ANALOG DEVICES ADP1740 Service Manual

2 A, Low VIN, Low Dropout
V
V
V
V
V
V
V
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FEATURES

Maximum output current: 2 A Input voltage range: 1.6 V to 3.6 V Low shutdown current: 2 µA Low dropout voltage: 160 mV @ 2 A load Initial accuracy: ±1% Accuracy over line, load, and temperature: ±2% 7 fixed output voltage options with soft start:
0.75 V to 2.5 V (ADP1740)
Adjustable output voltage options with soft start:
0.75 V to 3.0 V (ADP1741)
High PSRR
65 dB @ 1 kHz 65 dB @ 10 kHz
54 dB @ 100 kHz 23 V rms at 0.75 V output Stable with small 4.7 µF ceramic output capacitor Excellent load and line transient response Current-limit and thermal overload protection Power-good indicator Logic-controlled enable Reverse current protection

APPLICATIONS

Server computers Memory components Telecommunications equipment Network equipment DSP/FPGA/microprocessor supplies Instrumentation equipment/data acquisition systems
Linear Regulator
ADP1740/ADP1741

TYPICAL APPLICATION CIRCUITS

= 1.8
IN
4.7µF 4.7µF
100k
PG
1
2
3
4
VIN
VIN
VIN
EN
16
VIN
VIN
ADP1740
TOP VIEW
(Not to Scale)
GND
PG
5
15
6
14
VOUT
SS
7
VOUT
10nF
13
VOUT
VOUT
VOUT
SENSE
NC
8
12
11
10
9
Figure 1. ADP1740 with Fixed Output Voltage, 1.5 V
= 1.8
IN
4.7µF 4.7µF
100k
PG
1
2
3
4
VIN
VIN
VIN
EN
16
VIN
ADP1741
TOP VIEW
(Not to Scale)
GND
PG
5
15
VIN
6
13
14
VOUT VOUT
VOUT
VOUT
VOUT
ADJ
NC
SS
8
7
10nF
12
11
10
9
Figure 2. ADP1741 with Adjustable Output Voltage, 0.75 V to 3.0 V
= 0.5V(1 + R1/R2)
OUT
R1
R2
OUT
= 1.5
07081-001
07081-002

GENERAL DESCRIPTION

The ADP1740/ADP1741 are low dropout (LDO) CMOS linear regulators that operate from 1.6 V to 3.6 V and provide up to 2 A of output current. These low V lation of nanometer FPGA geometries operating from 2.5 V down to 1.8 V I/O rails, and for powering core voltages down to 0.75 V. Using an advanced, proprietary architecture, the ADP1740/ ADP1741 provide high power supply rejection ratio (PSRR) and low noise, and achieve excellent line and load transient response with only a small 4.7 µF ceramic output capacitor.
The ADP1740 is available in seven fixed output voltage options. The ADP1741 is an adjustable version that allows output
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
LDOs are ideal for regu-
IN/VOUT
voltages ranging from 0.75 V to 3.0 V via an external divider. The ADP1740/ADP1741 allow an external soft start capacitor to be connected to program the startup. A digital power-good output allows power system monitors to check the health of the output voltage.
The ADP1740/ADP1741 are available in a 16-lead, 4 mm × 4 mm LFCSP, making them not only very compact solutions, but also providing excellent thermal performance for applica­tions that require up to 2 A of output current in a small, low profile footprint.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2008 Analog Devices, Inc. All rights reserved.
ADP1740/ADP1741
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TABLE OF CONTENTS

Features .............................................................................................. 1
Applications ....................................................................................... 1
Typical Application Circuits ............................................................ 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Input and Output Capacitor, Recommended Specifications .. 4
Absolute Maximum Ratings ............................................................ 5
Thermal Data ................................................................................ 5
Thermal Resistance ...................................................................... 5
ESD Caution .................................................................................. 5
Pin Configurations and Function Descriptions ........................... 6
Typical Performance Characteristics ............................................. 7

REVISION HISTORY

10/08—Revision 0: Initial Version
Theory of Operation ...................................................................... 11
Soft Start Function ..................................................................... 11
Adjustable Output Voltage (ADP1741) ................................... 12
Enable Feature ............................................................................ 12
Power-Good Feature .................................................................. 12
Reverse Current Protection Feature ........................................ 13
Applications Information .............................................................. 14
Capacitor Selection .................................................................... 14
Undervoltage Lockout ............................................................... 15
Current-Limit and Thermal Overload Protection ................. 15
Thermal Considerations ............................................................ 15
PCB Layout Considerations ...................................................... 17
Outline Dimensions ....................................................................... 19
Ordering Guide .......................................................................... 19
Rev. 0 | Page 2 of 20
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SPECIFICATIONS

VIN = (V
Table 1.
Parameter Symbol Test Conditions/Comments Min Typ Max Unit
INPUT VOLTAGE RANGE VIN T OPERATING SUPPLY CURRENT I I I I SHUTDOWN CURRENT I EN = GND, VIN = 1.6 V, TJ = −40°C to +85°C 30 µA EN = GND, VIN = 3.6 V, TJ = −40°C to +85°C 100 µA OUTPUT VOLTAGE ACCURACY
Fixed Output Voltage Accuracy
Adjustable Output Voltage
LINE REGULATION V LOAD REGULATION DROPOUT VOLTAGE I I I START-UP TIME C CURRENT-LIMIT THRESHOLD THERMAL SHUTDOWN
Thermal Shutdown Threshold TSSD T
Thermal Shutdown Hysteresis TS
PG OUTPUT LOGIC LEVEL
PG Output Logic High PG
PG Output Logic Low PG
PG Output Delay from EN
PG OUTPUT THRESHOLD
Output Voltage Falling PG
Output Voltage Rising PG
EN INPUT
EN Input Logic High VIH 1.6 V VIN ≤ 3.6 V 1.2 V
EN Input Logic Low VIL 1.6 V VIN ≤ 3.6 V 0.4 V
EN Input Leakage Current V
UNDERVOLTAGE LOCKOUT UVLO
Input Voltage Rising UVLO
Input Voltage Falling UVLO
Hysteresis UVLO
SOFT START CURRENT ISS 1.6 V VIN 3.6 V 0.6 0.9 1.2 µA ADJ INPUT BIAS CURRENT
(ADP1741)
+ 0.4 V) or 1.6 V (whichever is greater), I
OUT
1
I
GND
GND-SD
V
(ADP1740)
OUT
I 10 mA < I V
Accuracy (ADP1741)
2
ADJ
I 10 mA < I
3
V
4
V
5
t
6
I
DROPOUT
START-UP
LIMIT
1.6 V V
Transition, Low to High
I-LEAKAGE
ADJ
= 100 mA, CIN = C
OUT
= −40°C to +125°C 1.6 3.6 V
J
I
= 500 µA 90 µA
OUT
= 100 mA 400 µA
OUT
= 100 mA, TJ = −40°C to +125°C 800 µA
OUT
= 2 A 1.5 mA
OUT
= 2 A, TJ = −40°C to +125°C 1.8 mA
OUT
= 4.7 µF, TA = 25°C, unless otherwise noted.
OUT
EN = GND, VIN = 3.6 V 2 6 µA
I
I
/VIN VIN = (V
OUT
/I
OUT
OUT
I
= 100 mA −1 +1 %
OUT
= 10 mA to 2 A −1.5 +1.5 %
OUT
< 2 A, TJ = −40°C to +125°C −2 +2 %
OUT
= 100 mA 0.495 0.5 0.505 V
OUT
= 10 mA to 2 A 0.492 0.508 V
OUT
< 2 A, TJ = −40°C to +125°C 0.490 0.510 V
OUT
+ 0.4 V) to 3.6 V, TJ = −40°C to +125°C −0.3 +0.3 %/V
OUT
I
= 10 mA to 2 A, TJ = −40°C to +125°C 0.5 %/A
OUT
= 100 mA, V
OUT
= 100 mA, V
OUT
= 2 A, V
OUT
= 2 A, V
OUT
CSS = 0 nF, I
= 10 nF, I
SS
≥ 1.8 V 10 mV
OUT
≥ 1.8 V, TJ = −40°C to +125°C 18 mV
OUT
1.8 V 160 mV
OUT
≥ 1.8 V, TJ = −40°C to +125°C 280 mV
OUT
= 10 mA 200 µs
OUT
= 10 mA 5.2 ms
OUT
2.4 3 5 A
rising 150
J
15
SD-HYS
1.6 V VIN ≤ 3.6 V, IOH < 1 µA 1.0 V
HIGH
1.6 V VIN ≤ 3.6 V, IOL < 2 mA 0.4 V
LOW
≤ 3.6 V, CSS = 10 nF 5.5 ms
IN
1.6 V VIN ≤ 3.6 V −10 %
FAL L
1.6 V VIN ≤ 3.6 V −6.5 %
RISE
°C °C
EN = VIN or GND 0.1 1 µA
1.58 V
RISE
1.25 V
FAL L
100 mV
HYS
1.6 V VIN ≤ 3.6 V, TJ = −40°C to +125°C 10 150 nA
I-BIAS
Rev. 0 | Page 3 of 20
ADP1740/ADP1741
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Parameter Symbol Test Conditions/Comments Min Typ Max Unit
1.6 V VIN ≤ 3.6 V 10 µA
SENSE INPUT BIAS CURRENT
(ADP1740) OUTPUT NOISE OUT 10 Hz to 100 kHz, V POWER SUPPLY REJECTION RATIO PSRR VIN = V 1 kHz, V 1 kHz, V 10 kHz, V 10 kHz, V 100 kHz, V 100 kHz, V
1
Minimum output load current is 500 A.
2
Accuracy when VOUT is connected directly to ADJ. When VOUT voltage is set by external feedback resistors, absolute accuracy in adjust mode depends on the tolerances
of the resistors used.
3
Based on an endpoint calculation using 10 mA and 2 A loads. See for typical load regulation performance. Figure 6
4
Dropout voltage is defined as the input to output voltage differential when the input voltage is set to the nominal output voltage. This applies only to output voltages
above 1.6 V.
5
Start-up time is defined as the time between the rising edge of EN to V
6
Current-limit threshold is defined as the current at which the output voltage drops to 90% of the specified typical value. For example, the current limit for a 1.0 V
output voltage is defined as the current that causes the output voltage to drop to 90% of 1.0 V, or 0.9 V.

INPUT AND OUTPUT CAPACITOR, RECOMMENDED SPECIFICATIONS

SNS
I-BIAS
10 Hz to 100 kHz, V
NOISE
OUT
OUT
OUT
= 0.75 V 23 µV rms
OUT
= 2.5 V 65 µV rms
OUT
+ 1 V, I
= 10 mA
OUT
= 0.75 V 65 dB = 2.5 V 56 dB
= 0.75 V 65 dB
OUT
= 2.5 V 56 dB
OUT
= 0.75 V 54 dB
OUT
= 2.5 V 51 dB
OUT
being at 95% of its nominal value.
OUT
Table 2.
Parameter Symbol Test Conditions/Comments Min Typ Max Unit
MINIMUM INPUT AND OUTPUT CAPACITANCE CAPACITOR ESR R
1
The minimum input and output capacitance should be greater than 3.3 µF over the full range of operating conditions. The full range of operating conditions in the
application must be considered during capacitor selection to ensure that the minimum capacitance specification is met. X7R and X5R type capacitors are recommended; Y5V and Z5U capacitors are not recommended for use with this LDO.
1
C
T
MIN
T
ESR
= –40°C to +125°C 3.3 µF
A
= –40°C to +125°C 0.001 0.1
A
Rev. 0 | Page 4 of 20
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ABSOLUTE MAXIMUM RATINGS

Table 3.
Parameter Rating
VIN to GND −0.3 V to +3.6 V VOUT to GND −0.3 V to VIN EN to GND −0.3 V to +3.6 V SS to GND −0.3 V to +3.6 V PG to GND −0.3 V to +3.6 V SENSE/ADJ to GND −0.3 V to +3.6 V Storage Temperature Range −65°C to +150°C Operating Junction Temperature Range −40°C to +125°C Soldering Conditions JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

THERMAL DATA

Absolute maximum ratings apply only individually, not in combination. The ADP1740/ADP1741 may be damaged when junction temperature limits are exceeded. Monitoring ambient temperature does not guarantee that the junction temperature is within the specified temperature limits. In applications with high power dissipation and poor PCB thermal resistance, the maximum ambient temperature may need to be derated. In applications with moderate power dissipation and low PCB thermal resistance, the maximum ambient temperature can exceed the maximum limit as long as the junction temperature is within specification limits.
The junction temperature (T ambient temperature (T
), and the junction-to-ambient thermal resistance of the
(P
D
package (θ
). TJ is calculated using the following formula:
JA
= TA + (PD × θJA)
T
J
The junction-to-ambient thermal resistance (θ
) of the device is dependent on the
J
), the power dissipation of the device
A
) of the package
JA
board design is required. The value of θ on PCB material, layout, and environmental conditions. The specified values of θ board. Refer to JEDEC JESD51-7 for detailed information about board construction. For more information, see the AN-772 Application Note, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP), at www.analog.com.
Ψ
is the junction-to-board thermal characterization parameter
JB
with units of °C/W. Ψ calculation using a 4-layer board. The JEDEC JESD51-12 document, Guidelines for Reporting and Using Electronic Package Thermal Information, states that thermal characterization parameters are not the same as thermal resistances. Ψ the component power flowing through multiple thermal paths rather than through a single path, as in thermal resistance (θ Therefore, Ψ the package, as well as radiation from the package, factors that make Ψ junction temperature (T ature (T formula:
T
= TB + (PD × ΨJB)
J
Refer to the JEDEC JESD51-8 and JESD51-12 documents for more detailed information about Ψ

THERMAL RESISTANCE

θJA and ΨJB are specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type θJA ΨJB Unit
16-Lead LFCSP with Exposed Pad 130 32.7 °C/W

ESD CAUTION

is based on modeling and calculation using a 4-layer board. The junction-to-ambient thermal resistance is highly dependent on the application and board layout. In applications where high maximum power dissipation exists, close attention to thermal
are based on a 4-layer, 4 in × 3 in circuit
JA
of the package is based on modeling and
JB
thermal paths include convection from the top of
JB
more useful in real-world applications. Maximum
JB
) is calculated from the board temper-
J
) and the power dissipation (PD) using the following
B
may vary, depending
JA
.
JB
measures
JB
).
JB
Rev. 0 | Page 5 of 20
ADP1740/ADP1741
T
T
2
T
T
2
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PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

VOU
VIN
VIN
VOU
14
13
15
16
PIN 1 INDICATO R
1VIN
2VIN
ADP1740
3VIN
TOP VIEW
(Not to Scale)
4EN
5
6
PG
NOTES
1. NC = NO CONNECT. . THE EXPOS ED PAD ON THE BOTTOM O F THE LFCSP ENHANCES
THERMAL PERFORMANCE AND IS ELECTRICALLY CONNECTED TO GND INSIDE THE PACKAGE. IT IS RECOMMENDED THAT THE EXP OSED PAD BE CONNECTED TO THE GROUND PL ANE ON THE BOARD.
GND
7
SS
8
C N
12 VOUT
11 VOUT
10 VOUT
9SENSE
1VIN
2VIN
ADP1741
3VIN
TOP VIEW
(Not to Scale)
4EN
NOTES
1. NC = NO CONNECT. . THE EXPOS ED PAD ON THE BOTTOM O F THE LFCSP ENHANCES
THERMAL PERFORMANCE AND IS ELECTRICALLY CONNECTED TO GND INSIDE THE PACKAGE. IT IS RECOMMENDED THAT THE EXP OSED PAD
07081-003
BE CONNECTED TO THE GROUND PL ANE ON THE BOARD.
VIN
VIN
15
16
PIN 1 INDICATO R
5
6
PG
GND
VOU
VOU
14
13
12 VOUT
11 VOUT
10 VOUT
9ADJ
8
7
C
SS
N
Figure 3. ADP1740 Pin Configuration Figure 4. ADP1741 Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
ADP1740 ADP1741
1, 2, 3, 15, 16 1, 2, 3, 15, 16 VIN
Mnemonic Description
Regulator Input Supply. Bypass VIN to GND with a 4.7 µF or greater capacitor. Note that all five VIN pins must be connected to the source supply.
4 4 EN
Enable Input. Drive EN high to turn on the regulator; drive it low to turn off the regulator. For automatic startup, connect EN to VIN.
5 5 PG
Power-Good Output. This open-drain output requires an external pull-up resistor to VIN. If the part is in shutdown mode, current-limit mode, or thermal shutdown, or if it falls below
90% of the nominal output voltage, the PG pin immediately transitions low. 6 6 GND Ground. 7 7 SS Soft Start Pin. A capacitor connected to this pin determines the soft start time. 8 8 NC Not Connected. No internal connection. 9 SENSE
Sense Input. This pin measures the actual output voltage at the load and feeds it to the error
amplifier. Connect the SENSE pin as close to the load as possible to minimize the effect of IR
drop between the regulator output and the load. 9 ADJ Adjust Pin. A resistor divider from VOUT to ADJ sets the output voltage. 10, 11, 12,
13, 14
10, 11, 12, 13, 14
EP EP
VOUT
Exposed pad
Regulated Output Voltage. Bypass VOUT to GND with a 4.7 µF or greater capacitor. Note that
all five VOUT pins must be connected to the load.
The exposed pad on the bottom of the LFCSP enhances thermal performance and is
electrically connected to GND inside the package. It is recommended that the exposed pad
be connected to the ground plane on the board.
07081-004
Rev. 0 | Page 6 of 20
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