Input voltage range: 2.3 V to 5.5 V
One 800 mA buck regulator
One 300 mA LDO
20-lead, 4 mm × 4 mm LFCSP package
Initial regulator accuracy: ±1%
Overcurrent and thermal protection
Soft start
Undervoltage lockout
Open-drain processor reset with threshold monitoring
±1.5% threshold accuracy over the full temperate range
Guaranteed reset output valid to V
Dual watchdog for secure systems
Watchdog 1 controls reset
Watchdog 2 controls reset and regulators power cycle
Buck regulator key specifications
Current-mode topology for excellent transient response
3 MHz operating frequency
Uses tiny multilayer inductors and capacitors
Mode pin selects forced PWM or auto PFM/PSM modes
100% duty cycle low dropout mode
LDO key specifications
Low V
from 1.7 V to 5.5 V
IN
Stable with1 µF ceramic output capacitors
High PSRR, 60 dB up to 1 kHz/10 kHz
Low output noise
Low dropout voltage: 150 mV at 300 mA load
−40°C to +125°C junction temperature range
= 1 V
CC
GENERAL DESCRIPTION
The ADP5043 combines one high performance buck regulator
and one low dropout regulator (LDO) in a small 20-lead LFCSP
to meet demanding performance and board space requirements.
The high switching frequency of the buck regulator enables use
of tiny multilayer external components and minimizes board space.
The MODE pin selects the buck’s mode of operation. When set
to logic high, the buck regulator operates in forced PWM mode.
When the MODE pin is set to logic low, the buck regulator
operates in PWM mode when the load is around the nominal
value. When the load current falls below a predefined threshold,
the regulator operates in power save mode (PSM) improving
the light-load efficiency.
The low quiescent current, low dropout voltage, and wide input
voltage range of the ADP5043 LDO extend the battery life of
portable devices. The LDO maintains a power supply rejection
of greater than 60 dB for frequencies as high as 10 kHz while
operating with a low headroom voltage.
Each regulator is activated by a high level on the respective
enable pin. The ADP5043 is available with factory programmable
default output voltages and can be set to a wide range of options.
The ADP5043 contains supervisory circuits that monitor
power supply voltage levels and code execution integrity in
microprocessor-based systems. The ADP5043 also provides
power-on reset signals. An on-chip dual watchdog timer can
reset the microprocessor or power cycle the system (Watchdog 2)
if it fails to strobe within a preset timeout period.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
HIGH LEVEL BLOCK DIAGRAM
Figure 1.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 www.analog.com
ADP5043 Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
General Description ......................................................................... 1
High Level Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Input Logic High VIH 2.5 V ≤ AVIN ≤ 5.5 V 1.2 V
Input Logic Low VIL 2.5 V ≤ AVIN ≤ 5.5 V 0.4 V
Input Leakage Current (WMOD Excluded) V
ENx = AVIN or GND, TJ = −40°C to +125°C 1 µA
WMOD Input Leakage Current V
OPEN-DRAIN OUTPUTS
nRSTO, WSTAT Output Voltage VOL AVIN = 2.3 V to 5.5 V, I
Open-Drain Reset Output Leakage Current 1 µA
+ 0.5 V) or 2.3 V, whichever is greater, AVIN, VIN1 ≥ VIN2, TA = 25°C, unless otherwise noted. Regulators
OUT1
TJ = −40°C to +125°C
AVIN
AVINRISE
AVI NFAL L
ENx = GND 0.1 µA
GND-SD
20 °C
SD-HYS
MR
INPUTS
ENx = AVIN or GND 0.05 µA
I-LEAKAGE
I-LKG-WMOD
VWMOD = 3.6 V, TJ = −40°C to +125°C 50 µA
nRSTO/WSTAT
= 3 mA 30
SUPERVISORY SPECIFICATIONS
AVIN, VIN1 = full operating range, TJ = −40°C to +125°C, unless otherwise noted.
Table 2.
Parameter Min Typ Max Unit Test Conditions/Comments
SUPPLY
Supply Current (Supervisory Circuit Only) 45 55 µA AVIN = 5.5 V, EN1 = EN2 = VIN1
43 52 µA AVIN = 3.6 V, EN1 = EN2 = VIN1
RESET THRESHOLD ACCURACY VTH − 0.8% VTH VTH + 0.8% V TA = 25°C, sensed on VOUTx
VTH − 1.5% VTH VTH + 1.5% V TJ = −40°C to +125°C, sensed on V
RESET THRESHOLD TO OUTPUT DELAY
GLITCH IMMUNITY (t
UOD
)
RESET TIMEOUT PERIOD WATCHDOG1 (t
RP1
50 125 400 µs VTH = V
)
Option A 24 30 36 ms
Option B 160 200 240 ms
RESET TIMEOUT PERIOD WATCHDOG2 (t
) 3.5 5 7 ms
RP2
VCC TO RESET DELAY (tRD) 150 µs VIN1 falling at 1 mV/µs
REGULATORS SEQUENCING DELAY (tD1, tD2) 2 ms
WATCHDOG INPUTS
Watchdog 1 Timeout Period (t
)
WD1
Option A 81.6 102 122.4 ms
Option B 1.28 1.6 1.92 sec
− 50 mV
OUT
OUTx
Rev. A | Page 3 of 32
ADP5043 Data Sheet
Option D
6.4 8 9.6
min
Option A
210 ms
MANUAL RESET INPUT
Parameter Min Typ Max Unit Test Conditions/Comments
Watchdog 2 Timeout Period (t
Option A 6 7.5 9 sec
Option B Watchdog 2 disabled
Option C 3.2 4 4.8 min
Option E 11.2 16 19.2 min
Option F 25.6 32 38.4 min
Option G 51.2 64 76.8 min
Option H 102.4 128 153.8 min
Watchdog 2 Power Off Period (t
Option B 400 ms
WDI1 Pulse Width 80 ns VIL = 0.4 V, VIH = 1.2 V
WDI2 Pulse Width 8 µs VIL = 0.4 V, VIH = 1.2 V
Watchdog Status Timeout Period (t
WDI1 Input Current (Source) 8 15 20 µA V
WDI1 Input Current (Sink) −30 −25 −14 µA V
WDI2 Internal Pull-Down 45 kΩ
for typical specifications, unless otherwise noted.
Table 3.
Parameter Test Conditions/Comments Min Ty p Max Unit
INPUT CHARACTERISTICS
Input Voltage Range (VIN1) 2.3 5.5 V
OUTPUT CHARACTERISTICS
Output Voltage Accuracy PWM mode, I
PSM mode −2 +2 %
PWM TO POWER SAVE MODE CURRENT THRESHOLD 100 mA
INPUT CURRENT CHARACTERISTICS
DC Operating Current I
Shutdown Current ENx = 0 V, TA = TJ = −40°C to +125°C 0.2 1.0 μA
SW CHARACTERISTICS
SW On Resistance PFET 180 240 mΩ
PFET, AVIN = VIN1 = 5 V 140 190 mΩ
NFET 170 235 mΩ
= 1.8 V, TJ = −40°C to +125°C for minimum/maximum specifications, L = 1 µH, C
OUT1
1
= 100 mA −1 +1 %
LOAD
VIN1 = 2.3 V to 5.5 V, PWM mode,
= 1 mA to 800 mA
I
LOAD
= 0 mA, device not switching 21 35 μA
LOAD
−3 +3 %
= 10 µF, and TA = 25°C
OUT
Current Limit PFET switch peak current limit 1100 1360 1600 mA
ACTIVE PULL-DOWN EN1 = 0 V 75 Ω
OSCILLATOR FREQUENCY 2.5 3.0 3.5 MHz
STA RT-UP TIME 250 μs
1
All limits at temperature extremes are guaranteed via correlation using standard statistical quality control (SQC).
LDO SPECIFICATIONS
AVIN = 3.6 V, VIN2 = (VOUT2 + 0.2 V) or 2.3 V, whichever is greater; AVIN, VIN1 ≥ VIN2; I
T
= 25°C, unless otherwise noted.
A
Table 4.
Parameter Symbol Test Conditions/Comments Min Typ Max Unit
INPUT VOLTAGE RANGE V
I
I
I
I
FIXED OUTPUT VOLTAGE ACCURACY V
TJ = −40°C to +125°C 1.7 5.5 V
IN2
GND
I
OUT2
OUT
= 0 µA, VOUT = 3.3 V,
I
OUT
= −40°C to +125°C
T
J
= 10 mA 67 µA
OUT
= 10 mA, TJ = −40°C to +125°C 105 µA
OUT
= 200 mA 100 µA
OUT
= 200 mA, TJ = −40°C to +125°C 245 µA
OUT
= 10 mA −1 +1 %
OUT
OUT
VIN2 = (VOUT2 + 0.5 V) to 5.5 V 100 µA < I
< 300 mA −3 +3 %
OUT
VIN2 = (VOUT2 + 0.5 V) to 5.5 V TJ = −40°C to +125°C
= 10 mA; CIN = C
OUT
= 1 µF;
OUT
50 µA
Rev. A | Page 5 of 32
ADP5043 Data Sheet
Load Regulation1
∆V
/∆I
= 1 mA to 200 mA
0.002
%/mA
DROPOUT VOLTAGE2
V
VOUT2 = 3.3 V
CAPACITOR ESR
R
TJ = −40°C to +125°C
0.001
1 Ω
Parameter Symbol Test Conditions/Comments Min Typ Max Unit
REGULATION
Line Regulation ∆V
I
TJ = −40°C to +125°C
I
TJ = −40°C to +125°C
I
I
I
I
ACTIVE PULL-DOWN R
STA RT-UP TIME T
CURRENT-LIMIT THRESHOLD3 I
OUTPUT NOISE OUT
POWER SUPPLY REJECTION RATIO PSRR
1
Based on an end-point calculation using 1 mA and 100 mA loads.
2
Dropout voltage is defined as the input-to-output voltage differential when the input voltage is set to the nominal output voltage. This applies only for output
voltages above 2.3 V.
3
Current-limit threshold is defined as the current at which the output voltage drops to 90% of the specified typical value. For example, the current limit for a 3.0 V
output voltage is defined as the current that causes the output voltage to drop to 90% of 3.0 V, or 2.7 V.
/∆V
OUT2
OUT2
DROPOUT
EN2 = 0 V 600 Ω
PDLDO
VOUT2 = 3.3 V 85 µs
STA RT-UP
TJ = −40°C to +125°C 335 470 mA
LIMIT
LDONOISE
VIN2= (VOUT2 + 0.5 V) to 5.5 V −0.03 +0.03 %/V
IN2
= 1 mA
OUT2
OUT2 IOUT2
= 1 mA to 200 mA 0.0075 %/mA
OUT2
= 10 mA 4 mV
OUT2
= 10 mA, TJ = −40°C to +125°C 5 mV
OUT2
= 200 mA 60 mV
OUT2
= 200 mA, TJ = −40°C to +125°C 100 mV
OUT2
10 Hz to 100 kHz, VIN2 = 5 V,
123 µV rms
VOUT2 = 3.3 V
10 Hz to 100 kHz, VIN2 = 5 V,
110 µV rms
VOUT2 = 2.8 V
10 Hz to 100 kHz, VIN2 = 5 V,
59 µV rms
VOUT2 = 1.5 V
1 kHz, VIN2 = 3.3 V, VOUT2 = 2.8 V,
I
= 100 mA
OUT
100 kHz, VIN2 = 3.3 V, VOUT2 = 2.8 V,
= 100 mA
I
OUT
1 MHz, VIN2 = 3.3 V, VOU T2 = 2.8 V,
= 100 mA
I
OUT
66 dB
57 dB
60 dB
INPUT AND OUTPUT CAPACITOR, RECOMMENDED SPECIFICATIONS
Table 5.
Parameter Symbol Test Conditions/Comments Min Ty p Max Unit
OUTPUT CAPACITANCE (BUCK)1 C
MINIMUM INPUT AND OUTPUT CAPACITANCE2 (LDO) C
1
The minimum output capacitance should be greater than 4.7 µF over the full range of operating conditions. The full range of operating conditions in the application
must be considered during device selection to ensure that the minimum capacitance specification is met.
2
The minimum input and output capacitance should be greater than 0.70 µF over the full range of operating conditions. The full range of operating conditions in the
application must be considered during device selection to ensure that the minimum capacitance specification is met. X7R and X5R type capacitors are recommended,
Y5V and Z5U capacitors are not recommended for use with LDOs or the buck.
Storage Temperature Range −65°C to +150°C
Operating Junction Temperature Range −40°C to +125°C
Soldering Conditions JEDEC J-STD-020
ESD Human Body Model 3000 V
ESD Charged Device Model 1500 V
−0.3 V to +6 V
Junction-to-ambient thermal resistance (θ
based on modeling and calculation using a 4-layer board. The
junction-to-ambient thermal resistance is highly dependent on
the application and board layout. In applications where high
maximum power dissipation exists, close attention to thermal
board design is required. The value of θ
PCB material, layout, and environmental conditions. The specified
value of θ
is based on a four-layer, 4” × 3”, 2.5 oz copper board,
JA
as per JEDEC standard. For additional information, see the
AN-772 Application Note, A Design and Manufacturing Guide
for the Lead Frame Chip Scale (LFCSP).
) of the package is
JA
may vary, depending on
JA
Stresses above those listed under absolute maximum ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL DATA
Absolute maximum ratings apply individually only, not in
combination.
The ADP5043 can be damaged when the junction temperature
limits are exceeded. Monitoring ambient temperature does not
guarantee that the junction temperature is within the specified
temperature limits. In applications with high power dissipation
and poor thermal resistance, the maximum ambient temperature may have to be derated. In applications with moderate
power dissipation and low PCB thermal resistance, the maximum
ambient temperature can exceed the maximum limit as long
as the junction temperature is within specification limits. The
junction temperature of the device is dependent on the ambient
temperature, the power dissipation of the device (P
junction-to-ambient thermal resistance of the package. Maximum junction temperature is calculated from the ambient
temperature and power dissipation using the formula
T
= TA + (PD × θJA)
J
), and the
D
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 7. Thermal Resistance
Package Type θJA θJC Unit
20-Lead, 0.5 mm pitch LFCSP 38 4.2 °C/W
ESD CAUTION
Rev. A | Page 7 of 32
ADP5043 Data Sheet
NOTES
1. EXPOS E D P AD S HOULD BE CONNECT E D TO AGND.
2. NC = NO CONNECT. DO NOT CONNECT T O THIS PIN.
THE PIN SHOULD BE LEFT FLOATING.
14
13
12
1
3
4
NC
15
WSTAT
GND
WDI2
11
VOUT1
NC
VIN2
2
VOUT2
EN2
5
nRSTO
7
VIN1
6
AVIN
8
SW
9
PGND
10
EN1
19
WDI1
20
18 WMOD
17
MODE
16
GND
ADP5043
MR
TOP VIEW
(Not to S cale)
09682-002
5
nRSTO
Open-Drain Reset Output, Active Low.
11
VOUT1
Buck Sensing Node.
19
WDI1
Watchdog 1 Refresh Input from Processor. If WDI1 is in high-Z and WMOD is low, Watchdog 1 is disabled.
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 2. Pin Configuration
Table 8. Pin Function Descriptions
Pin No. Mnemonic Description
1 NC Do not connect to this pin. The pin should be left floating.
2 VOUT2 LDO Output Voltage and Sensing Input.
3 VIN2 LDO Input Supply (1.7 V to 5.5 V).
4 EN2 Enable LDO. EN2 = high: turn on the LDO; EN2 = low: turn off the LDO.
6 AVIN Regulators Housekeeping and Supervisory Input Supply (2.3 V to 5.5 V).
7 VIN1 Buck Input Supply (2.3 V to 5.5 V).
8 SW Buck Switching Node.
9 PGND Dedicated Power Ground for Buck Regulator.
10 EN1 Enable Buck. EN1 = high: turn on buck; EN1 = low: turn off buck.
12 WDI2 Watchdog 2 (Long Timeout) Refresh Input from Processor. This pin can be disabled only by a factory option.
13 GND Connect to the ground plane.
14 NC Do not connect to this pin. The pin should be left floating.
15 WS TAT