ANALOG DEVICES ADUM1310 Service Manual

Triple-Channel Digital Isolators
Data Sheet

FEATURES

Low power operation
5 V operation
1.7 mA per channel maximum @ 0 Mbps to 2 Mbps
4.0 mA per channel maximum @ 2 Mbps to 10 Mbps
3 V operation
1.0 mA per channel maximum @ 0 Mbps to 2 Mbps
2.1 mA per channel maximum @ 2 Mbps to 10 Mbps Bidirectional communication 3 V/5 V level translation Schmitt trigger inputs High temperature operation: 105°C Up to 10 Mbps data rate (NRZ) Programmable default output state High common-mode transient immunity: >25 kV/μs 16-lead, RoHS-compliant, SOIC wide body package
8.1 mm external creepage
Safety and regulatory approvals
UL recognition: 2500 V rms for 1 minute per UL 1577 CSA Component Acceptance Notice #5A VDE certificate of conformity
DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12 V
= 560 V peak working voltage
IORM

APPLICATIONS

General-purpose multichannel isolation SPI interface/data converter isolation RS-232/RS-422/RS-485 transceiver Industrial field bus isolation
ADuM1310/ADuM1311

FUNCTIONAL BLOCK DIAGRAMS

1
V
GND
DISABLE
GND
DD1
V
V
V
NC
1
IA
IB
IC
1
ADuM1310
2
ENCODE DECODE
3
ENCODE DECODE
4
ENCODE DECODE
5
6
7
8
Figure 1. ADuM1310
1
V
GND
CTRL
GND
V
DD1
V
V
OC
NC
1
IA
IB
1
1
ADuM1311
2
ENCODE DECODE
3
ENCODE DECODE
4
DECODE ENCODE
5
6
7
8
Figure 2. ADuM1311
16
V
DD2
GND
15
2
14
V
OA
13
V
OB
12
V
OC
11
NC
10
CTRL
2
9
GND
2
04904-001
16
V
DD2
GND
15
2
14
V
OA
13
V
OB
12
V
IC
11
NC
10
CTRL
2
9
GND
2
04904-002

GENERAL DESCRIPTION

The ADuM131x1 are 3-channel digital isolators based on
Analog Devices, Inc. iCoupler® technology. Combining high
speed CMOS and monolithic air core transformer technology, these isolation components provide outstanding performance characteristics superior to alternatives such as optocoupler devices.
By avoiding the use of LEDs and photodiodes, iCoupler devices remove the design difficulties commonly associated with opto­couplers. The typical optocoupler concerns regarding uncertain current transfer ratios, maximum operating temperature, and lifetime effects are eliminated with the simple iCoupler digital interfaces and stable performance characteristics. The need for external drivers and other discrete components is eliminated with these iCoupler products. Furthermore, iCoupler devices consume one-tenth to one-sixth the power of optocouplers at comparable signal data rates. The iCoupler also offers higher channel densities and more options for channel directionality.
Rev. H
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
The ADuM131x isolators provide three independent isolation channels in a variety of channel configurations and data rates up to 10 Mbps (see the Ordering Guide). All models operate with the supply voltage on either side ranging from 2.7 V to
5.5 V, providing compatibility with lower voltage systems as well as enabling voltage translation functionality across the isolation barrier. All products allow the user to predetermine the default output state in the absence of input V
power with a simple
DD1
control pin. Unlike other optocoupler alternatives, the ADuM131x isolators have a patented refresh feature that ensures dc correctness in the absence of input logic transitions and during power-up/ power-down conditions.
1
Protected by U.S. Patents 5,952,849; 6,873,065; and 7,075,329. Other patents
pending.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2005–2012 Analog Devices, Inc. All rights reserved.
ADuM1310/ADuM1311 Data Sheet

TABLE OF CONTENTS

Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagrams ............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Electrical Characteristics—5 V Operation................................ 3
Electrical Characteristics—3 V Operation................................ 5
Electrical Characteristics—Mixed 5 V/3 V or 3 V/5 V
Operation ....................................................................................... 7
Package Characteristics ............................................................. 10
Regulatory Information ............................................................. 10
Insulation and Safety-Related Specifications .......................... 10
DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12
Insulation Characteristics .......................................................... 11
Recommended Operating Conditions .................................... 11
Absolute Maximum Ratings ......................................................... 12
ESD Caution................................................................................ 12
Pin Configurations and Function Descriptions ......................... 13
Typical Performance Characteristics ........................................... 16
Applications Information .............................................................. 18
PC Board Layout ........................................................................ 18
Propagation Delay-Related Parameters ................................... 18
DC Correctness and Magnetic Field Immunity ..................... 18
Power Consumption .................................................................. 19
Insulation Lifetime ..................................................................... 20
Outline Dimensions ....................................................................... 21
Ordering Guide .......................................................................... 21

REVISION HISTORY

3/12—Rev. G to Rev. H
Created Hyperlink for Safety and Regulatory Approvals
Entry in Features Section ................................................................. 1
Change to PC Board Layout Section ............................................ 18
Updated Outline Dimensions ....................................................... 21
6/07—Rev. F to Rev. G
Updated VDE Certification Throughout ...................................... 1
Changes to Features and Applications ........................................... 1
Changes to DC Specifications in Table 1 ....................................... 3
Changes to DC Specifications in Table 2 ....................................... 5
Changes to DC Specifications in Table 3 ....................................... 7
Changes to Regulatory Information Section .............................. 10
Added Table 10 ............................................................................... 12
Added Insulation Lifetime Section .............................................. 19
1/07—Rev. E to Rev. F
Added ADuM1311 ............................................................. Universal
Changes to Typical Performance Characteristics Section ......... 16
Changes to Ordering Guide .......................................................... 20
10/06—Rev. D to Rev. E
Removed ADuM1410 ........................................................ Universal
Updated Format .................................................................. Universal
Change to Figure 3 ......................................................................... 10
Changes to Table 10 ....................................................................... 10
Changes to Application Information Section ............................. 12
Updated Outline Dimensions ....................................................... 18
Changes to Ordering Guide .......................................................... 18
3/06—Rev. C to Rev. D
Added Note 1; Changes to Figure 2 ................................................ 1
Changes to Absolute Maximum Ratings ..................................... 11
11/05—Revision C: Initial Version
Rev. H | Page 2 of 24
Data Sheet ADuM1310/ADuM1311

SPECIFICATIONS

ELECTRICAL CHARACTERISTICS—5 V OPERATION

4.5 V ≤ V unless otherwise noted; all typical specifications are at T
Table 1.
Parameter Symbol Min Typ Max Unit Test Conditions
DC SPECIFICATIONS
ADuM1310, Total Supply Current,
ADuM1311, Total Supply Current,
For All Models
SWITCHING SPECIFICATIONS
ADuM131xARWZ
ADuM131xBRWZ
≤ 5.5 V, 4.5 V ≤ V
DD1
Three Channels
1
≤ 5.5 V; all minimum/maximum specifications apply over the entire recommended operation range,
DD2
= 25°C, V
A
DD1
= V
= 5 V. All voltages are relative to their respective grounds.
DD2
DC to 2 Mbps
V
Supply Current I
DD1
2.4 3.2 mA
DD1 (Q)
DC to 1 MHz logic signal frequency
V
Supply Current I
DD2
1.2 1.6 mA
DD2 (Q)
DC to 1 MHz logic signal frequency
10 Mbps (BRWZ Grade Only)
V
Supply Current I
DD1
V
Supply Current I
DD2
1
Three Channels
6.6 9.0 mA 5 MHz logic signal frequency
DD1 (10)
2.1 3.0 mA 5 MHz logic signal frequency
DD2 (10)
DC to 2 Mbps
V
Supply Current I
DD1
2.2 2.8 mA
DD1 (Q)
DC to 1 MHz logic signal frequency
V
Supply Current I
DD2
1.8 2.4 mA
DD2 (Q)
DC to 1 MHz logic signal frequency
10 Mbps (BRWZ Grade Only)
V
Supply Current I
DD1
V
Supply Current I
DD2
Input Currents
Logic High Input Threshold Logic Low Input Threshold
4.5 5.7 mA 5 MHz logic signal frequency
DD1 (10)
3.5 4.3 mA 5 MHz logic signal frequency
DD2 (10)
, IIB, IIC, I
I
IA
I
CTRL2
V
IH
V
IL
OAH
OAL
, I
, V
, V
CTRL1
DISABLE
OBH
, V
OBL
−10 +0.01 +10 μA
,
0 V ≤ V 0 V ≤ V 0 V ≤ V
2.0 V
0.8 V (V
or V
, V
OCL
DD1
OCH
(V
DD1
0.0 0.1 V IOx = 20 μA, VIx = V
) − 0.1 5.0 V IOx = −20 μA, VIx = V
DD2
or V
) − 0.4 4.8 V IOx = −4 mA, VIx = V
DD2
, VIB, VIC ≤ V
IA
, V
CTRL1
CTRL2
≤ V
DISABLE
0.2 0.4 V IOx = 4 mA, VIx = V
≤ V
DD1
or V
DD1
DD2
or V
DD1
DD2,
Logic High Output Voltages V
IxH
IxH
Logic Low Output Voltages V
IxL
IxL
Minimum Pulse Width2 PW 1000 ns CL = 15 pF, CMOS signal levels Maximum Data Rate3 1 Mbps CL = 15 pF, CMOS signal levels Propagation Delay4 t Pulse Width Distortion, |t
PLH
− t
PHL
4
| Propagation Delay Skew5 t Channel-to-Channel Matching6 t
, t
20 100 ns CL = 15 pF, CMOS signal levels
PHL
PLH
PWD 40 ns CL = 15 pF, CMOS signal levels
50 ns CL = 15 pF, CMOS signal levels
PSK
50 ns CL = 15 pF, CMOS signal levels
PSKCD/OD
Minimum Pulse Width2 PW 100 ns CL = 15 pF, CMOS signal levels Maximum Data Rate3 10 Mbps CL = 15 pF, CMOS signal levels Propagation Delay4 t Pulse Width Distortion, |t
PLH
− t
PHL
4
|
, t
20 30 50 ns CL = 15 pF, CMOS signal levels
PHL
PLH
PWD 5 ns CL = 15 pF, CMOS signal levels
Change vs. Temperature 5 ps/°C CL = 15 pF, CMOS signal levels
Propagation Delay Skew5 t
30 ns CL = 15 pF, CMOS signal levels
PSK
,
Rev. H | Page 3 of 24
ADuM1310/ADuM1311 Data Sheet
Parameter Symbol Min Typ Max Unit Test Conditions
5 ns CL = 15 pF, CMOS signal levels
Channel-to-Channel Matching,
Codirectional Channels
6
Channel-to-Channel Matching,
Opposing-Directional Channels
For All Models
Output Rise/Fall Time (10% to 90%) tR/tF 2.5 ns CL = 15 pF, CMOS signal levels Common-Mode Transient Immunity
at Logic High Output
Common-Mode Transient Immunity
at Logic Low Output
7
7
Refresh Rate fr 1.2 Mbps Input Enable Time8 t Input Disable Time8 t Input Supply Current per Channel,
Quiescent
Output Supply Current per Channel,
Quiescent
Input Dynamic Supply Current
per Channel
Output Dynamic Supply Current per
Channel
1
The supply current values for all four channels are combined when running at identical data rates. Output supply current values are specified with no output load
present. The supply current associated with an individual channel operating at a given data rate can be calculated as described in the P section. See through Figure 8 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See through
Figure 6
Figure 12
2
The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed.
3
The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed.
4
t
measured from the 50% level of the rising edge of the VIx signal to the 50% level of the rising edge of the VOx signal.
5
t
within the recommended operating conditions.
6
Codirectional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on the same side of
the isolation barrier. Opposing-directional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on opposing sides of the isolation barrier.
7
CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 V
that can be sustained while maintaining VO < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The transient magnitude is the range over which the common mode is slewed.
8
Input enable time is the duration from when V
transitions. If an input data logic transition within a given channel does occur within this time interval, the output of that channel reaches the correct state within the much shorter duration, as determined by the propagation delay specifications within this data sheet. Input disable time is the duration from when V until the output states are guaranteed to reach their programmed output levels, as determined by the CTRL2 logic state (see Table 13).
9
I
the same orientation as Channel A must be included to account for the total current consumed.
10
Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See through for information on per-channel supply current for unloaded and loaded conditions. See the section for guidance on calculating the per-channel supply current for a given data rate.
for total V
propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. t
PHL
is the magnitude of the worst-case difference in t
PSK
is the quiescent current drawn from the corresponding supply by a single channel. To calculate the total quiescent current, an additional inaccessible channel in
DDx (Q)
9
9
10
10
and V
DD1
supply currents as a function of data rate for ADuM1310/ADuM1311 channel configurations.
DD2
t
PSKCD
t
6 ns CL = 15 pF, CMOS signal levels
PSKOD
6
|CMH| 25 35 kV/μs
= V
or V
V
Ix
DD1
, VCM = 1000 V,
DD2
transient magnitude = 800 V
|CML| 25 35 kV/μs
= 0 V, VCM = 1000 V,
V
Ix
transient magnitude = 800 V
ENABLE
DISABLE
0.50 0.73 mA
I
DDI (Q)
I
0.38 0.53 mA
DDO (Q)
0.12
I
DDI (D)
2.0 μs VIA, VIB, VIC = 0 V or V
5.0 μs VIA, VIB, VIC = 0 V or V
mA/ Mbps
0.04
I
DDO (D)
mA/ Mbps
ower Consumption
Figure 9
propagation delay is
PLH
or t
that is measured between units at the same operating temperature, supply voltages, and output load
PHL
PLH
. CML is the maximum common-mode voltage slew rate
DD2
is set low until the output states are guaranteed to match the input states in the absence of any input data logic
DISABLE
DISABLE
Power Consumption
Figure 6
Figure 8
DD1
DD1
is set high
Rev. H | Page 4 of 24
Data Sheet ADuM1310/ADuM1311

ELECTRICAL CHARACTERISTICS—3 V OPERATION

2.7 V ≤ V unless otherwise noted; all typical specifications are at T
Table 2.
Parameter Symbol Min Typ Max Unit Test Conditions
DC SPECIFICATIONS
ADuM1310, Total Supply Current,
ADuM1311, Total Supply Current,
For All Models
SWITCHING SPECIFICATIONS
ADuM131xARWZ
ADuM131xBRWZ
≤ 3.6 V, 2.7 V ≤ V
DD1
Three Channels
1
≤ 3.6 V; all minimum/maximum specifications apply over the entire recommended operation range,
DD2
= 25°C, V
A
DD1
= V
= 3.0 V. All voltages are relative to their respective ground.
DD2
DC to 2 Mbps
V
Supply Current I
DD1
V
Supply Current I
DD2
1.2 1.6 mA DC to 1 MHz logic signal frequency
DD1 (Q)
0.8 1.0 mA DC to 1 MHz logic signal frequency
DD2 (Q)
10 Mbps (BRWZ Grade Only)
V
Supply Current I
DD1
V
Supply Current I
DD2
Three Channels
1
3.4 4.9 mA 5 MHz logic signal frequency
DD1 (10)
1.1 1.3 mA 5 MHz logic signal frequency
DD2 (10)
DC to 2 Mbps
V
Supply Current I
DD1
V
Supply Current I
DD2
1.0 1.6 mA DC to 1 MHz logic signal frequency
DD1 (Q)
0.9 1.4 DC to 1 MHz logic signal frequency
DD2 (Q)
10 Mbps (BRWZ Grade Only)
V
Supply Current I
DD1
V
Supply Current I
DD2
Input Currents
Logic High Input Threshold Logic Low Input Threshold
2.5 3.5 mA 5 MHz logic signal frequency
DD1 (10)
1.9 2.6 5 MHz logic signal frequency
DD2 (10)
, IIB, IIC, I
I
IA
I
CTRL2
V
IH
V
IL
OAH
OAL
, I
, V
, V
DISABLE
OBH
, V
OBL
−10 +0.01 +10 μA
CTRL1
,
0 V ≤ V 0 V ≤ V 0 V ≤ V
1.6 V
0.4 V (V
or V
, V
DD1
OCH
(V
DD1
0.0 0.1 V IOx = 20 μA, VIx = V
OCL
0.2 0.4 V I
) − 0.1 3.0 V IOx = −20 μA, VIx = V
DD2
or V
) − 0.4 2.8 V IOx = −4 mA, VIx = V
DD2
Ox
, VIB, VIC ≤ V
IA
, V
CTRL1
CTRL2
≤ V
DISABLE
= 4 mA, VIx = V
DD1
≤ V
IxL
IxL
IxH
DD1
IxH
Logic Low Output Voltages V
or V
DD1
Logic High Output Voltages V
or V
DD2
DD2,
Minimum Pulse Width2 PW 1000 ns CL = 15 pF, CMOS signal levels Maximum Data Rate3 1 Mbps CL = 15 pF, CMOS signal levels Propagation Delay4 t Pulse Width Distortion, |t
PLH
− t
|4 PWD 40 ns CL = 15 pF, CMOS signal levels
PHL
Propagation Delay Skew5 t Channel-to-Channel Matching6 t
, t
20 100 ns CL = 15 pF, CMOS signal levels
PHL
PLH
50 ns CL = 15 pF, CMOS signal levels
PSK
50 ns CL = 15 pF, CMOS signal levels
PSKCD/OD
Minimum Pulse Width2 PW 100 ns CL = 15 pF, CMOS signal levels Maximum Data Rate3 10 Mbps CL = 15 pF, CMOS signal levels Propagation Delay4 t Pulse Width Distortion, |t
PLH
− t
|4 PWD 5 ns CL = 15 pF, CMOS signal levels
PHL
, t
20 30 50 ns CL = 15 pF, CMOS signal levels
PHL
PLH
Change vs. Temperature 5 ps/°C CL = 15 pF, CMOS signal levels Propagation Delay Skew5 t Channel-to-Channel Matching,
Codirectional Channels
6
Channel-to-Channel Matching,
Opposing-Directional Channels
30 ns CL = 15 pF, CMOS signal levels
PSK
5 ns CL = 15 pF, CMOS signal levels
t
PSKCD
6 ns CL = 15 pF, CMOS signal levels
t
PSKOD
6
,
Rev. H | Page 5 of 24
ADuM1310/ADuM1311 Data Sheet
Parameter Symbol Min Typ Max Unit Test Conditions
For All Models
Output Rise/Fall Time (10% to 90%) tR/tF 2.5 ns CL = 15 pF, CMOS signal levels Common-Mode Transient Immunity
at Logic High Output
Common-Mode Transient Immunity
at Logic Low Output
7
7
|CMH| 25 35 kV/μs
|CML| 25 35 kV/μs
Refresh Rate fr 1.1 Mbps Input Enable Time8 t Input Disable Time8 t Input Supply Current per Channel,
Quiescent
Output Supply Current per Channel,
Quiescent
Input Dynamic Supply Current
per Channel
Output Dynamic Supply Current
per Channel
1
The supply current values for all four channels are combined when running at identical data rates. Output supply current values are specified with no output load
present. The supply current associated with an individual channel operating at a given data rate can be calculated as described in the P section. See through Figure 8 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See through
Figure 6
Figure 12
2
The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed.
3
The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed.
4
t
measured from the 50% level of the rising edge of the VIx signal to the 50% level of the rising edge of the VOx signal.
5
t
within the recommended operating conditions.
6
Codirectional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on the same side of
the isolation barrier. Opposing-directional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on opposing sides of the isolation barrier.
7
CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 V
that can be sustained while maintaining VO < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The transient magnitude is the range over which the common mode is slewed.
8
Input enable time is the duration from when V
transitions. If an input data logic transition within a given channel does occur within this time interval, the output of that channel reaches the correct state within the much shorter duration, as determined by the propagation delay specifications within this data sheet. Input disable time is the duration from when V until the output states are guaranteed to reach their programmed output levels, as determined by the CTRL2 logic state (see Table 13).
9
I
the same orientation as Channel A must be included to account for the total current consumed.
10
Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See through for information on per-channel supply current for unloaded and loaded conditions. See the section for guidance on calculating the per-channel supply current for a given data rate.
for total V
propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. t
PHL
is the magnitude of the worst-case difference in t
PSK
is the quiescent current drawn from the corresponding supply by a single channel. To calculate the total quiescent current, an additional inaccessible channel in
DDx (Q)
9
9
DD1
10
10
and V
supply currents as a function of data rate for ADuM1310/ADuM1311 channel configurations.
DD2
ENABLE
DISABLE
0.25 0.38 mA
I
DDI (Q)
0.19 0.33 mA
I
DDO (Q)
0.07
I
DDI (D)
I
0.02
DDO (D)
or t
that is measured between units at the same operating temperature, supply voltages, and output load
PHL
PLH
is set low until the output states are guaranteed to match the input states in the absence of any input data logic
DISABLE
= V
or V
V
Ix
DD1
, VCM = 1000 V,
DD2
transient magnitude = 800 V
= 0 V, VCM = 1000 V,
V
Ix
transient magnitude = 800 V
2.0 μs VIA, VIB, VIC = 0 V or V
5.0 μs VIA, VIB, VIC = 0 V or V
mA/ Mbps
mA/ Mbps
ower Consumption
Figure 9
propagation delay is
PLH
. CML is the maximum common-mode voltage slew rate
DD2
Power Consumption
Figure 6
Figure 8
DD1
DD1
DISABLE
is set high
Rev. H | Page 6 of 24
Data Sheet ADuM1310/ADuM1311

ELECTRICAL CHARACTERISTICS—MIXED 5 V/3 V OR 3 V/5 V OPERATION

5 V/3 V operation: 4.5 V ≤ V minimum/maximum specifications apply over the entire recommended operation range, unless otherwise noted; all typical specifications are at T
= 25°C; V
A
= 3.0 V, V
DD1
Table 3.
Parameter Symbol Min Typ Max Unit Test Conditions
DC SPECIFICATIONS
ADuM1310, Total Supply Current,
Three Channels
1
DC to 2 Mbps
V
Supply Current I
DD1
5 V/3 V Operation 2.4 3.2 mA
3 V/5 V Operation 1.2 1.6 mA
V
Supply Current I
DD2
5 V/3 V Operation 0.8 1.0 mA
3 V/5 V Operation 1.2 1.6 mA
10 Mbps (BRWZ Grade Only)
V
Supply Current I
DD1
5 V/3 V Operation 6.5 8.2 mA 5 MHz logic signal frequency 3 V/5 V Operation 3.4 4.9 mA 5 MHz logic signal frequency
V
Supply Current I
DD2
5 V/3 V Operation 1.1 1.3 mA 5 MHz logic signal frequency 3 V/5 V Operation 1.9 2.2 mA 5 MHz logic signal frequency
ADuM1311, Total Supply Current,
Three Channels
1
DC to 2 Mbps
V
Supply Current I
DD1
5 V/3 V Operation 2.2 2.8 mA
3 V/5 V Operation 1.0 1.6 mA
V
Supply Current I
DD2
5 V/3 V Operation 0.9 1.4 mA
3 V/5 V Operation 1.8 2.4 mA
10 Mbps (BRWZ Grade Only)
V
Supply Current I
DD1
5 V/3 V Operation 4.5 5.7 mA 5 MHz logic signal frequency 3 V/5 V Operation 2.5 3.5 mA 5 MHz logic signal frequency
V
Supply Current I
DD2
5 V/3 V Operation 1.9 2.6 mA 5 MHz logic signal frequency 3 V/5 V Operation 3.5 4.3 mA 5 MHz logic signal frequency
For All Models
Input Currents
Logic High Input Threshold
V
= 5 V Operation 2.0 V
DDX
V
= 3 V Operation 1.6 V
DDX
≤ 5.5 V, 2.7 V ≤ V
DD1
= 5 V or V
DD2
DD1 (Q)
DD2 (Q)
DD1 (10)
DD2 (10)
DD1 (Q)
DD2 (Q)
DD1 (10)
DD2 (10)
, IIB, IIC, I
I
IA
I
CTRL2
V
IH
≤ 3.6 V; 3 V/5 V operation: 2.7 V ≤ V
DD2
= 5 V, V
DD1
= 3.0 V. All voltages are relative to their respective ground.
DD2
≤ 3.6 V, 4.5 V ≤ V
DD1
DC to 1 MHz logic signal frequency
DC to 1 MHz logic signal frequency
DC to 1 MHz logic signal frequency
DC to 1 MHz logic signal frequency
DC to 1 MHz logic signal frequency
DC to 1 MHz logic signal frequency
DC to 1 MHz logic signal frequency
DC to 1 MHz logic signal frequency
−10 +0.01 +10 μA
, I
DISABLE
CTRL1
,
0 V ≤ V 0 V ≤ V 0 V ≤ V
≤ 5.5 V; all
DD2
, VIB, VIC ≤ V
IA
, V
CTRL1
≤ V
DISABLE
CTRL2
DD1
≤ V
DD1
or V
DD1
or V
DD2
DD2
,
,
Rev. H | Page 7 of 24
ADuM1310/ADuM1311 Data Sheet
Parameter Symbol Min Typ Max Unit Test Conditions
Logic Low Input Threshold
V
= 5 V Operation 0.8 V
DDX
V
= 3 V Operation 0.4 V
DDX
Logic High Output Voltages V
Logic Low Output Voltages V
SWITCHING SPECIFICATIONS
ADuM131xARWZ
Minimum Pulse Width2 PW 1000 ns CL = 15 pF, CMOS signal levels Maximum Data Rate3 1 Mbps CL = 15 pF, CMOS signal levels Propagation Delay4 t Pulse Width Distortion |t Propagation Delay Skew5 t Channel-to-Channel Matching6 t
ADuM131xBRWZ
Minimum Pulse Width2 PW 100 ns CL = 15 pF, CMOS signal levels Maximum Data Rate3 10 Mbps CL = 15 pF, CMOS signal levels Propagation Delay4 t Pulse Width Distortion, |t
Change vs. Temperature 5 ps/°C CL = 15 pF, CMOS signal levels Propagation Delay Skew5 t Channel-to-Channel Matching,
Codirectional Channels
Channel-to-Channel Matching,
Opposing-Directional Channels
For All Models
Output Rise/Fall Time (10% to 90%) tR/tF C
5 V/3 V Operation 2.5 ns
3 V/5 V Operation 2.5 ns Common-Mode Transient
Immunity at Logic High Output
Common-Mode Transient
Immunity at Logic Low Output
Refresh Rate fr
5 V/3 V Operation 1.2 Mbps
3 V/5 V Operation 1.1 Mbps Input Enable Time8 t Input Disable Time8 t Input Supply Current per Channel,
Quiescent
V
DDX
V
DDX
9
= 5 V Operation I = 3 V Operation I
Output Supply Current per
Channel, Quiescent
V
= 5 V Operation I
DDX
V
= 3 V Operation I
DDX
Input Dynamic Supply Current per
Channel
V
V
10
= 5 V Operation 0.12
DDX
= 3 V Operation 0.07
DDX
PLH
PLH
− t
− t
6
PHL
V
IL
, V
OAH
OBH
, V
OAL
OBL
, t
PHL
PLH
, V
(V
or V or V
) − 0.1 (V
DD2
) − 0.4 (V
DD2
OCH
DD1
(V
DD1
, V
0.0 0.1 V IOx = 20 μA, VIx = V
OCL
0.2 0.4 V IOx = 4 mA, VIx = V
DD1
DD1
or V
) V IOx = −20 μA, VIx = V
DD2
or V
) − 0.2 V IOx = −4 mA, VIx = V
DD2
IxH
IxH
IxL
IxL
25 100 ns CL = 15 pF, CMOS signal levels
|4 PWD 40 ns CL = 15 pF, CMOS signal levels
50 ns CL = 15 pF, CMOS signal levels
PSK
50 ns CL = 15 pF, CMOS signal levels
PSKCD/OD
, t
20 60 ns CL = 15 pF, CMOS signal levels
PHL
PLH
|4 PWD 5 ns CL = 15 pF, CMOS signal levels
PHL
30 ns CL = 15 pF, CMOS signal levels
PSK
5 ns CL = 15 pF, CMOS signal levels
t
PSKCD
6 ns CL = 15 pF, CMOS signal levels
t
PSKOD
6
= 15 pF, CMOS signal levels
L
|CMH| 25 35 kV/μs
7
|CML| 25 35 kV/μs
7
ENABLE
DISABLE
2.0 μs VIA, VIB, VIC, VID = 0 V or V
5.0 μs VIA, VIB, VIC, VID = 0 V or V
= V
or V
V
Ix
DD1
, VCM = 1000 V,
DD2
transient magnitude = 800 V
= 0 V, VCM = 1000 V,
V
Ix
transient magnitude = 800 V
DD1
DD1
0.50 0.73 mA
DDI (Q)
0.25 0.38 mA
DDI (Q)
9
0.38 0.53 mA
DDO (Q)
0.19 0.33 mA
DDO (Q)
I
DDI (D)
mA/ Mbps
mA/ Mbps
Rev. H | Page 8 of 24
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