ANALOG DEVICES ADUM3210 Service Manual

Dual-Channel Digital Isolators,
Enhanced System-Level ESD Reliability
Data Sheet

FEATURES

Enhanced system-level ESD performance per IEC 61000-4-x High temperature operation: 125°C Default low output Narrow body, RoHS-compliant, 8-lead SOIC Low power operation
5 V operation
1.7 mA per channel maximum @ 0 Mbps to 2 Mbps
3.7 mA per channel maximum @ 10 Mbps
7.0 mA per channel maximum @ 25 Mbps
3 V operation
1.5 mA per channel maximum @ 0 Mbps to 2 Mbps
2.5 mA per channel maximum @ 10 Mbps
4.7 mA per channel maximum @ 25 Mbps 3 V/5 V level translation High data rate: dc to 25 Mbps (NRZ) Precise timing characteristics
3 ns maximum pulse-width distortion at 5 V operation
3 ns maximum channel-to-channel matching High common-mode transient immunity: >25 kV/μs
Safety and regulatory approvals
UL recognition: 2500 V rms for 1 minute per UL 1577
CSA Component Acceptance Notice #5A
VDE Certificate of Conformity
DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12 V
= 560 V peak
IORM
Qualified for automotive applications

APPLICATIONS

Size-critical multichannel isolation SPI interface/data converter isolation RS-232/RS-422/RS-485 transceiver isolation Digital field bus isolation Gate drive interfaces Hybrid electric vehicles, battery monitor, and motor drive
ADuM3210/ADuM3211

GENERAL DESCRIPTION

The ADuM3210/ADuM3211 are dual-channel, digital isolators based on Analog Devices, Inc., iCoupler® technology. Combining high speed CMOS and monolithic transformer technology, this isolation component provides outstanding performance charac­teristics superior to alternatives such as optocoupler devices.
By avoiding the use of LEDs and photodiodes, iCoupler devices remove the design difficulties commonly associated with opto­couplers. The typical optocoupler concerns regarding uncertain current transfer ratios, nonlinear transfer functions, and temperature and lifetime effects are eliminated with the simple iCoupler digital interfaces and stable performance characteristics. The need for external drivers and other discrete components is eliminated with these iCoupler products. Furthermore, iCoupler devices consume one-tenth to one-sixth the power of optocouplers at comparable signal data rates.
The ADuM3210/ADuM3211 isolators provide two independent isolation channels in two channel configurations with data rates up to 25 Mbps (see the Ordering Guide). They operate with 3.3 V or 5 V supply voltages on either side, providing compatibility with lower voltage systems as well as enabling voltage translation functionality across the isolation barrier. The ADuM3210/
ADuM3211 isolators have a default output low characteristic in
comparison to the ADuM3200/ADuM3201 models XIJDI have a
default output high characteristic. ADuM3210W and ADuM3211W are automotive grade versions qualified for 125°C operation.
In comparison to the ADuM120x isolator, the ADuM3210/
ADuM3211 isolators contain various circuit and layout changes
providing increased capability relative to system-level IEC 61000-4-x testing (ESD, burst, and surge). The precise capability in these tests for either the ADuM120x or ADuM3210/ADuM3211 products is strongly determined by the design and layout of the user’s board or module. For more information, see the AN-793 Application Note, ESD/Latch-Up Considerations with iCoupler Isolation Products.

FUNCTIONAL BLOCK DIAGRAMS

1
V
DD1
ENCODE DECODE
2
V
IA
3
ENCODE DECODE
4
GND
V
IB
1
Figure 1. ADuM3210 Functional Block Diagram Figure 2. ADuM3211 Functional Block Diagram
Protected by U.S. Patents 5,952,849; 6,873,065; and 7,075,239.
Rev. F
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
ADuM3210
8
V
DD2
7
V
OA
6
V
OB
5
GND
2
06866-001
1
V
DD1
ENCODE DECODE
2
V
OA
3
V
IB
GND
1
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2008–2012 Analog Devices, Inc. All rights reserved.
ENCODE DECODE
4
ADuM3211
8
V
DD2
7
V
IA
6
V
OB
5
GND
2
06866-017
ADuM3210/ADuM3211 Data Sheet

TABLE OF CONTENTS

Features.............................................................................................. 1
Applications....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagrams............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Electrical Characteristics—5 V, 105°C Operation.................... 3
Electrical Characteristics—3 V, 105°C Operation ................... 4
Electrical Characteristics—Mixed 5 V/3 V, 105°C Operation.. 5
Electrical Characteristics—Mixed 3 V/5 V, 105°C Operation.. 6
Electrical Characteristics—5 V, 125°C Operation ................... 7
Electrical Characteristics—3 V, 125°C Operation..................... 8
Electrical Characteristics—Mixed 5 V/3 V, 125°C Operation.. 9
Electrical Characteristics—Mixed 3 V/5 V, 125°C Operation 10
Package Characteristics .............................................................11
Regulatory Information............................................................. 11
Insulation and Safety-Related Specifications.......................... 11
DIN V VDE V 0884-10 (VDE V 0884-10) Insulation
Characteristics ............................................................................ 12
Recommended Operating Conditions .................................... 12
Absolute Maximum Ratings ......................................................... 13
ESD Caution................................................................................ 13
Pin Configurations and Function Descriptions......................... 14
Truth Tables................................................................................. 14
Typical Performance Characteristics........................................... 15
Applications Information.............................................................. 16
PC Board Layout ........................................................................ 16
System-Level ESD Considerations and Enhancements ........ 16
Propagation Delay-Related Parameters................................... 16
DC Correctness and Magnetic Field Immunity........................... 16
Power Consumption .................................................................. 17
Insulation Lifetime..................................................................... 18
Outline Dimensions....................................................................... 19
Ordering Guide .......................................................................... 20
Automotive Products................................................................. 20

REVISION HISTORY

2/12—Rev. E to Rev. F
Created Hyperlink for Safety and Regulatory Approvals
Entry in Features Section................................................................. 1
Change to PC Board Layout Section............................................ 16
11/11—Rev. D to Rev. E
Changes to Table 1, Pulse Width Parameter................................. 3
Changes to Table 4, Pulse Width Parameter................................. 4
Changes to Table 7, Pulse Width Parameter................................. 5
Changes to Table 10, Pulse Width Parameter............................... 6
6/11—Rev. C to Rev. D
Changes to Features Section, Application Section, and General
Description Section .......................................................................... 1
Changes to Propagation Delay Skew Parameter, Table 1; Opposing
upply Current Parameter, Table 3................................................. 3
S
Changes to Opposing-Direction Parameter, Table 4................... 4
Changes to Opposing-Direction Parameter, Table 7 and Logic
Low Input Threshold Parameter, Table 9 ...................................... 5
Changes to Propagation Delay Skew Parameter, Table 10 and
Changes to Table 12.......................................................................... 6
Changes to Table 13, Table 14, and Quiescent Output Supply
Current Parameter, Table 15............................................................ 7
Changes to Table 16 and Table 17 .................................................. 8
Changes to Table 19, Table 20, and Logic Low Input Threshold
Parameter, Table 21 .......................................................................... 9
Direction Parameter, Table 1; and Quiescent Output
Changes to Table 22, Table 23, and Table 24............................... 10
Changes to Side 1 Current Parameter, Table 28; Side 2 Current
Parameter, Table 28; and Table 29 ................................................ 12
Changes to Ambient Operating Temperature, Table 30 and
Average Output Current per Pin, Table 30 ................................. 13
Changes to Figure 9, Figure 10, and Figure 11 Captions .......... 15
Changes to Ordering Guide.......................................................... 20
Added Automotive Products Section .......................................... 20
9/09—Rev. B to Rev. C
Added ADuM3210A and ADuM3211A .................... Throughout
Changes to General Description Section .......................................1
Reformatted Electrical Characteristics Tables...............................3
Moved Truth Tables Section ......................................................... 14
Changes to Ordering Guide.......................................................... 20
7/09—Rev. A to Rev. B
Added ADuM3211........................................................ Throughout
Changes to Specifications Section...................................................3
Added Table 16 ............................................................................... 19
Added Figure 5 and Table 18 ........................................................ 20
Added Figure 11 ............................................................................. 21
Changes to Power Consumption Section.................................... 23
Changes to Ordering Guide.......................................................... 25
9/08—Revision A: Initial Version
Rev. F | Page 2 of 20
Data Sheet ADuM3210/ADuM3211

SPECIFICATIONS

ELECTRICAL CHARACTERISTICS—5 V, 105°C OPERATION

All typical specifications are at TA = 25°C, V operation range: 4.5 V ≤ V are tested with C
= 15 pF and CMOS signal levels, unless otherwise noted.
L
≤ 5.5 V, 4.5 V ≤ V
DD1
Table 1.
A Grade B Grade Parameter Symbol Min Typ Max Min Typ Max Unit Test Conditions
SWITCHING SPECIFICATIONS
Data Rate 1 10 Mbps Within PWD limit
Propagation Delay t
PHL
, t
Pulse Width Distortion PWD 5 3 ns |t
Change vs. Temperature 6 5 ps/°C
Pulse Width PW Within PWD limit
ADuM3210 1000 22 ns ADuM3211 1000 33 ns
Propagation Delay Skew t
20 18 ns Between any two units
PSK
Channel Matching
Codirectional t Opposing-Direction t
PSKCD
PSKOD
Output Rise/Fall Time tR/tF 2.5 2.5 ns 10% to 90%
= V
DD1
20 50 20 50 ns 50% input to 50% output
PLH
= 5 V. Minimum/maximum specifications apply over the entire recommended
DD2
≤ 5.5 V, and −40°C ≤ TA ≤ +105°C, unless otherwise noted. Switching specifications
DD2
− t
PHL
|
PLH
5 3 ns 20 18 ns
Table 2.
1 Mbps—A Grade, B Grade 10 Mbps—B Grade
Parameter Symbol
Min Typ Max Min Typ Max
Unit Test Conditions
SUPPLY CURRENT
ADuM3210 I
I
ADuM3211 I
I
1.3 1.7 3.5 4.6 mA
DD1
1.0 1.6 1.7 2.8 mA
DD2
1.1 1.5 2.6 3.4 mA
DD1
1.3 1.8 3.1 4.0 mA
DD2
Table 3. For All Models
Parameter Symbol Min Typ Max Unit Test Conditions
DC SPECIFICATIONS
Logic High Input Threshold VIH 0.7 V
Logic Low Input Threshold VIL 0.3 V
Logic High Output Voltages VOH V
V
Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 μA, VIx = V
0.2 0.4 V IOx = 4 mA, VIx = V
Input Current per Channel II −10 +0.01 +10 μA 0 V ≤ VIx ≤ V
V
DDX
V
DDX
− 0.1 5.0 V IOx = −20 μA, VIx = V
DDX
− 0.5 4.8 V IOx = −4 mA, VIx = V
DDX
DDX
IxH
IxH
IxL
IxL
Supply Current per Channel
Quiescent Input Supply Current I Quiescent Output Supply Current I Dynamic Input Supply Current I Dynamic Output Supply Current I
0.4 0.8 mA
DDI(Q)
0.4 0.8 mA
DDO(Q)
0.19 mA/Mbps
DDI(D)
0.05 mA/Mbps
DDO(D)
AC SPECIFICATIONS
Common-Mode Transient Immunity1 |CM| 25 35 kV/μs
= V
Ix
DDX
, VCM = 1000 V,
V transient magnitude = 800 V
Refresh Rate fr 1.2 Mbps
1
|CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both
rising and falling common-mode voltage edges.
Rev. F | Page 3 of 20
ADuM3210/ADuM3211 Data Sheet

ELECTRICAL CHARACTERISTICS—3 V, 105°C OPERATION

All typical specifications are at TA = 25°C, V operation range: ADuM3210 supply voltages 2.7 V ≤ V
3.0 V ≤ V
≤ 3.6 V, and −40°C ≤ TA ≤ +105°C, unless otherwise noted. Switching specifications are tested with CL = 15 pF and CMOS
DD2
signal levels, unless otherwise noted.
Table 4.
A Grade B Grade Parameter Symbol Min Typ Max Min Typ Max Unit Test Conditions
SWITCHING SPECIFICATIONS
Data Rate 1 10 Mbps Within PWD limit Propagation Delay t
PHL
, t
Pulse Width Distortion PWD
ADuM3210 5 3 ns |t ADuM3211 6 4 ns |t Change vs. Temperature 6 5 ps/°C
Pulse Width PW Within PWD limit
ADuM3210 1000 22 ns ADuM3211 1000 33 ns
Propagation Delay Skew t
29 22 ns Between any two units
PSK
Channel Matching
Codirectional t Opposing-Direction t
PSKCD
PSKOD
Output Rise/Fall Time tR/tF 3.0 3.0 ns 10% to 90%
= V
DD1
20 60 20 60 ns 50% input to 50% output
PLH
= 3.0 V. Minimum/maximum specifications apply over the entire recommended
DD2
≤ 3.6 V, 2.7 V ≤ V
DD1
≤ 3.6 V; ADuM3211 supply voltages 3.0 V ≤ V
DD2
− t
PLH
PHL
− t
PLH
PHL
DD1
| |
5 3 ns 29 20 ns
≤ 3.6 V,
Table 5.
1 Mbps—A Grade, B Grade 10 Mbps—B Grade
Parameter Symbol
Min Typ Max Min Typ Max
Unit Test Conditions
SUPPLY CURRENT
ADuM3210 I I ADuM3211 I
I
0.8 1.3 2.0 3.2 mA
DD1
0.7 1.0 1.1 1.7 mA
DD2
0.7 1.3 1.5 2.1 mA
DD1
0.8 1.6 1.9 2.4 mA
DD2
Table 6. For All Models
Parameter Symbol Min Typ Max Unit Test Conditions
DC SPECIFICATIONS
Logic High Input Threshold VIH 0.7 V Logic Low Input Threshold VIL 0.3 V Logic High Output Voltages VOH V V Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 μA, VIx = V
0.2 0.4 V IOx = 4 mA, VIx = V Input Current per Channel II −10 +0.01 +10 μA
V
DDX
V
DDX
− 0.1 3.0 V IOx = −20 μA, VIx = V
DDX
− 0.5 2.8 V IOx = −4 mA, VIx = V
DDX
0 V
V
V
Ix
DDX
IxH
IxH
IxL
IxL
Supply Current per Channel
Quiescent Input Supply Current I Quiescent Output Supply Current I Dynamic Input Supply Current I Dynamic Output Supply Current I
0.3 0.5 mA
DDI(Q)
0.3 0.5 mA
DDO(Q)
0.10 mA/Mbps
DDI(D)
0.03 mA/Mbps
DDO(D)
AC SPECIFICATIONS
Common-Mode Transient Immunity1 |CM| 25 35 kV/μs VIx = V
, VCM = 1000 V,
DDX
transient magnitude = 800 V
Refresh Rate fr 1.1 Mbps
1
|CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both
rising and falling common-mode voltage edges.
Rev. F | Page 4 of 20
Data Sheet ADuM3210/ADuM3211

ELECTRICAL CHARACTERISTICS—MIXED 5 V/3 V, 105°C OPERATION

All typical specifications are at TA = 25°C, V recommended operation range: ADuM3210 supply voltages 4.5 V ≤ V
4.5 V ≤ V C
= 15 pF, and CMOS signal levels, unless otherwise noted.
L
≤ 5.5 V, 3.0 V ≤ V
DD1
≤ 3.6 V, and −40°C ≤ TA ≤ +105°C, unless otherwise noted. Switching specifications are tested with
DD2
Table 7.
A Grade B Grade Parameter Symbol Min Typ Max Min Typ Max Unit Test Conditions
SWITCHING SPECIFICATIONS
Data Rate 1 10 Mbps Within PWD limit
Propagation Delay t
PHL
, t
Pulse Width Distortion PWD 5 3 ns |t
Change vs. Temperature 6 5 ps/°C
Pulse Width PW Within PWD limit
ADuM3210 1000 22 ns ADuM3211 1000 33 ns
Propagation Delay Skew t
29 22 ns Between any two units
PSK
Channel Matching
Codirectional t Opposing-Direction t
PSKCD
PSKOD
Output Rise/Fall Time tR/tF 3.0 3.0 ns 10% to 90%
= 5 V, V
DD1
15 55 15 55 ns 50% input to 50% output
PLH
= 3.0 V. Minimum/maximum specifications apply over the entire
DD2
≤ 5.5 V, 2.7 V ≤ V
DD1
≤ 3.6 V; ADuM3211 supply voltages
DD2
− t
PLH
PHL
|
5 3 ns 29 20 ns
Table 8.
1 Mbps—A Grade, B Grade 10 Mbps—B Grade
Parameter Symbol
Min Typ Max Min Typ Max
Unit Test Conditions
SUPPLY CURRENT
ADuM3210 I
I
ADuM3211 I
I
1.3 1.7 3.5 4.6 mA
DD1
0.7 1.0 1.1 1.7 mA
DD2
1.1 1.5 2.6 3.4 mA
DD1
0.8 1.6 1.9 2.4 mA
DD2
Table 9. For All Models
Parameter Symbol Min Typ Max Unit Test Conditions
DC SPECIFICATIONS
Logic High Input Threshold VIH 0.7 V
Logic Low Input Threshold VIL 0.3 V
Logic High Output Voltages VOH V
V
Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 μA, VIx = V
0.2 0.4 V IOx = 4 mA, VIx = V
Input Current per Channel II −10 +0.01 +10 μA 0 V ≤ VIx ≤ V
V
DDX
V
DDX
− 0.1 V
DDX
− 0.5 V
DDX
V IOx = −20 μA, VIx = V
DDX
− 0.2 V IOx = −4 mA, VIx = V
DDX
DDX
IxH
IxH
IxL
IxL
Supply Current per Channel
Quiescent Input Supply Current I Quiescent Output Supply Current I Dynamic Input Supply Current I Dynamic Output Supply Current I
0.4 0.8 mA
DDI(Q)
0.3 0.5 mA
DDO(Q)
0.19 mA/Mbps
DDI(D)
0.03 mA/Mbps
DDO(D)
AC SPECIFICATIONS
Common-Mode Transient Immunity1 |CM| 25 35 kV/μs
= V
Ix
DDX
, VCM = 1000 V,
V transient magnitude = 800 V
Refresh Rate fr 1.2 Mbps
1
|CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both
rising and falling common-mode voltage edges.
Rev. F | Page 5 of 20
ADuM3210/ADuM3211 Data Sheet

ELECTRICAL CHARACTERISTICS—MIXED 3 V/5 V, 105°C OPERATION

All typical specifications are at TA = 25°C, V recommended operation range: ADuM3210 supply voltages 2.7 V ≤ V
3.0 V ≤ V C
= 15 pF and CMOS signal levels, unless otherwise noted.
L
≤ 3.6 V, 4.5 V ≤ V
DD1
≤ 5.5 V, and −40°C ≤ TA ≤ +105°C, unless otherwise noted. Switching specifications are tested with
DD2
Table 10.
A Grade B Grade Parameter Symbol Min Typ Max Min Typ Max Unit Test Conditions
SWITCHING SPECIFICATIONS
Data Rate 1 10 Mbps Within PWD limit Propagation Delay t
PHL
, t
Pulse Width Distortion PWD
ADuM3210 5 3 ns |t ADuM3211 6 4 ns |t Change vs. Temperature 6 5 ps/°C
Pulse Width PW Within PWD limit
ADuM3210 1000 22 ns ADuM3211 1000 33 ns
Propagation Delay Skew t
29 20 ns Between any two units
PSK
Channel Matching
Codirectional t Opposing-Direction t
PSKCD
PSKOD
Output Rise/Fall Time tR/tF 2.5 2.5 ns 10% to 90%
= 3 V, V
DD1
15 55 15 55 ns 50% input to 50% output
PLH
= 5.0 V. Minimum/maximum specifications apply over the entire
DD2
≤ 3.6 V, 4.5 V ≤ V
DD1
≤ 5.5 V; ADuM3211 supply voltages
DD2
− t
PLH
PHL
− t
PLH
PHL
| |
15 3 ns 29 22 ns
Table 11.
1 Mbps—A Grade, B Grade 10 Mbps—B Grade
Parameter Symbol
Min Typ Max Min Typ Max
Unit Test Conditions
SUPPLY CURRENT
ADuM3210 I I ADuM3211 I
I
0.8 1.3 2.0 3.2 mA
DD1
1.0 1.6 1.7 2.8 mA
DD2
0.7 1.3 1.5 2.1 mA
DD1
1.3 1.8 3.1 4.0 mA
DD2
Table 12. For All Models
Parameter Symbol Min Typ Max Unit Test Conditions
DC SPECIFICATIONS
Logic High Input Threshold VIH 0.7 V Logic Low Input Threshold VIL 0.3 V Logic High Output Voltages VOH V V Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 μA, VIx = V
0.2 0.4 V IOx = 4 mA, VIx = V Input Current per Channel II −10 +0.01 +10 μA Supply Current per Channel
Quiescent Input Supply Current I Quiescent Output Supply Current I Dynamic Input Supply Current I Dynamic Output Supply Current I
0.4 0.8 mA
DDI(Q)
0.5 0.8 mA
DDO(Q)
0.10 mA/Mbps
DDI(D)
0.05 mA/Mbps
DDO(D)
AC SPECIFICATIONS
Common-Mode Transient Immunity1 |CM| 25 35 kV/μs VIx = V
Refresh Rate fr 1.1 Mbps
1
|CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both
rising and falling common-mode voltage edges.
V
DDX
V
DDX
− 0.1 V
DDX
− 0.5 V
DDX
V IOx = −20 μA, VIx = V
DDX
− 0.2 V IOx = −4 mA, VIx = V
DDX
IxH
IxH
IxL
IxL
0 V
V
V
Ix
DDX
, VCM = 1000 V,
DDX
transient magnitude = 800 V
Rev. F | Page 6 of 20
Data Sheet ADuM3210/ADuM3211

ELECTRICAL CHARACTERISTICS—5 V, 125°C OPERATION

All typical specifications are at TA = 25°C, V operation range: 4.5 V ≤ V are tested with C
= 15 pF and CMOS signal levels, unless otherwise noted.
L
≤ 5.5 V, 4.5 V ≤ V
DD1
Table 13.
A Grade Parameter Symbol Min Typ Max Min Typ Max Min Typ Max Unit Test Conditions
SWITCHING SPECIFICATIONS
Data Rate 1 10 25 Mbps Within PWD limit
Propagation Delay t
, t
20 50 20 50 20 50 ns 50% input to 50% output
PHL
PLH
Pulse Width Distortion PWD 5 3 3 ns |t
Change vs. Temperature 6 5 5 ps/°C Pulse Width PW 1000 100 40 ns Within PWD limit Propagation Delay Skew t
20 18 18 ns Between any two units
PSK
Channel Matching
Codirectional t
Opposing-Direction t
5 3 3 ns
PSKCD
20 18 18 ns
PSKOD
Output Rise/Fall Time tR/tF
Table 14.
1 Mbps—A Grade,
B Grade, and C Grade
Parameter Symbol
SUPPLY CURRENT
ADuM3210 I I ADuM3211 I
I
1.3 1.7 3.5 4.6 6.6 9.0 mA
DD1
1.0 1.6 1.7 2.8 3.7 4.5 mA
DD2
1.1 1.5 2.6 3.4 5.3 7.5 mA
DD1
1.3 1.8 3.1 4.0 5.9 8.0 mA
DD2
= V
DD1
= 5 V. Minimum/maximum specifications apply over the entire recommended
DD2
≤ 5.5 V, and −40°C ≤ TA ≤ +125°C, unless otherwise noted. Switching specifications
DD2
B Grade and
T Grade C Grade
− t
PLH
2.5 2.5 2.5
ns 10% to 90%
10 Mbps—B Grade,
C Grade, and T Grade 25 Mbps—C Grade
Unit Test Conditions Min Typ Max Min Typ Max Min Typ Max
PHL
|
Table 15. For All Models
Parameter Symbol Min Typ Max Unit Test Conditions
DC SPECIFICATIONS
Logic High Input Threshold VIH 0.7 V Logic Low Input Threshold VIL 0.3 V Logic High Output Voltages VOH V V Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 μA, VIx = V
0.2 0.4 V IOx = 4 mA, VIx = V Input Current per Channel II −10 +0.01 +10 μA 0 V ≤ VIx ≤ V
V
DDX
V
DDX
− 0.1 5.0 V IOx = −20 μA, VIx = V
DDX
− 0.5 4.8 V IOx = −4 mA, VIx = V
DDX
DDX
IxH
IxH
IxL
IxL
Supply Current per Channel
Quiescent Input Supply Current I
Quiescent Output Supply Current I
Dynamic Input Supply Current I
Dynamic Output Supply Current I
0.4 0.8 mA
DDI(Q)
0.4 0.8 mA
DDO(Q)
0.19 mA/Mbps
DDI(D)
0.05 mA/Mbps
DDO(D)
AC SPECIFICATIONS
Common-Mode Transient Immunity1 |CM| 25 35 kV/μs
= V
Ix
DDX
, VCM = 1000 V,
V transient magnitude = 800 V
Refresh Rate fr 1.2 Mbps
1
|CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both
rising and falling common-mode voltage edges.
Rev. F | Page 7 of 20
ADuM3210/ADuM3211 Data Sheet

ELECTRICAL CHARACTERISTICS—3 V, 125°C OPERATION

All typical specifications are at TA = 25°C, V operation range: 3.0 V ≤ V are tested with C
= 15 pF and CMOS signal levels, unless otherwise noted.
L
≤ 3.6 V, 3.0 V ≤ V
DD1
Table 16.
A Grade Parameter Symbol Min Typ Max Min Typ Max Min Typ Max Unit Test Conditions
SWITCHING SPECIFICATIONS
Data Rate 1 10 25 Mbps Within PWD limit Propagation Delay t
, t
20 60 20 60 20 60 ns 50% input to 50% output
PHL
PLH
Pulse Width Distortion PWD 6 4 4 ns |t
Change vs. Temperature 6 5 5 ps/°C Pulse Width PW 1000 100 40 ns Within PWD limit Propagation Delay Skew t
29 22 22 ns Between any two units
PSK
Channel Matching
Codirectional t
Opposing-Direction t Output Rise/Fall Time tR/tF
5 3 3 ns
PSKCD
29 20 20 ns
PSKOD
Table 17.
1 Mbps—A Grade,
B Grade, and C Grade
Parameter Symbol
Min Typ Max Min Typ Max Min Typ Max
SUPPLY CURRENT
ADuM3210 I I ADuM3211 I
I
0.8 1.3 2.0 3.2 3.9 5.5 mA
DD1
0.7 1.0 1.1 1.7 2.4 3.0 mA
DD2
0.7 1.3 1.5 2.1 3.1 4.5 mA
DD1
0.8 1.6 1.9 2.4 3.5 5.0 mA
DD2
= V
DD1
= 3.0 V. Minimum/maximum specifications apply over the entire recommended
DD2
≤ 3.6 V, and −40°C ≤ TA ≤ +125°C, unless otherwise noted. Switching specifications
DD2
B Grade and
T Grade C Grade
3.0 3.0 3.0
10 Mbps—B Grade,
C Grade, and T Grade
25 Mbps—C Grade
− t
PHL
|
PLH
ns 10% to 90%
Unit Test Conditions
Table 18. For All Models
Parameter Symbol Min Typ Max Unit Test Conditions
DC SPECIFICATIONS
Logic High Input Threshold VIH 0.7 V Logic Low Input Threshold VIL 0.3 V Logic High Output Voltages VOH V V Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 μA, VIx = V
0.2 0.4 V IOx = 4 mA, VIx = V Input Current per Channel II −10 +0.01 +10 μA 0 V ≤ VIx ≤ V
V
DDX
V
DDX
− 0.1 3.0 V IOx = −20 μA, VIx = V
DDX
− 0.5 2.8 V IOx = −4 mA, VIx = V
DDX
DDX
IxH
IxH
IxL
IxL
Supply Current per Channel
Quiescent Input Supply Current I
Quiescent Output Supply Current I
Dynamic Input Supply Current I
Dynamic Output Supply Current I
0.3 0.5 mA
DDI(Q)
0.3 0.5 mA
DDO(Q)
0.10 mA/Mbps
DDI(D)
0.03 mA/Mbps
DDO(D)
AC SPECIFICATIONS
Common-Mode Transient Immunity1 |CM| 25 35 kV/μs
= V
Ix
, VCM = 1000 V,
DDX
V transient magnitude = 800 V
Refresh Rate fr 1.1 Mbps
1
|CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both
rising and falling common-mode voltage edges.
Rev. F | Page 8 of 20
Data Sheet ADuM3210/ADuM3211

ELECTRICAL CHARACTERISTICS—MIXED 5 V/3 V, 125°C OPERATION

All typical specifications are at TA = 25°C, V
operation range: 4.5 V ≤ V
are tested with C
= 15 pF and CMOS signal levels, unless otherwise noted.
L
≤ 5.5 V, 3.0 V ≤ V
DD1
Table 19.
Parameter Symbol Min Typ Max Min Typ Max Min Typ Max Unit Test Conditions
SWITCHING SPECIFICATIONS
Data Rate 1 10 25 Mbps Within PWD limit Propagation Delay t
, t
15 55 15 55 15 55 ns 50% input to 50% output
PHL
PLH
Pulse Width Distortion PWD 5 3 3 ns |t
Change vs. Temperature 6 5 5 ps/°C Pulse Width PW 1000 100 40 ns Within PWD limit Propagation Delay Skew t
29 22 22 ns Between any two units
PSK
Channel Matching
Codirectional t
Opposing-Direction t
5 3 3 ns
PSKCD
29 20 20 ns
PSKOD
Output Rise/Fall Time tR/tF
Table 20.
1 Mbps—A Grade,
B Grade, and C Grade
Parameter Symbol
Min Typ Max Min Typ Max Min Typ Max
SUPPLY CURRENT
ADuM3210 I I ADuM3211 I
I
1.3 1.7 3.5 4.6 6.6 9.0 mA
DD1
0.7 1.0 1.1 1.7 2.4 3.0 mA
DD2
1.1 1.5 2.6 3.4 5.3 7.5 mA
DD1
0.8 1.6 1.9 2.4 3.5 5.0 mA
DD2
= 5 V, V
DD1
DD2
= 3.0 V. Minimum/maximum specifications apply over the entire recommended
DD2
≤ 3.6 V, and −40°C ≤ TA ≤ +125°C, unless otherwise noted. Switching specifications
B Grade and
A Grade
T Grade C Grade
3.0 3.0 3.0
10 Mbps—B Grade,
C Grade, and T Grade 25 Mbps—C Grade
− t
|
PLH
PHL
ns 10% to 90%
Unit Test Conditions
Table 21. For All Models
Parameter Symbol Min Typ Max Unit Test Conditions
DC SPECIFICATIONS
Logic High Input Threshold VIH 0.7 V Logic Low Input Threshold VIL 0.3 V Logic High Output Voltages VOH V V Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 μA, VIx = V
0.2 0.4 V IOx = 4 mA, VIx = V Input Current per Channel II −10 +0.01 +10 μA 0 V ≤ VIx ≤ V
V
DDX
V
DDX
− 0.1 V
DDX
− 0.5 V
DDX
V IOx = −20 μA, VIx = V
DDX
− 0.2 V IOx = −4 mA, VIx = V
DDX
DDX
IxH
IxH
IxL
IxL
Supply Current per Channel
Quiescent Input Supply Current I
Quiescent Output Supply Current I
Dynamic Input Supply Current I
Dynamic Output Supply Current I
0.4 0.8 mA
DDI(Q)
0.3 0.5 mA
DDO(Q)
0.19 mA/Mbps
DDI(D)
0.03 mA/Mbps
DDO(D)
AC SPECIFICATIONS
Common-Mode Transient Immunity1 |CM| 25 35 kV/μs
= V
Ix
DDX
, VCM = 1000 V,
V transient magnitude = 800 V
Refresh Rate fr 1.2 Mbps
1
|CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both
rising and falling common-mode voltage edges.
Rev. F | Page 9 of 20
ADuM3210/ADuM3211 Data Sheet

ELECTRICAL CHARACTERISTICS—MIXED 3 V/5 V, 125°C OPERATION

All typical specifications are at TA = 25°C, V operation range: 3.0 V ≤ V are tested with C
= 15 pF and CMOS signal levels, unless otherwise noted.
L
≤ 3.6 V, 4.5 V ≤ V
DD1
Table 22.
Parameter Symbol Min Typ Max Min Typ Max Min Typ Max Unit Test Conditions
SWITCHING SPECIFICATIONS
Data Rate 1 10 25 Mbps Within PWD limit Propagation Delay t
, t
15 55 15 55 15 55 ns 50% input to 50% output
PHL
PLH
Pulse Width Distortion PWD 6 4 4 ns |t
Change vs. Temperature 6 5 5 ps/°C Pulse Width PW 1000 100 40 ns Within PWD limit Propagation Delay Skew t
29 22 22 ns Between any two units
PSK
Channel Matching
Codirectional t
Opposing-Direction t Output Rise/Fall Time tR/tF
15 3 3 ns
PSKCD
29 20 20 ns
PSKOD
Table 23.
1 Mbps—A Grade,
B Grade, and C Grade
Parameter Symbol
Min Typ Max Min Typ Max Min Typ Max
SUPPLY CURRENT
ADuM3210 I I ADuM3211 I
I
0.8 1.3 2.0 3.2 3.9 5.5 mA
DD1
1.0 1.6 1.7 2.8 3.7 4.5 mA
DD2
0.7 1.3 1.5 2.1 3.1 4.5 mA
DD1
1.3 1.8 3.1 4.0 5.9 8.0 mA
DD2
= 3 V, V
DD1
DD2
= 5.0 V. Minimum/maximum specifications apply over the entire recommended
DD2
≤ 5.5 V, and −40°C ≤ TA ≤ +125°C, unless otherwise noted. Switching specifications
B Grade and
A Grade
T Grade
C Grade
2.5 2.5 2.5
10 Mbps—B Grade,
C Grade, and T Grade 25 Mbps—C Grade
− t
PHL
|
PLH
ns 10% to 90%
Unit Test Conditions
Table 24. For All Models
Parameter Symbol Min Typ Max Unit Test Conditions
DC SPECIFICATIONS
Logic High Input Threshold VIH 0.7 V Logic Low Input Threshold VIL 0.3 V Logic High Output Voltages VOH V V Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 μA, VIx = V
0.2 0.4 V IOx = 4 mA, VIx = V Input Current per Channel II −10 +0.01 +10 μA 0 V ≤ VIx ≤ V
V
DDX
V
DDX
− 0.1 V
DDX
− 0.5 V
DDX
V IOx = −20 μA, VIx = V
DDX
− 0.2 V IOx = −4 mA, VIx = V
DDX
DDX
IxH
IxH
IxL
IxL
Supply Current per Channel
Quiescent Input Supply Current I
Quiescent Output Supply Current I
Dynamic Input Supply Current I
Dynamic Output Supply Current I
0.4 0.8 mA
DDI(Q)
0.5 0.8 mA
DDO(Q)
0.10 mA/Mbps
DDI(D)
0.05 mA/Mbps
DDO(D)
AC SPECIFICATIONS
Common-Mode Transient Immunity1 |CM| 25 35 kV/μs
= V
Ix
, VCM = 1000 V,
DDX
V transient magnitude = 800 V
Refresh Rate fr 1.1 Mbps
1
|CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both
rising and falling common-mode voltage edges.
Rev. F | Page 10 of 20
Data Sheet ADuM3210/ADuM3211

PACKAGE CHARACTERISTICS

Table 25.
Parameter Symbol Min Typ Max Unit Test Conditions
Resistance (Input-to-Output)1 R
Capacitance (Input-to-Output)1 C
Input Capacitance CI 4.0 pF
IC Junction-to-Case Thermal Resistance, Side 1 θ
IC Junction-to-Case Thermal Resistance, Side 2 θ
1
The device is considered a 2-terminal device; Pin 1 through Pin 4 are shorted together, and Pin 5 through Pin 8 are shorted together.

REGULATORY INFORMATION

The ADuM3210/ADuM3211 are approved by the organizations listed in Tabl e 26.
Table 26.
UL CSA VDE
Recognized under UL 1577
Component Recognition
Program
1
Single/basic 2500 V rms
isolation voltage
File E214100 File 205078 File 2471900-4880-0001
1
In accordance with UL 1577, each ADuM3210/ADuM3211 is proof tested by applying an insulation test voltage ≥ 3000 V rms for 1 second (current leakage detection
limit = 5 μA).
2
In accordance with DIN V VDE V 0884-10, each ADuM3210/ADuM3211 is proof tested by applying an insulation test voltage ≥ 1050 V peak for 1 second (partial
discharge detection limit = 5 pC). An asterisk (*) marking on the component designates DIN V VDE V 0884-10 approval.
Approved under CSA Component Acceptance Notice #5A
Basic insulation per CSA 60950-1-03 and IEC 60950-1, 400 V rms (566 V peak) maximum working voltage
Functional insulation per CSA 60950-1-03 and IEC 60950-1,
800 V rms(1131 V peak) maximum working voltage
1012 Ω
I-O
1.0 pF f = 1 MHz
I-O
46 °C/W
JCI
Thermocouple located at center of package underside
41 °C/W
JCO
Certified according to DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12
Reinforced insulation, 560 V peak
2

INSULATION AND SAFETY-RELATED SPECIFICATIONS

Table 27.
Parameter Symbol Value Unit Conditions
Rated Dielectric Insulation Voltage 2500 V rms 1-minute duration
Minimum External Air Gap (Clearance) L(I01) 4.90 min mm
Minimum External Tracking (Creepage) L(I02) 4.01 min mm
Minimum Internal Gap (Internal Clearance) 0.017 min mm Insulation distance through insulation
Tracking Resistance (Comparative Tracking Index) CTI >175 V DIN IEC 112/VDE 0303 Part 1
Isolation Group IIIa Material Group (DIN VDE 0110, 1/89, Table 1)
Measured from input terminals to output terminals, shortest distance through air
Measured from input terminals to output terminals, shortest distance path along body
Rev. F | Page 11 of 20
ADuM3210/ADuM3211 Data Sheet

DIN V VDE V 0884-10 (VDE V 0884-10) INSULATION CHARACTERISTICS

These isolators are suitable for reinforced isolation only within the safety limit data. Maintenance of the safety data is ensured by protective circuits. The asterisk (*) marking on the package denotes DIN V VDE V 0884-10 approval for a 560 V peak working voltage.
Table 28.
Description Conditions Symbol Characteristic Unit
Installation Classification per DIN VDE 0110
For Rated Mains Voltage ≤ 150 V rms I to IV For Rated Mains Voltage ≤ 300 V rms I to III For Rated Mains Voltage ≤ 400 V rms I to II
Climatic Classification 40/105/21 Pollution Degree per DIN VDE 0110, Table 1 Maximum Working Insulation Voltage V Input-to-Output Test Voltage, Method B1
Input-to-Output Test Voltage, Method A V
After Environmental Tests Subgroup 1 896 V peak After Input and/or Safety Test Subgroup 2
and Subgroup 3
Highest Allowable Overvoltage Transient overvoltage, tTR = 10 sec VTR 4000 V peak Safety-Limiting Values
Case Temperature TS 150 °C Side 1 Current IS1 160 mA Side 2 Current IS2 170 mA
Insulation Resistance at TS VIO = 500 V RS >109
200
180
160
140
120
100
SAFETY-LIMITING CURRENT (mA)
Figure 3. Thermal Derating Curve, Dependence of Safety-Limiting
SIDE #1
80
60
40
20
0
0
Values on Case Temperature per DIN V VDE V 0884-10
SIDE #2
50 100 150 200
CASE TEMPERAT URE (°C)
× 1.875 = VPR, 100% production test, tm = 1 sec,
V
IORM
2
560 V peak
IORM
1050 V peak
V
PR
partial discharge < 5 pC
× 1.6 = VPR, tm = 60 sec, partial discharge < 5 pC VPR
IORM
× 1.2 = VPR, tm = 60 sec, partial discharge < 5 pC 672 V peak
V
IORM
Maximum value allowed in the event of a failure (see Figure 3)

RECOMMENDED OPERATING CONDITIONS

Table 29.
Parameter Symbol Rating
Operating Temperature TA
ADuM3210A/ADuM3211A −40°C to +105°C ADuM3210B/ADuM3211B −40°C to +105°C ADuM3210T/ADuM3211T −40°C to +125°C ADuM3210WA/ADuM3211WA −40°C to +125°C ADuM3210WB/ADuM3211WB −40°C to +125°C ADuM3210WC/ADuM3211WC −40°C to +125°C
Supply Voltages1 V
ADuM3210A/ADuM3211A 2.7 V to 5.5 V
06866-002
ADuM3210B/ADuM3211B 2.7 V to 5.5 V ADuM3210T/ADuM3211T 3 V to 5.5 V ADuM3210WA/ADuM3211WA 3 V to 5.5 V ADuM3210WB/ADuM3211WB 3 V to 5.5 V ADuM3210WC/ADuM3211WC 3 V to 5.5 V
Maximum Input Signal Rise and
Fall Times
1
All voltages are relative to their respective ground. See the
and Magnetic Field Immunity magnetic fields.
section for information on immunity to external
, V
DD1
DD2
1 ms
DC Correctness
Ω
Rev. F | Page 12 of 20
Data Sheet ADuM3210/ADuM3211

ABSOLUTE MAXIMUM RATINGS

Ambient temperature = 25°C, unless otherwise noted.
Table 30.
Parameter Symbol Rating
Storage Temperature TST −55°C to +150°C
−40°C to +125°C
Ambient Operating
T
A
Temperature Supply Voltages1 V Input Voltage Output Voltage Average Output Current
per Pin Common-Mode
Transie nts
1
All voltages are relative to their respective ground.
2
V
and V
DDI
given channel, respectively.
3
See Figure 3 for information on maximum allowable current for various
temperatures.
4
Refers to common-mode transients across the insulation barrier. Common-
mode transients exceeding the Absolute Maximum Rating can cause latch-up or permanent damage.
1, 2
V
1, 2
V
3
4
refer to the supply voltages on the input and output sides of a
DDO
, V
−0.5 V to +7.0 V
DD1
DD2
, VIB −0.5 V to V
IA
, VOB −0.5 V to V
OA
−22 mA to +22 mA
I
O
, CML −100 kV/μs to +100 kV/μs
CM
H
+ 0.5 V
DDI
+ 0.5 V
DDO
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Table 31. Maximum Continuous Working Voltage
Parameter Max Unit Constraint
AC Voltage,
Bipolar Waveform
AC Voltage,
565 V peak
50-year minimum lifetime
Unipolar Waveform Functional Insulation 1131 V peak
Maximum approved working voltage per IEC 60950-1
Basic Insulation 560 V peak
Maximum approved working voltage per IEC 60950-1 and VDE V 0884-10
DC Voltage
Functional Insulation 1131 V peak
Maximum approved working voltage per IEC 60950-1
Basic Insulation 560 V peak
Maximum approved working voltage per IEC 60950-1 and VDE V 0884-10
1
Refers to continuous voltage magnitude imposed across the isolation
barrier. See the Insulation Lifetime TFDUJPOfor more details.

ESD CAUTION

1
Rev. F | Page 13 of 20
ADuM3210/ADuM3211 Data Sheet

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

1
V
DD1
ADuM3210
2
V
IA
3
V
TOP VIEW
IB
(Not to S cale)
4
GND
1
Figure 4. ADuM3210 Pin Configuration
8
V
DD2
7
V
OA
6
V
OB
5
GND
2
06866-003
V
V
GND
DD1
V
OA
IB
1
1
ADuM3211
2 3
TOP VIEW
(Not to S cale)
4
8
V
DD2
7
V
IA
6
V
OB
5
GND
2
06866-016
Figure 5. ADuM3211 Pin Configuration
Table 32. ADuM3210 Pin Function Descriptions
Pin No. Mnemonic Description
1 V
DD1
Supply Voltage for Isolator Side 1,
Table 33. ADuM3211 Pin Function Descriptions
Pin No. Mnemonic Description
1 V
DD1
2.7 V to 5.5 V. 2 VIA Logic Input A. 3 VIB Logic Input B. 4 GND1
Ground 1. Ground reference for
2 VOA Logic Output A. 3 VIB Logic Input B. 4 GND1
Isolator Side 1.
5 GND2
Ground 2. Ground reference for
5 GND2
Isolator Side 2. 6 VOB Logic Output B. 7 VOA Logic Output A. 8 V
DD2
Supply Voltage for Isolator Side 2,
6 VOB Logic Output B. 7 VIA Logic Input A. 8 V
DD2
2.7 V to 5.5 V.

TRUTH TABLES

Table 34. ADuM3210 Truth Table (Positive Logic)
VIA Input1 VIB Input1 V
H H Powered Powered H H L L Powered Powered L L H L Powered Powered H L L H Powered Powered L H X X Unpowered Powered L L
X X Powered Unpowered Indeterminate Indeterminate
1
H refers to a high logic, and L refers to a low logic.
State V
DD1
State VOA Output1 VOB Output1 Notes
DD2
Supply Voltage for Isolator Side 1,
2.7 V to 5.5 V.
Ground 1. Ground reference for Isolator Side 1.
Ground 2. Ground reference for Isolator Side 2.
Supply Voltage for Isolator Side 2,
2.7 V to 5.5 V.
Outputs return to the input state within 1 μs of V
power restoration
DDI
Outputs return to the input state within 1 μs of V
power restoration
DDO
Table 35. ADuM3211 Truth Table (Positive Logic)
VIA Input1 VIB Input1 V
State V
DD1
State VOA Output1 VOB Output1 Notes
DD2
H H Powered Powered H H L L Powered Powered L L H L Powered Powered H L L H Powered Powered L H X X Unpowered Powered Indeterminate L
X X Powered Unpowered L Indeterminate
1
H refers to a high logic, L refers to a low logic, and X refers to high or low logic, don’t care.
Rev. F | Page 14 of 20
Outputs return to the input state within 1 μs of V
power restoration
DDI
Outputs return to the input state within 1 μs of V
power restoration
DDO
Data Sheet ADuM3210/ADuM3211

TYPICAL PERFORMANCE CHARACTERISTICS

10
20
8
6
4
CURRENT/CHANNEL (mA)
2
0
0
5V
3V
10 20 30
DATA RATE (Mb ps)
Figure 6. Typical Input Supply Current per Channel vs. Data Rate
for 5 V and 3 V Operation
4
3
2
5V
1
CURRENT/CHANNEL (mA)
3V
0
0
10 20 30
DATA RATE (Mb ps)
Figure 7. Typical Output Supply Current per Channel vs. Data Rate
for 5 V and 3 V Operation (No Output Load)
15
10
CURRENT (mA)
5
0
6866-004
0
10 20 30
DATA RATE (Mb ps)
Figure 9. ADuM3210 Typical I
5V
3V
Supply Current vs. Data Rate
DD1
06866-007
for 5 V and 3 V Operation
4
3
5V
2
CURRENT (mA)
1
0
6866-005
0
10 20 30
DATA RATE (Mbps)
Figure 10. ADuM3210 Typical I
3V
Supply Current vs. Data Rate
DD2
06866-008
for 5 V and 3 V Operation
4
3
2
1
CURRENT/CHANNEL (mA)
0
0
5V
3V
10 20 30
DATA RATE (Mb ps)
Figure 8. Typical Output Supply Current per Channel vs. Data Rate
for 5 V and 3 V Operation (15 pF Output Load)
06866-006
Rev. F | Page 15 of 20
10
8
6
4
CURRENT (mA)
2
0
0
10 20 30
DATA RATE (Mbps)
Figure 11. ADuM3211 Typical I
for 5 V and 3 V Operation
5V
3V
06866--015
or I
Supply Current vs. Data Rate
DD1
DD2
ADuM3210/ADuM3211 Data Sheet
V

APPLICATIONS INFORMATION

PC BOARD LAYOUT

The ADuM3210/ADuM3211 digital isolators require no external interface circuitry for the logic interfaces. Power supply bypassing is strongly recommended at the input and output supply pins. The capacitor value should be between 0.01 μF and 0.1 μF. The total lead length between both ends of the capacitor and the input power supply pin should not exceed 20 mm.
See the AN-1109 Application Note for board layout guidelines.

SYSTEM-LEVEL ESD CONSIDERATIONS AND ENHANCEMENTS

System-level ESD reliability (for example, per IEC 61000-4-x) is highly dependent on system design, which varies widely by application. The ADuM3210/ADuM3211 incorporate many enhancements to make ESD reliability less dependent on system design. The enhancements include:
ESD protection cells were added to all input/output interfaces. Key metal trace resistances reduced using wider geometry
and paralleling of lines with vias.
The SCR effect inherent in CMOS devices is minimized
by use of a guarding and isolation technique between the PMOS and NMOS devices.
Areas of high electric field concentration are eliminated
using 45° corners on metal traces.
Supply pin overvoltage is prevented with larger ESD
clamps between each supply pin and its respective ground.
While the ADuM3210/ADuM3211 improve system-level ESD reliability, they are no substitute for a robust system-level design. For detailed recommendations on board layout and system-level design, see the AN-793 Application Note, ESD/Latch-Up Considerations with iCoupler Isolation Products.

PROPAGATION DELAY-RELATED PARAMETERS

Propagation delay is a parameter that describes the time it takes a logic signal to propagate through a component. The propagation delay to a logic low output can differ from the propagation delay to a logic high output.
INPUT (
)
Ix
OUTPUT (V
t
PLH
)
Ox
Figure 12. Propagation Delay Parameters
t
PHL
Pulse width distortion is the maximum difference between these two propagation delay values and is an indication of how accurately the input signal timing is preserved.
Channel-to-channel matching refers to the maximum amount that the propagation delay differs between channels within a single ADuM3210/ADuM3211 component.
50%
50%
Rev. F | Page 16 of 20
06866-009
Propagation delay skew refers to the maximum amount that the propagation delay differs between multiple ADuM3210/
ADuM3211 components operating under the same conditions.

DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY

Positive and negative logic transitions at the isolator input cause narrow (~1 ns) pulses to be sent to the decoder via the transformer. The decoder is bistable and is, therefore, either set or reset by the pulses, indicating input logic transitions. In the absence of logic transitions of more than 2 μs at the input, a periodic set of refresh pulses indicative of the correct input state are sent to ensure dc correctness at the output. If the decoder receives no internal pulses for more than approximately 5 μs, the input side is assumed to be unpowered or nonfunctional, in which case, the isolator output is forced to a default state (see Table 34 and Table 35) by the watchdog timer circuit.
The ADuM3210/ADuM3211 are immune to external magnetic fields. The limitation on the ADuM3210/ADuM3211 magnetic field immunity is set by the condition in which induced voltage in the transformer receiving coil is sufficiently large to either falsely set or reset the decoder. The following analysis defines the conditions under which this can occur. The 3 V operating condition of the ADuM3210/ADuM3211 is examined because it represents the most susceptible mode of operation.
The pulses at the transformer output have an amplitude greater than 1.0 V. The decoder has a sensing threshold at about 0.5 V, therefore establishing a 0.5 V margin in which induced voltages can be tolerated. The voltage induced across the receiving coil is given by
V = (−/dt) ∑π r
where:
β is the magnetic flux density (gauss). N is the number of turns in the receiving coil. r
is the radius of the nth turn in the receiving coil (cm).
n
Given the geometry of the receiving coil in the ADuM3210/ ADuM3211 and an imposed requirement that the induced voltage is at most 50% of the 0.5 V margin at the decoder, a maximum allowable magnetic field is calculated as shown in Figure 13.
100
10
1
0.1
DENSITY (kgauss)
0.01
MAXIMUM ALLOWABLE MAGNETIC FLUX
0.001 1k 10k 10M
Figure 13. Maximum Allowable External Magnetic Flux Density
2
, n = 1, 2, ... , N
n
MAGNETIC FIELD FREQUENCY (Hz)
1M
100M100k
06866-010
Data Sheet ADuM3210/ADuM3211
For example, at a magnetic field frequency of 1 MHz, the maximum allowable magnetic field of 0.2 kgauss induces a voltage of 0.25 V at the receiving coil. This is about 50% of the sensing threshold and does not cause a faulty output transition. Similarly, if such an event were to occur during a transmitted pulse (and had the worst-case polarity), it would reduce the received pulse from >1.0 V to 0.75 V, which is still well above the 0.5 V sensing threshold of the decoder.
The preceding magnetic flux density values correspond to specific current magnitudes at given distances away from the
ADuM3210/ADuM3211 transformers. Figure 14 expresses
these allowable current magnitudes as a function of frequency for selected distances. As shown, the ADuM3210/ADuM3211 are immune and can be affected only by extremely large currents operated at a high frequency and very close to the component. For the 1 MHz example, a 0.5 kA current would have to be placed 5 mm away from the ADuM3210/ADuM3211 to affect the operation of the component.
1000
DISTANCE = 1m
100
10
DISTANCE = 100mm
1
DISTANCE = 5mm
0.1
MAXIMUM ALL OWABLE CURRENT (kA)
0.01 1k 10k 100M100k 1M 10M
MAGNETIC F I ELD FREQUENCY (Hz)
Figure 14. Maximum Allowable Current for Various
Current-to-ADuM3210/ADuM3211 Spacings
Note that at combinations of strong magnetic fields and high frequencies, any loops formed by the printed circuit board (PCB) traces may induce sufficiently large error voltages to trigger the threshold of succeeding circuitry. Care should be taken in the layout of such traces to avoid this possibility.
06866-011

POWER CONSUMPTION

The supply current at a given channel of the ADuM3210/
ADuM3211 isolator is a function of the supply voltage, channel
data rate, and channel output load.
For each input channel, the supply current is given by
I
= I
DDI
DDI (Q)
I
DDI
= I
× (2f − fr) + I
DDI (D)
DDI (Q)
For each output channel, the supply current is given by
I
I
DDO
DDO
= I
= (I
f ≤ 0.5fr
DDO (Q)
+ (0.5 × 10−3) × CLV
DDO (D)
) × (2f − fr) + I
DDO
where:
I
, I
DDI (D)
are the input and output dynamic supply currents
DDO (D)
per channel (mA/Mbps).
I
, I
DDI (Q)
are the specified input and output quiescent
DDO (Q)
supply currents (mA).
C
is the output load capacitance (pF).
L
is the output supply voltage (V).
V
DDO
f is the input logic signal frequency (MHz, half of the input data
rate, NRZ signaling).
f
is the input stage refresh rate (Mbps).
r
To calculate the total I
DD1
and I
supply current, the supply
DD2
currents for each input and output channel corresponding to
and I
I
DD1
are calculated and totaled.
DD2
Figure 6 provides the input supply currents per channel as a function of data rate. Figure 7 and Figure 8 provide the output supply currents per channel as a function of data rate for an unloaded output condition and for a 15 pF output condition, respectively. Figure 9 through Figure 11 provide total I
supply current as a function of data rate for the ADuM3210
I
DD2
and ADuM3211 channel configurations.
f ≤ 0.5fr
f > 0.5fr
DDO (Q)
f > 0.5fr
and
DD1
Rev. F | Page 17 of 20
ADuM3210/ADuM3211 Data Sheet

INSULATION LIFETIME

All insulation structures eventually break down when subjected to voltage stress over a sufficiently long period. The rate of insulation degradation is dependent on the characteristics of the voltage waveform applied across the insulation. In addition to the testing performed by the regulatory agencies, Analog Devices carries out an extensive set of evaluations to determine the lifetime of the insulation structure within the ADuM3210/ADuM3211.
Analog Devices performs accelerated life testing using voltage levels higher than the rated continuous working voltage. Acceleration factors for several operating conditions are determined. These factors allow calculation of the time to failure at the actual working voltage.
The values shown in Tabl e 31 summarize the peak voltage for 50 years of service life for a bipolar ac operating condition and the maximum CSA/VDE approved working voltages. In many cases, the approved working voltage is higher than the 50-year service life voltage. Operation at these high working voltages can lead to shortened insulation life in some cases.
The insulation lifetime of the ADuM3210/ADuM3211 depends on the voltage waveform type imposed across the isolation barrier. The iCoupler insulation structure degrades at different rates depending on whether the waveform is bipolar ac, unipolar ac, or dc. Figure 15, Figure 16, and Figure 17 illustrate these different isolation voltage waveforms.
A bipolar ac voltage environment is the most stringent. The goal of a 50-year operating lifetime under the ac bipolar condition determines the Analog Devices recommended maximum working voltage.
In the case of unipolar ac or dc voltage, the stress on the insulation is significantly lower. This allows operation at higher working voltages while still achieving a 50-year service life. The working voltages listed in Tabl e 31 can be applied while maintaining the 50-year minimum lifetime provided that the voltage conforms to either the unipolar ac or dc voltage cases. Any cross-insulation voltage waveform that does not conform to Figure 16 or Figure 17 should be treated as a bipolar ac waveform, and its peak voltage should be limited to the 50-year lifetime voltage value listed in Tab l e 3 1 .
Note that the voltage presented in Figure 16 is shown as sinusoidal for illustration purposes only. It is meant to represent any voltage waveform varying between 0 V and some limiting value. The limiting value can be positive or negative, but the voltage cannot cross 0 V.
RATED PEAK VOL TAGE
0V
Figure 15. Bipolar AC Waveform
06866-012
RATED PEAK VOL TAGE
0V
Figure 16. Unipolar AC Waveform
06866-013
RATED PEAK VOL TAGE
0V
Figure 17. DC Waveform
06866-014
Rev. F | Page 18 of 20
Data Sheet ADuM3210/ADuM3211

OUTLINE DIMENSIONS

5.00 (0.1968)
4.80 (0.1890)
4.00 (0.1574)
3.80 (0.1497)
0.25 (0.0098)
0.10 (0.0040)
COPLANARITY
0.10
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLYAND ARE NOT APPROPRIATE FOR USE IN DESIGN.
85
1
1.27 (0.0500)
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MS-012-AA
BSC
6.20 (0.2441)
5.80 (0.2284)
4
1.75 (0.0688)
1.35 (0.0532)
0.51 (0.0201)
0.31 (0.0122)
8° 0°
0.25 (0.0098)
0.17 (0.0067)
0.50 (0.0196)
0.25 (0.0099)
1.27 (0.0500)
0.40 (0.0157)
45°
012407-A
Figure 18. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body (R-8)
Dimensions shown in millimeters and (inches)
Rev. F | Page 19 of 20
ADuM3210/ADuM3211 Data Sheet

ORDERING GUIDE

Number of Inputs, V
Side
DD1
Model
1, 2
ADuM3210ARZ 2 0 1 50 5 −40°C to +105°C R-8 ADuM3210ARZ-RL7 2 0 1 50 5 −40°C to +105°C R-8 ADuM3210BRZ 2 0 10 50 3 −40°C to +105°C R-8 ADuM3210BRZ-RL7 2 0 10 50 3 −40°C to +105°C R-8 ADuM3210TRZ 2 0 10 50 3 −40°C to +125°C R-8 ADuM3210TRZ-RL7 2 0 10 50 3 −40°C to +125°C R-8 ADuM3210WARZ 2 0 1 50 5 −40°C to +125°C R-8 ADuM3210WARZ-RL7 2 0 1 50 5 −40°C to +125°C R-8 ADuM3210WBRZ 2 0 10 50 3 −40°C to +125°C R-8 ADuM3210WBRZ-RL7 2 0 10 50 3 −40°C to +125°C R-8 ADuM3210WCRZ 2 0 25 50 3 −40°C to +125°C R-8 ADuM3210WCRZ-RL7 2 0 25 50 3 −40°C to +125°C R-8 ADuM3211ARZ 1 1 1 50 6 −40°C to +105°C R-8 ADuM3211ARZ-RL7 1 1 1 50 6 −40°C to +105°C R-8 ADuM3211BRZ 1 1 10 50 4 −40°C to +105°C R-8 ADuM3211BRZ-RL7 1 1 10 50 4 −40°C to +105°C R-8 ADuM3211TRZ 1 1 10 50 4 −40°C to +125°C R-8 ADuM3211TRZ-RL7 1 1 10 50 4 −40°C to +125°C R-8 ADuM3211WARZ 1 1 1 50 6 −40°C to +125°C R-8 ADuM3211WARZ-RL7 1 1 1 50 6 −40°C to +125°C R-8 ADuM3211WBRZ 1 1 10 50 4 −40°C to +125°C R-8 ADuM3211WBRZ-RL7 1 1 10 50 4 −40°C to +125°C R-8 ADuM3211WCRZ 1 1 25 50 4 −40°C to +125°C R-8 ADuM3211WCRZ-RL7 1 1 25 50 4 −40°C to +125°C R-8
1
Z = RoHS Compliant Part.
2
W = Qualified for Automotive Applications.
3
R-8 = 8-lead, narrow body SOIC_N.
Number of Inputs, V
Side
DD2
Maximum Data Rate (Mbps)
Maximum Propagation Delay, 5 V (ns)
Maximum Pulse Width Distortion (ns) Temperature Range
Package Option3

AUTOMOTIVE PRODUCTS

The ADuM3210W/ADuM3211W models are available with controlled manufacturing to support the quality and reliability requirements of automotive applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to obtain the specific Automotive Reliability reports for these models.
©2008–2012 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06866-0-2/12(F)
Rev. F | Page 20 of 20
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