Analog Devices ADP3414JR Datasheet

Dual Bootstrapped
a
FEATURES All-In-One Synchronous Buck Driver Bootstrapped High-Side Drive One PWM Signal Generates Both Drives Anticross-Conduction Protection Circuitry Pulse-by-Pulse Disable Control
APPLICATIONS Mobile Computing CPU Core Power Converters Multiphase Desktop CPU Supplies Single-Supply Synchronous Buck Converters Standard-to-Synchronous Converter Adaptations
GENERAL DESCRIPTION
The ADP3414 is a dual MOSFET driver optimized for driving two N-channel MOSFETs which are the two switches in a nonisolated synchronous buck power converter. Each of the drivers is capable of driving a 3000 pF load with a 20 ns propa­gation delay and a 30 ns transition time. One of the drivers can be bootstrapped, and is designed to handle the high-voltage slew rate associated with floating high-side gate drivers. The ADP3414 includes overlapping drive protection (ODP) to prevent shoot-through current in the external MOSFETs.
The ADP3414 is specified over the commercial temperature range of 0°C to 70°C and is available in an 8-lead SOIC package.
ADP3414
VCC
MOSFET Driver
ADP3414

FUNCTIONAL BLOCK DIAGRAM

VCC
IN
OVERLAP
PROTECTION
CIRCUIT
ADP3414
7V
D1
BST
12V
BST
DRVH
SW
DRVL
PGND
IN
DELAY
1V
Figure 1. General Application Circuit
REV. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
C
BST
DRVH
SW
+1V
DRVL
PGND
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 2001
Q1
Q2
1
ADP3414–SPECIFICATIONS
Parameter Symbol Conditions Min Typ Max Unit
SUPPLY
Supply Voltage Range VCC 4.15 7.5 V Quiescent Current ICC
PWM INPUT
Input Voltage High Input Voltage Low
2
2
HIGH-SIDE DRIVER
Output Resistance, Sourcing Current V
Output Resistance, Sinking Current V
3
Transition Times
Propagation Delay
(See Figure 2) tr
3, 4
(See Figure 2) tpdh
LOW-SIDE DRIVER
Output Resistance, Sourcing Current VCC = 5 V 3.0 5.0
Output Resistance, Sinking Current VCC = 5 V 1.5 3.0
3
Transition Times
Propagation Delay
NOTES
1
All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality Control (SQC) methods.
2
Logic inputs meet typical CMOS I/O conditions for source/sink current (~1 µA).
3
AC specifications are guaranteed by characterization, but not production tested.
4
For propagation delays, tpdh refers to the specified signal going high; tpdl refers to it going low.
Specifications subject to change without notice.
(See Figure 2) tr
3, 4
(See Figure 2) tpdh
DRVH
tf
DRVH
tpdl
DRVL
tf
DRVL
tpdl
Q
DRVH
DRVH
DRVL
DRVL
(TA = 0C to 70C, VCC = 7 V, BST = 4 V to 26 V, unless otherwise noted.)
12 mA
2.3 V
0.8 V
– VSW = 5 V 3.0 5.0
BST
– VSW = 7 V 2.0 3.5
V
BST
– VSW = 5 V 1.25 2.5
BST
V
– VSW = 7 V 1.0 2.5
BST
V
– VSW = 7 V, C
BST
V
– VSW = 7 V, C
BST
V
– V
BST
V
– V
BST
SW
= 7 V 65 86 ns
SW
= 7 V 21 32 ns
= 3 nF 36 47 ns
LOAD
= 3 nF 20 30 ns
LOAD
VCC = 7 V 2.0 3.5
VCC = 7 V 1.0 2.5 VCC = 7 V, C VCC = 7 V, C
= 3 nF 27 35 ns
LOAD
= 3 nF 19 26 ns
LOAD
VCC = 7 V 30 35 ns VCC = 7 V 15 25 ns
–2–
REV. 0
ADP3414
IN
VCC
BST
NC
DRVH
SW
DRVL
PGND
8
7
6
5
NC = NO CONNECT
ADP3414
TOP VIEW
(Not To Scale)
1
2
3
4

ABSOLUTE MAXIMUM RATINGS*

VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +8 V
BST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +30 V
BST to SW . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +8 V
SW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –5.0 V to +25 V
IN . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to VCC + 0.3 V
Model Range Description Option
ADP3414JR 0°C to 70°C 8-Lead Standard SO-8

ORDERING GUIDE

Temperature Package Package
Small Outline (SOIC)
Operating Ambient Temperature Range . . . . . . . 0°C to 70°C
Operating Junction Temperature Range . . . . . . 0°C to 125°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155°C/W
θ
JA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40°C/W
θ
JC
PIN CONFIGURATION
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . . 300°C
*This is a stress rating only; operation beyond these limits can cause the device to
be permanently damaged. Unless otherwise specified, all voltages are referenced to PGND.
PIN FUNCTION DESCRIPTIONS
Pin Mnemonic Function
1 BST Floating Bootstrap Supply for the Upper MOSFET. A capacitor connected between BST and SW pins
holds this bootstrapped voltage for the high-side MOSFET as it is switched. The capacitor should be
chosen between 100 nF and 1 F. 2 IN TTL-level Input Signal, which has primary control of the drive outputs. 3 NC No Connection. 4 VCC Input Supply. This pin should be bypassed to PGND with ~1 µF ceramic capacitor. 5 DRVL Synchronous Rectifier Drive. Output drive for the lower (synchronous rectifier) MOSFET. 6 PGND Power Ground. Should be closely connected to the source of the lower MOSFET. 7 SW This pin is connected to the buck-switching node, close to the upper MOSFETs source. It is the floating
return for the upper MOSFET drive signal. It is also used to monitor the switched voltage to prevent turn-
on of the lower MOSFET until the voltage is below ~1 V. Thus, according to operating conditions, the
high-low transition delay is determined at this pin. 8 DRVH Buck Drive. Output drive for the upper (buck) MOSFET.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although
WARNING!
the ADP3414 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
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–3–
ESD SENSITIVE DEVICE
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