The APL5301/2 series are micropower, low noise, low
dropout linear regulators, which operate from 3V to
6V input voltage and deliver up to 300mA. Typical
dropout voltage is only 260mV at 300mA loading. Designed for use in battery-powered system, the low 50uA
quiescent current makes it an ideal choice. Design
with an internal P-channel MOSFET pass transistor,
the APL5301/2 maintain a low supply current, independent of the load current and dropout voltage.
Other features include reverse current protection, ther-
mal-shutdown protection, current limit protection to
ensure specified output current and controlled shortcircuit current. The APL5301/2 regulators come in a
miniature SOP-8, SOT-23, SOT-23-5, SOT-89 and
SOT-89-5 packages.
Pin Configuration
V
IN
3
12
123
TAB is V
IN
V
GND
OUT
GND
INVOUT
V
Applications
SOT-23 (T opView)
• Notebook Computer
APL5301
• PDA or Portable Equipments
• Noise-Sensitive Instrumentation Systems
OUT
V
GND
V
1
2
3
IN
BP
5
4
SHDN
SOT-23-5 (T opView)
APL5301
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Unless otherwise noted these specifications apply over full temperature, VIN=3.8V, CIN=COUT=1uF, SHDN=VIN,
TJ=0 to 125°C. Typical values refer to TJ=25°C.
The APL5301/2 use at least a 1uF capacitor on the
input, and this capacitor can be Aluminum, Tantalum
or Ceramic capacitor. The input capacitor with larger
value and lower ESR provides better PSRR and linetransient response. The output capacitor also can use
Aluminum, T antalum or Ceramic capacitor , and a minimum value of 1uF and ESR above 0.06Ω is
recommended. The curve of the stable region in typical characteristics shows the appropriate output capacitor ESR for different load current stable operation.
A larger output capacitor can reduce noise and improve load-transient response, stability, and PSRR.
Note that some ceramic dielectrics exhibit large capacitance and ESR variation with temperature. When
using this capacitor, a minimum 2.2uF or more may
be required to ensure the stability at low temperature
operation. Use a bypass capacitor at BP pin for low
output noise. Increasing the capacitance will slightly
decrease the output noise, but increase the start-up
time. (See Shutdown Exit Delay and Output Noise
vs.Bypass Capacitor graph in the typical
characteristics)
tery-powered systems, this will determine the useful
end-of-life battery voltage. Because the APL5301/2
use a p-channel MOSFET pass transistor, the dropout voltage is a function of drain-to-source on-resistance (R
) multiplied by the load current.
DS(ON)
Reverse Current Protection
The APL5301/2 have an internal reverse protection, it
does not need an external schottky diode to connect
the regulator input and output. If the output voltage is
forced above the input voltage by more than 11mV,
the IC will be shutdown and the ground pin current is
below 0.1uA.
Shutdown/Enable
The APL5301/2 have an active high enable function.
Force EN high (>1.6V) enables the regulator, EN low
(<0.4V) disables the regulator and enter the shutdown
mode. In shutdown mode, the quiescent current can
reduce below 1uA. The EN pin cannot be floating, a
floating EN pin may cause an indeterminate state on
the output. If it is no use, connect to VIN for normal
operation.
Load-Transient Considerations
The APL5301/2 load-transient response graphs in typical characteristics show the transient response. A
step change in the load current from 1mA to 50mA at
1us will cause a 60mV transient spike. Larger output
capacitor and lower ESR can reduce transient spike.
Input-Output (Dropout)Voltage
The minimum input-output voltage difference (dropout)
determines the lowest usable supply voltage. In bat
The APL5301/2 have a current limit protection. The
ouptut voltage will drop close to zero volt, when load
current reaches the limit, and then the load current
will be limited at 50mA after output voltage is below 0.
7V. When the load current back to the value where
limiting started, the output voltage and current will return to normal value. When output is shorted to
ground, the APL5301/2 will keep short circuit current
at 150mA .
www.anpec.com.tw10
APL5301/2
Thermal Protection
Thermal protection limits total power dissipation in the
device. When the junction temperature exceeds
=+150°C, the thermal sensor generates a logic sig-
T
J
nal to turn off the pass transistor and allows IC to
cool. When the IC’s junction temperature is down by
10°C, the thermal sensor will turn the pass transistor
on again, resulting in a pulsed output during continuous thermal protection. Thermal protection is designed
to protect the APL5301/2 in the event of fault
conditions. For continuous operation, do not exceed
the absolute maximum junction temperature of
T
=+150°C.
J
Operating Region and Power Dis-
sipation
The thermal resistance of the case to circuit board,
and the rate of air flow all control the APL5301/2’s
maximum power dissipation. The power dissipation
across the device is PD = I
OUT (VIN-VOUT
) and the maximum power dissipation is:
P
= (TJ-TA) / (θJC +θCA)
DMAX
where TJ-TA is the temperature difference between the
junction and ambient air, θJC is the thermal resistance
of the package, and θCA is the thermal resistance
through the printed circuit board, copper traces, and
other materials to the ambient air.
The GND pin of the APL5301 and APL5302 that the
packages ard SOT-23-5, SOT-89-5 AND SOP-8 provide an electrical connection to ground and channeling heat away. If power dissipation is large, connect
the GND pin to ground using a large pad or ground
plane, can improve the problem of over heat of IC.
Term inal Ma terial Solder -P lated C opp er (Solde r Ma ter ial : 90/10 or 63/37 S nP b), 100 %Sn
Lead Solderability Meets EIA Spec ification RSI86-91, ANSI/J-STD-002 Catego ry 3.
Reflow Condition (IR/Convection or VPR Reflow)
T
P
Ramp-up
T
L
Tsmax
Tsmin
Temp erature
ts
Preheat
25
°
t 25 C to Pe a k
Classificatin Reflow Profiles
tp
Ramp-down
Time
Critical Zone
to T
T
L
P
t
L
Profile Feature
Average ramp-up rate
(T
to TP)
L
Preheat
- Temperature Min (Tsmin)
- Temperature Mix (Tsmax)
- Time (min to max)(ts)
Tsmax to T
L
Sn-Pb Eutectic Assembly Pb-Free Assembly
Large Body Small Body Large Body Small Body
3°C/second max. 3°C/second max.
100°C
150°C
60-120 seconds
- Ramp-up Rate
Tsmax to TL
- Temperature(T
- Time (t
)
L
Peak Temperature(Tp)
Time within 5°C of actual Peak
Temperature(tp)
Ramp-down Rate
Time 25°C to Peak Temperature
Note: All temperatures refer to topside of the package. Measured on the body surface.