Maximum output current: 1.2 A
Input voltage range: 1.6 V to 3.6 V
Low shutdown current: <2 µA
Very low dropout voltage: 105 mV @ 1.2 A load
Initial accuracy: ±1%
Accuracy over line, load, and temperature: ±2%
7 fixed output voltage options with soft start
0.75 V to 2.5 V (ADP1754)
Adjustable output voltage option with soft star t
0.75 V to 3.0 V (ADP1755)
High PSRR
65 dB @ 1 kHz
65 dB @ 10 kHz
54 dB @ 100 kHz
23 V rms at 0.75 V output
Stable with small 4.7 µF ceramic output capacitor
Excellent load and line transient response
Current-limit and thermal overload protection
Power-good indicator
Logic-controlled enable
Reverse current protection
APPLICATIONS
Server computers
Memory components
Telecommunications equipment
Network equipment
DSP/FPGA/microprocessor supplies
Instrumentation equipment/data acquisition systems
Linear Regulator
ADP1754/ADP1755
TYPICAL APPLICATION CIRCUITS
= 1.8
IN
4.7µF
100kΩ
PG
1
2
3
4
VIN
VIN
VIN
EN
16
VIN
VIN
ADP1754
TOP VIEW
(Not to Scale)
GND
PG
5
15
6
Figure 1. ADP1754 with Fixed Output Voltage, 1.5 V
= 1.8
IN
4.7µF
100kΩ
PG
1
2
3
4
VIN
VIN
VIN
EN
16
VIN
ADP1755
TOP VIEW
(Not to Scale)
GND
PG
5
15
VIN
6
Figure 2. ADP1755 with Adjustable Output Voltage, 0.75 V to 3.0 V
VOUT
14
VOUT
SS
7
14
SS
7
10nF
10nF
13
VOUT
VOUT
VOUT
VOUT
ADJ
NC
8
13
VOUT
VOUT
VOUT
VOUT
SENSE
NC
8
12
11
10
9
= 0.5V(1 + R1/R2)
OUT
12
11
10
9
R1
R2
OUT
4.7µF
= 1.5
4.7µF
07722-001
07722-002
GENERAL DESCRIPTION
The ADP1754/ADP1755 are low dropout (LDO) CMOS linear
regulators that operate from 1.6 V to 3.6 V and provide up to
1.2 A of output current. These low V
LDOs are ideal for
IN/VOUT
regulation of nanometer FPGA geometries operating from 2.5 V
down to 1.8 V I/O rails, and for powering core voltages down to
0.75 V. Using an advanced proprietary architecture, the ADP1754/
ADP1755 provide high power supply rejection ratio (PSRR) and
low noise, and achieve excellent line and load transient response
with only a small 4.7 µF ceramic output capacitor.
The ADP1754 is available in seven fixed output voltage options.
The ADP1755 is the adjustable version, which allows output
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
voltages that range from 0.75 V to 3.0 V via an external divider.
The ADP1754/ADP1755 allow an external soft start capacitor
to be connected to program the startup. A digital power-good
output allows power system monitors to check the health of the
output voltage.
The ADP1754/ADP1755 are available in a 16-lead, 4 mm × 4 mm
LFCSP, making them not only very compact solutions, but also
providing excellent thermal performance for applications that
require up to 1.2 A of output current in a small, low profile
footprint.
Changes to Table 3 ............................................................................ 5
10/08—Revision 0: Initial Version
Rev. B | Page 2 of 20
ADP1754/ADP1755
SPECIFICATIONS
VIN = (V
Table 1.
Parameter Symbol Test Conditions/Comments Min Typ Max Unit
INPUT VOLTAGE RANGE VIN T
OPERATING SUPPLY CURRENT1 I
I
I
I
I
SHUTDOWN CURRENT I
OUTPUT VOLTAGE ACCURACY
Fixed Output Voltage Accuracy
Adjustable Output Voltage Accuracy
LINE REGULATION V
LOAD REGULATION3 V
DROPOUT VOLTAGE4 V
I
I
I
START-UP TIME5 t
C
CURRENT-LIMIT THRESHOLD6 I
THERMAL SHUTDOWN
Thermal Shutdown Threshold TSSD T
Thermal Shutdown Hysteresis TS
PG OUTPUT LOGIC LEVEL
PG Output Logic High PG
PG Output Logic Low PG
PG Output Delay from EN Transition
Low to High
PG OUTPUT THRESHOLD
Output Voltage Falling PG
Output Voltage Rising PG
EN INPUT
EN Input Logic High VIH 1.6 V ≤ VIN ≤ 3.6 V 1.2 V
EN Input Logic Low VIL 1.6 V ≤ VIN ≤ 3.6 V 0.4 V
EN Input Leakage Current V
UNDERVOLTAGE LOCKOUT UVLO
Input Voltage Rising UVLO
Input Voltage Falling UVLO
Hysteresis UVLO
SOFT START CURRENT ISS 1.6 V ≤ VIN ≤ 3.6 V
ADJ INPUT BIAS CURRENT (ADP1755) ADJ
SENSE INPUT BIAS CURRENT SNS
+ 0.4 V) or 1.6 V (whichever is greater), I
OUT
(ADP1754)
2
(ADP1755)
= 10 mA, CIN = C
OUT
= −40°C to +125°C 1.6 3.6 V
J
I
GND
GND-SD
= 500 A
OUT
= 100 mA
OUT
= 100 mA, TJ = −40°C to +125°C
OUT
= 1.2 A
OUT
= 1.2 A, TJ = −40°C to +125°C
OUT
EN = GND,
VIN = 1.6 V
EN = GND, VIN = 1.6 V, TJ = −40°C to +85°C
EN = GND, VIN = 3.6 V, TJ = −40°C to +85°C
I
V
OUT
I
10 mA < I
I
V
ADJ
I
10 mA < I
/VIN VIN = (V
OUT
/I
OUT
OUT
I
DROPOUT
CSS = 0 nF, I
START-UP
1.5 2 5 A
LIMIT
15
SD-HYS
1.6 V ≤ VIN ≤ 3.6 V, IOH < 1 µA 1.0 V
HIGH
1.6 V ≤ VIN ≤ 3.6 V, IOL < 2 mA 0.4 V
LOW
1.6 V ≤ V
1.6 V ≤ VIN ≤ 3.6 V −10 %
FAL L
1.6 V ≤ VIN ≤ 3.6 V −6.5 %
RISE
EN = VIN or GND 0.1 1 µA
I-LEAKAGE
TJ = −40°C to +125°C
RISE
TJ = −40°C to +125°C
FAL L
TJ = 25°C
HYS
= 10 mA −1 +1 %
OUT
= 10 mA to 1.2 A −1.5 +1.5 %
OUT
< 1.2 A, TJ = −40°C to +125°C −2 +2 %
OUT
= 10 mA 0.495 0.5 0.505 V
OUT
= 10 mA to 1.2 A 0.495 0.505 V
OUT
< 1.2 A, TJ = −40°C to +125°C 0.490 0.510 V
OUT
+ 0.4 V) to 3.6 V, TJ = −40°C to +125°C −0.3 +0.3 %/V
OUT
I
= 10 mA to 1.2 A, TJ = −40°C to +125°C 0.6 %/A
OUT
= 100 mA, V
OUT
= 100 mA, V
OUT
= 1.2 A, V
OUT
= 1.2 A, V
OUT
= 10 nF, I
SS
rising 150
J
OUT
OUT
OUT
OUT
≤ 3.6 V, CSS = 10 nF 5.5 ms
IN
= 4.7 µF, TA = 25°C, unless otherwise noted.
OUT
90
400
800
1.1
1.4
µA
µA
µA
mA
mA
2 6 µA
30 µA
100 µA
≥ 1.8 V 10 mV
OUT
≥ 1.8 V, TJ = −40°C to +125°C 16 mV
OUT
≥ 1.8 V 105 mV
≥ 1.8 V, TJ = −40°C to +125°C 200 mV
= 10 mA 200 µs
= 10 mA 5.2 ms
°C
°C
1.58 V
1.25 V
100 mV
0.6 0.9 1.2 µA
1.6 V ≤ VIN ≤ 3.6 V, TJ = −40°C to +125°C 10 150 nA
I-BIAS
1.6 V ≤ VIN ≤ 3.6 V 10 µA
I-BIAS
Rev. B | Page 3 of 20
ADP1754/ADP1755
Parameter Symbol Test Conditions/Comments Min Typ Max Unit
OUTPUT NOISE OUT
10 Hz to 100 kHz, V
POWER SUPPLY REJECTION RATIO PSRR VIN = V
1 kHz, V
1 kHz, V
10 kHz, V
10 kHz, V
100 kHz, V
100 kHz, V
1
Minimum output load current is 500 A.
2
Accuracy when VOUT is connected directly to ADJ. When VOUT voltage is set by external feedback resistors, absolute accuracy in adjust mode depends on the
tolerances of resistors used.
3
Based on an end-point calculation using 10 mA and 1.2 A loads. See for typical load regulation performance. Figure 6
4
Dropout voltage is defined as the input to output voltage differential when the input voltage is set to the nominal output voltage. This applies only to output voltages
above 1.6 V.
5
Start-up time is defined as the time between the rising edge of EN to V
6
Current-limit threshold is defined as the current at which the output voltage drops to 90% of the specified typical value. For example, the current limit for a 1.0 V
output voltage is defined as the current that causes the output voltage to drop to 90% of 1.0 V, or 0.9 V.
INPUT AND OUTPUT CAPACITOR, RECOMMENDED SPECIFICATIONS
Table 2.
Parameter Symbol Test Conditions/Comments Min Typ Max Unit
MINIMUM INPUT AND OUTPUT CAPACITANCE1 C
CAPACITOR ESR R
1
The minimum input and output capacitance should be greater than 3.3 µF over the full range of operating conditions. The full range of operating conditions in the
application must be considered during device selection to ensure that the minimum capacitance specification is met. X7R and X5R type capacitors are recommended;
Y5V and Z5U capacitors are not recommended for use with this LDO.
10 Hz to 100 kHz, V
NOISE
+ 1 V, I
OUT
OUT
OUT
OUT
OUT
being at 95% of its nominal value.
OUT
TA = −40°C to +125°C 3.3 µF
MIN
T
ESR
= 0.75 V 23 µV rms
OUT
= 2.5 V 65 µV rms
OUT
= 10 mA
OUT
= 0.75 V 65 dB
= 2.5 V 56 dB
= 0.75 V 65 dB
= 2.5 V 56 dB
= 0.75 V 54 dB
OUT
= 2.5 V 51 dB
OUT
= −40°C to +125°C 0.001 0.1 Ω
A
Rev. B | Page 4 of 20
ADP1754/ADP1755
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
VIN to GND −0.3 V to +3.6 V
VOUT to GND −0.3 V to +3.6 V
EN to GND −0.3 V to +3.6 V
SS to GND −0.3 V to +3.6 V
PG to GND −0.3 V to +3.6 V
SENSE/ADJ to GND −0.3 V to +3.6 V
Storage Temperature Range −65°C to +150°C
Operating Junction Temperature Range −40°C to +125°C
Soldering Conditions JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL DATA
Absolute maximum ratings apply individually only, not in
combination. The ADP1754/ADP1755 may be damaged if the
junction temperature limits are exceeded. Monitoring ambient
temperature does not guarantee that T
temperature limits. In applications with high power dissipation
and poor thermal resistance, the maximum ambient temperature
may need to be derated. In applications with moderate power
dissipation and low PCB thermal resistance, the maximum
ambient temperature can exceed the maximum limit as long
as the junction temperature is within specification limits.
The junction temperature (T
ambient temperature (T
(P
), and the junction-to-ambient thermal resistance of the
D
package (θ
). TJ is calculated using the following formula:
JA
T
= TA + (PD × θJA)
J
) of the device is dependent on the
J
), the power dissipation of the device
A
is within the specified
J
Junction-to-ambient thermal resistance (θ
based on modeling and calculation using a 4-layer board. The
junction-to-ambient thermal resistance is highly dependent
on the application and board layout. In applications where high
maximum power dissipation exists, close attention to thermal
board design is required. The value of θ
on PCB material, layout, and environmental conditions. The
specified values of θ
board. Refer to JEDEC JESD51-7 for detailed information about
board construction. For more information, see the AN-772
Application Note, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP), at www.analog.com.
Ψ
is the junction-to-board thermal characterization parameter
JB
with units of °C/W. Ψ
calculation using a 4-layer board. The JESD51-12 document,
Guidelines for Reporting and Using Electronic Package Thermal
Information, states that thermal characterization parameters are
not the same as thermal resistances. Ψ
power flowing through multiple thermal paths rather than through
a single path as in thermal resistance, θ
paths include convection from the top of the package as well as
radiation from the package, factors that make Ψ
real-world applications. Maximum junction temperature (T
is calculated from the board temperature (T
dissipation (P
= TB + (PD × ΨJB)
T
J
Refer to the JEDEC JESD51-8 and JESD51-12 documents for more
detailed information about Ψ
THERMAL RESISTANCE
θJAand ΨJB are specified for the worst-case conditions, that is, a
device soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type θJA ΨJB Unit
16-Lead LFCSP with Exposed Pad (CP-16-4) 42 25.5 °C/W
are based on a 4-layer, 4 in × 3 in circuit
JA
of the package is based on modeling and
JB
) using the following formula:
D
.
JB
) of the package is
JA
may vary, depending
JA
measures the component
JB
. Therefore, ΨJB thermal
JB
more useful in
JB
) and the power
B
)
J
ESD CAUTION
Rev. B | Page 5 of 20
ADP1754/ADP1755
T
T
2
T
T
2
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
VOU
VIN
VIN
VOU
14
13
15
16
PIN 1
INDICATO R
1VIN
2VIN
ADP1754
3VIN
TOP VIEW
(Not to Scale)
4EN
5
6
PG
NOTES
1. NC = NO CONNECT.
. THE EXPOS ED PAD ON THE BOTTOM O F THE LFCSP ENHANCES
THERMAL PERFORMANCE AND IS ELECTRICALLY CONNECTED TO GND
INSIDE THE PACKAGE. IT IS RECOMMENDED THAT THE EXP OSED PAD
BE CONNECTED TO THE GROUND PL ANE ON THE BOARD.
GND
7
SS
8
C
N
12 VOUT
11 VOUT
10 VOUT
9SENSE
1VIN
2VIN
ADP1755
3VIN
TOP VIEW
(Not to Scale)
4EN
NOTES
1. NC = NO CONNECT.
. THE EXPOS ED PAD ON THE BOTTOM O F THE LFCSP ENHANCES
THERMAL PERFORMANCE AND IS ELECTRICALLY CONNECTED TO GND
INSIDE THE PACKAGE. IT IS RECOMMENDED THAT THE EXP OSED PAD
Regulator Input Supply. Bypass VIN to GND with a 4.7 µF or greater capacitor. Note that all five
VIN pins must be connected to the source.
Enable Input. Drive EN high to turn on the regulator; drive it low to turn off the regulator. For
automatic startup, connect EN to VIN.
5 5 PG
Power Good. This open-drain output requires an external pull-up resistor to VIN. If the part is in
shutdown mode, current-limit mode, thermal shutdown, or if it falls below 90% of the nominal
output voltage, PG immediately transitions low.
6 6 GND Ground.
7 7 SS Soft Start. A capacitor connected to this pin determines the soft start time.
8 8 NC Not Connected. No internal connection.
9 N/A SENSE
Sense. This pin measures the actual output voltage at the load and feeds it to the error
amplifier. Connect SENSE as close as possible to the load to minimize the effect of IR drop
between the regulator output and the load.
N/A 9 ADJ Adjust. A resistor divider from VOUT to ADJ sets the output voltage.
10, 11, 12,
13, 14
10, 11, 12,
13, 14
17 (EPAD) 17 (EPAD)
VOUT
Exposed
paddle
(EPAD)
Regulated Output Voltage. Bypass VOUT to GND with a 4.7 µF or greater capacitor. Note that all
five VOUT pins must be connected to the load.
The exposed pad on the bottom of the LFCSP package enhances thermal performance and is
electrically connected to GND inside the package. It is recommended that the exposed pad be
connected to the ground plane on the board.
07722-004
Rev. B | Page 6 of 20
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