Analog Devices ADT7318ARQ, ADT7317ARQ, ADT7316ARQ Datasheet

PRELIMINARY TECHNICAL DA T A
T
SPI/I2C
Compatible, 10-Bit Digital Temperature
=
Sensor and Quad Voltage Output 12/10/8-Bit DAC
Preliminary Technical Data
FEATURES ADT7316 - Four 12-Bit DACs ADT7317 - Four 10-Bit DACs ADT7318 - Four 8-Bit DACs Buffered Voltage Output Guaranteed Monotonic By Design Over All Codes 10-Bit Temperature to Digital Converter Temperature range: -40 Temperature Sensor Accuracy of ±0.5 Supply Range : + 2.7 V to + 5.5 V
DAC Output Range: 0 - 2V Power-Down Current 1 Internal 2.25 V
Option
Ref
Double-Buffered Input Logic Buffered / Unbuffered Reference Input Option Power-on Reset to Zero Volts Simultaneous Update of Outputs ( On-Chip Rail-to-Rail Output Buffer Amplifier

2

I
C
, SPITM, QSPITM, MICROWIRETM and DSP-Compatible 4­wire Serial Interface 16-Lead QSOP Package
APPLICATIONS Portable Battery Powered Instruments Personal Computers Telecommunications Systems Electronic Test Equipment Domestic Appliances Process Control
INTERNAL T EMPERAT URE
VALUE REGISTER
A-TO-D
CONVERTER
EXTERNAL TEMPERATURE
VALUE REGISTER
D+
D-
TEMPERATURE
7 8
ON-CHIP SENSOR
ANAL OG
MUX
V
DD
SENSOR
ADT7316/17/18
µµ
µA
µµ
o
REF
VALU E
REGISTER
C to +125oC
o
LDAC Function)
V
DD
C
X U M L A T
I
COMPARATOR
G
I D
LIMIT
STATUS
REGISTERS
ADDRESSPOINTER
X U M L A T
I G
I D
CONTROL CONFIG. 1
CONTROL CONFIG. 2
CONTROL CONFIG. 3
DAC CONFIGURATION
LDAC C ONF IGURA TION
INTERRUPT MASK
ADT7316/7317/7318
GENERAL DESCRIPTION
The ADT7316/7317/7318 combines a 10-Bit Tempera­ture-to-Digital Converter and a quad 12/10/8-Bit DAC respectively, in a 16-Lead QSOP package. This includes a bandgap temperature sensor and a 10-bit ADC to monitor and digitize the temperature reading to a resolution of
o
C. The ADT7316/17/18 operates from a single
0.25 +2.7V to +5.5V supply. The output voltage of the DAC ranges from 0 V to 2V time of typ 7 msec. The ADT7316/17/18 provides two serial interface options, a four-wire serial interface which is compatible with SPI DSP interface standards; and a two-wire I features a standby mode that is controlled via the serial interface.
The reference for the four DACs is derived either inter­nally or from two reference pins (one per DAC pair) .The outputs of all DACs may be updated simultaneously using the software
LDAC
function or external LDAC pin. The ADT7316/7317/7318 incorporates a power-on-reset cir­cuit, which ensures that the DAC output powers-up to zero volts and it remains there until a valid write takes place.
The ADT7316/7317/7318’s wide supply voltage range, low supply current and SPI/I make it ideal for a variety of applications, including per­sonal computers, office equipment and domestic appli­ances.
REGISTER
T
LIMIT
HIGH
REGISTERS
T
LIMIT
LOW
REGISTERS
VDDLim it
REGISTERS
REGISTER
REGISTER
REGISTER
REGISTER
REGISTER
REGISTERS
REGISTERS
REGISTERS
, with an output voltage settling
REF
TM
, QSPITM, MICROWIRETM and
2
C-compatible interface,
DAC A
DAC B
DAC C
REGISTERS
DAC D
REGISTERS
STRING
DAC A
STRING
DAC B
STRING
DAC C
STRING
DAC D
2
C interface. It
GAIN
SELECT
LOGIC
POWER
DOWN LOGIC
2
1
16
15
10
V
-A
OUT
V
-B
OUT
V
-C
OUT
V
-D
OUT
INTERRUP
SMBus/SPI INTERFACE
6 5
VDDGND
4 13 12 11
CS
SCL/SCLK SDA/DIN
DOUT /ADD

FUNCTIONAL BLOCK DIAGRAM

REV. PrN 02/02
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
INTERNAL TEMP
9
LDAC
3
V
-AB
REF
SENSOR
14
V
-CD
REF
I2C is a registered trademark of Philips Corporation * Protected by U.S. Patent No. 5,969,657; other patents pending.
SPI and QSPI are trademarks of Motorola, INC. MICROWIRE is a trademark of National Semiconductor Corporation.
PRELIMINARY TECHNICAL D A T A
ADT7316/ADT7317/ADT7318-SPECIFICATIONS
1
(VDD=2.7 V to 5.5 V, GND=0 V, REFIN=2.25 V, unless otherwise noted)
Parameter
DAC DC PERFORMANCE
2
3,4
Min Typ Max Units Conditions/Comments
ADT7318
Resolution 8 Bits Relative Accuracy ±0.15 ±1 LSB Relative Accuracy tbd tbd LSB Excluding Offset and Gain errors Differential Nonlinearity ±0.02 ±0.25 LSB Guaranteed Monotonic by design over all codes
ADT7317
Resolution 10 Bits Relative Accuracy ±0.5 ±4 LSB Relative Accuracy tbd tbd LSB Excluding Offset and Gain errors Differential Nonlinearity ±0.05 ±0.5 LSB Guaranteed Monotonic by design over all codes
ADT7316
Resolution 12 Bits Relative Accuracy ±2 ±16 LSB Relative Accuracy tbd tbd LSB Excluding Offset and Gain errors
Differential Nonlinearity ±0.02 ±0.9 LSB Guaranteed Monotonic by design over all codes Offset Error ±0.4 ±3 % of FSR Offset Error Match ±0.5 LSB Gain Error ±0.3 ±1.25 % of FSR Gain Error Match ±0.5 LSB Lower Deadband 20 60 mV Lower Deadband exists only if Offset Error is
Negative. See Figure 5.
Upper Deadband tbd tbd mV Upper Deadband exists if V
Offset Error Drift Gain Error Drift
DC Power Supply Rejection Ratio
DC Crosstalk
6
6
6
6
THERMAL CHARACTERISTICS
-12
-5
ppm of FSR/°C ppm of FSR/°C
-60 dB ∆V
200 µV R
plus Gain Error is positive. See Figure 6.
= ±10%
DD
= 2 K to GND or V
L
Internal Reference used.
= VDD and Offset
REF
DD
INTERNAL TEMPERATURE SENSOR
Accuracy @ VDD=3.3V ±2 °C TA = 0°C to +85°C
±3 °C T
Accuracy @ V
Resolution 10 Bits Long Term Drift 0.5 °C/1000hrs
EXTERNAL TEMPERATURE SENSOR External Transistor = 2N3906.
Accuracy @ V
Accuracy @ V
Resolution 10 Bits
Update Rate, t
Temperature Conversion Time
=5V ±2 °C TA = 0°C to +85°C
DD
=3.3V ±2 °C TA = 0°C to +85°C.
DD
=5V ±2 °C TA = 0°C to +85°C
DD
R
±3 °C T
±3 °C T
±3 °C T
TBD µ s Round Robin5 enabled TBD µs Round Robin disabled TBD
µs
= -40°C to +125°C
A
= -40°C to +125°C
A
= -40°C to +125°C
A
= -40°C to +125°C
A
Output Source Current 180 µA High Level
11 µA Low Level
VOLTAGE OUTPUT
8-Bit DAC Output
Resolution 1 °C Scale Factor 8.79 mV/°C 0-V
17.58 mV/°C 0-2V
Output. TA = -40°C to +125°C
REF
Output. TA = -40°C to +125°C
REF
10-Bit DAC Output
Resolution 0.25 °C
–2–
REV. PrN
PRELIMINARY TECHNICAL D A T A
ADT7316/7317/7318
Parameter
DAC ERTERNAL REFERENCE INPUT
2
Scale Factor 2.2 mV/°C 0-V
6
V
Input Range 1 V
REF
Input Range 0.25 V
V
REF
V
Input Impedance 37 45 k Unbuffered Reference Mode. 0-2 V
REF
Min Typ Max Units Conditions/Comments
Output. TA = -40°C to +125°C
4.39 mV/°C 0-2V
DD DD
74 90 k Unbuffered Reference Mode. 0- V
V Buffered Reference Mode V Unbuffered Reference Mode
REF
Output. TA = -40°C to +125°C
REF
>10 M Buffered reference mode and Power-Down Mode
Output Range.
REF
Output Range.
REF
Reference Feedthrough -90 dB Frequency=10KHz Channel-toChannel Isolation -75 dB Frequency=10KHz
ON-CHIP REFERENCE
Reference Voltage Temperature Coefficient
OUTPUT CHARACTERISTICS
Output Voltage
6
6
7
6
0.001 VDD-0.001 V This is a measure of the minimum and maximum drive
2.25 V 80 ppm/
°C
capability of the output amplifier
DC Output Impedance 0.5 Short Circuit Current 25 mA V
16 mA V
Power Up Time 2.5 µs Coming out of Power Down Mode. V
5 µs Coming out of Power Down Mode. VDD = +3 V
DIGITAL INPUTS
6
Input Current ±1 µ A VIN = 0V to V VIL, Input Low Voltage 0.8 V V
0.6 V V
V
, Input High Voltage 1.89 V
IH
Pin Capacitance 3 10 pF All Digital Inputs
= +5V
DD
= +3V
DD
= +5V±10%
DD
= +3V±10%
DD
DD
= +5 V
DD
SCL, SDA Glitch Rejection 50 ns Input Filtering Suppresses Noise Spikes of Less than 50
ns
DIGITAL OUTPUT
Output High Voltage, V Output Low Voltage, V Output High Current, I
Output Capacitance, C
ALERT Output Saturation Voltage
I2C TIMING CHARACTERISTICS
Serial Clock Period, t
OH
OL
OH
OUT
8,9
1
Data In Setup Time to SCL High, t Data Out Stable after SCL Low, t
2.4 V I
0.4 V IOL = 3 mA 1mAV
50 pF
0.8 V I
2.5 µs Fast-Mode I2C. See Figure 1
2
0 ns See Figure 1
3
SOURCE
= 5 V
OH
= 4 mA
OUT
= I
SINK
= 200 µA
SDA Low Setup Time to SCL Low
(Start Condition), t
4
50 ns See Figure 1
SDA High Hold Time after SCL High
(Stop Condition), t
SDA and SCL Fall Time, t
5
6
SPI TIMING CHARACTERISTICS
CS to SCLK Setup Time, t SCLK High Pulsewidth, t SCLK Low Pulse, t Data Access Time after
SCLK Falling edge, t
1
2
3
12
4
50 ns See Figure 1
90 ns See Figure 1
10, 11
0 ns See Figure 2 50 ns See Figure 2 50 ns See Figure 2
35 ns See Figure 2
Data Setup Time Prior
to SCLK Rising Edge, t
5
20 ns See Figure 2
Data Hold Time after
SCLK Rising Edge, t
CS to SCLK Hold Time, t
6
7
CS to DOUT High Impedance, t
0 ns See Figure 2 0 ns See Figure 2
8
40 ns See Figure 2
POWER REQUIREMENTS
V
DD
Settling Time 50 ms VDD settles to within 10% of it’s final voltage
V
DD
2.7 5.5 V
level.
–3–REV. PrN
PRELIMINARY TECHNICAL D A T A
ADT7316/7317/7318
I
(Normal Mode)
DD
I
(Power Down Mode) 1 3 µA V
DD
Power Dissipation tbd tbd tbd µW V
Notes:
1
Temperature ranges are as follows: A Version: -40°C to +125°C.
2
See Terminology.
3
DC specifications tested with the outputs unloaded.
4
Linearity is tested using a reduced code range:; ADT7316 (code 115 to 4095); ADT7317 (code 28 to 1023); ADT7318 (code 8 to 255)
5
See Terminology.
6
Guaranteed by Design and Characterization, not production tested
7
In order for the amplifier output to reach its minimum voltage, Offset Error must be negative. In order for the amplifier output to reach its maximum voltage, V "Offset plus Gain" Error must be positive.
8
The SDA & SCL timing is measured with the input filters turned on so as to meet the Fast-Mode I rate but has a negative affect on the EMC behaviour of the part.
9
Guaranteed by design. Not tested in production.
10
Guaranteed by design and characterization, not production tested.
11
All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of 1.6 V.
12
Measured with the load circuit of Figure 3.
13
IDD spec. is valid for all DAC codes. Interface inactive. All DACs active. Load currents excluded.
Specifications subject to change without notice.
13
0.85 1.3 mA VIH = VDD and V = +4.5V to +5.5V, VIH=VDD and VIL=GND
0.5 1 µA V
DD
= +2.7V to +3.6V, VIH=VDD and VIL=GND
DD
= +2.7 V. Using Normal Mode
DD
= GND
IL
tbd tbd tbd µW VDD = +2.7 V. Using Shutdown Mode
2
C specification. Switching off the input filters improves the transfer
REF=VDD
,
DAC AC CHARACTERISTICS
Parameter
2
1
Min Typ @ 25°C M ax Units Conditions/Comments
Output Voltage Settling Time V
(VDD = +2.7V to +5.5 V; R 4K7 to V
; All specifications T
DD
=4k7 to GND; C
L
to T
MIN
REF=VDD
MAX
=+5V
=200pF to GND;
L
unless otherwise noted.)
ADT7318 6 8 µs 1/4 Scale to 3/4 Scale change (40 Hex to C0 Hex) ADT7317 7 9 µs 1/4 Scale to 3/4 Scale change (100 Hex to 300 Hex) ADT7316 8 10 µs 1/4 Scale to 3/4 Scale change (400 Hex to
C00 Hex) Slew Rate 0.7 V/µs Major-Code Change Glitch Energy 12 nV-s 1 LSB change around major carry. Digital Feedthrough 0.5 nV-s Digital Crosstalk 1 nV-s Analog Crosstalk 0.5 nV-s DAC-to-DAC Crosstalk 3 nV-s Multiplying Bandwidth 200 kHz V Total Harmonic Distortion -70 dB V
NOTES
1
Guaranteed by Design and Characterization, not production tested
2
See Terminology
=2V±0.1Vpp
REF
=2.5V±0.1Vpp. Frequency=10kHz.
REF
Specifications subject to change without notice.
SCL
SDA
DATA IN
SDA
DATA O U T
t
1
t
4
t
2
t
3
Figure 1. Diagram for I2C Bus Timing
–4– REV. PrN
t
5
t
6
+5
PRELIMINARY TECHNICAL D A T A
ADT7316/7317/7318
t
1
SCLK
DOUT DBX
DIN
DB7
MSB L SB
t
t
1
2
2
DBX DBX
DB6 DB0
3
4
t
3
DBX
t
t
5
6
DB5
8
t
4
DB7 MSB
DB8
MSB
7
t
8
Figure 2. Diagram for SPI Bus Timing
I
A
200
OL
TO
OUTPUT
PIN
50pF
C
L
1.6V
A
200
I
OL
Figure 3. Load Circuit for Access Time and Bus Relinquish Time
DD
V
To DAC
Outp ut
4Κ7Ω
4Κ7Ω 200
pF
Figure 4. Load Circuit for DAC Outputs
–5–REV. PrN
PRELIMINARY TECHNICAL D A T A
ADT7316/7317/7318
ABSOLUTE MAXIMUM RATINGS*
VDD to GND –0.3 V to +7 V Digital Input Voltage to GND –0.3 V to V Digital Output Voltage to GND –0.3 V to V Reference Input voltage to GND –0.3 V to V Operating Temperature Range –40°C to +125°C Storage Temperature Range –65°C to +150°C Junction Temperature +150°C 16-Lead QSOP Package Power Dissipation (T
θ
Thermal Impedance 150 °C/W (QSOP)
JA
j
Reflow Soldering Peak Temperature +220 +/- 0°C
Time of Peak Temperature 10 sec to 40 sec
*Stresses above those listed under Absolute Maximum Ratings may cause permanent
damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
DD DD
DD
max - T
+ 0.3 V + 0.3 V
+ 0.3V
) / θ
A
JA
2
Table 1. I
C Address Selection
ADD Pin I2C Address
Low 1001 000
Float 1001 010
High 1001 011
PIN CONFIGURATION
QSOP
V
-B
out
V
-A
out
V
ref
2
-AB V
3
ADT7316/
4
CS
GND
D+
D-
7317/7318
5
TOP VIEW
6
(Not to Scale)
7
89
V
16
V
15
14
13
SCL/SCLK
12
SDA/D IN DOUT/ADDVDD
11
10
INTERRUPT
LDAC
out out ref
-C1
-D
-CD

ORDERING GUIDE

Model Temperature Range DAC Resolution Package Description Package Options
ADT7318ARQ –40°C to +125°C 8-Bits 16-Lead QSOP RQ-16 ADT7317ARQ -40°C to +125°C 10-Bits 16-Lead QSOP RQ-16 ADT7316ARQ -40°C to +125°C 12-Bits 16-Lead QSOP RQ-16
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although
ADT7316/7317/7318
the
feature proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
6REV. PrN
WARNING!
ESD SENSITIVE DEVICE
PRELIMINARY TECHNICAL D A T A
ADT7316/7317/7318
ADT7316/7317/7318 PIN FUNCTION DESCRIPTION
Pin Mnemonic Description
1V 2V 3V
4 CS SPI Active low control Input. This is the frame synchronization signal for the input data.
5 GN D Ground Reference Point for All Circuitry on the part. Analog and Digital Ground. 6VDDPositive Supply Voltage, +2.7 V to +5.5 V.The supply should be decoupled to ground. 7 D+ Positive connection to external temperature sensor 8 D- Negative connection to external temperature sensor 9 LDAC Active low control input that transfers the contents of the input registers to their respective
10 INTERRUPT Over Limit Interrupt. The output polarity of this pin can be set to give an active low or active
11 DOUT/ADD SPI Serial Data Output. Logic Output. Data is clocked out of any register at this pin. Data is
12 SDA/DIN SDA - I
13 SCL/SCLK Serial Clock Input. This is the clock input for the serial port. The serial clock is used to clock
14 V
15 V 16 V
B Buffered Analog Output Voltage from DAC B. The output amplifier has rail-to-rail operation.
OUT
A Buffered Analog Output Voltage from DAC A. The output amplifier has rail-to-rail operation.
OUT
AB Reference Input Pin for DACs A and B.It may be configured as a buffered or unbuffered input
REF
to each or both of the DACs A and B. It has an input range from 0.25 V to V
in unbuffered
DD
mode and from 1 V to VDD in buffered mode.
When CS goes low, it enables the input register and data is transferred in and out on the ris­ing edges of the following serial clocks. This pin must be kept high for I
2
C mode of operation.
CS is also used as a control pin when selecting the serial interface type after power-up.
DAC registers. Pulsing this pin low allows any or all DAC registers to be updated if the input registers have new data. This allows simultaneous update of all DAC outputs. Bit C3 of Con­trol Configuration 3 register enables LDAC pin. Default is with LDAC pin controlling the loading of DAC registers.
high interrupt when temperature, VDD and AIN limits are exceeded. Default is active low.
clocked out at the falling edge of SCLK. ADD, I nication this pin is checked to determine the serial bus address assigned to the ADT7316/17/
18. Any subsequent changes on this pin will have no affect on the I
2
C serial bus address selection pin. Logic input. During the first valid I2C bus commu-
2
C serial bus address. A low on this pin gives the address 1001 000, leaving it floating gives the address 1001 010 and set­ting it high gives the address 1001 011.
2
C Serial Data Input. I2C serial data to be loaded into the parts registers is provided on this input. DIN - SPI Serial Data Input. Serial data to be loaded into the parts registers is provided on this input. Data is clocked into a register on the rising edge of SCLK.
data out of any register of the ADT7316/7317/7318 and also to clock data into any register that can be written to.
CD Reference Input Pin for DACs C and D.It may be configured as a buffered or unbuffered input
REF
to each or both of the DACs C and D. It has an input range from 0.25 V to V
in unbuffered
DD
mode and from 1 V to VDD in buffered mode.
D Buffered Analog Output Voltage from DAC D. The output amplifier has rail-to-rail operation.
OUT
C Buffered Analog Output Voltage from DAC C. The output amplifier has rail-to-rail operation.
OUT
7REV. PrN
ADT7316/7317/7318
PRELIMINARY TECHNICAL D A T A

TERMINOLOGY RELATIVE ACCURACY

Relative accuracy or integral nonlinearity (INL) is a mea­sure of the maximum deviation, in LSBs, from a straight line passing through the endpoints of the DAC transfer function. Typical INL versus Code plots can be seen in TPCs 1, 2, and 3.

DIFFERENTIAL NONLINEARITY

Differential Nonlinearity (DNL) is the difference be­tween the measured change and the ideal 1 LSB change between any two adjacent codes. A specified differential nonlinearity of ±1 LSB maximum ensures monotonicity. This DAC and Temperature Sensor ADC is guaranteed monotonic by design. Typical DAC DNL versus Code plots can be seen in TPCs 4, 5, and 6.

OFFSET ERROR

This is a measure of the offset error of the DAC and the output amplifier. (See Figures 5 and 6.) It can be negative or positive. It is expressed in mV.

OFFSET ERROR MATCH

This is the difference in Offset Error between any two channels.

GAIN ERROR

This is a measure of the span error of the DAC. It is the deviation in slope of the actual DAC transfer characteristic from the ideal expressed as a percentage of the full-scale range.

GAIN ERROR MATCH

This is the difference in Gain Error between any two channels.

OFFSET ERROR DRIFT

This is a measure of the change in offset error with changes in temperature. It is expressed in (ppm of full­scale range)/°C.

GAIN ERROR DRIFT

This is a measure of the change in gain error with changes in temperature. It is expressed in (ppm of full­scale range)/°C.

DC POWER-SUPPLY REJECTION RATIO (PSRR)

This indicates how the output of the DAC is affected by changes in the supply voltage. PSRR is the ratio of the change in V the DAC. It is measured in dBs. V V
is varied ±10%.
DD

DC CROSSTALK

to a change in VDD for full-scale output of
OUT
is held at 2 V and
REF
This is the dc change in the output level of one DAC in response to a change in the output of another DAC. It is measured with a full-scale output change on one DAC while monitoring another DAC. It is expressed in µV.

REFERENCE FEEDTHROUGH

This is the ratio of the amplitude of the signal at the DAC output to the reference input when the DAC output is not being updated (i.e., LDAC is high). It is expressed in dBs.

CHANNEL-TO-CHANNEL ISOLATION

This is the ratio of the amplitude of the signal at the out­put of one DAC to a sine wave on the reference input of another DAC. It is measured in dBs.

MAJOR-CODE TRANSITION GLITCH ENERGY

Major-code transition glitch energy is the energy of the impulse injected into the analog output when the code in the DAC register changes state. It is normally specified as the area of the glitch in nV secs and is measured when the digital code is changed by 1 LSB at the major carry transi­tion (011 . . . 11 to 100 . . . 00 or 100 . . . 00 to 011 . . . 11).

DIGITAL FEEDTHROUGH

Digital feedthrough is a measure of the impulse injected into the analog output of a DAC from the digital input pins of the device but is measured when the DAC is not being written to the. It is specified in nV secs and is mea­sured with a full-scale change on the digital input pins, i.e., from all 0s to all 1s or vice versa.

DIGITAL CROSSTALK

This is the glitch impulse transferred to the output of one DAC at midscale in response to a full-scale code change (all 0s to all 1s and vice versa) in the input register of another DAC. It is measured in stand-alone mode and is expressed in nV secs.

ANALOG CROSSTALK

This is the glitch impulse transferred to the output of one DAC due to a change in the output of another DAC. It is measured by loading one of the input registers with a full­scale code change (all 0s to all 1s and vice versa) while keeping LDAC high. Then pulse LDAC low and monitor the output of the DAC whose digital code was not changed. The area of the glitch is expressed in nV secs.

DAC-TO-DAC CROSSTALK

This is the glitch impulse transferred to the output of one DAC due to a digital code change and subsequent out­put change of another DAC. This includes both digital and analog crosstalk. It is measured by loading one of the DACs with a full-scale code change (all 0s to all 1s and vice versa) with LDAC low and monitoring the output of another DAC. The energy of the glitch is expressed in nV secs.

MULTIPLYING BANDWIDTH

The amplifiers within the DAC have a finite bandwidth. The multiplying bandwidth is a measure of this. A sine wave on the reference (with full-scale code loaded to the DAC) appears on the output. The multiplying band­width is the frequency at which the output amplitude falls to 3 dB below the input.
8REV. PrN
PRELIMINARY TECHNICAL D A T A

TOTAL HARMONIC DISTORTION

This is the difference between an ideal sine wave and its attenuated version using the DAC. The sine wave is used as the reference for the DAC, and the THD is a measure of the harmonics present on the DAC output. It is measured in dBs.

ROUND ROBIN

This term is used to describe the ADT7316/17/18 cycling through the available measurement channels in sequence taking a measurement on each channel.
GAIN ERROR
+
OFFSE T ERROR
ADT7316/7317/7318
OUTP UT
VOLTAGE
NEGATIVE
OFFSET
ERROR
AM PL IFIER
FOOTROOM
NEGATIVE
OFFSET
ERROR
LOWER
DEADBAND
CODES
DAC CODE
ACTUAL IDEAL
Figure 5. Transfer Function with Negative Offset
GAIN ERROR
+
OFFSET ERROR
UPPER
OUTP UT
VOLTAGE
DEADBA ND CODES
ACTUAL IDEAL
POSITIVE
OFFSET
ERROR
DAC CODE
FULL SCALE
Figure 6. Transfer Function with Positive Offset (V
–9–REV. PrN
REF
= VDD)
ADT7316/7317/7318
0
PRELIMINARY TECHNICAL D A T A
1.0
TA=25ⴗC
=5V
V
DD
0.5
L
­R
O
0
R R E L N
I
-0.5
-1.0 050 250100 150 200
CODE
TPC 1. ADT7318 Typical INL Plot
0. 3
TA=25ⴗC V
=5V
DD
0. 2
s B S
0. 1
L
­R O
0
R R E
L
-0.1
N D
-0.2
3
TA=25ⴗC
=5V
V
DD
2
1
L
­R
0
O R R E L
-1
N
I
-2
-3 0 200 1000400 600 800
CODE
12
TA=25ⴗC
=5V
V
DD
8
s B
4
S L
­R
0
O R R E L
-4
N
I
-8
-12 040001000 2000 3000
CODE
TPC 2. ADT7317 Typical INL Plot TPC 3. ADT7316 Typical INL Plot
0.6
TA=25ⴗC
=5V
V
DD
0.4
s B
0.2
S L
­R
O
0
R R E L
-0.2
N D
-0.4
1
TA=25ⴗC
=5V
V
DD
0.5
s B S L
­R
O
0
R R E L N D
-0.5
-0.3 050 25100 150 200
CODE
TPC 4. ADT7318 Typical DNL Plot
0.5
VDD=5V T
=25ⴗC
A
0.25
s B S L
­R
0
O R R E
-0.25
-0.5 01 5234
MAX INL
MIN DNL
MIN INL
V
REF
MAX DNL
-V
TPC 7. ADT7318 INL and DNL
Error vs V
REF
-0.6 2000
CODE
600400
800 100
-1 10000
2000
CODE
3000 4000
TPC 5. ADT7317 Typical DNL Plot TPC 6. ADT7316 Typical DNL Plot
0.5
VDD=5V
0.4
V
=3V
REF
0.3
0.2
s B
0.1
S L
-
0
R O R
-0.1
R E
-0.2
-0.3
-0.4
-0.5
40 0 40
MAX INL
MAX DNL
MIN DNL
MIN INL
80 120
TEMPERATURE -ⴰC
TPC 8. ADT7318 INL Error and DNL
Error vs Temperature
1
VDD=5V V
=2V
REF
0.5
R S F
%
-
0
R O R R E
-0.5
-1
GAIN E RROR
OFFS ET ER ROR
40 0 40
TEMPERATURE -ⴰC
80 120
TPC 9. ADT7318 Offset Error and Gain
Error vs Temperature
–10– REV. PrN
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