Input voltage: 4.5 V to 20 V
Integrated 44 mΩ high-side MOSFET
0.6 V ± 1% reference voltage over temperature
Continuous output current: 6 A
Programmable switching frequency: 250 kHz to 1.4 MHz
Synchronizes to external clock: 250 kHz to 1.4 MHz
180° out-of-phase synchronization
Programmable UVLO
Power-good output
External compensation
Internal soft start with external adjustable option
Startup into a precharged output
Supported by ADIsimPower design tool
APPLICATIONS
Communication infrastructure
Networking and servers
Industrial and instrumentation
Healthcare and medical
Intermediate power rail conversion
DC-to-dc point of load application
20 V, 6 A Synchronous Step-Down
TYPICAL APPLICATIONS CIRCUIT
Figure 1.
GENERAL DESCRIPTION
The ADP2381 is a current mode control, synchronous, stepdown, dc-to-dc regulator. It integrates a 44 mΩ power MOSFET
and a low-side driver to provide a high efficiency solution. The
ADP2381 runs from an input voltage of 4.5 V to 20 V and can
deliver 6 A of output current. The output voltage can be
adjusted to 0.6 V to 90% of the input voltage. The switching
frequency of the ADP2381 can be programmed from
250 kHz to 1.4 MHz or fixed at 290 kHz or 550 kHz. The
synchronization function allows the switching frequency to be
synchronized to an external clock to minimize system noise.
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
External compensation and an adjustable soft start provide
design flexibility. The power-good output provides simple and
reliable power sequencing. Additional features include
programmable undervoltage lockout (UVLO), overvoltage
protection (OVP), overcurrent protection (OCP), and thermal
shutdown (TSD).
The ADP2381 operates over the −40°C to +125°C junction
temperature range and is available in a 16-lead TSSOP_EP
package.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Figure 2. ADP2381 Efficiency vs. Output Current, V
= 12 V, fSW = 250 kHz
IN
www.analog.com
ADP2381 Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Synchronization Range 250 1400 kHz
SYNC Minimum Pulse Width 100 ns
SYNC Minimum Off Time 100 ns
SYNC Input High Voltage 1.3 V
SYNC Input Low Voltage 0.4 V
EN/SS
Enable Threshold 0.5 V
Internal Soft Start 1500 Clock cycles
SS Pin Pull-Up Current I
2.6 3.3 4 µA
Rev. 0 | Page 3 of 28
ADP2381 Data Sheet
PGOOD from high to low
16 Clock cycles
PGOOD
PGOOD
THERMAL
Parameter Symbol Test Conditions/Comments Min Typ Max Unit
POWER GOOD (PGOOD)
PGOOD Range FB rising threshold 95 %
FB falling threshold 90 %
PGOOD Deglitch Time PGOOD from low to high 1024 Clock cycles
PGOOD Leakage Current V
PGOOD Output Low Voltage I
= 5 V 0.01 0.1 µA
= 1 mA 125 200 mV
UVLO
Rising Threshold 1.2 1.28 V
Falling Threshold 1.02 1.1 V
BST VSW + 6 V
UVLO, FB, EN/SS, COMP, SYNC, RT
VREG, LD −0.3 V to +12 V
PGND to GND −0.3 V to +0.3 V
Operating Junction Temperature Range −40°C to +125°C
Soldering Conditions JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
−0.3 V to +6 V
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages are
referenced to GND.
THERMAL INFORMATION
Table 3. Thermal Resistance
16-lead TSSOP_EP 39.48 °C/W
θJA is specified for the worst-case conditions, that is, a device
soldered in circuit board (4-layer, JEDEC standard board) for
surface-mount packages.
ESD CAUTION
Rev. 0 | Page 5 of 28
ADP2381 Data Sheet
OUT
12
VREG
Internal 8 V Regulator Output. Place a 1 µF ceramic capacitor between this pin and GND.
TOP VIEW
(Not to S cale)
1
2
3
4
5
6
7
8
ADP2381
16
15
14
13
12
11
10
9
PVIN
UVLO
PGOOD
EN/SS
SYNC
RT
PVIN
SW
SW
LD
GND
COMPFB
PGND
VREG
BST
10209-003
NOTES
1. THE EXPOSED PAD SHOULD BE SOLDERED
TO AN EXT E RNAL GROUND PLANE UNDE RNE ATH
THE IC FOR THERMAL DISSIPATION.
PIN CONFIGURATION AND FUNCTION DESCRIPTION
Figure 3. Pin Configuration (Top View)
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1, 2 PVIN Power Input. Connect to the input power source and connect a bypass capacitor between this pin and
PGND.
3 UVLO Undervoltage Lockout Pin. An external resistor divider can be used to set the turn-on threshold.
4 PGOOD Power-Good Output (Open Drain). A pull-up resistor of 10 kΩ to 100 kΩ is recommended.
5 RT Frequency Setting. Connect a resistor between RT and GND to program the switching frequency
between 250 kHz and 1.4 MHz. If the RT pin is connected to GND, the switching frequency is set to 290
kHz. If the RT pin is open, the switching frequency is set to 550 kHz.
6 SYNC Synchronization Input. Connect this pin to an external clock to synchronize the switching frequency
between 250 kHz and 1.4 MHz (see the Oscillator section and the Synchronization section for details).
7 EN/SS Enable Pin (EN). When this pin voltage falls below 0.5 V, the regulator is disabled.
Soft Start (SS). This pin can also be used to set the soft start time.
Connect a capacitor from SS to GND to program the slow soft start time. If this pin is open, the regulator
is enabled and uses the internal soft start.
8 COMP Error Amplifier Output. Connect an RC network from COMP to FB.
9 FB Feedback Voltage Sense Input. Connect to a resistor divider from V
.
10 GND Analog Ground. Connect to the ground plane.
11 PGND Power Ground. Connect to the source of the synchronous N-channel MOSFET.
13 LD Low-Side Gate Driver Output. Connect this pin to the gate of the synchronous N-MO SFET.
14, 15 SW Switch Node Output. Connect this pin to the output inductor.
16 BST Supply Rail for the High-Side Gate Drive. Place a 0.1 µF ceramic capacitor between SW and BST.
17 EPAD The exposed pad should be soldered to an external ground plane underneath the IC for thermal