ANALOG DEVICES UG-017 Service Manual

Evaluation Board User Guide
UG-017
One Technology Way P. O. Box 9106 Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 Fax: 781.461.3113 www.analog.com
Evaluation Board for Dual High Speed Op Amps
Offered in 16-Lead 3 mm × 3 mm LFCSP

FEATURES

Enables quick breadboarding/prototyping User-defined circuit configuration Edge-mounted SMA connector provisions Easy connection to test equipment and other circuits RoHS compliant

GENERAL DESCRIPTION

The Analog Devices, Inc., 16-lead LFCSP evaluation board is designed to help users evaluate dual high speed op amps offered in 16-lead, 3 mm × 3 mm LFCSP packages. The evaluation board is a bare board (that is, there are no com­ponents or amplifier soldered to the board; these must be ordered separately) that enables users to quickly prototype a variety of dual op amp circuits, which minimizes risk and
reduces time to market. Figure 1 and Figure 2 show the bare evaluation board component and circuit sides.
The evaluation board is a 2-layer PCB that accepts SMA edge mounted connectors on the inputs and outputs for efficient connection to test equipment or other circuitry. The ground plane, component placement, and supply bypassing are designed to minimize parasitic inductances and capacitances. The evaluation board components are primarily SMT 0805 case size, with the exception of the electrolytic bypass capaci­tors (C1 and C2), which are 3528 case size.
Figure 3 shows the evaluation board schematic. The evaluation board assembly drawings and layout patterns are shown in Figure 4 through Figure 7.

EVALUATION BOARD COMPONENT AND CIRCUIT SIDES

NOTES
1. THE EVALUATION BOARD SILKSCRE E N P ART NUMBER LABELING ON YOUR BOARD M AY BE DIFFERENT FROM WHAT IS SHOWN HERE .
Figure 1. Component Side of Evaluation Board
NOTES
1. THE EVALUATION BOARD SILKSCRE E N P ART NUMBER LABELING
08145-101
ON YOUR BOARD M AY BE DIFFERENT FROM WHAT IS SHOWN HERE .
Figure 2. Circuit Side of Evaluation Board
08145-102
Rev. A | Page 1 of 8
UG-017 Evaluation Board User Guide
TABLE OF CONTENTS
Features .............................................................................................. 1
General Description ......................................................................... 1
Evaluation Board Component and Circuit Sides ......................... 1
Revision History ............................................................................... 2

REVISION HISTORY

6/11—Rev. 0 to Rev. A
Changes to Features and General Descriptions Sections ............ 1
Changes to Figure 1 .......................................................................... 1
Added Figure 2 .................................................................................. 1
Changes to Evaluation Board Schematic, Assembly Drawings,
and Layout Patterns ............................................................................ 3
Added Ordering Information Section .......................................... 6
2/10—Revision 0: Initial Version
Evaluation Board Schematics, Assembly Drawings and Layout
Patterns ...............................................................................................3
Ordering Information .......................................................................6
Bill of Materials ..............................................................................6
Rev. A | Page 2 of 8
Evaluation Board User Guide UG-017
14 13
16LFCSP3X3_B
AGND
AGND
AGND
AGND
AGND AGND
AGND AGND
AGND AGND
AGND
AGND
AGND
AGND
+IN2
–IN2
+IN1
–IN1
C5*
C6*
R2*
C3*
PD2/DIS2
PD1/DIS1
R15*
R3*
R12*
R14*
R13*
R9*
R10*
R8*
–VS
C4*
OUT2
+VS
1 2 3 4 9
10
11
12
Z1
R16*
R11*
R7*
R5*
R4*
R6*
*USER-DEFI NED VAL UE
R1*
10UF
C2
10UF
C1
OUT1
+VS
R17*
R18*
R19*
R20* R21*
08145-001

EVALUATION BOARD SCHEMATICS, ASSEMBLY DRAWINGS AND LAYOUT PATTERNS

Figure 3. Evaluation Board Schematic
Rev. A | Page 3 of 8
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