ANALOG DEVICES ADP122, ADP123 Service Manual

Current, CMOS Linear Regulator

ADP122/ADP123

Rev. D

Trademarks and registered trademarks are the property of their respective owners.

Fax: [phone] ©2009–2012 Analog Devices, Inc. All rights reserved.

2

3

1

4

5

VIN = 2.3V TO 5.5V V

OUT

= 1.8V

VIN

GND

EN

VOUT

NC

C

IN

1µF

C

OUT

1µF

ADP122

08399-001

OFF

ON

VIN = 2.3V TO 5.5V V

OUT

= 0.5V(1 + R1/R2)

R1

R2

C

IN

1µF

C

OUT

1µF

08399-002

2

3

1

4

5

VIN

GND

EN

VOUT

ADJ

ADP123

OFF

ON

08399-135

NC = NOTCONNECT. THIS PIN CAN BE LEFT FLOATING
OR CONNECTED TOGROUND.

TOP VIEW

(Not to Scale)

ADP122

3

GND

1

VOUT

2

NC

4

EN

6

VIN = 2.3VTO 5.5VVOUT = 1.8V

C1
1µF

GND

ON

OFF

VIN

5

NC

C2
1µF

GND

GND

08399-136

NC = NOTCONNECT. THISPIN CAN BE LEFT FLOATING
OR

CONNECTED TO GROUND.

TOP VIEW

(Not to Scale)

ADP123

3

GND

1

VOUT

2

ADJ

4

EN

6

VIN = 2.3VTO 5.5VVOUT = 0.5V(1 + R1/R2)

C1
1µF

GND

ON

OFF

VIN

5

NC

C2
1µF

R1

R2

GND

GND

GND

Data Sheet

FEATURES

Input voltage supply range: 2.3 V to 5.5 V
300 mA maximum output current
Fixed and adjustable output voltage versions
Very low dropout voltage: 85 mV at 300 mA load
Low quiescent current: 45 µA at no load
Low shutdown current: <1 µA
Initial accuracy: ±1% accuracy
Up to 31 fixed-output voltage options available from

1.75 V to 3.3 V

Adjustable-output voltage range

0.8 V to 5.0 V (ADP123)
Excellent PSRR performance: 60 dB at 100 kHz
Excellent load/line transient response
Optimized for small 1.0 μF ceramic capacitors
Current limit and thermal overload protection
Logic controlled enable
Compact packages: 5-lead TSOT and 6-lead 2 mm × 2 mm LFCSP

APPLICATIONS

Digital camera and audio devices
Portable and battery-powered equipment
Automatic meter reading (AMR) meters
GPS and location management units
Medical instrumentation
Point-of-sale equipment

5.5 V Input, 300 mA, Low Quiescent

TYPICAL APPLICATION CIRCUITS

Figure 1. ADP122 with Fixed Output Voltage (TSOT Version)

Figure 2. ADP123 with Adjustable Output Voltage (TSOT Version)

GENERAL DESCRIPTION

The ADP122/ADP123 are low quiescent current, low dropout
linear regulators. They are designed to operate from an input
voltage between 2.3 V and 5.5 V and to provide up to 300 mA of
output current. The low 85 mV dropout voltage at a 300 mA load
improves efficiency and allows operation over a wide input
voltage range.

The low 170 μA of quiescent current at full load makes the ADP122
ideal for battery-operated portable equipment.

The ADP122 is capable of 31 fixed output voltages from 1.75 V
to 3.3 V. The ADP123 is the adjustable version of the device and
allows the output voltage to be set between 0.8 V and 5.0 V by
an external voltage divider.

The ADP122/ADP123 are specifically designed for stable operation
with tiny 1 µF ceramic input and output capacitors to meet the
requirements of high performance, space constrained applications.

Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

Figure 3. ADP122 with Fixed Output Voltage (LFCSP Version)

Figure 4. ADP123 with Adjustable Output Voltage (LFCSP Version)

The ADP122/ADP123 have an internal soft start that gives a
constant start-up time of 350 µs. Short-circuit protection and
thermal overload protection circuits prevent damage in adverse
conditions. The ADP122/ADP123 are available in a tiny, 5-lead
TSOT package and 6-lead LFCSP package for the smallest
footprint solution to meet a variety of portable applications.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: [phone]

www.analog.com

ADP122/ADP123 Data Sheet

TABLE OF CONTENTS

Features .............................................................................................. 1

Applications ....................................................................................... 1

General Description ......................................................................... 1

Typical Application Circuits ............................................................ 1

Revision History ............................................................................... 2

Specifications ..................................................................................... 3

Recommended Specifications ..................................................... 4

Absolute Maximum Ratings ............................................................ 5

Thermal Data ................................................................................ 5

Thermal Resistance ...................................................................... 5

ESD Caution .................................................................................. 5

Pin Configurations and Function Descriptions ........................... 6

Typical Performance Characteristics ............................................. 7

REVISION HISTORY

4/12—Rev. C to Rev. D

Changes to Ordering Guide ........................................................... 21

4/12—Rev. B to Rev. C

Changes to Operating Ambient Temperature Range;

Table 3 ................................................................................................. 5

3/12—Rev. A to Rev. B

Added V

Updated Outline Dimensions ....................................................... 20

6/11—Rev. 0 to Rev. A

Added 6-Lead LFCSP Package ..................................... Throughout

Added Figure 3 and Figure 4 (Renumbered Sequentially) ......... 1

= 2.8 V to Figure 23 Caption...................................... 9

OUT

Theory of Operation ...................................................................... 11

Applications Information .............................................................. 12

Capacitor Selection .................................................................... 12

Undervoltage Lockout ............................................................... 13

Enable Feature ............................................................................ 13

Current Limit and Thermal Overload Protection ................. 14

Thermal Considerations ............................................................ 14

Junction Temperature Calculations For TSOT Package ....... 15

Junction Temperature Calculations For LFCSP Package ...... 17

Printed Circuit Board Layout Considerations........................ 19

Outline Dimensions ....................................................................... 20

Ordering Guide .......................................................................... 21

Changes to Table 4 ............................................................................. 5

Changes to Pin Configuration and Function Descriptions

Section ................................................................................................. 6

Changes to Thermal Considerations Section ............................. 14

Added Junction Temperature Calculations for LFCSP Package

Section .............................................................................................. 17

Updated Outline Dimensions ...................................................... 20

Changes to Ordering Guide .......................................................... 21

10/09—Revision 0: Initial Version

Rev. D | Page 2 of 24

Data Sheet ADP122/ADP123

SPECIFICATIONS

Unless otherwise noted, VIN = (V
C

= 1.0 µF; TA = 25°C.

OUT

Table 1.

Parameter Symbol Test Conditions Min Typ Max Unit

INPUT VOLTAGE RANGE VIN 2.3 5.5 V
OPERATING SUPPLY CURRENT1 I

I
I
I
I
I
I
I

SHUTDOWN CURRENT ISD EN = GND 0.1 µA

EN = GND, TJ = −40°C to +125°C 1 µA

OUTPUT VOLTAGE ACCURACY2 V

Fixed Output I
100 µA < I

Adjustable Output I
100 µA < I

LINE REGULATION ∆V
LOAD REGULATION3 ∆V

I
ADJ INPUT BIAS CURRENT ADJ
DROPOUT VOLTAGE4 V

I

I

I

I

I

I
START-UP TIME5 t
CURRENT LIMIT THRESHOLD6 I
THERMAL SHUTDOWN

Thermal Shutdown Threshold TSSD TJ rising 150

Thermal Shutdown Hysteresis TS

EN INPUT

EN Input Logic High VIH 2.3 V ≤ VIN ≤ 5.5 V 1.2 V

EN Input Logic Low VIL 2.3 V ≤ VIN ≤ 5.5 V 0.4 V

EN Input Leakage Current V

EN = VIN or GND, TJ = −40°C to +125°C 1 µA
UNDERVOLTAGE LOCKOUT UVLO

Input Voltage Rising UVLO

Input Voltage Falling UVLO

Hysteresis UVLO

+ 0.3 V) or 2.3 V, whichever is greater; ADJ connected to VOUT; I

OUT

I

GND

OUT

/∆VIN VIN = VIN = 2.3 V to 5.5 V, TJ = −40°C to +125°C −0.05 +0.05 %/V

OUT

/∆I

OUT

OUT

2.3 V ≤ VIN ≤ 5.5 V, ADJ connected to VOUT 15 nA

I-BIAS

DROPOUT

V

STA RT-UP

350 500 650 mA

LIMIT

15

SD-HYS

EN = VIN or GND 0.1 µA

I-LEAKAGE

TJ = −40°C to +125°C 2.1 V

RISE

TJ = −40°C to +125°C 1.5 V

FAL L

TA = 25°C 125 mV

HYS

= 0 µA 45 µA

OUT

= 0 µA, TJ = −40°C to +125°C 105 µA

OUT

= 1 mA 60 µA

OUT

= 1 mA, TJ = −40°C to +125°C 120 µA

OUT

= 150 mA 130 µA

OUT

= 150 mA, TJ = −40°C to +125°C 190 µA

OUT

= 300 mA 170 µA

OUT

= 300 mA, TJ = −40°C to +125°C 240 µA

OUT

= 10 mA −1 +1 %

OUT

< 300 mA, VIN = (V

OUT

= −40°C to +125°C

= 10 mA 0.495 0.500 0.505 V

< 300 mA, VIN = 2.3 V to 5.5 V,

OUT

= −40°C to +125°C

= 1 mA to 300 mA 0.0005 %/mA
= 1 mA to 300 mA , TJ = −40°C to +125°C 0.001 %/mA

= 10 mA, V

> 2.3 V 3 mV

OUT

= 10 mA, TJ = −40°C to +125°C 5 mV
= 150 mA, V

OUT

> 2.3 V
= 150 mA, TJ = −40°C to +125°C 75 mV
= 300 mA, V

OUT

> 2.3V
= 300 mA, TJ = −40°C to +125°C 150 mV

= 3.0 V 350 µs

I

T

T

J

OUT

J

OUT

OUT

OUT

OUT

OUT

OUT

OUT

OUT

OUT

+ 0.5 V) to 5.5 V,

OUT

= 10 mA; CIN = 1.0 µF;

OUT

−2 +1.5 %

0.490 0.500 0.5075 V

45 mV

85 mV

°C
°C

Rev. D | Page 3 of 24

ADP122/ADP123 Data Sheet

10 Hz to 100 kHz, VIN = 5.5 V, V

= 4.2 V

65 µV rms

Parameter Symbol Test Conditions Min Typ Max Unit

OUTPUT NOISE OUT
10 Hz to 100 kHz, VIN = 5.5 V, V

10 Hz to 100 kHz, VIN = 5.5 V, V
10 Hz to 100 kHz, VIN = 5.5 V, V

POWER SUPPLY REJECTION RATIO PSRR 10 kHz, V

(VIN = V

+ 0.5 V) 10 kHz, V

OUT

10 kHz, V
100 kHz, V
100 kHz, V
100 kHz, V

1

The current from the external resistor divider network in the case of adjustable voltage output (as with the ADP123) should be subtracted from the ground current measured.

2

Accuracy when VOUT is connected directly to ADJ. When VOUT voltage is set by external feedback resistors, absolute accuracy in adjust mode depends on the tolerances of

the resistors used.

3

Based on an endpoint calculation using 1 mA and 300 mA loads.

4

Dropout voltage is defined as the input-to-output voltage differential when the input voltage is set to the nominal output voltage. This applies only for output voltages

greater than 2.3 V.

5

Start-up time is defined as the time between the rising edge of EN to VOUT being at 90% of its nominal value.

6

Current limit threshold is defined as the current at which the output voltage drops to 90% of the specified typical value. For example, the current limit for a 3.3 V

output voltage is defined as the current that causes the output voltage to drop to 90% of 3.3V, or 2.97 V.

10 Hz to 100 kHz, VIN = 5.5 V, V

NOISE

= 3.3 V 60 dB

OUT

= 2.5 V 60 dB

OUT

= 1.8 V 60 dB

OUT

= 3.3 V 60 dB

OUT

= 2.5 V 60 dB

OUT

= 1.8 V 60 dB

OUT

= 1.2 V 25 µV rms

OUT

= 1.8 V 35 µV rms

OUT

= 2.5 V 45 µV rms

OUT

= 3.3 V 55 µV rms

OUT

OUT

RECOMMENDED SPECIFICATIONS

Table 2.

Parameter Symbol Test Conditions Min Typ Max Unit

Minimum Input and Output

Capacitance

1

Capacitor ESR R

1

The minimum input and output capacitance should be greater than 0.70 µF over the full range of operating conditions. The full range of operating conditions in the

application must be considered during device selection to ensure that the minimum capacitance specification is met. X7R and X5R type capacitors are recommended;
Y5V and Z5U capacitors are not recommended for use with any LDO.

TA = −40°C to +125°C 0.70 µF

CAP

MIN

TA = −40°C to +125°C 0.001 1 Ω

ESR

Rev. D | Page 4 of 24

Data Sheet ADP122/ADP123

ADJ to GND

−0.3 V to +4 V

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter Rating

VIN to GND −0.3 V to +6.5 V

EN to GND −0.3 V to +6.5 V
VOUT to GND −0.3 V to VIN
Storage Temperature Range −65°C to +150°C
Operating Ambient Temperature Range −40°C to +125°C
Operating Junction Temperature −40°C to +125°C
Soldering Conditions JEDEC J-STD-020

Stresses above those listed under Absolute Maximum Ratings may
cause permanent damage to the device. This is a stress rating
only; functional operation of the device at these or any other
conditions above those indicated in the operational section of
this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in
combination. The ADP122/ADP123 can be damaged when the
junction temperature limits are exceeded. Monitoring ambient
temperature does not guarantee that T
specified temperature limits. In applications with high power
dissipation and poor thermal resistance, the maximum ambient
temperature may have to be derated.

In applications with moderate power dissipation and low PCB
thermal resistance, the maximum ambient temperature can
exceed the maximum limit as long as the junction temperature
is within specification limits. The junction temperature (T
the device is dependent on the ambient temperature (T
power dissipation of the device (P
thermal resistance of the package (θ

Maximum junction temperature (T
ambient temperature (T

) and power dissipation (PD) using the

A

formula

T

= TA + (PD × θJA)

J

The junction-to-ambient thermal resistance (θ
is based on modeling and calculation using a 4-layer board. The
junction-to-ambient thermal resistance is highly dependent on the

will remain within the

J

J

), the

A

), and the junction-to-ambient

D

).

JA

) is calculated from the

J

) of the package

JA

) of

application and board layout. In applications in which high maxi­mum power dissipation exists, close attention to thermal board
design is required. The value of θ

may vary, depending on PCB

JA

material, layout, and environmental conditions. The specified
values of θ

are based on a 4-layer, 4 inch × 3 inch circuit board.

JA

Refer to JESD51-7 for detailed information on the board
construction

Ψ

is the junction-to-board thermal characterization parameter

JB

and is measured in °C/ W. The Ψ

of the package is based on

JB

modeling and calculation using a 4-layer board. The Guidelines for
Reporting and Using Package Thermal Information: JESD51-12
states that thermal characterization parameters are not the same
as thermal resistances. Ψ

measures the component power flowing

JB

through multiple thermal paths rather than a single path as in
thermal resistance, θ

. Therefore, ΨJB thermal paths include

JB

convection from the top of the package as well as radiation from
the package—factors that make Ψ
applications. Maximum junction temperature (T
from the board temperature (T

more useful in real-world

JB

) is calculated

J

) and power dissipation (PD)

B

using the formula

T

= TB + (PD × ΨJB)

J

Refer to JESD51-8 and JESD51-12 for more detailed information
about Ψ

.

JB

THERMAL RESISTANCE

θJA and ΨJB are specified for the worst-case conditions, that is, a
device soldered in a circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type θJA ΨJB Unit

5-Lead TSOT 170 43 °C/W
6-Lead 2 mm × 2 mm LFCSP 68.9 44.1 °C/W

ESD CAUTION

Rev. D | Page 5 of 24

ADP122/ADP123 Data Sheet

ADP122

TOP VIEW

(Not to Scale)

1

VIN

2

GND

3

EN

5

VOUT

4

NC

NC = NO CONNECT

08399-004

08399-137

TOP VIEW

(Not to Scal

e)

ADP122

3

GND

1

VOUT

2

NC

4

EN

6

VIN

5

NC

NOTES

1. NC =NOT CONNECT. THIS PIN CAN BE LEFT FLOATING
OR CONNECTED TOGROUND.

2. EXPOSED PAD MUST BE CONNECTED TO GND.

ADP123

TOP VIEW

(Not to Scale)

1

VIN

2

GND

3

EN

5

VOUT

4

ADJ

08399-003

08399-138

TOP VIEW

(Not to Scale)

ADP123

3

GND

1

VOUT

2

ADJ

4

EN

6

NOTES

1. NC =NOT CONNECT. THIS PIN CAN BE LEFTFLOATING
OR CONNECTED TOGROUND.

2. EXPOSED PAD MUST BE CONNECTED TO GND.

VIN

5

NC

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

Figure 5. ADP122 TSOT Fixed Output Pin Configuration

Figure 7. ADP123 TSOT Adjustable Output Pin Configuration

Figure 6. ADP122 LFCSP Fixed Output Pin Configuration

Figure 8. ADP123 LFCSP Adjustable Output Pin Configuration

Table 5. Pin Function Descriptions

Pin No.

ADP122 ADP123

TSOT LFCSP TSOT LFCSP

Mnemonic Description

1 6 1 6 VIN Regulator Input Supply. Bypass VIN to GND with a capacitor of at least 1 µF.
2 3 2 3 GND Ground.

3 4 3 4 EN Enable Input. Drive EN high to turn on the regulator; drive EN low to turn off the

regulator. For automatic startup, connect EN to VIN.

N/A N/A 4 2 ADJ Output Voltage Adjust Input. Connect the midpoint of an external divider from VOUT to

GND to this pin to set the output voltage.

4 2, 5 N/A 5 NC No Connect. These pins are not internally bonded. They can be left floating or connected

to ground.
5 1 5 1 VOUT Regulated Output Voltage. Bypass VOUT to GND with a capacitor of at least 1 µF.
N/A EP N/A EP EPAD Exposed Pad. The exposed pad must be connected to ground.

Rev. D | Page 6 of 24

Data Sheet ADP122/ADP123

3.260

3.265

3.270

3.275

3.280

3.285

3.290

3.295

3.300

–40 –5 25 85 125

JUNCTION T E M P E RATURE (°C)

V

OUT

(V)

I

OUT

= 100µA

I

OUT

= 1mA

I

OUT

= 10mA

I

OUT

= 100mA

I

OUT

= 200mA

I

OUT

= 300mA

08399-005

3.2895

3.2900

3.2905

3.2910

3.2915

3.2920

3.2925

3.2930

3.2935

3.2940

3.2945

0.1 1 10 100 1000
I

OUT

(mA)

V

OUT

(V)

08399-006

3.284

3.286

3.288

3.290

3.292

3.294

3.296

V

IN

(V)

V

OUT

(V)

08399-007

3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4

I

OUT

= 100µA

I

OUT

= 1mA

I

OUT

= 10mA

I

OUT

= 100mA

I

OUT

= 200mA

I

OUT

= 300mA

0

50

100

150

200

250

GROUND CURRENT ( µ A)

–40 –5 25 85 125

JUNCTION T E M P E RATURE (°C)

I

OUT

= 100µA

I

OUT

= 10mA

I

OUT

= 100mA

I

OUT

= 200mA

I

OUT

= 300mA

I

OUT

= 1mA

08399-008

0

20

40

60

80

100

120

140

160

180

200

0.1 1 10 100 1000
I

OUT

(mA)

GROUND CURRENT ( µ A)

08399-009

0

20

40

60

80

100

120

140

160

180

200

3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4

V

IN

(V)

GROUND CURRENT ( µ A)

I

OUT

= 100µA

I

OUT

= 1mA

I

OUT

= 10mA

I

OUT

= 100mA

I

OUT

= 200mA

I

OUT

= 300mA

08399-010

TYPICAL PERFORMANCE CHARACTERISTICS

VIN = 3.6 V, V

= 3.3 V, I

OUT

= 10 mA, CIN = 1.0 µF, C

OUT

= 1.0 µF, TA = 25°C, unless otherwise noted.

OUT

Figure 9. Output Voltage vs. Junction Temperature

Figure 10. Output Voltage vs. Load Current

Figure 12. Ground Current vs. Junction Temperature

Figure 13. Ground Current vs. Load Current

Figure 11. Output Voltage vs. Input Voltage

Figure 14. Ground Current vs. Input Voltage

Rev. D | Page 7 of 24

ADP122/ADP123 Data Sheet

0.10

0.15

0.20

0.25

0.30

0.35

0.40

0.45

0.50

–50 –25 0 25 50 75 100 125

TEMPERATURE (°C)

SHUTDOWN CURRE NT (µA)

V

IN

= 3.6V

V

IN

= 3.8V

V

IN

= 4.2V

V

IN

= 4.4V

V

IN

= 5.0V

V

IN

= 5.2V

V

IN

= 5.4V

V

IN

= 5.5V

08399-011

0

10

20

30

40

50

60

70

1 10 100 1000

I

OUT

(mA)

DROPOUT ( mV )

08399-012

0

50

100

150

200

250

300

350

400

450

3.05 3.10 3.15 3.20 3.25 3.30 3.35 3.40 3.45
VIN (V)

I

GND

(µA)

I

OUT

= 10mA

I

OUT

= 100mA

I

OUT

= 150mA

I

OUT

= 300mA

08399-014

3.00

3.05

3.10

3.15

3.20

3.25

3.30

3.35

3.05 3.10 3.15 3.20 3.25 3.30 3.35 3.40
V

IN

(V)

V

OUT

(V)

I

OUT

= 10mA

I

OUT

= 100mA

I

OUT

= 150mA

I

OUT

= 300mA

08399-013

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10

10 100 1k 10k 100k 1M

10M

FREQUENCY ( Hz )

PSRR (dB)

I

OUT

= 100µA

V

IN

= V

OUT

+ 0.5V

V

RIPPLE

= 50mV

C

IN

= C

OUT

1µF

I

OUT

= 1mA

I

OUT

= 10mA

I

OUT

= 100mA

I

OUT

= 200mA

I

OUT

= 300mA

08399-015

–100

–90

–80

–70

–60

–50

–40

–30

–20

–10

10 100 1k 10k 100k 1M 10M

FREQUENCY ( Hz )

PSRR (dB)

I

OUT

= 100µA

V

IN

= V

OUT

+ 0.5V

V

RIPPLE

= 50mV

C

IN

= C

OUT

1µF

I

OUT

= 1mA

I

OUT

= 10mA

I

OUT

= 100mA

I

OUT

= 200mA

I

OUT

= 300mA

08399-016

Figure 15. Shutdown Current vs. Temperature at Various Input Voltages

Figure 16. Dropout Voltage vs. Load Current

Figure 18. Output Voltage vs. Input Voltage (in Dropout)

Figure 19. Power Supply Rejection Ratio v s. Frequency, V

= 2.8 V, VIN = 3.3 V

OUT

Figure 17. Ground Current vs. Input Voltage (in Dropout)

Figure 20. Power Supply Rejection Ratio v s. Frequency, V

= 3.3 V, VIN = 3.8 V

OUT

Rev. D | Page 8 of 24