0.8V Reference Ultra Low Dropout (0.2V@1.5A) Linear Regulator
Features
•Ultra Low Dropout
- 0.2V(typical) at 1.5A Output Current
•Low ESR Output Capacitor (Multi-layer Chip
Capacitors (MLCC)) Applicable
•0.8V Reference Voltage
•High Output Accuracy
- ±1.5% over Line, Load, and Temperature
•Fast Transient Response
•Adjustable Output Voltage by External Resistors
•Power-On-Reset Monitoring on both VCNTL and
VIN Pins
•Internal Soft-Start
•Current-Limit Protection
•Under-Voltage Protection
•Thermal Shutdown with Hysteresis
•Power-OK Output with a Delay Time
•Shutdown for Standby or Suspend Mode
•Simple SOP-8P Package with Exposed Pad
•Lead Free and Green Devices Available
(RoHS Compliant)
General Description
The APL5915 is a 1.5A ultra low dropout linear regulator.
This product is specifically designed to provide well supply volatage for motherboards NB and VGA c ard
applications. The IC needs two supply voltages, a control
voltage for the circuitry and a main supply voltage for
power conversion, to reduce power dissipation and provide extremely low dropout.
The APL5915 integrates many functions into a single
package. A Power-On-Reset (POR) circuit monitors both
supply voltages to prev ent wrong operations. Thermal
shutdown and current limit functions protect the device
against thermal and current over-loads. POK indicates
the output status with time delay which is set internally. It
can control other converter for power sequence. The
APL5915 is enabled by other power system. Pulling and
holding the EN pin below 0.3V to shuts off the output.
The APL5915 is available in SOP-8P package which features small size as SOP-8 and an Exposed Pad to reduce
the junction-to-case resistance, being applicable in 1~2W
applications.
= Exposed Pad
(connected to VIN plane for better heat dissipation)
VIN
3
4
SOP-8P
(Top View)
8
7
6
5
EN
POK
VCNTL
VIN
www.anpec.com.tw1
APL5915
Ordering and Marking Information
APL5915
Assembly Material
Handling Code
Temperature Range
Package Code
Package Code
KA : SOP-8P
Operating Ambient Temperature Range
I : -40 to 85 oC
Handing Code
TR : Tape & Reel
Assembly Material
L : Lead Free Device
G : Halogen and Lead Free Device
APL5915 KA:
APL5915
XXXXX
XXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings
Symbol Parameter Rating Unit
V
VCNTL Supply Voltage (VCNTL to GND) -0.3 ~ 7 V
CNTL
VIN VIN Supply Voltage (VIN to GND) -0.3 ~ 3.9 V
V
EN and FB to GND -0.3 ~ V
I/O
V
POK to GND -0.3 ~ 7 V
POK
PD Power Dissipation 2.8 W
TJ Junction Temperature 150
T
Storage Temperature -65 ~ 150
STG
T
Maximum Lead Soldering Temperature, 10 Seconds 260
SDR
Note 1: Absolute Maximum Ratings are those values beyond whic h the life of a device may be impaired. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
+0.3 V
CNTL
o
C
o
C
o
C
Thermal Characteristics
Symbol Parameter Typical Value Unit
Junction-to-Ambient Thermal Resistance in Free Air
θ
JA
θJC
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed pad
Junction-to-Case Thermal Resistance
(Note 3)
of SOP-8P is soldered directly on the PCB.
Note 3: The “Thermal Pad Temperature” is measured on the PCB copper area connected to the thermal pad of package.