency 15 10 MHz Ready Pin Open Collector Voltage 1.2 2.2 1.2 2.2 V
2. AC test load = 50 pF.
3. Float delays are measured with 5 pF AC loads. Transition is measured ± 200 mV from steady state active levels.
4. During cascade F
= 12.5 MHz.
MAX
Commercial/Industrial Military
Min Max Min Max
Units
AC Characteristics for AT17LV512/010 When Cascading
VCC = 3.3V ± 10%
Commercial/Industrial Military
Symbol Description
(3)
T
CDF
(2)
T
OCK
(2)
T
OCE
(2)
T
OOE
CLK to Data Float Delay 50 50 ns CLK to CEO Delay 50 55 ns CE to CEO Delay 35 40 ns RESET/OE to CEO Delay 35 35 ns
UnitsMinMaxMinMax
8
AT17C/LV512/010
AT17C/LV512/010
Ordering Information - 5V Devices
Memory Size Ordering Code Package Operation Range
512K AT17C512-10JC 20J Commercial
(0°C to 70°C)
AT17C512-10JI 20J Industrial
(-40°C to 85°C)
1M AT17C010-10JC 20J Commercial
(0°C to 70°C)
AT17C010-10JI 20J Industrial
(-40°C to 85°C)
Ordering Information - 3.3V Devices
Memory Size Ordering Code Package Operation Range
512K AT17LV512-10JC 20J Commercial
(0°C to 70°C)
AT17LV512-10JI 20J Industrial
(-40°C to 85°C)
1M AT17LV010-10JC 20J Commercial
(0°C to 70°C)
AT17LV010-10JI 20J Industrial
(-40°C to 85°C)
Package Type
20J 20 Lead, Plastic J-Leaded Chip Carrier (PLCC)
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