Input voltage range: 2.3 V to 5.5 V
One 0.8 A buck regulator
Two 300 mA LDOs
20-lead, 4 mm × 4 mm LFCSP package
Initial regulator accuracy: ±1%
Overcurrent and thermal protection
Soft start
Undervoltage lockout
Open drain processor reset with threshold monitoring
±1.5% threshold accuracy over the full temperate range
Guaranteed reset output valid to V
Dual watchdog for secure systems
Watchdog 1 controls reset
Watchdog 2 controls reset and regulators power cycle
Buck key specifications
Current mode topology for excellent transient response
3 MHz operating frequency
Uses tiny multilayer inductors and capacitors
Mode pin selects forced PWM or auto PFM/PSM modes
100% duty cycle low dropout mode
LDOs key specifications
Low V
from 1.7 V to 5.5 V
IN
Stable with1 µF ceramic output capacitors
High PSRR, 60 dB PSRR up to 1 kHz/10 kHz
Low output noise
110 µV rms typical output noise at V
Low dropout voltage: 150 mV at 300 mA load
−40°C to +125°C junction temperature range
= 1 V
CC
= 2.8 V
OUT
Micro PMU with 0.8 A Buck, Two 300 mA LDOs
HIGH LEVEL BLOCK DIAGRAM
Figure 1.
GENERAL DESCRIPTION
The ADP5042 combines one high performance buck regulator
and two low dropout regulators (LDO) in a small 20-lead
LFCSP to meet demanding performance and board space
requirements.
The high switching frequency of the buck regulator enables
use of tiny multilayer external components and minimizes the
board space.
The MODE pin selects the buck mode of operation. When set
to logic high, the buck regulators operate in forced PWM mode.
When the MODE pin is set to logic low, the buck regulators
operate in PWM mode when the load is around the nominal
value. When the load current falls below a predefined threshold
the regulator operates in power save mode (PSM) improving
the light-load efficiency.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringement s of patents or other
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
The low quiescent current, low dropout voltage, and wide input
voltage range of the ADP5042 LDOs extend the battery life of
portable devices. The two LDOs maintain power supply
rejection greater than 60 dB for frequencies as high as 10 kHz
while operating with a low headroom voltage.
Each regulator is activated by a high level on the respective
enable pin. The ADP5042 is available with factory programmable
default output voltages and can be set to a wide range of options.
The ADP5042 contains supervisory circuits that monitor
power supply voltage levels and code execution integrity in
microprocessor-based systems. They also provide power-on
reset signals. An on-chip dual watchdog timer can reset the
microprocessor or power cycle the system (Watchdog 2) if it
fails to strobe within a preset timeout period.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 www.analog.com
ADP5042 Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
High Level Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
3.5 5 7 ms
VCC TO RESET DELAY (tRD) 150 µs VIN1 falling at 1 mV/µs
REGULATORS SEQUENCING DELAY (tD1, tD2) 2 ms
WATCHDOG INPUTS
Watchdog 1 Timeout Period (t
)
WD1
Option A 81.6 102 122.4 ms
Option B 1.28 1.6 1.92 sec
= −40°C to +125°C, sensed on
T
J
V
OUTx
= V
TH
− 50 mV
UOT
Rev. A | Page 3 of 32
ADP5042 Data Sheet
Option D
6.4 8 9.6
min
Option A
210 ms
MANUAL RESET INPUT
Parameter Min Typ Max Unit Test Conditions/Comments
Watchdog 2 Timeout Period (t
Option A 6 7.5 9 sec
Option B Watchdog 2 disabled
Option C 3.2 4 4.8 min
Option E 11.2 16 19.2 min
Option F 25.6 32 38.4 min
Option G 51.2 64 76.8 min
Option H 102.4 128 153.8 min
Watchdog 2 Power Off Period (t
Option B 400 ms
WDI1 Pulse Width 80 ns VIL = 0.4 V, VIH = 1.2 V
WDI2 Pulse Width 8 µs VIL = 0.4 V, VIH = 1.2 V
Watchdog Status Timeout Period (t
WDI1 Input Current (Source) 8 15 20 µA V
WDI1 Input Current (Sink) −30 −25 −14 µA V
WDI2 Internal Pull-Down 45 kΩ
for typical specifications, unless otherwise noted.
Table 3.
Parameter Test Conditions/Comments Min Typ Max Unit
INPUT CHARACTERISTICS
Input Voltage Range (VIN1) 2.3 5.5 V
OUTPUT CHARACTERISTICS
Output Voltage Accuracy PWM mode, TA= 25 °C , I
PWM mode −2 +2 %
PWM TO POWER SAVE MODE CURRENT THRESHOLD 100 mA
INPUT CURRENT CHARACTERISTICS
DC Operating Current I
Shutdown Current ENx = 0 V, TA = TJ = −40°C to +125°C 0.2 1.0 μA
SW CHARACTERISTICS
SW On Resistance PFET 180 240 mΩ
PFET, AVIN = VIN1 = 5 V 140 190 mΩ
NFET 170 235 mΩ
= 1.8 V, TJ= −40°C to +125°C for minimum/maximum specifications, L = 1 µH, C
OUT1
1
VIN1 = 2.3 V to 5.5 V, PWM mode,
= 1 to 800 mA
I
LOAD
= 0 mA, device not switching 21 35 μA
LOAD
= 100 mA −1 +1 %
LOAD
−3 +3 %
= 10 µF, and TA = 25°C
OUT
Current Limit PFET switch peak current limit 1100 1360 1600 mA
ACTIVE PULL-DOWN EN1 = 0 V 75 Ω
OSCILLATOR FREQUENCY 2.5 3.0 3.5 MHz
STA RT-UP TIME 250 μs
1
All limits at temperature extremes are guaranteed via correlation using standard statistical quality control (SQC).
LDO1, LDO2 SPECIFICATIONS
AVIN = 3.6 V, V
T
= 25°C, unless otherwise noted.
A
Table 4.
Parameter Symbol Conditions Min Typ Max Unit
INPUT VOLTAGE RANGE V
OPERATING SUPPLY CURRENT (per
LDO)
I
I
I
I
I
FIXED OUTPUT VOLTAGE ACCURACY V
100 µA < I
V
100 µA < I
V
TJ = −40°C to +125°C
REGULATION
Line Regulation ∆V
TJ = −40°C to +125°C
IN2, VIN3
= (V
+ 0.2 V) or 2.3 V, whichever is greater; AVIN, VIN1 ≥ VIN2, VIN3; I
OUT3
, V
TJ = −40°C to +125°C 1.7
IN2
IN3
I
I
GND
OUT2, VOUT3
/∆V
OUT2
∆V
/∆V
OUT3
I
IN2
IN3
= 0 µA, V
OUT
= 0 µA, V
OUT
= 10 mA 67 µA
OUT
= 10 mA, TJ = −40°C to +125°C 105 µA
OUT
= 200 mA 100 µA
OUT
= 200 mA, TJ = −40°C to +125°C 245 µA
OUT
= 10 mA −1 +1 %
OUT
IN2, VIN3
IN2, VIN3
V
IN2, VIN3
OUT3
= 3.3 V 15 µA
OUT
= 3.3 V, TJ = −40°C to +125°C 50 µA
OUT
< 300 mA −2 +2 %
OUT
= (V
OUT2, VOUT3
< 300 mA −3 +3 %
OUT
= (V
OUT2, VOUT3
= (V
OUT2, VOUT3
+ 0.5 V) to 5.5 V
+ 0.5 V) to 5.5 V
+ 0.5 V) to 5.5 V −0.03 +0.03 %/V
= 10 mA; CIN = C
OUT
= 1 µF;
OUT
5.5 V
Rev. A | Page 5 of 32
ADP5042 Data Sheet
I
= 200 mA
60 mV
µV rms
Parameter Symbol Conditions Min Typ Max Unit
Load Regulation1 ∆V
∆V
OUT2
OUT3
/∆I
/∆I
OUT2
OUT3
I
TJ = −40°C to +125°C
DROPOUT VOLTAGE2 V
DROPOUT
V
I
I
I
ACTIVE PULL-DOWN R
STA RT-UP TIME T
CURRENT-LIMIT THRESHOLD3 I
OUTPUT NOISE OUT
EN2/EN3 = 0 V 600 Ω
PDLDO
V
STA RT-UP
TJ = −40°C to +125°C 335 470 mA
LIMIT
LDO2NOISE
10 Hz to 100 kHz, V
10 Hz to 100 kHz, V
OUT
LDO1NOISE
10 Hz to 100 kHz, V
10 Hz to 100 kHz, V
POWER SUPPLY REJECTION RATIO PSRR
1
Based on an end-point calculation using 1 mA and 100 mA loads.
2
Dropout voltage is defined as the input-to-output voltage differential when the input voltage is set to the nominal output voltage. This applies only for output
voltages above 2.3 V.
3
Current-limit threshold is defined as the current at which the output voltage drops to 90% of the specified typical value. For example, the current limit for a 3.0 V
output voltage is defined as the current that causes the output voltage to drop to 90% of 3.0 V, or 2.7 V.
I
OUT2, VOUT3
= 1 mA to 200 mA 0.002 %/mA
OUT2, VOUT3
OUT2, VOUT3
OUT2, IOUT3
OUT2, IOUT3
OUT2, IOUT3
OUT2, IOUT3
OUT2, VOUT3
= 1 mA to 200 mA 0.0075 %/mA
= 3.3 V
= 10 mA 4 mV
= 10 mA, TJ = −40°C to +125°C 5 mV
= 200 mA, TJ = −40°C to +125°C 100 mV
= 3.3 V 85 µs
10 Hz to 100 kHz, V
10 Hz to 100 kHz, V
IN2, VIN3
IN2, VIN3
, V
IN2
= 3.3 V, V
= 3.3 V, V
= 3.3 V, V
IN3
1 kHz, V
= 100 mA
I
OUT
100 kHz, V
= 100 mA
I
OUT
1 MHz, V
= 100 mA
I
OUT
= 5 V, V
IN3
= 5 V, V
IN3
= 5 V, V
IN3
= 5 V, V
IN2
= 5 V, V
IN2
= 5 V, V
IN2
OUT3
OUT3
OUT3
OUT2
OUT2
OUT2
OUT2, OUT3
OUT2, VOUT3
OUT2, VOUT3
= 3.3 V 123 µV rms
= 2.8 V 110 µV rms
= 1.5 V 59 µV rms
= 3.3 V 140 µV rms
= 2.8 V 129 µV rms
= 1.5 V 66
= 2.8 V,
= 2.8 V,
= 2.8 V,
66 dB
57 dB
60 dB
INPUT AND OUTPUT CAPACITOR, RECOMMENDED SPECIFICATIONS
Table 5.
Parameter Symbol Conditions Min Typ Max Unit
MINIMUM OUTPUT CAPACITANCE (BUCK)1 C
MINIMUM INPUT AND OUTPUT CAPACITANCE2 (LDO1, LDO2) C
CAPACITOR ESR R
1
The minimum output capacitance should be greater than 4.7 µF over the full range of operating conditions. The full range of operating conditions in the application
must be considered during device selection to ensure that the minimum capacitance specification is met.
2
The minimum input and output capacitance should be greater than 0.70 µF over the full range of operating conditions. The full range of operating conditions in the
application must be considered during device selection to ensure that the minimum capacitance specification is met. X7R and X5R type capacitors are recommended,
Y5V and Z5U capacitors are not recommended for use with LDOs or the buck.
TJ = −40°C to +125°C 7 40 µF
MIN1
TJ = −40°C to +125°C 0.70 µF
MIN23
TJ = −40°C to +125°C 0.001 1 Ω
ESR
Rev. A | Page 6 of 32
Data Sheet ADP5042
ESD Machine Model
100 V
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter Rating
AVIN, VINx, VOUTx, ENx, MODE, MR, WDIx,
WMOD, WSTAT, nRSTO to GND
Storage Temperature Range −65°C to +150°C
Operating Junction Temperature Range −40°C to +125°C
Soldering Conditions JEDEC J-STD-020
ESD Human Body Model 3000 V
ESD Charged Device Model 1500 V
−0.3 V to +6 V
Junction-to-ambient thermal resistance (θ
based on modeling and calculation using a 4-layer board. The
junction-to-ambient thermal resistance is highly dependent on
the application and board layout. In applications where high
maximum power dissipation exists, close attention to thermal
board design is required. The value of θ
PCB material, layout, and environmental conditions. The specified
value of θ
is based on a four-layer, 4” × 3”, 2.5 oz copper board,
JA
as per JEDEC standard. For additional information, see the
AN-772 Application Note, A Design and Manufacturing Guide
for the Lead Frame Chip Scale (LFCSP).
) of the package is
JA
may vary, depending on
JA
Stresses above those listed under absolute maximum ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL DATA
Absolute maximum ratings apply individually only, not in
combination.
The ADP5042 can be damaged when the junction temperature
limits are exceeded. Monitoring ambient temperature does not
guarantee that the junction temperature is within the specified
temperature limits. In applications with high power dissipation
and poor thermal resistance, the maximum ambient
temperature may have to be derated. In applications with
moderate power dissipation and low PCB thermal resistance,
the maximum ambient temperature can exceed the maximum
limit as long as the junction temperature is within specification
limits. The junction temperature of the device is dependent on
the ambient temperature, the power dissipation of the device
(P
), and the junction-to-ambient thermal resistance of the
D
package. Maximum junction temperature is calculated from the
ambient temperature and power dissipation using the formula
T
= TA + (PD × θJA)
J
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 7. Thermal Resistance
Package Type θJA θJC Unit
20-Lead, 0.5 mm pitch LFCSP 38 4.2 °C/W
ESD CAUTION
Rev. A | Page 7 of 32
ADP5042 Data Sheet
D
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
DI1
MO
W
MODE
W
MR
20
EN2
19
16
17
18
1
NC
2
VOUT3
VIN3
EN3
nRSTO
NOTES
1. EXPOSED PAD SHOULD BE CONNECTED TO AGND.
2. NC = NO CONNE CT. DO NOT CONNECT TO THIS PIN.
3
4
5
ADP5042
TOP VIEW
(Not to S cale)
8
6
7
SW
VIN1
AVIN
15 WSTAT
VOUT2
14
13
VIN2
12
WDI2
11
VOUT1
9
10
EN1
PGND
08811-002
Figure 2. Pin Configuration—View from Top of the Die
Table 8. Preliminary Pin Function Descriptions
Pin No. Mnemonic Description
1 NC Do not connect to this pin.
2 VOUT3 LDO2 Output Voltage and Sensing Input.
3 VIN3 LDO2 Input Supply (1.7 V to 5.5 V).
4 EN3 Enable LDO2. EN3 = high: turn on LDO2; EN3 = low: turn off LDO2.
5 nRSTO Open-Drain Reset Output, Active Low.
6 AVIN Regulators Housekeeping and Supervisory Input Supply (2.3 V to 5.5 V).
7 VIN1 Buck Input Supply (2.3 V to 5.5 V).
8 SW Buck Switching Node.
9 PGND Dedicated Power Ground for Buck Regulator.
10 EN1 Enable Buck. EN1 = high: turn on buck; EN1 = low: turn off buck.
11 VOUT1 Buck Sensing Node.
12 WDI2 Watchdog 2 (Long Timeout) Refresh Input from Processor. Can be disabled only by factory option.
13 VIN2 LDO1 Input Supply (1.7 V to 5.5 V).
14 VOUT2 LDO1 Output Voltage and Sensing Input.
15 WSTAT
in pulse skipping mode (PSM) at light load and in constant PWM at higher load.
18 WMOD
Watchdog Mode. WMOD = low: Watchdog 1 normal mode; WMOD = high: Watchdog 1 cannot be disabled by
a three-state condition applied on WDI1.
19 WDI1 Watchdog 1 Refresh Input from Processor. If WDI1 is in high-Z and WMOD is low, Watchdog 1 is disabled.
20
MR
Manual Reset Input, Active Low.
TP AGND Analog Ground (TP = Thermal Pad). Exposed pad should be connected to AGND.