Analog Devices ADSP-TS201S User Manual

a
®
TigerSHARC
Embedded Processor
ADSP-TS201S
KEY FEATURES
Up to 600 MHz, 1.67 ns instruction cycle rate 24M bits of internal—on-chip—DRAM memory 25 mm × 25 mm (576-ball) thermally enhanced ball grid
array package
Dual-computation blocks—each containing an ALU, a
multiplier, a shifter, a register file, and a communications logic unit (CLU)
Dual-integer ALUs, providing data addressing and pointer
manipulation
Integrated I/O includes 14-channel DMA controller, external
port, four link ports, SDRAM controller, programmable flag pins, two timers, and timer expired pin for system integration
1149.1 IEEE-compliant JTAG test access port for on-chip emulation
Single-precision IEEE 32-bit and extended-precision 40-bit
floating-point data formats and 8-, 16-, 32-, and 64-bit fixed-point data formats
DATA ADDRESS GENERATION
32
32
INTEGER
KALU
32-BIT × 32-BIT
128
128
DAB
DAB
PROGRAM
SEQUENCER
ADDR
FETCH
BTB
PC
IAB
CLU
INTEGER
JALU
32-BIT × 32-BIT
J-BUS ADDR
J-BUS DATA
K-BUS ADDR
K-BUS DATA
I-BUS ADDR
I-BUS DATA
T
X
REGISTER
MULALUSHIFT
FILE
32-BIT × 32-BIT
KEY BENEFITS
Provides high performance static superscalar DSP
operations, optimized for telecommunications infrastructure and other large, demanding multiprocessor DSP applications
Performs exceptionally well on DSP algorithm and I/O
benchmarks (see benchmarks in Table 1)
Supports low overhead DMA transfers between internal
memory, external memory, memory-mapped peripherals, link ports, host processors, and other (multiprocessor) DSPs
Eases DSP programming through extremely flexible instruc-
tion set and high-level-language-friendly DSP architecture
Enables scalable multiprocessing systems with low commu-
nications overhead
Provides on-chip arbitration for glueless multiprocessing
24M BITS INTERNAL MEMORY
MEMORY BLOCKS
(PAGE CACHE)
4 × CROSSBAR CONNECT
ADADA
A
D
32
128
32
128
32
128
S-BUS ADDR
S-BUS DATA
128
128
Y
REGISTER
FILE
32-BIT × 32-BIT
D
SOC
I/F
21
128
MUL ALU SHIFT
SOC BUS
CLU
JTAG
HOST
MULTI-
PROC
SDRAM
CTRL
C-BUS
ARB
DMA
L0
OUT
L1
OUT
L2
OUT
L3
OUT
JTAG PORT
6
EXTERNAL
PORT
32
64
8
10
EXT DMA
REQ
LINK PORTS
4 8
IN
4 8 4 8
IN
4 8 4 8
IN
4 8 4 8
IN
4 8
ADDR
DATA
CTRL
CTRL
4
TigerSHARC and the TigerSHARC logo are registered trademarks of Analog Devices, Inc.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
COMPUTATIONAL BLOCKS
Figure 1. Functional Block Diagram
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2006 Analog Devices, Inc. All rights reserved.
ADSP-TS201S

TABLE OF CONTENTS

General Description ................................................. 3
Dual Compute Blocks ............................................ 4
Data Alignment Buffer (DAB) .................................. 4
Dual Integer ALU (IALU) ....................................... 4
Program Sequencer ............................................... 5
Interrupt Controller ........................................... 5
Flexible Instruction Set ........................................ 5
DSP Memory ....................................................... 5
External Port (Off-Chip Memory/Peripherals
Interface) ......................................................... 6
Host Interface ................................................... 7
Multiprocessor Interface ...................................... 7
SDRAM Controller ............................................ 7
EPROM Interface .............................................. 7
DMA Controller ................................................... 7
Link Ports (LVDS) ................................................ 9
Timer and General-Purpose I/O ............................... 9
Reset and Booting ................................................. 9
Clock Domains .................................................... 9
Power Domains .................................................. 10
Filtering Reference Voltage and Clocks .................... 10
Development Tools ............................................. 10
Evaluation Kit .................................................... 11
Designing an Emulator-Compatible
DSP Board (Target) .......................................... 11
Additional Information ........................................ 11
Pin Function Descriptions ....................................... 12
Strap Pin Function Descriptions ................................ 20
ADSP-TS201S—Specifications .................................. 21
Operating Conditions .......................................... 21
Electrical Characteristics ....................................... 22
Package Information ........................................... 23
Absolute Maximum Ratings .................................. 23
ESD Sensitivity ................................................... 23
Timing Specifications .......................................... 24
General AC Timing .......................................... 24
Link Port Low Voltage, Differential-Signal (LVDS)
Electrical Characteristics, and Timing ................ 30
Link Port—Data Out Timing ........................... 31
Link Port—Data In Timing ............................. 34
Output Drive Currents ......................................... 36
Test Conditions .................................................. 37
Output Disable Time ......................................... 37
Output Enable Time ......................................... 38
Capacitive Loading ........................................... 38
Environmental Conditions .................................... 40
Thermal Characteristics ..................................... 40
576-Ball BGA_ED Pin Configurations ......................... 41
Outline Dimensions ................................................ 45
Surface Mount Design .......................................... 45
Ordering Guide ..................................................... 46

REVISION HISTORY

12/06—Rev. B to Rev. C
Applied Corrections to:
Figure7, SCLK_VREF Filtering Scheme .................... 10
Operating Conditions ........................................... 21
Added On-Chip DRAM Refresh ............................. 27
Ordering Guide .................................................. 46
Rev. C | Page 2 of 48 | December 2006

GENERAL DESCRIPTION

ADSP-TS201S
The ADSP-TS201S TigerSHARC processor is an ultrahigh per­formance, static superscalar processor optimized for large signal processing tasks and communications infrastructure. The DSP combines very wide memory widths with dual computation blocks—supporting floating-point (IEEE 32-bit and extended precision 40-bit) and fixed-point (8-, 16-, 32-, and 64-bit) pro­cessing—to set a new standard of performance for digital signal processors. The TigerSHARC static superscalar architecture lets the DSP execute up to four instructions each cycle, performing 24 fixed-point (16-bit) operations or six floating-point operations.
Four independent 128-bit wide internal data buses, each con­necting to the six 4M bit memory banks, enable quad-word data, instruction, and I/O access and provide 33.6G bytes per second of internal memory bandwidth. Operating at 600 MHz, the ADSP-TS201S processor’s core has a 1.67 ns instruction cycle time. Using its single-instruction, multiple-data (SIMD) features, the ADSP-TS201S processor can perform 4.8 billion, 40-bit MACS or 1.2 billion, 80-bit MACS per second. Table 1 shows the DSP’s performance benchmarks.
Table 1. General-Purpose Algorithm Benchmarks at 600 MHz
Clock
Benchmark Speed
Cycles
32-bit algorithm, 1.2 billion MACS/s peak performance 1K point complex FFT 64K point complex FFT
1
(Radix2) 15.7 μs 9419
1
(Radix2) 2.33 ms 1397544 FIR filter (per real tap) 0.83 ns 0.5 [8 × 8][8 × 8] matrix multiply (complex,
floating-point) 2.3 μs 1399 16-bit algorithm, 4.8 billion MACS/s peak performance 256 point complex FFT
(Radix 2)
0.975 μs 585
1
I/O DMA transfer rate External port 1G bytes/s n/a Link ports (each) 1G bytes/s n/a
1
Cache preloaded
The ADSP-TS201S processor is code compatible with the other TigerSHARC processors.
The Functional Block Diagram on Page 1 shows the ADSP-TS201S processor’s architectural blocks. These blocks include:
• Dual compute blocks, each consisting of an ALU, multi­plier, 64-bit shifter, 128-bit CLU, and 32-word register file and associated data alignment buffers (DABs)
• Dual integer ALUs (IALUs), each with its own 31-word register file for data addressing and a status register
• A program sequencer with instruction alignment buffer (IAB) and branch target buffer (BTB)
• An interrupt controller that supports hardware and soft­ware interrupts, supports level- or edge-triggers, and supports prioritized, nested interrupts
• Four 128-bit internal data buses, each connecting to the six 4M bit memory banks
• On-chip DRAM (24M bit)
• An external port that provides the interface to host proces­sors, multiprocessing space (DSPs), off-chip memory­mapped peripherals, and external SRAM and SDRAM
• A 14-channel DMA controller
• Four full-duplex LVDS link ports
• Two 64-bit interval timers and timer expired pin
• An 1149.1 IEEE-compliant JTAG test access port for on­chip emulation
Figure 2 on Page 3 shows a typical single-processor system with
external SRAM and SDRAM. Figure 4 on Page 8 shows a typical multiprocessor system.
ADSP-TS201S
RST_IN RST_OUT
CLOCK
REFERENCE
REFERENCE
SDRAM
MEMORY
(OPTIONAL)
CS
CLK ADDR
RAS CAS
DATA
DQM
WE
CKE
A10
LINK
DEVICES
(4 MAX)
(OPTIONAL)
POR_IN
SCLK
SCLKRA T2–0
SCLK_V
REF
V
REF
IRQ3–0
FLAG3–0
ID2–0
MSSD3–0 RAS CAS
LDQM
HDQM
SDWE
SDCKE
SDA10
IORD IOWR IOEN
LxDATO3–0P/N
LxCLKOUTP/N
LxACKI
LxBCMPO
LxDATI3–0P/N
LxCLKINP/N
LxACKO
LxBCMPI
CONTROLIMP1–0 TMR0E DS2–0
BMS
BRST
ADDR31–0
DATA63–0
WRH/WRL
ACK
MS1–0
MSH HBR HBG
BOFF
BR7–0
CPA DPA
DMAR3–0
BM
BUSLOCK
JTAG
RD
L
S S
O
E
R
R
T
D
N
D
O
A
C
Figure 2. ADSP-TS201S Single-Processor System with External SDRAM
A T A D
BOOT
EPROM
(OPTIONAL)
CS
ADDR
DATA
MEMORY
(OPTIONAL)
ADDR
DATA
OE WE
ACK
CS
HOST
PROCESSOR
INTERFACE (OPTIONAL)
ADDR
DATA
DMA DEVICE
(OPTIONAL)
DATA
Rev. C | Page 3 of 48 | December 2006
ADSP-TS201S
TM
The TigerSHARC DSP uses a Static Superscalar This architecture is superscalar in that the ADSP-TS201S pro­cessor’s core can execute simultaneously from one to four 32-bit instructions encoded in a very large instruction word (VLIW) instruction line using the DSP’s dual compute blocks. Because the DSP does not perform instruction re-ordering at runtime— the programmer selects which operations will execute in parallel prior to runtime—the order of instructions is static.
With few exceptions, an instruction line, whether it contains one, two, three, or four 32-bit instructions, executes with a throughput of one cycle in a 10-deep processor pipeline.
For optimal DSP program execution, programmers must follow the DSP’s set of instruction parallelism rules when encoding an instruction line. In general, the selection of instructions that the DSP can execute in parallel each cycle depends on the instruc­tion line resources each instruction requires and on the source and destination registers used in the instructions. The program­mer has direct control of three core components—the IALUs, the compute blocks, and the program sequencer.
The ADSP-TS201S processor, in most cases, has a two-cycle execution pipeline that is fully interlocked, so—whenever a computation result is unavailable for another operation depen­dent on it—the DSP automatically inserts one or more stall cycles as needed. Efficient programming with dependency-free instructions can eliminate most computational and memory transfer data dependencies.
In addition, the ADSP-TS201S processor supports SIMD opera­tions two ways—SIMD compute blocks and SIMD computations. The programmer can load both compute blocks with the same data (broadcast distribution) or different data (merged distribution).

DUAL COMPUTE BLOCKS

The ADSP-TS201S processor has compute blocks that can exe­cute computations either independently or together as a single­instruction, multiple-data (SIMD) engine. The DSP can issue up to two compute instructions per compute block each cycle, instructing the ALU, multiplier, shifter, or CLU to perform independent, simultaneous operations. Each compute block can execute eight 8-bit, four 16-bit, two 32-bit, or one 64-bit SIMD computations in parallel with the operation in the other block. These computation units support IEEE 32-bit single-precision floating-point, extended-precision 40-bit floating point, and 8-, 16-, 32-, and 64-bit fixed-point processing.
The compute blocks are referred to as X and Y in assembly syn­tax, and each block contains four computational units—an ALU, a multiplier, a 64-bit shifter, a 128-bit CLU—and a 32­word register file.
• Register File—each compute block has a multiported 32­word, fully orthogonal register file used for transferring data between the computation units and data buses and for
Static Superscalar is a trademark of Analog Devices, Inc.
architecture.
storing intermediate results. Instructions can access the registers in the register file individually (word-aligned), in sets of two (dual-aligned), or in sets of four (quad-aligned).
• ALU—the ALU performs a standard set of arithmetic oper­ations in both fixed- and floating-point formats. It also performs logic operations.
• Multiplier—the multiplier performs both fixed- and float­ing-point multiplication and fixed-point multiply and accumulate.
• Shifter—the 64-bit shifter performs logical and arithmetic shifts, bit and bit stream manipulation, and field deposit and extraction operations.
• Communications Logic Unit (CLU)—this 128-bit unit pro­vides trellis decoding (for example, Viterbi and Turbo decoders) and executes complex correlations for CDMA communication applications (for example, chip-rate and symbol-rate functions).
Using these features, the compute blocks can:
• Provide 8 MACS per cycle peak and 7.1 MACS per cycle sustained 16-bit performance and provide 2 MACS per cycle peak and 1.8 MACS per cycle sustained 32-bit perfor­mance (based on FIR)
• Execute six single-precision floating-point or execute 24 fixed-point (16-bit) operations per cycle, providing
3.6G FLOPS or 14.4G/s regular operations performance at 600 MHz
• Perform two complex 16-bit MACS per cycle
• Execute eight trellis butterflies in one cycle

DATA ALIGNMENT BUFFER (DAB)

The DAB is a quad-word FIFO that enables loading of quad­word data from nonaligned addresses. Normally, load instruc­tions must be aligned to their data size so that quad words are loaded from a quad-aligned address. Using the DAB signifi­cantly improves the efficiency of some applications, such as FIR filters.

DUAL INTEGER ALU (IALU)

The ADSP-TS201S processor has two IALUs that provide pow­erful address generation capabilities and perform many general­purpose integer operations. The IALUs are referred to as J and K in assembly syntax and have the following features:
• Provide memory addresses for data and update pointers
• Support circular buffering and bit-reverse addressing
• Perform general-purpose integer operations, increasing programming flexibility
• Include a 31-word register file for each IALU
As address generators, the IALUs perform immediate or indi­rect (pre- and post-modify) addressing. They perform modulus and bit-reverse operations with no constraints placed on mem­ory addresses for the modulus data buffer placement. Each IALU can specify either a single-, dual-, or quad-word access from memory.
Rev. C | Page 4 of 48 | December 2006
ADSP-TS201S
The IALUs have hardware support for circular buffers, bit reverse, and zero-overhead looping. Circular buffers facilitate efficient programming of delay lines and other data structures required in digital signal processing, and they are commonly used in digital filters and Fourier transforms. Each IALU pro­vides registers for four circular buffers, so applications can set up a total of eight circular buffers. The IALUs handle address pointer wraparound automatically, reducing overhead, increas­ing performance, and simplifying implementation. Circular buffers can start and end at any memory location.
Because the IALU’s computational pipeline is one cycle deep, in most cases integer results are available in the next cycle. Hard­ware (register dependency check) causes a stall if a result is unavailable in a given cycle.

PROGRAM SEQUENCER

The ADSP-TS201S processor’s program sequencer supports the following:
• A fully interruptible programming model with flexible pro­gramming in assembly and C/C++ languages; handles hardware interrupts with high throughput and no aborted instruction cycles
• A 10-cycle instruction pipeline—four-cycle fetch pipe and six-cycle execution pipe—computation results available two cycles after operands are available
• Supply of instruction fetch memory addresses; the sequencer’s instruction alignment buffer (IAB) caches up to five fetched instruction lines waiting to execute; the pro­gram sequencer extracts an instruction line from the IAB and distributes it to the appropriate core component for execution
• Management of program structures and program flow determined according to JUMP, CALL, RTI, RTS instruc­tions, loop structures, conditions, interrupts, and software exceptions
• Branch prediction and a 128-entry branch target buffer (BTB) to reduce branch delays for efficient execution of conditional and unconditional branch instructions and zero-overhead looping; correctly predicted branches occur with zero overhead cycles, overcoming the five-to-nine stage branch penalty
• Compact code without the requirement to align code in memory; the IAB handles alignment

Interrupt Controller

The DSP supports nested and nonnested interrupts. Each inter­rupt type has a register in the interrupt vector table. Also, each has a bit in both the interrupt latch register and the interrupt mask register. All interrupts are fixed as either level-sensitive or edge-sensitive, except the IRQ3–0 are programmable.
hardware interrupts, which
The DSP distinguishes between hardware interrupts and soft­ware exceptions, handling them differently. When a software exception occurs, the DSP aborts all other instructions in the instruction pipe. When a hardware interrupt occurs, the DSP continues to execute instructions already in the instruction pipe.

Flexible Instruction Set

The 128-bit instruction line, which can contain up to four 32-bit instructions, accommodates a variety of parallel operations for concise programming. For example, one instruction line can direct the DSP to conditionally execute a multiply, an add, and a subtract in both computation blocks while it also branches to another location in the program. Some key features of the instruction set include:
• CLU instructions for communications infrastructure to govern trellis decoding (for example, Viterbi and Turbo decoders) and despreading via complex correlations
• Algebraic assembly language syntax
• Direct support for all DSP, imaging, and video arithmetic types
• Eliminates toggling DSP hardware modes because modes are supported as options (for example, rounding, satura­tion, and others) within instructions
• Branch prediction encoded in instruction; enables zero­overhead loops
• Parallelism encoded in instruction line
• Conditional execution optional for all instructions
• User-defined partitioning between program and data memory

DSP MEMORY

The DSP’s internal and external memory is organized into a unified memory map, which defines the location (address) of all elements in the system, as shown in Figure 3.
The memory map is divided into four memory areas—host space, external memory, multiprocessor space, and internal memory—and each memory space, except host memory, is sub­divided into smaller memory spaces.
The ADSP-TS201S processor internal memory has 24M bits of on-chip DRAM memory, divided into six blocks of 4M bits (128K words × 32 bits). Each block—M0, M2, M4, M6, M8, and M10—can store program instructions, data, or both, so applica­tions can configure memory to suit specific needs. Placing program instructions and data in different memory blocks, however, enables the DSP to access data while performing an instruction fetch. Each memory segment contains a 128K bit cache to enable single cycle access to internal DRAM.
The six internal memory blocks connect to the four 128-bit wide internal buses through a crossbar connection, enabling the DSP to perform four memory transfers in the same cycle. The DSP’s internal bus architecture provides a total memory bandwidth of
Rev. C | Page 5 of 48 | December 2006
ADSP-TS201S
INTERNAL S PACE
RESERVED
SO C RE GISTE RS (URE GS)
RESERVED
INTERNAL REGISTERS (UREG S)
RESERVED
INTERNAL MEMORY BLOCK 1 0
RESERVED
INTERNAL M EMORY BLOCK 8
RESERVED
INTERNAL MEMORY BLOCK 6
RESERVED
INTERNAL MEMORY BLOCK 4
RESERVED
INTERNAL M EMORY BLOCK 2
RESERVED
INTERNAL M EMORY BLOCK 0
0x03FFFFFF
0x 00 1F0 3F F
0x001F0000
0x 001 E0 3F F
0x001E0000
0x0015FFFF
0x0 01 40 00 0
0x0011FFFF
0x0 01 00 00 0
0x000DFFFF
0x 00 0C0 000
0x0009FFFF
0x0 00 80 00 0
0x0005FFFF
0x0 00 40 00 0
0x0001FFFF
0x0 00 00 00 0
GLOBAL SPACE
HOST (MSH)
RESE RV ED
MSSD BANK 3 (MSSD3)
E C A P S
Y R O M E M L A N R E T X E
E C A P S
Y R O M E M
R O S S E C O R IP T L U M
RESE RV ED
MSSD BANK 2 (MSSD2)
RESE RV ED
MSSD BANK 1 (MSSD1)
RESE RV ED
MSSD BANK 0 (MSSD0)
BANK 1 (MS 1)
BANK 0 (MS 0)
PROC ES SOR I D 7
PROC ES SOR I D 6
PROC ES SOR I D 5
PROC ES SOR I D 4
PROC ES SOR I D 3
PROC ES SOR I D 2
PROC ES SOR I D 1
PROC ES SOR I D 0
BROADCAST
RE S ER V ED
INTER NAL MEMORY
0xFFFFFFFF
0x 80 00 00 00
0x 74 00 00 00
0x 70 00 00 00
0x 64 00 00 00
0x 60 00 00 00
0x 54 00 00 00
0x 50 00 00 00
0x4 40 00 00 0
0x4 00 00 00 0
0x 38 00 00 00
0x 300 00 00 0
0x 2C00 00 00
0x 280 00 00 0
0x 240 00 00 0
0x 200 00 00 0
0x 1C00 00 00
0x 180 00 00 0
0x 140 00 00 0
0x 100 00 00 0
0x 0C00 00 00
0x 03 FFFF F F
0x 000 00 00 0
EACH IS A COPY
OF INTERNAL SPACE
Figure 3. ADSP-TS201S Memory Map
33.6G bytes per second, enabling the core and I/O to access eight 32-bit data-words and four 32-bit instructions each cycle. The DSP’s flexible memory structure enables:
• DSP core and I/O accesses to different memory blocks in the same cycle
• DSP core access to three memory blocks in parallel—one instruction and two data accesses
• Programmable partitioning of program and data memory
• Program access of all memory as 32-, 64-, or 128-bit words—16-bit words with the DAB

EXTERNAL PORT (OFF-CHIP MEMORY/PERIPHERALS INTERFACE)

The ADSP-TS201S processor’s external port provides the DSP’s interface to off-chip memory and peripherals. The 4G word address space is included in the DSP’s unified address space.
Rev. C | Page 6 of 48 | December 2006
The separate on-chip buses—four 128-bit data buses and four 32-bit address buses—are multiplexed at the SOC interface and transferred to the external port over the SOC bus to create an external system bus transaction. The external system bus pro­vides a single 64-bit data bus and a single 32-bit address bus. The external port supports data transfer rates of 1G byte per second over the external bus.
The external bus can be configured for 32-bit or 64-bit, little­endian operations. When the system bus is configured for 64-bit operations, the lower 32 bits of the external data bus connect to even addresses, and the upper 32 bits connect to odd addresses.
The external port supports pipelined, slow, and SDRAM proto­cols. Addressing of external memory devices and memory­mapped peripherals is facilitated by on-chip decoding of high order address lines to generate memory bank select signals.
ADSP-TS201S
The ADSP-TS201S processor provides programmable memory, pipeline depth, and idle cycle for synchronous accesses; and external acknowledge controls to support interfacing to pipe­lined or slow devices, host processors, and other memory­mapped peripherals with variable access, hold, and disable time requirements.

Host Interface

The ADSP-TS201S processor provides an easy and configurable interface between its external bus and host processors through the external port (see Figure 4). To accommodate a variety of host processors, the host interface supports pipelined or slow protocols for ADSP-TS201S processor access of the host as slave or pipelined for host access of the ADSP-TS201S processor as slave. Each protocol has programmable transmission parame­ters, such as idle cycles, pipe depth, and internal wait cycles.
The host interface supports burst transactions initiated by a host processor. After the host issues the starting address of the burst and asserts the BRST internally while the host continues to assert BRST
The host interface provides a deadlock recovery mechanism that enables a host to recover from deadlock situations involving the DSP. The BOFF nism. When the host asserts BOFF current transaction and asserts HBG external bus.
The host can directly read or write the internal memory of the ADSP-TS201S processor, and it can access most of the DSP reg­isters, including DMA control (TCB) registers. Vector interrupts support efficient execution of host commands.
signal, the DSP increments the address
.
signal provides the deadlock recovery mecha-
, the DSP backs off the
and relinquishes the

Multiprocessor Interface

The ADSP-TS201S processor offers powerful features tailored to multiprocessing DSP systems through the external port and link ports (see Figure 4). This multiprocessing capability pro­vides the highest bandwidth for interprocessor communication, including:
• Up to eight DSPs on a common bus
• On-chip arbitration for glueless multiprocessing
• Link ports for point-to-point communication
The external port and link ports provide integrated, glueless multiprocessing support.
The external port supports a unified address space (see Figure 3) that enables direct interprocessor accesses of each ADSP-TS201S processor’s internal memory and registers. The DSP’s on-chip distributed bus arbitration logic provides simple, glueless connection for systems containing up to eight ADSP-TS201S processors and a host processor. Bus arbitration has a rotating priority. Bus lock supports indivisible read­modify-write sequences for semaphores. A bus fairness feature prevents one DSP from holding the external bus too long.
The DSP’s four link ports provide a second path for interproces­sor communications with throughput of 4G bytes per second. The cluster bus provides 1G byte per second throughput—with a total of 4.8G bytes per second interprocessor bandwidth (lim­ited by SOC bandwidth).

SDRAM Controller

The SDRAM controller controls the ADSP-TS201S processor’s transfers of data to and from external synchronous DRAM (SDRAM) at a throughput of 32 bits or 64 bits per SCLK cycle using the external port and SDRAM control pins.
The SDRAM interface provides a glueless interface with stan­dard SDRAMs—16M bit, 64M bit, 128M bit, 256M bit, and 512M bit. The DSP supports directly a maximum of four banks of 64M words × 32 bits of SDRAM. The SDRAM interface is mapped in external memory in each DSP’s unified memory map.

EPROM Interface

The ADSP-TS201S processor can be configured to boot from an external 8-bit EPROM at reset through the external port. An automatic process (which follows reset) loads a program from the EPROM into internal memory. This process uses 16 wait cycles for each read access. During booting, the BMS tions as the EPROM chip select signal. The EPROM boot procedure uses DMA Channel 0, which packs the bytes into 32-bit instructions. Applications can also access the EPROM (write flash memories) during normal operation through DMA.
The EPROM or flash memory interface is not mapped in the DSP’s unified memory map. It is a byte address space limited to a maximum of 16M bytes (24 address bits). The EPROM or flash memory interface can be used after boot via a DMA.
pin func-

DMA CONTROLLER

The ADSP-TS201S processor’s on-chip DMA controller, with 14 DMA channels, provides zero-overhead data transfers with­out processor intervention. The DMA controller operates independently and invisibly to the DSP’s core, enabling DMA operations to occur while the DSP’s core continues to execute program instructions.
The DMA controller performs DMA transfers between internal memory, external memory, and memory-mapped peripherals; the internal memory of other DSPs on a common bus, a host processor, or link port I/O; between external memory and exter­nal peripherals or link port I/O; and between an external bus master and internal memory or link port I/O. The DMA con­troller performs the following DMA operations:
• External port block transfers. Four dedicated bidirectional DMA channels transfer blocks of data between the DSP’s internal memory and any external memory or memory­mapped peripheral on the external bus. These transfers support master mode and handshake mode protocols.
• Link port transfers. Eight dedicated DMA channels (four transmit and four receive) transfer quad-word data only between link ports and between a link port and internal or
Rev. C | Page 7 of 48 | December 2006
ADSP-TS201S
001
LINK
DEVICES
000
RESET
CLOCK
REFERENCE
REFERENCE
LINK
DEVICES
(2 MAX)
(OPTIONAL)
ID2–0
RST_IN
CLKS/REFS
ID2–0
RST_IN
CLKS/REFS
RST_OUT POR_IN
SCLK
SCLK_V
V
REF
SCLKRAT2–0
IRQ3–0
FLAG3–0
LINK
LxDATO3–0P/N
LxCLKOUTP/N
LxACKI
LxBCMPO
LxDATI3–0P/N
LxCLKINP/N
LxACKO
LxBCMPI
TMR0E
BM
CONTROLIMP1–0
DS2–0
ADSP-TS201S #7 ADSP-TS201S #6 ADSP-TS201S #5 ADSP-TS201S #4 ADSP-TS201S #3 ADSP-TS201S #2
ADSP-TS201S #1
ADDR31–0
DATA31–0
CONTROL
LINK
ADSP-TS201S #0
ADDR31–0
DATA31–0
BUSLOCK
REF
DMAR3–0
MSSD3–0
JTAG
CONTROL
BR7–2,0
BR1
BR7–1
BR0
RD
WRL
ACK
MS1–0
BMS
CPA
DPA
BRST
BOFF
HBR HBG
MSH
IORD
IOWR
IOEN
RAS CAS
LDQM
SDWE
SDCKE
SDA10
L
S S
O R T N O C
L O R T N O C
A
E
T
R
A
D
D
D A
S S
A
E
T
R
A
D
D
D A
ADDR
DATA
OE WE
ACK
CS
CS
ADDR
DATA
ADDR
DATA
CS
SDRAM MEMORY
RAS CAS
DQM
WE
CKE
A10
ADDR
DATA
GLOBAL
MEMORY
AND
PERIPHERALS
(OPTIONAL)
BOOT
EPROM
(OPTIONAL)
CLOCK
HOST
PROCESSOR
INTERFACE (OPTIONAL)
(OPTIONAL)
CLK
Figure 4. ADSP-TS201S Shared Memory Multiprocessing System
external memory. These transfers only use handshake mode protocol. DMA priority rotates between the four receive channels.
• AutoDMA transfers. Two dedicated unidirectional DMA channels transfer data received from an external bus master to internal memory or to link port I/O. These transfers only use slave mode protocol, and an external bus master must initiate the transfer.
The DMA controller provides these additional features:
• Flyby transfers. Flyby operations only occur through the external port (DMA Channel 0) and do not involve the DSP’s core. The DMA controller acts as a conduit to trans­fer data from an I/O device to external SDRAM memory.
Rev. C | Page 8 of 48 | December 2006
During a transaction, the DSP relinquishes the external data bus; outputs addresses and memory selects (MSSD3–0 RD
); outputs the IORD, IOWR, IOEN, and
/WR strobes; and responds to ACK.
• DMA chaining. DMA chaining operations enable applica­tions to automatically link one DMA transfer sequence to another for continuous transmission. The sequences can occur over different DMA channels and have different transmission attributes.
• Two-dimensional transfers. The DMA controller can access and transfer two-dimensional memory arrays on any DMA transmit or receive channel. These transfers are implemented with index, count, and modify registers for both the X and Y dimensions.
ADSP-TS201S

LINK PORTS (LVDS)

The DSP’s four full-duplex link ports each provide additional four-bit receive and four-bit transmit I/O capability, using low voltage, differential-signal (LVDS) technology. With the ability to operate at a double data rate—latching data on both the rising and falling edges of the clock—running at up to 500 MHz, each link port can support up to 500M bytes per second per direc­tion, for a combined maximum throughput of 4G bytes per second.
The link ports provide an optional communications channel that is useful in multiprocessor systems for implementing point­to-point interprocessor communications. Applications can also use the link ports for booting.
Each link port has its own triple-buffered quad-word input and double-buffered quad-word output registers. The DSP’s core can write directly to a link port’s transmit register and read from a receive register, or the DMA controller can perform DMA transfers through eight (four transmit and four receive) dedi­cated link port DMA channels.
Each link port direction has three signals that control its opera­tion. For the transmitter, LxCLKOUT is the output transmit clock, LxACKI is the handshake input to control the data flow, and the LxBCMPO
output indicates that the block transfer is complete. For the receiver, LxCLKIN is the input receive clock, LxACKO is the handshake output to control the data flow, and the LxBCMPI
input indicates that the block transfer is com­plete. The LxDATO3–0 pins are the data output bus for the transmitter and the LxDATI3–0 pins are the input data bus for the receiver.
Applications can program separate error detection mechanisms for transmit and receive operations (applications can use the checksum mechanism to implement consecutive link port transfers), the size of data packets, and the speed at which bytes are transmitted.

TIMER AND GENERAL-PURPOSE I/O

The ADSP-TS201S processor has a timer pin (TMR0E) that generates output when a programmed timer counter has expired, and four programmable general-purpose I/O pins (FLAG3–0) that can function as either single-bit input or out­put. As outputs, these pins can signal peripheral devices; as inputs, they can provide the test for conditional branching.
After reset, the ADSP-TS201S processor has four boot options for beginning operation:
• Boot from EPROM.
• Boot by an external master (host or another ADSP-TS201S processor).
•Boot by link port.
• No boot—start running from memory address selected with one of the IRQ3–0
interrupt signals. See Table 2.
Using the “no boot” option, the ADSP-TS201S processor must start running from memory when one of the interrupts is asserted.
Table 2. No Boot, Run from Memory Addresses
Interrupt Address
IRQ0 IRQ1 IRQ2 IRQ3
0x3000 0000 (External Memory) 0x3800 0000 (External Memory) 0x8000 0000 (External Memory) 0x0000 0000 (Internal Memory)
The ADSP-TS201S processor core always exits from reset in the idle state and waits for an interrupt. Some of the interrupts in the interrupt vector table are initialized and enabled after reset.
For more information on boot options, see the EE-200:
ADSP-TS20x TigerSHARC Processor Boot Loader Kernels Oper­ation on the Analog Devices website (www.analog.com).

CLOCK DOMAINS

The DSP uses calculated ratios of the SCLK clock to operate, as shown in Figure 5. The instruction execution rate is equal to CCLK. A PLL from SCLK generates CCLK which is phase­locked. The SCLKRATx pins define the clock multiplication of SCLK to CCLK (see Table 4 on Page 12). The link port clock is generated from CCLK via a software programmable divisor, and the SOC bus operates at 1/2 CCLK. Memory transfers to exter­nal and link port buffers operate at the SOCCLK rate. SCLK also provides clock input for the external bus interface and defines the ac specification reference for the external bus signals. The external bus interface runs at the SCLK frequency. The maxi­mum SCLK frequency is one quarter the internal DSP clock (CCLK) frequency.

RESET AND BOOTING

The ADSP-TS201S processor has three levels of reset:
• Power-up reset – after power-up of the system (SCLK, all static inputs, and strap pins are stable), the RST_IN must be asserted (low).
• Normal reset – for any chip reset following the power-up reset, the RST_IN
pin must be asserted (low).
• DSP-core reset – when setting the SWRST bit in EMUCTL, the DSP core is reset, but not the external port or I/O.
For normal operations, tie the RST_OUT POR_IN
pin.
pin to the
pin
Rev. C | Page 9 of 48 | December 2006
SCLK
SCLKRATx
LCTLx REGISTER
PLL
SPD BITS,
Figure 5. Clock Domains
/CR
EXTERNAL INTERFACE
CCLK (INSTRUCTION RA TE)
SOCCLK
/2
(PERIPHERAL BUS RATE)
LxCLKOUT (LINK OUTPUT RATE)
ADSP-TS201S

POWER DOMAINS

The ADSP-TS201S processor has separate power supply con­nections for internal logic (V buffer (V
), and internal DRAM (V
DD_IO
Note that the analog (V
), analog circuits (V
DD
DD_DRAM
) supply powers the clock generator
DD_A
DD_A
) power supply.
), I/O
PLLs. To produce a stable clock, systems must provide a clean power supply to power input V attention to bypassing the V
. Designs must pay critical
DD_A
supply.
DD_A

FILTERING REFERENCE VOLTAGE AND CLOCKS

Figure 6 and Figure 7 show possible circuits for filtering V
and SCLK_V
. These circuits provide the reference voltages
REF
for the switching voltage reference and system clock reference.
V
DD_IO
R1
R2 C1 C2
V
SS
R1: 2kSERIES RESISTOR (±1%) R2: 2.55kSERIES RESISTOR (±1%) C1: 1F CAPACITO R (SMD) C2: 1nF CAPACITOR (HF SMD) PLACED CLOSE TO DSP’S PINS
Figure 6. V
CLOCK DRIVER
*
VOLTAGE OR
V
DD_IO
R1
R2 C1 C2
R1: 2kSERIES RESISTOR (±1%) R2: 2.55kSERIES RESISTOR (±1%) C1: 1F CAPACITOR ( SMD) C2: 1nF CAPACITOR (HF SMD) PLACED CLOSE TO DSP’S PINS
*
IF CLOCK DRIVER VOLTAGE > V
Figure 7. SCLK_V
Filtering Scheme
REF
V
SS
DD_IO
Filtering Scheme
REF
V
REF
SCLK_V
REF
REF
,

DEVELOPMENT TOOLS

The ADSP-TS201S processor is supported with a complete set of CROSSCORE including Analog Devices emulators and VisualDSP++ opment environment. The same emulator hardware that supports other TigerSHARC processors also fully emulates the ADSP-TS201S processor.
CROSSCORE is a registered trademark of Analog Devices, Inc.
VisualDSP++ is a registered trademark of Analog Devices, Inc.
®
software and hardware development tools,
®
devel-
The VisualDSP++ project management environment lets pro­grammers develop and debug an application. This environment includes an easy to use assembler (which is based on an alge­braic syntax), an archiver (librarian/library builder), a linker, a loader, a cycle-accurate instruction-level simulator, a C/C++ compiler, and a C/C++ run-time library that includes DSP and mathematical functions. A key point for theses tools is C/C++ code efficiency. The compiler has been developed for efficient translation of C/C++ code to DSP assembly. The DSP has archi­tectural features that improve the efficiency of compiled C/C++ code.
The VisualDSP++ debugger has a number of important features. Data visualization is enhanced by a plotting package that offers a significant level of flexibility. This graphical representation of user data enables the programmer to quickly determine the performance of an algorithm. As algorithms grow in complexity, this capability can have increasing significance on the designer’s development schedule, increasing productivity. Statistical profiling enables the programmer to nonintrusively poll the processor as it is running the program. This feature, unique to VisualDSP++, enables the software developer to passively gather important code execution metrics without interrupting the real-time characteristics of the program. Essentially, the developer can identify bottlenecks in software quickly and efficiently. By using the profiler, the programmer can focus on those areas in the program that impact performance and take corrective action.
Debugging both C/C++ and assembly programs with the VisualDSP++ debugger, programmers can:
• View mixed C/C++ and assembly code (interleaved source and object information)
• Insert breakpoints
• Set conditional breakpoints on registers, memory, and stacks
• Trace instruction execution
• Perform linear or statistical profiling of program execution
• Fill, dump, and graphically plot the contents of memory
• Perform source level debugging
• Create custom debugger windows
The VisualDSP++ IDE lets programmers define and manage DSP software development. Its dialog boxes and property pages let programmers configure and manage all of the TigerSHARC processor development tools, including the color syntax high­lighting in the VisualDSP++ editor. This capability permits programmers to:
• Control how the development tools process inputs and generate outputs
• Maintain a one-to-one correspondence with the tool’s command line switches
The VisualDSP++ Kernel (VDK) incorporates scheduling and resource management tailored specifically to address the mem­ory and timing constraints of DSP programming. These capabilities enable engineers to develop code more effectively,
Rev. C | Page 10 of 48 | December 2006
ADSP-TS201S
eliminating the need to start from the very beginning when developing new application code. The VDK features include threads, critical and unscheduled regions, semaphores, events, and device flags. The VDK also supports priority-based, pre­emptive, cooperative, and time-sliced scheduling approaches. In addition, the VDK was designed to be scalable. If the application does not use a specific feature, the support code for that feature is excluded from the target system.
Because the VDK is a library, a developer can decide whether to use it or not. The VDK is integrated into the VisualDSP++ development environment, but can also be used via standard command line tools. When the VDK is used, the development environment assists the developer with many error-prone tasks and assists in managing system resources, automating the gen­eration of various VDK-based objects, and visualizing the system state, when debugging an application that uses the VDK.
VCSE is Analog Devices’ technology for creating, using, and reusing software components (independent modules of sub­stantial functionality) to quickly and reliably assemble software applications. It also is used for downloading components from the Web, dropping them into the application, and publishing component archives from within VisualDSP++. VCSE supports component implementation in C/C++ or assembly language.
Use the expert linker to visually manipulate the placement of code and data on the embedded system, view memory use in a color-coded graphical form, easily move code and data to differ­ent areas of the DSP or external memory with a drag of the mouse, and examine runtime stack and heap usage. The expert linker is fully compatible with existing linker definition file (LDF), allowing the developer to move between the graphical and textual environments.
Analog Devices DSP emulators use the IEEE 1149.1 JTAG test access port of the ADSP-TS201S processor to monitor and con­trol the target board processor during emulation. The emulator provides full speed emulation, allowing inspection and modifi­cation of memory, registers, and processor stacks. Nonintrusive in-circuit emulation is assured by the use of the processor’s JTAG interface—the emulator does not affect target system loading or timing.
In addition to the software and hardware development tools available from Analog Devices, third parties provide a wide range of tools supporting the TigerSHARC processor family. Hardware tools include TigerSHARC processor PC plug-in cards. Third party software tools include DSP libraries, real­time operating systems, and block diagram design tools.

EVALUATION KIT

®
Analog Devices offers a range of EZ-KIT Lite forms to use as a cost-effective method to learn more about developing or prototyping applications with Analog Devices processors, platforms, and software tools. Each EZ-KIT Lite includes an evaluation board along with an evaluation suite of the VisualDSP++ development and debugging environment with the C/C++ compiler, assembler, and linker. Also included
evaluation plat-
are sample application programs, power supply, and a USB cable. All evaluation versions of the software tools are limited for use only with the EZ-KIT Lite product.
The USB controller on the EZ-KIT Lite board connects the board to the USB port of the user’s PC, enabling the VisualDSP++ evaluation suite to emulate the on-board processor in-circuit. This permits the customer to download, execute, and debug programs for the EZ-KIT Lite system. It also allows in-circuit programming of the on-board flash device to store user-specific boot code, enabling the board to run as a standalone unit, without being connected to the PC.
With a full version of VisualDSP++ installed (sold separately), engineers can develop software for the EZ-KIT Lite or any custom-defined system. Connecting one of Analog Devices JTAG emulators to the EZ-KIT Lite board enables high speed, nonintrusive emulation.

DESIGNING AN EMULATOR-COMPATIBLE DSP BOARD (TARGET)

The Analog Devices family of emulators are tools that every DSP developer needs in order to test and debug hardware and software systems. Analog Devices has supplied an IEEE 1149.1 JTAG test access port (TAP) on each JTAG DSP. The emulator uses the TAP to access the internal features of the DSP, allowing the developer to load code, set breakpoints, observe variables, observe memory, and examine registers. The DSP must be halted to send data and commands, but once an operation has been completed by the emulator, the DSP system is set running at full speed with no impact on system timing.
To use these emulators, the target board must include a header that connects the DSP’s JTAG port to the emulator.
For details on target board design issues including mechanical layout, single processor connections, multiprocessor scan chains, signal buffering, signal termination, and emulator pod logic, see the EE-68: Analog Devices JTAG Emulation Technical Reference on the Analog Devices website (www.analog.com)— use the string “EE-68” in site search. This document is updated regularly to keep pace with improvements to emulator support.

ADDITIONAL INFORMATION

This data sheet provides a general overview of the ADSP-TS201S processor’s architecture and functionality. For detailed information on the ADSP-TS201S processor’s core architecture and instruction set, see the ADSP-TS201 Tiger-
SHARC Processor Hardware Reference and the ADSP-TS201 TigerSHARC Processor Programming Reference. For detailed
information on the development tools for this processor, see the VisualDSP++ User’s Guide for TigerSHARC Processors.
EZ-Kit Lite is a registered trademark of Analog Devices, Inc.
Rev. C | Page 11 of 48 | December 2006
ADSP-TS201S

PIN FUNCTION DESCRIPTIONS

While most of the ADSP-TS201S processor’s input pins are nor­mally synchronous—tied to a specific clock—a few are asynchronous. For these asynchronous signals, an on-chip syn­chronization circuit prevents metastability problems. Use the ac specification for asynchronous signals when the system design requires predictable, cycle-by-cycle behavior for these signals.
The output pins can be three-stated during normal operation. The DSP three-states all output pins during reset, allowing these pins to get to their internal pull-up or pull-down state. Some pins have an internal pull-up or pull-down resistor (±30% toler­ance) that maintains a known value during transitions between different drivers.
Table 3. Pin Definitions—Clocks and Reset
Signal Type Term Description
SCLKRAT2–0 I (pd) na Core Clock Ratio. The DSP’s core clock (CCLK) rate = n × SCLK, where n is user-
programmable using the SCLKRATx pins to the values shown in Table 4 . These pins may change only during reset; connect these pins to V
or VSS. All reset specifica-
DD_IO
tions in Tab le 25 , Tab le 26 , and Tab le 27 must be satisfied. The core clock rate (CCLK) is the instruction cycle rate.
SCLK I na System Clock Input. The DSP’s system input clock for cluster bus. The core clock rate
is user-programmable using the SCLKRATx pins. For more information, see Clock
Domains on Page 9.
RST_IN
I/A na Reset. Sets the DSP to a known state and causes program to be in idle state. RST_IN
must be asserted a specified time according to the type of reset operation. For details,
see Reset and Booting on Page 9, Table 25 on Page 26, and Figure 13 on Page 26. RST_OUT POR_IN
O na Reset Output. Indicates that the DSP reset is complete. Connect to POR_IN. I/A na Power-On Reset for internal DRAM. Connect to RST_OUT.
I = input; A = asynchronous; O = output; OD = open-drain output; T = three-state; P = power supply; G = ground; pd = internal pull-down 5k
Ω; pu = internal pull-up 5 kΩ; pd_0 = internal pull-down 5 kΩ on DSP ID = 0; pu_0 = internal pull-up 5 kΩ on DSP ID = 0; pu_od_0 = internal
pull-up 500 Ω on DSP ID = 0; pd_m = internal pull-down 5 kΩ on DSP bus master; pu_m = internal pull-up 5 kΩ on DSP bus master; pu_ad = internal pull-up 40 k
Term (termination of unused pins) column symbols: epd = external pull-down approximately 5 k imately 5 kΩ to V
Ω. For more pull-down and pull-up information, see Electrical Characteristics on Page 22.
, nc = not connected; na = not applicable (always used); V
DD_IO
= connect directly to V
DD_IO
Ω to V
; epu = external pull-up approx-
SS
; VSS = connect directly to V
DD_IO
SS
Table 4. SCLK Ratio
SCLKRAT2–0 Ratio
000 (default) 4 001 5 010 6 011 7 100 8 101 10 110 12 111 Reserved
Rev. C | Page 12 of 48 | December 2006
ADSP-TS201S
Table 5. Pin Definitions—External Port Bus Controls
Signal Type Term Description
ADDR31–0 I/O/T
(pu_ad)
DATA63–0 I/O/T
(pu_ad)
RD
I/O/T (pu_0)
WRL
I/O/T (pu_0)
WRH
I/O/T (pu_0)
ACK I/O/T/OD
(pu_od_0)
BMS
O/T (pu_0)
MS1–0
O/T (pu_0)
MSH
O/T (pu_0)
BRST
I/O/T (pu_0)
I = input; A = asynchronous; O = output; OD = open-drain output; T = three-state; P = power supply; G = ground; pd = internal pull-down 5k
Ω; pu = internal pull-up 5 kΩ; pd_0 = internal pull-down 5 kΩ on DSP ID = 0; pu_0 = internal pull-up 5 kΩ on DSP ID = 0; pu_od_0 = internal
pull-up 500 = internal pull-up 40 k
Ω on DSP ID = 0; pd_m = internal pull-down 5 kΩ on DSP bus master; pu_m = internal pull-up 5 kΩ on DSP bus master; pu_ad
Ω. For more pull-down and pull-up information, see Electrical Characteristics on Page 22.
Term (termination of unused pins) column symbols: epd = external pull-down approximately 5 k imately 5 k
1
This external pull-up may be omitted for the ID = 000 TigerSHARC processor.
Ω to V
, nc = not connected; na = not applicable (always used); V
DD_IO
nc Address Bus. The DSP issues addresses for accessing memory and peripherals on
these pins. In a multiprocessor system, the bus master drives addresses for accessing internal memory or I/O processor registers of other ADSP-TS201S processors. The DSP inputs addresses when a host or another DSP accesses its internal memory or I/O processor registers.
nc External Data Bus. The DSP drives and receives data and instructions on these pins.
Pull-up or pull-down resistors on unused DATA pins are unnecessary.
1
epu
Memory Read. RD is asserted whenever the DSP reads from any slave in the system, excluding SDRAM. When the DSP is a slave, RD
is an input and indicates read trans­actions that access its internal memory or universal registers. In a multiprocessor system, the bus master drives RD. RD changes concurrently with ADDR pins.
1
epu
Write Low. WRL is asserted in two cases: when the ADSP-TS201S processor writes to an even address word of external memory or to another external bus agent; and when the ADSP-TS201S processor writes to a 32-bit zone (host, memory, or DSP programmed to 32-bit bus). An external master (host or DSP) asserts WRL
for writing to a DSP’s low word of internal memory. In a multiprocessor system, the bus master drives WRL
. WRL changes concurrently with ADDR pins. When the DSP is a slave, WRL is an input and indicates write transactions that access its internal memory or universal registers.
1
epu
Write High. WRH is asserted when the ADSP-TS201S processor writes a long word (64 bits) or writes to an odd address word of external memory or to another external bus agent on a 64-bit data bus. An external master (host or another DSP) must assert
for writing to a DSP’s high word of 64-bit data bus. In a multiprocessing system,
WRH the bus master drives WRH
. WRH changes concurrently with ADDR pins. When the DSP is a slave, WRH is an input and indicates write transactions that access its internal memory or universal registers.
1
epu
Acknowledge. External slave devices can deassert ACK to add wait states to external memory accesses. ACK is used by I/O devices, memory controllers, and other periph­erals on the data phase. The DSP can deassert ACK to add wait states to read and write accesses of its internal memory. The pull-up is 50 Ω on low-to-high transactions and is 500 Ω on all other transactions.
na Boot Memory Select. BMS is the chip select for boot EPROM or flash memory. During
reset, the DSP uses BMS cessor system, the DSP bus master drives BMS
as a strap pin (EBOOT) for EPROM boot mode. In a multipro-
. For details, see Reset and Booting on
Page 9 and the EBOOT signal description in Table 16 on Page 20.
nc Memory Select. MS0 or MS1 is asserted whenever the DSP accesses memory banks 0
or 1, respectively. MS1–0 with ADDR pins. When ADDR31:27 = 0b00110, MS0
are decoded memory address pins that change concurrently
is asserted. When ADDR31:27 =
0b00111, MS1 is asserted. In multiprocessor systems, the master DSP drives MS1–0.
nc Memory Select Host. MSH is asserted whenever the DSP accesses the host address
space (ADDR31 = 0b1). MSH
is a decoded memory address pin that changes concur-
rently with ADDR pins. In a multiprocessor system, the bus master DSP drives MSH
1
epu
Burst. The current bus master (DSP or host) asserts this pin to indicate that it is reading or writing data associated with consecutive addresses. A slave device can ignore addresses after the first one and increment an internal address counter after each transfer. For host-to-DSP burst accesses, the DSP increments the address automati­cally while BRST
is asserted.
DD_IO
Ω to V
= connect directly to V
; epu = external pull-up approx-
SS
; VSS = connect directly to V
DD_IO
.
SS
Rev. C | Page 13 of 48 | December 2006
ADSP-TS201S
Table 6. Pin Definitions—External Port Arbitration
Signal Type Term Description
BR7–0
I/O V
DD_IO
1
Multiprocessing Bus Request Pins. Used by the DSPs in a multiprocessor system to arbitrate for bus mastership. Each DSP drives its own BRx line (corresponding to the value of its ID2–0 inputs) and monitors all others. In systems with fewer than eight DSPs, set the unused BRx
pins high (V
DD_IO
).
ID2–0 I (pd) na Multiprocessor ID. Indicates the DSP’s ID, from which the DSP determines its order in
a multiprocessor system. These pins also indicate to the DSP which bus request (BR0
–BR7) to assert when requesting the bus: 000 = BR0, 001 = BR1, 010 = BR2,
011 = BR3
, 100 = BR4, 101 = BR5, 110 = BR6, or 111 = BR7. ID2–0 must have a
constant value during system operation and can change during reset only.
BM
O na Bus Master. The current bus master DSP asserts BM. For debugging only. At reset this
is a strap pin. For more information, see Table 16 on Page 20.
BOFF
I epu Back Off. A deadlock situation can occur when the host and a DSP try to read from
each other’s bus at the same time. When deadlock occurs, the host can assert BOFF to force the DSP to relinquish the bus before completing its outstanding transaction.
BUSLOCK O/T
(pu_0)
HBR
I epu Host Bus Request. A host must assert HBR to request con trol of the DSP’s externa l bus.
na Bus Lock Indication. Provides an indication that the current bus master has locked the
bus. At reset, this is a strap pin. For more information, see Table 16 on Page 20.
When HBR
is asserted in a multiprocessing system, the bus master relinquishes the
bus and asserts HBG once the outstanding transaction is finished.
HBG
I/O/T (pu_0)
epu
2
Host Bus Grant. Acknowledges HBR and indicates that the host can take control of the external bus. When relinquishing the bus, the master DSP three-states the ADDR31–0, DATA63–0, MSH
, MSSD3–0, MS1–0, RD, WRL, WRH, BMS, BRST, IORD, IOWR, IOEN, RAS, CAS, SDWE, SDA10, SDCKE, LDQM, and HDQM pins, and the DSP puts the SDRAM in self-refresh mode. The DSP asserts HBG
until the host deasserts HBR. In multiprocessor systems, the current bus master DSP drives HBG, and all slave DSPs monitor it.
CPA
I/O/OD (pu_od_0)
epu
2
Core Priority Access. Asserted while the DSP’s core accesses external memory. This pin enables a slave DSP to interrupt a master DSP’s background DMA transfers and gain control of the external bus for core-initiated transactions. CPA
is an open drain output, connected to all DSPs in the system. If not required in the system, leave CPA unconnected (external pull-ups will be required for DSP ID = 1 through ID = 7).
DPA
I/O/OD (pu_od_0)
epu
2
DMA Priority Access. Asserted while a high priority DSP DMA channel accesses external memory. This pin enables a high priority DMA channel on a slave DSP to interrupt transfers of a normal priority DMA channel on a master DSP and gain control of the external bus for DMA-initiated transactions. DPA connected to all DSPs in the system. If not required in the system, leave DPA
is an open drain output,
uncon-
nected (external pull-ups will be required for DSP ID = 1 through ID = 7).
I = input; A = asynchronous; O = output; OD = open-drain output; T = three-state; P = power supply; G = ground; pd = internal pull-down 5k
Ω; pu = internal pull-up 5 kΩ; pd_0 = internal pull-down 5 kΩ on DSP ID = 0; pu_0 = internal pull-up 5 kΩ on DSP ID = 0; pu_od_0 = internal
pull-up 500 = internal pull-up 40 k
Term (termination of unused pins) column symbols: epd = external pull-down approximately 5 k imately 5 k
1
The BRx pin matching the ID2–0 input selection for the processor should be left nc if unused. For example, the processor with ID = 000 has BR0 = nc and BR7–1 = V
2
This external pull-up resistor may be omitted for the ID = 000 TigerSHARC processor.
Ω on DSP ID = 0; pd_m = internal pull-down 5 kΩ on DSP bus master; pu_m = internal pull-up 5 kΩ on DSP bus master; pu_ad
Ω. For more pull-down and pull-up information, see Electrical Characteristics on Page 22.
Ω to V
; epu = external pull-up approx-
Ω to V
, nc = not connected; na = not applicable (always used); V
DD_IO
= connect directly to V
DD_IO
SS
; VSS = connect directly to V
DD_IO
DD_IO
SS
.
Rev. C | Page 14 of 48 | December 2006
ADSP-TS201S
Table 7. Pin Definitions—External Port DMA/Flyby
Signal Type Term Description
DMAR3–0
IOWR
IORD
IOEN
I = input; A = asynchronous; O = output; OD = open-drain output; T = three-state; P = power supply; G = ground; pd = internal pull-down 5kΩ; pu = internal pull-up 5 kΩ; pd_0 = internal pull- down 5 kΩ on DSP ID = 0; pu_0 = internal pull-up 5 kΩ on DSP ID = 0; pu_od_0 = internal pull-up 500
Ω on DSP ID = 0; pd_m = internal pull-down 5 kΩ on DSP bus master; pu_m = internal pull-up 5 kΩ on DSP bus master; pu_ad
= internal pull-up 40 kΩ. For more pull-down and pull-up information, see Electrical Characteristics on Page 22. Term (termination of unused pins) column symbols: epd = external pull-down approximately 5 k
imately 5 k
Ω to V
DD_IO
I/A epu DMA Request Pins. Enable external I/O devices to request DMA services from the DSP.
In response to DMARx, the DSP performs DMA transfers according to the DMA channel’s initialization. The DSP ignores DMA requests from uninitialized channels.
O/T (pu_0)
nc I/O Write. When a DSP DMA channel initiates a flyby mode read transaction, the DSP
asserts the IOWR
signal during the data cycles. This assertion makes the I/O device
sample the data instead of the TigerSHARC.
O/T (pu_0)
nc I/O Read. When a DSP DMA channel initiates a flyby mode write transaction, the DSP
asserts the IORD signal during the data cycle. This assertion with the IOEN makes the I/O device drive the data instead of the TigerSHARC.
O/T (pu_0)
nc I/O Device Output Enable. Enables the output buffers of an external I/O device for fly-
by transactions between the device and external memory. Active on flyby transactions.
Ω to V
; epu = external pull-up approx-
, nc = not connected; na = not applicable (always used); V
= connect directly to V
DD_IO
SS
; VSS = connect directly to V
DD_IO
SS
Rev. C | Page 15 of 48 | December 2006
ADSP-TS201S
Table 8. Pin Definitions—External Port SDRAM Controller
Signal Type Term Description
MSSD3–0
RAS
CAS I/O/T
LDQM O/T
HDQM O/T
SDA10 O/T
SDCKE I/O/T
SDWE I/O/T
I = input; A = asynchronous; O = output; OD = open-drain output; T = three-state; P = power supply; G = ground; pd = internal pull-down
Ω; pu = internal pull-up 5 kΩ; pd_0 = internal pull-down 5 kΩ on DSP ID = 0; pu_0 = internal pull-up 5 kΩ on DSP ID = 0; pu_od_0 = internal
5k pull-up 500
Ω on DSP ID = 0; pd_m = internal pull-down 5 kΩ on DSP bus master; pu_m = internal pull-up 5 kΩ on DSP bus master; pu_ad
= internal pull-up 40 kΩ. For more pull-down and pull-up information, see Electrical Characteristics on Page 22. Term (termination of unused pins) column symbols: epd = external pull-down approximately 5 k
imately 5 k
Ω to V
I/O/T (pu_0)
nc Memory Select SDRAM. MSSD0, MSSD1, MSSD2, or MSSD3 is asserted whenever the
DSP accesses SDRAM memory space. MSSD3–0 are decoded memory address pins that are asserted whenever the DSP issues an SDRAM command cycle (access to ADDR31:30 = 0b01—except reserved spaces shown in Figure 3 on Page 6). In a multi­processor system, the master DSP drives MSSD3–0
I/O/T (pu_0)
nc Row Address Select. When sampled low, RAS indicates that a row address is valid in
a read or write of SDRAM. In other SDRAM accesses, it defines the type of operation to execute according to SDRAM specification.
nc Column Address Select. When sampled low, CAS indicates that a column address is
(pu_0)
valid in a read or write of SDRAM. In other SDRAM accesses, it defines the type of operation to execute according to the SDRAM specification.
nc Low Word SDRAM Data Mask. When sampled high, three-states the SDRAM DQ
(pu_0)
buffers. LDQM is valid on SDRAM transactions when CAS read transactions. On write transactions, LDQM is active when accessing an odd address word on a 64-bit memory bus to disable the write of the low word.
nc High Word SDRAM Data Mask. When sampled high, three-states the SDRAM DQ
(pu_0)
buffers. HDQM is valid on SDRAM transactions when CAS is asserted, and inactive on read transactions. On write transactions, HDQM is active when accessing an even address in word accesses or when memory is configured for a 32-bit bus to disable the write of the high word.
nc SDRAM Address Bit 10. Separate A10 signals enable SDRAM refresh operation while
(pu_0)
the DSP executes non-SDRAM transactions.
nc SDRAM Clock Enable. Activates the SDRAM clock for SDRAM self-refresh or suspend (pu_m/ pd_m)
modes. A slave DSP in a multiprocessor system does not have the pull-up or pull­down. A master DSP (or ID = 0 in a single processor system) has a pull-up before granting the bus to the host, except when the SDRAM is put in self refresh mode. In self refresh mode, the master has a pull-down before granting the bus to the host.
nc SDRAM Write Enable. When sampled low while CAS is active, SDWE indicates an (pu_0)
SDRAM write access. When sampled high while CAS is active, SDWE indicates an SDRAM read access. In other SDRAM accesses, SDWE defines the type of operation to execute according to SDRAM specification.
, nc = not connected; na = not applicable (always used); V
DD_IO
= connect directly to V
DD_IO
.
is asserted, and inactive on
Ω to V
; epu = external pull-up approx-
SS
; VSS = connect directly to V
DD_IO
SS
Rev. C | Page 16 of 48 | December 2006
Table 9. Pin Definitions—JTAG Port
ADSP-TS201S
Signal Type Term Description
EMU
O/OD nc TCK I epd or epu TDI I (pu_ad) nc TDO O/T nc TMS I (pu_ad) nc TRST
I/A (pu_ad) na Test Reset (JTAG). Resets the test state machine. TRST must be asserted or pulsed low
1
1
1
1
Emulation. Connected to the DSP’s JTAG emulator target board connector only.
1
Test Clock (JTAG). Provides an asynchronous clock for JTAG scan. Test Data Input (JTAG). A serial data input of the scan path. Test Data Output (JTAG). A serial data output of the scan path. Test Mode Select (JTAG). Used to control the test state machine.
after power up for proper device operation. For more information, see Reset and
Booting on Page 9.
I = input; A = asynchronous; O = output; OD = open-drain output; T = three-state; P = power supply; G = ground; pd = internal pull-down 5kΩ; pu = internal pull-up 5 kΩ; pd_0 = internal pull- down 5 kΩ on DSP ID = 0; pu_0 = internal pull-up 5 kΩ on DSP ID = 0; pu_od_0 = internal pull-up 500 Ω on DSP ID = 0; pd_m = internal pull-down 5 kΩ on DSP bus master; pu_m = internal pull-up 5 kΩ on DSP bus master; pu_ad = internal pull-up 40 k
Term (termination of unused pins) column symbols: epd = external pull-down approximately 5 k imately 5 k
1
See the reference on Page 11 to the JTAG emulation technical reference EE-68.
Ω to V
Ω. For more pull-down and pull-up information, see Electrical Characteristics on Page 22.
, nc = not connected; na = not applicable (always used); V
DD_IO
= connect directly to V
DD_IO
Ω to V
; epu = external pull-up approx-
SS
; VSS = connect directly to V
DD_IO
Table 10. Pin Definitions—Flags, Interrupts, and Timer
Signal Type Term Description
FLAG3–0 I/O/A
(pu)
nc FLAG pins. Bidirectional input/output pins can be used as program conditions. Each pin
can be configured individually for input or for output. FLAG3–0 are inputs after power-up and reset.
IRQ3–0
I/A (pu)
nc Interrupt Request. When asser ted, the DSP generates an interrupt. Each of the IRQ3–0 pins
can be independently set for edge-triggered or level-sensitive operation. After reset, these pins are disabled unless the IRQ3–0 strap option and interrupt vectors are initialized for booting.
TMR0E O na Timer 0 expires. This output pulses whenever timer 0 expires. At reset, this is a strap pin.
For more information, see Table 16 on Page 20.
I = input; A = asynchronous; O = output; OD = open-drain output; T = three-state; P = power supply; G = ground; pd = internal pull-down 5k
Ω; pu = internal pull-up 5 kΩ; pd_0 = internal pull-down 5 kΩ on DSP ID = 0; pu_0 = internal pull-up 5 kΩ on DSP ID = 0; pu_od_0 = internal
pull-up 500 Ω on DSP ID = 0; pd_m = internal pull-down 5 kΩ on DSP bus master; pu_m = internal pull-up 5 kΩ on DSP bus master; pu_ad = internal pull-up 40 k
Term (termination of unused pins) column symbols: epd = external pull-down approximately 5 k imately 5 kΩ to V
Ω. For more pull-down and pull-up information, see Electrical Characteristics on Page 22.
, nc = not connected; na = not applicable (always used); V
DD_IO
= connect directly to V
DD_IO
Ω to V
; epu = external pull-up approx-
SS
; VSS = connect directly to V
DD_IO
SS
SS
Rev. C | Page 17 of 48 | December 2006
ADSP-TS201S
Table 11. Pin Definitions—Link Ports
Signal Type Term Description
LxDATO3–0P O nc Link Ports 3–0 Data 3–0 Transmit LVDS P LxDATO3–0N O nc Link Ports 3–0 Data 3–0 Transmit LVDS N LxCLKOUTP O nc Link Ports 3–0 Transmit Clock LVDS P LxCLKOUTN O nc Link Ports 3–0 Transmit Clock LVDS N LxACKI I (pd) nc Link Ports 3–0 Receive Acknowledge. Using this signal, the receiver indicates to the
transmitter that it may continue the transmission.
LxBCMPO
LxDATI3–0P I V LxDATI3–0N I V LxCLKINP I/A V LxCLKINN I/A V LxACKO O nc Link Ports 3–0 Transmit Acknowledge. Using this signal, the receiver indicates to the
LxBCMPI
I = input; A = asynchronous; O = output; OD = open-drain output; T = three-state; P = power supply; G = ground; pd = internal pull-down 5k
Ω; pu = internal pull-up 5 kΩ; pd_0 = internal pull-down 5 kΩ on DSP ID = 0; pu_0 = internal pull-up 5 kΩ on DSP ID = 0; pu_od_0 = internal
pull-up 500
Ω on DSP ID = 0; pd_m = internal pull-down 5 kΩ on DSP bus master; pu_m = internal pull-up 5 kΩ on DSP bus master; pu_ad
= internal pull-up 40 kΩ; pd_l = internal pull-down 50 kΩ. For more pull-down and pull-up information, see Electrical Characteristics on
Page 22.
Term (termination of unused pins) column symbols: epd = external pull-down approximately 5 k imately 5 k
Ω to V
O (pu) nc Link Ports 3–0 Block Completion. When the transmission is executed using DMA, this
signal indicates to the receiver that the transmitted block is completed. The pull-up resistor is present on L0BCMPO pins are strap pins. For more information, see Table 16 on Page 20.
DD_IO
DD_IO
DD_IO
DD_IO
Link Ports 3–0 Data 3–0 Receive LVDS P Link Ports 3–0 Data 3–0 Receive LVDS N Link Ports 3–0 Receive Clock LVDS P Link Ports 3–0 Receive Clock LVDS N
transmitter that it may continue the transmission.
I (pd_l) V
SS
Link Ports 3–0 Block Completion. When the reception is executed using DMA, this signal indicates to the receiver that the transmitted block is completed.
, nc = not connected; na = not applicable (always used); V
DD_IO
only. At reset, the L1BCMPO, L2BCMPO, and L3BCMPO
Ω to V
; epu = external pull-up approx-
= connect directly to V
DD_IO
SS
; VSS = connect directly to V
DD_IO
SS
Table 12. Pin Definitions—Impedance Control, Drive Strength Control, and Regulator Enable
Signal Type Term Description
CONTROLIMP0 CONTROLIMP1
I (pd) I (pu)
na na
Impedance Control. As shown in Tab le 13 , the CONTROLIMP1–0 pins select between normal driver mode and A/D driver mode. When using normal mode (recommended), the output drive strength is set relative to maximum drive strength according to
Tab le 14 . When using A/D mode, the resistance control operates in the analog mode,
where drive strength is continuously controlled to match a specific line impedance as shown in Tab le 14 .
DS2, 0 DS1
I (pu) I (pd)
na Digital Drive Strength Selection. Selected as shown in Tab le 14 . For drive strength calcu-
lation, see Output Drive Currents on Page 36. The drive strength for some pins is preset, not controlled by the DS2–0 pins. The pins that are always at drive strength 7 (100%) include: CPA, DPA, TDO, EMU, and RST_OUT. The drive strength for the ACK pin is always x2 drive strength 7 (100%).
ENEDREG I (pu) V
SS
Connect the ENEDREG pin to VSS. Connect the V
pins to a properly decoupled
DD_DRAM
DRAM power supply.
I = input; A = asynchronous; O = output; OD = open-drain output; T = three-state; P = power supply; G = ground; pd = internal pull-down
Ω; pu = internal pull-up 5 kΩ; pd_0 = internal pull-down 5 kΩ on DSP ID = 0; pu_0 = internal pull-up 5 kΩ on DSP ID = 0; pu_od_0 = internal
5k pull-up 500 = internal pull-up 40 k
Term (termination of unused pins) column symbols: epd = external pull-down approximately 5 k imately 5 k
Ω on DSP ID = 0; pd_m = internal pull-down 5 kΩ on DSP bus master; pu_m = internal pull-up 5 kΩ on DSP bus master; pu_ad
Ω. For more pull-down and pull-up information, see Electrical Characteristics on Page 22.
Ω to V
; epu = external pull-up approx-
Ω to V
, nc = not connected; na = not applicable (always used); V
DD_IO
= connect directly to V
DD_IO
SS
; VSS = connect directly to V
DD_IO
SS
Rev. C | Page 18 of 48 | December 2006
Table 13. Impedance Control Selection
CONTROLIMP1-0 Driver Mode
00 (recommended) Normal 01 Reserved 10 (default) A/D Mode 11 Reserved
Table 14. Drive Strength/Output Impedance Selection
ADSP-TS201S
DS2–0 Pins
Drive Strength
1
Output Impedance
2
000 Strength 0 (11.1%) 26 Ω 001 Strength 1 (23.8%) 32 Ω 010 Strength 2 (36.5%) 40 Ω 011 Strength 3 (49.2%) 50 Ω 100 Strength 4 (61.9%) 62 Ω 101 (default) Strength 5 (74.6%) 70 Ω 110 Strength 6 (87.3%) 96 Ω 111 Strength 7 (100%) 120 Ω
1
CONTROLIMP1 = 0, A/D mode disabled.
2
CONTROLIMP1 = 1, A/D mode enabled.
Table 15. Pin Definitions—Power, Ground, and Reference
Signal Type Term Description
V
DD
V
DD_A
V
DD_IO
V
DD_DRAM
V
REF
PnaV
PnaV
PnaV
PnaV
pins for internal logic.
DD
pins for analog circuits. Pay critical attention to bypassing this supply.
DD
pins for I/O buffers.
DD
pins for internal DRAM.
DD
I na Reference voltage defines the trip point for all input buffers, except SCLK, RST_IN,
POR_IN, IRQ3–0, FLAG3–0, DMAR3–0, ID2–0, CONTROLIMP1–0, LxDATO3–0P/N,
. V
LxCLKOUTP/N, LxDATI3–0P/N, LxCLKINP/N, TCK, TDI, TMS, and TRST
can be
REF
connected to a power supply or set by a voltage divider circuit as shown in Figure 6.
For more information, see Filtering Reference Voltage and Clocks on Page 10.
SCLK_V
REF
I na System Clock Reference. Connect this pin to a reference voltage as shown in Figure 7.
For more information, see Filtering Reference Voltage and Clocks on Page 10.
V
SS
GnaGround pins. NC nc No Connect. Do not connect these pins to anything (not to any supply, signal, or each
other). These pins are reserved and must be left unconnected.
I = input; A = asynchronous; O = output; OD = open-drain output; T = three-state; P = power supply; G = ground; pd = internal pull-down
Ω; pu = internal pull-up 5 kΩ; pd_0 = internal pull-down 5 kΩ on DSP ID = 0; pu_0 = internal pull-up 5 kΩ on DSP ID = 0; pu_od_0 = internal
5k pull-up 500 = internal pull-up 40 k
Term (termination of unused pins) column symbols: epd = external pull-down approximately 5 k imately 5 k
Ω on DSP ID = 0; pd_m = internal pull-down 5 kΩ on DSP bus master; pu_m = internal pull-up 5 kΩ on DSP bus master; pu_ad
Ω. For more pull-down and pull-up information, see Electrical Characteristics on Page 22.
Ω to V
; epu = external pull-up approx-
Ω to V
, nc = not connected; na = not applicable (always used); V
DD_IO
= connect directly to V
DD_IO
SS
; VSS = connect directly to V
DD_IO
SS
Rev. C | Page 19 of 48 | December 2006
ADSP-TS201S

STRAP PIN FUNCTION DESCRIPTIONS

Some pins have alternate functions at reset. Strap options set DSP operating modes. During reset, the DSP samples the strap option pins. Strap pins have an internal pull-up or pull-down for the default value. If a strap pin is not connected to an over­driving external pull-up, pull-down, or logic load, the DSP samples the default value during reset. If strap pins are
connected to logic inputs, a stronger external pull-up or pull­down may be required to ensure default value depending on leakage and/or low level input current of the logic load. To set a mode other than the default mode, connect the strap pin to a sufficiently stronger external pull-up or pull-down. Table 16 lists and describes each of the DSP’s strap pins.
Table 16. Pin Definitions—I/O Strap Pins
Type (at
Signal
EBOOT I
IRQEN I
LINK_DWIDTH I
SYS_REG_WE I
TM1 I
TM2 I
TM3 I
I = input; A = asynchronous; O = output; OD = open-drain output; T = three-state; P = power supply; G = ground; pd = internal pull-down 5k
Ω; pu = internal pull-up 5 kΩ; pd_0 = internal pull-down 5 kΩ on DSP ID = 0; pu_0 = internal pull-up 5 kΩ on DSP ID = 0; pu_od_0 = internal
pull-up 500 = internal pull-up 40 kΩ. For more pull-down and pull-up information, see Electrical Characteristics on Page 22.
Ω on DSP ID = 0; pd_m = internal pull-down 5 kΩ on DSP bus master; pu_m = internal pull-up 5 kΩ on DSP bus master; pu_ad
Reset) On Pin … Description
BMS
(pd_0)
BM Interrupt Enable.
(pd)
TMR0E Link Port Input Default Data Width.
(pd)
BUSLOCK
(pd_0)
L1BCMPO
(pu)
L2BCMPO Test Mode 2. Do not overdrive default value during reset.
(pu)
L3BCMPO
(pu)
EPROM Boot.
0 = boot from EPROM immediately after reset (default) 1 = idle after reset and wait for an external device to boot DSP
through the external port or a link port
0 = disable and set IRQ3–0 interrupts to edge-sensitive after
reset (default)
1 = enable and set IRQ3–0
immediately after reset
0 = 1-bit (default) 1 = 4-bit
SYSCON and SDRCON Write Enable.
0 = one-time writable after reset (default) 1 = always writable
Test Mode 1. Do not overdrive default value during reset.
Test Mode 3. Do not overdrive default value during reset.
interrupts to level-sensitive
When default configuration is used, no external resistor is needed on the strap pins. To apply other configurations, a 500 Ω resistor connected to V external pull-downs, do not strap these pins directly to V
is required. If providing
DD_IO
SS
; the
strap pins require 500 Ω resistor straps.
All strap pins are sampled on the rising edge of RST_IN
(deas­sertion edge). Each pin latches the strapped pin state (state of the strap pin at the rising edge of RST_IN sertion of RST_IN
, these pins are reconfigured to their normal
). Shortly after deas-
functionality.
These strap pins have an internal pull-down resistor, pull-up resistor, or no-resistor (three-state) on each pin. The resistor type, which is connected to the I/O pad, depends on whether RST_IN
is active (low) or if RST_IN is deasserted (high).
Table 17 shows the resistors that are enabled during active reset
and during normal operation.
Rev. C | Page 20 of 48 | December 2006
Table 17. Strap Pin Internal Resistors—Active Reset (RST_IN
Pin RST_IN = 0 RST_IN = 1
BMS BM TMR0E (pd) Driven BUSLOCK L1BCMPO L2BCMPO L3BCMPO
pd = internal pull-down 5 k pd_0 = internal pull-down 5 k pu_0 = internal pull-up 5 k
= 0) vs. Normal Operation (RST_IN = 1)
(pd_0) (pu_0) (pd) Driven
(pd_0) (pu_0) (pu) Driven (pu) Driven (pu) Driven
Ω; pu = internal pull-up 5 kΩ;
Ω on DSP ID = 0;
Ω on DSP ID = 0
ADSP-TS201S—SPECIFICATIONS
Note that component specifications are subject to change with­out notice. For information on link port electrical characteristics, see Link Port Low Voltage, Differential-Signal
(LVDS) Electrical Characteristics, and Timing on Page 30.

OPERATING CONDITIONS

Parameter Description Test Conditions Grade
ADSP-TS201S
1
Min Typ Max Unit
V
DD
Internal Supply Voltage @ CCLK = 600 MHz 060 1.14 1.20 1.26 V
@ CCLK = 500 MHz 050 1.00 1.05 1.10 V
V
DD_A
Analog Supply Voltage @ CCLK = 600 MHz 060 1.14 1.20 1.26 V
@ CCLK = 500 MHz 050 1.00 1.05 1.10 V
V
DD_IO
V
DD_DRAM
I/O Supply Voltage (all) 2.38 2.50 2.63 V
Internal DRAM Supply Voltage @ CCLK = 600 MHz 060 1.52 1.60 1.68 V
@ CCLK = 500 MHz 050 1.425 1.500 1.575 V
T
CASE
T
CASE
V
IH1
V
IH2
V
IL
I
DD
I
DD_A
I
DD_IO
I
DD_DRAM
V
REF
SCLK_V
1
Specifications vary for different grades (for example, SABP-060, SABP-050, SWBP-050). For more information on part grades, see Ordering Guide on Page 46.
2
V
specification applies to input and bidirectional pins: SCLKRAT2–0, SCLK, ADDR31–0, DATA63–0, RD, WRL, WRH, ACK, BRST, BR7–0, BOFF, HBR, HBG, MSSD3–0,
IH1
RAS, CAS, SDCKE, SDWE, TCK, FLAG3–0, DS2–0, ENEDREG.
3
Values represent dc case. During transitions, the inputs may overshoot or undershoot to the voltage shown in Table 18, based on the transient duty cycle. The dc case is equivalent
to 100% duty cycle.
4
V
specification applies to input and bidirectional pins: TDI, TMS, TRST, CIMP1–0, ID2–0, LxBCMPI, LxACKI, POR_IN, RST_IN, IRQ3–0, CPA, DPA, DMAR3–0.
IH2
5
Applies to input and bidirectional pins.
6
For details on internal and external power calculation issues, including other operating conditions, see the EE-170, Estimating Power for the ADSP-TS201S on the Analog Devices
website.
Case Operating Temperature A –40 +85 °C
Case Operating Temperature W –40 +105 °C
High Level Input Voltage2,
High Level Input Voltage3,
Low Level Input Voltage3,
VDD Supply Current, Typical Activity
V
Supply Current, Typical Activity @ CCLK = 600 MHz, VDD = 1.20 V, T
DD_A
V
Supply Current, Typical Activity6@ SCLK = 62.5 MHz, V
DD_IO
V
Supply Current, Typical Activity6@ CCLK = 600 MHz, V
DD_DRAM
Voltage Reference (all) (V
Voltage Reference (all) (V
REF
3
4
5
@ VDD, V
@ VDD, V
@ VDD, V
6
@ CCLK = 600 MHz, VDD = 1.20 V, T
= Max (all) 1.7 3.63 V
DD_IO
= Max (all) 1.9 3.63 V
DD_IO
= Min (all) –0.33 +0.8 V
DD_IO
@ CCLK = 500 MHz, V
@ CCLK = 500 MHz, V
@ CCLK = 500 MHz, V
= 1.05 V, T
DD
= 1.05 V, T
DD
= 2.5 V, T
DD_IO
DD_DRAM
DD_DRAM
CASE
CASE
CASE
CASE
= 1.6 V, T
= 1.5 V, T
= 25°C 060 2.90 A
= 25°C 050 2.06 A
= 25°C 060 25 55 mA
= 25°C 050 20 50 mA
= 25°C (all) 0.15 A
CASE
= 25°C 060 0.28 0.43 A
CASE
= 25°C 050 0.25 0.40 A
CASE
×0.56)±5% V
DD_IO
× 0.56) ±5% V
CLOCK_DRIVE
Rev. C | Page 21 of 48 | December 2006
ADSP-TS201S
Table 18. Maximum Duty Cycle for Input Transient Voltage
Maximum Duty
2
Cycle
VIN Max (V)
1
VIN Min (V)
1
+3.63 –0.33 100% +3.64 –0.34 90% +3.70 –0.40 50% +3.78 –0.48 30% +3.86 –0.56 17% +3.93 –0.63 10%
1
The individual values cannot be combined for analysis of a single instance of
overshoot or undershoot. The worst case observed value must fall within one of the voltages specified and the total duration of the overshoot or undershoot (exceeding the 100% case) must be less than or equal to the corresponding duty cycle.
2
Duty cycle refers to the percentage of time the signal exceeds the value for the
100% case. This is equivalent to the measured duration of a single instance of overshoot or undershoot as a percentage of the period of occurrence. The practical worst case for period of occurrence for either overshoot or undershoot is 2 × t
SCLK
.

ELECTRICAL CHARACTERISTICS

Parameter Description Test Conditions Min Max Unit
V
OH
V
OL
High Level Input Current @V
I
IH
I
IH_PU
I
IH_PD
I
IH_PD_L
I
Low Level Input Current @V
IL
I
IL_PU
I
IL_PU_AD
I
OZH
I
OZH_PD
Three-State Leakage Current Low @V
I
OZL
I
OZL_PU
I
OZL_PU_AD
I
OZL_OD
C
IN
High Level Output Voltage
Low Level Output Voltage
High Level Input Current @V
High Level Input Current @V
High Level Input Current @V
Low Level Input Current @V
Low Level Input Current @V
Three-State Leakage Current High @V
Three-State Leakage Current High @V
Three-State Leakage Current Low @V
Three-State Leakage Current Low @V
Three-State Leakage Current Low @V
Input Capacitance
2, 3
Parameter name suffix conventions: no suffix = applies to pins without pull-up or pull-down resistors, _PD = applies to pin types (pd) or (pd_0), _PU = applies to pin types (pu) or (pu_0), _PU_AD = applies to pin types (pu_ad), _OD = applies to pin types OD, _PD_L = applies to pin types (pd_l)
1
Applies to output and bidirectional pins.
2
Applies to all signals.
3
Guaranteed but not tested.
1
1
@V
=Min, IOH = –2 mA 2.18 V
DD_IO
@V
=Min, IOL=4 mA 0.4 V
DD_IO
=Max, VIN=VIH Max 20 μA
DD_IO
=Max, VIN=VIH Max 20 μA
DD_IO
=Max, VIN=V
DD_IO
=Max, VIN=VIH Max 307A
DD_IO
=Max, VIN=0 V 20 μA
DD_IO
=Max, VIN=0 V 0.3 0.76 mA
DD_IO
=Max, VIN= 0 V 30 100 μA
DD_IO
=Max, VIN=VIH Max 50 μA
DD_IO
=Max, VIN=V
DD_IO
=Max, VIN=0 V 20 μA
DD_IO
=Max, VIN=0 V 0.3 0.76 mA
DD_IO
=Max, VIN= 0 V 30 100 μA
DD_IO
=Max, VIN =0 V 4 7.6 mA
DD_IO
@fIN=1 MHz, T
CASE
Max 0.3 0.76 mA
DD_IO
Max 0.3 0.76 mA
DD_IO
=25°C, VIN=2.5 V 3 pF
Rev. C | Page 22 of 48 | December 2006
ADSP-TS201S

PACKAGE INFORMATION

The information presented in Figure 8 provide details about the package branding for the ADSP-TS201S processors. For a com­plete listing of product availability, see Ordering Guide on
Page 46.
a
ADSP-TS20xS
tppZ-ccc
LLLLLLLLL-L 2.0
yyww country_of_origin
T
Figure 8. Typical Package Brand
Table 19. Package Brand Information
Brand Key Field Description
t Temperature Range pp Package Type Z Lead Free Option (optional) ccc See Ordering Guide LLLLLLLLL-L Silicon Lot Number R.R Silicon Revision yyww Date Code vvvvvv Assembly Lot Code
vvvvv

ABSOLUTE MAXIMUM RATINGS

Stresses greater than those listed below may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specifica­tion is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Table 20. Absolute Maximum Ratings
Parameter Rating
Internal (Core) Supply Voltage (V Analog (PLL) Supply Voltage (V External (I/O) Supply Voltage (V External (DRAM) Supply Voltage (V Input Voltage
1
Output Voltage Swing –0.5 V to V Storage Temperature Range –65°C to +150°C
1
Applies to 10% transient duty cycle. For other duty cycles see Table 18.
)–0.3 V to +1.4 V
DD
)–0.3 V to +1.4 V
DD_A
)–0.3 V to +3.5 V
DD_IO
)–0.3 V to +2.1 V
DD_DRAM
–0.63 V to +3.93 V
+0.5 V
DD_IO

ESD SENSITIVITY

ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be take to avoid performance degradation or loss of functionality.
Rev. C | Page 23 of 48 | December 2006
ADSP-TS201S

TIMING SPECIFICATIONS

With the exception of DMAR3–0, IRQ3–0, TMR0E, and FLAG3–0 (input only) pins, all ac timing for the ADSP-TS201S processor is relative to a reference clock edge. Because input setup/hold, output valid/hold, and output enable/disable times are relative to a clock edge, the timing data for the ADSP­TS201S processor has few calculated (formula-based) values. For information on ac timing, see General AC Timing. For information on link port transfer timing, see Link Port Low
Voltage, Differential-Signal (LVDS) Electrical Characteristics, and Timing on Page 30.

General AC Timing

Timing is measured on signals when they cross the 1.25 V level as described in Figure 15 on Page 29. All delays (in nanosec­onds) are measured between the point that the first signal reaches 1.25 V and the point that the second signal reaches
1.25 V.
Table 21. AC Asynchronous Signal Specifications
Name Description Pulse Width Low (Min) Pulse Width High (Min)
1
IRQ3–0 DMAR3–0 FLAG3–0 TMR0E
1
These input pins have Schmitt triggers and therefore do not need to be synchronized to a clock reference.
2
For output specifications on FLAG3–0 pins, see Table 29.
3
This pin is a strap option. During reset, an internal resistor pulls the pin low.
1
2
3
Interrupt Request 2× t DMA Request 2 × t FLAG3–0 Input 2 × t Timer 0 Expired 4×t
The general ac timing data appears in Table 22 and Table 29. All ac specifications are measured with the load specified in
Figure 36 on Page 38, and with the output drive strength set to
strength 4. In order to calculate the output valid and hold times for different load conditions and/or output drive strengths, refer to Figure 37 on Page 38 through Figure 44 on Page 39 (Rise and Fall Time vs. Load Capacitance) and Figure 45 on Page 39 (Out­put Valid vs. Load Capacitance and Drive Strength).
The ac asynchronous timing data for the IRQ3–0
, DMAR3–0,
FLAG3–0, and TMR0E pins appears in Table 21.
ns 2 × t
SCLK
ns 2 × t
SCLK
ns 2× t
SCLK
ns
SCLK
SCLK
SCLK
SCLK
ns ns
ns
Table 22. Reference Clocks—Core Clock (CCLK) Cycle Time
Grade = 060 (600 MHz) Grade = 050 (500 MHz)
Parameter Description
1
t
CCLK
1
CCLK is the internal processor clock or instruction cycle time. The period of this clock is equal to the system clock period (t
(SCLKRAT2–0). For information on available part numbers for different internal processor clock rates, see the Ordering Guide on Page 46.
Core Clock Cycle Time 1.67 12.5 2.0 12.5 ns
) divided by the system clock ratio
SCLK
t
CCLK
CCLK
Figure 9. Reference Clocks—Core Clock (CCLK) Cycle Time
UnitMin Max Min Max
Rev. C | Page 24 of 48 | December 2006
Table 23. Reference Clocks—System Clock (SCLK) Cycle Time
SCLKRAT = 4×, 6×, 8×, 10×, 12× SCLKRAT = 5×, 7×
Parameter Description
1, 2, 3
t
SCLK
t
SCLKH
t
SCLKL
t
SCLKF
t
SCLKR
5, 6
t
SCLKJ
1
For more information, see Table 3 on Page 12.
2
For more information, see Clock Domains on Page 9.
3
The value of (t
4
System clock transition times apply to minimum SCLK cycle time (t
5
Actual input jitter should be combined with ac specifications for accurate timing analysis.
6
Jitter specification is maximum peak-to-peak time interval error (TIE) jitter.
System Clock Cycle Time 8 50 8 50 ns System Clock Cycle High Time 0.40 × t System Clock Cycle Low Time 0.40 × t System Clock Transition Time—Falling Edge
4
—1.5—1.5ns System Clock Transition Time—Rising Edge 1.5 1.5 ns System Clock Jitter Tolerance 500 500 ps
/ SCLKRAT2-0) must not violate the specification for t
SCLK
t
SCLKH
SCLK
t
SCLK
SCLK
CCLK
) only.
t
SCLKL
.
SCLK
SCLK
0.60 × t
0.60 × t
t
SCLKJ
SCLK
SCLK
0.45 × t
0.45 × t
t
SCLKF
ADSP-TS201S
0.55 × t
SCLK
0.55 × t
SCLK
t
SCLKR
SCLK
SCLK
UnitMin Max Min Max
ns ns
Figure 10. Reference Clocks—System Clock (SCLK) Cycle Time
Table 24. Reference Clocks—JTAG Test Clock (TCK) Cycle Time
Parameter Description Min Max Unit
t
TCK
t
TCKH
t
TCKL
Test Clock (JTAG) Cycle Time Greater of 30 or t
× 4 — ns
CCLK
Test Clock (JTAG) Cycle High Time 12 ns Test Clock (JTAG) Cycle Low Time 12 ns
t
TCK
TCK
t
TCKH
Figure 11. Reference Clocks—JTAG Test Clock (TCK) Cycle Time
t
TCKL
Rev. C | Page 25 of 48 | December 2006
ADSP-TS201S
Table 25. Power-Up Timing
1
Parameter Min Max Unit
Timing Requirement
t
VDD_DRAM
1
For information about power supply sequencing and monitoring solutions, please visit www.analog.com/sequencing.
V
DD_A
V
DD_IO
V
DD_DRAM
V
DD_DRAM
V
DD
Stable After VDD, V
t
DD_A
VDD_DRAM
, V
Stable >0 ms
DD_IO
Figure 12. Power-Up Timing
Table 26. Power-Up Reset Timing
Parameter Min Max Unit
Timing Requirements
t
RST_IN_PWR
RST_IN Deasserted After VDD, V
DD_A
, V
DD_IO
, V
DD_DRAM
, SCLK, and Static/
Strap Pins Stable 2 ms
t
TRST_IN_PWR
1
TRST Asserted During Power-Up Reset 100 × t
SCLK
ns
Switching Characteristic
t
RST_OUT_PWR
1
Applies after VDD, V
RST_OUT Deasserted After RST_IN Deasserted 1.5 ms
, V
DD_A
DD_IO
, V
, and SCLK are stable and before RST_IN deasserted.
DD_DRAM
RST_IN
RST_OUT
TRST
SCLK, V
DD,VDD_A,
V
DD_IO,VDD_DRAM
STATIC/STRAP PINS
t
RST_IN_PWR
t
TRST_IN_PWR
t
RST_OUT_PWR
Figure 13. Power-Up Reset Timing
Rev. C | Page 26 of 48 | December 2006
ADSP-TS201S
Table 27. Normal Reset Timing
Parameter Min Max Unit
Timing Requirements
t
RST_IN
t
STRAP
Switching Characteristic
t
RST_OUT
RST_IN Asserted 2 ms
RST_IN Deasserted After Strap Pins Stable 1.5 ms
RST_OUT Deasserted After RST_IN Deasserted 1.5 ms
t
RST_IN
RST_IN
t
RST_OUT
RST_OUT
t
STRAP
STRAP PINS
Figure 14. Normal Reset Timing
Table 28. On-Chip DRAM Refresh
1
Parameter Min Max Unit
Timing Requirement
t
REF
1
For more information on setting the refresh rate for the on-chip DRAM, refer to the ADSP-TS201 TigerSHARC Processor Programming Reference.
On-chip DRAM Refresh Period 1.56 μs
Rev. C | Page 27 of 48 | December 2006
ADSP-TS201S
Table 29. AC Signal Specifications
(All values in this table are in nanoseconds.)
Name Description
Input Setup
(Min)
Input Hold
(Min)
Output Valid
(Max)
Output Hold
(Min)
Output Enable
(Min)1Output Disable
(Max)1Reference
Clock
ADDR31–0 External Address Bus 1.5 0.5 4.0 1.0 1.15 2.0 SCLK DATA63–0 External Data Bus 1.5 0.5 4.0 1.0 1.15 2.0 SCLK MSH MSSD3–0 MS1–0 RD WRL WRH
Memory Select HOST Line 4.0 1.0 1.15 2.0 SCLK Memory Select SDRAM Lines 1.5 0.5 4.0 1.0 1.0 2.0 SCLK Memory Select for Static Blocks 4.0 1.0 1.15 2.0 SCLK Memory Read 1.5 0.5 4.0 1.0 1.15 2.0 SCLK Write Low Word 1.5 0.5 4.0 1.0 1.15 2.0 SCLK Write High Word 1.5 0.5 4.0 1.0 1.15 2.0 SCLK
ACK Acknowledge for Data High to Low 1.5 0.5 3.6 1.0 1.15 2.0 SCLK
Acknowledge for Data Low to High 1.5 0.5 4.2 0.9 1.15 2.0 SCLK SDCKE SDRAM Clock Enable 1.5 0.5 4.0 1.0 1.15 2.0 SCLK RAS CAS SDWE
Row Address Select 1.5 0.5 4.0 1.0 1.15 2.0 SCLK
Column Address Select 1.5 0.5 4.0 1.0 1.15 2.0 SCLK
SDRAM Write Enable 1.5 0.5 4.0 1.0 1.15 2.0 SCLK LDQM Low Word SDRAM Data Mask 4.0 1.0 1.15 2.0 SCLK HDQM High Word SDRAM Data Mask 4.0 1.0 1.15 2.0 SCLK SDA10 SDRAM ADDR10 4.0 1.0 1.15 2.0 SCLK HBR HBG BOFF BUSLOCK BRST BR7–0 BM IORD IOWR IOEN CPA
Host Bus Request 1.5 0.5 SCLK
Host Bus Grant 1.5 0.5 4.0 1.0 1.15 2.0 SCLK
Back Off Request 1.5 0.5 SCLK
Bus Lock 4.0 1.0 1.15 2.0 SCLK
Burst Pin 1.5 0.5 4.0 1.0 1.15 2.0 SCLK
Multiprocessing Bus Request Pins 1.5 0.5 4.0 1.0 SCLK
Bus Master Debug Aid Only 4.0 1.0 SCLK
I/O Read Pin 4.0 1.0 1.0 2.0 SCLK
I/O Write Pin 4.0 1.0 1.15 2.0 SCLK
I/O Enable Pin 4.0 1.0 1.15 2.0 SCLK
Core Priority Access High to Low 1.5 0.5 4.0 1.0 0.75 2.0 SCLK
Core Priority Access Low to High 1.5 0.5 29.5 2.0 0.75 2.0 SCLK DPA
DMA Priority Access High to Low 1.5 0.5 4.0 1.0 0.75 2.0 SCLK
DMA Priority Access Low to High 1.5 0.5 29.5 2.0 0.75 2.0 SCLK BMS FLAG3–0 RST_IN
2
3, 4
Boot Memory Select 4.0 1.0 1.15 2.0 SCLK
FLAG Pins 4.0 1.0 1.15 2.0 SCLK
Global Reset Pin 1.5 2.5 SCLK
5
TMS Test Mode Select (JTAG) 1.50.5————TCK TDI Test Data Input (JTAG) 1.50.5————TCK TDO Test Data Output (JTAG) 4.0 1.0 0.75 2.0 TCK
4
TRST3,
7
EMU
8
ID2–0 CONTROLIMP1–0
8
Test Reset (JTAG) 1.50.5————TCK
Emulation High to Low 5.5 2.0 1.15 4.0 TCK or SCLK
Static PinsMust Be Constant ———————
Static PinsMust Be Constant ———————
6
Rev. C | Page 28 of 48 | December 2006
Table 29. AC Signal Specifications (Continued)
(All values in this table are in nanoseconds.)
ADSP-TS201S
1
Name Description
8
DS2–0 SCLKRAT2–0
8
Static Pins—Must Be Constant
Static Pins—Must Be Constant — ENEDREG Static Pins—Must Be Connected to V STRAP SYS JTAG SYS
1
The external port protocols employ bus IDLE cycles for bus mastership transitions as well as slave access boundary crossings to avoid any potential bus contention. The
apparent driver overlap, due to output disables being larger than output enables, is not actual.
2
For input specifications on FLAG3–0 pins, see Table 21.
3
These input pins are asynchronous and therefore do not need to be synchronized to a clock reference.
4
For additional requirement details, see Reset and Booting on Page 9.
5
RST_IN clock reference is the falling edge of SCLK.
6
TDO output clock reference is the falling edge of TCK.
7
Reference clock depends on function.
8
These pins may change only during reset; recommend connecting it to V
9
STRAP pins include: BMS, BM, BUSLOCK, TMR0E, L1BCMPO, L2BCMPO, and L3BCMPO.
10
Specifications applicable during reset only.
11
JTAG system pins include: RST_IN, RST_OUT, POR_IN, IRQ3–0, DMAR3–0, HBR, BOFF, MS1–0, MSH, SDCKE, LDQM, HDQM, BMS, IOWR, IORD, BM, EMU, SDA10,
9, 10
11, 12
Strap Pins 1.50.5————SCLK
JTAG System Pins +2.5 +10.0 +12.0 –1.0 TCK
DD_IO/VSS
Input Setup
(Min)
Input Hold
(Min)
Output Valid
(Max)
Output Hold
(Min)
Output Enable
(Min)1Output Disable
———————
SS
(Max)
.
Reference
Clock
IOEN, BUSLOCK, TMR0E, DATA63–0, ADDR31–0, RD, WRL, WRH, BRST, MSSD3–0, RAS, CAS, SDWE, HBG, BR7–0, FLAG3–0, L0DATOP3–0, L0DATON3–0, L1DATOP3–0, L1DATON3–0, L2DATOP3–0, L2DATON3–0, L3DATOP3–0, L3DATON3–0, L0CLKOUTP, L0CLKOUTN, L1CLKOUTP, L1CLKOUTN, L2CLKOUTP, L2CLKOUTN, L3CLKOUTP, L3CLKOUTN, L0ACKI, L1ACKI, L2ACKI, L3ACKI, L0DATIP3–0, L0DATIN3–0, L1DATIP3–0, L1DATIN3–0, L2DATIP3–0, L2DATIN3–0, L3DATIP3–0, L3DATIN3–0, L0CLKINP, L0CLKINN, L1CLKINP, L1CLKINN, L2CLKINP, L2CLKINN, L3CLKINP, L3CLKINN, L0ACKO, L1ACKO, L2ACKO, L3ACKO, ACK, CPA, DPA, L0BCMPO, L1BCMPO, L2BCMPO, L3BCMPO, L0BCMPI, L1BCMPI, L2BCMPI, L3BCMPI, ID2–0, CTRL_IMPD1–0, SCLKRAT2–0, DS2–0, ENEDREG.
12
JTAG system output timing clock reference is the falling edge of TCK.
REFERENCE
CLOCK
t
OR t
SCLK
1.25V
TCK
INPUT
SIGNAL
OUTPUT SIGNAL
THREE-
STATE
INPUT
SETUP
OUTPUT
VALID
OUTPUT
DISABLE
1.25V
1.25V
Figure 15. General AC Parameters Timing
Rev. C | Page 29 of 48 | December 2006
INPUT HOLD
OUTPUT
HOLD
OUTPUT ENABLE
ADSP-TS201S

Link Port Low Voltage, Differential-Signal (LVDS) Electrical Characteristics, and Timing

Table 30 and Table 31 with Figure 16 provide the electrical
characteristics for the LVDS link ports. The LVDS link port sig­nal definitions represent all differential signals with a V level and use signal naming without N (negative) and P (posi­tive) suffixes (see Figure 17).
Table 30. Link Port LVDS Transmit Electrical Characteristics
Parameter Description Test Conditions Min Max Unit
V
OH
V
OL
|V
| Output Differential Voltage RL = 100 Ω 300 650 mV
OD
I
OS
V
OCM
Output Voltage High, V Output Voltage Low, V
O_P
O_P
or V
or V
O_N
O_N
Short-Circuit Output Current V
Common-Mode Output Voltage 1.20 1.50 V
Table 31. Link Port LVDS Receive Electrical Characteristics
Parameter Description Test Conditions Min Max Unit
| Differential Input Voltage t
|V
ID
V
ICM
Common-Mode Input Voltage 0.6 1.57 V
OD
=0V
RL = 100 Ω 1.85 V RL = 100 Ω 0.92 V
or V
O_P
V
OD
LDIS/tLDIH
t
LDIS/tLDIH
t
LDIS/tLDIH
t
LDIS/tLDIH
= 0 V +5/– 55 mA
O_N
= 0 V ±10 mA
0.20 ns 0.25 ns 0.30 ns 0.35 ns
250 217 206 195
850 850 850 850
mV mV mV mV
V
O_P
R
L
V
O_N
VOD=(V
V
OCM
Figure 16. Link Ports—Transmit Electrical Characteristics
DIFFERENTI AL P AIR WAVEFORMS
Lx <P IN >P
Lx<PIN>N
DIFFE RENTIAL VOLTAG E WAVEFORM
Lx<PIN>
V
=0V
OD
VOD=V
V
O_N
V
O_P
O_P–VO_N
Figure 17. Link Ports—Signals Definition
O_P–VO_N
(V
O_P+VO_N
=
)
)
2
Rev. C | Page 30 of 48 | December 2006
ADSP-TS201S
Link Port—Data Out Timing
Table 32 with Figure 18, Figure 19, Figure 20, Figure 21, Figure 22, and Figure 23 provide the data out timing for the
LVDS link ports.
Table 32. Link Port—Data Out Timing
Parameter Description Min Max Unit
Outputs
t
REO
t
FEO
t
LCLK OP
t
LCLK OH
t
LCLK OL
t
COJT
t
LDOS
t
LDOH
t
LACKID
t
BCMPOV
t
BCMPOH
Inputs
t
LACKIS
t
LACKIH
1
Timing is relative to the 0 differential voltage (VOD = 0).
2
LCR (link port clock ratio) = 1, 1.5, 2, or 4. t
3
For the cases of t
4
LCR= 1.
5
LCR= 1.5.
6
LCR= 2.
7
LCR= 4.
8
The t
LDOS
9
TSW is a short-word transmission period. For a 4-bit link, it is 2 × LCR × t
Rising Edge (Figure 19)350ps Falling Edge (Figure 19)350ps LxCLKOUT Period (Figure 18) Greater of 2.0 or
0.9 × LCR × t LxCLKOUT High (Figure 18)0.4× t LxCLKOUT Low (Figure 18)0.4× t
LCLK OP
LCLK OP
1, 2, 3
CCLK
1
1
LxCLKOUT Jitter (Figure 18) ±1504, 5,
LxDATO Output Setup (Figure 20)0.25 × LCR × t
0.25 × LCR × t
0.25 × LCR × t LxDATO Output Hold (Figure 20)0.25 × LCR × t
0.25 × LCR × t
0.25 × LCR × t
CCLK
CCLK
CCLK
CCLK
CCLK
CCLK
–0.10 × t –0.15 × t –0.30 × t
–0.10 × t –0.15 × t –0.30 × t
CCLK
CCLK
CCLK
CCLK
CCLK
CCLK
1, 4, 8
1,
5, 6,
1,
7,
1, 4, 8
1, 5, 6, 8
1, 7, 8
Delay from LxACKI rising edge to first transmission
Smaller of 12.5 or
1.1 × LCR × t
0.6 × t
0.6 × t
±250
8
8
16 × LCR × t
LCLK OP
LCLK OP
7
1, 2, 3
CCLK
1
1
6
ns ns ns ps
ps
ns ns ns
ns ns ns
1, 2
CCLK
ns
clock edge (Figure 21) LxBCMPO Valid (Figure 21)2× LCR × t LxBCMPO Hold (Figure 22)3× TSW – 0.5
1, 9
CCLK
1, 2
ns ns
LxACKI low setup to guarantee that the transmitter stops transmitting (Figure 22) LxACKI high setup to guarantee that the transmitter continues its transmission without any interruption (Figure 23)16× LCR × t
CCLK
1, 2
ns
LxACKI High Hold Time (Figure 23)0.51 ns
is the core period.
= 2.0 ns and t
LCLKOP
and t
values include LCLKOUT jitter.
LDOH
CCLK
= 12.5 ns, the effect of t
LCLKOP
specification on output period must be considered.
COJT
. For a 1-bit link, it is 8 × LCR × t
CCLK
CCLK
ns.
Rev. C | Page 31 of 48 | December 2006
ADSP-TS201S
t
LCLKOP
VOD=0V
LxCLKOUT
t
COJT
t
LCLKOH
t
LCLKOL
Figure 18. Link Ports—Output Clock
V
+|V
-
O_P
C
t
REO
L_P
C
L_N
t
FEO
R
MIN
OD|
=0V
V
OD
V
MIN
|
OD|
C
L
V
L
O_N
RL=100
=0.1pF
C
L
C
=5pF
L_P
=5pF
C
L_N
Figure 19. Link Ports—Differential Output Signals Transition Time
LxCLKOUT
=0V
V
OD
t
LDOStLDOHtLDOStLDOH
LxDATO
VOD=0V
Figure 20. Link Ports—Data Output Setup and Hold
1
These parameters are valid for both clock edges.
1
LxCLKOUT
V
=0V
OD
LxDATO
VOD=0V
LxACKI
LxBCMPO
t
LACK ID
t
BCMPOV
Figure 21. Link Ports—Transmission Start
Rev. C | Page 32 of 48 | December 2006
LxCLKOUT
V
=0V
OD
LxDATO
VOD=0V
ADSP-TS201S
FIRST EDGE OF 5TH SHORT WORD IN A QUAD WORD
LASTEDGEINAQUADWORD
LxACKI
LxBCMPO
LxCLKOUT
V
=0V
OD
t
LACKIS
t
BCMPOH
Figure 22. Link Ports—Transmission End and Stops
LAST EDGE IN A QUAD WORD
t
LACKIH
LxDATO
VOD=0V
LxACKI
t
LACKIS
Figure 23. Link Ports—Back to Back Transmission
Rev. C | Page 33 of 48 | December 2006
t
LACKIH
ADSP-TS201S
Link Port—Data In Timing
Table 33 with Figure 24 and Figure 25 provide the data in
timing for the LVDS link ports.
Table 33. Link Port—Data In Timing
Parameter Description Min Max Unit
Inputs
t
LCLKI P
t
LDIS
t
LDIH
t
BCMPIS
t
BCMPIH
1
Timing is relative to the 0 differential voltage (VOD = 0).
2
|VID| = 250 mV
3
|VID| = 217 mV
4
|VID| = 206 mV
5
|VID| = 195 mV
LxCLKIN Period (Figure 25)Greater of 1.8
or 0.9 × t
LxDATI Input Setup (Figure 25)0.20
1, 2
0.251,
0.301,
0.351,
0.25
0.30
0.35
1, 2
1, 3
1, 4
1, 5
LxDATI Input Hold (Figure 25)0.20
LxBCMPI Setup (Figure 24)2×t LxBCMPI Hold (Figure 24)2×t
3
4
5
LCLK IP
LCLK IP
CCLK
1
1
1
12.5 ns ns
ns ns ns
ns ns ns ns
ns ns
LxCLKIN
V
=0V
OD
LxDATI
VOD=0V
LxBCMPI
FIRST EDGE IN FIFTH SHORT WORD IN A QUAD WORD
t
BCMPIS
Figure 24. Link Ports—Last Received Quad Word
t
BCMPIH
Rev. C | Page 34 of 48 | December 2006
LxCLKIN
=0V
V
OD
LxDATI
VOD=0V
t
LCLKIP
t
LDIStLDIHtLDIStLDIH
ADSP-TS201S
Figure 25. Link Ports—Data Input Setup and Hold
1
These parameters are valid for both clock edges.
1
Rev. C | Page 35 of 48 | December 2006
ADSP-TS201S

OUTPUT DRIVE CURRENTS

Figure 26 through Figure 33 show typical I–V characteristics for
the output drivers of the ADSP-TS201S processor. The curves in these diagrams represent the current drive capability of the out­put drivers as a function of output voltage over the range of drive strengths. Typical drive currents for intermediate temper­atures (such as 85°C) should be obtained from the curves using linear interpolation. For complete output driver characteristics, refer to the DSP’s IBIS models, available on the Analog Devices website (www.analog.com).
15.0
) A m
( T N
E R R U C
N
I P
T U P T
–10.0
U O
–12.5
–15.0
12.5
10.0
7.5
5.0
2.5
–2.5
–5.0
–7.5
I
OL
V
= 2.38V, +105°C
DD_IO
0
V
=2.38V,+105°C
DD_IO
02.80.4 0.8 1.2 1.6 2.0 2.4
Figure 26. Typical Drive Currents at Strength 0
30
5
V
0
DD_IO
V
DD_IO
02.80.4
I
OL
= 2.38V, +105°C
= 2.38V, +105°C
25
20
)
15
A m
(
10
T N E R R U C
–5
N
I P
–10
T U P
–15
T U O
–20
–25
–30
Figure 27. Typical Drive Currents at Strength 1
STRENGTH 0
V
=2.5V,+25°C
DD_IO
V
=2.5V,+25°C
DD_IO
OUTPUT PIN VOLTAGE (V)
STRENGTH 1
V
=2.5V,+25°C
DD_IO
V
=2.5V,+25°C
DD_IO
1.2 1.6 2.0 2.4
0.8 OUTPUT PIN VOLTAGE (V)
V
V
DD_IO
DD_IO
V
DD_IO
V
DD_IO
= 2.63V, –40°C
=2.63V,–40°C
I
OH
= 2.63V, –40°C
= 2.63V, –40°C
I
OH
STRENGTH 2
V
= 2.5V, +25°C
DD_IO
= 2.38V, +105°C
V
= 2.5V, +25°C
DD_IO
1.2 1.6 2.0 2.4
0.8 OUTPUT PIN VOLTAGE (V)
V
DD_IO
) A m
( T N
E R R U C
N
I P
T U P T U O
45
36
27
18
9
0
–9
–18
–27
–36
–45
02.80.4
V
DD_IO
I
OL
V
DD_IO
= 2.38V, +105°C
Figure 28. Typical Drive Currents at Strength 2
55
44
33
) A m
22
( T
N E
11
R R U C
IN P
–11
T U P T
–22
U O
–33
–44
–55
I
OL
V
V
DD_IO
DD_IO
= 2.38V, +105°C
= 2.38V, +105°C
0
02.80.4 0.8 1.2 1.6 2.0 2.4
STRENGTH 3
V
=2.5V,+25°C
DD_IO
V
=2.5V, +25°C
DD_IO
OUTPUT PIN VOLTAGE (V)
Figure 29. Typical Drive Currents at Strength 3
70
60
50
40
) A
30
m
(
20
T N E
10
R R U C
–10
N
I P
–20
T U
–30
P T U
–40
O
–50
–60
–70
I
OL
V
V
DD_IO
DD_IO
= 2.38V, +105°C
=2.38V,+105°C
0
02.80.4 0.8 1.2 1.6 2.0 2.4
STRENGTH 4
V
=2.5V,+25°C
DD_IO
V
=2.5V,+25°C
DD_IO
OUTPUT PIN VOLTAGE (V)
V
DD_IO
= 2.63V, –40°C
V
DD_IO
V
DD_IO
V
DD_IO
V
DD_IO
= 2.63V, –40°C
I
OH
= 2.63V, –40°C
= 2.63V, –40°C
I
OH
= 2.63V, –40°C
=2.63V,–40°C
I
OH
Rev. C | Page 36 of 48 | December 2006
Figure 30. Typical Drive Currents at Strength 4
ADSP-TS201S
88 77
66
55
)
44
A m
33
( T
22
N E
11
R R U C
–11
IN P
–22
T U
–33
P T
–44
U O
–55
–66
–77
–88
I
OL
V
V
DD_IO
DD_IO
= 2.38V, +105°C
= 2.38V, +105°C
0
02.80.4 0.8 1.2 1.6 2.0 2.4
STRENGTH 5
V
=2.5V,+25°C
DD_IO
V
=2.5V,+25°C
DD_IO
OUTPUT PIN VOLTAGE (V)
Figure 31. Typical Drive Currents at Strength 5
100
) A m
( T
N E R R U C
N
I P
T U P T U O
–10 –20 –30 –40 –50 –60 –70 –80 –90
–100
90 80 70 60 50 40 30 20 10
I
OL
V
V
DD_IO
DD_IO
=2.38V,+105°C
0
02.80.4 0.8 1.2 1.6 2.0 2.4
STRENGTH 6
V
=2.5V,+25°C
DD_IO
= 2.38V, +105°C
V
=2.5V,+25°C
DD_IO
OUTPUT PIN VOLTAGE (V)
Figure 32. Typical Drive Currents at Strength 6
110
) A m
( T
N E R R U C
IN P
T U P T U O
100
–10 –20 –30 –40 –50 –60 –70 –80
–90 –100 –110
90 80 70 60 50 40 30 20 10
I
OL
V
V
DD_IO
DD_IO
= 2.38V, +105°C
= 2.38V, +105°C
0
02.80.4 0.8 1.2 1.6 2.0 2.4
STRENGTH 7
V
=2.5V,+25°C
DD_IO
V
=2.5V, +25°C
DD_IO
OUTPUT PIN VOLTAGE (V)
V
V
V
DD_IO
V
DD_IO
DD_IO
V
DD_IO
V
DD_IO
DD_IO
=2.63V,–40°C
= 2.63V, –40°C
I
OH
=2.63V,–40°C
= 2.63V, –40°C
I
OH
= 2.63V, –40°C
=2.63V,–40°C
I
OH

TEST CONDITIONS

The ac signal specifications (timing parameters) appear in
Table 29 on Page 28. These include output disable time, output
enable time, and capacitive loading. The timing specifications for the DSP apply for the voltage reference levels in Figure 34.
INPUT
OR
OUTPUT
Figure 34. Voltage Reference Levels for AC Measurements (Except Output Enable/Disable)

Output Disable Time

Output pins are considered to be disabled when they stop driv­ing, go into a high impedance state, and start to decay from their output high or low voltage. The time for the voltage on the bus to decay by ΔV is dependent on the capacitive load, C load current, I lowing equation:
The output disable time t t
MEASURED_DIS
t
MEASURED_DIS
switches to when the output voltage decays ΔV from the mea­sured output high or output low voltage. t with test loads C
REFERENCE
V
OH (MEASURED)
V
OL (MEASURED)
1.25V 1.25V
. This decay time can be approximated by the fol-
L
and t
t
DECAY
as shown in Figure 35. The time
DECAY
CLVΔ()I
=
L
is the difference between
DIS
is the interval from when the reference signal
is calculated
DECAY
t
MEASURED_ENA
t
ENA
V
+ V
t
RAMP
OUTPUT STARTS
1.65V
0.85V
SIGNAL
and IL, and with ΔV equal to 0.4 V.
L
t
MEASURED_DIS
t
DIS
V
OH (MEASURED)
V
OL (MEASURED)
t
DECAY
OUTPUT STOPS
DRIVING
HIGH IMPEDANCE STATE.
TEST CONDITIONS CAUSE THIS
VOLTAGE TO BE A PPROXIMATELY 1.25V.
Figure 35. Output Enable/Disable
and the
L
DRIVING
Figure 33. Typical Drive Currents at Strength 7
Rev. C | Page 37 of 48 | December 2006
ADSP-TS201S

Output Enable Time

Output pins are considered to be enabled when they have made a transition from a high impedance state to when they start driv­ing. The time for the voltage on the bus to ramp by ΔV is dependent on the capacitive load, C
, and the drive current, ID.
L
This ramp time can be approximated by the following equation:
t
RAMP
The output enable time t t
MEASURED_ENA
t
MEASURED_ENA
and t
RAMP
is the interval from when the reference signal
as shown in Figure 35. The time
CLVΔ()I
=
D
is the difference between
ENA
switches to when the output voltage ramps ΔV from the mea­sured three-stated output level. t
, drive current ID, and with ΔV equal to 0.4 V.
C
L
is calculated with test load
RAMP

Capacitive Loading

Output valid and hold are based on standard capacitive loads: 30 pF on all pins (see Figure 36). The delay and hold specifica­tions given should be derated by a drive strength related factor for loads other than the nominal value of 30 pF. Figure 37 through Figure 44 show how output rise time varies with capac­itance. Figure 45 graphically shows how output valid varies with load capacitance. (Note that this graph or derating does not apply to output disable delays; see Output Disable Time on
Page 37.) The graphs of Figure 37 through Figure 45 may not be
linear outside the ranges shown.
30pF
STRENGTH 0
(V
=2.5V)
DD_IO
RISE TIME
50
1.25V
DD_IO
=2.5V)
TO
OUTPUT
PIN
Figure 36. Equivalent Device Loading for AC Measurements (Includes All Fixtures)
25
) s n
(
20
S E M
I T
L L A F
D N A
E S
I R
FALL TIM E
15
Y = 0.251x + 4.2245
10
5
0
0
10 20 30 40 50 60 70 80 90 100
Y = 0.259x + 3.0842
LOAD CAPACITANCE (pF)
Figure 37. Typical Output Rise and Fall Time (10% to 90%, V vs. Load Capacitance at Strength 0
STRENGTH 1
=2.5V)
(V
25
) s n
( S
E
20
M
I T
L L A
15
F D
N A
E
10
S
I R
5
0
0 102030405060708090100
Y = 0.1527x + 0.7485
DD_IO
FALL TIME
RISE TI ME
Y = 0.1501
LOAD CAPACITANCE (pF)
x
+0.05
Figure 38. Typical Output Rise and Fall Time (10% to 90%, V vs. Load Capacitance at Strength 1
STREN GTH 2
=2.5V)
(V
25
) s n
( S
20
E M
I T
L L A
15
F D
N A
E
10
S
I R
5
0
0102030405060708090100
DD_IO
FALL TIM E
Y = 0.0949x + 0.8112
RISE TIME
Y = 0.0861
LOAD CAPACITAN CE (pF)
x
+ 0.4712
Figure 39. Typical Output Rise and Fall Time (10% to 90%, V vs. Load Capacitance at Strength 2
STRENGTH 3
=2.5V)
(V
25
) s n
( S
20
E M
I T
L L A
15
F D
N A
E
10
S
I R
5
0
0 102030405060708090100
DD_IO
FALL TIME
Y = 0.0691x + 1.1158
Y=0.06
LOAD CAPACITANCE (pF)
RISE TIME
x
+1.1362
Figure 40. Typical Output Rise and Fall Time (10% to 90%, V vs. Load Capacitance at Strength 3
DD_IO
DD_IO
DD_IO
=2.5V)
=2.5V)
=2.5V)
Rev. C | Page 38 of 48 | December 2006
ADSP-TS201S
STRENG TH 4
=2.5V
(V
25
) s n
( S
20
E M
I T
L L
15
A F
D N A
E
10
IS R
5
0
0
10 20 30 40 50 60 70 80 90 100
DD_IO
FALL TIME
Y = 0.0592x + 1.0629
LOAD CAPACITANCE (pF)
)
RISE TIME
Y = 0.0573x + 0.9789
Figure 41. Typical Output Rise and Fall Time (10% to 90%, V vs. Load Capacitance at Strength 4
STRENGTH 5
=2.5V)
(V
25
) s n
(
20
S E M
I T
L L
15
A F
D N A
10
E S
I R
5
0
0
10 20 30 40 50 60 70 80 90 100
DD_IO
FALL TIME
Y = 0.0493x + 0.8389
LOAD CAPACITANCE (pF)
RISE TIME
Y = 0.0481
x
DD_IO
+0.7889
=2.5V)
STRENGTH 7
(V
=2.5V)
25
) s n
( S
20
E M
I T
L L
15
A F
D N A
10
E S
I R
5
0
0
FALL TIME
Y = 0.0313x + 0.818
10 20 30 40 50 60 70 80 90 100
DD_IO
LOAD CAPACITANCE (pF)
RISE TIME
Y = 0.0321
x
Figure 44. Typical Output Rise and Fall Time (10% to 90%, V vs. Load Capacitance at Strength 7
15
) s n
(
10
D
I L A V
T U P T U O
5
0
0 102030405060708090100
STRENGTH 0–7
=2.5V)
(V
DD_IO
LOAD CAPACITANCE (pF)
+0.6512
DD_IO
=2.5V)
0
1
2
3
4
5
6
7
Figure 42. Typical Output Rise and Fall Time (10% to 90%, V vs. Load Capacitance at Strength 5
STREN GTH 6
(V
=2.5V)
25
) s n
( S
20
E M
I T
L L
15
A F
D N A
E
10
S
I R
5
0
0
FALL TIME
Y = 0.0374x + 0.851
10 20 30 40 50 60 70 80 90 100
DD_IO
LOAD CAPACITANCE (pF)
RISE TIME
Y = 0.0377
x
Figure 43. Typical Output Rise and Fall Time (10% to 90%, V vs. Load Capacitance at Strength 6
Rev. C | Page 39 of 48 | December 2006
DD_IO
+0.7449
DD_IO
=2.5V)
=2.5V)
Figure 45. Typical Output Valid (V Case Temperature and Strength 0 to 7
1
The line equations for the output valid vs. load capacitance are:
= 2.5 V) vs. Load Capacitance at Max
DD_IO
1
Strength 0: y = 0.1255x + 2.7873 Strength 1: y = 0.0764x + 1.0492 Strength 2: y = 0.0474x + 1.0806 Strength 3: y = 0.0345x + 1.2329 Strength 4: y = 0.0296x + 1.2064 Strength 5: y = 0.0246x + 1.0944 Strength 6: y = 0.0187x + 1.1005 Strength 7: y = 0.0156x + 1.084
ADSP-TS201S

ENVIRONMENTAL CONDITIONS

The ADSP-TS201S processor is rated for performance under T
environmental conditions specified in the Operating Con-
CASE
ditions on Page 21.

Thermal Characteristics

The ADSP-TS201S processor is packaged in a 25 mm × 25 mm, thermally enhanced ball grid array (BGA_ED). The ADSP-TS201S processor is specified for a case temperature (T
). To ensure that the T
CASE
exceeded, a heat sink and/or an air flow source may be required.
Table 34 shows the thermal characteristics of the 25 mm ×
25 mm BGA_ED package. All parameters are based on a JESD51-9 four-layer 2s2p board. All data are based on 3 W power dissipation.
Table 34. Thermal Characteristics for 25 mm × 25 mm Package
Parameter Condition Typical Unit
1
θ
JA
Airflow = 0 m/s 12.9 Airflow = 1 m/s 10.2 °C/W Airflow = 2 m/s 9.0 °C/W Airflow = 3 m/s 8.0 °C/W
3
θ
JB
4
θ
JC
1
θJA measured per JEDEC standard JESD51-6.
2
θJA = 12.9°C/W for 0 m/s is for vertically mounted boards. For horizontally
mounted boards, use 17.0°C/W for 0 m/s.
3
θJB measured per JEDEC standard JESD51-9.
4
θJC measured by cold plate test method (no approved JEDEC standard).
—7.7°C/W —0.7°C/W
data sheet specification is not
CASE
2
°C/W
Rev. C | Page 40 of 48 | December 2006

576-BALL BGA_ED PIN CONFIGURATIONS

Figure 46 shows a summary of pin configurations for the
576-ball BGA_ED package and Table 35 lists the signal-to-ball assignments.
ADSP-TS201S
AA
AB
AC
AD
8624 2224
57
31
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
9
1210
11
13
1614
20
18
191721 2315
KEY:
SIGNAL
V
DD
V
DD_IO
V
DD_DRAM
V
DD_A
V
REF
V
SS
NO CO NNEC T
TOP VIEW
Figure 46. 576-Ball BGA_ED Pin Configurations1 (Top View, Summary)
1
For a more detailed pin summary diagram, see the EE-179: ADSP-TS201S System Design Guidelines on the Analog Devices website (www.analog.com).
Rev. C | Page 41 of 48 | December 2006
ADSP-TS201S
Table 35. 576-Ball (25 mm × 25 mm) BGA_ED Ball Assignments
Ball No. Signal Name Ball No. Signal Name Ball No. Signal Name Ball No. Signal Name
A1 V
SS
A2 DATA51 B2 V A3 V
SS
A4 DATA49 B4 DATA50 C4 DATA52 D4 V A5 DATA43 B5 DATA44 C5 DATA47 D5 DATA48 A6 DATA41 B6 DATA42 C6 DATA45 D6 DATA46 A7 DATA37 B7 DATA38 C7 DATA39 D7 DATA40 A8 DATA33 B8 DATA34 C8 DATA35 D8 DATA36 A9 DATA29 B9 DATA30 C9 DATA31 D9 DATA32 A10 DATA25 B10 DATA26 C10 DATA27 D10 DATA28 A11 DATA23 B11 DATA24 C11 DATA21 D11 DATA22 A12 DATA19 B12 DATA20 C12 DATA17 D12 DATA18 A13 DATA15 B13 DATA16 C13 V A14 DATA11 B14 DATA12 C14 DATA13 D14 DATA14 A15 DATA9 B15 DATA10 C15 DATA7 D15 DATA8 A16 DATA5 B16 DATA6 C16 DATA3 D16 DATA4 A17 DATA1 B17 DATA2 C17 ACK D17 DATA0 A18 WRL A19 ADDR30 B19 ADDR31 C19 ADDR26 D19 ADDR27 A20 ADDR28 B20 ADDR29 C20 ADDR24 D20 ADDR25 A21 ADDR22 B21 ADDR23 C21 ADDR20 D21 V A22 V
SS
A23 ADDR21 B23 V A24 V
SS
E1 DATA61 F1 DATA63 G1 MSSD1 H1 V E2 DATA62 F2 MS1 G2 V E3 DATA57 F3 DATA59 G3 MS0 H3 MSSD3 E4 DATA58 F4 DATA60 G4 BMS H4 SCLKRAT0 E5 V E6 V E7 V E8 V E9 V E10 V E11 V E12 V E13 V E14 V E15 V E16 V E17 V E18 V E19 V E20 V
SS
DD_IO
SS
DD_IO
SS
DD_IO
DD_IO
DD_IO
DD_IO
DD_IO
DD_IO
SS
DD_IO
SS
DD_IO
SS
E21 ADDR15 F21 ADDR13 G21 ADDR7 H21 ADDR3 E22 ADDR14 F22 ADDR12 G22 ADDR6 H22 ADDR2 E23 ADDR11 F23 ADDR9 G23 ADDR5 H23 ADDR1 E24 ADDR10 F24 ADDR8 G24 ADDR4 H24 ADDR0
B1 DATA53 C1 V
C2 V C3 V
B3 V
SS
SS
SS
SS
SS
SS
D1 DATA55 D2 DATA56 D3 DATA54
SS
D13 V
SS
B18 WRH C18 RD D18 BRST
SS
B22 V
SS
SS
B24 ADDR18 C24 V
F5 V F6 V F7 V F8 V F9 V F10 V F11 V F12 V F13 V F14 V F15 V F16 V F17 V F18 V F19 V F20 V
DD_IO
DD
DD
DD
DD
DD
DD_DRAM
DD_DRAM
DD
DD
DD_DRAM
DD_DRAM
DD
DD
DD
DD_IO
C22 V C23 V
G5 V G6 V G7 V G8 V G9 V G10 V G11 V G12 V G13 V G14 V G15 V G16 V G17 V G18 V G19 V G20 V
SS
DD_IO
DD_IO
SS
SS
DD
DD
DD
DD
DD
DD_DRAM
DD_DRAM
DD
DD
DD_DRAM
DD_DRAM
DD
DD
DD
DD_IO
D22 ADDR19 D23 ADDR17 D24 ADDR16
SS
H2 MSH
H5 V H6 V H7 V H8 V H9 V H10 V H11 V H12 V H13 V H14 V H15 V H16 V H17 V H18 V H19 V H20 V
DD_IO
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
DD
DD
DD_IO
Rev. C | Page 42 of 48 | December 2006
ADSP-TS201S
Table 35. 576-Ball (25 mm × 25 mm) BGA_ED Ball Assignments (Continued)
Ball No. Signal Name Ball No. Signal Name Ball No. Signal Name Ball No. Signal Name
J1 RAS K1 SDA10 L1 SDWE M1 BR3 J2 CAS K2 SDCKE L2 BR0 M2 SCLKRAT1 J3 V J4 V J5 V J6 V J7 V J8 V J9 V J10 V J11 V J12 V J13 V J14 V J15 V J16 V J17 V J18 V J19 V J20 V
SS
REF
SS
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
DD
DD
SS
J21 L0ACKO K21 L0DATI1_N L21 L0DATI3_N M21 V J22 L0BCMPI K22 L0DATI1_P L22 L0DATI3_P M22 V J23 L0DATI0_N K23 L0CLKINN L23 L0DATI2_N M23 L0DATO3_N J24 L0DATI0_P K24 L0CLKINP L24 L0DATI2_P M24 L0DATO3_P N1 ID0 P1 SCLK R1 V N2 V N3 V N4 V N5 V N6 V N7 V N8 V N9 V N10 V N11 V N12 V N13 V N14 V N15 V N16 V N17 V N18 V N19 V N20 V
SS
DD_A
DD_A
DD_IO
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
DD
DD
DD_IO
N21 L0DATO2_N P21 L0DATO1_N R21 NC T21 L1DATI0_N N22 L0DATO2_P P22 L0DATO1_P R22 V N23 L0CLKON P23 L0DATO0_N R23 L0BCMPO N24 L0CLKOP P24 L0DATO0_P R24 L0ACKI T24 L1BCMPI
K3 LDQM L3 BR1 M3 BR5 K4 HDQM L4 BR2 M4 BR6 K5 V K6 V K7 V K8 V K9 V K10 V K11 V K12 V K13 V K14 V K15 V K16 V K17 V K18 V K19 V K20 V
DD_IO
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
DD_DRAM
DD_DRAM
DD_IO
P2 SCLK_VREF R2 NC (SCLK) P3 V
SS
L5 V L6 V L7 V L8 V L9 V L10 V L11 V L12 V L13 V L14 V L15 V L16 V L17 V L18 V L19 V L20 V
DD_IO
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
DD_DRAM
DD_DRAM
DD_IO
SS
1
R3 NC (SCLK_VREF)
M5 V M6 V M7 V M8 V M9 V M10 V M11 V M12 V M13 V M14 V M15 V M16 V M17 V M18 V M19 V M20 V
DD_IO
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
DD
DD
DD_IO
SS
SS
T1 RST_IN T2 SCLKRAT2
1
T3 BR4 P4 BM R4 BR7 T4 DS0 P5 V P6 V P7 V P8 V P9 V P10 V P11 V P12 V P13 V P14 V P15 V P16 V P17 V P18 V P19 V P20 V
DD_IO
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
DD_DRAM
DD_DRAM
DD_IO
R5 V R6 V R7 V R8 V R9 V R10 V R11 V R12 V R13 V R14 V R15 V R16 V R17 V R18 V R19 V R20 V
DD_IO
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
DD_DRAM
DD_DRAM
DD_IO
SS
T5 V
T6 V
T7 V
T8 V
T9 V
T10 V
T11 V
T12 V
T13 V
T14 V
T15 V
T16 V
T17 V
T18 V
T19 V
T20 V
SS
DD
DD
SS
SS
SS
SS
SS
SS
SS
SS
SS
SS
DD
DD
SS
T22 L1DATI0_P
T23 L1ACKO
Rev. C | Page 43 of 48 | December 2006
ADSP-TS201S
Table 35. 576-Ball (25 mm × 25 mm) BGA_ED Ball Assignments (Continued)
Ball No. Signal Name Ball No. Signal Name Ball No. Signal Name Ball No. Signal Name
U1 MSSD0 V1 MSSD2 W1 CONTROLIMP0 Y1 EMU U2 RST_OUT V2 DS2 W2 ENEDREG Y2 TCK U3 ID2 V3 POR_IN W3 TDI Y3 TMR0E U4 DS1 V4 CONTROLIMP1 W4 TDO Y4 FLAG3 U5 V U6 V U7 V U8 V U9 V U10 V U11 V U12 V U13 V U14 V U15 V U16 V U17 V U18 V U19 V U20 V
DD_IO
DD
DD
SS
SS
DD
DD_DRAM
SS
SS
SS
SS
SS
SS
DD
DD
DD_IO
U21 L1CLKINN V21 L1DATI3_N W21 L1CLKON Y21 L1DATO1_N U22 L1CLKINP V22 L1DATI3_P W22 L1CLKOP Y22 L1DATO1_P U2 3 L 1D ATI 1_ N V2 3 L1 DAT I2 _ N W 23 L1 DAT O3 _N Y 23 L 1D ATO 2_ N U2 4 L 1D ATI 1_ P V2 4 L1 DAT I2 _P W 24 L 1D ATO 3_ P Y2 4 L 1D ATO2 _ P AA1 FLAG2 AB1 V AA2 FLAG1 AB2 V AA3 IRQ3 AB3 V AA4 V
SS
AA5 IRQ0 AB5 IRQ2 AC5 IOWR AD5 IORD AA6 IOEN AB6 IRQ1 AC6 DMAR2 AD6 DMAR3 AA7 DMAR0 AB7 DMAR1 AC7 CPA AD7 DPA AA8 HBR AB8 HBG AC8 BOFF AD8 BUSLOCK AA9 L3BCMPO AB9 L3ACKI AC9 L3DATO0_N AD9 L3DATO0_P AA10 L3DATO1_N AB10 L3DATO1_P AC10 L3CLKON AD10 L3CLKOP AA11 L3DATO3_N AB11 L3DATO3_P AC11 L3DATO2_N AD11 L3DATO2_P AA12 V
SS
AA13 L3DATI2_N AB13 L3DATI2_P AC13 L3CLKINN AD13 L3CLKINP AA14 L3DATI1_N AB14 L3DATI1_P AC14 L3DATI0_N AD14 L3DATI0_P AA15 NC AB15 V AA16 L2DATO0_N AB16 L2DATO0_P AC16 L2BCMPO AD16 L2ACKI AA17 L2CLKON AB17 L2CLKOP AC17 L2DATO1_N AD17 L2DATO1_P AA18 L2DATO3_N AB18 L2DATO3_P AC18 L2DATO2_N AD18 L2DATO2_P AA19 L2CLKINN AB19 L2CLKINP AC19 L2DATI3_N AD19 L2DATI3_P AA20 L2DATI1_N AB20 L2DATI1_P AC20 L2DATI2_N AD20 L2DATI2_P AA21 V
SS
AA22 L1BCMPO AA23 L1DATO0_N AB23 V AA24 L1DATO0_P AB24 V
1
On revision 1.x silicon, the R2 and R3 balls are NC. On revision 0.x silicon, the R2 ball is SCLK, and the R3 ball is SCLK_V
on revision 0.x silicon, see the EE-179: ADSP-TS20x TigerSHARC System Design Guidelines on the Analog Devices website (www.analog.com).
V5 V V6 V V7 V V8 V V9 V V10 V V11 V V12 V V13 V V14 V V15 V V16 V V17 V V18 V V19 V V20 V
SS
DD
DD
DD
DD
DD
DD_DRAM
DD_DRAM
DD
DD
DD_DRAM
DD_DRAM
DD
DD
DD
DD_IO
SS
SS
SS
W5 V W6 V W7 V W8 V W9 V W10 V W11 V W12 V W13 V W14 V W15 V W16 V W17 V W18 V W19 V W20 V
DD_IO
DD
DD
DD
DD
DD
DD_DRAM
DD_DRAM
DD
DD
DD_DRAM
DD_DRAM
DD
DD
DD
DD_IO
Y5 V Y6 V Y7 V Y8 V Y9 V Y10 V Y11 V Y12 V Y13 V Y14 V Y15 V Y16 V Y17 V Y18 V Y19 V Y20 V
AC1 FLAG0 AD1 V AC2 V AC3 V
SS
DD_IO
AD2 ID1 AD3 V
SS
DD_IO
SS
DD_IO
SS
DD_IO
DD_IO
DD_IO
DD_IO
DD_IO
DD_IO
SS
DD_IO
SS
DD_IO
SS
SS
DD_IO
AB4 NC AC4 TMS AD4 TRST
AB12 V
SS
SS
AC12 L3DATI3_N AD12 L3DATI3_P
AC15 L3ACKO AD15 L3BCMPI
AB21 L2ACKO AC21 L2DATI0_N AD21 L2DATI0_P AB22 V
SS
DD_IO
DD_IO
AC22 V AC23 V
DD_IO
SS
AD22 V AD23 L2BCMPI
AC24 L1ACKI AD24 V
. For more information on SCLK and SCLK_V
REF
DD_IO
SS
REF
Rev. C | Page 44 of 48 | December 2006

OUTLINE DIMENSIONS

The ADSP-TS201S processor is available in a 25 mm × 25 mm, 576-ball metric thermally enhanced ball grid array (BGA_ED) package with 24 rows of balls (BP-576).
25.20
25.00
24.80
1.25
1.00
0.75
3.10
2.94
2.78
NOTES:
1. ALL DIMENSIO NS ARE IN MILL IM ETERS.
2. THE ACTUAL PO SITION OF THE BALL GRID IS W ITHIN 0.25 mm OF ITS IDEAL P OSITIO N RELATIVE TO THE PACKAGE EDGES.
3. CENTER DIMENSIONS ARE NOMINAL.
4. THIS PACKAGE CONFORMS TO JEDEC MS-034 S PECIFICATION.
1.25
1.00
0.75
A1 BALL INDICATOR
TOP VIEW
25.20
25.00
24.80
DETAIL A
1.00
BSC
23.00 BSC
SQ
1.00
BSC
(BALL
PITCH)
1.00 BSC
0.97 BSC
SEATING PLANE
10121416182024 22
1721 1923
1113
15
BOTTOM VIEW
0.75
0.65
0.55
(BALL
DIAMETER)
ADSP-TS201S
68
42
79531
1.60 MAX
0.20 M AX
0.60
0.50
0.40
B
D
F
H
K
M
P
T
V
Y
AB
AD
A
C
E
G
J
L
N
R
U
W
AA
AC
DETAIL A
Figure 47. 576-Ball BGA_ED (BP-576)

SURFACE MOUNT DESIGN

Table 36 is provided as an aid to PCB design. For industry-
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern Standard.
Table 36. BGA Data for Use with Surface Mount Design
Package Ball Attach Type Solder Mask Opening Ball Pad Size
576-Ball BGA_ED (BP-576)
Nonsolder Mask Defined (NSMD) 0.69 mm diameter 0.56 mm diameter
Rev. C | Page 45 of 48 | December 2006
ADSP-TS201S

ORDERING GUIDE

Model
Temperature
1
Range
Instruction
2
Rate
On-Chip DRAM Operating Voltage
ADSP-TS201SABP-060 –40°C to +85°C 600 MHz 24M bit 1.20 V ADSP-TS201SABP-050 –40°C to +85°C 500 MHz 24M bit 1.05 V ADSP-TS201SYBP-050 –40°C to +105°C 500 MHz 24M bit 1.05 V ADSP-TS201SABPZ060 ADSP-TS201SABPZ050 ADSP-TS201SYBPZ050
1
Represents case temperature.
2
The instruction rate is the same as the internal processor core clock (CCLK) rate.
3
Z = Pb-free part.
3
–40°C to +85°C 600 MHz 24M bit 1.20 VDD, 2.5 V
3
–40°C to +85°C 500 MHz 24M bit 1.05 VDD, 2.5 V
3
–40°C to +105°C 500 MHz 24M bit 1.05 VDD, 2.5 V
DD
DD
DD
, 2.5 V , 2.5 V , 2.5 V
DD_IO
DD_IO
DD_IO
DD_IO
DD_IO
DD_IO
, 1.6 V , 1.5 V , 1.5 V , 1.6 V , 1.5 V , 1.5 V
DD_DRAM
DD_DRAM
DD_DRAM
DD_DRAM
DD_DRAM
DD_DRAM
Package Option
Package Description
BP-576 576-Ball BGA_ED BP-576 576-Ball BGA_ED BP-576 576-Ball BGA_ED BP-576 576-Ball BGA_ED BP-576 576-Ball BGA_ED BP-576 576-Ball BGA_ED
Rev. C | Page 46 of 48 | December 2006
ADSP-TS201S
Rev. C | Page 47 of 48 | December 2006
ADSP-TS201S
©2006 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners.
D04324-0-11/06(C)
Rev. C | Page 48 of 48 | December 2006
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