ANALOG DEVICES LTC 1150 CS8 Datasheet

Page 1
FEATURES
High Voltage Operation: ±16V
No External Components Required
Maximum Offset Voltage: 10µV
Maximum Offset Voltage Drift: 0.05µV/°C
Minimum Voltage Gain: 135dB
Minimum PSRR: 120dB
Minimum CMRR: 110dB
Low Supply Current: 0.8mA
Single Supply Operation: 4.75V to 32V
Input Common Mode Range Includes Ground
200µA Supply Current with Pin 1 Grounded
Typical Overload Recovery Time 20ms
(0.1Hz to 10Hz)
P-P
LTC1150
±15V Zero-Drift
Operational Amplifier with
Internal Capacitors
U
DESCRIPTIO
®
The LTC zero-drift operational amplifier. The two sample-and-hold capacitors usually required externally by other chopper amplifiers are integrated on-chip. Further, LTC’s propri­etary high-voltage CMOS structures allow the LTC1150 to operate at up to 32V total supply voltage.
The LTC1150 has an offset voltage of 0.5µV, drift of
0.01µV/°C, 0.1Hz to 10Hz input noise voltage of 1.8µV and a typical voltage gain of 180dB. The slew rate of 3V/µs and a gain bandwidth product of 2.5MHz are achieved with
0.8mA of supply current. Overload recovery times from positive and negative saturation conditions are 3ms and 20ms, respectively.
1150 is a high-voltage, high-performance
P-P
U
APPLICATIO S
Strain Gauge Amplifiers
Electronic Scales
Medical Instrumentation
Thermocouple Amplifiers
High Resolution Data Acquisition
TYPICAL APPLICATIO
Single Supply Instrumentation Amplifier Noise Spectrum
1k
+
V
1M
2
7
LTC1150
3
–V
IN
+
6
4
1k
For applications demanding low power consumption, Pin 1 can be used to program the supply current. Pin 5 is an optional AC-coupled clock input, useful for synchronization.
The LTC1150 is available in standard 8-lead, plastic dual­in-line package, as well as an 8-lead SO package. The LTC1150 can be a plug-in replacement for most standard bipolar op amps with significant improvement in DC performance.
, LTC and LT are registered trademarks of Linear Technology Corporation.
U
160
1M
+
V
2
7
LTC1150
3
V
IN
+
6
GAIN = 1000V/V
4
OUTPUT OFFSET 5mV TOTAL SUPPLY CURRENT DECREASES TO 400µA WHEN BOTH PIN 1s ARE GROUNDED
V
OUT
LTC1150 •TA01
140
120
100
80
60
40
VOLTAGE NOISE DENSITY (nVHz)
20
0
10 1k 10k 100k
100
FREQUENCY (Hz)
LTC1150 •TA02
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LTC1150
WWWU
ABSOLUTE AXI U RATI GS
(Note 1)
Total Supply Voltage (V+ to V–) ............................... 32V
+
Input Voltage (Note 2) .............. (V
0.3V) to (V– –0.3V)
Output Short Circuit Duration .......................... Indefinite
Burn-In Voltage ....................................................... 32V
Operating Temperature Range
LTC1150M (OBSOLETE).....................–55°C to 125°C
LTC1150C .......................................... – 40°C to 85°C
Storage Temperature Range ................. –65°C to 150°C
Lead Temperature (Soldering, 10 sec).................. 300°C
UU
W
PACKAGE/ORDER I FOR ATIO
TOP VIEW
I
SUPPLY
1
–IN
2
+IN
3
V
4
N8 PACKAGE 8-LEAD PDIP
T
= 110°C, θJA = 130°C/W
JMAX
J8 PACKAGE
8-LEAD CERDIP
CLOCK OUT
8
+
V
7
OUT
6
EXT CLOCK
5
IN
OBSOLETE PACKAGE
Consider the N8 or S8 Package as an Alternate Source
Consult LTC Marketing for parts specified with wider operating temperature ranges.
ORDER PART
NUMBER
LTC1150CN8
LTC1150MJ8 LTC1150CJ8
I
SUPPLY
TOP VIEW
1
–IN
2
+IN
3
V
4
S8 PACKAGE
8-LEAD PLASTIC SO
= 110°C, θJA = 200°C/W
T
JMAX
ORDER PART
NUMBER
8
CLOCK OUT
+
V
– +
7
OUT
6
EXT CLOCK
5
IN
LTC1150CS8
S8 PART
MARKING
1150
ELECTRICAL CHARACTERISTICS
The denotes the specifications which apply over the full operating
temperature range otherwise specifications are at TA = 25°C. VS = ±15V, Pin 1 = Open, unless otherwise noted.
LTC1150M LTC1150C
PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS
Input Offset Voltage (Note 3) ±0.5 ±10 ±0.5 ±10 µV Average Input Offset Drift (Note 3) ±0.01 ±0.05 ±0.01 ±0.05 µV/°C
Long Term Offset Voltage Drift 50 50 nV/√mo
Input Offset Current ±20 ±60 ±20 ±200 pA
±1.5 ±0.5 nA
Input Bias Current ±10 ±50 ±10 ±100 pA
±2.5 ±1.0 nA
Input Noise Voltage RS = 100, 0.1Hz to 10Hz, TC2 1.8 1.8 µV
RS = 100, 0.1Hz to 1Hz, TC2 0.6 0.6
Input Noise Current f = 10Hz (Note 4) 1.8 1.8 fA/√Hz
Common Mode Rejection Ratio VCM = V– to 12V 110 130 110 130 dB
Power Supply Rejection Ratio VS = ±2.375V to ±16V 120 145 120 145 dB
Large-Signal Voltage Gain RL = 10k, V
Maximum Output Voltage Swing RL = 10k ±13.5 ±14.5 ±13.5 ±14.5 V
RL = 10k 10.5/ 10.5/
RL = 100k ±14.95 ±14.95
= ±10V 135 180 135 180 dB
OUT
–13.5 –13.5
P-P
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LTC1150
ELECTRICAL CHARACTERISTICS
The denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VS = ±15V, Pin 1 = Open, unless otherwise noted.
LTC1150M LTC1150C
PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS
Slew Rate RL = 10k, CL = 50pF 3 3 V/µs
Gain Bandwidth Product 2.5 2.5 MHz
Supply Current No Load 0.8 1.5 0.8 1.5 mA
No Load, Pin 1 = V No Load
Internal Sampling Frequency 550 550 Hz
22
0.2 0.2
The denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. V
= 5V, Pin 1 = Open, unless otherwise noted.
S
LTC1150M LTC1150C
PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNITS
Input Offset Voltage (Note 3) ±0.5 ±10 ±0.05 ±10 µV Average Input Offset Drift (Note 3) ±0.01 ±0.05 ±0.01 ±0.05 µV/°C
Long Term Offset Voltage Drift 50 50 µV/mo
Input Offset Current ±10 ±60 ±10 ±60 pA
Input Bias Current ±5 ±30 ±5 ±30 pA
Input Noise Voltage RS = 100, 0.1Hz to 10Hz, TC2 2.0 2.0 µV
RS = 100, 0.1Hz to 1Hz, TC2 0.7 0.7
Input Noise Current f = 10Hz (Note 4) 1.3 1.3 fA/√Hz
Common Mode Rejection Ratio VCM = 0V to 2.7V 106 130 106 130 dB
Power Supply Rejection Ratio VS = ±2.375V to ±16V 120 145 120 145 dB
Large-Signal Voltage Gain RL = 10k, V
Maximum Output Voltage Swing RL = 10k 0.15 to 4.85 0.15 to 4.85 V
= 100k 0.02 to 4.97 0.02 to 4.97
R
L
Slew Rate RL = 10k, CL = 50pF 1.5 1.5 V/µs
Gain Bandwidth Product 1.8 1.8 MHz
Supply Current No Load 0.4 1 0.4 1 mA
Internal Sampling Frequency 300 300 Hz
= 0.3V to 4.5V 115 180 115 180 dB
OUT
1.5 1.5
P-P
Note 1: Absolute Maximum Ratings are those values beyond which life of the device may be impaired.
Note 2: Connecting any terminal to voltages greater than V
may cause destructive latch-up. It is recommended that no sources
V operating from external supplies be applied prior to power-up of the
LTC1150.
+
or less than
Note 3: These parameters are guaranteed by design. Thermocouple effects
preclude measurement of these voltage levels in high-speed automatic test systems. V capability.
Note 4: Current Noise is calculated from the formula:
where q = 1.6 • 10
is measured to a limit determined by test equipment
OS
I
= √(2q • Ib)
N
–19
Coulomb.
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LTC1150
LTC1150 •TC02
100k
475k
TO X-Y RECORDER
475k
FOR 1Hz NOISE BW, INCREASE ALL THE CAPACITORS BY A FACTOR OF 10
316k
0.1µF 0.1µF
0.1µF
158k
10
LTC1150
+
LT1012
+
LTC1150 • TPC06
FREQUENCY (Hz)
0
GAIN (dB)
PHASE (DEGREES)
20
60
100
120
100 10k 100k 10M
–20
1k
1M
80
40
–40
180
160
120
80
60
200
100
140
220
VS = ± 15V C
L
= 100pF
PIN 1 = –15V
PHASE
GAIN
TEST CIRCUITS
Offset Voltage Test Circuit
1M
+
2
3
V
LTC1150
+
V
7
6
OUTPUT
4
R
L
LTC1150 •TC01
1k
UW
TYPICAL PERFOR A CE CHARACTERISTICS
Supply Current vs Supply Voltage
1000
TA = 25°C
900
800
700
600
500
SUPPLY CURRENT (µA)
400
300
200
8
4
12
TOTAL SUPPLY VOLTAGE, V+ TO V– (V)
16
20
24
28
32
LTC1150 • TPC01
36
1400
VS = ± 15V
1200
1000
800
600
SUPPLY CURRENT (µA)
400
200
–55
53565
–25
AMBIENT TEMPERATURE (°C)
95 125
LTC1150 • TPC02
DC-10Hz Noise Test Circuit
Gain/Phase vs FrequencySupply Current vs Temperature
120
VS = ± 15V
= 100pF
C
L
100
80
60
40
GAIN (dB)
20
0
–20
–40
100 10k 100k 10M
GAIN
1k
FREQUENCY (Hz)
PHASE
1M
LTC1150 • TPC03
60
80
100
PHASE (DEGREES)
120
140
160
180
200
220
Output Short-Circuit Current vs Supply Voltage
6
(mA)
4
OUT
2
0
–3
–6
–9
–12
SHORT-CIRCIUT OUTPUT CURRENT, I
–15
4
4
V
= V
OUT
I
SOURCE
+
V
= V
OUT
I
SINK
TOTAL SUPPLY VOLTAGE, V+ TO V– (V)
PIN 1 = OPEN
8
12
16
PIN 1 = OPEN
PIN 1 = V
PIN 1 = V
20
24
TA = 25°C
28
32
LTC1150 • TPC04
36
SET
1200
V
= ± 15V
S
= 25°C
T
A
1000
800
600
400
SUPPLY CURRENT (µA)
200
0
1k
10k 100k 1M
R
, PIN 1 TO V
SET
()
LTC1150 • TPC05
Gain/Phase vs FrequencySupply Current vs R
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TYPICAL PERFOR A CE CHARACTERISTICS
LTC1150
Input Bias Current vs Supply Voltage Gain/Phase vs Frequency
12
TA = 25°C
= OV
V
CM
10
8
6
4
INPUT BIAS CURRENT (pA)
2
0
0
± 4 ± 8
± 2 ± 6
SUPPLY VOLTAGE (V)
± 10
± 12
LTC1150 • TPC07
±14
±16
Input Bias Current vs Input Common Mode Voltage Input Bias Current vs Temperature
40
30
20
10
0
–10
–20
INPUT BIAS CURRENT (pA)
–30
–40
–I
B
+I
B
–15 –10 –5
INPUT COMMON MODE VOLTAGE (V)
0
5
VS = ± 15V
= 25°C
T
A
10
LTC1150 • TPC10
15
Undistorted Output Swing vs Frequency
30
25
20
15
10
OUTPUT VOLTAGE (Vp-p)
5
0
100 10k 100k 1M
–1000
–100
–10
INPUT BIAS CURRENT (pA)
–1
–50 –25
PIN 1 = FLOATING
1k
VCM = 0
= ± 15V
V
S
–I
B
0255075100 125
TEMPERATURE (°C)
PIN 1 = V
RL = 10k
= 100k
R
L
FREQUENCY (Hz)
+I
B
LTC1150 • TPC08
LTC1150 • TPC11
120
VS = ±2.5V
= 100pF
C
L
100
80
60
40
GAIN (dB)
20
0
–20
–40
100 10k 100k 10M
GAIN
1k
FREQUENCY (Hz)
Common Mode Input Range vs Supply Voltage
15
TA = 25°C
10
5
0
–5
COMMON MODE RANGE (V)
–10
–15
0
±5 ±7.5 ±10
±2.5
SUPPLY VOLTAGE (V)
PHASE
1M
LTC1150 • TPC09
±12.5 ±15
LTC1150 • TPC12
60
80
100
PHASE (DEGREES)
120
140
160
180
200
220
CMRR vs Frequency
160
140
120
100
80
CMRR (dB)
60
40
20
0
10
1 100 1k 100k
FREQUENCY (Hz)
10k
LTC1150 • TPC13
PSRR vs Frequency
160
140
120
100
80
PSRR (dB)
60
40
20
0
1 100 1k 100k
POSITIVE SUPPLY, PIN 1 = OPEN
POSITIVE SUPPLY, PIN 1 = V
NEGATIVE SUPPLY,
PIN 1 = OPEN
NEGATIVE SUPPLY, PIN 1 = V
10
FREQUENCY (Hz)
10k
LTC1150 • TPC14
Offset Voltage vs Sampling Frequency
10
VA = ± 15V T
= 25°C
A
8
6
4
OFFSET VOLTAGE (µV)
2
0
0
PIN 1 = V
1k
SAMPLING FREQUENCY, fS (Hz)
PIN 1 = OPEN
2k
LTC1150 • TPC15
3k
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LTC1150
LTC1150 • TPC18
AMBIENT TEMPERATURE (°C)
–55
300
SAMPLING FREQUENCY (Hz)
400
500
600
700
900
–25
53565
95 125
800
VS = ± 15V
UW
TYPICAL PERFOR A CE CHARACTERISTICS
Offset Voltage Drift vs Sampling Frequency
100
VS = ± 15V
90
80
70
60
50
40
30
20
OFFSET VOLTAGE DRIFT (nV/C°)
10
0
100
SAMPLING FREQUENCY, fS (Hz)
PIN 1 = OPEN
1k 10k
Large-Signal Transient Response
LTC1150 • TPC16
10Hz p-p Noise vs Sampling Frequency
4
VS = ± 15V
= 25°C
T
A
3
2
1
10Hz PEAK-TO-PEAK NOISE (µV)
0
100
SAMPLING FREQUENCY, fS (Hz)
Large-Signal Transient Response, Pin 1 = V
1k 10k
LTC1150 • TPC17
Sampling Frequency vs Temperature
Small-Signal Transient Response
Small-Signal Transient Response, Pin 1 = V
VS = ±15V, AV = 1, CL = 100pF, RL = 10k
VS = ±15V, AV = 1, CL = 100pF, RL = 10k,
PIN 1 = V
VS = ±15V, AV = 1, CL = 100pF, PIN 1 = V
Overload Recovery from Negative Saturation
VS = ±15V, AV = –100, 2ms/DIV
VS = ±15V, AV = 1, CL = 100pF, RL = 10k
Overload Recovery from Positive Saturation
VS = ±15V, AV = –100, 2ms/DIV
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TYPICAL PERFOR A CE CHARACTERISTICS
0.1Hz to 10Hz Noise, V = ±15V, TA = 25°C, Internal Clock
1µV
LTC1150
2.0µV
P-P
1s
0.1Hz to 10Hz Noise, V = ±15V, TA = 25°C, fS = 1800Hz
1µV
1s
0.1Hz to 1Hz Noise, V = ±15V, TA = 25°C, Internal Clock
10s
10s
LTC1150 • TPC25
1.0µV
LTC1150 • TPC26
P-P
500nV
10s
100s
700nV
LTC1150 • TPC27
P-P
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LTC1150
UW
TYPICAL PERFOR A CE CHARACTERISTICS
0.1Hz to 1Hz Noise, V = ±15V, TA = 25°C, fS = 1800Hz
500nV
300nV
P-P
10s
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PI DESCRIPTIO S
I
SUPPLY
ply current can be programmed through Pin 1. When Pin 1 is left open or tied to V+, the supply current defaults to 800µA. Tying a resistor between Pin 1 and Pin 4, the negative supply pin, will reduce the supply current. The supply current, as a function of the resistor value, is shown in Typical Performance Characteristics.
–IN (Pin 2): Inverting Input.
+IN (Pin 3): Noninverting Input.
V– (Pin 4): Negative Supply.
EXT CLOCK IN (Pin 5): Optional External Clock Input. The
LTC1150 has an internal oscillator to control the circuit operation of the amplifier if Pin 5 is left open or biased at any DC voltage in the supply voltage range. When an external clock is desirable, it can be applied to Pin 5. The applied clock is AC-coupled to the internal circuitry to
(Pin 1): Supply Current Programming. The sup-
8-Pin Packages
100s
simplified interface requirements. The amplitude of the clock input signal needs to be greater than 2V and the voltage level has to be within the supply voltage range. Duty cycle is not critical. The internal chopping frequency is the external clock frequency divided by four. When frequency of the external clock falls below 100Hz (internal chopping at 25Hz), the internal oscillator takes over and the circuit chops at 550Hz.
OUT (Pin 6): Output.
V+ (Pin 7): Positive Supply.
CLOCK OUT (Pin 8): Clock Output. The signal coming out
of this pin is at the internal oscillator frequency of about
2.2kHz (four times the chopping frequency) and has voltage levels at VH = VS and VL = VS –4.6. If the circuit is driven by an external clock, Pin 8 is pulled up to VS.
LTC1150 • TPC28
8
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LTC1150 •AI01
OUTPUT
NOMINALLY UNNECESSARY
RESISTOR USED TO
THERMALLY BALANCE
OTHER INPUT RESISTOR
RESISTOR LEAD, SOLDER, COPPER TRACE JUNCTION
LEAD WIRE/SOLDER COPPER TRACE JUNCTION
LTC1150
+
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APPLICATIO S I FOR ATIO
LTC1150
ACHIEVING PICOAMPERE/MICROVOLT PERFORMANCE
Picoamperes
In order to realize the picoampere level of accuracy of the LTC1150, proper care must be exercised. Leakage cur­rents in circuitry external to the amplifier can significantly degrade performance. High quality insulation should be used (e.g., Teflon, Kel-F); cleaning of all insulating sur­faces to remove fluxes and other residues will probably be necessary–particularly for high temperature perfor­mance. Surface coating may be necessary to provide a moisture barrier in high humidity environments.
Board leakage can be minimized by encircling the input connections with a guard ring operated at a potential close to that of the inputs: in inverting configurations the guard ring should be tied to ground; in noninverting connections to the inverting input. Guarding both sides of the printed circuit board is required. Bulk leakage reduction depends on the guard ring width.
number of junctions in the amplifier’s input signal path. Avoid connectors, sockets, switches, and relays where possible. In instances where this is not possible, attempt to balance the number and type of junctions so that differential cancellation occurs. Doing this may involve deliberately introducing junctions to offset unavoidable junctions.
Figure 1 is an example of the introduction of an unneces­sary resistor to promote differential thermal balance. Maintaining compensating junctions in close physical proximity will keep them at the same temperature and reduce thermal EMF errors.
Microvolts
Thermocouple effects must be considered if the LTC1150’s ultralow drift is to be fully utilized. Any connection of dissimilar metals forms a thermoelectric junction produc­ing an electric potential which varies with temperature (Seebeck effect). As temperature sensors, thermocouples exploit this phenomenon to produce useful information. In low drift amplifier circuits the effect is a primary source of error.
Connectors, switches, relay contacts, sockets, resistors, solder, and even copper wire are all candidates for thermal EMF generation. Junctions of copper wire from different manufacturers can generate thermal EMFs of 200nV/°C—four times the maximum drift specification of the LTC1150. The copper/kovar junction, formed when wire or printed circuit traces contact a package lead, has a thermal EMF of approximately 35µV/°C—700 times the maximum drift specification of the LTC1150.
Minimizing thermal EMF-induced errors is possible if judicious attention is given to circuit board layout and component selection. It is good practice to minimize the
Figure 1. Extra Resistors Cancel Thermal EMF
When connectors, switches, relays and/or sockets are necessary, they should be selected for low thermal EMF activity. The same techniques of thermally-balancing and coupling the matching junctions are effective in reducing the thermal EMF errors of these components.
Resistors are another source of thermal EMF errors. Table 1 shows the thermal EMF generated for different resistors. The temperature gradient across the resistor is important, not the ambient temperature. There are two junctions formed at each end of the resistor and if these junctions are at the same temperature, their thermal EMFs will cancel each other. The thermal EMF numbers are approximate and vary with resistor value. High values give higher thermal EMF.
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LTC1150
WUUU
APPLICATIO S I FOR ATIO
Table 1. Resistor Thermal EMF
RESISTOR TYPE THERMAL EMF/°C GRADIENT
Tin Oxide ~mV/°C
Carbon Composition ~450µV/°C
Metal Film ~20µV/°C
WireWound
Evenohm ~2µV/°C Manganin ~2µV/°C
PACKAGE-INDUCED OFFSET VOLTAGE
Package-induced thermal EMF effects are another impor­tant source of errors. It arises at the copper/kovar junctions formed when wire or printed circuit traces contact a package lead. Like all the previously mentioned thermal EMF effects, it is outside the LTC1150’s offset nulling loop and cannot be cancelled. Metal can H packages exhibit the worst warm-up drift. The input offset voltage specification of the LTC1150 is actually set by the package-induced warm-up drift rather than by the circuit itself. The thermal time constant ranges from 0.5 to 3 minutes, depending on package type.
ALIASING
Like all sampled data systems, the LTC1150 exhibits aliasing behavior at input frequencies near the sampling frequency. The LTC1150 includes a high-frequency correction loop which minimizes this effect; as a result, aliasing is not a problem for most applications.
LEVEL SHIFTING THE CLOCK
Level shifting is needed if the clock output of the LTC1150 in ±15V operation must interface to regular 5V logic circuits. Figures 2 and 3 show some typical level shifting circuits.
When operated from single 5V or ±5V supplies, the LTC1150 clock output at Pin 8 can interface to TTL or CMOS inputs directly.
LOW SUPPLY OPERATION
The minimum supply for proper operation of the LTC1150 is typically below 4.0V (±2.0V). In single supply applica­tions, PSRR is guaranteed down to 4.7V (±2.35V) to ensure proper operation down to the minimum TTL specified voltage of 4.75V.
15V
10k
7
2
8
LTC1150
3
+
–15V
Figure 2. Output Level Shift (Option 1)
6
4
10k
5V
LOGIC
CIRCUIT
LTC1150 • AI02
For a complete discussion of the correction circuitry and aliasing behavior, please refer to the LTC1051/53 data sheet.
SYNCHRONIZATION OF MULTIPLE LTC115O’S
When synchronization of several LTC1150’s is required, one of the LTC1150’s can be used to provide the “master” clock to control over 100 “slave” LTC1150’s. The master clock, coming from Pin 8 of the master LTC1150, can directly drive Pin 5 of the slaves. Note that Pin 8 of the slave LTC1150’s will be pulled up to V
S.
If all the LTC1150’s are to be synchronized with an external clock, then the external clock should drive Pin 5 of all the LTC1150’s.
10
15V
2
LTC1150
3
+
–15V
Figure 3. Output Level Shift (Option 2)
100pF
7
8
6
4
10k
GND
10k
5V5V
LOGIC
CIRCUIT
LTC1150 • AI03
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TYPICAL APPLICATIO S
LTC1150
U
Low Level Photodetector
15pF
SINGLE
POINT
SENSE
GROUND
HP 5082-4204
15V
7
2
LTC1150
3
+
4
–15V
1M
+
V
LTC1150
+
7
6
4
2
I
P
3
Ground Force Reference
1k
15V
1000pF
6
LT1010
–15V
10k
10
OUTPUT = I
LTC1150 • TA03
• 109Ω
P
FORCED GROUND
APPLICATION: TO FORCE TWO GROUND POINTS IN A SYSTEM WITHIN 5µV
LTC1150 • TA04
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LTC1150
TYPICAL APPLICATIO S
10
10
U
Paralleling to Improve Noise
10k
LTC1150
10k
+
10k
LTC1150
10k 25k
+
10k
CLK IN
MEASURED NOISE
CLK FREE RUN
CLK DRIVEN 1800Hz
10Hz = 700nV 1Hz = 200nV
10Hz = 360nV 1Hz = 160nV
VOS = 1.1µV
P-P
P-P
VOS = 10µV
P-P
P-P
10
IN
10
LTC1150
+
10k
LTC1150
10k
10k
LTC1150
+
V
OUT
= 10k V
IN
+
LTC1150 • TA05
Battery Discharge Monitor
OPEN AT t = 0
C
+
R2
2
LOAD
LTC1150
3
+
I
ERROR +
R1
V
5µV
IR1
6
OUT
–IR1
= t
R2C
30pAIR2
R1
12
LTC1150 • TA06
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Page 13
PACKAGE DESCRIPTIO
LTC1150
U
J8 Package
8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
CORNER LEADS OPTION
(4 PLCS)
.023 – .045
(0.584 – 1.143)
HALF LEAD
.045 – .068
(1.143 – 1.650)
FULL LEAD
OPTION
.300 BSC
(7.62 BSC)
.008 – .018
(0.203 – 0.457)
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE OR TIN PLATE LEADS
0° – 15°
OPTION
OBSOLETE PACKAGE
.005
(0.127)
MIN
.025
(0.635)
RAD TYP
.045 – .065
(1.143 – 1.651)
.014 – .026
(0.360 – 0.660)
.405
(10.287)
MAX
87
12
65
3
4
.220 – .310
(5.588 – 7.874)
.015 – .060
(0.381 – 1.524)
.100
(2.54)
BSC
.200
(5.080)
MAX
.125
3.175 MIN
J8 0801
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Page 14
LTC1150
PACKAGE DESCRIPTIO
U
N8 Package
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510)
.255 ± .015*
(6.477 ± 0.381)
.400*
(10.160)
MAX
87 6
5
12
.300 – .325
(7.620 – 8.255)
.065
(1.651)
.008 – .015
(0.203 – 0.381)
+.035
.325
–.015 +0.889
8.255
()
–0.381
NOTE:
1. DIMENSIONS ARE
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
INCHES
MILLIMETERS
TYP
.045 – .065
(1.143 – 1.651)
.100
(2.54)
BSC
3
4
.130 ± .005
(3.302 ± 0.127)
.120
(3.048)
MIN
.018 ± .003
(0.457 ± 0.076)
.020
(0.508)
MIN
N8 1002
14
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Page 15
PACKAGE DESCRIPTIO
.050 BSC
N
U
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
.189 – .197
.045 ±.005
(4.801 – 5.004)
7
8
NOTE 3
6
LTC1150
5
.245 MIN
123 N/2
.030 ±.005
TYP
RECOMMENDED SOLDER PAD LAYOUT
.010 – .020
(0.254 – 0.508)
.008 – .010
(0.203 – 0.254)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
× 45°
.016 – .050
(0.406 – 1.270)
INCHES
(MILLIMETERS)
.160 ±.005
.228 – .244
(5.791 – 6.197)
.053 – .069
(1.346 – 1.752)
0°– 8° TYP
.014 – .019
(0.355 – 0.483)
TYP
N
.150 – .157
(3.810 – 3.988)
N/2
1
3
2
NOTE 3
4
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
SO8 0502
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen­tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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Page 16
LTC1150
TYPICAL APPLICATIO
U
DC Stabilized, Low Noise Amplifier
15V
INPUT
3
2
100k
+
LTC1150
4
–15V
0.01µF
130
7
6
15V
1
3
+
LT1028
2
–15V
68
7
8
6
4
15V
OUTPUT
10k
(A = 1000)
10
LTC1150 • TA07
16
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
www.linear.com
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LW/TP 1202 1K REV B • PRINTED IN USA
LINEAR TE CHNO LOG Y CO RPORATION 1991
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