ANALOG DEVICES ADUM 1300 ARWZ Datasheet

G
G
Triple-Channel Digital Isolators
Data Sheet

FEATURES

Qualified for automotive applications Low power operation
5 V operation
1.2 mA per channel maximum at 0 Mbps to 2 Mbps
3.5 mA per channel maximum at 10 Mbps 32 mA per channel maximum at 90 Mbps
3 V operation
0.8 mA per channel maximum at 0 Mbps to 2 Mbps
2.2 mA per channel maximum at 10 Mbps
20 mA per channel maximum at 90 Mbps Bidirectional communication 3 V/5 V level translation High temperature operation: 125°C High data rate: dc to 90 Mbps (NRZ) Precise timing characteristics
2 ns maximum pulse width distortion
2 ns maximum channel-to-channel matching High common-mode transient immunity: >25 kV/μs Output enable function 16-lead SOIC wide body package RoHS-compliant models available
Safety and regulatory approvals
UL recognition: 2500 V rms for 1 minute per UL 1577
CSA Component Acceptance Notice 5A
VDE Certificate of Conformity
DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 V
= 560 V peak
IORM
TÜV approval: IEC/EN/UL/CSA 61010-1

APPLICATIONS

General-purpose multichannel isolation SPI interface/data converter isolation RS-232/RS-422/RS-485 transceivers Industrial field bus isolation Automotive systems

FUNCTIONAL BLOCK DIAGRAMS

1
V
DD1
2
ND
1
ENCODE DECODE
3
V
IA
4
V
V
NC
NC
ND
ENCODE DECODE
IB
5
ENCODE DECODE
IC
6
7
8
1
Figure 1. ADuM1300 Functional Block Diagram
Rev. K Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
16
V
DD2
15
GND
2
14
V
OA
13
V
OB
12
V
OC
11
NC
10
V
E2
9
GND
2
03787-001
ADuM1300/ADuM1301

GENERAL DESCRIPTION

The ADuM1300/ADuM13011 are triple-channel digital isolators based on the Analog Devices, Inc., iCoupler® technology. Combining high speed CMOS and monolithic transformer technology, these isolation components provide outstanding performance characteristics superior to alternatives, such as optocouplers.
By avoiding the use of LEDs and photodiodes, iCoupler devices remove the design difficulties commonly associated with optocouplers. The typical optocoupler concerns regarding uncertain current transfer ratios, nonlinear transfer functions, and temperature and lifetime effects are eliminated with the simple iCoupler digital interfaces and stable performance characteristics. The need for external drivers and other discrete components is eliminated with these iCoupler products. Furthermore, iCoupler devices consume one-tenth to one-sixth of the power of optocouplers at comparable signal data rates.
The ADuM1300/ADuM1301 isolators provide three independent isolation channels in a variety of channel configurations and data rates (see the Ordering Guide). Both models operate with the supply voltage on either side ranging from 2.7 V to 5.5 V, providing compatibility with lower voltage systems as well as enabling a voltage translation functionality across the isolation barrier. In addition, the ADuM1300/ADuM1301 provide low pulse width distortion (<2 ns for CRW grade) and tight channel­to-channel matching (<2 ns for CRW grade). Unlike other optocoupler alternatives, the ADuM1300/ADuM1301 isolators have a patented refresh feature that ensures dc correctness in the absence of input logic transitions and when power is not applied to one of the supplies.
1
Protected by U.S. Patents 5,952,849; 6,873,065; 6,903,578; and 7,075,329.
1
V
DD1
2
GND
1
ENCODE DECODE
3
V
IA
4
V
V
OC
NC
V
GND
Figure 2. ADuM1301 Functional Block Diagram
ENCODE DECODE
IB
5
DECODE ENCODE
6
7
E1
8
1
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2003–2015 Analog Devices, Inc. All rights reserved.
Technical Support www.analog.com
16
V
DD2
15
GND
2
14
V
OA
13
V
OB
12
V
IC
11
NC
10
V
E2
9
GND
2
03787-002
ADuM1300/ADuM1301 Data Sheet

TABLE OF CONTENTS

Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagrams ............................................................. 1
Revision History ............................................................................... 3
Specifications ..................................................................................... 4
Electrical Characteristics—5 V, 105°C Operation ................... 4
Electrical Characteristics—3 V, 105°C Operation ................... 6
Electrical Characteristics—Mixed 5 V/3 V or 3 V/5 V,
105°C Operation ........................................................................... 8
Electrical Characteristics—5 V, 125°C Operation ................. 11
Electrical Characteristics—3 V, 125°C Operation ................. 13
Electrical Characteristics—Mixed 5 V/3 V, 125°C Operation ... 15
Electrical Characteristics—Mixed 3 V/5 V, 125°C Operation .... 17
Package Characteristics ............................................................. 19
Regulatory Information ............................................................. 19
Insulation and Safety-Related Specifications .......................... 19
DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 Insulation
Characteristics ............................................................................ 20
Recommended Operating Conditions .................................... 20
Absolute Maximum Ratings ......................................................... 21
ESD Caution................................................................................ 21
Pin Configurations and Function Descriptions ......................... 22
Typical Performance Characteristics ........................................... 23
Applications Information .............................................................. 25
Printed Circuit Board (PCB) Layout ....................................... 25
Propagation Delay-Related Parameters ................................... 25
DC Correctness and Magnetic Field Immunity .......................... 25
Power Consumption .................................................................. 26
Insulation Lifetime ..................................................................... 27
Outline Dimensions ....................................................................... 28
Ordering Guide .......................................................................... 29
Automotive Products ................................................................. 29
Rev. K | Page 2 of 32
Data Sheet ADuM1300/ADuM1301

REVISION HISTORY

11/15—Rev. J to Rev. K
Changes to Table 9 and Table 10 ................................................... 19
Changes to Ordering Guide ........................................................... 29
4/14—Rev. I to Rev. J
Change to Table 9 ............................................................................ 19
3/12—Rev. H to Rev. I
Created Hyperlink for Safety and Regulatory Approvals
Entry in Features Section ................................................................. 1
Change to PC Board Layout Section ............................................ 25
Updated Outline Dimensions ........................................................ 28
Moved Automotive Products Section ........................................... 28
5/08—Rev. G to Rev. H
Added ADuM1300W and ADuM1301W Parts ............. Universal
Changes to Features List ................................................................... 1
Added Table 4 .................................................................................. 11
Added Table 5 .................................................................................. 13
Added Table 6 .................................................................................. 15
Added Table 7 .................................................................................. 17
Changes to Table 12 ........................................................................ 20
Changes to Table 13 ........................................................................ 21
Added Automotive Products Section ........................................... 27
Changes to Ordering Guide ........................................................... 28
11/07—Rev. F to Rev. G
Changes to Note 1 and Figure 2 ...................................................... 1
Added ADuM130xARW Change vs. Temperature Parameter ... 3 Added ADuM130xARW Change vs. Temperature Parameter ... 5 Added ADuM130xARW Change vs. Temperature Parameter ... 8
Changes to Figure 14 ...................................................................... 16
6/07—Rev. E to Rev. F
Updated VDE Certification Throughout ....................................... 1
Changes to Features, Note 1, Figure 1, and Figure 2 .................... 1
Changes to Regulatory Information Section ............................... 10
Added Table 10 ................................................................................ 12
Added Insulation Lifetime Section ............................................... 17
Updated Outline Dimensions ........................................................ 19
Changes to Ordering Guide ........................................................... 19
2/06—Rev. D to Rev. E
Updated Format ................................................................. Universal
Added TÜV Approval ....................................................... Universal
Changes to Figure 2 .......................................................................... 1
5/05—Rev. C to Rev. D
Changes to Format ............................................................. Universal
Changes to Figure 2 .......................................................................... 1
Changes to Table 6 .......................................................................... 10
Changes to Ordering Guide ........................................................... 18
6/04—Rev. B to Rev. C
Changes to Format ............................................................. Universal
Changes to Features .......................................................................... 1
Changes to Electrical Characteristics—5 V Operation ................ 3
Changes to Electrical Characteristics—3 V Operation ................ 5
Changes to Electrical Characteristics—Mixed 5 V/3 V or
3 V/5 V Operation ............................................................................ 7
Changes to Ordering Guide ........................................................... 18
5/04—Rev. A to Rev. B
Changes to the Format ...................................................... Universal
Changes to the Features.................................................................... 1
Changes to Table 7 and Table 8 ..................................................... 14
Changes to Table 9 .......................................................................... 15
Changes to the DC Correctness and Magnetic Field Immunity
Section .............................................................................................. 19
Changes to the Power Consumption Section .............................. 20
Changes to the Ordering Guide .................................................... 21
9/03—Rev. 0 to Rev. A
Edits to Regulatory Information ................................................... 13
Edits to Absolute Maximum Ratings ............................................ 15
Deleted the Package Branding Information ................................ 16
9/03—Revision 0: Initial Version
Rev. K | Page 3 of 32
ADuM1300/ADuM1301 Data Sheet
DC to 2 Mbps
Channel-to-Channel Matching6
t
50
ns
CL = 15 pF, CMOS signal levels

SPECIFICATIONS

ELECTRICAL CHARACTERISTICS—5 V, 105°C OPERATION

All voltages are relative to their respective ground. 4.5 V ≤ V over the entire recommended operation range, unless otherwise noted; all typical specifications are at T specifications do not apply to ADuM1300W and ADuM1301W automotive grade versions.
Table 1.
Parameter Symbol Min Typ Max Unit Test Conditions
DC SPECIFICATIONS
Input Supply Current per Channel, Quiescent I Output Supply Current per Channel, Quiescent I
ADuM1300 Total Supply Current, Three Channels1
DC to 2 Mbps
V
Supply Current I
DD1
V
Supply Current I
DD2
10 Mbps (BRW and CRW Grades Only)
V
Supply Current I
DD1
V
Supply Current I
DD2
90 Mbps (CRW Grade Only)
V
Supply Current I
DD1
V
Supply Current I
DD2
ADuM1301 Total Supply Current, Three Channels1
DDI (Q)
DDO (Q)
DD1 (Q)
DD2 (Q)
DD1 (10)
DD2 (10)
DD1 (90)
DD2 (90)
≤ 5.5 V, 4.5 V ≤ V
DD1
≤ 5.5 V; all minimum/maximum specifications apply
DD2
= 25°C, V
A
DD1
= V
= 5 V. These
DD2
0.50 0.53 mA
0.19 0.24 mA
1.6 2.5 mA DC to 1 MHz logic signal freq.
0.7 1.0 mA DC to 1 MHz logic signal freq.
6.5 8.1 mA 5 MHz logic signal freq.
1.9 2.5 mA 5 MHz logic signal freq.
57 77 mA 45 MHz logic signal freq. 16 18 mA 45 MHz logic signal freq.
V
Supply Current I
DD1
V
Supply Current I
DD2
1.3 2.1 mA DC to 1 MHz logic signal freq.
DD1 (Q)
1.0 1.4 mA DC to 1 MHz logic signal freq.
DD2 (Q)
10 Mbps (BRW and CRW Grades Only)
V
Supply Current I
DD1
V
Supply Current I
DD2
5.0 6.2 mA 5 MHz logic signal freq.
DD1 (10)
3.4 4.2 mA 5 MHz logic signal freq.
DD2 (10)
90 Mbps (CRW Grade Only)
V
Supply Current I
DD1
V
Supply Current I
DD2
43 57 mA 45 MHz logic signal freq.
DD1 (90)
29 37 mA 45 MHz logic signal freq.
DD2 (90)
For All Models
Input Currents IIA, IIB, IIC, IE1, I
Logic High Input Threshold Logic Low Input Threshold Logic High Output Voltages V
VIH, V VIL, V
OAH
, V
EH
EL
OBH
(V Logic Low Output Voltages V
OAL
, V
OBL
−10 +0.01 +10 µA 0 V ≤ VIA, VIB, VIC ≤ V
E2
0 V ≤ V
2.0 V
0.8 V
, V
(V
or V
OCH
DD1
DD1
, V
0.0 0.1 V IOx = 20 µA, VIx = V
OCL
) − 0.1 5.0 V IOx = −20 µA, VIx = V
DD2
or V
) − 0.4 4.8 V IOx = −4 mA, VIx = V
DD2
, VE2 ≤ V
E1
DD1
0.04 0.1 V IOx = 400 µA, VIx = V
0.2 0.4 V IOx = 4 mA, VIx = V SWITCHING SPECIFICATIONS
ADuM1300ARW/ADuM1301ARW
Minimum Pulse Width2 PW 1000 ns CL = 15 pF, CMOS signal levels Maximum Data Rate3 1 Mbps CL = 15 pF, CMOS signal levels Propagation Delay4 t Pulse Width Distortion, |t
PLH
− t
PHL
4
|
, t
50 65 100 ns CL = 15 pF, CMOS signal levels
PHL
PLH
PWD 40 ns CL = 15 pF, CMOS signal levels
Change vs. Temperature 11 ps/°C CL = 15 pF, CMOS signal levels
Propagation Delay Skew5 t
50 ns CL = 15 pF, CMOS signal levels
PSK
PSKCD/tPSKOD
IxL
IxL
DD1
or V
IxH
IxH
IxL
or V
DD2
,
DD2
Rev. K | Page 4 of 32
Data Sheet ADuM1300/ADuM1301
Change vs. Temperature
5 ps/°C
CL = 15 pF, CMOS signal levels
PW 8.3
11.1
ns
CL = 15 pF, CMOS signal levels
Common-Mode Transient Immunity at Logic
|CML|
25
35 kV/µs
VIx = 0 V, VCM = 1000 V, I
0.05 mA/Mbps
Parameter Symbol Min Typ Max Unit Test Conditions
ADuM1300BRW/ADuM1301BRW
Minimum Pulse Width2 Maximum Data Rate3 Propagation Delay4 Pulse Width Distortion, |t
PLH
− t
PHL
4
|
Propagation Delay Skew5 Channel-to-Channel Matching, Codirectional
Channels
Channel-to-Channel Matching, Opposing-
Directional Channels
6
6
PW 100 ns C 10 Mbps C
, t
20 32 50 ns CL = 15 pF, CMOS signal levels
t
PHL
PLH
PWD 3 ns CL = 15 pF, CMOS signal levels
15 ns CL = 15 pF, CMOS signal levels
t
PSK
3 ns CL = 15 pF, CMOS signal levels
t
PSKCD
6 ns CL = 15 pF, CMOS signal levels
t
PSKOD
ADuM1300CRW/ADuM1301CRW
Minimum Pulse Width2 Maximum Data Rate3 Propagation Delay4 Pulse Width Distortion, |t
PLH
− t
PHL
4
|
90 120 Mbps C
, t
18 27 32 ns CL = 15 pF, CMOS signal levels
t
PHL
PLH
PWD 0.5 2 ns CL = 15 pF, CMOS signal levels
Change vs. Temperature 3 ps/°C CL = 15 pF, CMOS signal levels
10 ns CL = 15 pF, CMOS signal levels
Propagation Delay Skew5 Channel-to-Channel Matching, Codirectional
Channels
Channel-to-Channel Matching, Opposing-
Directional Channels
6
6
t
PSK
2 ns CL = 15 pF, CMOS signal levels
t
PSKCD
5 ns CL = 15 pF, CMOS signal levels
t
PSKOD
For All Models
Output Disable Propagation Delay (High/Low
t
PHZ
, t
PLH
6 8 ns CL = 15 pF, CMOS signal levels
to High Impedance)
Output Enable Propagation Delay (High
t
, t
6 8 ns CL = 15 pF, CMOS signal levels
PZH
PZL
Impedance to High/Low) Output Rise/Fall Time (10% to 90%) tR/tF 2.5 ns CL = 15 pF, CMOS signal levels Common-Mode Transient Immunity at Logic
High Output
7
|CM
| 25 35 kV/µs VIx = V
H
= 15 pF, CMOS signal levels
L
= 15 pF, CMOS signal levels
L
= 15 pF, CMOS signal levels
L
or V
DD1
, VCM = 1000 V,
DD2
transient magnitude = 800 V
Low Output
7
transient magnitude = 800 V Refresh Rate fr 1.2 Mbps Input Dynamic Supply Current per Channel8 I Output Dynamic Supply Current per Channel8
1
The supply current values are for all three channels combined when running at identical data rates. Output supply current values are specified with no output load
present. The supply current associated with an individual channel operating at a given data rate may be calculated as described in the Power Consumption section. See Figure 6 through Figure 8 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See Figure 9 through Figure 12 for total V
2
The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed.
3
The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed.
4
t
propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. t
PHL
measured from the 50% level of the rising edge of the VIx signal to the 50% level of the rising edge of the VOx signal.
5
t
is the magnitude of the worst-case difference in t
PSK
within the recommended operating conditions.
6
Codirectional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on the same side of
the isolation barrier. Opposing-directional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on opposing sides of the isolation barrier.
7
CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 V
that can be sustained while maintaining VO < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The transient magnitude is the range over which the common mode is slewed.
8
Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 6 through Figure 8 for information
on per-channel supply current for unloaded and loaded conditions. See the Power Consumption section for guidance on calculating the per-channel supply current for a given data rate.
DD1
and V
supply currents as a function of data rate for ADuM1300/ADuM1301 channel configurations.
DD2
or t
PHL
0.19 mA/Mbps
DDI (D)
DDO (D)
propagation delay is
PLH
that is measured between units at the same operating temperature, supply voltages, and output load
PLH
. CML is the maximum common-mode voltage slew rate
DD2
Rev. K | Page 5 of 32
ADuM1300/ADuM1301 Data Sheet
Output Supply Current per Channel, Quiescent
I
0.11
0.15
mA
DC to 2 Mbps
V
Supply Current
I
1.8
2.5
mA
5 MHz logic signal freq.
0.2
0.4 V IOx = 4 mA, VIx = V
Maximum Data Rate3
1 Mbps
CL = 15 pF, CMOS signal levels
Propagation Delay Skew5
t
50
ns
CL = 15 pF, CMOS signal levels

ELECTRICAL CHARACTERISTICS—3 V, 105°C OPERATION

All voltages are relative to their respective ground. 2.7 V ≤ V over the entire recommended operation range, unless otherwise noted; all typical specifications are at T These specifications do not apply to ADuM1300W and ADuM1301W automotive grade versions.
Table 2.
Parameter Symbol Min Typ Max Unit Test Conditions
DC SPECIFICATIONS
Input Supply Current per Channel, Quiescent I
ADuM1300 Total Supply Current, Three Channels1
DC to 2 Mbps
V
Supply Current I
DD1
V
Supply Current I
DD2
10 Mbps (BRW and CRW Grades Only)
V
Supply Current I
DD1
V
Supply Current I
DD2
90 Mbps (CRW Grade Only)
V
Supply Current I
DD1
V
Supply Current I
DD2
ADuM1301 Total Supply Current, Three Channels1
DDI (Q)
DDO (Q)
DD1 (Q)
DD2 (Q)
DD1 (10)
DD2 (10)
DD1 (90)
DD2 (90)
≤ 3.6 V, 2.7 V ≤ V
DD1
≤ 3.6 V; all minimum/maximum specifications apply
DD2
= 25°C, V
A
DD1
= V
= 3.0 V.
DD2
0.26 0.31 mA
0.9 1.7 mA DC to 1 MHz logic signal freq.
0.4 0.7 mA DC to 1 MHz logic signal freq.
3.4 4.9 mA 5 MHz logic signal freq.
1.1 1.6 mA 5 MHz logic signal freq.
31 48 mA 45 MHz logic signal freq. 8 13 mA 45 MHz logic signal freq.
V
Supply Current I
DD1
V
Supply Current I
DD2
0.7 1.4 mA DC to 1 MHz logic signal freq.
DD1 (Q)
0.6 0.9 mA DC to 1 MHz logic signal freq.
DD2 (Q)
10 Mbps (BRW and CRW Grades Only)
V
Supply Current I
DD1
DD2
2.6 3.7 mA 5 MHz logic signal freq.
DD1 (10)
DD2 (10)
90 Mbps (CRW Grade Only)
V
Supply Current I
DD1
V
Supply Current I
DD2
24 36 mA 45 MHz logic signal freq.
DD1 (90)
16 23 mA 45 MHz logic signal freq.
DD2 (90)
For All Models
Input Currents IIA, IIB, IIC, IE1, I
Logic High Input Threshold Logic Low Input Threshold Logic High Output Voltages V
VIH, V VIL, V
OAH
EH
EL
, V
OBH
(V Logic Low Output Voltages V
OAL
, V
OBL
−10 +0.01 +10 µA 0 V ≤ VIA, VIB, VIC ≤ V
E2
0 V ≤ V
1.6 V
0.4 V
, V
(V
or V
OCH
DD1
DD1
, V
0.0 0.1 V IOx = 20 µA, VIx = V
OCL
) − 0.1 3.0 V IOx = −20 µA, VIx = V
DD2
or V
) − 0.4 2.8 V IOx = −4 mA, VIx = V
DD2
, VE2 ≤ V
E1
DD1
IxL
0.04 0.1 V IOx = 400 µA, VIx = V
IxL
SWITCHING SPECIFICATIONS
ADuM1300ARW/ADuM1301ARW
Minimum Pulse Width2 PW 1000 ns CL = 15 pF, CMOS signal levels
Propagation Delay4 t Pulse Width Distortion, |t
PLH
− t
PHL
4
|
, t
50 75 100 ns CL = 15 pF, CMOS signal levels
PHL
PLH
PWD 40 ns CL = 15 pF, CMOS signal levels
Change vs. Temperature 11 ps/°C CL = 15 pF, CMOS signal levels
PSK
Channel-to-Channel Matching6 t
PSKCD/tPSKOD
50 ns CL = 15 pF, CMOS signal levels
DD1
or V
IxH
IxH
IxL
or V
DD2
,
DD2
Rev. K | Page 6 of 32
Data Sheet ADuM1300/ADuM1301
Change vs. Temperature
5 ps/°C
CL = 15 pF, CMOS signal levels
PW 8.3
11.1
ns
CL = 15 pF, CMOS signal levels
Parameter Symbol Min Typ Max Unit Test Conditions
ADuM1300BRW/ADuM1301BRW
Minimum Pulse Width2 Maximum Data Rate3 Propagation Delay4 Pulse Width Distortion, |t
PLH
− t
PHL
4
|
Propagation Delay Skew5 Channel-to-Channel Matching, Codirectional
Channels
Channel-to-Channel Matching, Opposing-
Directional Channels
6
6
PW 100 ns C 10 Mbps C
, t
20 38 50 ns CL = 15 pF, CMOS signal levels
t
PHL
PLH
PWD 3 ns CL = 15 pF, CMOS signal levels
26 ns CL = 15 pF, CMOS signal levels
t
PSK
3 ns CL = 15 pF, CMOS signal levels
t
PSKCD
6 ns CL = 15 pF, CMOS signal levels
t
PSKOD
ADuM1300CRW/ADuM1301CRW
Minimum Pulse Width2 Maximum Data Rate3 Propagation Delay4 Pulse Width Distortion, |t
PLH
− t
PHL
4
|
90 120 Mbps C
, t
20 34 45 ns CL = 15 pF, CMOS signal levels
t
PHL
PLH
PWD 0.5 2 ns CL = 15 pF, CMOS signal levels
Change vs. Temperature 3 ps/°C CL = 15 pF, CMOS signal levels
16 ns CL = 15 pF, CMOS signal levels
Propagation Delay Skew5 Channel-to-Channel Matching, Codirectional
Channels
Channel-to-Channel Matching, Opposing-
Directional Channels
6
6
For All Models
Output Disable Propagation Delay (High/Low to
t
PSK
2 ns CL = 15 pF, CMOS signal levels
t
PSKCD
5 ns CL = 15 pF, CMOS signal levels
t
PSKOD
t
, t
PHZ
PLH
6 8 ns CL = 15 pF, CMOS signal levels
High Impedance)
Output Enable Propagation Delay (High
t
, t
6 8 ns CL = 15 pF, CMOS signal levels
PZH
PZL
Impedance to High/Low) Output Rise/Fall Time (10% to 90%) tR/tF 3 ns CL = 15 pF, CMOS signal levels Common-Mode Transient Immunity at
Logic High Output
Common-Mode Transient Immunity at
Logic Low Output
7
7
|CM
| 25 35 kV/µs VIx = V
H
|CML| 25 35 kV/µs VIx = 0 V, VCM = 1000 V,
Refresh Rate fr 1.1 Mbps Input Dynamic Supply Current per Channel8 I Output Dynamic Supply Current per Channel8
1
The supply current values are for all three channels combined when running at identical data rates. Output supply current values are specified with no output load
present. The supply current associated with an individual channel operating at a given data rate may be calculated as described in the Power Consumption section. See Figure 6 through Figure 8 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See Figure 9 through Figure 12 for total V
2
The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed.
3
The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed.
4
t
propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. t
PHL
measured from the 50% level of the rising edge of the VIx signal to the 50% level of the rising edge of the VOx signal.
5
t
is the magnitude of the worst-case difference in t
PSK
within the recommended operating conditions.
6
Codirectional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on the same side of
the isolation barrier. Opposing-directional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on opposing sides of the isolation barrier.
7
CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 V
that can be sustained while maintaining VO < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The transient magnitude is the range over which the common mode is slewed.
8
Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 6 through Figure 8 for information
on per-channel supply current for unloaded and loaded conditions. See the Power Consumption section for guidance on calculating the per-channel supply current for a given data rate.
DD1
and V
supply currents as a function of data rate for ADuM1300/ADuM1301 channel configurations.
DD2
or t
PHL
0.10 mA/Mbps
DDI (D)
0.03 mA/Mbps
I
DDO (D)
that is measured between units at the same operating temperature, supply voltages, and output load
PLH
. CML is the maximum common-mode voltage slew rate
DD2
= 15 pF, CMOS signal levels
L
= 15 pF, CMOS signal levels
L
= 15 pF, CMOS signal levels
L
or V
DD1
, VCM = 1000 V,
DD2
transient magnitude = 800 V
transient magnitude = 800 V
propagation delay is
PLH
Rev. K | Page 7 of 32
ADuM1300/ADuM1301 Data Sheet
DC SPECIFICATIONS
5 V/3 V Operation
0.11
0.15
mA
3 V/5 V Operation
3.4
4.9
mA
5 MHz logic signal freq.
5 V/3 V Operation
0.6
0.9
mA
DC to 1 MHz logic signal freq.

ELECTRICAL CHARACTERISTICS—MIXED 5 V/3 V OR 3 V/5 V, 105°C OPERATION

All voltages are relative to their respective ground. 5 V/3 V operation: 4.5 V ≤ V
2.7 V ≤ V
≤ 3.6 V, 4.5 V ≤ V
DD1
unless otherwise noted; all typical specifications are at T
≤ 5.5 V; all minimum/maximum specifications apply over the entire recommended operation range,
DD2
= 25°C; V
A
= 3.0 V, V
DD1
tions do not apply to ADuM1300W and ADuM1301W automotive grade versions.
Table 3.
Parameter Symbol Min Typ Max Unit Test Conditions
≤ 5.5 V, 2.7 V ≤ V
DD1
= 5 V or V
DD2
= 5 V, V
DD1
≤ 3.6 V; 3 V/5 V operation:
DD2
= 3.0 V. These specifica-
DD2
Input Supply Current per Channel, Quiescent I
DDI (Q)
5 V/3 V Operation 0.50 0.53 mA 3 V/5 V Operation 0.26 0.31 mA
Output Supply Current per Channel, Quiescent I
DDO (Q)
3 V/5 V Operation 0.19 0.24 mA
ADuM1300 Total Supply Current, Three Channels1
DC to 2 Mbps
V
Supply Current I
DD1
DD1 (Q)
5 V/3 V Operation 1.6 2.5 mA DC to 1 MHz logic signal freq. 3 V/5 V Operation 0.9 1.7 mA DC to 1 MHz logic signal freq.
V
Supply Current I
DD2
DD2 (Q)
5 V/3 V Operation 0.4 0.7 mA DC to 1 MHz logic signal freq. 3 V/5 V Operation 0.7 1.0 mA DC to 1 MHz logic signal freq.
10 Mbps (BRW and CRW Grades Only)
V
Supply Current I
DD1
DD1 (10)
5 V/3 V Operation 6.5 8.1 mA 5 MHz logic signal freq.
V
Supply Current I
DD2
DD2 (10)
5 V/3 V Operation 1.1 1.6 mA 5 MHz logic signal freq. 3 V/5 V Operation 1.9 2.5 mA 5 MHz logic signal freq.
90 Mbps (CRW Grade Only)
V
Supply Current I
DD1
DD1 (90)
5 V/3 V Operation 57 77 mA 45 MHz logic signal freq. 3 V/5 V Operation 31 48 mA 45 MHz logic signal freq.
V
Supply Current I
DD2
DD2 (90)
5 V/3 V Operation 8 13 mA 45 MHz logic signal freq. 3 V/5 V Operation 16 18 mA 45 MHz logic signal freq.
ADuM1301 Total Supply Current, Three Channels1
DC to 2 Mbps
V
Supply Current I
DD1
DD1 (Q)
5 V/3 V Operation 1.3 2.1 mA DC to 1 MHz logic signal freq. 3 V/5 V Operation 0.7 1.4 mA DC to 1 MHz logic signal freq.
V
Supply Current I
DD2
DD2 (Q)
3 V/5 V Operation 1.0 1.4 mA DC to 1 MHz logic signal freq.
10 Mbps (BRW and CRW Grades Only)
V
Supply Current I
DD1
5 V/3 V Operation 5.0 6.2 mA 5 MHz logic signal freq. 3 V/5 V Operation 2.6 3.7 mA 5 MHz logic signal freq.
V
Supply Current I
DD2
5 V/3 V Operation 1.8 2.5 mA 5 MHz logic signal freq. 3 V/5 V Operation 3.4 4.2 mA 5 MHz logic signal freq.
DD1 (10)
DD2 (10)
Rev. K | Page 8 of 32
Data Sheet ADuM1300/ADuM1301
Parameter Symbol Min Typ Max Unit Test Conditions
90 Mbps (CRW Grade Only)
V
Supply Current I
DD1
5 V/3 V Operation 43 57 mA 45 MHz logic signal freq. 3 V/5 V Operation 24 36 mA 45 MHz logic signal freq.
V
Supply Current I
DD2
5 V/3 V Operation 16 23 mA 45 MHz logic signal freq. 3 V/5 V Operation 29 37 mA 45 MHz logic signal freq.
For All Models
Input Currents IIA, IIB, IIC, IE1, I
Logic High Input Threshold
5 V/3 V Operation 2.0 V
3 V/5 V Operation 1.6 V Logic Low Input Threshold
5 V/3 V Operation 0.8 V
3 V/5 V Operation 0.4 V Logic High Output Voltages V (V Logic Low Output Voltages V
0.04 0.1 V IOx = 400 µA, VIx = V
0.2 0.4 V IOx = 4 mA, VIx = V SWITCHING SPECIFICATIONS
ADuM1300ARW/ADuM1301ARW
Minimum Pulse Width2 PW 1000 ns CL = 15 pF, CMOS signal levels Maximum Data Rate3 1 Mbps CL = 15 pF, CMOS signal levels Propagation Delay4 t Pulse Width Distortion, |t
PLH
− t
PHL
4
|
Change vs. Temperature 11 ps/°C CL = 15 pF, CMOS signal levels Propagation Delay Skew5 t Channel-to-Channel Matching6 t
ADuM1300BRW/ADuM1301BRW
Minimum Pulse Width2 Maximum Data Rate3 Propagation Delay4 Pulse Width Distortion, |t
PLH
− t
PHL
4
|
Change vs. Temperature 5 ps/°C CL = 15 pF, CMOS signal levels Propagation Delay Skew5 Channel-to-Channel Matching, Codirectional
Channels
Channel-to-Channel Matching, Opposing-
Directional Channels
6
6
ADuM1300CRW/ADuM1301CRW
Minimum Pulse Width2 Maximum Data Rate3 Propagation Delay4 Pulse Width Distortion, |t
PLH
− t
PHL
4
|
Change vs. Temperature 3 ps/°C CL = 15 pF, CMOS signal levels Propagation Delay Skew5 Channel-to-Channel Matching,
Codirectional Channels Channel-to-Channel Matching,
Opposing-Directional Channels
6
6
DD1 (90)
DD2 (90)
−10 +0.01 +10 µA 0 V ≤ VIA, VIB, VIC ≤ V
E2
VIH, V
VIL, V
OAH
OAL
PHL
EH
EL
, V
OBH
, V
OBL
, t
PLH
, V
(V
or V or V
) − 0.1 (V
DD2
) − 0.4 (V
DD2
OCH
DD1
DD1
, V
0.0 0.1 V IOx = 20 µA, VIx = V
OCL
DD1
DD1
or V
) V IOx = −20 µA, VIx = V
DD2
or V
) − 0.2 V IOx = −4 mA, VIx = V
DD2
50 70 100 ns CL = 15 pF, CMOS signal levels
0 V ≤ V
, VE2 ≤ V
E1
DD1
IxL
DD1
or V
IxH
IxH
IxL
IxL
or V
DD2
DD2
PWD 40 ns CL = 15 pF, CMOS signal levels
50 ns CL = 15 pF, CMOS signal levels
PSK
PSKCD/tPSKOD
PW 100 ns C 10 Mbps C t
PHL
50 ns CL = 15 pF, CMOS signal levels
= 15 pF, CMOS signal levels
L
= 15 pF, CMOS signal levels
L
, t
15 35 50 ns CL = 15 pF, CMOS signal levels
PLH
PWD 3 ns CL = 15 pF, CMOS signal levels
6 ns CL = 15 pF, CMOS signal levels
t
PSK
3 ns CL = 15 pF, CMOS signal levels
t
PSKCD
22 ns CL = 15 pF, CMOS signal levels
t
PSKOD
PW 8.3 11.1 ns C 90 120 Mbps C
, t
20 30 40 ns CL = 15 pF, CMOS signal levels
t
PHL
PLH
= 15 pF, CMOS signal levels
L
= 15 pF, CMOS signal levels
L
PWD 0.5 2 ns CL = 15 pF, CMOS signal levels
14 ns CL = 15 pF, CMOS signal levels
t
PSK
2 ns CL = 15 pF, CMOS signal levels
t
PSKCD
5 ns CL = 15 pF, CMOS signal levels
t
PSKOD
,
Rev. K | Page 9 of 32
ADuM1300/ADuM1301 Data Sheet
3 V/5 V Operation
2.5 ns
mA/Mbps
mA/Mbps
Parameter Symbol Min Typ Max Unit Test Conditions
For All Models
Output Disable Propagation Delay
(High/Low to High Impedance)
Output Enable Propagation Delay (High
Impedance to High/Low)
Output Rise/Fall Time (10% to 90%) tR/tF CL = 15 pF, CMOS signal levels
5 V/3 V Operation 3.0 ns
t
, t
PHZ
PLH
t
, t
PZH
PZL
6 8 ns CL = 15 pF, CMOS signal levels
6 8 ns CL = 15 pF, CMOS signal levels
Common-Mode Transient Immunity at
Logic High Output
Common-Mode Transient Immunity at
Logic Low Output
7
7
|CM
| 25 35 kV/µs VIx = V
H
DD1
or V
DD2
, VCM = 1000 V,
transient magnitude = 800 V
|CML| 25 35 kV/µs VIx = 0 V, VCM = 1000 V,
transient magnitude = 800 V
Refresh Rate fr
5 V/3 V Operation 1.2 Mbps 3 V/5 V Operation 1.1 Mbps
Input Dynamic Supply Current per Channel8 I
DDI (D)
5 V/3 V Operation 0.19 mA/Mbps 3 V/5 V Operation 0.10 mA/Mbps
Output Dynamic Supply Current per Channel8
5 V/3 V Operation 0.03 3 V/5 V Operation 0.05
1
The supply current values are for all three channels combined when running at identical data rates. Output supply current values are specified with no output load present. The
I
DDO (D)
supply current associated with an individual channel operating at a given data rate may be calculated as described in the Power Consumption section. See Figure 6 through
and V
Figure 8 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See Figure 9 through Figure 12 for total V supply currents as a function of data rate for ADuM1300/ADuM1301 channel configurations.
2
The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed.
3
The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed.
4
t
propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. t
PHL
from the 50% level of the rising edge of the VIx signal to the 50% level of the rising edge of the VOx signal.
5
t
is the magnitude of the worst-case difference in t
PSK
recommended operating conditions.
6
Codirectional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on the same side of the isolation
or t
that is measured between units at the same operating temperature, supply voltages, and output load within the
PHL
PLH
propagation delay is measured
PLH
DD1
DD2
barrier. Opposing-directional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on opposing sides of the isolation barrier.
7
CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 V
sustained while maintaining VO < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The transient magnitude is the range over which the common mode is slewed.
8
Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 6 through Figure 8 for information on
. CML is the maximum common-mode voltage slew rate that can be
DD2
per-channel supply current for unloaded and loaded conditions. See the Power Consumption section for guidance on calculating the per-channel supply current for a given data rate.
Rev. K | Page 10 of 32
Data Sheet ADuM1300/ADuM1301
V
Supply Current
I
1.9
2.5
mA
5 MHz logic signal freq.
0.2
0.4 V IOx = 4 mA, VIx = V
Minimum Pulse Width2
PW
1000
ns
CL = 15 pF, CMOS signal levels
Change vs. Temperature
5 ps/°C
CL = 15 pF, CMOS signal levels

ELECTRICAL CHARACTERISTICS—5 V, 125°C OPERATION

All voltages are relative to their respective ground. 4.5 V ≤ V over the entire recommended operation range, unless otherwise noted; all typical specifications are at T specifications apply to ADuM1300W and ADuM1301W automotive grade versions.
Table 4.
Parameter Symbol Min Typ Max Unit Test Conditions
DC SPECIFICATIONS
Input Supply Current per Channel, Quiescent I Output Supply Current per Channel, Quiescent I
DDI (Q)
DDO (Q)
ADuM1300W, Total Supply Current, Three Channels1
DC to 2 Mbps
V
Supply Current I
DD1
V
Supply Current I
DD2
DD1 (Q)
DD2 (Q)
10 Mbps (TRWZ Grade Only)
V
Supply Current I
DD1
DD2
DD1 (10)
DD2 (10)
ADuM1301W, Total Supply Current, Three Channels1
DC to 2 Mbps
V
Supply Current I
DD1
V
Supply Current I
DD2
DD1 (Q)
DD2 (Q)
10 Mbps (TRWZ Grade Only)
V
Supply Current I
DD1
V
Supply Current I
DD2
DD1 (10)
DD2 (10)
For All Models
Input Currents IIA, IIB, IIC, IE1, I
Logic High Input Threshold Logic Low Input Threshold Logic High Output Voltages V
Logic Low Output Voltages V
VIH, V VIL, V
OAH
OAL
SWITCHING SPECIFICATIONS
ADuM1300WSRWZ/ADuM1301WSRWZ
≤ 5.5 V, 4.5 V ≤ V
DD1
≤ 5.5 V; all minimum/maximum specifications apply
DD2
= 25°C, V
A
DD1
= V
= 5 V. These
DD2
0.50 0.53 mA
0.19 0.24 mA
1.6 2.5 mA DC to 1 MHz logic signal freq.
0.7 1.0 mA DC to 1 MHz logic signal freq.
6.5 8.1 mA 5 MHz logic signal freq.
1.3 2.1 mA DC to 1 MHz logic signal freq.
1.0 1.4 mA DC to 1 MHz logic signal freq.
5.0 6.2 mA 5 MHz logic signal freq.
3.4 4.2 mA 5 MHz logic signal freq.
, V
, V
−10 +0.01 +10 µA
E2
0 V ≤ V 0 V ≤ V
EH
EL
OBH
OBL
2.0 V
0.8 V
, V
V
, V
OCH
V
, V
0.0 0.1 V IOx = 20 µA, VIx = V
OCL
− 0.1 5.0 V IOx = −20 µA, VIx = V
DD1
DD2
, V
− 0.4 4.8 V IOx = −4 mA, VIx = V
DD1
DD2
0.04 0.1 V IOx = 400 µA, VIx = V
, VIB, VIC ≤ V
IA
, VE2 ≤ V
E1
DD1
IxL
IxL
DD1
or V
IxH
IxH
IxL
or V
DD2
DD2
,
Maximum Data Rate3 1 Mbps CL = 15 pF, CMOS signal levels Propagation Delay4 t Pulse Width Distortion, |t Propagation Delay Skew5 t Channel-to-Channel Matching6 t
ADuM1300WTRWZ/ADuM1301WTRWZ
Minimum Pulse Width2 PW 100 ns CL = 15 pF, CMOS signal levels Maximum Data Rate3 10 Mbps CL = 15 pF, CMOS signal levels Propagation Delay4 t Pulse Width Distortion, |t
Propagation Delay Skew5 t Channel-to-Channel Matching, Codirectional
Channels
Channel-to-Channel Matching, Opposing-
Directional Channels
, t
50 65 100 ns CL = 15 pF, CMOS signal levels
PHL
4
− t
− t
PHL
PHL
|
4
|
PLH
PLH
6
6
PLH
PWD 40 ns CL = 15 pF, CMOS signal levels
50 ns CL = 15 pF, CMOS signal levels
PSK
PSKCD/tPSKOD
PHL
50 ns CL = 15 pF, CMOS signal levels
, t
18 27 32 ns CL = 15 pF, CMOS signal levels
PLH
PWD 3 ns CL = 15 pF, CMOS signal levels
15 ns CL = 15 pF, CMOS signal levels
PSK
3 ns CL = 15 pF, CMOS signal levels
t
PSKCD
6 ns CL = 15 pF, CMOS signal levels
t
PSKOD
Rev. K | Page 11 of 32
ADuM1300/ADuM1301 Data Sheet
Refresh Rate
fr 1.2 Mbps
Parameter Symbol Min Typ Max Unit Test Conditions
For All Models
, t
Output Disable Propagation Delay
t
PHZ
PLH
(High/Low to High Impedance)
t
, t
Output Enable Propagation Delay
6 8 ns CL = 15 pF, CMOS signal levels
PZH
PZL
(High Impedance to High/Low)
Output Rise/Fall Time (10% to 90%) tR/tF 2.5 ns CL = 15 pF, CMOS signal levels
| 25 35 kV/µs
Common-Mode Transient Immunity at Logic
High Output
Common-Mode Transient Immunity at Logic
Low Output
7
7
|CM
H
|CML| 25 35 kV/µs
6 8 ns CL = 15 pF, CMOS signal levels
= V
V
Ix
DD1/VDD2
, VCM = 1000 V,
transient magnitude = 800 V
= 0 V, VCM = 1000 V,
V
Ix
transient magnitude = 800 V
Input Dynamic Supply Current per Channel8 I Output Dynamic Supply Current per Channel8 I
1
The supply current values are for all three channels combined when running at identical data rates. Output supply current values are specified with no output load
0.19 mA/Mbps
DDI (D)
0.05 mA/Mbps
DDO (D)
present. The supply current associated with an individual channel operating at a given data rate may be calculated as described in the Power Consumption section. See Figure 6 through Figure 8 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See Figure 9 through Figure 12 for total V
2
The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed.
3
The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed.
4
t
propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. t
PHL
measured from the 50% level of the rising edge of the VIx signal to the 50% level of the rising edge of the VOx signal.
5
t
is the magnitude of the worst-case difference in t
PSK
within the recommended operating conditions.
6
Codirectional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on the same side of
DD1
and V
supply currents as a function of data rate for ADUM1300W/ADUM1301W channel configurations.
DD2
or t
that is measured between units at the same operating temperature, supply voltages, and output load
PHL
PLH
propagation delay is
PLH
the isolation barrier. Opposing-directional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on opposing sides of the isolation barrier.
7
CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 V
that can be sustained while maintaining VO < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The transient magnitude is the range over which the common mode is slewed.
8
Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 6 through Figure 8 for information
. CML is the maximum common-mode voltage slew rate
DD2
on per-channel supply current for unloaded and loaded conditions. See the Power Consumption section for guidance on calculating the per-channel supply current for a given data rate.
Rev. K | Page 12 of 32
Data Sheet ADuM1300/ADuM1301
Output Supply Current per Channel, Quiescent
I
0.11
0.15
mA
For All Models
Input Currents
IIA, IIB, IIC, IE1, I
−10
+0.01
+10
µA
0 V ≤ VIA, VIB, VIC ≤ V
or V
,
SWITCHING SPECIFICATIONS

ELECTRICAL CHARACTERISTICS—3 V, 125°C OPERATION

All voltages are relative to their respective ground. 3.0 V ≤ V over the entire recommended operation range, unless otherwise noted; all typical specifications are at T These specifications apply to ADuM1300W and ADuM1301W automotive grade versions.
Table 5.
Parameter Symbol Min Typ Max Unit Test Conditions
DC SPECIFICATIONS
Input Supply Current per Channel, Quiescent I
ADuM1300W, Total Supply Current, Three Channels
DC to 2 Mbps
V
Supply Current I
DD1
V
Supply Current I
DD2
10 Mbps (TRWZ Grade Only)
V
Supply Current I
DD1
V
Supply Current I
DD2
ADuM1301W, Total Supply Current, Three Channels
DC to 2 Mbps
V
Supply Current I
DD1
V
Supply Current I
DD2
10 Mbps (TRWZ Grade Only)
V
Supply Current I
DD1
V
Supply Current I
DD2
DDI (Q)
DDO (Q)
1
DD1 (Q)
DD2 (Q)
DD1 (10)
DD2 (10)
1
DD1 (Q)
DD2 (Q)
DD1 (10)
DD2 (10)
≤ 3.6 V, 3.0 V ≤ V
DD1
≤ 3.6 V; all minimum/maximum specifications apply
DD2
= 25°C, V
A
DD1
= V
= 3.0 V.
DD2
0.26 0.31 mA
0.9 1.7 mA DC to 1 MHz logic signal freq.
0.4 0.7 mA DC to 1 MHz logic signal freq.
3.4 4.9 mA 5 MHz logic signal freq.
1.1 1.6 mA 5 MHz logic signal freq.
0.7 1.4 mA DC to 1 MHz logic signal freq.
0.6 0.9 mA DC to 1 MHz logic signal freq.
2.6 3.7 mA 5 MHz logic signal freq.
1.8 2.5 mA 5 MHz logic signal freq.
Logic High Input Threshold Logic Low Input Threshold Logic High Output Voltages V
Logic Low Output Voltages V
VIH, V VIL, V
OAH
OAL
, V
, V
E2
0 V ≤ VE1, VE2 ≤ V
EH
EL
OBH
OBL
1.6 V
0.4 V
, V
V
, V
OCH
V
, V
0.0 0.1 V IOx = 20 µA, VIx = V
OCL
− 0.1 3.0 V IOx = −20 µA, VIx = V
DD1
DD2
, V
− 0.4 2.8 V IOx = −4 mA, VIx = V
DD1
DD2
0.04 0.1 V IOx = 400 µA, VIx = V
0.2 0.4 V IOx = 4 mA, VIx = V
DD1
IxL
DD1
or V
IxH
IxH
IxL
IxL
ADuM1300WSRWZ/ADuM1301WSRWZ
Minimum Pulse Width2 PW 1000 ns CL = 15 pF, CMOS signal levels Maximum Data Rate3 1 Mbps CL = 15 pF, CMOS signal levels Propagation Delay4 t Pulse Width Distortion, |t
PLH
− t
PHL
4
| Propagation Delay Skew5 t Channel-to-Channel Matching6 t
, t
50 75 100 ns CL = 15 pF, CMOS signal levels
PHL
PLH
PWD 40 ns CL = 15 pF, CMOS signal levels
50 ns CL = 15 pF, CMOS signal levels
PSK
PSKCD/tPSKOD
50 ns CL = 15 pF, CMOS signal levels
ADuM1300WTRWZ/ADuM1301WTRWZ
Minimum Pulse Width2 Maximum Data Rate3 Propagation Delay4 Pulse Width Distortion, |t
PLH
− t
PHL
PW 100 ns C 10 Mbps C
, t
20 34 45 ns CL = 15 pF, CMOS signal levels
t
PHL
4
|
PLH
PWD 3 ns CL = 15 pF, CMOS signal levels
= 15 pF, CMOS signal levels
L
= 15 pF, CMOS signal levels
L
Change vs. Temperature 5 ps/°C CL = 15 pF, CMOS signal levels
26 ns CL = 15 pF, CMOS signal levels
Propagation Delay Skew5 Channel-to-Channel Matching,
Codirectional Channels
6
Channel-to-Channel Matching,
Opposing-Directional Channels
6
t
PSK
3 ns CL = 15 pF, CMOS signal levels
t
PSKCD
6 ns CL = 15 pF, CMOS signal levels
t
PSKOD
DD2
DD2
Rev. K | Page 13 of 32
ADuM1300/ADuM1301 Data Sheet
Parameter Symbol Min Typ Max Unit Test Conditions
For All Models
Output Disable Propagation Delay (High/Low to
t
, t
PHZ
PLH
High Impedance)
Output Enable Propagation Delay (High Impedance
t
, t
6 8 ns CL = 15 pF, CMOS signal levels
PZH
PZL
to High/Low) Output Rise/Fall Time (10% to 90%) tR/tF 3 ns CL = 15 pF, CMOS signal levels Common-Mode Transient Immunity at
Logic High Output
Common-Mode Transient Immunity at
Logic Low Output
7
7
|CM
| 25 35 kV/µs VIx = V
H
|CML| 25 35 kV/µs VIx = 0 V, VCM = 1000 V,
Refresh Rate fr 1.1 Mbps Input Dynamic Supply Current per Channel8 I Output Dynamic Supply Current per Channel8
1
The supply current values are for all three channels combined when running at identical data rates. Output supply current values are specified with no output load
present. The supply current associated with an individual channel operating at a given data rate may be calculated as described in the Power Consumption section. See Figure 6 through Figure 8 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See Figure 9 through Figure 12 for total V
2
The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed.
3
The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed.
4
t
propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. t
PHL
measured from the 50% level of the rising edge of the VIx signal to the 50% level of the rising edge of the VOx signal.
5
t
is the magnitude of the worst-case difference in t
PSK
within the recommended operating conditions.
6
Codirectional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on the same side of
the isolation barrier. Opposing-directional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on opposing sides of the isolation barrier.
7
CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 V
that can be sustained while maintaining V magnitude is the range over which the common mode is slewed.
8
Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 6 through Figure 8 for information
on per-channel supply current for unloaded and loaded conditions. See the Power Consumption section for guidance on calculating the per-channel supply current for a given data rate.
DD1
and V
supply currents as a function of data rate for ADUM1300W/ADUM1301W channel configurations.
DD2
or t
PHL
PLH
< 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The transient
O
0.10 mA/Mbps
DDI (D)
0.03 mA/Mbps
I
DDO (D)
that is measured between units at the same operating temperature, supply voltages, and output load
6 8 ns CL = 15 pF, CMOS signal levels
, VCM = 1000 V,
DD1/VDD2
transient magnitude = 800 V
transient magnitude = 800 V
propagation delay is
PLH
. CML is the maximum common-mode voltage slew rate
DD2
Rev. K | Page 14 of 32
Data Sheet ADuM1300/ADuM1301
ELECTRICAL CHARACTERISTICS—MIXED 5 V/3 V, 125°C OPERATION1
All voltages are relative to their respective ground. 4.5 V ≤ V over the entire recommended operation range, unless otherwise noted; all typical specifications are at T These specifications apply to ADuM1300W and ADuM1301W automotive grade versions.
Table 6.
Parameter Symbol Min Typ Max Unit Test Conditions
DC SPECIFICATIONS
Input Supply Current per Channel, Quiescent I
Output Supply Current per Channel, Quiescent I
ADuM1300W, Total Supply Current, Three Channels
DC to 2 Mbps
V
Supply Current I
DD1
V
Supply Current I
DD2
10 Mbps (TRWZ Grade Only)
V
Supply Current I
DD1
V
Supply Current I
DD2
ADuM1301W, Total Supply Current, Three Channels
DC to 2 Mbps
V
Supply Current I
DD1
V
Supply Current I
DD2
10 Mbps (TRWZ Grade Only)
V
Supply Current I
DD1
V
Supply Current I
DD2
For All Models
Input Currents IIA, IIB, IIC, IE1, I
Logic High Input Threshold Logic Low Input Threshold Logic High Output Voltages V
Logic Low Output Voltages V
SWITCHING SPECIFICATIONS
ADuM1300WSRWZ/ADuM1301WSRWZ
Minimum Pulse Width3 PW 1000 ns CL = 15 pF, CMOS signal levels Maximum Data Rate4 1 Mbps CL = 15 pF, CMOS signal levels Propagation Delay5 t Pulse Width Distortion, |t
PLH
− t
PHL
4
| Propagation Delay Skew6 t Channel-to-Channel Matching7
ADuM1300WTRWZ/ADuM1301WTRWZ
Minimum Pulse Width2 Maximum Data Rate3 Propagation Delay4 Pulse Width Distortion, |t
PLH
− t
PHL
4
|
Change vs. Temperature 5 ps/°C CL = 15 pF, CMOS signal levels Propagation Delay Skew5 Channel-to-Channel Matching, Codirectional
Channels
Channel-to-Channel Matching, Opposing-
Directional Channels
6
6
DDI (Q)
DDO (Q)
2
DD1 (Q)
DD2 (Q)
DD1 (10)
DD2 (10)
1
DD1 (Q)
DD2 (Q)
DD1 (10)
DD2 (10)
VIH, V VIL, V
, V
OAH
, V
OAL
, t
PHL
PWD 40 ns CL = 15 pF, CMOS signal levels
50 ns CL = 15 pF, CMOS signal levels
PSK
t
PSKCD/tPSKOD
PW 100 ns C 10 Mbps C
, t
t
PHL
PWD 3 ns CL = 15 pF, CMOS signal levels
6 ns CL = 15 pF, CMOS signal levels
t
PSK
t
PSKCD
t
PSKOD
≤ 5.5 V, 3.0 V ≤ V
DD1
≤ 3.6 V; all minimum/maximum specifications apply
DD2
= 25°C; V
A
= 5 V, V
DD1
= 3.0 V.
DD2
0.50 0.53 mA
0.11 0.15 mA
1.6 2.5 mA DC to 1 MHz logic signal freq.
0.4 0.7 mA DC to 1 MHz logic signal freq.
6.5 8.1 mA 5 MHz logic signal freq.
1.1 1.6 mA 5 MHz logic signal freq.
1.3 2.1 mA DC to 1 MHz logic signal freq.
0.6 0.9 mA DC to 1 MHz logic signal freq.
5.0 6.2 mA 5 MHz logic signal freq.
1.8 2.5 mA 5 MHz logic signal freq.
−10 +0.01 +10 μA 0 V ≤ VIA, VIB, VIC ≤ V
E2
EH
EL
OBH
OBL
2.0 V
0.8 V
, V
V
, V
DD1
DD1
, V
− 0.1 V
DD2
− 0.4 V
DD2
OCH
V
, V
0.0 0.1 V IOx = 20 μA, VIx = V
OCL
, V
V IOx = −20 μA, VIx = V
DD1
DD2
V I
,
DD1
− 0.2
V
DD2
, VE2 ≤ V
0 V ≤ V
E1
= −4 mA, VIx = V
Ox
0.04 0.1 V IOx = 400 μA, VIx = V
0.2 0.4 V IOx = 4 mA, VIx = V
50 70 100 ns CL = 15 pF, CMOS signal levels
PLH
50 ns C
20 30 40 ns CL = 15 pF, CMOS signal levels
PLH
= 15 pF, CMOS signal levels
L
= 15 pF, CMOS signal levels
L
= 15 pF, CMOS signal levels
L
DD1
IxL
IxL
DD1
or V
IxH
IxH
IxL
or V
DD2
DD2
3 ns CL = 15 pF, CMOS signal levels
22 ns CL = 15 pF, CMOS signal levels
,
Rev. K | Page 15 of 32
ADuM1300/ADuM1301 Data Sheet
Input Dynamic Supply Current per Channel9
I
0.19 mA/Mbps
Parameter Symbol Min Typ Max Unit Test Conditions
For All Models
Output Disable Propagation Delay (High/Low
to High Impedance)
Output Enable Propagation Delay (High
Impedance to High/Low) Output Rise/Fall Time (10% to 90%) tR/tF 3.0 ns CL = 15 pF, CMOS signal levels Common-Mode Transient Immunity at
Logic High Output Common-Mode Transient Immunity at
Logic Low Output
8
7
Refresh Rate fr 1.2 Mbps
Output Dynamic Supply Current per Channel8
1
All voltages are relative to their respective ground.
2
The supply current values are for all three channels combined when running at identical data rates. Output supply current values are specified with no output load present. The
supply current associated with an individual channel operating at a given data rate may be calculated as described in the Power Consumption section. See Figure 6 through Figure 8 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See Figure 9 through Figure 12 for total V supply currents as a function of data rate for ADUM1300W/ADUM1301W channel configurations.
3
The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed.
4
The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed.
5
t
propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. t
PHL
from the 50% level of the rising edge of the V
6
t
is the magnitude of the worst-case difference in t
PSK
recommended operating conditions.
7
Codirectional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on the same side of the isolation
barrier. Opposing-directional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on opposing sides of the isolation barrier.
8
CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 V
sustained while maintaining VO < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The transient magnitude is the range over which the common mode is slewed.
9
Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 6 through Figure 8 for information on
per-channel supply current for unloaded and loaded conditions. See the Power Consumption section for guidance on calculating the per-channel supply current for a given data rate.
signal to the 50% level of the rising edge of the VOx signal.
Ix
PHL
t
, t
PHZ
PLH
t
, t
6 8 ns CL = 15 pF, CMOS signal levels
PZH
PZL
|CM
| 25 35 kV/µs VIx = V
H
6 8 ns CL = 15 pF, CMOS signal levels
, VCM = 1000 V,
DD1/VDD2
transient magnitude = 800 V
|CML| 25 35 kV/µs VIx = 0 V, VCM = 1000 V,
transient magnitude = 800 V
DDI (D)
0.03 mA/Mbps
I
DDO (D)
propagation delay is measured
PLH
or t
that is measured between units at the same operating temperature, supply voltages, and output load within the
PLH
. CML is the maximum common-mode voltage slew rate that can be
DD2
DD1
and V
DD2
Rev. K | Page 16 of 32
Data Sheet ADuM1300/ADuM1301

ELECTRICAL CHARACTERISTICS—MIXED 3 V/5 V, 125°C OPERATION

All voltages are relative to their respective ground. 3.0 V ≤ V over the entire recommended operation range, unless otherwise noted; all typical specifications are at T These apply to ADuM1300W and ADuM1301W automotive grade versions.
Table 7.
Parameter Symbol Min Typ Max Unit Test Conditions
DC SPECIFICATIONS
Input Supply Current per Channel, Quiescent I Output Supply Current per Channel, Quiescent I
ADuM1300W, Total Supply Current, Three Channels
DC to 2 Mbps
V
Supply Current I
DD1
V
Supply Current I
DD2
10 Mbps (TRWZ Grade Only)
V
Supply Current I
DD1
V
Supply Current I
DD2
ADuM1301W, Total Supply Current, Three Channels
DC to 2 Mbps
V
Supply Current I
DD1
V
Supply Current I
DD2
10 Mbps (TRWZ Grade Only)
V
Supply Current I
DD1
V
Supply Current I
DD2
For All Models
Input Currents IIA, IIB, IIC, IE1, I
Logic High Input Threshold Logic Low Input Threshold Logic High Output Voltages V
Logic Low Output Voltages V
SWITCHING SPECIFICATIONS
ADuM1300WSRWZ/ADuM1301WSRWZ
Minimum Pulse Width2 PW 1000 ns CL = 15 pF, CMOS signal levels Maximum Data Rate3 1 Mbps CL = 15 pF, CMOS signal levels Propagation Delay4 t Pulse Width Distortion, |t
PLH
− t
PHL
4
| Propagation Delay Skew5 t Channel-to-Channel Matching6
ADuM1300WTRWZ/ADuM1301WTRWZ
Minimum Pulse Width2 Maximum Data Rate3 Propagation Delay4 Pulse Width Distortion, |t
PLH
− t
PHL
4
|
Change vs. Temperature 5 ps/°C CL = 15 pF, CMOS signal levels Propagation Delay Skew5 Channel-to-Channel Matching, Codirectional
Channels
Channel-to-Channel Matching, Opposing-
Directional Channels
6
6
DDI (Q)
DDO (Q)
1
DD1 (Q)
DD2(Q)
DD1 (10)
DD2 (10)
1
DD1 (Q)
DD2 (Q)
DD1 (10)
DD2 (10)
VIH, V VIL, V
, V
OAH
, V
OAL
, t
PHL
PWD 40 ns CL = 15 pF, CMOS signal levels
50 ns CL = 15 pF, CMOS signal levels
PSK
t
PSKCD/tPSKOD
PW 100 ns C 10 Mbps C
, t
t
PHL
PWD 3 ns CL = 15 pF, CMOS signal levels
6 ns CL = 15 pF, CMOS signal levels
t
PSK
t
PSKCD
t
PSKOD
≤ 3.6 V, 4.5 V ≤ V
DD1
≤ 5.5 V; all minimum/maximum specifications apply
DD2
= 25°C; V
A
= 3.0 V, V
DD1
DD2
= 5 V.
0.26 0.31 mA
0.19 0.24 mA
0.9 1.7 mA DC to 1 MHz logic signal freq.
0.7 1.0 mA DC to 1 MHz logic signal freq.
3.4 4.9 mA 5 MHz logic signal freq.
1.9 2.5 mA 5 MHz logic signal freq.
0.7 1.4 mA DC to 1 MHz logic signal freq.
1.0 1.4 mA DC to 1 MHz logic signal freq.
2.6 3.7 mA 5 MHz logic signal freq.
3.4 4.2 mA 5 MHz logic signal freq.
−10 +0.01 +10 μA 0 V ≤ VIA, VIB, VIC ≤ V
E2
EH
EL
OBH
OBL
1.6 V
0.4 V
, V
V
, V
DD1
DD1
, V
− 0.1 V
DD2
− 0.4 V
DD2
OCH
V
, V
0.0 0.1 V IOx = 20 μA, VIx = V
OCL
, V
V IOx = −20 μA, VIx = V
DD1
DD2
V I
,
DD1
− 0.2
V
DD2
, VE2 ≤ V
0 V ≤ V
E1
= −4 mA, VIx = V
Ox
0.04 0.1 V IOx = 400 μA, VIx = V
0.2 0.4 V IOx = 4 mA, VIx = V
50 70 100 ns CL = 15 pF, CMOS signal levels
PLH
50 ns C
20 30 40 ns CL = 15 pF, CMOS signal levels
PLH
= 15 pF, CMOS signal levels
L
= 15 pF, CMOS signal levels
L
= 15 pF, CMOS signal levels
L
DD1
IxL
IxL
DD1
or V
IxH
IxH
IxL
or V
DD2
DD2
3 ns CL = 15 pF, CMOS signal levels
22 ns CL = 15 pF, CMOS signal levels
,
Rev. K | Page 17 of 32
ADuM1300/ADuM1301 Data Sheet
3 V/5 V Operation
2.5 ns
Parameter Symbol Min Typ Max Unit Test Conditions
For All Models
Output Disable Propagation Delay (High/Low
to High Impedance)
Output Enable Propagation Delay
(High Impedance to High/Low)
Output Rise/Fall Time (10% to 90%) tR/tF CL = 15 pF, CMOS signal levels
5 V/3 V Operation 3.0 ns
t
, t
PHZ
PLH
t
, t
6 8 ns CL = 15 pF, CMOS signal levels
PZH
PZL
6 8 ns CL = 15 pF, CMOS signal levels
Common-Mode Transient Immunity at Logic
High Output
Common-Mode Transient Immunity at Logic
Low Output
7
7
|CM
| 25 35 kV/µs VIx = V
H
DD1/VDD2
, VCM = 1000 V,
transient magnitude = 800 V
|CML| 25 35 kV/µs VIx = 0 V, VCM = 1000 V,
transient magnitude = 800 V Refresh Rate fr 1.1 Mbps Input Dynamic Supply Current per Channel8 I Output Dynamic Supply Current per Channel8
1
The supply current values are for all three channels combined when running at identical data rates. Output supply current values are specified with no output load present. The
supply current associated with an individual channel operating at a given data rate may be calculated as described in the Power Consumption section. See Figure 6 through Figure 8 for information on per-channel supply current as a function of data rate for unloaded and loaded conditions. See Figure 9 through Figure 12 for total V supply currents as a function of data rate for ADuM1300W/ADuM1301W channel configurations.
2
The minimum pulse width is the shortest pulse width at which the specified pulse width distortion is guaranteed.
3
The maximum data rate is the fastest data rate at which the specified pulse width distortion is guaranteed.
4
t
propagation delay is measured from the 50% level of the falling edge of the VIx signal to the 50% level of the falling edge of the VOx signal. t
PHL
from the 50% level of the rising edge of the VIx signal to the 50% level of the rising edge of the VOx signal.
5
t
is the magnitude of the worst-case difference in t
PSK
recommended operating conditions.
6
Codirectional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on the same side of the isolation
barrier. Opposing-directional channel-to-channel matching is the absolute value of the difference in propagation delays between any two channels with inputs on opposing sides of the isolation barrier.
7
CMH is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 V
sustained while maintaining VO < 0.8 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. The transient magnitude is the range over which the common mode is slewed.
8
Dynamic supply current is the incremental amount of supply current required for a 1 Mbps increase in signal data rate. See Figure 6 through Figure 8 for information on
per-channel supply current for unloaded and loaded conditions. See the Power Consumption section for guidance on calculating the per-channel supply current for a given data rate.
or t
PHL
PLH
0.10 mA/Mbps
DDI (D)
0.05 mA/Mbps
I
DDO (D)
and V
DD1
DD2
propagation delay is measured
PLH
that is measured between units at the same operating temperature, supply voltages, and output load within the
. CML is the maximum common-mode voltage slew rate that can be
DD2
Rev. K | Page 18 of 32
Data Sheet ADuM1300/ADuM1301

PACKAGE CHARACTERISTICS

Table 8.
Parameter Symbol Min Typ Max Unit Test Conditions
Resistance (Input-to-Output)1 R Capacitance (Input-to-Output)
1
Input Capacitance2 C IC Junction-to-Case Thermal Resistance, Side 1 θ
IC Junction-to-Case Thermal Resistance, Side 2 θ
1
Device is considered a 2-terminal device; Pin 1, Pin 2, Pin 3, Pin 4, Pin 5, Pin 6, Pin 7, and Pin 8 are shorted together and Pin 9, Pin 10, Pin 11, Pin 12, Pin 13, Pin 14,
Pin 15, and Pin 16 are shorted together.
2
Input capacitance is from any input data pin to ground.

REGULATORY INFORMATION

The ADuM1300/ADuM1301 are approved by the organizations listed in Table 9. Refer to Table 14 and the Insulation Lifetime section for details regarding recommended maximum working voltages for specific crossisolation waveforms and insulation levels.
Table 9.
UL CSA CQC VDE TÜV
Recognized
Under 1577 Component Recognition Program
1
Single Protection,
2500 V rms Isolation Voltage
Approved under CSA Component Acceptance Notice 5A
Basic insulation per CSA 60950-1-03 and IEC 60950-1, 800 V rms (1131 V peak) maximum working voltage
Reinforced insulation per CSA 60950-1-03 and IEC 60950-1, 400 V rms (566 V peak) maximum working voltage
File E214100 File 205078 File: CQC14001114900 File 2471900-4880-0001 Certificate U8V 05 06 56232 002
1
In accordance with UL 1577, each ADuM1300/ADuM1301 is proof tested by applying an insulation test voltage ≥3000 V rms for 1 sec (current leakage detection limit = 5 μA).
2
In accordance with DIN V VDE V 0884-10, each ADuM1300/ADuM1301 is proof tested by applying an insulation test voltage ≥1050 V peak for 1 sec (partial discharge
detection limit = 5 pC). The * marking branded on the component designates DIN V VDE V 0884-10 approval.
Approved under CQC11-471543-2012
Basic insulation per GB4943.1-2011
Basic insulation, 415 V rms (588 V peak) maximum working voltage, tropical climate, altitude ≤ 5000 m
1012 Ω
I-O
C
1.7 pF f = 1 MHz
I-O
4.0 pF
I
33 °C/W
JCI
Thermocouple located at center of package underside
28 °C/W
JCO
Certified according to DIN V VDE V 0884-10 (VDE V 0884-10):2006-12
2
Reinforced insulation, 560 V peak
Approved according to IEC 61010-1:2001 (2 EN 61010-1:2001 (2
nd
Edition),
nd
Edition), UL 61010-1:2004 CSA C22.2.61010.1:2005
Reinforced insulation, 400 V rms maximum working voltage

INSULATION AND SAFETY-RELATED SPECIFICATIONS

Table 10.
Parameter Symbol Value Unit Conditions
Rated Dielectric Insulation Voltage 2500 V rms 1-minute duration Minimum External Air Gap (Clearance) L(I01) 7.7 min mm
Minimum External Tracking (Creepage) L(I02) 8.1 min mm
Minimum Internal Gap (Internal Clearance) 0.017 min mm Insulation distance through insulation Tracking Resistance (Comparative Tracking Index) CTI >400 V DIN IEC 112/VDE 0303 Part 1 Isolation Group II Material Group (DIN VDE 0110, 1/89, Table 1)
Rev. K | Page 19 of 32
Measured from input terminals to output terminals, shortest distance through air
Measured from input terminals to output terminals, shortest distance path along body
ADuM1300/ADuM1301 Data Sheet
Climatic Classification
40/105/21
After Environmental Tests Subgroup 1
896
V peak
Supply Voltages (V
, V
)
3.0 V to 5.5 V
CASE TEMPERATURE (°C)
SAFETY- LIMITING CURRENT (mA)
0
0
350
300
250
200
150
100
50
50 100 150 200
SIDE #1
SIDE #2
03787-003

DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 INSULATION CHARACTERISTICS

These isolators are suitable for reinforced electrical isolation only within the safety limit data. Maintenance of the safety data is ensured by protective circuits. The asterisk (*) marking on packages denotes DIN V VDE V 0884-10 approval for 560 V peak working voltage.
Table 11.
Description Conditions Symbol Characteristic Unit
Installation Classification per DIN VDE 0110
For Rated Mains Voltage ≤ 150 V rms I to IV For Rated Mains Voltage ≤ 300 V rms I to III For Rated Mains Voltage ≤ 400 V rms I to II
Pollution Degree per DIN VDE 0110, Table 1 2 Maximum Working Insulation Voltage V Input-to-Output Test Voltage, Method B1
× 1.875 = VPR, 100% production test, tm = 1 sec,
V
IORM
partial discharge < 5 pC
Input-to-Output Test Voltage, Method A V
After Input and/or Safety Test Subgroup 2
× 1.6 = VPR, tm = 60 sec, partial discharge < 5 pC VPR
IORM
× 1.2 = VPR, tm = 60 sec, partial discharge < 5 pC 672 V peak
V
IORM
and Subgroup 3 Highest Allowable Overvoltage Transient overvoltage, tTR = 10 seconds VTR 4000 V peak Safety-Limiting Values
Maximum value allowed in the event of a failure
(see Figure 3) Case Temperature TS 150 °C Side 1 Current IS1 265 mA Side 2 Current IS2 335 mA
Insulation Resistance at TS VIO = 500 V RS >109 Ω
560 V peak
IORM
1050 V peak
V
PR
Figure 3. Thermal Derating Curve, Dependence of Safety-Limiting
Values with Case Temperature per DIN V VDE V 0884-10

RECOMMENDED OPERATING CONDITIONS

Table 12.
Parameter Rating
Operating Temperature (TA)1 −40°C to +105°C Operating Temperature (TA)2 −40°C to +125°C Supply Voltages (V
DD1
DD1
Input Signal Rise and Fall Times 1.0 ms
1
Does not apply to ADuM1300W and ADuM1301W automotive grade versions.
2
Applies to ADuM1300W and ADuM1301W automotive grade versions.
3
All voltages are relative to their respective ground. See the DC Correctness
and Magnetic Field Immunity section for information on immunity to external magnetic fields.
1, 3
, V
)
2.7 V to 5.5 V
DD2
2, 3
DD2
Rev. K | Page 20 of 32
Data Sheet ADuM1300/ADuM1301
Basic Insulation
1131
V peak
Maximum approved working voltage per IEC 60950-1

ABSOLUTE MAXIMUM RATINGS

Ambient temperature = 25°C, unless otherwise noted.
Table 13.
Parameter Rating
Storage Temperature (TST) −65°C to +150°C Ambient Operating Temperature (TA)1 −40°C to +105°C Ambient Operating Temperature (TA)2 −40°C to +125°C Supply Voltages (V Input Voltage (VIA, VIB, VIC, VE1, VE2) Output Voltage (VOA, VOB, VOC)
, V
)3 −0.5 V to +7.0 V
DD1
DD2
3, 4
3, 4
−0.5 V to V
−0.5 V to V
+ 0.5 V
DDI
+ 0.5 V
DDO
Average Output Current per Pin5
Side 1 (IO1) −23 mA to +23 mA Side 2 (IO2) −30 mA to +30 mA
Common-Mode Transients6 −100 kV/µs to +100 kV/µs
1
Does not apply to ADuM1300W and ADuM1301W automotive grade versions.
2
Applies to ADuM1300W and ADuM1301W automotive grade versions.
3
All voltages are relative to their respective ground.
4
V
and V
DDI
given channel, respectively. See the Printed Circuit Board (PCB) Layout section.
5
See Figure 3 for maximum rated current values for various temperatures.
6
This refers to common-mode transients across the insulation barrier.
Common-mode transients exceeding the Absolute Maximum Ratings may cause latch-up or permanent damage.
refer to the supply voltages on the input and output sides of a
DDO
1
Table 14. Maximum Continuous Working Voltage
Parameter Max Unit Constraint
AC Voltage, Bipolar Waveform 565 V peak 50-year minimum lifetime AC Voltage, Unipolar Waveform
Basic Insulation 1131 V peak Maximum approved working voltage per IEC 60950-1 Reinforced Insulation 560 V peak Maximum approved working voltage per IEC 60950-1 and VDE V 0884-10
DC Voltage
Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.

ESD CAUTION

Reinforced Insulation 560 V peak Maximum approved working voltage per IEC 60950-1 and VDE V 0884-10
1
Refers to continuous voltage magnitude imposed across the isolation barrier. See the Insulation Lifetime section for more details.
Table 15. Truth Table (Positive Logic)
VIx Input1 VEx Input
1, 2
V
DDI
State1 V
State1 VOx Output1 Notes
DDO
H H or NC Powered Powered H L H or NC Powered Powered L X L Powered Powered Z X H or NC Unpowered Powered H Outputs return to the input state within 1 µs of V
power restoration.
DDI
X L Unpowered Powered Z X X Powered Unpowered Indeterminate
1
VIx and VOx refer to the input and output signals of a given channel (A, B, or C). VEx refers to the output enable signal on the same side as the VOx outputs. V
refer to the supply voltages on the input and output sides of the given channel, respectively.
2
In noisy environments, connecting VEx to an external logic high or low is recommended.
Outputs return to the input state within 1 µs of V if the V within 8 ns of V
state is H or NC. Outputs return to a high impedance state
Ex
power restoration if the VEx state is L.
DDO
power restoration
DDO
Rev. K | Page 21 of 32
DDI
and V
DDO
ADuM1300/ADuM1301 Data Sheet
*
G

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

V
1
DD1
2
*GND
1
V
3
IA
ADuM1300
V
4
IB
TOP VIEW
(Not to S cal e)
V
5
IC
6
NC NC
7 8
*GND
1
NC = NO CONNECT
PIN 2 AND PIN 8 ARE I NTERNALLY CO NNE CTED, AND CONNECT IN BOTH TO GND1 IS RECOMME NDED. PIN 9 AND PIN 15 ARE INTERNALLY CONNECTED, AND CONNECTING BO TH TO GND
V
16
DD2
15
GND2* V
14
OA
V
13
OB
V
12
OC
11
NC V
10
E2
9
GND2*
03787-004
IS RECOMME NDED.
2
Figure 4. ADuM1300 Pin Configuration
1
V
DD1
2
*GND
1
3
V
IA
ADuM1301
4
V
IB
TOP VIEW
(Not to S cale)
5
V
OC
6
NC
7
V
E1
8
*GND
1
NC = NO CONNECT
*PIN 2 AND PIN 8 ARE I NTERNALLY CONNECTED, AND CONNE CTING BOTH TO GND CONNECTED, AND CONNECTING BO TH TO GND
IS RECOMME NDE D. PIN 9 AND PIN 15 ARE INTERNALLY
1
Figure 5. ADuM1301 Pin Configuration
16
V
DD2
15
GND2*
14
V
OA
13
V
OB
12
V
IC
11
NC
10
V
E2
GND2*
9
03787-005
IS RECOMME NDE D.
2
Table 16. ADuM1300 Pin Function Descriptions
Pin
Mnemonic Description
No.
1 V
DD1
2 GND 3 V
1
IA
4 VIB Logic Input B. 5 VIC Logic Input C. 6 NC No Connect. 7 NC No Connect. 8 GND1 Ground 1. Ground reference for Isolator Side 1. 9 GND2 Ground 2. Ground reference for Isolator Side 2. 10 VE2 Output Enable 2. Active high logic input. VOA, VOB, and VOC outputs are enabled when VE2 is high or disconnected. VOA, VOB, and VOC
11 NC No Connect. 12 VOC Logic Output C. 13 VOB Logic Output B. 14 VOA Logic Output A. 15 GND2 Ground 2. Ground reference for Isolator Side 2. 16 V
Supply Voltage for Isolator Side 2.
DD2
Supply Voltage for Isolator Side 1. Ground 1. Ground reference for Isolator Side 1. Logic Input A.
outputs are disabled when V
is low. In noisy environments, connecting VE2 to an external logic high or low is recommended.
E2
Table 17. ADuM1301 Pin Function Descriptions
Pin
Mnemonic Description
No.
1 V
DD1
2 GND 3 V
IA
1
Supply Voltage for Isolator Side 1. Ground 1. Ground reference for Isolator Side 1.
Logic Input A. 4 VIB Logic Input B. 5 VOC Logic Output C. 6 NC No Connect. 7 VE1 Output Enable 1. Active high logic input. VOC output is enabled when VE1 is high or disconnected. VOC output is disabled when VE1 is
low. In noisy environments, connecting V
to an external logic high or low is recommended.
E1
8 GND1 Ground 1. Ground reference for Isolator Side 1. 9 GND2 Ground 2. Ground reference for Isolator Side 2. 10 VE2 Output Enable 2. Active high logic input. VOA and VOB outputs are enabled when VE2 is high or disconnected. VOA and VOB outputs are
disabled when V
is low. In noisy environments, connecting VE2 to an external logic high or low is recommended.
E2
11 NC No Connect. 12 VIC Logic Input C. 13 VOB Logic Output B. 14 VOA Logic Output A. 15 GND2 Ground 2. Ground reference for Isolator Side 2. 16 V
Supply Voltage for Isolator Side 2.
DD2
Rev. K | Page 22 of 32
Data Sheet ADuM1300/ADuM1301
DATA RATE (Mbps)
CURRENT/CHANNEL ( mA)
0
0
6
4
2
14
12
10
8
16
18
20
40
20 60
80 100
5V
3V
03787-008
DATA RATE (Mbps)
CURRENT/CHANNEL ( mA)
0
0
2
4
3
5
1
6
20
40 60
80 100
5V
3V
03787-009
DATA RATE (Mbps)
CURRENT/CHANNEL ( mA)
0
0
10
9
8
7
6
5
4
3
2
1
20 40 8060 100
5V
3V
03787-010
DATA RATE (Mbps)
CURRENT (mA)
0 20
0
20
10
50
40
30
60
40 60
80 100
5V
3V
03787-011
DATA RATE (Mbps)
CURRENT (mA)
0
0
4
2
10
8
6
12
16
14
4020 60 80 100
5V
3V
03787-012
DATA RATE (Mbps)
CURRENT (mA)
0
0
15
10
5
45
40
35
30
25
20
50
20 40 60 80 100
5V
3V
03787-013

TYPICAL PERFORMANCE CHARACTERISTICS

Figure 6. Typical Input Supply Current per Channel vs. Data Rate
for 5 V and 3 V Operation
Figure 7. Typical Output Supply Current per Channel vs. Data Rate
for 5 V and 3 V Operation (No Output Load)
Figure 9. Typical ADuM1300 V
for 5 V and 3 V Operation
Figure 10. Typical ADuM1300 V
for 5 V and 3 V Operation
Supply Current vs. Data Rate
DD1
Supply Current vs. Data Rate
DD2
Figure 8. Typical Output Supply Current per Channel vs. Data Rate
for 5 V and 3 V Operation (15 pF Output Load)
Rev. K | Page 23 of 32
Figure 11. Typical ADuM1301 V
for 5 V and 3 V Operation
Supply Current vs. Data Rate
DD1
ADuM1300/ADuM1301 Data Sheet
DATA RATE (Mbps)
CURRENT (mA)
0
0
10
5
20
15
25
30
20
40
60 80 100
5V
3V
03787-014
TEMPERATURE (°C)
PROPAGATION DELAY ( ns)
–50
–25
25
30
35
40
0
50 75
25
100
3V
5V
03787-019
Figure 12. Typical ADuM1301 V
Supply Current vs. Data Rate
DD2
for 5 V and 3 V Operation
Figure 13. Propagation Delay vs. Temperature, C Grade
Rev. K | Page 24 of 32
Data Sheet ADuM1300/ADuM1301
V
V

APPLICATIONS INFORMATION

PRINTED CIRCUIT BOARD (PCB) LAYOUT

The ADuM1300/ADuM1301 digital isolator requires no external interface circuitry for the logic interfaces. Power supply bypassing is strongly recommended at the input and output supply pins (see Figure 14). Bypass capacitors are most conveniently connected between Pin 1 and Pin 2 for V for V
. The capacitor value should be between 0.01 μF and 0.1 μF.
DD2
and between Pin 15 and Pin 16
DD1
The total lead length between both ends of the capacitor and the input power supply pin should not exceed 20 mm. Bypassing between Pin 1 and Pin 8 and between Pin 9 and Pin 16 should also be considered unless the ground pair on each package side is connected close to the package.
V
DD1
GND
1
V
IA
V
IB
IC/VOC
NC
NC/V
E1
GND
1
Figure 14. Recommended Printed Circuit Board Layout
V
DD2
GND V
OA
V
OB
V
OC/VIC
NC V
E2
GND
2
2
3787-015
In applications involving high common-mode transients, take care to ensure that board coupling across the isolation barrier is minimized. Furthermore, the board layout should be designed such that any coupling that does occur equally affects all pins on a given component side. Failure to ensure this could cause voltage differentials between pins exceeding the absolute maximum ratings of the device, thereby leading to latch-up or permanent damage.
See the AN-1109 Application Note for board layout guidelines.

PROPAGATION DELAY-RELATED PARAMETERS

Propagation delay is a parameter that describes the time it takes a logic signal to propagate through a component. The propagation delay to a logic low output may differ from the propagation delay to a logic high output.
INPUT (
)
Ix
OUTPUT (V
t
PLH
)
Ox
t
PHL
Figure 15. Propagation Delay Parameters
Pulse width distortion is the maximum difference between these two propagation delay values and is an indication of how accurately the timing of the input signal is preserved.
Channel-to-channel matching refers to the maximum amount that the propagation delay differs between channels within a single ADuM1300/ADuM1301 component.
Propagation delay skew refers to the maximum amount that the propagation delay differs between multiple ADuM1300/
ADuM1301 components operating under the same conditions.
50%
50%
3787-016

DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY

Positive and negative logic transitions at the isolator input cause narrow (approximately 1 ns) pulses to be sent to the decoder via the transformer. The decoder is bistable and is therefore either set or reset by the pulses, indicating input logic transitions. In the absence of logic transitions at the input for more than approximately 1 μs, a periodic set of refresh pulses indicative of the correct input state are sent to ensure dc correctness at the output. If the decoder receives no internal pulses for more than about 5 μs, the input side is assumed to be unpowered or nonfunctional, in which case the isolator output is forced to a default state (see Table 15) by the watchdog timer circuit.
The ADuM1300/ADuM1301 is extremely immune to external magnetic fields. The limitation on the magnetic field immunity of the ADuM1300/ADuM1301 is set by the condition in which induced voltage in the receiving coil of the transformer is sufficiently large enough to either falsely set or reset the decoder. The following analysis defines the conditions under which this may occur. The 3 V operating condition of the ADuM1300/
ADuM1301 is examined because it represents the most
susceptible mode of operation.
The pulses at the transformer output have an amplitude greater than 1.0 V. The decoder has a sensing threshold at about 0.5 V, thus establishing a 0.5 V margin in which induced voltages can be tolerated. The voltage induced across the receiving coil is given by
V = (−dβ/dt)∑∏r
where:
β is magnetic flux density (gauss). N is the number of turns in the receiving coil. r
is the radius of the nth turn in the receiving coil (cm).
n
Given the geometry of the receiving coil in the ADuM1300/
ADuM1301 and an imposed requirement that the induced
voltage be 50% at most of the 0.5 V margin at the decoder, a maximum allowable magnetic field is calculated as shown in Figure 16.
100
10
1
0.1
DENSITY (kgauss)
0.01
MAXIMUM ALLOWABLE MAGNETIC FLUX
0.001 1k 10k 10M
Figure 16. Maximum Allowable External Magnetic Flux Density
2
; n = 1, 2, … , N
n
MAGNETIC FIELD FREQUENCY (Hz)
1M
100M100k
3787-017
Rev. K | Page 25 of 32
ADuM1300/ADuM1301 Data Sheet
MAGNETIC FIELD F RE QUENCY (Hz)
MAXIMUM AL LOWABLE CURRE NT (kA)
1000
100
10
1
0.1
0.01 1k 10k 100M
100k 1M
10M
DISTANCE = 5mm
DISTANCE = 1m
DISTANCE = 100mm
03787-018
For example, at a magnetic field frequency of 1 MHz, the maximum allowable magnetic field of 0.2 kgauss induces a voltage of 0.25 V at the receiving coil. This is about 50% of the sensing threshold and does not cause a faulty output transition. Similarly, if such an event occurs during a transmitted pulse (and has the worst-case polarity), it reduces the received pulse from >1.0 V to 0.75 V—still well above the 0.5 V sensing threshold of the decoder.
The preceding magnetic flux density values correspond to specific current magnitudes at given distances from the
ADuM1300/ADuM1301 transformers. Figure 17 shows these
allowable current magnitudes as a function of frequency for selected distances. The ADuM1300/ADuM1301 is extremely immune and can be affected only by extremely large currents operated at a high frequency very close to the component. For the 1 MHz example noted, one would have to place a 0.5 kA current 5 mm away from the ADuM1300/ADuM1301 to affect the operation of the component.
Figure 17. Maximum Allowable Current
for Various Current-to-ADuM1300/ADuM1301 Spacings
Note that at combinations of strong magnetic field and high frequency, any loops formed by printed circuit board traces could induce error voltages sufficiently large enough to trigger the thresholds of succeeding circuitry. Take care in the layout of such traces to avoid this possibility.

POWER CONSUMPTION

The supply current at a given channel of the ADuM1300/
ADuM1301 isolator is a function of the supply voltage, the data
rate of the channel, and the output load of the channel.
For each input channel, the supply current is given by
= I
I
DDI
DDI (Q)
= I
I
DDI
× (2f − fr) + I
DDI (D)
DDI (Q)
For each output channel, the supply current is given by
I
I
DDO
DDO
= I
= (I
f ≤ 0.5 fr
DDO (Q)
+ (0.5 × 10−3) × CL × V
DDO (D)
) × (2f − fr) + I
DDO
where:
I
, I
DDI (D)
are the input and output dynamic supply currents
DDO (D)
per channel (mA/Mbps).
C
is the output load capacitance (pF).
L
V
is the output supply voltage (V).
DDO
f is the input logic signal frequency (MHz); it is half of the input
data rate expressed in units of Mbps.
f
is the input stage refresh rate (Mbps).
r
, I
I
DDI (Q)
are the specified input and output quiescent
DDO (Q)
supply currents (mA).
To calculate the total V
DD1
and V
supply current, the supply
DD2
currents for each input and output channel corresponding to V
DD1
and V
are calculated and totaled. Figure 6 and Figure 7
DD2
provide per-channel supply currents as a function of data rate for an unloaded output condition. Figure 8 provides per-channel supply current as a function of data rate for a 15 pF output condition. Figure 9 through Figure 12
supply current as a function of data rate for ADuM1300/
V
DD2
provide total V
ADuM1301 channel configurations.
f ≤ 0.5 fr
f > 0.5 fr
DDO (Q)
f > 0.5 fr
and
DD1
Rev. K | Page 26 of 32
Data Sheet ADuM1300/ADuM1301
0V
RATED PEAK VOLTAGE
03787-021
0V
RATED PEAK VOLTAGE
03787-022
0V
RATED PEAK VOLTAGE
03787-023

INSULATION LIFETIME

All insulation structures eventually break down when subjected to voltage stress over a sufficiently long period. The rate of insulation degradation is dependent on the characteristics of the voltage waveform applied across the insulation. In addition to the testing performed by the regulatory agencies, Analog Devices carries out an extensive set of evaluations to determine the lifetime of the insulation structure within the ADuM1300/
ADuM1301.
Analog Devices performs accelerated life testing using voltage levels higher than the rated continuous working voltage. Accel­eration factors for several operating conditions are determined. These factors allow calculation of the time to failure at the actual working voltage. The values shown in Ta b le 14 summarize the peak voltage for 50 years of service life for a bipolar ac operating condition and the maximum CSA/VDE approved working voltages. In many cases, the approved working voltage is higher than the 50-year service life voltage. Operation at these high working voltages can lead to shortened insulation life in some cases.
The insulation lifetime of the ADuM1300/ADuM1301 depends on the voltage waveform type imposed across the isolation barrier. The iCoupler insulation structure degrades at different rates depending on whether the waveform is bipolar ac, unipolar ac, or dc. Figure 18, Figure 19, and Figure 20 illustrate these different isolation voltage waveforms, respectively.
Bipolar ac voltage is the most stringent environment. The goal of a 50-year operating lifetime under the ac bipolar condition determines the Analog Devices recommended maximum working voltage.
In the case of unipolar ac or dc voltage, the stress on the insulation is significantly lower, which allows operation at higher working voltages while still achieving a 50-year service life. The working voltages listed in Tabl e 14 can be applied while maintaining the 50-year minimum lifetime provided the voltage conforms to either the unipolar ac or dc voltage cases. Any cross insulation voltage waveform that does not conform to Figure 19 or Figure 20 should be treated as a bipolar ac waveform, and its peak voltage should be limited to the 50-year lifetime voltage value listed in Tabl e 14.
Note that the voltage presented in Figure 19 is shown as sinusoidal for illustration purposes only. It is meant to represent any voltage waveform varying between 0 V and some limiting value. The limiting value can be positive or negative, but the voltage cannot cross 0 V.
Figure 18. Bipolar AC Waveform
Figure 19. Unipolar AC Waveform
Figure 20. DC Waveform
Rev. K | Page 27 of 32
ADuM1300/ADuM1301 Data Sheet
CO
NTRO
LLI
NG D
IMEN
SIO
NS A
RE
IN
M
IL
LI
M
ET
E
RS
; I
NC
H DI
MENS
ION
S
(I
N PAR
ENT
HES
ES) A
RE R
OU
N
DE
D-
O
FF
MI
L
LI
ME
TER
EQU
IVA
LENT
S FO
R
REF
ERE
NCE
ONL
Y
AN
D A
R
E N
O
T A
PPR
OPR
IATE
FOR
USE
IN D
ESIG
N.
COM
PLI
ANT
TO J
EDEC
ST
AN
DA
R
DS
M
S-
01
3
-A
A
1
0.
5
0 (
0.
4
13
4)
10
.
10
(0
.
39
76
)
0
.
30
(0
.
01
18
)
0
.
10
(0
.
00
39
)
2.65 (0.1043)
2.35 (0.0925)
10.65 (
0.
4
19
3)
10
.0
0
(0
.
39
37
)
7
.
60
(0
.
29
92
)
7
.
40
(0
.
29
13
)
0.75 (0.0295)
0.25 (0.0098)
4
1.
27
(
0.
05
0
0)
0.
40
(
0.
01
5
7)
C
O
PL
AN
A
RI
TY
0.
10
0
.
33
(0
.
0130)
0.20 (0.0079)
0
.
51
(0
.
02
01
)
0
.3
1 (
0
.0
12
2
)
S
EA
TI
N
G
PLANE
8° 0
°
1
6
9
8
1
1.
2
7 (
0.
0
50
0)
BSC
0
3-
2
7-
20
0
7-
B

OUTLINE DIMENSIONS

Figure 21. 16-Lead Standard Small Outline Package [SOIC_W]
Wide Body (RW-16)
Dimensions shown in millimeters (and inches)
Rev. K | Page 28 of 32
Data Sheet ADuM1300/ADuM1301
Number
Number
Maximum
Maximum
Maximum
ADuM1300ARWZ-RL
3 0 1
100
40
−40°C to +105°C
RW-16
ADuM1301BRW-RL
2 1 10
50 3 −40°C to +105°C
RW-16

ORDERING GUIDE

Package Option
Model
1, 2, 3
of Inputs, V
Side
DD1
of Inputs, V
Side
DD2
Data Rate (Mbps)
Propagation Delay, 5 V (ns)
Pulse Width Distortion (ns)
Temperature Range
ADuM1300ARW 3 0 1 100 40 −40°C to +105°C RW-16 ADuM1300ARW-RL 3 0 1 100 40 −40°C to +105°C RW-16 ADuM1300ARWZ 3 0 1 100 40 −40°C to +105°C RW-16
ADuM1300BRWZ 3 0 10 50 3 −40°C to +105°C RW-16 ADuM1300BRWZ-RL 3 0 10 50 3 −40°C to +105°C RW-16 ADuM1300CRWZ 3 0 90 32 2 −40°C to +105°C RW-16 ADuM1300CRWZ-RL 3 0 90 32 2 −40°C to +105°C RW-16 ADuM1300WSRWZ 3 0 1 100 40 −40°C to +125°C RW-16 ADuM1300WSRWZ-RL 3 0 1 100 40 −40°C to +125°C RW-16 ADuM1300WTRWZ 3 0 10 32 3 −40°C to +125°C RW-16 ADUM1300WTRWZ-RL 3 0 10 32 3 −40°C to +125°C RW-16 ADuM1301ARW 2 1 1 100 40 −40°C to +105°C RW-16 ADUM1301ARW-RL 2 1 1 100 40 −40°C to +105°C RW-16 ADUM1301ARWZ
2 1 1 100 40 −40°C to +105°C RW-16 ADUM1301ARWZ-RL 2 1 1 100 40 −40°C to +105°C RW-16 ADuM1301BRW 2 1 10 50 3 −40°C to +105°C RW-16
ADUM1301BRWZ
2 1 10 50 3 −40°C to +105°C RW-16 ADUM1301BRWZ-RL 2 1 10 50 3 −40°C to +105°C RW-16 ADuM1301CRW 2 1 90 32 2 −40°C to +105°C RW-16 ADuM1301CRWZ 2 1 90 32 2 −40°C to +105°C RW-16 ADuM1301CRWZ-RL 2 1 90 32 2 −40°C to +105°C RW-16 ADuM1301WSRWZ 2 1 1 100 40 −40°C to +125°C RW-16 ADUM1301WSRWZ-RL 2 1 1 100 40 −40°C to +125°C RW-16 ADuM1301WTRWZ 2 1 10 32 3 −40°C to +125°C RW-16 ADUM1301WTRWZ-RL 2 1 10 32 3 −40°C to +125°C RW-16 EVA L-ADuMQSEBZ
1
Z = RoHS Compliant Part.
2
W = Qualified for Automotive Applications.
3
The addition of an -RL suffix designates a 13” (1,000 units) tape-and-reel option.
4
RW-16 = 16-lead wide body SOIC.
4

AUTOMOTIVE PRODUCTS

The ADuM1300W/ADuM1301W models are available with controlled manufacturing to support the quality and reliability requirements of automotive applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to obtain the specific Automotive Reliability reports for these models.
Rev. K | Page 29 of 32
ADuM1300/ADuM1301 Data Sheet
NOTES
Rev. K | Page 30 of 32
Data Sheet ADuM1300/ADuM1301
NOTES
Rev. K | Page 31 of 32
ADuM1300/ADuM1301 Data Sheet
©2003–2015 Analog Devices, Inc. All rights reserved. Trademarks and
NOTES
registered trademarks are the property of their respective owners. D03787-0-11/15(K)
Rev. K | Page 32 of 32
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