Atlantis COM-870E User Manual

85

COM-870E

Wide Range Temperature

COM Express Type 6 CPU Module

User’s Manual

Version 1.0

2012.06

85

This page is intentionally left blank.

Index

Contents

Chapter 1 - Introduction ...................................................................... 1

1.1 Copyright Notice ...........................................................................2

1.2 Declaration of Conformity ...........................................................2

1.3 About This User’s Manual ...........................................................4

1.4 Warning .........................................................................................4

1.5 Replacing the Lithium Battery.....................................................4

1.6 Technical Support ........................................................................4

1.7 Warranty ........................................................................................5

1.8 Packing List ..................................................................................6

1.9 Ordering Information ....................................................................6

1.10 Specications .............................................................................7

1.11 Board Dimensions ...................................................................... 8

Chapter 2 - Installation ........................................................................ 9

2.1 What is “COM Express”?...........................................................10

2.2 Block Diagram ...........................................................................12

2.3 Connectors..................................................................................13

2.4 COM Express AB Connector (bottom side) .............................14

2.5 COM Express CD Connector (bottom side) ............................15

2.6 The Installation Paths of CD Driver ..........................................16

2.7 Heatsink Installation...................................................................17

Chapter 3 - BIOS ................................................................................ 19

3.1 BIOS Main Setup.........................................................................20

3.2 Advanced Settings .....................................................................21

3.2.1 ACPI Conguration ........................................................22

3.2.2 CPU Conguration ......................................................... 23

3.2.3 SATA Conguration .......................................................24

3.2.4 Intel Anti-Theft Technology Conguration ..................25

3.2.5 AMT Conguration .........................................................26

3.2.6 USB Conguration ......................................................... 28

3.2.7 H/W Monitor .................................................................... 29

3.2.8 Super IO Conguration .................................................30

3.2.9 Sandybridge PPM Conguration .................................. 33

- I -

Index

3.3 Chipset ........................................................................................34

3.3.1 System Agent (SA) Conguration ................................35

3.3.2 PCH-IO Conguration .................................................... 45

3.4 Boot Settings ..............................................................................50

3.5 Security .......................................................................................51

3.6 Save & Exit .................................................................................. 53

3.7 AMI BIOS Checkpoints ...............................................................54

3.7.1 Checkpoint Ranges .......................................................54

3.7.2 Standard Checkpoints ................................................... 55

Appendix ............................................................................................63

Appendix A: I/O Port Address Map ................................................. 64

Appendix B: Interrupt Request Lines (IRQ) ...................................67

Appendix C: BIOS Memory Map ......................................................68

Appendix D: Digital I/O Setting .......................................................70

- II -

Introduction

1Chapter 1

Introduction

Chapter 1 - Introduction

- 1 -

Introduction

1.1 Copyright Notice

All Rights Reserved.

The information in this document is subject to change without prior notice in
order to improve the reliability, design and function. It does not represent a
commitment on the part of the manufacturer.

Under no circumstances will the manufacturer be liable for any direct, indirect,
special, incidental, or consequential damages arising from the use or inability
to use the product or documentation, even if advised of the possibility of such
damages.

This document contains proprietary information protected by copyright.
All rights are reserved. No part of this manual may be reproduced by any
mechanical, electronic, or other means in any form without prior written
permission of the manufacturer.

1.2 Declaration of Conformity

CE

The CE symbol on your product indicates that it is in compliance with the

directives of the Union European (EU). A Certicate of Compliance is available

by contacting Technical Support.

This product has passed the CE test for environmental specications when

shielded cables are used for external wiring. We recommend the use of
shielded cables. This kind of cable is available from ARBOR. Please contact
your local supplier for ordering information.

This product has passed the CE test for environmental specications. Test

conditions for passing included the equipment being operated within an
industrial enclosure. In order to protect the product from being damaged by
ESD (Electrostatic Discharge) and EMI leakage, we strongly recommend the
use of CE-compliant industrial enclosure products.

Warning

This is a class A product. In a domestic environment this product may cause
radio interference in which case the user may be required to take adequate
measures.

FCC Class A

This device complies with Part 15 of the FCC Rules. Operation is subject to
the following two conditions:

- 2 -

Introduction

(1)This device may not cause harmful interference, and

(2)This device must accept any interference received, including interference
that may cause undesired operation.

NOTE:

This equipment has been tested and found to comply with the limits for a
Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are
designed to provide reasonable protection against harmful interference when
the equipment is operated in a commercial environment. This equipment
generates, uses, and can radiate radio frequency energy and, if not installed
and used in accordance with the instruction manual, may cause harmful
interference to radio communications. Operation of this equipment in a
residential area is likely to cause harmful interference in which case the user
will be required to correct the interference at his own expense.

RoHS

ARBOR Technology Corp. certies that all components in its products are in

compliance and conform to the European Union’s Restriction of Use of Haz­ardous Substances in Electrical and Electronic Equipment (RoHS) Directive
2002/95/EC.

The above mentioned directive was published on 2/13/2003. The main pur­pose of the directive is to prohibit the use of lead, mercury, cadmium, hexava­lent chromium, polybrominated biphenyls (PBB), and polybrominated diphenyl
ethers (PBDE) in electrical and electronic products. Member states of the EU
are to enforce by 7/1/2006.

ARBOR Technology Corp. hereby states that the listed products do not contain
unintentional additions of lead, mercury, hex chrome, PBB or PBDB that ex­ceed a maximum concentration value of 0.1% by weight or for cadmium exceed

0.01% by weight, per homogenous material. Homogenous material is dened

as a substance or mixture of substances with uniform composition (such as sol­ders, resins, plating, etc.). Lead-free solder is used for all terminations (Sn(96-

96.5%), Ag(3.0-3.5%) and Cu(0.5%)).

SVHC / REACH

To minimize the environmental impact and take more responsibility to the

earth we live, Arbor hereby conrms all products comply with the restriction

of SVHC (Substances of Very High Concern) in (EC) 1907/2006 (REACH

--Registration, Evaluation, Authorization, and Restriction of Chemicals)
regulated by the European Union.

All substances listed in SVHC < 0.1 % by weight (1000 ppm)

- 3 -

Introduction

1.3 About This User’s Manual

This user’s manual provides general information and installation instructions
about the product. This User’s Manual is intended for experienced users and
integrators with hardware knowledge of personal computers. If you are not
sure about any description in this booklet. please consult your vendor before
further handling.

1.4 Warning

Single Board Computers and their components contain very delicate
Integrated Circuits (IC). To protect the Single Board Computer and its
components against damage from static electricity, you should always follow
the following precautions when handling it :

1. Disconnect your Single Board Computer from the power source when you
want to work on the inside.

2. Hold the board by the edges and try not to touch the IC chips, leads or cir­cuitry.

3. Use a grounded wrist strap when handling computer components.

4. Place components on a grounded antistatic pad or on the bag that comes
with the Single Board Computer, whenever components are separated from
the system.

1.5 Replacing the Lithium Battery

Incorrect replacement of the lithium battery may lead to a risk of explosion.

The lithium battery must be replaced with an identical battery or a battery type
recommended by the manufacturer.

Do not throw lithium batteries into the trash-can. It must be disposed of in
accordance with local regulations concerning special waste.

1.6 Technical Support

If you have any technical difculties, please do not hesitate to call or e-mail our

customer service.

http://www.arbor.com.tw

E-mail:[e-mail]

- 4 -

Introduction

1.7 Warranty

This product is warranted to be in good working order for a period of two years
from the date of purchase. Should this product fail to be in good working order
at any time during this period, we will, at our option, replace or repair it at no
additional charge except as set forth in the following terms. This warranty does

not apply to products damaged by misuse, modications, accident or disaster.

Vendor assumes no liability for any damages, lost prots, lost savings or any

other incidental or consequential damage resulting from the use, misuse of,
or inability to use this product. Vendor will not be liable for any claim made by
any other related party.

Vendors disclaim all other warranties, either expressed or implied, including

but not limited to implied warranties of merchantability and tness for a

particular purpose, with respect to the hardware, the accompanying product’s
manual(s) and

warranty gives you specic legal rights.

Return authorization must be obtained from the vendor before returned
merchandise will be accepted.
faxing

the vendor and
number.
description.

Returned

written materials, and any accompanying hardware. This limited

Authorization can be obtained by calling or

requesting a Return Merchandise Authorization (RMA)

goods should always be accompanied by a clear problem

- 5 -

Introduction

1.8 Packing List

Packing List

Before you begin installing your single board, please make sure that the following
materials have been shipped:

1 x COM-870E COM Express CPU Module

1 x Driver CD

1 x Quick Installation Guide

If any of the above items is damaged or missing, contact your vendor
immediately.

1.9 Ordering Information

COM-870E-827E

HS-65M2-F1 Heat Spreader (95 x 125 x 18mm)

HS-65M2-C1 Cooler (95 x 125 x 34.8mm)

PBE-1702

CBK-04-1702-00

Intel® Celeron 827E WT COM Express CPU
module

COM Express Type 6 evaluation board in
ATX form factor

Cable kit
1 x SATA cable
2 x COM port cables
1 x USB cable

- 6 -

1.10 Specications

Introduction

Form Factor

CPU

Chipset

System Memory

VGA/ LCD
Controller

Ethernet controller

BIOS

Storage

Parallel Port

Universal Serial Bus

LCD

Expansion Interface

Operation Temp. -40ºC ~ 85ºC (-4ºF ~ 185ºF)

Watchdog Timer

Dimension (L x W)

COM Express Type 6 CPU Module

Intel® Celeron™ 827E 1.4GHz processor

Intel® HM65

2 x DDR3 SO-DIMM sockets, supporting up to 8GB
SDRAM

Intel® Graphics Media Accelerator 3000 graphics
core w/ Analog RGB/ Dual Channels 24-bit LVDS
(Dual independent displays), 3 x DDI ports

1 x Intel 82579LM Gigabit Ethernet PHY

AMI PnP Flash BIOS

2 x Serial ATA ports w/ 600MB/s HDD transfer rate
2 x Serial ATA ports w/ 300MB/s HDD transfer rate

SPP/EPP/ECP mode selectable (via COM Express
carrier board)

8 x USB 2.0 ports

Dual Channels 24-bit LVDS

1 x PCIe x16 lanes
5 x PCIe x1 lanes
SPI, and LPC (Low Pin Count) interface

1~ 255 levels Reset

125 x 95 mm (4.9” x 3.7”)

- 7 -

Introduction

1.11 Board Dimensions

Sandy
Bridge

Processor

PCH

73,67

QM67

71,58

4,0030,00

95,00

87,00

35,56

Ø2.6*Ø6.5

125,00

86,01

55,68

45,35

48,46

4,00

41,0076,00

4,00

(9,2)

(SODIMM)

2

32

12

6

Unit: mm

- 8 -

2Chapter 2

Installation

Installation

Chapter 2 - Installation

- 9 -

Installation

2.1 What is “COM Express”?

With more and more demands on small and embedded industrial boards, a
multi-functioned COM (Computer-on-Module) is the great one of the
solutions.
COM Express, board-to-board connectors consist of two rows of 220 pins
each.
Row AB, which is required, provides pins for PCI Express, SATA, LVDS, LCD
channel, LPC bus, system and power management, VGA, LAN, and power
and ground interfaces.
Row CD, which is optional, provides SDVO and legacy PCI and IDE signals
next to additional PCI Express, LAN and power and ground signals.

By the way, the target markets of COM will be focused on:

● Retail & Advertising

● Medical

● Test & Measurement

● Gaming & Entertainment

● Industrial & Automation

● Military & Government

● Security

- 10 -

Installation

COM Express supports seven pin-out Type applying to Basic and Extended
form factors:
Module Type 1 and 10 support single connector with two rows of pins (220
pins) Module Type 2, 3, 4, 5 and 6 support two connectors with four rows
of pins (440 pins) Connector placement and most mounting holes have
transparency between Form Factors.
The differences among the Module Type 6 and COM-870E are summarized
in table below:

Module Type Standard Type 6 COM-870E-827E

Connectors 2 2

Connector Rows A, B, C, D A, B, C, D

PCIe Lanes (Max) 24 23

PCI Bus No No

PATA - ID E No No

LAN (Max) 1 1

Serial Ports (Max) 2 0

Muxed SDVO No No

Digital Display I/F (Max) 3 3

USB 3.0 Ports (Max) 4 0

- 11 -

Installation

2.2 Block Diagram

PCIex16 (PEG)

DDI1 (DisplayPoer/HDMI/DIV/SDVO)

Connector CD

DDI2 (DisplayPort/HDMI/DVI)

Soldered

onboard

Intel®

Celeron 827E

Processor

DMI2

FDI

(x4)

Intel®

HM65

PCH

DDR3-1333/1066MHz

Dual Channels 24-bit LVDS

Analog RGB

HD Audio Link

SATA0, 1 (600Gb/s)

SATA2, 3 (300Gb/s)

USB Port 0 ~7

5 x PCIex1

Intel 82579LM

PCIex1

GbE controller

2 x SO-DIMM DDR3
sockets

GbE LAN

Connector AB

DDI3 (DisplayPort/HDMI/DVI)

1 x PCIex1

- 12 -

SMBus

LPC I/F

SPI Bus

Fintek

F75111

LPC I/F

TPM 1.2 (optional)

Infineon SLB9635

SMBus

SPI Bus

SPI BIOS

8 GPIO

2.3 Connectors

Top side

Bottom side

COM Express AB Connector

COM Express CD Connector

Installation

Sandy
Bridge

Processor

PCH

QM67

COM Express CD Connector

COM Express AB Connector

- 13 -

Installation

2.4 COM Express AB Connector (bottom side)

GND (FIXED)

B1

GBE0_ACT#

B2

LPC_FRAME#

B3

LPC_AD0

B4

LPC_AD1

B5

LPC_AD2

B6

LPC_AD3

B7

LPC_DRQ0#

B8

LPC_DRQ1#

B9

LPC_CLK

B10

GND (FIXED)

B11

PWRBTN#

B12

SMB_CK

B13

SMB_DAT

B14

SMB_ALERT#

B15

SATA1_TX+

B16

SATA1_TX-

B17

SUS_STAT#

B18

SATA1_RX+

B19

SATA1_RX-

B20

GND (FIXED)

B21

SATA3_TX+

B22

SATA3_TX-

B23

PWR_OK

B24

SATA3_RX+

B25

SATA3_RX-

B26

WDT

B27

AC_SDIN2

B28

AC_SDIN1

B29

AC_SDIN0

B30

GND

B31

SPKR

B32

I2C_CK

B33

I2C_DAT

B34

THRM#

B35

USB7-

B36

USB7+

B37

USB_4_5_OC#

B38

USB5-

B39

USB5+

B40

GND

B41

USB3-

B42

USB3+

B43

USB_0_1_OC#

B44

USB1-

B45

USB1+

B46

EXCD1_PERST#

B47

EXCD1_CPPE#

B48

SYS_RESET#

B49

CB_RESET#

B50

GND

B51

PCIE_RX5+

B52

PCIE_RX5-

B53

GPO1

B54

PCIE_RX4+

B55

GND (FIXED)

GBE0_MDI3-

GBE0_MDI3+

GBE0_LINK100#

GBE0_LINK1000#

GBE0_MDI2­GBE0_MDI2+
GBE0_LINK#

GBE0_MDI1­GBE0_MDI1+
GND (FIXED)

GBE0_MDI0­GBE0_MDI0+

GBE0_CTREF

SUS_S3#

SATA0_TX+

SATA0_TX-

SUS_S4#

SATA0_RX+

SATA0_RX-

GND (FIXED)

SATA2_TX+

SATA2_TX-

SUS_S5#

SATA2_RX+

SATA2_RX-

BATLOW#

ATA_ACT#

AC_SYNC

AC_RST#

GND
AC_BITCLK
AC_SDOUT

BIOS_DISABLE#

THRMTRIP#

USB6-

USB6+

USB_6_7_OC#

USB4-

USB4+

GND

USB2-

USB2+

USB_2_3_OC#

USB0-

USB0+

VCC_RTC

EXCD0_PERST#

EXCD0_CPPE#

LPC_SERIRQ

GND

PCIE_TX5+

PCIE_TX5-

GPI0

PCIE_TX4+

A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
A22
A23
A24
A25
A26
A27
A28
A29
A30
A31
A32
A33
A34
A35
A36
A37
A38
A39
A40
A41
A42
A43
A44
A45
A46
A47
A48
A49
A50
A51
A52
A53
A54
A55

PCIE_RX4-

B56

GPO2

B57

PCIE_RX3+

B58

PCIE_RX3-

B59

GND

B60

PCIE_RX2+

B61

PCIE_RX2-

B62

GPO3

B63

PCIE_RX1+

B64

PCIE_RX1-

B65

WAKE0#

B66

WAKE1#

B67

PCIE_RX0+

B68

PCIE_RX0-

B69

GND

B70

LVDS_B0+

B71

LVDS_B0-

B72

LVDS_B1+

B73

LVDS_B1-

B74

LVDS_B2+

B75

LVDS_B2-

B76

LVDS_B3+

B77

LVDS_B3-

B78

LVDS_BKLT_EN

B79

GND

B80

LVDS_B_CK+

B81

LVDS_B_CK-

B82

CKLVDS_BKLT_CTRL

B83

VCC_5V_SBY

B84

VCC_5V_SBY

B85

VCC_5V_SBY

B86

VCC_5V_SBY

B87

RSVD

B88

VGA_RED

B89

GND

B90

VGA_GRN

B91

VGA_BLU

B92

VGA_HSYNC

B93

VGA_VSYNC

B94

VGA_I2C_CK

B95

VGA_I2C_DAT

B96

TV_DAC_A

B97

TV_DAC_B

B98

TV_DAC_C

B99

GND

B100

VCC_12V

B101

VCC_12V

B102

VCC_12V

B103

VCC_12V

B104

VCC_12V

B105

VCC_12V

B106

VCC_12V

B107

VCC_12V

B108

VCC_12V

B109

GND

B110

PCIE_TX4-

GND

PCIE_TX3+

PCIE_TX3-

GND

PCIE_TX2+

PCIE_TX2-

GPI1

PCIE_TX1+

PCIE_TX1-

GND
GPI2

PCIE_TX0+

PCIE_TX0-

GND

LVDS_A0+

LVDS_A0-

LVDS_A1+

LVDS_A1-

LVDS_A2+

LVDS_A2-

LVDS_VDD_EN

LVDS_A3+

LVDS_A3-

GND

LVDS_A_CK+

LVDS_A_CK-

LVDS_I2C_CK

LVDS_I2C_DAT

GPI3

KBD_RST#

KBD_A20GATE

PCIE0_CK_REF+

PCIE0_CK_REF-

GND

RSVD B91

RSVD
GPO0
RSVD
RSVD

GND
VCC_12V
VCC_12V
VCC_12V

GND
VCC_12V
VCC_12V
VCC_12V
VCC_12V
VCC_12V
VCC_12V
VCC_12V
VCC_12V
VCC_12V

GND

A56
A57
A58
A59
A60
A61
A62
A63
A64
A65
A66
A67
A68
A69
A70
A71
A72
A73
A74
A75
A76
A77
A78
A79
A80
A81
A82
A83
A84
A85
A86
A87
A88
A89
A90
A91
A92
A93
A94
A95
A96
A97
A98
A99
A100
A101
A102
A103
A104
A105
A106
A107
A108
A109
A110

- 14 -

2.5 COM Express CD Connector (bottom side)

Installation

GND (FIXED)

D1

GND

D2

USB_SSTX0-

D3

USB_SSTX0+

D4

GND

D5

USB_SSTX1-

D6

USB_SSTX1+

D7

GND

D8

USB_SSTX2-

D9

USB_SSTX2+

D10

GND (FIXED)

D11

USB_SSTX3-

D12

USB_SSTX3+

D13

GND

D14

DDI1_CTRLCLK_AUX+

D15

DDI1_CTRLCLK_AUX-

D16

RSVD

D17

RSVD

D18

PCIE_TX6+

D19

PCIE_TX6-

D20

GND(FIXED)

D21

PCIE_TX7+

D22

PCIE_TX7-

D23

RSVD

D24

RSVD

D25

DDI1_PAIR0+

D26

DDI1_PAIR0-

D27

RSVD

D28

DDI1_PAIR1+

D29

DDI1_PAIR1-

D30

GND(FIXED)

D31

DDI1_PAIR2+

D32

DDI1_PAIR2-

D33

DDI1_DDC_AUX_SEL

D34

RSVD

D35

DDI1_PAIR3+

D36

DDI1_PAIR3-

D37

RSVD

D38

DDI1_PAIR0+

D39

DDI1_PAIR0-

D40

GND(FIXED)

D41

DDI1_PAIR1+

D42

DDI1_PAIR1-

D43

DDI2_HPD

D44

RSVD

D45

DDI2_PAIR2+

D46

DDI2_PAIR2-

D47

RSVD

D48

DDI2_PAIR3+

D49

DDI2_PAIR3-

D50

GND (FIXED)

D51

PEG_TX0+

D52

PEG_TX0-

D53

PEG_LANE_RV#

D54

PEG_TX1+

D55

GND (FIXED)

USB_SSRX0-

USB_SSRX0+

USB_SSRX1-

USB_SSRX1+

USB_SSRX2-

USB_SSRX2+

GND (FIXED)

USB_SSRX3-

USB_SSRX3+

DDI1_PAIR6+

DDI1_PAIR6-

PCIE_RX6+

PCIE_RX6-

GND(FIXED)

PCIE_RX7+

PCIE_RX7-

DDI1_PAIR4+

DDI1_PAIR4-

DDI1_PAIR5+

DDI1_PAIR5-

GND (FIXED)

DDI2_CTRLCLK_AUX+

DDI2_CTRLCLK_AUX-

DDI2_DDC_AUX_SEL

DDI3_CTRLCLK_AUX+

DDI3_CTRLCLK_AUX-

DDI3_DDC_AUX_SEL

DDI3_PAIR0+

DDI3_PAIR0-

GND(FIXED)

DDI3_PAIR1+

DDI3_PAIR1-

DDI3_PAIR2+

DDI3_PAIR2-

DDI3_PAIR3+

DDI3_PAIR3-

GND (FIXED)

PEG_RX0+

PEG_RX1+

GND

GND

GND

GND

RSVD
RSVD

DDI1_HPD

RSVD
RSVD

RSVD

DDI3_HPD

RSVD

RSVD

PEG_RX0-

TYPE0#

C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
C11
C12
C13
C14
C15
C16
C17
C18
C19
C20
C21
C22
C23
C24
C25
C26
C27
C28
C29
C30
C31
C32
C33
C34
C35
C36
C37
C38
C39
C40
C41
C42
C43
C44
C45
C46
C47
C48
C49
C50
C51
C52
C53
C54
C55

D56
D57
D58
D59
D60
D61
D62
D63
D64
D65
D66
D67
D68
D69
D70
D71
D72
D73
D74
D75
D76
D77
D78
D79
D80
D81
D82
D83
D84
D85
D86
D87
D88
D89
D90
D91
D92
D93
D94
D95
D96
D97
D98

D99
D100
D101
D102
D103
D104
D105
D106
D107
D108
D109
D110

PEG_TX1­TYPE2#
PEG_TX2+
PEG_TX2­GND (FIXED)
PEG_TX3+
PEG_TX3­RSVD
RSVD
PEG_TX4+
PEG_TX4­RSVD
PEG_TX5+
PEG_TX5­GND (FIXED)
PEG_TX6+
PEG_TX6­GND
PEG_TX7+
PEG_TX7­GND
RSVD
PEG_TX8+
PEG_TX8­GND (FIXED)
PEG_TX9+
PEG_TX9­RSVD
GND
PEG_TX10+
PEG_TX10­GND
PEG_TX11+
PEG_TX11­GND (FIXED)
PEG_TX12+
PEG_TX12­GND
PEG_TX13+
PEG_TX13­GND
RSVD
PEG_TX14+
PEG_TX14­GND (FIXED)
PEG_TX15+
PEG_TX15­GND
VCC_12V
VCC_12V
VCC_12V
VCC_12V
VCC_12V
VCC_12V
GND (FIXED)

PEG_RX1-

TYPE1#

PEG_RX2+

PEG_RX2-

GND (FIXED)

PEG_RX3+

PEG_RX3-

RSVD
RSVD

PEG_RX4+

PEG_RX4-

RSVD

PEG_RX5+

PEG_RX5-

GND (FIXED)

PEG_RX6+

PEG_RX6-

GND

PEG_RX7+

PEG_RX7-

GND

RSVD

PEG_RX8+

PEG_RX8-

GND (FIXED)

PEG_RX9+

PEG_RX9-

RSVD

GND

PEG_RX10+

PEG_RX10-

GND

PEG_RX11+

PEG_RX11-

GND (FIXED)

PEG_RX12+

PEG_RX12-

GND

PEG_RX13+

PEG_RX13-

GND

RSVD

PEG_RX14+

PEG_RX14-

GND (FIXED)

PEG_RX15+

PEG_RX15-

GND
VCC_12V
VCC_12V
VCC_12V
VCC_12V
VCC_12V
VCC_12V

GND (FIXED)

C56
C57
C58
C59
C60
C61
C62
C63
C64
C65
C66
C67
C68
C69
C70
C71
C72
C73
C74
C75
C76
C77
C78
C79
C80
C81
C82
C83
C84
C85
C86
C87
C88
C89
C90
C91
C92
C93
C94
C95
C96
C97
C98
C99
C100
C101
C102
C103
C104
C105
C106
C107
C108
C109
C110

- 15 -

Installation

2.6 The Installation Paths of CD Driver
Windows 2000 & XP

Driver Path

CHIPSET \EmETXe-i67M2\CHIPSET

LAN

NET Framework \EmETXe-i67M2\NET Framework

VGA

Management
Engine

RAID \EmETXe-i67M2\IRST

\EmETXe-i67M2\ETHERNET\XP_WIN7_SERIES\32
\EmETXe-i67M2\ETHERNET\XP_WIN7_SERIES\64

\EmETXe-i67M2\GRAPHICS\Windows XP 32bit
Graphics Drivers\Windows XP Graphics Drivers\
winxp

\EmETXe-i67M2\GRAPHICS\Windows XP 64bit
Graphics Drivers\Windows XP64 Graphics Drivers\
winxp64

\EmETXe-i67M2\ME

Windows 7

Driver Path

CHIPSET \EmETXe-i67M2\CHIPSET

LAN

VGA

Management
Engine

Intel Turbo \EmETXe-i67M2\OTHERS

\EmETXe-i67M2\ETHERNET\XP_WIN7_SERIES\32
\EmETXe-i67M2\ETHERNET\XP_WIN7_SERIES\64

\EmETXe-i67M2\GRAPHICS\Windows 7 Graphics
Driver 32_bit\Windows Vista Windows 7 Graphics
Driver\WinVista7

\EmETXe-i67M2\GRAPHICS\Windows 7 64-Bit
Graphics Driver\Windows Vista Windows 7 64-Bit
Graphics Driver\WinVista7_64

\EmETXe-i67M2\ME

- 16 -

Installation

2.7 Heatsink Installation

1. Prepare your optional heatsink, thermal pad and CPU module.

2. You have to put an additional thermal pad between heatsink and CPU
module. Please tear protective membranes on both sides from thermal pad

rst of all, be sure not to pinch or mold the thermal pad, and then put it as

right picture.

3. You may also apply thermal pad to their memory module. But be aware to

put it on the designated place of the rst module, as the left illustration, and

don’t put it on the 2nd module, as right picture, for the 2nd memory module
doesn’t need it.

(O) (X)

- 17 -

Installation

4. After everything is settled down, please assemble heatsink with CPU
module according to their corresponding screw positions.

5. Carefully turn them over together and secure the rst 3 screws as left

picture. Overturn again to secure the rest as right picture.

- 18 -

BIOS

BIOS

3Chapter 3

Chapter 3 - BIOS

- 19 -