The LT®1964 is a micropower low noise, low dropout negative regulator. The device is capable of supplying 200mA
of output current with a dropout voltage of 340mV. Low
quiescent current (30μA operating and 3μA shutdown)
makes the LT1964 an excellent choice for battery-powered applications. Quiescent current is well controlled in
dropout.
Other features of the LT1964 include low output noise.
With the addition of an external 0.01μF bypass capacitor,
output noise is reduced to 30μV
bandwidth. The LT1964 is capable of operating with small
capacitors and is stable with output capacitors as low
as 1μF. Small ceramic capacitors can be used without
the necessary addition of ESR as is common with other
regulators. Internal protection circuitry includes reverse
output protection, current limiting, and thermal limiting.
The device is available with a fi xed output voltage of –5V
and as an adjustable device with a –1.22V reference voltage. The LT1964 regulators are available in a low profi le
(1mm) ThinSOT and the low profi le (0.75mm) 8-pin
(3mm × 3mm) DFN packages.
L, LT, LTC and LTM are registered trademarks of Linear Technology Corporation. ThinSOT is
a trademark of Linear Technology Corporation. All other trademarks are the property of their
respective owners.
over a 10Hz to 100kHz
RMS
TYPICAL APPLICATION
–5V Low Noise Regulator
V
IN
–5.4V
TO –20V
1μF
GND
SHDNBYP
LT1964-5
IN
OUT
10μF
0.01μF
–5V AT 200mA
NOISE
30μV
RMS
1964 TA01a
V
OUT
100μV/DIV
10Hz to 100kHz Output Noise
1ms/DIV
1964 TA01b
30μV
RMS
1964fb
1
Page 2
LT1964
S
N
ABSOLUTE MAXIMUM RATINGS
(Note 1)
IN Pin Voltage ........................................................ ±20V
OUT Pin Voltage (Note 11) ......................................±20V
OUT to IN Differential Voltage (Note 11) ........ –0.5V, 20V
ADJ Pin Voltage
(with Respect to IN Pin) (Note 11) ............. –0.5V, 20V
BYP Pin Voltage
(with Respect to IN Pin) ..................................... ±20V
SHDN Pin Voltage
(with Respect to IN Pin) (Note 11) ............. –0.5V, 35V
PIN CONFIGURATION
SHDN Pin Voltage
(with Respect to GND Pin) ..........................–20V, 15V
EXPOSED PAD (PIN 9) IS IN, MUST BE SOLDERED TO PCB
LT1964-BYPLT1964-5
GND 1
IN 2
BYP 3
5-LEAD PLASTIC SOT-23
T
= 150°C, θJA ≈125°C/W to 250°C/W
JMAX
SEE THE APPLICATIONS INFORMATION SECTION
9
DD PACKAGE
(NOTE 13)
TOP VIEW
S5 PACKAGE
(NOTE 13)
8
7
6
5
5 OUT
4 ADJ
IN
GND
BYP
LT1964-SD
TOP VIEW
GND 1
IN 2
SHDN 3
S5 PACKAGE
5-LEAD PLASTIC SOT-23
T
= 150°C, θJA ≈125°C/W to 250°C/W
JMAX
SEE THE APPLICATIONS INFORMATION SECTION
GND 1
BYP 3
T
JMAX
SEE THE APPLICATIONS INFORMATION SECTION
(NOTE 13)
TOP VIEW
IN 2
S5 PACKAGE
5-LEAD PLASTIC SOT-23
= 150°C, θJA ≈125°C/W to 250°C/W
(NOTE 13)
5 OUT
4 ADJ
5 OUT
4 SHD
ORDER INFORMATION
LEAD FREE FINISHTAPE AND REELPART MARKING*PACKAGE DESCRIPTIONTEMPERATURE RANGE
LT1964ES5-SD#PBFLT1964ES5-SD#TRPBFLTVX5-Lead Plastic SOT-23–40°C to 125°C
LT1964ES5-BYP#PBFLT1964ES5-BYP#TRPBFLTVY5-Lead Plastic SOT-23–40°C to 125°C
LT1964ES5-5#PBFLT1964ES5-5#TRPBFLTVZ5-Lead Plastic SOT-23–40°C to 125°C
LT1964EDD#PBFLT1964EDD#TRPBFLDVM
8-Lead (3mm × 3mm) Plastic DFN
–40°C to 125°C
LT1964IS5-SD#PBFLT1964IS5-SD#TRPBFLTVX5-Lead Plastic SOT-23–40°C to 125°C
LT1964IS5-BYP#PBFLT1964IS5-BYP#TRPBFLTVY5-Lead Plastic SOT-23–40°C to 125°C
LT1964IS5-5#PBFLT1964IS5-5#TRPBFLTVZ5-Lead Plastic SOT-23–40°C to 125°C
LT1964IDD#PBFLT1964IDD#TRPBFLDVM
8-Lead (3mm × 3mm) Plastic DFN
–40°C to 125°C
1964fb
2
Page 3
LT1964
ORDER INFORMATION
LEAD BASED FINISHTAPE AND REELPART MARKING*PACKAGE DESCRIPTIONTEMPERATURE RANGE
LT1964ES5-SDLT1964ES5-SD#TRLTVX5-Lead Plastic SOT-23–40°C to 125°C
LT1964ES5-BYPLT1964ES5-BYP#TRLTVY5-Lead Plastic SOT-23–40°C to 125°C
LT1964ES5-5LT1964ES5-5#TRLTVZ5-Lead Plastic SOT-23–40°C to 125°C
LT1964EDDLT1964EDD#TRLDVM
8-Lead (3mm × 3mm) Plastic DFN
LT1964IS5-SDLT1964IS5-SD#TRLTVX5-Lead Plastic SOT-23–40°C to 125°C
LT1964IS5-BYPLT1964IS5-BYP#TRLTVY5-Lead Plastic SOT-23–40°C to 125°C
LT1964IS5-5LT1964IS5-5#TRLTVZ5-Lead Plastic SOT-23–40°C to 125°C
LT1964IDDLT1964IDD#TRLDVM
8-Lead (3mm × 3mm) Plastic DFN
Consult LTC Marketing for parts specifi ed with wider operating temperature ranges. *The temperature grade is identifi ed by a label on the shipping container.
For more information on lead free part marking, go to:
For more information on tape and reel specifi cations, go to:
ELECTRICAL CHARACTERISTICS
The l denotes the specifi cations which apply over the full operating
http://www.linear.com/leadfree/
http://www.linear.com/tapeandreel/
temperature range, otherwise specifi cations are at TA = 25°C.
PARAMETERCONDITIONSMINTYPMAXUNITS
Regulated Output Voltage
(Notes 3, 9)
ADJ Pin Voltage
(Notes 2, 3, 9)
LT1964-5 V
–20V < V
LT1964 VIN = –2V, I
–20V < V
= –5.5V, I
IN
Line RegulationLT1964-5 ΔVIN = –5.5V to –20V, I
LT1964 (Note 2) ΔV
= –2.8V to –20V, I
IN
Load RegulationLT1964-5 VIN = –6V, ΔI
V
= –6V, ΔI
IN
LT1964 VIN = –2.8V, ΔI
Dropout Voltage
VIN = V
OUT(NOMINAL)
(Notes 4, 5)
GND Pin Current
V
= V
IN
OUT(NOMINAL)
(Notes 4, 6)
V
= –1mA
I
LOAD
I
= –1mA
LOAD
I
= –10mA
LOAD
I
= –10mA
LOAD
I
= –100mA
LOAD
I
= –100mA
LOAD
I
= –200mA
LOAD
I
= –200mA
LOAD
= 0mA
I
LOAD
I
= –1mA
LOAD
I
= –10mA
LOAD
I
= –100mA
LOAD
I
= –200mA
LOAD
= –2.8V, ΔI
IN
= –1mA
LOAD
< –6V, –200mA < I
IN
= –1mA
LOAD
< –2.8V, –200mA < I
IN
LOAD
LOAD
= –1mA to –200mA
LOAD
= –1mA to –200mA
LOAD
= –1mA to –200mA
LOAD
= –1mA to –200mA
LOAD
LOAD
LOAD
= –1mA
= –1mA
< –1mA
< –1mA
–4.925
l
–4.850–5–5
–1.202
l
–1.184
l
l
l
l
l
l
l
l
l
l
l
l
l
–40°C to 125°C
–40°C to 125°C
–5.075
–5.150
–1.22
–1.22
15
–1.238
–1.256
50
1
12
1535
50
2715mV
0.10.15
0.19
0.150.20
0.25
0.260.33
0.39
0.340.42
0.49
30
85
300
1.3
2.5
70
180
600
3
6
mV
mV
mV
mV
mV
μA
μA
μA
mA
mA
V
V
V
V
V
V
V
V
V
V
V
V
1964fb
3
Page 4
LT1964
ELECTRICAL CHARACTERISTICS
The l denotes the specifi cations which apply over the full operating
= 0.01μF, I
BYP
= 0V
LOAD
= 0V
, V
ADJ
= 25°C.
A
RIPPLE
= –200mA
–1.5V, ΔV
, V
SHDN
= –200mA, BW = 10Hz to 100kHz30μV
LOAD
l
l
l
l
l
0.25
–0.25
l
–1.9
–1.6
1.6
–1.9
0.8
–0.8
–2.8
–2.2
2.1
–2.8
–1±0.1
6
–3
= 0.5V
P-P
l
,
46 54dB
310 μA
350mA
= 0.1V
OUT
= Open Circuit
l220
l
RMS
1
15
–9
mA
1mA
temperature range, otherwise specifi cations are at T
Output Voltage NoiseC
ADJ Pin Bias Current(Notes 2, 7)30100nA
Minimum Input Voltage (Note 12)
I
= –200mA
LOAD
Shutdown ThresholdV
SHDN Pin Current (Note 8)V
Quiescent Current in ShutdownV
Ripple RejectionV
Current LimitV
Input Reverse Leakage CurrentV
= 10μF, C
OUT
LT1964-BYP
LT1964-SD
= Off to On (Positive)
OUT
V
= Off to On (Negative)
OUT
V
= On to Off (Positive)
OUT
V
= On to Off (Negative)
OUT
= 0V
SHDN
V
= 15V
SHDN
V
= –15V
SHDN
= –6V, V
IN
IN
f
RIPPLE
IN
V
IN
IN
– V
OUT
= 120Hz, I
= –6V, V
= V
OUT(NOMINAL)
= 20V, V
SHDN
= –1.5V(Avg), V
OUT
OUT
V
V
V
V
V
V
μA
μA
μA
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime
Note 2: The LT1964 (adjustable version) is tested and specifi ed for these
conditions with the ADJ pin connected to the OUT pin.
Note 3: Operating conditions are limited by maximum junction
temperature. The regulated output voltage specifi cation will not apply
for all possible combinations of input voltage and output current. When
operating at maximum input voltage, the output current range must be
limited. When operating at maximum output current, the input voltage
range must be limited.
Note 4: To satisfy requirements for minimum input voltage, the LT1964
(adjustable version) is tested and specifi ed for these conditions with an
external resistor divider (two 249k resistors) for an output voltage of
–2.44V. The external resistor divider will add a 5μA DC load on the output.
Note 5: Dropout voltage is the minimum input to output voltage differential
needed to maintain regulation at a specifi ed output current. In dropout, the
output voltage will be equal to: (V
Note 6: GND pin current is tested with V
IN
+ V
DROPOUT
= V
IN
).
OUT(NOMINAL)
and a current
source load. This means the device is tested while operating in its dropout
region. This is the worst-case GND pin current. The GND pin current will
decrease slightly at higher input voltages.
Note 7: ADJ pin bias current fl ows out of the ADJ pin.
Note 8: Positive SHDN pin current fl ows into the SHDN pin. SHDN pin
current is included in the GND pin current specifi cation.
Note 9: For input-to-output differential voltages greater than 7V, a 50μA
load is needed to maintain regulation.
Note 10: The LT1964 is tested and specifi ed under pulse load conditions
such that T
≅ TA. The LT1964E is tested at TA = 25°C. Performance at
J
–40°C to 125°C is assured by design, characterization and correlation with
statistical process controls. The LT1964I is guaranteed over the full –40°C
to 125°C operating junction temperature range.
Note 11: A parasitic diode exists internally on the LT1964 between the
OUT, ADJ and SHDN pins and the IN pin. The OUT, ADJ and SHDN pins
cannot be pulled more than 0.5V more negative than the IN pin during
fault conditions, and must remain at a voltage more positive than the IN
pin during operation.
Note 12: For the LT1964-BYP, this specifi cation accounts for the operating
threshold of the SHDN pin, which is tied to the IN pin internally. For the
LT1964-SD, the SHDN threshold must be met to ensure device operation.
Note 13: Actual thermal resistance (θ
) junction to ambient will be a
JA
function of board layout. See the Thermal Considerations section in the
Applications Information.
4
1964fb
Page 5
TYPICAL PERFORMANCE CHARACTERISTICS
Typical Dropout VoltageGuaranteed Dropout VoltageDropout Voltage
500
450
400
350
300
250
200
150
DROPOUT VOLTAGE (mV)
100
50
0
–40–80–120–160–200
0
OUTPUT CURRENT (mA)
TJ = 125°C
TJ = 25°C
Quiescent Current
–50
VIN = –6V
–45
= 250k (∞ FOR LT1964-5)
R
L
= –5μA (0 FOR LT1964-5)
I
–40
L
–35
V
V
SHDN
SHDN
= V
= 0V
–30
–25
–20
–15
QUIESCENT CURRENT (μA)
–10
–5
0
–50 –250255075100 125
TEMPERATURE (°C)
500
= TEST POINT
450
1964 G01
400
350
300
250
200
150
DROPOUT VOLTAGE (mV)
100
50
0
TJ ≤ 125°C
TJ ≤ 25°C
–40–80–120–160–200
0
OUTPUT CURRENT (mA)
1964 G02
LT1964-5
Output VoltageLT1964 ADJ Pin Voltage
–5.12
IL = –1mA
–5.09
–5.06
IN
1964 G04
–5.03
–5.00
–4.97
OUTPUT VOLTAGE (V)
–4.94
–4.91
–4.88
–50 –250255075100 125
TEMPERATURE (°C)
1964 G05
500
450
400
350
300
250
200
150
DROPOUT VOLTAGE (mV)
100
50
0
–50 –250255075100 125
–1.240
–1.235
–1.230
–1.225
–1.220
–1.215
ADJ PIN VOLTAGE (V)
–1.210
–1.205
–1.200
–50 –250255075100 125
IL = –1mA
LT1964
IL = –200mA
IL = –100mA
IL = –50mA
IL = –10mA
IL = –1mA
TEMPERATURE (°C)
TEMPERATURE (°C)
1964 G03
1964 G06
LT1964-5
Quiescent CurrentLT1964 Quiescent Current
–40
TJ = 25°C
–35
= ∞
R
L
–30
–25
–20
–15
–10
QUIESCENT CURRENT (μA)
–5
–0
0 –1 –2 –3 –4 –5 –6 –7 –8 –9 –10
INPUT VOLTAGE (V)
V
V
SHDN
SHDN
= V
= 0V
IN
1964 G07
–40
TJ = 25°C
–35
= 250k
R
L
= –5μA
I
L
–30
–25
–20
–15
–10
QUIESCENT CURRENT (μA)
–5
–0
0 –1 –2 –3 –4 –5 –6 –7 –8 –9 –10
INPUT VOLTAGE (V)
V
V
SHDN
SHDN
= V
= 0V
IN
1964 G08
LT1964-5
GND Pin Current
–3.0
TJ = 25°C
= V
V
SHDN
*FOR V
IN
= –5V
OUT
INPUT VOLTAGE (V)
–2.5
–2.0
–1.5
–1.0
GND PIN CURRENT (mA)
–0.5
0
0 –1 –2 –3 –4 –5 –6 –7 –8 –9 –10
RL = 25
I
L
RL = 50
I
L
RL = 100
I
L
RL = 500
I
L
= –200mA*
= –100mA*
= –50mA*
= –10mA*
1964 G09
1964fb
5
Page 6
LT1964
TYPICAL PERFORMANCE CHARACTERISTICS
LT1964 GND Pin CurrentGND Pin Current vs I
–3.0
TJ = 25°C; V
–2.5
–2.0
–1.5
–1.0
GND PIN CURRENT (mA)
–0.5
0
0 –1 –2 –3 –4 –5 –6 –7 –8 –9 –10
= VIN; *FOR V
SHDN
RL = 6.1Ω
= –200mA*
I
L
RL = 12.2Ω
= –100mA*
I
L
RL = 24.4Ω
= –50mA*
I
L
RL = 122Ω
= –10mA*
I
L
INPUT VOLTAGE (V)
OUT
= –1.22V
1964 G10
–4.0
VIN = V
–3.5
–3.0
–2.5
–2.0
–1.5
GND PIN CURRENT (mA)
–1.0
–0.5
0
OUT(NOMINAL)
0–40–80–120–160–200
OUTPUT CURRENT (mA)
LOAD
– 1V
TJ = –50°C
TJ = 25°C
TJ = 125°C
1964 G11
SHDN Pin Thresholds
2.5
2.0
1.5
1.0
0.5
0
–0.5
–1.0
SHDN PIN VOLTAGE (V)
–1.5
–2.0
–2.5
–50 –250255075100 125
TEMPERATURE (°C)
SHDN Pin Input CurrentSHDN Pin Input CurrentADJ Pin Bias Current
10
TJ = 25°C
8
POSITIVE CURRENT
6
FLOWS INTO THE PIN
4
2
0
–2
–4
–6
SHDN PIN INPUT CURRENT (μA)
–8
–10
–8 –6 –4 –2 02 4 6810
–10
SHDN PIN VOLTAGE (V)
1964 G13
12
9
6
3
0
–3
SHDN PIN INPUT CURRENT (μA)
–6
–9
–50 –250255075100 125
VIN = –15V
POSITIVE CURRENT
FLOWS INTO THE PIN
V
= 15V
SHDN
V
= –15V
SHDN
TEMPERATURE (°C)
1964 G14
–70
–60
–50
–40
–30
–20
ADJ PIN BIAS CURRENT (nA)
–10
0
–50 –250255075100 125
TEMPERATURE (°C)
ON
OFF
ON
1964 G12
1964 G15
6
1964fb
Page 7
TYPICAL PERFORMANCE CHARACTERISTICS
Current LimitCurrent LimitInput Ripple Rejection
–600
ΔV
= 100mV
OUT
–500
–400
–300
–200
CURRENT LIMIT (mA)
–100
0
0
–4–8–12–16–20
INPUT/OUTPUT DIFFERENTIAL (V)
1964 G16
–600
VIN = –7V
= 0V
V
OUT
–500
–400
–300
–200
CURRENT LIMIT (mA)
–100
0
–50 –250255075100 125
TEMPERATURE (°C)
1964 G17
80
IL = –200mA
= V
V
IN
70
50mV
= 0
C
BYP
60
50
40
30
RIPPLE REJECTION (dB)
20
10
0
101001k10k100k1M
OUT(NOMINAL)
RIPPLE
RMS
FREQUENCY (Hz)
LT1964
– 1V +
C
= 10μF
OUT
C
= 1μF
OUT
1964 G18
Input Ripple Rejection
60
VIN = V
58
56
54
52
50
RIPPLE REJECTION (dB)
48
46
44
–50 –250255075100 125
OUT(NOMINAL)
0.5V
= –200mA
I
L
– 1V +
RIPPLE AT f = 120Hz
P-P
TEMPERATURE (°C)
1964 G19
LT1964-BYP
Minimum Input Voltage
–3.0
–2.5
–2.0
IL = –200mA
–1.5
IL = –1mA
–1.0
NOTE: THE MINIMUM INPUT VOLTAGE
ACCOUNTS FOR THE OPERATING
MINIMUM INPUT VOLTAGE (V)
–0.5
THRESHOLD OF THE SHDN PIN WHICH
IS TIED TO THE IN PIN INTERNALLY
0
–50 –250255075100 125
TEMPERATURE (°C)
1964 G20
LT1964, LT1964-SD
Minimum Input Voltage
–3.0
–2.5
–2.0
IL = –200mA
–1.5
–1.0
NOTE: THE SHDN PIN THRESHOLD
MINIMUM INPUT VOLTAGE (V)
–0.5
MUST BE MET TO ENSURE
DEVICE OPERATION
0
–50 –250255075100 125
TEMPERATURE (°C)
IL = –1mA
1964 G21
1964fb
7
Page 8
LT1964
TYPICAL PERFORMANCE CHARACTERISTICS
Load RegulationOutput Noise Spectral Density
30
IL = –1mA TO –200mA
25
20
15
10
LOAD REGULATION (mV)
5
0
LT1964-5
LT1964
–50 –250255075100 125
TEMPERATURE (°C)
1964 G22
10
C
= 1000pF C
BYP
1
0.1
C
= 0.01μF
BYP
C
= 10μF
OUT
= 200mA
I
L
OUTPUT NOISE SPECTRAL DENSITY (μV/√Hz)
0.01
101k10k100k
100
FREQUENCY (Hz)
BYP
= 100pF
C
= 0
BYP
LT1964-5
LT1964
1964 G23
RMS Output Noise vs Bypass
Capacitor
140
120
)
100
RMS
80
60
40
OUTPUT NOISE (μV
20
LT1964-5
LT1964
0
10
1001k10k
C
OUT
I
L
f = 10Hz TO 100kHz
C
(pF)
BYP
= 10μF
= –200mA
1964 G24
RMS Output Noise vs Load
Current
140
C
= 10μF
OUT
120
)
100
RMS
80
60
40
OUTPUT NOISE (μV
20
0
–0.01
C
= 0
BYP
–1–10–1k–0.1–100
LOAD CURRENT (mA)
C
BYP
LT1964-5
LT1964
LT1964-5
LT1964
= 0.01μF
1964 G25
V
OUT
200μV/DIV
LT1964-5, 10Hz to 100kHz Output
Noise, C
= 10μF
OUT
= –200mA
I
LOAD
BYP
= 0
1ms/DIVC
1964 G26
V
OUT
100μV/DIV
LT1964-5, 10Hz to 100kHz Output
Noise, C
= 10μF
OUT
= –200mA
I
LOAD
= 100pF
BYP
1ms/DIVC
1964 G27
8
1964fb
Page 9
LT1964
LT1964-5, 10Hz to 100kHz Output
Noise, C
V
OUT
100μV/DIV
I
LOAD
LT1964-5, Transient Response,
C
0.2
0.1
0
–0.1
DEVIATION (V)
OUTPUT VOLTAGE
–0.2
OUT
BYP
BYP
= 10μF
= –200mA
= 0
= 1000pF
1ms/DIVC
VIN = –6V
= 10μF
C
IN
= 10μF
C
OUT
1964 G28
LT1964-5, 10Hz to 100kHz Output
Noise, C
V
OUT
100μV/DIV
OUT
I
LOAD
LT1964-5, Transient Response,
C
BYP
0.04
0.02
0
–0.02
DEVIATION (V)
OUTPUT VOLTAGE
–0.04
BYP
= 10μF
= –200mA
= 0.01μF
= 0.01μF
1ms/DIVC
VIN = –6V
= 10μF
C
IN
= 10μF
C
OUT
1964 G29
0
–100
(mA)
–200
LOAD CURRENT
0
400800120016002000
TIME (μs)
1964 G30
0
–100
(mA)
–200
LOAD CURRENT
0
40801201602060100140180 200
TIME (μs)
1964 G31
1964fb
9
Page 10
LT1964
PIN FUNCTIONS
ADJ (Adjustable Devices only): For the Adjustable LT1964,
this is the Input to the Error Amplifi er. The ADJ pin has a
bias current of 30nA that fl ows out of the pin. The ADJ pin
voltage is –1.22V referenced to ground, and the output
voltage range is –1.22V to –20V. A parasitic diode exists
between the ADJ pin and the input of the LT1964. The ADJ
pin cannot be pulled more negative than the input during
normal operation, or more than 0.5V more negative than
the input during a fault condition.
BYP: The BYP Pin is used to Bypass the Reference of
the LT1964 to Achieve Low Noise Performance from the
Regulator. A small capacitor from the output to this pin
will bypass the reference to lower the output voltage noise.
A maximum value of 0.01μF can be used for reducing
output voltage noise to a typical 30μV
to 100kHz bandwidth. If not used, this pin must be left
unconnected.
Exposed Pad (DFN Package Only): IN. Connect to IN
(Pins 7, 8) at the PCB.
GND: Ground.
IN: Power is Supplied to the Device Through the Input Pin.
A bypass capacitor is required on this pin if the device
is more than six inches away from the main input fi lter
capacitor. In general, the output impedance of a battery
rises with frequency, so it is advisable to include a bypass
capacitor in battery-powered circuits. A bypass capacitor
in the range of 1μF to 10μF is suffi cient.
over a 10Hz
RMS
OUT: The Output Supplies Power to the Load. A minimum
output capacitor of 1μF is required to prevent oscillations.
Larger output capacitors will be required for applications
with large transient loads to limit peak voltage transients.
A parasitic diode exists between the output and the input.
The output cannot be pulled more negative than the input
during normal operation, or more than 0.5V below the input
during a fault condition. See the Applications Information
section for more information on output capacitance and
reverse output characteristics.
SHDN: The SHDN Pin is used to put the LT1964 into a Low
Power Shutdown State. The SHDN pin is referenced to
the GND pin for regulator control, allowing the LT1964 to
be driven by either positive or negative logic. The output
of the LT1964 will be off when the SHDN pin is pulled
within ±0.8V of GND. Pulling the SHDN pin more than
–1.9V or +1.6V will turn the LT1964 on. The SHDN pin
can be driven by 5V logic or open collector logic with a
pull-up resistor. The pull-up resistor is required to supply
the pull-up current of the open collector gate, normally
several microamperes, and the SHDN pin current, typically 3μA out of the pin (for negative logic) or 6μA into
the pin (for positive logic). If unused, the SHDN pin must
be connected to V
SHDN pin is open circuit. For the LT1964-BYP, the SHDN
pin is internally connected to V
between the SHDN pin and the input of the LT1964. The
SHDN pin cannot be pulled more negative than the input
during normal operation, or more than 0.5V below the
input during a fault condition.
. The device will be shut down if the
IN
. A parasitic diode exists
IN
10
1964fb
Page 11
APPLICATIONS INFORMATION
LT1964
The LT1964 is a 200mA negative low dropout regulator with
micropower quiescent current and shutdown. The device
is capable of supplying 200mA at a dropout voltage of
340mV. Output voltage noise can be lowered to 30μV
RMS
over a 10Hz to 100kHz bandwidth with the addition of a
0.01μF reference bypass capacitor. Additionally, the reference bypass capacitor will improve transient response of
the regulator, lowering the settling time for transient load
conditions. The low operating quiescent current (30μA)
drops to 3μA in shutdown. In addition to the low quiescent current, the LT1964 incorporates several protection
features which make it ideal for use in battery-powered
systems. In dual supply applications where the regulator
load is returned to a positive supply, the output can be
pulled above ground by as much as 20V and still allow
the device to start and operate.
Adjustable Operation
The adjustable version of the LT1964 has an output voltage range of –1.22V to –20V. The output voltage is set by
the ratio of two external resistors as shown in Figure 1.
The device servos the output to maintain the voltage at
the ADJ pin at –1.22V referenced to ground. The current
in R1 is then equal to –1.22V/R1 and the current in R2 is
the current in R1 plus the ADJ pin bias current. The ADJ
pin bias current, 30nA at 25°C, fl ows through R2 out of
the ADJ pin. The output voltage can be calculated using
R1
ADJ
R2
)(R2)
+
V
OUT
1964 F01
GND
IN
ADJ
LT1964
OUT
R2
R1
V
IN
= –1.22V(1 + ) – (I
V
OUT
V
= –1.22V
ADJ
I
= 30nA AT 25°C
ADJ
OUTPUT RANGE = –1.22V TO –20V
Figure 1. Adjustable Operation
the formula in Figure 1. The value of R1 should be less
than 250k to minimize errors in the output voltage caused
by the ADJ pin bias current. Note that in shutdown the
output is turned off and the divider current will be zero.
Curves of ADJ Pin Voltage vs Temperature and ADJ Pin Bias
Current vs Temperature appear in the Typical Performance
Characteristics section.
The adjustable device is tested and specifi ed with the ADJ
pin tied to the OUT pin and a 5μA DC load (unless otherwise
specifi ed) for an output voltage of –1.22V. Specifi cations
for output voltages greater than –1.22V will be proportional to the ratio of the desired output voltage to –1.22V;
/ –1.22V). For example, load regulation for an output
(V
OUT
current change of 1mA to 200mA is 2mV typical at V
–1.22V. At V
= –12V, load regulation is:
OUT
OUT
=
(–12V/–1.22V) • (2mV) = 19.6mV
Bypass Capacitance and Low Noise Performance
The LT1964 may be used with the addition of a bypass
capacitor from V
to the BYP pin to lower output voltage
OUT
noise. A good quality low leakage capacitor is recommended. This capacitor will bypass the reference of the
LT1964, providing a low frequency noise pole. The noise
pole provided by this bypass capacitor will lower the output voltage noise to as low as 30μV
with the addition
RMS
of a 0.01μF bypass capacitor. Using a bypass capacitor
has the added benefi t of improving transient response.
With no bypass capacitor and a 10μF output capacitor, a
–10mA to –200mA load step will settle to within 1% of
its fi nal value in less than 100μs. With the addition of a
0.01μF bypass capacitor, the output will stay within 1%
for the same –10mA to –200mA load step (see LT1964-5
Transient Response in the Typical Characteristics section).
However, regulator start-up time is proportional to the size
of the bypass capacitor.
Higher values of output voltage noise may be measured
if care is not exercised with regard to circuit layout and
testing. Crosstalk from nearby traces can induce unwanted
noise onto the output of the LT1964-X.
1964fb
11
Page 12
LT1964
APPLICATIONS INFORMATION
Output Capacitance and Transient Response
The LT1964 is designed to be stable with a wide range
of output capacitors. The ESR of the output capacitor
affects stability, most notably with small capacitors. A
minimum output capacitor of 1μF with an ESR of 3Ω or
less is recommended to prevent oscillations. The LT1964
is a micropower device and output transient response
will be a function of output capacitance. Larger values
of output capacitance decrease the peak deviations and
provide improved transient response for larger load current
changes. Bypass capacitors, used to decouple individual
components powered by the LT1964, will increase the
effective output capacitor value.
Extra consideration must be given to the use of ceramic
capacitors. Ceramic capacitors are manufactured with a
variety of dielectrics, each with different behavior across
temperature and applied voltage. The most common
dielectrics used are specifi ed with EIA temperature characteristic codes of Z5U, Y5V, X5R and X7R. The Z5U and
Y5V dielectrics are good for providing high capacitances
in a small package, but they tend to have strong voltage
and temperature coeffi cients as shown in Figures 2 and 3.
When used with a 5V regulator, a 16V 10μF Y5V capacitor
can exhibit an effective value as low as 1μF to 2μF for the
DC bias voltage applied and over the operating temperature range. The X5R and X7R dielectrics result in more
stable characteristics and are more suitable for use as the
output capacitor. The X7R type has better stability across
temperature, while the X5R is less expensive and is available in higher values. Care still must be exercised when
using X5R and X7R capacitors; the X5R and X7R codes
only specify operating temperature range and maximum
capacitance change over temperature. Capacitance change
due to DC bias with X5R and X7R capacitors is better than
Y5V and Z5U capacitors, but can still be signifi cant enough
to drop capacitor values below appropriate levels. Capacitor DC bias characteristics tend to improve as component
case size increases, but expected capacitance at operating
voltage should be verifi ed.
Voltage and temperature coeffi cients are not the only
sources of problems. Some ceramic capacitors have a
piezoelectric response. A piezoelectric device generates
voltage across its terminals due to mechanical stress,
similar to the way a piezoelectric accelerometer or microphone works. For a ceramic capacitor the stress can be
induced by vibrations in the system or thermal transients.
The resulting voltages produced can cause appreciable
20
0
–20
–40
–60
CHANGE IN VALUE (%)
–80
–100
0
26
Figure 2. Ceramic Capacitor DC Bias Characteristics
40
20
0
–20
–40
–60
CHANGE IN VALUE (%)
–80
BOTH CAPACITORS ARE 16V,
1210 CASE SIZE, 10μF
–100
–50
–250
Figure 3. Ceramic Capacitor Temperature Characteristics
BOTH CAPACITORS ARE 16V,
1210 CASE SIZE, 10μF
X5R
Y5V
4
8
DC BIAS VOLTAGE (V)
TEMPERATURE (°C)
10
Y5V
50100 125
2575
12
X5R
14
16
1964 F02
1964 F03
12
1964fb
Page 13
APPLICATIONS INFORMATION
LT1964
amounts of noise, especially when a ceramic capacitor is
used for noise bypassing. A ceramic capacitor produced
Figure 4’s trace in response to light tapping from a pencil.
Similar vibration induced behavior can masquerade as
increased output voltage noise.
V
OUT
1mV/DIV
LT1964-5
= 10μF
C
OUT
= 0.01μF
C
BYP
= –200mA
I
LOAD
100ms/DIV
1964 F04
Figure 4. Noise Resulting from Tapping on a Ceramic Capacitor
Thermal Considerations
The power handling capability of the device will be limited
by the maximum rated junction temperature (125°C). The
power dissipated by the device will be made up of two
components:
1. Output current multiplied by the input/output voltage
differential: I
OUT
IN
– V
OUT
), and
• (V
2. Ground pin current multiplied by the input voltage:
GND
• V
IN
I
The GND pin current can be found by examining the GND
Pin Current curves in the Typical Performance Characteristics. Power dissipation will be equal to the sum of the
two components listed above.
For surface mount devices, heat sinking is accomplished
by using the heat spreading capabilities of the PC board
and its copper traces. Copper board stiffeners and plated
through-holes can also be used to spread the heat generated by power devices.
The following tables list thermal resistance for several
different board sizes and copper areas. All measurements
were taken in still air on 3/32" FR-4 board with one ounce
copper.
Table 1. SOT-23 Thermal Resistance
COPPER AREA
BOARD AREA
2
2500mm
1000mm
225mm
100mm
50mm
*Device is mounted on topside.
2
2
2
2
2500mm
2500mm
2500mm
2500mm
2500mm
2
2
2
2
2
2500mm
2500mm
2500mm
2500mm
2500mm
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)TOPSIDE*BACKSIDE
2
2
2
2
2
125°C/W
125°C/W
130°C/W
135°C/W
150°C/W
Table 2. DFN Thermal Resistance
COPPER AREA
BOARD AREA
2
2500mm
1000mm
225mm
100mm
*Device is mounted on topside.
2
2
2
2500mm
2500mm
2500mm
2500mm
2
2
2
2
2500mm
2500mm
2500mm
2500mm
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)TOPSIDE*BACKSIDE
2
2
2
2
40°C/W
45°C/W
50°C/W
62°C/W
The thermal resistance junction-to-case (θJC), measured
at Pin 2, is 60°C/W. for the SOT-23 package and is 16°C/W
measured at the backside of the exposed pad on the DFN
package
Calculating Junction Temperature
The LT1964 series regulators have internal thermal limiting
designed to protect the device during overload conditions.
For continuous normal conditions the maximum junction
temperature rating of 125°C must not be exceeded. It is
important to give careful consideration to all sources of
thermal resistance from junction to ambient. Additional
heat sources mounted nearby must also be considered.
Example: Given an output voltage of –5V, an input voltage
range of –6V to –8V, an output current range of 0mA to
–100mA, and a maximum ambient temperature of 50°C,
what will the maximum junction temperature be?
The power dissipated by the device will be equal to:
1964fb
13
Page 14
LT1964
APPLICATIONS INFORMATION
I
OUT(MAX)
where,
I
OUT(MAX)
V
IN(MAX)
I
GND
so,
P = –100mA • (–8V + 5V) + (–2mA • –8V) = 0.32W
The thermal resistance (junction to ambient) will be in the
range of 125°C/W to 150°C/W for the SOT-23 package
depending on the copper area. So the junction temperature
rise above ambient will be approximately equal to:
0.32W • 140°C/W = 44.2°C
The maximum junction temperature will then be equal to
the maximum junction temperature rise above ambient
plus the maximum ambient temperature or:
T
JMAX
Protection Features
The LT1964 incorporates several protection features
which make it ideal for use in battery-powered circuits.
In addition to the normal protection features associated
with monolithic regulators, such as current limiting and
thermal limiting, the device is protected against reverse
input voltages and reverse output voltages.
Current limit protection and thermal overload protection
are intended to protect the device against current overload
conditions at the output of the device. For normal operation,
the junction temperature should not exceed 125°C.
The output of the LT1964 can be pulled above ground
without damaging the device. If the input is left open circuit
or grounded, the output can be pulled above ground by
20V. For fi xed voltage versions, the output will act like a
large resistor, typically 500k or higher, limiting current fl ow
to less than 40μA. For adjustable versions, the output will
• (V
IN(MAX)
= –100mA
= –8V
at (I
= –100mA, VIN = –8V) = –2mA
OUT
= 50°C + 44.2°C = 94.2°C
– V
OUT
) + (I
GND
• V
IN(MAX)
)
act like an open circuit, no current will fl ow into the pin.
If the input is powered by a voltage source, the output
will sink the short-circuit current of the device and will
protect itself by thermal limiting. In this case, grounding
the SHDN pin will turn off the device and stop the output
from sinking the short-circuit current.
Like many IC power regulators, the LT1964 series have
safe operating area protection. The safe area protection
activates at input-to-output differential voltages greater
than –7V. The safe area protection decreases the current
limit as the input-to-output differential voltage increases
and keeps the power transistor inside a safe operating
region for all values of forward input to-output voltage.
The protection is designed to provide some output current
at all values of input-to-output voltage up to the device
breakdown. A 50μA load is required at input-to-output
differential voltages greater than –7V.
When power is fi rst turned on, as the input voltage rises,
the output follows the input, allowing the regulator to start
up into very heavy loads. During start-up, as the input
voltage is rising, the input-to-output voltage differential
is small, allowing the regulator to supply large output
currents. With a high input voltage, a problem can occur
wherein removal of an output short will not allow the
output voltage to fully recover. Other regulators, such as
the LT1175, also exhibit this phenomenon, so it is not
unique to the LT1964 series.
The problem occurs with a heavy output load when
the input voltage is high and the output voltage is low.
Common situations are immediately after the removal of
a short-circuit or when the SHDN pin is pulled high after
the input voltage has already been turned on. The load line
for such a load may intersect the output current curve at
two points. If this happens, there are two stable operating points for the regulator. With this double intersection,
the input supply may need to be cycled down to zero and
brought up again to make the output recover.
14
1964fb
Page 15
PACKAGE DESCRIPTION
0.62
MAX
3.85 MAX
2.62 REF
0.95
REF
S5 Package
5-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1635)
1.22 REF
1.50 – 1.75
1.4 MIN
2.80 BSC
(NOTE 4)
PIN ONE
2.90 BSC
(NOTE 4)
LT1964
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.20 BSC
DATUM ‘A’
0.30 – 0.50 REF
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
3.5 ±0.05
1.65 ±0.05
(2 SIDES)2.15 ±0.05
0.25 ± 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
2.38 ±0.05
(2 SIDES)
0.50
BSC
0.80 – 0.90
1.00 MAX
0.09 – 0.20
(NOTE 3)
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
0.675 ±0.05
PIN 1
PACKAGE
OUTLINE
TOP MARK
(NOTE 6)
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.95 BSC
3.00 ±0.10
(4 SIDES)
0.75 ±0.05
1.90 BSC
0.00 – 0.05
S5 TSOT-23 0302 REV B
R = 0.115
1.65 ± 0.10
(2 SIDES)
0.25 ± 0.05
BOTTOM VIEW—EXPOSED PAD
0.30 – 0.45 TYP
5 PLCS (NOTE 3)
0.01 – 0.10
TYP
2.38 ±0.10
(2 SIDES)
0.38 ± 0.10
85
14
0.50 BSC
(DD) DFN 1203
1964fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
Page 16
LT1964
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