Analog Devices EVAL-ADE7169F16EB, ADUM5230ARWZ, ADUM5230, ADE7100 Datasheet

Isolated Half-Bridge Driver

with Integrated High-Side Supply

ADuM5230

Rev. 0

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responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
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FEATURES

Integrated, isolated high-side supply
150 mW of secondary side power
Isolated high-side and low-side outputs
100 mA output source current, 300 mA output sink current
High common-mode transient immunity: >25 kV/μs
High temperature operation: 105°C
Adjustable power level
Wide body 16-lead SOIC package
Safety and regulatory approvals (pending)

UL recognition: 2500 V rms for 1 minute per UL1577

APPLICATIONS

MOSFET/IGBT gate drive
Plasma display modules
Motor drives
Power supplies
Solar panel inverters

GENERAL DESCRIPTION

The ADuM52301 is an isolated half-bridge gate driver that
employs Analog Devices, Inc., iCoupler® technology to provide
independent and isolated high-side and low-side outputs.
Combining CMOS and microtransformer technologies, this
isolation component contains an integrated dc-to-dc converter
providing an isolated high-side supply. This eliminates the cost,
space, and performance difficulties associated with external
supply configurations such as a bootstrap circuitry. This high­side isolated supply powers not only the ADuM5230 high-side
output but also any external buffer circuitry used with the
ADuM5230.

In comparison to gate drivers employing high voltage level
translation methodologies, the ADuM5230 offers the benefit
of true, galvanic isolation between the input and each output.
Each output can operate up to ±700 V

P

relative to the input,
thereby supporting low-side switching to negative voltages.
The differential voltage between the high-side and low-side
may be as high as 700 V

P

.

1

Protected by U.S. Patents 5,952,849; 6,873,065; 6,903,578; 7,075,329; other

pending patents.

FUNCTIONAL BLOCK DIAGRAM

07080-001

V

DD1

7

V

DDB

10

GND

1

8

V

OB

9

V

DD1

3

GND

ISO

14

V

ADJ

4

NC

13

V

IA

5

NC

12

DECODE

ENCODE

V

IB

6

GND

B

11

DECODEENCODE

1

V

OA

16

GND

1

GND

1

2

V

ISO

15

ISOLATED

DC/DC

CONVERTER

╓
╜

╓
╜

╓
╜

╓
╜

NC = NO CONNECT

ADuM5230

Figure 1.

ADuM5230

Rev. 0 | Page 2 of 16

TABLE OF CONTENTS

Features .............................................................................................. 1

Applications ....................................................................................... 1 

General Description ......................................................................... 1

Functional Block Diagram .............................................................. 1

Revision History ............................................................................... 2

Specifications ..................................................................................... 3

Electrical Characteristics ............................................................. 3

Package Characteristics ............................................................... 5

Regulatory Information ............................................................... 5

Insulation and Safety-Related Specifications ............................ 5

Recommended Operating Conditions ...................................... 5

Absolute Maximum Ratings ............................................................ 6

ESD Caution .................................................................................. 6

Pin Configuration and Pin Function Descriptions ...................... 7

Typical Perfomance Characteristics ................................................8

Applications Information .............................................................. 10

Theory of Operation .................................................................. 10

PC Board Layout ........................................................................ 10

Thermal Analysis ....................................................................... 10

Propagation Delay-Related Parameters ................................... 11

DC Correctness and Magnetic Field Immunity ........................... 11

Power Consumption .................................................................. 12

Increasing and Decreasing Available Power ............................... 12

Common-Mode Transient Immunity ..................................... 12

Typical Application Usage ......................................................... 13

Insulation Lifetime ..................................................................... 13

Outline Dimensions ....................................................................... 15

Ordering Guide .......................................................................... 15

REVISION HISTORY

4/08—Revision 0: Initial Version

ADuM5230

Rev. 0 | Page 3 of 16

SPECIFICATIONS

ELECTRICAL CHARACTERISTICS

All voltages are relative to their respective ground. 4.5 V ≤ V

DD1

≤ 5.5 V, 12.0 ≤ V

DDB

≤ 18.0 V. All min/max specifications apply over the

entire recommended operating range, unless otherwise noted. All typical specifications are at T

A

= 25°C, V

DD1

= 5.0 V, V

DDB

= 15 V.

Table 1.

Parameter Symbol Min Typ Max Unit Test Conditions

DC SPECIFICATIONS

Input Supply Current, Quiescent I

DD1(Q)

125 mA

I

ISO

= 0 mA, dc signal inputs,

V

ADJ

= open

Channel B Supply Current, Quiescent I

DDB(Q)

1.6 mA

Channel A Output Supply Voltage V

ISO

12 15 18.5 V

At 100 kHz Switching Frequency

Maximum Channel A Output Supply Current I

ISO(max, 100)

10 mA CL = 200 pF

Input Supply Current I

DD1

200 mA I

ISO

= I

ISO(max, 100)

Channel B Supply Current I

DDB

1.8 mA CL = 200 pF

At 1000 kHz Switching Frequency

Maximum Channel A Output Supply Current I

ISO(max, 1000)

7.5 mA CL = 200 pF

Input Supply Current I

DD1

200 mA I

ISO

= I

ISO(max, 1000)

Channel B Supply Current I

DDB

7.5 mA CL = 200 pF

Input Currents IIA, I

IB

−10 +0.01 +10 μA 0 ≤ VIA, VIB ≤ 5.5 V

Logic High Input Voltage V

ATH

, V

BTH

0.7 × V

DD1

V

Logic Low Input Voltage V

ATL

, V

BTL

0.3 × V

DD1

V

Logic High Output Voltages V

OAH

, V

OBH

V

ISO

– 0.1,

V

DDB

– 0.1

V

ISO

, V

DDB

V IOA, I

OB

= −1 mA

Logic Low Output Voltages V

OAL

, V

OBL

0.1 V IOA, I

OB

= 1 mA

Undervoltage Lockout, V

ISO

and V

DDB

Supply

Positive-Going Threshold V

DDBUV+

8.0 10.1 V

Negative-Going Threshold V

DDBUV−

7.4 9.0 V

Hysteresis V

DDBUVH

0.9 V

Undervoltage Lockout, V

DD1

Supply

Positive-Going Threshold V

DD1UV+

3.5 4.2 V

Negative-Going Threshold V

DD1UV−

3.0 3.9 V

Hysteresis V

DD1UVH

0.4 V

Output Short-Circuit Pulsed Current, Sourcing

1

I

OA

, IOB 100 mA

Output Short-Circuit Pulsed Current, Sinking

1

I

OA

, IOB 300 mA

SWITCHING SPECIFICATIONS

Minimum Pulse Width

2

PW 100 ns C

L

= 200 pF

Maximum Switching Frequency

3

1 MHz C

L

= 200 pF

Propagation Delay

4

t

PHL

, t

PLH

100 ns CL = 200 pF

Change vs. Temperature 100 ps/°C

Pulse Width Distortion, |t

PLH

− t

PHL

| PWD 8 ns CL = 200 pF

Channel-to-Channel Matching, Rising or Falling

Matching Edge Polarity

5

tM2 8 ns CL = 200 pF

Channel-to-Channel Matching, Rising vs. Falling

Opposite Edge Polarity

6

tM1 10 ns CL = 200 pF

Part-to-Part Matching, Rising or Falling Edges

7

55 ns C

L

= 200 pF

Part-to-Part Matching, Rising vs. Falling Edges

8

63 ns C

L

= 200 pF

ADuM5230

Rev. 0 | Page 4 of 16

Parameter Symbol Min Typ Max Unit Test Conditions

Common-Mode Transient Immunity

at Logic High Output

|CM

H

| 25 35 kV/μs

V

Ix

= V

DD1

, VCM = 1000 V,

transient magnitude = 800 V

Common-Mode Transient Immunity

at Logic Low Output

|CM

L

| 25 35 kV/μs

V

Ix

= 0 V, VCM = 1000 V,

transient magnitude = 800 V

Output Rise Time (10% to 90%) tR 25 ns

C

L

= 200 pF, I

ISO

= 10 mA,

100 kHz switching frequency

Output Fall Time (10% to 90%) tF 10 ns

C

L

= 200 pF, I

ISO

= 10 mA,

100 kHz switching frequency

1

Short-circuit duration is less than 1 sec. Average output current must conform to the limit shown under the section. Absolute Maximum Ratings

2

The minimum pulse width is the shortest pulse width at which the specified timing parameters are guaranteed. Operation below the minimum pulse width is strongly

discouraged because in some instances pulse stretching to 1 μs may occur.

3

The maximum switching frequency is the maximum signal frequency at which the specified timing and power conversion parameters are guaranteed. Operation

above the maximum frequency is strongly discouraged.

4

t

PHL

propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. t

PLH

propagation delay is

measured from the 50% level of the rising edge of the VIx signal to the 50% level of the rising edge of the VOx signal.

5

In channel-to-channel matching, the rising or falling matching edge polarity is the magnitude of the propagation delay difference between two channels of the same

part when both inputs are either both rising or falling edges. The loads on each channel are equal.

6

In channel-to-channel matching, the rising vs. falling opposite edge polarity is the magnitude of the propagation delay difference between two channels of the same

part when one input is a rising edge and one input is a falling edge. The loads on each channel are equal.

7

In part-to-part matching, the rising or falling edges is the magnitude of the propagation delay difference between the same channels of two different parts when the

inputs are either both rising or falling edges. The supply voltages, temperatures, and loads of each part are equal.

8

In part-to-part matching, the rising vs. falling edges is the magnitude of the propagation delay difference between the same channels of two different parts when one

input is a rising edge and the other input is a falling edge. The supply voltages, temperatures, and loads of each part are equal.

ADuM5230

Rev. 0 | Page 5 of 16

PACKAGE CHARACTERISTICS

Table 2.

Parameter Symbol Min Typ Max Unit Test Conditions

Resistance (Input-to-Output)

1

R

I-O

1012 Ω

Capacitance (Input-to-Output)

1

C

I-O

2.0 pF f = 1 MHz
Input Capacitance CI 4.0 pF
IC Junction-to-Ambient Thermal Resistance θJA 48 °C/W

1

The device is considered a two-terminal device: Pin 1 to Pin 8 are shorted together, and Pin 9 to Pin 16 are shorted together.

REGULATORY INFORMATION

The ADuM5230 will be approved by the organization listed in Tab l e 3.

Table 3.

UL1 (pending)

Recognized under 1577 component recognition program, File E214100

1

In accordance with UL1577, each ADuM5230 is proof-tested by applying an insulation test voltage ≥3000 V rms for 1 sec (current leakage detection limit = 5 μA).

INSULATION AND SAFETY-RELATED SPECIFICATIONS

Table 4.

Parameter Symbol Value Unit Conditions

Rated Dielectric Insulation Voltage

2500 V rms

1 minute duration

Minimum External Air Gap (Clearance)

L(I01) 3.5 min mm

Measured from input conductors to output conductors,
shortest distance through air

Minimum External Tracking (Creepage)

L(I02) 3.5 min mm

Measured from input conductors to output conductors,
shortest distance path along body

Minimum Internal Gap (Internal

Clearance)

0.017 min mm

Distance through the insulation

Tracking Resistance (Comparative

Tracking I ndex)

CTI >175

V

DIN IEC 112/VDE 0303 Part 1

Isolation Group

IIIa

Material Group (DIN VDE 0110, 1/89, Table 1)

600

500

400

300

200

100

0

–40 0 40 80 120 160 200

AMBIENT TEMPERATURE (°C)

SAFE OPERATING V

DD1

CURRENT (mA)

07080-010

Figure 2. Thermal Derating Curve, Dependence of Safety Limiting Values on

Case Temperature, per DIN EN 60747-5-2

RECOMMENDED OPERATING CONDITIONS

Table 5.

Parameter Value

Operating Temperature (TA) −40°C to +105°C
Input Supply Voltage1 (V

DD1

) 4.5 V to 5.5 V

Channel B Supply Voltage1 (V

DDB

) 12 V to 18.5 V
Input Signal Rise and Fall Times 1 ms
Minimum V

DD1

Power-On Slew Rate2 (P

SLEW

) 400 V/ms

1

All voltages are relative to their respective ground.

2

The ADuM5230 power supply may fail to initialize properly if V

DD1

is applied

too slowly.