Appendix D: Digital I/O Setting .......................................................70
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Introduction
1Chapter 1
Introduction
Chapter 1 - Introduction
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Introduction
1.1 Copyright Notice
All Rights Reserved.
The information in this document is subject to change without prior notice in
order to improve the reliability, design and function. It does not represent a
commitment on the part of the manufacturer.
Under no circumstances will the manufacturer be liable for any direct, indirect,
special, incidental, or consequential damages arising from the use or inability
to use the product or documentation, even if advised of the possibility of such
damages.
This document contains proprietary information protected by copyright.
All rights are reserved. No part of this manual may be reproduced by any
mechanical, electronic, or other means in any form without prior written
permission of the manufacturer.
1.2 Declaration of Conformity
CE
The CE symbol on your product indicates that it is in compliance with the
directives of the Union European (EU). A Certicate of Compliance is available
by contacting Technical Support.
This product has passed the CE test for environmental specications when
shielded cables are used for external wiring. We recommend the use of
shielded cables. This kind of cable is available from ARBOR. Please contact
your local supplier for ordering information.
This product has passed the CE test for environmental specications. Test
conditions for passing included the equipment being operated within an
industrial enclosure. In order to protect the product from being damaged by
ESD (Electrostatic Discharge) and EMI leakage, we strongly recommend the
use of CE-compliant industrial enclosure products.
Warning
This is a class A product. In a domestic environment this product may cause
radio interference in which case the user may be required to take adequate
measures.
FCC Class A
This device complies with Part 15 of the FCC Rules. Operation is subject to
the following two conditions:
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Introduction
(1)This device may not cause harmful interference, and
(2)This device must accept any interference received, including interference
that may cause undesired operation.
NOTE:
This equipment has been tested and found to comply with the limits for a
Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are
designed to provide reasonable protection against harmful interference when
the equipment is operated in a commercial environment. This equipment
generates, uses, and can radiate radio frequency energy and, if not installed
and used in accordance with the instruction manual, may cause harmful
interference to radio communications. Operation of this equipment in a
residential area is likely to cause harmful interference in which case the user
will be required to correct the interference at his own expense.
RoHS
ARBOR Technology Corp. certies that all components in its products are in
compliance and conform to the European Union’s Restriction of Use of Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive
2002/95/EC.
The above mentioned directive was published on 2/13/2003. The main purpose of the directive is to prohibit the use of lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB), and polybrominated diphenyl
ethers (PBDE) in electrical and electronic products. Member states of the EU
are to enforce by 7/1/2006.
ARBOR Technology Corp. hereby states that the listed products do not contain
unintentional additions of lead, mercury, hex chrome, PBB or PBDB that exceed a maximum concentration value of 0.1% by weight or for cadmium exceed
0.01% by weight, per homogenous material. Homogenous material is dened
as a substance or mixture of substances with uniform composition (such as solders, resins, plating, etc.). Lead-free solder is used for all terminations (Sn(96-
96.5%), Ag(3.0-3.5%) and Cu(0.5%)).
SVHC / REACH
To minimize the environmental impact and take more responsibility to the
earth we live, Arbor hereby conrms all products comply with the restriction
of SVHC (Substances of Very High Concern) in (EC) 1907/2006 (REACH
--Registration, Evaluation, Authorization, and Restriction of Chemicals)
regulated by the European Union.
All substances listed in SVHC < 0.1 % by weight (1000 ppm)
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Introduction
1.3 About This User’s Manual
This user’s manual provides general information and installation instructions
about the product. This User’s Manual is intended for experienced users and
integrators with hardware knowledge of personal computers. If you are not
sure about any description in this booklet. please consult your vendor before
further handling.
1.4 Warning
Single Board Computers and their components contain very delicate
Integrated Circuits (IC). To protect the Single Board Computer and its
components against damage from static electricity, you should always follow
the following precautions when handling it :
1. Disconnect your Single Board Computer from the power source when you
want to work on the inside.
2. Hold the board by the edges and try not to touch the IC chips, leads or circuitry.
3. Use a grounded wrist strap when handling computer components.
4. Place components on a grounded antistatic pad or on the bag that comes
with the Single Board Computer, whenever components are separated from
the system.
1.5 Replacing the Lithium Battery
Incorrect replacement of the lithium battery may lead to a risk of explosion.
The lithium battery must be replaced with an identical battery or a battery type
recommended by the manufacturer.
Do not throw lithium batteries into the trash-can. It must be disposed of in
accordance with local regulations concerning special waste.
1.6 Technical Support
If you have any technical difculties, please do not hesitate to call or e-mail our
customer service.
http://www.arbor.com.tw
E-mail:info@arbor.com.tw
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Introduction
1.7 Warranty
This product is warranted to be in good working order for a period of two years
from the date of purchase. Should this product fail to be in good working order
at any time during this period, we will, at our option, replace or repair it at no
additional charge except as set forth in the following terms. This warranty does
not apply to products damaged by misuse, modications, accident or disaster.
Vendor assumes no liability for any damages, lost prots, lost savings or any
other incidental or consequential damage resulting from the use, misuse of,
or inability to use this product. Vendor will not be liable for any claim made by
any other related party.
Vendors disclaim all other warranties, either expressed or implied, including
but not limited to implied warranties of merchantability and tness for a
particular purpose, with respect to the hardware, the accompanying product’s
manual(s) and
warranty gives you specic legal rights.
Return authorization must be obtained from the vendor before returned
merchandise will be accepted.
faxing
the vendor and
number.
description.
Returned
written materials, and any accompanying hardware. This limited
Authorization can be obtained by calling or
requesting a Return Merchandise Authorization (RMA)
goods should always be accompanied by a clear problem
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Introduction
1.8 Packing List
Packing List
Before you begin installing your single board, please make sure that the following
materials have been shipped:
1 x COM-870E COM Express CPU Module
1 x Driver CD
1 x Quick Installation Guide
If any of the above items is damaged or missing, contact your vendor
immediately.
1.9 Ordering Information
COM-870E-827E
HS-65M2-F1Heat Spreader (95 x 125 x 18mm)
HS-65M2-C1Cooler (95 x 125 x 34.8mm)
PBE-1702
CBK-04-1702-00
Intel® Celeron 827E WT COM Express CPU
module
COM Express Type 6 evaluation board in
ATX form factor
Cable kit
1 x SATA cable
2 x COM port cables
1 x USB cable
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1.10 Specications
Introduction
Form Factor
CPU
Chipset
System Memory
VGA/ LCD
Controller
Ethernet controller
BIOS
Storage
Parallel Port
Universal Serial Bus
LCD
Expansion Interface
Operation Temp.-40ºC ~ 85ºC (-4ºF ~ 185ºF)
Watchdog Timer
Dimension (L x W)
COM Express Type 6 CPU Module
Intel® Celeron™ 827E 1.4GHz processor
Intel® HM65
2 x DDR3 SO-DIMM sockets, supporting up to 8GB
SDRAM
Intel® Graphics Media Accelerator 3000 graphics
core w/ Analog RGB/ Dual Channels 24-bit LVDS
(Dual independent displays), 3 x DDI ports
1 x Intel 82579LM Gigabit Ethernet PHY
AMI PnP Flash BIOS
2 x Serial ATA ports w/ 600MB/s HDD transfer rate
2 x Serial ATA ports w/ 300MB/s HDD transfer rate
SPP/EPP/ECP mode selectable (via COM Express
carrier board)
8 x USB 2.0 ports
Dual Channels 24-bit LVDS
1 x PCIe x16 lanes
5 x PCIe x1 lanes
SPI, and LPC (Low Pin Count) interface
1~ 255 levels Reset
125 x 95 mm (4.9” x 3.7”)
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Introduction
1.11 Board Dimensions
Sandy
Bridge
Processor
PCH
73,67
QM67
71,58
4,0030,00
95,00
87,00
35,56
Ø2.6*Ø6.5
125,00
86,01
55,68
45,35
48,46
4,00
41,0076,00
4,00
(9,2)
(SODIMM)
2
32
12
6
Unit: mm
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2Chapter 2
Installation
Installation
Chapter 2 - Installation
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Installation
2.1 What is “COM Express”?
With more and more demands on small and embedded industrial boards, a
multi-functioned COM (Computer-on-Module) is the great one of the
solutions.
COM Express, board-to-board connectors consist of two rows of 220 pins
each.
Row AB, which is required, provides pins for PCI Express, SATA, LVDS, LCD
channel, LPC bus, system and power management, VGA, LAN, and power
and ground interfaces.
Row CD, which is optional, provides SDVO and legacy PCI and IDE signals
next to additional PCI Express, LAN and power and ground signals.
By the way, the target markets of COM will be focused on:
● Retail & Advertising
● Medical
● Test & Measurement
● Gaming & Entertainment
● Industrial & Automation
● Military & Government
● Security
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Installation
COM Express supports seven pin-out Type applying to Basic and Extended
form factors:
Module Type 1 and 10 support single connector with two rows of pins (220
pins) Module Type 2, 3, 4, 5 and 6 support two connectors with four rows
of pins (440 pins) Connector placement and most mounting holes have
transparency between Form Factors.
The differences among the Module Type 6 and COM-870E are summarized
in table below:
\EmETXe-i67M2\GRAPHICS\Windows 7 Graphics
Driver 32_bit\Windows Vista Windows 7 Graphics
Driver\WinVista7
\EmETXe-i67M2\GRAPHICS\Windows 7 64-Bit
Graphics Driver\Windows Vista Windows 7 64-Bit
Graphics Driver\WinVista7_64
\EmETXe-i67M2\ME
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Installation
2.7 Heatsink Installation
1. Prepare your optional heatsink, thermal pad and CPU module.
2. You have to put an additional thermal pad between heatsink and CPU
module. Please tear protective membranes on both sides from thermal pad
rst of all, be sure not to pinch or mold the thermal pad, and then put it as
right picture.
3. You may also apply thermal pad to their memory module. But be aware to
put it on the designated place of the rst module, as the left illustration, and
don’t put it on the 2nd module, as right picture, for the 2nd memory module
doesn’t need it.
(O)(X)
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Installation
4. After everything is settled down, please assemble heatsink with CPU
module according to their corresponding screw positions.
5. Carefully turn them over together and secure the rst 3 screws as left
picture. Overturn again to secure the rest as right picture.
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BIOS
BIOS
3Chapter 3
Chapter 3 - BIOS
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BIOS
3.1 BIOS Main Setup
The AMI BIOS provides a setup utility program for specifying the system
congurations and settings which are stored in the BIOS ROM of the system.
When you turn on the computer, the AMI BIOS is immediately activated. After
you have entered the setup utility, use the left/right arrow keys to highlight a
particular conguration screen from the top menu bar or use the down arrow
key to access and congure the information below.
NOTE: In order to increase system stability and performance, our engineering
staff are constantly improving the BIOS menu. The BIOS setup screens and
descriptions illustrated in this manual are for your reference only, and may not
completely match what you see on your screen.
BIOS Information
Display the BIOS information.
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BIOS
System Date
Set the system date. Note that the ‘Day’ automatically changes when you set
the date.
The date format is: Day : Sun to Sat
Month : 1 to 12
Date : 1 to 31
Year : 1999 to 2099
System Time
Set the system time.
The time format is: Hour : 00 to 23
Minute : 00 to 59Second : 00 to 59
3.2 Advanced Settings
Legacy OpROM Support
Launch PXE OpROM
Enable or disable the boot option for legacy network devices.
Launch Storage OpROM
Enable or Disable Boot Option for Legacy Mass Storage Devices with Option
ROM.
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BIOS
3.2.1 ACPI Conguration
Enable Hibernation
Enable or disable System ability to Hibernation (OS/S4 Sleep State). This option may be not effective with some OS.
ACPI Sleep State
Select the highest ACPI sleep state the system will enter when the SUSPEND
button is pressed.
The choice: Suspend Disabled, S1 (CPU Stop Clock), S3 (Suspend to RAM)
Lock Legacy Resources
Enable or disable Lock of Legacy Resources.
Power-Supply Type
Set power-supply type.
The choice: AT, ATX
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BIOS
3.2.2 CPU Conguration
The CPU Conguration setup screen varies depending on the installed
processor.
Hyper-threading
This item is used to enable or disable the processor’s Hyper-threading
feature.
Enabled for Windows XP and Linux (OS optimized for Hyper-threading
Technology) and disabled for other OS (OS not optimized for Hyper-threading
Technology).
When disabled, only one thread per enabled core is enabled.
Limit CPUID Maximum
Enable or disable the Limit CPUID Maximum.
Intel Virtualization Technology
When enabled, a VMM can utilize the additional hardware capabilities provided by Vanderpool Technology.
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BIOS
3.2.3 SATA Conguration
It allows you to select the operation mode for SATA controller.
SATA Controller(s)
Enable or disable SATA devices.
SATA Mode Selection
The choice: Disable; IDE (Default), RAID
IDE: Set the Serial ATA drives as Parallel ATA storage devices.
RAID: Create RAID or Intel Matrix Storage conguration on Serial ATA
devices.
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3.2.4 Intel Anti-Theft Technology Conguration
BIOS
Intel Anti-Theft Technology
Enable or disable Intel® Anti-Theft Technology function in BIOS.
Intel Anti-Theft Technology Recovery
Set the number of times Recovery attempted will be allowed.
Enter Intel AT Suspend Mode
Enable or disable the request that platform enters AT suspend mode.
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BIOS
3.2.5 AMT Conguration
BIOS Hotkey Pressed
OEMFLag Bit 1:
Enable/Disable BIOS hotkey press.
MeBx Selection Screen
OEMFLag Bit 2:
Enable/Disable MEBx selection screen.
Verbose Mebx Output
OEMFLag Bit 3:
Enable/Disable Verbose Mebx Output.
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Hide Un-Congure ME Conrmation
OEMFLag Bit 6:
Hide Un-Congure ME without password Conrmation Prompt.
MeBx Debug Message Output
OEMFLag Bit 14:
Enable MEBx debug message output.
Un-Congure ME
OEMFLag Bit 15:
Un-Congure ME without password.
Intel AMT Password Write Enabled
Enable/Disable Intel AMT Password Write. Password is writable when
set Enable.
Amt Wait Timer
Set timer to wait before sending ASF_GET_BOOT_OPTIONS.
ASF
Enable/Disable Alert Specication Format.
Activate Remote Assistance Process
BIOS
Trigger CIRA boot.
USB Congure
Enable/Disable USB Congure function.
PET Progress
User can enable/disable PET Events progress to received PET events or
not.
Intel Amt SPI Protected
Enable/Disable Intel AMT SPI write protect.
WatchDog
Enable/Disable WatchDog Timer.
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BIOS
3.2.6 USB Conguration
Legacy USB Support
Enable support for legacy USB. AUTO option disables legacy support if no
USB devices are connected.
The choice: Enabled (Default); Auto; Disabled
EHCI Hand-off
Allow you to enable support for operating systems without an EHCI hand-off
feature. Do not disable the BIOS EHCI Hand-Off option if you are running a
Windows® operating system with USB device.
The choice: Enabled (Default); Disabled
USB Beep Switch
Enable/Disable USB Beep sound.
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BIOS
USB hardware delays and time-outs
USB transfer time-out — The time-out value for control, bulk, and interrupt
transfers. Default setting: 20 sec
Device reset time-out — USB mass storage device start unit command timeout. Default setting: 20 sec
Device power-up delay — Maximum time the device will take before it properly reports itself to the host controller. ‘Auto’ uses default value: for a Root
port it is 100ms, for a Hub port the delay is taken from hub descriptor. The
choice: Auto (Default); Manual
Mass Storage Devices
This item displays information when USB devices are detected.
3.2.7 H/W Monitor
PC Health Status
The hardware monitor menu shows the operating temperature and system
voltages of CPU module.
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BIOS
3.2.8 Super IO Conguration
You can use this item to set up or change the Super IO conguration for FDD
controllers, parallel ports and serial ports.
Power On After Power Failure
Specify what state to go to when power is re-applied after a power failure.
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BIOS
Serial Port 1~2 Conguration
Serial Port
Use the Serial port option to enable or disable the serial port.
The choice: Enabled, Disabled
Change Settings
Use the Change Settings option to change the serial port’s IO port address
and interrupt address.
The choice:
Auto
IO=3F8h; IRQ=4,
IO=3F8h; IRQ=3,4,5,6,7,10,11,12
IO=2F8h; IRQ=3,4,5,6,7,10,11,12
IO=3E8h; IRQ=3,4,5,6,7,10,11,12
IO=2E8h; IRQ=3,4,5,6,7,10,11,12
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BIOS
Parallel Port Conguration
Parallel Port Conguration
This item allows you to enable/disable Parallel Port (LPT/LPTE).
Change Settings
Use the Change Settings option to change the parallel port’s IO port address
and interrupt address.
The choice:
Auto
IO=378h; IRQ=5,
IO=378h; IRO=5,6,7,10,11,12,
IO=378h; IRQ=5,6,7,10,11,12,
IO=278h; IRQ=5,6,7,10,11,12,
IO=38Ch; IRQ=5,6,7,10,11,12,
Device Mode
The choice: Standard Parallel Port Mode, EPP Mode, ECP Mode, EPP Mode
& ECP Mode.
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3.2.9 Sandybridge PPM Conguration
EIST
Enable/Disable Intel SpeedStep.
CPU C3 Report
Enable/Disable CPU C3(ACPI C2) report to OS.
CPU C6 Report
Enable/Disable CPU C6(ACPI C3) report to OS.
CPU C7 Report
Enable/Disable CPU C7(ACPI C3) report to OS.
Long duration power limit
Long duration power limit in Watts, 0 means use factory default.
Long duration maintained
Time window which the long duration power is maintained.
Short duration power limit
Short duration power limit in Watts, 0 means use factory default.
TCC active offset
Offset from the factory TCC activation temperature.
BIOS
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BIOS
3.3 Chipset
This section allows you to congure and improve your system; also, set up
some system features according to your preference.
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3.3.1 System Agent (SA) Conguration
CHAP Device (B0:D7:F0)
Enable or disable SA CHAP Device.
Thermal Device (B0:D4 F0)
Enable or disable SA Thermal Device.
Enable NB CRID
Enable or disable NB CRID WorkAround.
BIOS
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BIOS
Graphics Conguration
Primary Display
Select which of IGFX/PEG/PCI Graphics Devices should be Primary Display
or select SG for Switchable Gfx.
Internal Graphics
Keep IGD enabled based on the option.
GTT Size
Select the GTT Size: 1MB, 2MB.
Aperture Size
Select the Aperture Size: 128MB, 256MB, 512MB.
DVMT Pre-Allocated
Select DVMT 5.0 Pre-Allocated (Fixed) Graphics Memory size used by the
Internal Graphics Device: 0M~512M.
DVMT Total Gfx Mem
Select DVMT5.0 Total Graphic Memory size used by the Internal Graphics
Device: 128M, 256M, MAX.
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Gfx Low Power Mode
This option is applicable for SFF only.
LCD Control
BIOS
Primary IGFX Boot Display
Select the Video Device which will be activated during POST. This has no effect if external graphics present.
Secondary boot display selection will appear based on your selection.
VGA modes will be supported only on primary display.
LCD Panel Type
Select LCD panel used by Internal Graphics Device by selecting the appropriate setup item: VBIOS Default, 640x480 LVDS ~ 2048x1536 LVDS.
Panel Scaling
Select the LCD panel scaling option used by the Internal Graphics Device:
Auto, Off, Force Scaling.
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BIOS
Backlight Control
The choice: PWM Inverted (Default), PWM Normal, GMBus Inverted and GMBus Normal.
BIA
The choice: VBIOS Default, Disabled and Level 1/2/3/4/5.
Spread Spectrum clock Chip
The default setting is Off. Other options are:
Hardware: Spread is controlled by chip.
Software: Spread is controlled by BIOS.
Active LFP
Select the Active LFP Conguration.
No LVDS: VBIOS does not enable LVDS.
Int-LVDS: VBIOS enables LVDS driver by Integrated encoder.
SDVO LVDS: VBIOS enables LVDS driver by SDVO encoder.
eDP Port-A: LFP driven by Int-DisplayPort encoder from Port-A.
Panel Color Depth
Select the LFP panel color depth: 18 Bit, 24 Bit.
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DMI Conguration
Control various DMI functions.
BIOS
DMI Vc1/Vcp/Vcm Control
Enable or disable DMI Vc1/Vcp/Vcm.
DMI Link ASPM Control
Enable or disable the control of Active State Power Management on SA side
of the DMI Link.
The choice: Disabled, L0s, L1, L0sL1
DMI Extended Synch Control
Enable or disable DMI Extended Synchronization.
DMI Gen 2
Enable or disable DMI Gen 2.
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BIOS
NB PCIe Conguration
Congure NB PCIe Express Settings.
PEG0 – Gen X
Congure PEG0 B0:D1:F0 Gen1-Gen2.
The choice: Auto, Gen1, Gen2
PEG1 – Gen X
Congure PEG1 B0:D1:F1 Gen1-Gen2.
The choice: Auto, Gen1, Gen2
PEG2 – Gen X
Congure PEG2 B0:D1:F2 Gen1-Gen2.
The choice: Auto, Gen1, Gen2
PEG3 – Gen X
Congure PEG3 B0:D6:F0 Gen1-Gen2.
The choice: Auto, Gen1, Gen2
Always Enable PEG
Enable the PEG slot.
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BIOS
PEG ASPM
Control ASPM support for the PEG Device. This has no effect if PEG is not the
currently active device.
The choice: Disabled, Auto, ASPM L0s, ASPM L1, ASPM L0sL1
De-emphasis Control
Congure the De-emphasis control on PEG.
The choice: -6 dB, -3.5 dB
Memory Conguration
DIMM prole
Select DIMM timing prole that should be used.
The choice: Default DIMM prole, XMP prole 1, XMP prole 2
Memory Frequency
Maximum Memory Frequency Selections in Mhz.
The choice: Auto, 1067, 1333, 1600, 1867, 2133
ECC Support
Enable or disable DDR Ecc Support.
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BIOS
Max TOLUD
Maximum Value of TOLUD. Dynamic assignment would adjust TOLUD
automatically based on largest MMIO length of installed graphic controller.
The choice: Dynamic, 1GB, 1.25 GB, 1.5 GB, 1.75 GB, 2GB, 2.25 GB,
2.5 GB, 2.75 GB, 3 GB, 3.25 GB
NMode Support
NMode Support Option.
The choice: Auto, 1 N Mode, 2 N Mode
Memory Scrambler
Enable or disable Memory Scrambler support.
RMT Crosser Support
Enable or disable RmtCrosserEnable support.
MRC Fast Boot
Enable or disable MRC fast boot.
Force Cold Reset
Force cold reset or choose MRC cold reset mode, when cold boot is required
during MRC execution.
NOTE: If ME 5.0MB is present, Force cold reset is required!
Scrambler Seed Generation Off
Control Memory Scrambler Seed Generation.
Enable - do not generate scrambler seed.
Disable - generate scrambler seed always.
Memory Remap
Enable or disable memory remap above 4G.
Channel A DIMM Control
Enable or disable dimms on channel A.
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Memory Thermal Conguration
Memory Thermal Conguration Options.
BIOS
Memory Thermal Management
Enable or disable Memory Thermal Management.
PECI Injected Temperature
Enable or disable memory temperatures to be injected to the processor via
PECI.
EXTT# via TS-on-Board
Enable or disable routing TS-on-Board’s ALERT# and THERM# to EXTTS#
pins on the PCH.
EXTT# via TS-on-DIMM
Enable or disable routing TS-on-DIMM’s ALERT# to EXTTS# pin on the PCH.
Virtual Temperature Sensor (VTS)
Enable or disable Virtual Temperature Sensor.
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BIOS
GT – Power Management Control
RC6 (Render Standby)
Check to enable render standby support.
GT Overclocking Support
Enable or disable GT Overclocking Support.
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3.3.2 PCH-IO Conguration
BIOS
PCIE Wake UP
Enable or disable PCIE Wake# to wake the system.
Wake on RING
Enable or disable Wake on RING (WOR). Computer will start up simply by applying power to a connected external modem if WOR is enabled.
Azalia
Control detection of the Azalia device.
Disabled = Azalia will be unconditionally disabled.
Enabled = Azalia will be unconditionally enabled.
Auto = Azalia will be enabled if present, disabled otherwise.
SLP_S4 Assertion Width
Select a minimum assertion width of the SLP_S4# signal.
The choice: 1-2 Seconds, 2-3 Seconds, 3-4 Seconds, 4-5 Seconds
Restore AC Power Loss
Select AC power state when power is re-applied after a power failure.
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BIOS
USB Conguration
EHCI1~2
Control the USB EHCI (USB2.0) functions.
One EHCI controller must always be enabled.
USB Ports Per-Port Disable Control
Enable or disable each of the USB ports (0~9).
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PCI Express Conguration
BIOS
PCI Express Clock Gating
Enable or disable PCI Express Clock Gating for each root port.
DMI Link ASPM Control
The control of Active State Power Management on both NB side and SB
side of the DMI Link.
DMI Link Extended Synch Control
The control of Extended Synch on SB side of the DMI Link.
Subtractive Decode
Enable or disable Subtractive Decode.
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BIOS
PCI Express Root Port 1~8
PCI Express Root Port 1~8
Control the PCI Express Root Port.
PEG1 – Gen X
Congure PEG1 B0 :D1 :F1 Gen1-Gen2
The choice: Auto, Gen1, Gen2
ASPM Support
Set the ASPM Level to Disabled, L0s, L1, L0sL1, Auto
Force L0 - Force all links to L0 State
AUTO - BIOS auto conguration
DISABLE - Disable ASPM
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BIOS
URR
Enable or disable PCI Express Unsupported Request Reporting.
FER
Enable or disable PCI Express Device Fatal Error Reporting.
NFER
Enable or disable PCI Express Device Non-Fatal Error Reporting.
CER
Enable or disable PCI Express Device Correctable Error Reporting.
CTO
Enable or disable PCI Express Completion Timer TO.
SEFE
Enable or disable Root PCI Express System Error on Fatal Error.
SENFE
Enable or disable Root PCI Express System Error on Non-Fatal Error.
SECE
Enable or disable Root PCI Express System Error on Correctable Error.
PME SCI
Enable or disable PCI Express PME SCI.
Hot Plug
Enable or disable PCI Express Hot Plug.
Extra Bus Reserved
Extra Bus Reserved (0-7) for bridges behind this Root Bridge.
Reserved Memory
Reserved Memory and Prefetchable Memory (1-20MB) Range for this Root
Bridge.
Reserved I/O
Reserved I/O (4k/8k/12k/16k/20k) Range for this Root Bridge.
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BIOS
3.4 Boot Settings
The Boot menu items allow you to change the system boot options.
Boot Conguration
Bootup NumLock State
This setting determines whether the Num Lock key should be activated at
boot up.
Quiet Boot
This allows you to select the screen display when the system boots.
Boot Option Priorities
Select the boot sequence of the hard drives.
Hard Drive BBS Priorities
This allows you to set the hard drive boot priority. The BIOS will attempt to
arrange the hard disk boot sequence automatically. You can also change the
booting sequence. The number of device items that appears on the screen
depends on the number of devices installed in the system.
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3.5 Security
BIOS
Administrator Password
Use the Administrator Password to set or change a administrator password.
ENTER PASSWORD
Type the password, up to eight characters in length, and press <Enter>. The
password typed now will clear any previously entered password from CMOS
memory. You will be asked to conrm the password. Type the password again
and press <Enter>. You may also press <ESC> to abort the selection and not
enter a password.
To disable a password, just press <Enter> when you are prompted to enter
the password. A message will conrm the password will be disabled. Once
the password is disabled, the system will boot and you can enter Setup freely.
PASSWORD DISABLED
When a password has been enabled, you will be prompted to enter it every
time you try to enter Setup. This prevents an unauthorized person from
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BIOS
changing any part of your system conguration.
Additionally, when a password is enabled, you can also require the BIOS to
request a password every time your system is rebooted. This would prevent
unauthorized use of your computer.
You can determine when the password is required within the BIOS Features
Setup Menu and its Security option. If the Security option is set to “System”,
the password will be required both at boot and at entry to Setup. If it’s set to
“Setup”, prompting only occurs when trying to enter Setup.
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3.6 Save & Exit
Save Changes and Reset
Pressing <Enter> on this item and it asks for conrmation:
Save conguration changes and exit setup?
BIOS
Pressing <OK> stores the selection made in the menus in CMOS - a special
section of memory that stays on after you turn your system off. The next
time you boot your computer, the BIOS congures your system according to
the Setup selections stored in CMOS. After saving the values the system is
restarted again.
Restore Defaults
Restore system to factory default.
Pressing <Enter> on this item and it asks for conrmation prior to executing
this command.
Boot Override
This group of functions includes a list of tokens, each of them corresponding
to one device within the boot order. Select a drive to immediately boot that
device regardless of the current boot order.
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BIOS
3.7 AMI BIOS Checkpoints
3.7.1 Checkpoint Ranges
Status Code RangeDescription
0x01 – 0x0BSEC execution
0x0C – 0x0FSEC errors
0x10 – 0x2F
0x30 – 0x4FPEI execution after memory detection
0x50 – 0x5FPEI errors
0x60 – 0x8FDXE execution up to BDS
0x90 – 0xCFBDS execution
0xD0 – 0xDFDXE errors
0xE0 – 0xE8S3 Resume (PEI)
0xE9 – 0xEFS3 Resume errors (PEI)
0xF0 – 0xF8Recovery (PEI)
0xF9 – 0xFFRecovery errors (PEI)
PEI execution up to and including memory
detection
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3.7.2 Standard Checkpoints
SEC Phase
Status CodeDescription
0x00Not used
Progress Codes
0x01Power on. Reset type detection (soft/hard).
0x02AP initialization before microcode loading
0x03North Bridge initialization before microcode loading
0x04South Bridge initialization before microcode loading
0x05OEM initialization before microcode loading
0x06Microcode loading
0x07AP initialization after microcode loading
0x08North Bridge initialization after microcode loading
0x09South Bridge initialization after microcode loading
0x0AOEM initialization after microcode loading
0x0BCache initialization
SEC Error Codes
0x0C – 0x0DReserved for future AMI SEC error codes
0x0EMicrocode not found
0x0FMicrocode not loaded
BIOS
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BIOS
PEI Phase
Status CodeDescription
Progress Codes
0x10PEI Core is started
0x11Pre-memory CPU initialization is started
0x12Pre-memory CPU initialization (CPU module specic)
0x13Pre-memory CPU initialization (CPU module specic)
0x14Pre-memory CPU initialization (CPU module specic)
0x15Pre-memory North Bridge initialization is started
0x16
0x17
0x18
0x19Pre-memory South Bridge initialization is started
0x37Post-Memory North Bridge initialization is started
0x38
0x39
0x3A
0x3BPost-Memory South Bridge initialization is started
0x3C
0x3D
0x3E
0x3F-0x4EOEM post memory initialization codes
0x4FDXE IPL is started
PEI Error Codes
0x50
0x51Memory initialization error. SPD reading has failed
0x52
0x53Memory initialization error. No usable memory detected
0x54Unspecied memory initialization error.
CPU post-memory initialization. Application Processor(s)
(AP) initialization
CPU post-memory initialization. Boot Strap Processor
(BSP) selection
CPU post-memory initialization. System Management
Mode (SMM) initialization
Post-Memory North Bridge initialization (North Bridge
module specic)
Post-Memory North Bridge initialization (North Bridge
module specic)
Post-Memory North Bridge initialization (North Bridge
module specic)
Post-Memory South Bridge initialization (South Bridge
module specic)
Post-Memory South Bridge initialization (South Bridge
module specic)
Post-Memory South Bridge initialization (South Bridge
module specic)
Memory initialization error. Invalid memory type or
incompatible memory speed
Memory initialization error. Invalid memory size or
memory modules do not match.
BIOS
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BIOS
0x55Memory not installed
0x56Invalid CPU type or Speed
0x57CPU mismatch
0x58CPU self test failed or possible CPU cache error
0x59
0x5AInternal CPU error
0x5Breset PPI is not available
0x5C-0x5FReserved for future AMI error codes
S3 Resume Progress Codes
0xE0
0xE1S3 Boot Script execution
0xE2Video repost
0xE3OS S3 wake vector call
0xE4-0xE7Reserved for future AMI progress codes
S3 Resume Error Codes
0xE8S3 Resume Failed
0xE9S3 Resume PPI not Found
0xEAS3 Resume Boot Script Error
0xEBS3 OS Wake Error
0xEC-0xEFReserved for future AMI error codes
Recovery Progress Codes
0xF0Recovery condition triggered by rmware (Auto recovery)
0xF1Recovery condition triggered by user (Forced recovery)
0xF2Recovery process started
0xF3Recovery rmware image is found
0xF4Recovery rmware image is loaded
0xF5-0xF7Reserved for future AMI progress codes
Recovery Error Codes
0xF8Recovery PPI is not available
CPU micro-code is not found or micro-code update is
failed
S3 Resume is stared (S3 Resume PPI is called by the
DXE IPL)
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0xF9Recovery capsule is not found
0xFAInvalid recovery capsule
0xFB – 0xFFReserved for future AMI error codes
DXE Phase
Status CodeDescription
0x60DXE Core is started
0x61NVRAM initialization
0x62Installation of the South Bridge Runtime Services
0x63CPU DXE initialization is started
0x64CPU DXE initialization (CPU module specic)
0x65CPU DXE initialization (CPU module specic)
0x66CPU DXE initialization (CPU module specic)
0x67CPU DXE initialization (CPU module specic)
0x68PCI host bridge initialization
0x69North Bridge DXE initialization is started
0x6ANorth Bridge DXE SMM initialization is started
0x6B
0x6C
0x6D
0x6E
0x6F
0x70South Bridge DXE initialization is started
0x71South Bridge DXE SMM initialization is started
0x72South Bridge devices initialization
0x73
North Bridge DXE initialization (North Bridge module
specic)
North Bridge DXE initialization (North Bridge module
specic)
North Bridge DXE initialization (North Bridge module
specic)
North Bridge DXE initialization (North Bridge module
specic)
North Bridge DXE initialization (North Bridge module
specic)
South Bridge DXE Initialization (South Bridge module
specic)
BIOS
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BIOS
0x74
0x75
0x76
0x77
0x78ACPI module initialization
0x79CSM initialization
0x7A – 0x7FReserved for future AMI DXE codes
0x80 – 0x8FOEM DXE initialization codes
0x90Boot Device Selection (BDS) phase is started
0x91Driver connecting is started
0x92PCI Bus initialization is started
0x93PCI Bus Hot Plug Controller Initialization
0x94PCI Bus Enumeration
0x95PCI Bus Request Resources
0x96PCI Bus Assign Resources
0x97Console Output devices connect
0x98Console input devices connect
0x99Super IO Initialization
0x9AUSB initialization is started
0x9BUSB Reset
0x9CUSB Detect
0x9DUSB Enable
0x9E – 0x9FReserved for future AMI codes
0xA0IDE initialization is started
0xA1IDE Reset
0xA2IDE Detect
0xA3IDE Enable
South Bridge DXE Initialization (South Bridge module
specic)
South Bridge DXE Initialization (South Bridge module
specic)
South Bridge DXE Initialization (South Bridge module
specic)
South Bridge DXE Initialization (South Bridge module
specic)
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0xA4SCSI initialization is started
0xA5SCSI Reset
0xA6SCSI Detect
0xA7SCSI Enable
0xA8Setup Verifying Password
0xA9Start of Setup
0xAAReserved for ASL (see ASL Status Codes section below)
0xABSetup Input Wait
0xACReserved for ASL (see ASL Status Codes section below)
0xADReady To Boot event
0xAELegacy Boot event
0xAFExit Boot Services event
0xB0Runtime Set Virtual Address MAP Begin
0xB1Runtime Set Virtual Address MAP End
0xB2Legacy Option ROM Initialization
0xB3System Reset
0xB4USB hot plug
0xB5PCI bus hot plug
0xB6Clean-up of NVRAM
0xB7Conguration Reset (reset of NVRAM settings)
0xB8 – 0xBFReserved for future AMI codes
0xC0 – 0xCFOEM BDS initialization codes
DXE Error Codes
0xD0CPU initialization error
0xD1North Bridge initialization error
0xD2South Bridge initialization error
0xD3Some of the Architectural Protocols are not available
0xD4PCI resource allocation error. Out of Resources
0xD5No Space for Legacy Option ROM
0xD6No Console Output Devices are found
BIOS
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BIOS
0xD7No Console Input Devices are found
0xD8Invalid password
0xD9Error loading Boot Option (LoadImage returned error)
0xDABoot Option is failed (StartImage returned error)
0xDBFlash update is failed
0xDCReset protocol is not available
ACPI/ASL Checkpoints
Status CodeDescription
0x01System is entering S1 sleep state
0x02System is entering S2 sleep state
0x03System is entering S3 sleep state
0x04System is entering S4 sleep state
0x05System is entering S5 sleep state
0x10System is waking up from the S1 sleep state
0x20System is waking up from the S2 sleep state
0x30System is waking up from the S3 sleep state
0x40System is waking up from the S4 sleep state
0xAC
0xAA
System has transitioned into ACPI mode. Interrupt
controller is in PIC mode.
System has transitioned into ACPI mode. Interrupt
controller is in APIC mode.
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Appendix
Appendix
Appendix
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Appendix
Appendix A: I/O Port Address Map
Each peripheral device in the system is assigned a set of I/O port addresses
which also becomes the identity of the device.
The following table lists the I/O port addresses used.
0xFED00000-0xFED003FF High Precision Event Timer, HPET
0xF7C25000-0xF7C250FFSM Bus Controller
0xFED40000-0xFED44FFF System board
0xFED1C000-0xFED1FFFF Motherboard resources
0xFED10000-0xFED17FFF Motherboard resources
0xFED18000-0xFED18FFF Motherboard resources
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0xFED19000-0xFED19FFF Motherboard resources
0xF8000000-0xFBFFFFFFMotherboard resources
0xFED20000-0xFED3FFFF Motherboard resources
0xFED90000-0xFED93FFF Motherboard resources
0xFED45000-0xFED8FFFF Motherboard resources
0xFEE00000-0xFEEFFFFF Motherboard resources
0x20000000-0x201FFFFFSystem board
0x40000000-0x401FFFFFSystem board
Appendix
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Appendix
Appendix D: Digital I/O Setting
Below are the source codes written in C, please take them for Digital I/O
application examples. The default I/O address is 6Eh.
C language Code
/* */
/* SMBus Device Register Reader program by Rex Chin. */
/* */
/*----- Include Header Area -----*/
#include “math.h”
#include “stdio.h”
#include “dos.h”
/*----- routing, sub-routing -----*/
void main(int argc, char *argv[])
{
int SMB_PORT_AD = 0x580;
int SMB_DEVICE_ADD = 0x6e; /*75111R’s Add=6eh */
int i,j;
printf(“ Fintek F75111 DIO LED TEST Program Ver:0.1 \n”);
printf(“ Warning: This tools is test only. \n”);
/* Index 10, GPIO1x Output pin control */
SMB_Byte_WRITE(SMB_PORT_AD,SMB_DEVICE_ADD,0x10,0xff);
delay(10);
printf(“All Digital I/O LED ON ... \n”);
/* Index 11, GPIO1x Output Data value */
SMB_Byte_WRITE(SMB_PORT_AD,SMB_DEVICE_ADD,0x11,0x00);
delay(3000);
printf(“All Digital I/O LED OFF ... \n”);
/* Index 11, GPIO1x Output Data value */
SMB_Byte_WRITE(SMB_PORT_AD,SMB_DEVICE_ADD,0x11,0xff);
delay(3000);
printf(“Digital I/O pin 7,5,3,1 LED OFF ...\n”);
/* Index 11, GPIO1x Output Data value */
SMB_Byte_WRITE(SMB_PORT_AD,SMB_DEVICE_ADD,0x11,0xAA);
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Appendix
delay(3000);
printf(“Digital I/O pin 6,4,2,0 LED OFF ...\n”);
/* Index 11, GPIO1x Output Data value */
SMB_Byte_WRITE(SMB_PORT_AD,SMB_DEVICE_ADD,0x11,0x55);
delay(1500);