ASUS s62f Service Manual

service overview

T

Chapter

Service Overview

Carefully read through this chapter for a look at various components of
the notebook and necessary cautions and tools before performing any
service and repairs.

o provide the best service and support for the ASUS S62F Series, we have provided the
below information for technicians from distributors and resellers to perform the
complete notebook disassembly and assembly. But before performing the procedures,
please be sure to read through the overview in this chapter for component overview,

cautions and tools to avoid any unwarranted damages to the notebook’s hardware.

The following chapter includes:

• S62F Overview

• Components

• Precautions

• Appropriate Tools

1-1

service overview

y

S62F Series Overview and Components

The ASUS S62F Series Notebook is a product combining the power of Intel®
Pentium-M CPU. In this section, an overview for the S62F, along with its components,
will be presented.

OVERVIEW

Mic input

S62F Overview

The illustrations below show the notebook’s overview from front view, right side view,
left side view, and rear side view. Most of the parts will be discussed in this manual.

Keyboard

Instant Ke

TouchPad

Power switch

LCD panel

LCD bezel

Headphone

output

3 in 1 card reader

LED Indicators

1-2

service overview

)

p

USB (2.0

orts

Modem port

PCMCIA slot

1394 port

VGA Port

LAN port

Kensington Lock

Air vents

Optical Drive Device

DC Power Input Jack

Battery Module

1 - 3

service overview

COMPONENTS

LCD

INVERTER

BOARD

Components

The illustrations below show the components of theS62F Series.

LCD Panel*

The illustration below shows the LCD display panel. The S62F Series notebook comes with

15.0” TFT LCD Panel.

Inverter Board

The illustration below shows the inverter board, which is hidden underneath the lower edge
of the LCD front bezel.

1 - 4

LCD

BRACKETS

HINGE COVER

service overview

LCD bracket

The illustration below shows the LCD brackets.

Hinge Cover

The illustration below shows the Hinge Cover.

LCD CASE

LCD Case

The illustration below shows the LCD case. Here is the LCD bezel.

1 - 5

service overview

KEYBOARD

TOP CASE

Keyboard

The illustration below shows the keyboard plate. It can be exchanged with keyboard plates
with different language layouts, such as U.S., German, Russian, British, Italian and others.

Top Case Module

The illustration below shows the top case of the notebook.

BATTERY

Battery Pack

The illustration below shows the battery pack of the notebook. It’s located at bottom of the
notebook.

1 - 6

service overview

OPTICAL

DRIVE

DEVICE

HDD

Optical Drive Device

The illustration below shows the Optical Drive Device

Hard Disk Drive

The illustration below shows the 2.5” industry-standard HDD with 9.5mm height.

HDD BRACKET

CPU

HDD Bracket

The illustration below shows the HDD Bracket that is placed over the HDD.

CPU

The illustration below shows the Intel Pentium-M CPU view.

1 - 7

service overview

CPU

THERMAL

MODULE

MEMORY

CPU Thermal Module

The illustration below shows the thermal module for the CPU. It’s located on the top of
CPU.

Memory Module

The illustration below shows the industry-standard 200pin SO-DIMM DDR SDRAM
module for the notebook.

MOTHERBOARD

Motherboard

The illustration below shows the motherboard of the notebook.

1 - 8

MODEM

MODULE

WALN

MODULE

service overview

Modem Module

The illustration below shows the modem module of the notebook.

WALN Module

The illustration below shows the WALN module of the notebook.

TOP CASE

Top Case

The illustration below shows the TOP case of the notebook.

1 - 9

service overview

Service Overview

Please pay special attention to the cautions below to prevent any damages to the notebook
and also please be sure to select the appropriate tools described in this section to perform any
services desired.

CAUTIONS

Precautions

Before you perform any service and/or repair on the notebook, please follow the steps below
first.

1. Be sure that the notebook is powered down.

2. Disconnect the AC plug from the notebook

3. Turn the notebook over. Unlock and hold the latches, and remove the battery .

3. Remove all rings, watches and any other metal objects from your hands.

4. Always wear a ground strap on your hand to protect the notebook from static discharge.

1 - 10

service overview

TOOLS

CROSS

SCREW-

DRIVER

FLATHEAD

SCREW-

DRIVER

TWEEZERS

Appropriate T ools

The illustrations below show the appropriate tools that should be used for the notebook’s
service and repair.

Phillips-head Screwdriver

Use a Phillips-head screwdriver to fasten/remove the K- or B-typed screws.

Single-Slotted Screwdriver

Use a single-slotted screwdriver to lock/unlock the flexible cable connector locks

Tweezers

Use a pair of tweezers to remove/insert flexible cables.

INSERTION

AND

EXTRACTION

TOOL FOR

FPC

CONNECTOR

VACUUM

HANDLING

TOOL

SPACER
SCREW-

DRIVER

Insertion and extraction tool for FPC connector

Use insertion and extraction tool for FPC connector to handle locking and unlocking of FPC
connectors.

Vacuum Handling Tool

Use Vacuum handling tool to handle CPU.

Spacer Screwdriver

Use a spacer screwdriver to fasten/remove spacer screws or hex screws.

1 - 11

Disassembly procedure

A

Chapter

Disassembly Procedure

Please follow the information provided in this section to perform the complete
disassembly procedure of the notebook. Be sure to use proper tools
described before.

SUS S62F Series Notebook consists of various modules. This chapter describes the
procedures for the complete notebook disassembly. In addition, in between procedures,
the detailed disassembly procedure of individual modules will be provided for your
service needs.

The disassembly procedure consists of the following steps:

• Battery Module

• HDD Module

• Wireless Module

• Memory Module

• CPU Module

• ODD Module

• Keyboard

• Top Case Module

• Motherboard

• Bottom case Module

• LCD Module

Disassembly procedure

BATTERY

BATTERY

MODULE

REMOVAL

Battery Module

The illustration below shows how to remove the battery module.

1. Unlock and hold the latch No (1).

1

2. Slide the battery lock (No.2) and pull the battery pack out.

2

3. Pull the battery pack out.

Disassembly procedure

HDD

MODULE

HDD Module

The illustrations below show how to remove the HDD module from the notebook.

HDD

MODULE

REMOVAL

Removing HDD Module

1. Remove 3 screws (M2.5*4L (K)), then remove the HDD door.

M2.5*4L

2. Lift the HDD module and then remove it.

3. Remove 4 screws [M3 * 4(L)] to separate HDD from HDD housing.

M3*4L

Disassembly procedure

WIRELESS

LAN

Wireless LAN Module

The illustration below shows how to remove the Wireless LAN module.

1. Remove 1 piece of tape and disconnect the MAIN & AUX antenna.

2. And open the two latches to pop the MINI PCI MODULE up then pull it out.

MEMORY

MODULE

Memory Module

The S62F Series Notebook does not have RAM onboard. There is one SO-DIMM
sockets for installing SO-DIMM RAM. It can upgrade the total memory size up to 1GB .

MEMORY

REMOVAL

Removing Memory module

1. Remove 2 screws (M2.5*4L (K)), then remove the DIMM door.

M2.5*4L

Disassembly procedure

2. Open the 2 latches aside (No. 1, 2), which will pop the memory module up to an
angle of 30°, then pull out the memory module in that angle (No. 3).

1

CPU MODULE

CPU

REMOVAL

3

2

o

30

CPU Module

The illustrations below show how to remove the CPU module from the notebook.

Removing CPU Module

1. Remove 2 screws (M2.5*4L (K)), then remove the CPU door.

M2.5*4L

2. Remove 4 screws (M2*3L (K)) by order.

3

M2*3L

1

2

4

Disassembly procedure

3. Disconnect the Fan cable and remove 2 screws (M2.5*4L (K)) then take away the

CPU thermal module.

M2.5*4L

4. Turn the non-removable screw here 180 degrees counter-clockwise to loosen the

CPU.

L

O

Unlock

5. Squeeze the vacuum handling pump and use it to lift the CPU away.

Disassembly procedure

OPTICAL

DRIVE

DEVICE

ODD

ODD Module

The illustration below shows how to remove the ODD module.

1. Remove 1 screw (M2.5*4L (K)).

REMOVAL

M2.5*4L

2. Push the ODD Module out by a pair of tweezers.

Disassembly procedure

3

KEYBOARD

K/B REMOVAL

Keyboard

The illustration of below shows how to remove the keyboard.

Removing Keyboard

1. Push the 4 latches in (No.1, No.2, No.3, No.4) with a pair of tweezers or a

single-slotted screwdriver and lift the keyboard plate up.

2 1 4

2. Lay the keyboard down over the Top case. *Do not remove the keyboard yet.

The keyboard cable is still attached.

3. Disconnect the FPC connector by a pair of tweezers.

Disassembly procedure

CABLE

REMOVAL

Removing Keyboard Cable

1. Use a flexible connector tool to unlock the cable connector on both ends (no. 1).

2. Carefully pull out the keyboard cable (no. 2) with a pair of tweezers.

3. Lock the connector (no. 3) again to avoid possible breakage.

2. Cable out

1. Unlock

3.

1. Unlock

3.

4. Remove keyboard from the top case.

TOP CASE

MODULE

T op Case Module

The illustrations below show how to disassemble and remove the top case module of the notebook.
The module contains the top case itself.

HINGE COVER

REMOVAL

Removing top Case Module

1. Remove the MIDDLE cover.

Disassembly procedure

2. Use a pair of tweezers to remove both hinge Cover.

3. Disconnect the LANCH cable and touchpad FFC on the top case.

LANCH cable

Touchpad FFC

4. Turn over the NB and remove 1 screws (M2*3L (K)).

I

M2*3L

Disassembly procedure

5. Disconnect the Coaxial & inverter cable.

Coaxial cable

Inverter cable

6. Arrange the Coaxial & inverter cable and antenna on the bottom case.

BOTTOM

CASE

REMOVAL

7. Remove 15 screws (M2.5*6L (K)) and 1 screw (M2.5*4L) (K)) on the bottom case.

M2.5*4L

M2.5*6L

Disassembly procedure

8. Before separate the bottom case, remove a little bit bottom case and let the cable

and antennas through out of hole.

Inverter & camera cable

Antenna

9. Separate the bottom case from the top case.

10. Remove 2 screws (M2.5*6L (K)) on both hinge.

M2.5*6L

TOP

CASE

REMOVAL

Disassembly procedure

11. Separate the LCD module from the Top Case module

12. Remove 2 screws (M2.5*4L (K)) and take away the LANCH board.

13. Remove the LANCH board cable.

M2.5*4L

Disassembly procedure

14. Disconnect the touch pad FFC and remove 1 piece of tape then take away the

touch pad FFC.

15. Remove 5 screws (M2.5*4L (K)) and take away the touchpad bracket.

M2.5*4L

16. Take away the touchpad.

Disassembly procedure

MOTHERBOARD

MOTHERBOARD

REMOVAL

Motherboard

The illustrations below show how to disassemble and remove the Motherboard.

Removing Motherboard

1. Remove 2 screws (M2.5*4L (K)).

2. Remove 2 screws for CRT on the right side by a spacer screwdriver.

3. Separate the Motherboard from the bottom case. *Do not remove the

Motherboard yet. The Bluetooth & Speaker cables are still attached.

Disassembly procedure

4. Disconnect the Bluetooth & Speaker cables then take away the Motherboard.

Bluetooth cable

Speaker cable

5. Remove 1 screw (M2*3L (K)) on the IO bracket.

M2*3L

6. Use a single-slotted screwdriver to remove 2 screws HEX 5mm then take away the

IO bracket.

Disassembly procedure

7. Remove 1 screw (M2*3L (K)) and take away the TPM board .

M2*3L

8. Remove 4 pieces of tapes and disconnect the modem cable.

9. Remove 2 screws (M2*3L (K)) and take away the modem board.

M2*3L

Disassembly procedure

BOTTOM

CASE

MODULE

BOTTOM

CASE

DISASSEMBLY

Bottom Case Module

The illustrations below show how to remove and disassemble the Bottom case module.
The module contains Bluetooth board, speaker cable.

Disassembling Bottom case Module

1. Disconnect the Bluetooth cable and remove it.

2. Take away the Bluetooth board from the bottom case.

3. Take away the speaker module from the bottom case.

Disassembly procedure

LCD MODULE

LCD MODULE

DISASSEMBLY

LCD Module

The illustrations below show how to remove and disassemble the LCD module. The
module contains LCD panel, Inverter board, LCD bezel, LCD back cover.

Disassembling LCD Module

4. Remove 7 rubber pads and 7 screws (M2.5 x 6L) from LCD module.

M2.5*6L

5. Prying the inside edges of the LCD bezel, and then separates it from LCD back

cover.

Disassembly procedure

6. Disconnect the LCD cable.

7. Remove 2 screws (M2.5*4L (K)) & 4 screws (M2.5*6L (K)) and take away the

LCD panel.

M2.5*4L

M2.5*6L

5. Remove 4 screws(M2*3L(K)) on the right LCD bracket to disassemble the LCD

bracket.

M2*3L

Disassembly procedure

6. Remove 4 screws(M2*3L(K)) on the left LCD bracket to disassemble the other

LCD bracket.

M2*3L

7. Remove 2 pieces of tapes and disconnect the coaxial cable then take it away.

8. Remove 1 screw (M2x 4L).

.

M2*4L

Disassembly procedure

9. Lift a little bit the inverter board and disconnect the inverter cable and then take

it away.

6. Remove 2 screws (M2x 6L) on both hinge and take them away.

M2.5*6L

M2.5*6L

Disassembly procedure

7. Disconnect the camera cable and remove the microphone.

8. Remove the cable and remove mylar then take away the cable.

9. Take away the Camera module from the LCD back cover.

10. Remove 1 screw (M2x 4L) and remove 3 pieces of tapes then take away the

wireless black wire.

Disassembly procedure

11. Remove 1 screw (M2x 4L) and remove 3 pieces of tapes then take away the

wireless white wire.

Assembly procedure

A

Chapter

Assembly Procedure

Please follow the information provided in this section to perform the complete
assembly procedure of the notebook. Be sure to use proper tools described
before.

fter you have completed the previous chapter of complete disassembly, please follow this
chapter to assemble the notebook back together. This chapter describes the procedures
of the complete notebook assembly. In addition, in between procedures, the detailed
assembly procedure of individual modules will be provided for your service needs.

The assembly procedure consists of the following steps:

• LCD Module

• Bottom case Module

• Motherboard

• Top Case Module

• Keyboard

• ODD Module

• CPU Module

• Memory Module

• Wireless Module

• HDD Module

• Battery Module

3 - 1

Assembly procedure

LCD MODULE

LCD MODULE

ASSEMBLY

LCD Module

The illustrations below show how to assemble and install the LCD module of the
notebook.

1. Install the wireless white wire module and secure 1 screw (M2x 4L) then paste 3
pieces of tapes to secure it.

2. Install the wireless black wire module and secure 1 screw (M2x 4L) then paste 3
pieces of tapes to secure it.

3. Install the Camera module on the LCD back cover.

3 - 2

Assembly procedure

4. Install the microphone on the LCD cover and connect the camera cable.

5. Lay the inverter cable through the locking trench on the LCD back cover.

6. Lay the inverter cable through the locking trench on the LCD back cover.

3 - 3

Assembly procedure

7. Install the both hinge on LCD back cover and secure 2 screws (M2x 6L) to
secure them.

M2.5*6L

M2.5*6L

8. Install the inverter board on LCD back cover and connect the inverter cable.

9. Secure 1 screw (M2x 4L) to secure it.

.

M2*4L

3 - 4

Assembly procedure

Assembly LCD Module

1. Connect the coaxial cable and paste 2 pieces of tapes to secure it.

2. Install the left LCD bracket and secure 4 screws (M2*3L (K)) to fix it.

M2*3L

3. Install the right LCD bracket and 4 screws(M2*3L(K)) and secure 4 screws

(M2*3L (K)) to fix it.

M2*3L

3 - 5

Assembly procedure

4. Install the LCD panel and secure 2 screws (M2.5*4L (K)) & 4 screws (M2.5*6L

(K)) to secure it.

M2.5*4L

M2.5*6L

5. Connect the LCD cable.

6. Combine the LCD bezel and LCD Cover properly and press on all four edges until

them snap into position.

3 - 6

Assembly procedure

7. Secure74 screws (M2.5 x 6L) on LCD front bezel then paste 7 rubber pads above.

M2.5*6L

BOTTOM

CASE

MODULE

BOTTOM

CASE ASSEMBLY

Bottom Case Module

The illustrations below show how to assembly the Bottom case module. The module
contains Bluetooth board, speaker cable.

Assembling Bottom case Module

1. Install the speaker module on the bottom case.

3 - 7

Assembly procedure

2. Install the Bluetooth board on the bottom case.

3. Connect the Bluetooth cable and lay it through the locking trench on bottom case.

MOTHERBOARD

MOTHERBOARD

ASSEMBLY

Motherboard

The illustrations below show how to assemble and install the motherboard of the
notebook.

1. Install the modem board and secure 2 screws (M2.5*3L (K)).

M2*3L

3 - 8

Assembly procedure

2. Connect the modem cable and paste 4 pieces of tape to fix the cable.

3. Install the TPM board and secure 1 screw (M2*3L (K)) to secure it.

M2*3L

4. Install the IO bracket and use a single-slotted screwdriver to secure 2 screws HEX
5mm.

3 - 9

Assembly procedure

5. Secure 1 screw (M2*3L (K)) on the IO bracket to secure it.

M2*3L

6. Connect the Bluetooth & Speaker cables, before install the Motherboard to the
bottom case.

Bluetooth cable

Speaker cable

7. Combine the Motherboard and the bottom case.

8. Remove 2 screws for CRT on the right side by a spacer screwdriver.

TOP CASE

MODULE

CASE

ASSEMBLY

TOP

Assembly procedure

9. Secure 2 screws (M2.5*4L (K)) to secure the motherboard.

T op Case Module

The illustrations below show how to assemble and install the top case module of the
notebook.

1. Install the touchpad on the top case.

2. Install the touchpad bracket and secure 5 screws (M2.5*4L (K)) to secure it.

M2.5*4L

Assembly procedure

3. Connect the touch pad FFC and paste 1 piece of tape.

4. Connect the LANCH board cable.

5. Install the LANCH board and secure 2 screws (M2.5*4L (K)).

M2.5*4L

TOP CASE

MODULE

ASSEMBLY

Assembly procedure

1. Combine the Top case module and LCD module.

2. Secure 2 screws (M2.5*6L (K)) to fix the hinge.

BOTTOM CASE

ASSEMBLY

M2.5*6L

1. Combine the bottom case from the top case.

Assembly procedure

2. Before secure the bottom case, let the cable and antennas through in the hole.

Inverter & camera cable

Antenna

3. Secure 15 screws (M2.5*6L (K)) and 1 screw (M2.5*4L) (K)) to secure the bottom
case.

M2.5*4L

M2.5*6L

4. Lay the antennas through the locking trench on bottom case

Assembly procedure

5. Connect the Coaxial & inverter cable and lay the cables through the locking trench
on bottom case.

Coaxial cable

Inverter cable

6. Secure 1 screws (M2*3L (K)) to secure cables.

M2*3L

I

7. Turn over the NB and connect the LANCH cable and touchpad FFC on top case.

LANCH cable

Touchpad FFC

Assembly procedure

HINGE COVER

ASSEMABLY

8. Install the both hinge Cover.

9. Install the MIDDLE cover.

Assembly procedure

3

KEYBOARD

KEYBOARD
ASSEMBLY

Assembling Keyboard

The illustrations below show how to assemble and install the Keyboard of the notebook.

1. Place the Keyboard module on front side of the top case. Then connect Keyboard

FPC Cable with a pair of tweezers.

2. Install Keyboard properly and note the lower side should inset first. Push the 4

latches to fix the keyboard.

2 1 4

Assembly procedure

ODD MODULE

ODD MODULE

INSTALLATION

ODD Module

The illustrations below show how to assemble and install the ODD Module of the
notebook.

1. Insert the ODD module.

2. Secure 1 screw (M2.5*4L (K)) to secure it.

CPU MODULE

CPU

INSTALLATION

M2.5*4L

CPU Module Assembly

The illustration below shows how to install CPU and the CPU heat sink of the notebook.

1. Squeeze the vacuum handling pump and use it to install the CPU.

Assembly procedure

k

2. Turn the non-removable screw here 180 degrees clockwise to lock the CPU.

L

O

Loc

3. Install the CPU thernal module gently and connect the fan cable then secure 2

screws (M2.5*4L (K)) to secure it.

M2.5*4L

4. Secure 4 screws (M2*3L (K)) by order.

3

M2*3L

1

2

4

5. Install the CPU door and secure 2 screws (M2.5*4L (K)) to secure it.

M2.5*4L

MEMORY
MODULE

MEMORY

INSTALLATION

Assembly procedure

Assembling Memory Module

The illustrations below show how to assemble and install the memory module to the
notebook.

1. Insert the Memory module into the memory socket by an angle of 30 degree, and

push down to latch the memory module.

o

30

2. Install the DIMM door and secure 2 screws (M2.5*4L (K)) to secure it.

WIRELESS

LAN

M2.5*4L

Wireless LAN Module

The illustration below shows how to assemble the Wireless LAN module.

1. Install the MINI PCI module into the socket by an angle of 30 degree, and push

down to latch the MINI PCI module.

Assembly procedure

2. Connect the MAIN & AUX antenna and paste 1 piece of tape to secure antennas.

HDD

MODULE

HDD

INSTALLATION

HDD Module

The illustrations below show how to assemble and install the HDD module of the
notebook

1. Secure 4 screws [M3 * 4(L)] to fix HDD into HDD housing.

M3*4L

2. Insert the HDD module to connect the FPC connector until it’s installed

properly.

Assembly procedure

3. Install the bottom case and secure 3 screws (M2.5*4L(K)) to fix it.

M2.5*4L

BATTERY

MODULE

BATTERY

INSTALLATION

Battery Module

The illustrations below show how to install battery module of the notebook.

1. Install the battery module. Slide the battery latch to close the battery lock.

Upgrade & Replacement

Chapter

Upgrade & Replacement

Follow the individual procedures in this chapter to perform the
notebook’s upgrade and replacement of various major components.

sus S62F Series Notebook is a 2 spindles product, which means there are less
options for you to upgrade to. The key upgradeable and replaceable items include

A

In order to avoid redundancy, please refer to chapters 2 and 3 of this manual for repeated
and reused disassembly and assembly procedures, such as keyboard & heat sink replacement,
which is used by several different procedures in this chapter.

instructions described in Chapter 1 to safeguard the notebook against any potential
damages.

chapter, please refer to Chapters 2 and 3 for detailed disassembly and assembly and perform
necessary procedures accordingly.

This chapter includes the following items:

• CPU Upgrade

• Memory Upgrade

• HDD Upgrade

• ODD Replacement

the CPU module, memory module, HDD module, and ODD module.

Be sure to follow the safety

For any other components which you need to replace not covered in this

4 – 1

Upgrade & Replacement

CPU

CPU Upgrade

TheS62F Series Notebook comes standard with a Intel® Micro-FCPGA Socket
on the motherboard, which means it can support all Intel Micro-FCPGA CPUs
up to 2.13 GHz.

Upgrading CPU

Remove battery module

1. Unlock and hold the latch No (1).

1

2. Slide the battery lock (No.2) and pull the battery pack out.

2

3. Pull the battery pack out.

4 - 2

CPU

REMOVAL

Upgrade & Replacement

Removing CPU Module

1. Remove 2 screws (M2.5*4L (K)), then remove the CPU door.

M2.5*4L

2. Remove 4 screws (M2*3L (K)) by order.

3

M2*3L

1

2

4

3. Disconnect the Fan cable and remove 2 screws (M2.5*4L (K)) then take
away the CPU thermal module.

M2.5*4L

4 - 3

Upgrade & Replacement

k

4. Turn the non-removable screw here 180 degrees counter-clockwise to
loosen the CPU.

L

O

Unlock

5. Squeeze the vacuum handling pump and use it to lift the CPU away.

CPU

INSTALLATION

INSTALLATION

CPU

Installing CPU

The illustration below shows how to install CPU and the heat sink of the
notebook.

1. Squeeze the vacuum handling pump and use it to install the CPU.

2. Turn the non-removable screw here 180 degrees clockwise to lock the

CPU.

L

O

Loc

4 - 4

Upgrade & Replacement

3. Install the CPU thermal module gently and connect the fan cable then

secure 2 screws (M2.5*4L (K)) to secure it.

M2.5*4L

4. Secure 4 screws (M2*3L (K)) by order.

BATTERY

INSTALLATION

3

2

M2*3L

1

4

5. Install the CPU door and secure 2 screws (M2.5*4L (K)) to secure it.

M2.5*4L

Install battery module

1. Install the battery module. Slide the battery latch to close the battery lock.

4 - 5

Upgrade & Replacement

MEMORY

Second Memory Upgrade

The S62F Series Notebook does not have RAM onboard. There are two SO­DIMM sockets for installing SO-DIMM RAM. It can upgrade the total memory
size up to 1GB with a 512MB module on each socket.

Upgrading Memory Module

Remove battery module

1. Unlock and hold the latch No (1).

1

2. Slide the battery lock (No.2) and pull the battery pack out.

2

3. Pull the battery pack out.

4 - 6

MEMORY

REMOVAL

Upgrade & Replacement

Removing Memory module

1. Remove 2 screws (M2.5*4L (K)), then remove the DIMM door.

M2.5*4L

2. Open the 2 latches aside (No. 1, 2), which will pop the memory module up to

an angle of 30°, then pull out the memory module in that angle (No. 3).

1

MEMORY

INSTALLATION

MEMORY

INSTALLATION

3

30

o

2

Installing Memory Module

1. Insert the Memory module into the memory socket by an angle of 30 degree,

and push down to latch the memory module.

o

30

4 - 7

BATTERY

INSTALLATION

Upgrade & Replacement

2. Install the DIMM door and secure 2 screws (M2.5*4L (K)) to secure it.

M2.5*4L

Install battery module

3. Install the battery module. Slide the battery latch to close the battery lock.

4 - 8

Upgrade & Replacement

HDD

HDD Upgrade

The S62F Series Notebook uses an industry-standard 2½” HDD with IDE
interface. You can replace the HDD to any capacity of your choice within our
approval and prior test.

Upgrading HDD

Remove battery module

1. Unlock and hold the latch No (1).

1

2. Slide the battery lock (No.2) and pull the battery pack out.

2

3. Pull the battery pack out.

4 - 9

HDD

MODULE

REMOVAL

Upgrade & Replacement

Removing HDD Module

1. Remove 3 screws (M2.5*4L (K)), then remove the HDD door.

M2.5*4L

2. Lift the HDD module and then remove it.

3. Remove 4 screws [M3 * 4(L)] to separate HDD from HDD housing.

M3*4L

4 - 10

HDD

INSTALLATION

Upgrade & Replacement

Installing new HDD module

4. Secure 4 screws [M3 * 4(L)] to fix HDD into HDD housing.

M3*4L

5. Insert the HDD module to connect the FPC connector until it’s installed
properly.

6. Install the bottom case and secure 3 screws (M2.5*4L(K)) to fix it.

M2.5*4L

BATTERY

INSTALLATION

Install battery module

7. Install the battery module. Slide the battery latch to close the battery lock.

4 - 11

Upgrade & Replacement

WIRELESS

LAN

WALN

REMOVAL

Wireless LAN Module

The illustration below shows how to remove the Wireless LAN module.

Replacing WLAN

Remove battery module

1. Unlock and hold the latch No (1).

1

2. Slide the battery lock (No.2) and pull the battery pack out.

2

3. Pull the battery pack out.

4 - 12

ODD

REMOVAL

Upgrade & Replacement

Removing WALN Module

1. Remove 1 piece of tape and disconnect the MAIN & AUX antenna.

2. And open the two latches to pop the MINI PCI MODULE up then pull it out.

WALN MODULE

INSTALLATION

Installing new WALN module

3. Install the MINI PCI module into the socket by an angle of 30 degree, and
push down to latch the MINI PCI module.

4 - 13

BATTERY

INSTALLATION

Upgrade & Replacement

4. Connect the MAIN & AUX antenna and paste 1 piece of tape to secure
antennas.

Install battery module

1. Install the battery module. Slide the battery latch to close the battery lock.

4 - 14

Upgrade & Replacement

ODD

ODD

REMOVAL

ODD Replacement

The S62F Series Notebook can support DVD-ROM (8x DVD), COMBO (CD-R
24x/ CD-RW 24x / DVD-ROM 8x/ CD 24x), and DVD-Dual (DVD-R/RW: 4x/2x,
DVD+R/RW: 4x/2.4x, CD-R/RW: 24x/ 10x, DVD: 8x, CD: 24x).

Replacing ODD

Remove battery module

1. Unlock and hold the latch No (1).

1

2. Slide the battery lock (No.2) and pull the battery pack out.

2

3. Pull the battery pack out.

4 - 15

ODD

REMOVAL

Upgrade & Replacement

Removing ODD Module

1. Remove 1 screw (M2.5*4L (K)).

M2.5*4L

2. Push the ODD Module out by a pair of tweezers.

ODD MODULE

INSTALLATION

Installing new ODD module

3. Insert the ODD module.

4 - 16

BATTERY

INSTALLATION

Upgrade & Replacement

4. Secure 1 screw (M2.5*4L (K)) to secure it.

M2.5*4L

Install battery module

5. Install the battery module. Slide the battery latch to close the battery lock.

4 - 17

HARDWARE SPECIFICATION

Chapter

Hardware Specifications

You can enjoy and utilize the S62 series Notebook more
effectively with a better comprehension of detailed hardware
specifications of the notebook.

his chapter lists the detailed specifications of the notebook’s main system and modules.
Please refer to this section when you need to find out specific technical data about the
notebook.

This chapter contains the following information:

• System Specifications

• Chipset Specifications

• Key Parts List

• System Resource

• Module Specification

5- 1

HARDWARE SPECIFICATION

1 MARKETING SPEC

S62F Specification

Product Family S62F
Dimension 328 x 288x 27-38mm
Weight 2.4
Color Silver-Gray
CPU Type Intel Yonah 1M/2M

Speed 1.66G,1.83G,2.0G,2.16G

Package Micro-PGA 479M

L2 Cache Yes
Size 2M On-die cache memory
Memory Type DDR II SDRAM without ECC
Base Memory None

(Two-Spindle Design)

Socketable

Expansion Memory 256/512MB/1GB SO-DIMM 1.25" x 2 Slot
MAX 2GB
LCD Size 14.1”
Resolution WXGA,WXGA+
Panel Type TFT
Interface LVDS
Contrast Control None
Brightness Control Hot-key(16 steps)
HDD type 2.5", 9.5mm
Ultra DMA 100 Yes
Size 60/80/100 GB
CD Driver

CD-ROM N/A
DVD N/A
COMBO 8X/24X/24X/24X COMBO
DVD-RW Super-Multi

Chip Set

5- 2

HARDWARE SPECIFICATION

North Bridge INTEL 945GM
South Bridge INTEL ICH7M
Super IO SMSC LPC47N217
Thermal Sensor ADT7461ARMZ
Micro-Processor ITE8510E
KBC ITE8510E
Flash ROM (ISA) SST 4Mb
Graphic Accelerator Intel 950 internal GPU
3D Yes
Controller Intel Internal graphic
AGP Support No
Dual view/Dual App Yes
Graphic Memory Share Memory
TV Out Support Yes
PCMCIA
Slot Type Type II x 1
Controller RICOH R5C841
Card Bus Yes
ZV port No
Sound System
Controller AD1986A AC97 CODEC
SW wave table Yes
FM synthesizer Yes
Speaker Stereo
I/F Azalia I/F
PC99 Yes
S/PDF Yes
6 channel output Yes
Audio Amplifier TPA0212
Microphone Mono
Modem CONEXANT RD02-D110
Controller CONEXANT

5- 3

HARDWARE SPECIFICATION

Spec 56K
I/F Azalia MDC
Jack RJ-11 RJ-11 port
ACPI Yes
V.90 Yes
Voice Phone No

Digital Line Protection

Wake On Ring Yes
BT No

Yes

Controller CSR
I/F USB
ANT Chip antenna
LAN
Jack RJ-45 RJ-45 port
Wake On LAN YES
Controller RealTEK RTL8110SB
Internal Keyboard
Vendor
Key 88 Keys (W/ MS-Windows function

keys)
Stroke/Pitch -
Function Key 12 Fun ction Keys
Hot Key Function 10 Hot Keys
Suspend (STR or STD) Fn + F1

BT-183

RF enable Fn + F2 802.11b+g
Display stretch No Not Implement
Brightness Up Fn + F6
Brightness Down Fn + F5
Back light on/off Fn + F7
LCD/CRT Fn + F8
PC Speaker Volume Fn + F10 On/Mute
PC Speaker Volume Fn + F12 Volume increase

5- 4

HARDWARE SPECIFICATION

PC Speaker Volume Fn + F11 Volume decrease
Number Lock Fn + Ins
Scroll Lock Fn + Del
Instant Keys

Power Saving Power 4 Gear
E-mail Direct button
Internet Browser Direct button

Disable TouchPad Direct button
Status Indication 8 LEDs (Machine Base x 8)
Power Status Yes (Green on LED when Power on.

Blinking when in SUSPEND mode.

OFF when power off.)

Battery Charge Status Yes (Orange when charging. Blinking

when battery low. OFF when fully

charged/empty.)
HDD/CD-ROM LED Yes (Green while accessing)
Number Lock LED Yes (Green)
Caps Lock LED Yes (Green)

Scroll Lock LED Yes (Green)
E-mail notification Yes (Orange)
W-LAN/BT LED Yes (Blue)

Pointing Device Glide Pad Synaptics

Glide Pad Yes
Right Button Yes
Left Button Yes
Scroll up button No

Scroll down button No
Function Control
Power On Button Yes
LCD Brightness Yes Hot Keys
LCD Lid Switch Yes
Sound Volume Yes Hot Keys
Password Override Yes (Master Password)

5- 5

HARDWARE SPECIFICATION

Reset/Force Off Yes (Force Off switch)
I/O Port All ports support hot-plug
Parallel NO
CRT Yes 15-pin D-sub
Port Bar port III Yes
Mouse/Keyboard NO
IrDA Port NO
Fax/Modem Yes RJ11
LAN Jack Yes RJ45
Line In NO
Mic In Jack Yes Mono
Head Phone Jack Yes Stereo out
USB port Yes 4 Ports
DC-In Yes 2-pin type/65W
Heat Solution
Heat Pipe Yes
Heat Sink Yes

FAN Support Yes
AC Adaptor Delta/Liteon
Input AC 100-240Volt, 50~60Hz
Output DC 19V, 3.42A, 65W
1st Battery 9 Cells/6 Cells 11.2Vx4800mAh/2400mA

h

Type Li-ION(2400mAH)
1st Battery Celxpert
2nd Battery No
Type
2nd Battery
Charging time Li-ION (2400mAH)
Machine ON TBD.
Machine OFF TBD.
Battery Life TBD.
PM Off TBD.

5- 6

HARDWARE SPECIFICATION

PM On TBD.
Power Management AMI BIOS
LCD Close/Open Yes
LCD Back-light Yes
Suspend/Resume Yes
Hibernation (S2D) Yes
Thermal Control Yes DTS/Thermal diode
ACPI Yes
DMI 2.0 Yes Support DMI BIOS 2.1
Security
Password Yes Password overridden by

Master password
Security Lock Kensington Lock Hole
TPM Infineon TPM 1.2 Option
S/W
Install OS WinXP
Option Win2000
Flash BIOS Yes
Drivers
Chipset Driver Yes
VGA Driver Yes
AUDIO Driver Yes
LAN Driver Yes
Glide Pad Driver Yes
Modem Driver Yes
Blue tooth Driver Yes
WLAN Driver Yes
LOGO
Audio Driver Yes
USB Port Bar 3 Yes
Parallel Port Yes
VGA Port Yes
USB Port X 4 Yes

5- 7

HARDWARE SPECIFICATION

LAN Port Yes

5- 8

S62F Hardware Technical Specification Rev. 1.0 06/03/28

2 CHIPSET LIST

Chipset Summary Table

Function S62F HW ACPI/PC99
CPU Intel Yonah Not required
SRAM (L2 Cache) 2M Not required
North Bridge Intel 945GM YES
South Bridge Intel ICH7M YES
MEMORY DDR II SDRAM Not required
BIOS ROM SST 4Mb Not required
VGA Intel internal graphic YES
SUPER I/O SMSC LPC47N217 YES
PCMCIA RICOH R5C841 YES
AUDIO Azalia CODEC software Audio YES
AUDIO AMPLIFIER TPA0212 Not required
KB CONTROLLER ITE8510E YES
PIC (uP) ITE8510E YES
IrDA NO
CLOCK Generator ICS954310BGLFT YES
MODEM CONEXANT YES
Bluetooth BT-183
1394 RICOH R5C841 Yes
LAN RealTEK RTL8110SB YES

ASUSTeK Confidential Page

9

2.1 CPU

S62F Hardware Technical Specification Rev. 1.0 06/03/28

Processor Type:

Processor frequency:

Intel Yonah Processor

1.66 /1.83 /2.0/2.16 GHz

Construction method:
Supply voltage:

u-PGA479 with socket
Code:1.25V(High_Frequency_Mode)~0.725V(lowest_Freque

ncy_Mode)

Function feature:

On-die , primary 32-KB instruction cache and 32-KB write-

back data cache.

On-die , 2MB second level cache with Advanced Transfer

Cache Architecture.
Data Prefetch.
Streaming SIMD extensions 2(SSE2).
Enhanced Intel SpeedStep technology
533/667 MHZ FSB support

ASUSTeK Confidential Page

10

S62F Hardware Technical Specification Rev. 1.0 06/03/28

2.2 CHIPSET

2.2.1 North Bridge

Function:

Vendor:
Parts Number:
Package:

2.2.2 South Bridge

Function:

Full support 32bits AGTL+ host bus

addressing
Supports 400/533/667 DDR2 device
Integrates the graphic controller
Support Intel Rapid Memory power

management
DMI x2/x4 Interface connect to ICH

Intel
945GM
1466-ball micro-FCBGA

DMI x2/x4 interface link with GMCH
Integrated PC/AT compatible system (DMA

Controller, INT, Timer/Counters)

Integrated one channels IDE controller with

Ultra DMA/33/66/100 support

Integrated USB 1.1 and 2.0 Host Bus

controller with 8 USB ports

Vendor:

Parts Number:
Package:

Intel
ICH7M
652-ball BGA

2.3 DRAM MEMORY

2.3.1 ON-BOARD MEMORY

None

Integrated HD Audio Interface
Build-in RTC
LPC Interface

IRQ Controller

ASUSTeK Confidential Page

11

S62F Hardware Technical Specification Rev. 1.0 06/03/28

2.3.2 EXPANSION MEMORY

Number of sockets:
Bus:
Supply voltage:
Functional features:
Hardware features:

Parity support:

2.4 BIOS ROM

ROM Type:
Package:
Supply voltage:
Serviceability:

Two 200 pin SO-DIMM socket
64-bit data path

1.8V
Supports up to 16 simultaneous open pages

Supports DDR2 400/533/667 DDR devices
Maximum of 2GB of system memory

without ECC

SST Flash Memory
32-Lead PLCC

3.3V
End user upgradeable for the firmware

2.5 INTERNAL VGA CONTROLLER

Function features:

Vendor:
Chipset

3D Setup and Render Engine
Integrated 24 bit RAMDAC that can drive a standard

Single or dual channel LVDS panel support up to

TV out resolution up to 1024x768
Intel
945GM

progressive scan analog monitor up to 2048 X
1536 CRT resolution at a maximum refresh rate
of 75 Hz

112MHZ

ASUSTeK Confidential Page

12

S62F Hardware Technical Specification Rev. 1.0 06/03/28

2.6 I/O INTERFACE Controller

Function:

Full ACPI 1.0 and PC98/99

compliant

Support 10 IRQ channel

options

Integrated PC/AT Floppy Disk

Controller
Support 5.25”/3.5”/2.5” FDD
Support 3-mode FDD
Integrated Serial Port RS-

232C Controller
Integrated Infrared Controller
Support IrDA 1.0
Integrated Parallel Port

Controller
Support Standard, bi-

directional, ECP, EPP

mode

Vendor: SMSC
Parts Number: LPC47N217
Package: 64-pin STQFP

Support 2 general purpose

pins for game port control
Support voltage 5V

ASUSTeK Confidential Page

13

S62F Hardware Technical Specification Rev. 1.0 06/03/28

2.7 PCMCIA Controller

Function:

Vendor:

Parts Number:
Package:

PC99, ACPI 1.0 and PCI bus power

management 1.1 Design compliant
Integrated PC Card Controller
Support 1995 PC Card (PCMCIA 2.2)
Integrated Card Bus Controller
PC98/99/2001 compliant
Single Chip PCI-CardBus/1394 Bridge
Compliant with PCI Specification2.2
1394 PHY
1394 OHCI-LINK Bridge
Flash Memory Interface (3 in 1 Media Bay)

RICOH
R5C841
208 pin CSP

2.8 KEYBOARD CONTROLLER

Function features:

Vendor:
Parts Number:
Package:

Embedded controller-style host
Support hardware speed-up of GateA20 and RC
Local 16x8 keyboard switch matrix support
Three industry standard serial keyboard interfaces
All three ports are bi-directional
ITE
8510E
176-pin TQFP

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14

S62F Hardware Technical Specification Rev. 1.0 06/03/28

2.9 AUDIO CODEC

Function features:

Vendor:
Parts Number:
Package:

2.10 AUDIO AMPLIFIER

Function features:

Fully Compliant HD Audio Compliant.
20-bit Stereo Digital to Analog Converters.
18-bit Stereo Analog to Digital Converters.
High-quality pseudo-Differential CD input.
Meets or exceeds the Microsoft PC99 Audio

Performance requirements.

S/PDIF digital audio output.
3D Stereo Enhancement.

ADI
1986A
48-pin LFCSP

2 X 1.8W BTL audio amplifier with 4ohm load.

Depop circuitry integrated

BTL or SE mode operation

Thermal shutdown circuitry integrated

Vendor:
Parts Number:
Package:

2.11 LAN & MODEM

2.11.1 LAN

Function features:

TI
TPA0212
24-pin TSSOP

Integrated Fast Ethernet MAC, Physical chip

and transceiver in one chip
10Mb/s, 100Mb/s, 1000Mb/s operation
Compliant to PCI Revision 2.2
Compliant to PC99/PC2001 standard
Support Wake-on-LAN function and remote

wake up (Magic Packet, LinkChg and

Microsoft wake-up frame)

ASUSTeK Confidential Page

15

S62F Hardware Technical Specification Rev. 1.0 06/03/28

Vendor:
Parts Number:
Package:

2.11.2 MODEM

Function features:

Vendor:
Parts Number:

Package:

Realtek
RTL8110SB
128-Pin LQFP

V.90 and K56 flex support
Integrated PnP functionality
PC99 compliant
Support both APM and ACPI power management
Support Wake-on-ring functionality

ASUS
RD02-D110
Azalia MDC

ASUSTeK Confidential Page

16

S62F Hardware Technical Specification Rev. 1.0 06/03/28

3 KEY PARTS LIST

Key Parts Summary:

S62F Project Keyparts List

Priority Vendor Model No. ASUS Part No.

CPU

1
1

Intel

Intel INT CO667 DC 2.0G T2500 L8VP

Intel

Intel

INT CO667 DC 2.16G T2600

L8VN

INT CO667 DC 1.83G T2400

L8VQ

INT CO667 DC 1.66G T2300

L8VR

LCD

14.1” WXGA

1

2
2
2

AUO B141EW01 V1
AUO B141EW01 V3(Glare)
CMO N141I1_L02
CMO N141I1_L03(Glare)

14.1” WXGA+

1
1

AUO B141PW01 V0
CMO N141C1-L03 REV C1

CMO N141C1-L02 REV C1
ODD
DVD Combo

1

TSST TS-L462C 17G112151102

KME UJDA770 17G112151201
DVD Super Multi

1

2

KME UJ-850BAL-A 17G141120000

KME UJ-841BAL-A 17G141113000

TSST TS-L632C 17G141115001
Touchpad

1

SYNAPTICS SYNAPTICS FOR A6 04G110001710

ASUSTeK Confidential Page

17

MDC

S62F Hardware Technical Specification Rev. 1.0 06/03/28

1

ASUS MODEM 56K Azalia(Green)
CMOS Camera Module

1

YA HSIN N03P1BG_SM9 04G370030100

CHICONY CMN5622 04G370030000
HDD

1
1
1
1

2
2
2

HGST HTS421 260H9AT00 17G013131708

HGST HTS42 1280H9AT00 17G013132708

HGST HTS421 210H9AT00 17G013134701

Fujitsu MHV2060AT PL 17G013131119

Fujitsu MHV-2100AT PL 17G013134114

HGST HTS421212H9AT00 17G013133900

HGST HTS541060G9AT00 17G013131706

HGST HTS541080G9AT00 17G013132707

HGST HTS541 010G9AT00 17G013134700

Fujitsu MHV2100AH 17G013134112

61-BMM011-01

Minicard WLAN

1
1

Keyboard

1
1
1
1

2
2

Battery

1
1

Intel INTEL/WM3945AGM1GEN 04G033051000

Intel INTEL/WM3945AGM2GEN 04G033052000

Intel INTEL/WM3945AGRWGEN 04G033052010

Intel INTEL/WM3945AGJPGEN 04G033052020

SUNREX KEYBOARD S62 (USA) 04GNG51KUS00

SUNREX KEYBOARD S62 (UKB) 04GNG51KUK00

SUNREX KEYBOARD S62 (JPN) 04GNG51KJP00

DARFON KEYBOARD S62F (US) 04GNG51KUS00-1

DARFON KEYBOARD S62F (UK) 04GNG51KUK00-1

DARFON KEYBOARD S62F (JPN) 04GNG51KJP00-1

Celxpert ICR18650-24E/3S2P 3.7V 07G016A61865

Celxpert ICR18650-24E/3S3P 3.7V 07G016B31865
AC Adapter

1

Delta SADP65KB-ABH REV:01 04G266003183

ASUSTeK Confidential Page

18

S62F Hardware Technical Specification Rev. 1.0 06/03/28

1

Delta SADP65KB-BFJ REV:01 04G266003163
SO-DIMM
512MB DDR2 533

1
1

UNIFOSA GU33512AGHYQ612L3PC 04G0016 16673
NANYA NT512T64UH8A1FN-37B 04G001616619

1GB DDR2 533

1

NANYA NT1GT64U8HA0BN-37B 04G001617633

512MB DDR2 667

Infineon M470T6554CZ3-CE6 04G00161662F
Nanya NT512T64UH8A1FN-3C 04G00161661B

1GB DDR2 667

Infineon M470T2953CZ3-CE6 04G001617641
Nanya NT1GT64U8HA0BN-3C 04G001617634

ASUSTeK Confidential Page

19

S62F Hardware Technical Specification Rev. 1.0 06/03/28

3.1 Display

WXGA

WXGA
+

Technology: Active color (TFT: Thin Film Transistor)
Size: 14.1”W
Resolution: WXGA (1280 X 800)
Dimension:
Pixel Pitch: 0.279mm x 0.279mm
Display Colors: 262,144
Vendor: AUO/CMO/Hansstar

Technology: Active color (TFT: Thin Film Transistor)

Size: 14.1”W
Resolution: WXGA+ (1440 X 900)
Dimension:
Pixel Pitch: 0.297mm x 0.297mm
Display Colors: 262,144
Vendor: AUO/CMO/Hansstar

3.2 Hard Disk Drive

Form factor:
Capacity:
Height:
Interface:
Functional features:

2.5 inch
60/80/100 GB

9.5 mm
Enhanced IDE conforming to ATA-5
Power Management APM 1.1 and 1.2 (standby/suspend)
LBA-modes

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20

S62F Hardware Technical Specification Rev. 1.0 06/03/28

Hardware features:

Vendor/Model:

3.3 Combo Drive

Functional features:

Form factor:
Speed:
Height:
Interface:

Standard I/O addresses: 1F0h to 1F7h and 3F6h
Support of minimum IRQ 14
Support of at least 3 DMA channels, if DMA is supported
Easily removable and exchangeable for user’s future

upgrade
HGST/ HTS421260H9AT00
, HTS421280H9AT00

5.25 Inch
24X/24X/8X/24X

12.7mm

IDE (ATAPI)

Power Management APM 1.1 and 1.2 (standby/suspend)

Vendor/Model:

3.4 DVD-Dual Drive

Form factor:

Speed:

Height:
Interface:

Functional features:

Vendor/Model:

Standard I/O addresses
Support of minimum IRQ
Easily removable and exchangeable for user’s future

upgradability
Toshiba/TS-L462C , Panasonic/UJDA770

5.25 Inch
DVD super-multi

12.7mm
IDE (ATAPI)
Power Management APM 1.1 and 1.2 (standby/suspend)
Standard I/O addresses
Support of minimum IRQ
Easily removable and exchangeable for user’s future

upgradability
Toshiba/TS-L632C, Panasonic/UJ-841BAL-A

ASUSTeK Confidential Page

21

S62F Hardware Technical Specification Rev. 1.0 06/03/28

A

3.5 Touch Pad

Dimensions:
Sensor effective areas:
Interface:
X/Y position resolution:
Customizing:

65 mm(W) x 49 mm(H) x 2.82 mm(T)

62.5 mm(W) x 46.5 mm(H)
PS/2
40 points / mm (graphics mode)
Custom color can be printed on the sensor pad.

Functional features: Accurate positioning

Low fatigue pointing action
Low power consumption
Software configurable
Scanner function for signature
Low profile, compact size and low weight

Vendor/Model Synaptics : TM61PDE8G307

3.6 Keyboard

Compatibility:
Functional features:

Hardware feature:

MS-Windows 2000/XP
Standard Notebook-Keyboard
MF2-Layout
Simultaneously use of internal and external keyboard

Easily to assemble or disassemble
Dimensions: (H) 300mm x (V) 116.5 mm
Type:

Total travel:
Key top:
Language versions:
Vendor/ Model

Key switch Membrane

3.0 ± 0.3 mm
BS material, TANPO printing with UV hardening English,

Japanese, Chinese, Korean and European etc.,
InnovACE/K000962, Chicony/MP-0411

3.7 Battery

3.7.1 Main Battery

Purpose:

Gas-gauge:

ASUSTeK Confidential Page

Main power supply battery
SMBus interface

22

S62F Hardware Technical Specification Rev. 1.0 06/03/28

Chemistry:

Voltage:
Capacity:
Vendor:
Duration:
Charge Method:
Charging Source:
Gas-gauge:

3.7.2 RTC Backup Battery

Purpose:

Chemistry:
Voltage:
Capacity:

Li-ion rechargeable battery
Nominal 11.1V (= 3.7V cell 3pcs in serial, 2pcs in parallel)
2400mAH/Cell
Celxpert
Minimum 4 hour (w/o PMU)
Fast Charge: 2.5A, 3.0 hour (while System off)
AC Adapter
BENCHMARQ bq2060H

Backup the RTC/CMOS data
While AC adapter off & Main Battery removed
Coin cell 2032 Li-ion battery
Nominal 3V
200mAH

Vendor:

TOSHIBA, Panasonic, KTS

3.8 AC/DC Adapter

The notebook can be powered either by an external AC adapter or by an internal battery pack. The AC adapter
is used as power source for the DC/DC converter and as constant current source for the battery pack.

Input Requirements:

AC line voltage:
AC line current:
AC line frequency
Efficiency

Output requirements:

Output-Voltage
Output-Current

90V to 264V AC, Full Range

1.5A

50 Hz to 60 Hz
85% min.

+19V DC +/- 3%
max.3.42A

Ripple voltage

Power cord:

DC Cable length:

500mV

P-P

Plug to the adapter
180 mm +/- 50mm

ASUSTeK Confidential Page

23

S62F Hardware Technical Specification Rev. 1.0 06/03/28

Regulatory:

EMI:
Safety:

FCC Class B
CISPR 22 Class B

.Dimension: (L) 114.5 x (W) 49.5 x (H) 29 mm

ASUSTeK Confidential Page

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S62F Hardware Technical Specification Rev. 1.0 06/03/28

4 SYSTEM

4.1 System diagram

ASUSTeK Confidential Page

25

S62F Hardware Technical Specification Rev. 1.0 06/03/28

4.2 Main components block diagrams

ASUSTeK Confidential Page

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