Rx mixer with integrated fractional-N PLL
RF input frequency range: 1200 MHz to 3600 MHz
Internal LO frequency range: 2500 MHz to 2900 MHz
Input P1dB: 14.5 dBm
Input IP3: 27.5 dBm
IIP3 optimization via external pin
SSB noise figure
IP3SET pin open: 14.3 dB
IP3SET pin at 3.3 V: 15.5 dB
Voltage conversion gain: 6.8 dB
Matched 200 Ω IF output impedance
IF 3 dB bandwidth: 500 MHz
Programmable via 3-wire SPI interface
40-lead, 6 mm × 6 mm LFCSP
APPLICATIONS
Cellular base stations
GENERAL DESCRIPTION
The ADRF6604 is a high dynamic range active mixer with
integrated phase-locked loop (PLL) and voltage controlled
oscillator (VCO). The PLL/synthesizer uses a fractional-N
PLL to generate a f
can be divided or multiplied and then applied to the PLL phase
frequency detector (PFD).
LODRV_EN
MUXOUT
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
input to the mixer. The reference input
LO
CC1
CC2VCC_LOVCC_MIXVCC_V2IVCC_LO
36
LON
37
38
LOP
16
PLL_EN
DATA
CLK
REF_IN
12
13
14
LE
6
8
SPI
INTERFACE
×2
MUX
÷2
÷4
FRACTION
TEMP
SENSOR
7 11 15 20 21 23 24 25 28 30 31 35
FUNCTIONAL BLOCK DIAGRAM
PHASE
INTEGER
N COUNTER
21 TO 123
MODULUS
REG
THIRD-ORDER
FRACTIONAL
INTERP OLAT OR
–
+
FREQUENCY
DETECTOR
GND
REG
Figure 1.
ADRF6604
The PLL can support input reference frequencies from 12 MHz
to 160 MHz. The PFD output controls a charge pump whose
output drives an off-chip loop filter.
The loop filter output is then applied to an integrated VCO. The
VCO output at 2 × f
programmable PLL divider. The programmable PLL divider is
controlled by a sigma-delta (Σ-) modulator (SDM). The modulus
of the SDM can be programmed from 1 to 2047.
The active mixer converts the single-ended, 50 RF input to
a differential, 200 Ω IF output. The IF output can operate up
to 500 MHz.
The ADRF6604 is fabricated using an advanced silicon-germanium
BiCMOS process. It is available in a 40-lead, RoHS-compliant,
6 mm × 6 mm LFCSP with an exposed paddle. Performance is
specified over the −40°C to +85°C temperature range.
Changes to Figure 49...................................................................... 25
6/10—Revision 0: Initial Version
Rev. A | Page 2 of 32
ADRF6604
SPECIFICATIONS
RF SPECIFICATIONS
VS = 5 V, ambient temperature (TA) = 25°C, f
= 153.6 MHz, f
REF
using CDAC = 0xC and IP3SET = 3.3 V, unless otherwise noted.
Table 2.
Parameter Test Conditions/CommenMin Typ Max Unit
INTERNAL LO FREQUENCY RANGE 2500 2900 MHz
RF INPUT FREQUENCY RANGE ±3 dB RF input range 1200 3600 MHz
RF INPUT AT 2360 MHz
Input Return Loss Relative to 50 Ω (can be improved with external match) −16.2 dB
Input P1dB 14.6 dBm
Second-Order Intercept (IIP2) −5 dBm each tone (10 MHz spacing between tones) 54.5 dBm
Third-Order Intercept (IIP3) −5 dBm each tone (10 MHz spacing between tones) 28 dBm
Single-Sideband Noise Figure IP3SET = 3.3 V 14.8 dB
IP3SET = open 13.9 dB
LO-to-IF Leakage At 1× LO frequency, 50 Ω termination at the RF port −43 dBm
RF INPUT AT 2560 MHz
Input Return Loss Relative to 50 Ω (can be improved with external match) −21 dB
Input P1dB 14.5 dBm
Second-Order Intercept (IIP2) −5 dBm each tone (10 MHz spacing between tones) 58.2 dBm
Third-Order Intercept (IIP3) −5 dBm each tone (10 MHz spacing between tones) 27.6 dBm
Single-Sideband Noise Figure IP3SET = 3.3 V 14.9 dB
IP3SET = open 14.2 dB
LO-to-IF Leakage At 1× LO frequency, 50 Ω termination at the RF port −42 dBm
RF INPUT AT 2760 MHz
Input Return Loss Relative to 50 Ω (can be improved with external match) −20 dB
Input P1dB 14.4 dBm
Second-Order Intercept (IIP2) −5 dBm each tone (10 MHz spacing between tones) 64.4 dBm
Third-Order Intercept (IIP3) −5 dBm each tone (10 MHz spacing between tones) 27 dBm
Single-Sideband Noise Figure IP3SET = 3.3 V 15.5 dB
IP3SET = open 14.6 dB
LO-to-IF Leakage At 1× LO frequency, 50 Ω termination at the RF port −44 dBm
IF OUTPUT
Voltage Conversion Gain Differential 200 Ω load 6.8 dB
IF Bandwidth Small signal 3 dB bandwidth 500 MHz
Output Common-Mode Voltage External pull-up balun or inductors required 5 V
Gain Flatness Over frequency range, any 5 MHz/50 MHz 0.2/0.5 dB
Gain Variation Over full temperature range 1.3 dB
Output Swing Differential 200 Ω load 2 V p-p
Output Return Loss Relative to 200 Ω −15 dB
LO INPUT/OUTPUT (LOP, LON) Externally applied 1× LO input, inte al PLL disabled rn
Frequency Range 250 6000 MHz
Output Level (LO as Output) 1× LO into a 50 Ω load, LO output buffer enabled −9 dBm
Input Level (LO as Input) −6 0 +6 dBm
Input Impedance 50 Ω
= 38.4 MH
PFD
ts
z, high-side LO injection, f = 140 MHz, IIP3 optimized
IF
Rev. A | Page 3 of 32
ADRF6604
SYNTHESIZER/PLL SPE
= 140 MHz, IIP3 optimi
f
IF
Table 3.
Parameter Test Conditions/Comments Min Typ Max Unit
SYNTHESIZER SPECIFICATIONS Synthesizer specifications referenced to 1× LO
Frequency Range 2500 2900 MHInternally generated LO z
Figure of Merit1 P
Reference Spurs f
f
−82 dBc f
>f
PH ASE NOISE fLO = 2500 MHz to 2900 MHz, f
PFD Frequency 20 40 MHz
RET pins FERENCE CHARACTERISTICS REF_IN, MUXOU
REF_IN Input Frequency 12 160 MH z
REF_IN Input Capacitance 4 pF
MUXOUT Output Level
V
MUXOUT Duty Cycle 50 %
CH ARGE PUMP
Pump Current Programmable to 250 μA, 500 μA, 750 μA, 1 mA 500 μA
Output Compliance Range 1 2.8 V
1
T) is computed as phaas m sured across LO ran with f
he figure of merit (FOM
a
nd f power = 10 dBm
REF
CIFICATIONS
e (TA) = 25°C, f
turVS = 5 V, ambient tempera
zed using CDAC = 0xC and IP3SET = 3.3 V, unless otherwise noted.
(500 V/μs slew rate) w
se noise (dBc/Hz) – 10 log 10(f
= 153.6 MHz, f
REF
= 0 dBm −221.4 dBc/Hz/Hz
REF_IN
= 38.4 MHz
PFD
/4 −107 dBc
PFD
PFD
−80 dBc
PFD
(lock detect output selected) 0.25 V V
OL
(lock detect output selected) 2.7 V
OH
ith a 40 MHz f
. The FOM was computed at 50 kHz offset.
PFD
power = 4 dBm, f
REF
= 38.4 MHz
PFD
) – 20 log 10(fLO/f
PFD
). The FOM w
PFD
= 38.4 MHz, high-side LO injection,
PFD
ea the fullge,0 MHz,
°rms
= 8
REF
LOGIC INPUER SPECIFIC
V = 2-side LO injection, fIF = 140 MHz, IIP3 optimize
= 5 V, ambient temperature (TA)5°C, f
S
usxC and IP3SET = 3.3
ing CDAC = 0V, unless otherwise noted.
T
able 4.
PaTest CondT p Max Unit
rameter itions/Comments Min y
T AND POWATIONS
= 153.6 MHz, f
REF
= 38.4 MHz, highd
PFD
LOGIC INPUTS CLK, DATA , LE
Input High Voltage, V
Input Low Voltage, V
Input Current, I
Input Capacitance, C
1.4 3.3 V
INH
0 0.7 V
INL
0.1 μA
INH/IINL
IN
5pF
POWER SUPPLIES VCC1, VCC2, VCC_LO, VCC_MIX, and VCC_V2I pins
Voltage Range 4.75 5 5.25 V
Supply Current PLL only 96 mA
External LO mode (internal PLL disabled, IP3SET pin = 3.3 V, LO output buffer off) 164 mA
Internal LO mode (internal PLL enabled, IP3SET pin = 3.3 V, LO output buffer on) 274 mA
Internal LO mode (internal PLL enabled, IP3SET pin = 3.3 V, LO output buffer off) 260 mA
Power-down mode 30 mA
Rev. A | Page 4 of 32
ADRF6604
TIMING CHARACTERISTICS
VCC2 = 5 V ± 5%.
Table 5.
Paramete
t1 20 e ns min LE setup tim
t2 10 ns min DATA-to-CLK setup time
t3 -CLK hold time 10ns min DATA-to
t4 25 CLK high duration ns min
t5 CLK low duration 25 ns min
t6 10 CLK-to-LE setup time ns min
t7 20 in LE pulse width ns m
Timing Diagram
r Limit Unit Description
CLK
t
4
t
5
DATA
t
2
DB23 (MSB)
t
1
LE
DB22
t
3
DB2DB1
(CONTROL BIT C(CONTROL BIT C3)
2)
(COBIT C1)
DB0 (L
NTROL
SB)
t
t
7
6
08553-002
Figure 2. Timing Diagram
Rev. A | Page 5 of 32
ADRF6604
ABSOLUTE MAXIMUM R
Table 6.
Paramete
Supply Voltage, VC2, VCC_LO,
Digital I/O, CLK, DAE, LODRV_EN,
VTUNE 3.3 V 0 V to
IFP, IFN to VCC_V2I −0.3 V + 0.3 V
RFIN 16 dBm
LOP, LON, REF_IN 13 dBm
θJA (Exposed Paddle Soldered Down) 35°C/W
Maximum Junction Temperature 150°C
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
r Rating
C1, VCC
VCC_MIX, VCC_V
PLL_EN
2I
TA, L
ATINGS
V to +5.5 V
−0.5
to +3.6 V
−0.3 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section o
maximu
de
f this specification is not implied. Exposure to absolute
m rating conditions for extended periods may affect
vice reliability.
ESD CAUTION
Rev. A | Page 6 of 32
ADRF6604
TION DESCRIPTIONS PIN CONFIGURATION AND FUNC
NC
VCC_LO
GND
LODRV_EN
LON
LOP
VTUNE
DECLVCO
38
39
40
PIN 1
11
VCC
GND
R
SET
RE
F_IN
GND
XOUT
MU
2P5
DECL
VCC2
NOTES
1. NC = NO CONNECT . DO NOT CONNECT TO T HIS PIN.
2. THE EXPOSED PADDLE SHOULD BE SOLDERED TO A
LOW IMPEDANCE GROUND PL AN
INDICATO R
2DECL3P3
3CP
4
ADRF6604
5
6
7
8
9
10
TOP VIEW
(Not to Scale)
11
12
13
ND
CLK
G
DATA
Figure 3. Pin Configuration
NC
GND
32
31
33
34
35
36
37
30 GND
29 IP3SET
28 GND
27 VCC_V2I
RF
26
IN
25
GND
24 GND
23 GND
22 VCC_MIX
21
GND
15
17
16
18
19
14
LE
20
O
IFP
IFN
GND
GND
PLL_EN
VCC_L
E.
8553-003
Table 7. Pin Function Descriptions
Pin No. Mnemonic Description
1 VCC1
Power Supply for the 3.3 V LDO. Power supply voltage range is 4.75 V to 5.25 V. Each power supply pin
should be decoupled with a 100 pF capacitor and a 0.1 μF capacitor located close to the pin.
2 DECL3P3 Decoupling Node for 3.3 V LDO. Connect a 0.1 μF capacitor between this pin and ground.
3 CP Charge Pump Output Pin. Connect to VTUNE through the loop filter.
4, 7, 11, 15, 20,
GND Ground. Connect these pins to a low impedance ground plane.
21, 23, 24, 25,
28, 30, 31, 35
5 R
SET
Charge Pump Current. The nominal charge pump current can be set to 250 μA, 500 μA, 750 μA, or 1 mA using
Bit DB11 and Bit DB10 in Register 4 and by setting Bit DB18 in Register 4 to 0 (internal reference current). In
this mode, no external R
is required. If Bit DB18 is set to 1, the four nominal charge pump currents (I
SET
can be externally adjusted according to the following equation:
4.217
I
×
R
=
SET
6 REF_IN
Reference Input. Nominal input level is 1 V p-p. Input range is 12 MHz to 160 MHz. This pin is internally dc-
⎛
⎜
⎜
⎝
I
NOMINAL
⎞
CP
⎟
⎟
⎠
37.8
−
biased and should be ac-coupled.
8 MUXOUT
Multiplexer Output. This output can be programmed to provide the reference output signal or the lock detect
signal. The output is selected by programming the appropriate register.
9 DECL2P5 Decoupling Node for 2.5 V LDO. Connect a 0.1 μF capacitor between this pin and ground.
10 VCC2
Power Supply for the 2.5 V LDO. Power supply voltage range is 4.75 V to 5.25 V. Each power supply pin
should be decoupled with a 100 pF capacitor and a 0.1 μF capacitor located close to the pin.
12 DATA Serial Data Input. The serial data input is loaded MSB first; the three LSBs are the control bits.
13 CLK
Serial Clock Input. The serial clock input is used to clock in the serial data to the registers. The data is latched
into the 24-bit shift register on the CLK rising edge. The maximum clock frequency is 20 MHz.
14 LE
Load Enable. When the LE input pin goes high, the data stored in the shift register is loaded into one of the
eight registers. The relevant latch is selected by the three control bits of the 24-bit word.
16 PLL_EN
PLL Enable. Switch between internal PLL and external LO input. When this pin is logic high, the mixer LO is
automatically switched to the internal PLL and the internal PLL is powered up. When this pin is logic low, the
internal PLL is powered down and the external LO input is routed to the mixer LO inputs. The SPI can also be
used to switch modes.
17, 34 VCC_LO
Power Supply. Power supply voltage range is 4.75 V to 5.25 V. Each power supply pin should be decoupled
with a 100 pF capacitor and a 0.1 μF capacitor located close to the pin.
18, 19 IFP, IFN Mixer IF Outputs. These outputs should be pulled to VCC_MIX with RF chokes.
NOMINAL
)
Rev. A | Page 7 of 32
ADRF6604
Pin No. Mnemonic Description
22 VCC_MIX
26 RFIN RF Input. Single-ended, 50 Ω.
27 VCC_V2I
29 IP3SET Connect a resistor from this pin to a 5 V supply to adjust IIP3. Normally leave open.
32, 33 NC NC = No Connect. Do not connect to this pin.
36 LODRV_EN
37, 38 LON, LOP
39 VTUNE
40 DECLVCO Decoupling Node for VCO LDO. Connect a 100 pF capacitor and a 10 μF capacitor between this pin and ground.
EPAD Exposed Paddle. The exposed paddle should be soldered to a low impedance ground plane.
Power Supply. Power supply voltage range is 4.75 V to 5.25 V. Each power supply pin should be decoupled
with a 100 pF capacitor and a 0.1 μF capacitor located close to the pin.
Power Supply. Power supply voltage range is 4.75 V to 5.25 V. Each power supply pin should be decoupled
with a 100 pF capacitor and a 0.1 μF capacitor located close to the pin.
LO Driver Enable. Together with Pin 16 (PLL_EN), this digital input pin determines whether the LOP and LON pins
operate as inputs or outputs. LOP and LON become inputs if the PLL_EN pin is low or if the PLL_EN pin is set
high with the PLEN bit (DB6 in Register 5) set to 0. LOP and LON become outputs if either the LODRV_EN pin
or the LDRV bit (DB3 in Register 5) is set to 1 while the PLL_EN pin is set high. The external LO drive frequency
must be 1× LO. This pin has an internal 100 kΩ pull-down resistor.
Local Oscillator Input/Output. The internally generated 1× LO is available on these pins. When internal LO
generation is disabled, an external 1× LO can be applied to these pins.
VCO Control Voltage Input. This pin is driven by the output of the loop filter. The nominal input voltage
range on this pin is 1.5 V to 2.5 V.