APTM 50 H 35 F Service Manual

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APTM50HM35F
MOSFET Power Module
G1
S1
S3
G3
Full - Bridge
OUT1
VBUS
0/VBUS
OUT2
G2
S2
S4
G4
Absolute maximum ratings
Symbol Parameter Max ratings Unit
V
Drain - Source Breakdown Voltage 500 V
DSS
ID Continuous Drain Current
IDM Pulsed Drain current 396
VGS Gate - Source Voltage ±30 V
R
Drain - Source ON Resistance 35
DSon
PD Maximum Power Dissipation Tc = 25°C 781 W
IAR Avalanche current (repetitive and non repetitive) 51 A EAR Repetitive Avalanche Energy 50 EAS Single Pulse Avalanche Energy 3000
These Devices are sensitive to Electrostatic Discharge. Pr oper Handing Procedures Should Be Followed.
V R
I
= 500V
DSS
= 35mW max @ Tj = 25°C
DSon
= 99A @ Tc = 25°C
D
Application
· Welding converters
· Switched Mode Power Supplies
· Uninterruptible Power Supplies
· Motor control
Features
· Power MOS 7
- Low R
®
FREDFETs
DSon
- Low input and Miller capacitance
- Low gate charge
- Fast intrinsic reverse diode
- Avalanche energy rated
- Very rugged
· Kelvin source for easy drive
· Very low stray inductance
- Symmetrical design
- M5 power connectors
· High level of integration
Benefits
· Outstanding performance at high frequency operation
· Direct mounting to heatsink (isolated package)
· Low junction to case thermal resistance
· Low profile
Tc = 25°C 99
= 80°C 74
T
c
A
mW
mJ
APT website –http://www.advancedpower.com
1–6
APTM50HM35F– Rev 1 May, 2004
APTM50HM35F
All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
BV
Drain - Source Breakdown Voltage VGS = 0V, ID = 375µA 500 V
DSS
I
Zero Gate Voltage Drain Current
DSS
R
Drain – Source on Resistance VGS = 10V, ID = 49.5A
DS(on)
V
Gate Threshold Voltage VGS = VDS, ID = 5mA 3 5 V
GS(th)
I
Gate – Source Leakage Current VGS = ±30 V, VDS = 0V ±150 nA
GSS
VGS = 0V,VDS = 500V T
VGS = 0V,VDS = 400V T
Dynamic Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
Input Capacitance 14
C
iss
C
Output Capacitance 2.8
oss
C
Reverse Transfer Capacitance
rss
Qg Total gate Charge 280
Qgs Gate – Source Charge 80
Qgd Gate – Drain Charge
T
Turn-on Delay Time 21
d(on)
T
Rise Time 38
r
T
Turn-off Delay Time 75
d(off)
T
Fall Time
f
E
Turn-on Switching Energy u 2070
on
E
Turn-off Switching Energy v
off
= 0V
V
GS
= 25V
V
DS
f = 1MHz
= 10V
V
GS
= 250V
V
Bus
= 99A
I
D
Inductive switching @ 125°C
= 15V
V
GS
= 333V
V
Bus
I
= 99A
D
= 1W
R
G
Inductive switching @ 25°C
V
= 15V, V
GS
= 99A, RG = 1
I
D
= 333V
Bus
= 25°C 375
j
= 125°C 1500
j
35
0.18
140
93
1690
µA
mW
nF
nC
ns
µJ
E
Turn-on Switching Energy u 3112
on
E
Turn-off Switching Energy v
off
Inductive switching @ 125°C
V
= 15V, V
GS
= 99A, RG = 1
I
D
= 333V
Bus
µJ
2026
Source - Drain diode ratings and characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
IS Continuous Source current
(Body diode)
Tc = 25°C 99 Tc = 80°C 74
A
VSD Diode Forward Voltage VGS = 0V, IS = - 99A 1.3 V
dv/dt Peak Diode Recovery w 15 V/ns
= - 99A
I
trr Reverse Recovery Time
Qrr Reverse Recovery Charge
S
= 250V
V
R
/dt = 200A/µs
di
S
= - 99A
I
S
= 250V
V
R
/dt = 200A/µs
di
S
Tj = 25°C 270
= 125°C 540
T
j
Tj = 25°C 5.2
= 125°C 19.2
T
j
ns
µC
u Eon includes diode reverse recovery.
v In accordance with JEDEC standard JESD24-1. w dv/dt numbers reflect the limitations of the circuit rather than the device itself.
£ - 99A di/dt £ 700A/µs VR £ V
I
S
Tj £ 150°C
DSS
APT website –http://www.advancedpower.com
2–6
APTM50HM35F– Rev 1 May, 2004
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