Multipoint LVDS transceivers (low voltage differential
signaling driver and receiver pairs)
Switching rate: 200 Mbps (100 MHz)
Supported bus loads: 30 Ω to 55 Ω
Choice of 2 receiver types
Type 1 ( ADN4691E/ADN4693E): hysteresis of 25 mV
Type 2 ( ADN4696E/ADN4697E): threshold offset of 100 mV
for open-circuit and bus-idle fail-safe
Conforms to TIA/EIA-899 standard for M-LVDS
Glitch-free power-up/power-down on M-LVDS bus
Controlled transition times on driver output
Common-mode range: −1 V to +3.4 V, allowing
communication with 2 V of ground noise
Driver outputs high-Z when disabled or powered off
Enhanced ESD protection on bus pins
±15 kV HBM (human body model), air discharge
±8 kV HBM (human body model), contact discharge
±10 kV IEC 61000-4-2, air discharge
±8 kV IEC 61000-4-2, contact discharge
Operating temperature range: −40°C to +85°C
Available in 8-lead (ADN4691E/ADN4696E) and 14-lead
(ADN4693E/ADN4697E) SOIC packages
High Speed M-LVDS Transceivers
FUNCTIONAL BLOCK DIAGRAMS
CC
ADN4691E/
ADN4696E
ROR
RE
DE
D
DI
GND
Figure 1.
V
CC
ADN4693E/
ADN4697E
ROR
RE
DE
D
DI
GND
Figure 2.
A
B
10355-001
A
B
Z
Y
10355-002
APPLICATIONS
Backplane and cable multipoint data transmission
Multipoint clock distribution
Low power, high speed alternative to shorter RS-485 links
Networking and wireless base station infrastructure
GENERAL DESCRIPTION
The ADN4691E/ADN4693E/ADN4696E/ADN4697E are
multipoint, low voltage differential signaling (M-LVDS)
transceivers (driver and receiver pairs) that can operate at up to
200 Mbps (100 MHz). The receivers detect the bus state with a
differential input of as little as 50 mV over a common-mode
voltage range of −1 V to +3.4 V. ESD protection of up to ±15 kV
is implemented on the bus pins. The parts adhere to the
TIA/EIA-899 standard for M-LVDS and complement TIA/EIA644 LVDS devices with additional multipoint capabilities.
The ADN4691E/ADN4693E are Type 1 receivers with 25 mV of
hysteresis, so that slow-changing signals or loss of input does
not lead to output oscillations. The ADN4696E/ADN4697E are
Type 2 receivers exhibiting an offset threshold, guaranteeing the
output state when the bus is idle (bus-idle fail-safe) or the inputs are
open (open-circuit fail-safe).
A
Rev.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
The parts are available as half-duplex in an 8-lead SOIC package
(the ADN4691E/ADN4696E) or as full-duplex in a 14-lead
SOIC package (the ADN4693E/ADN4697E). A selection table
for the ADN469xE parts is shown in Ta ble 1.
Table 1. ADN469xE Selection Table
Part No. Receiver Data Rate SOIC Duplex
ADN4690E Type 1 100 Mbps 8-lead Half
ADN4691E Type 1 200 Mbps 8-lead Half
ADN4692E Type 1 100 Mbps 14-lead Full
ADN4693E Type 1 200 Mbps 14-lead Full
ADN4694E Type 2 100 Mbps 8-lead Half
ADN4695E Type 2 100 Mbps 14-lead Full
ADN4696E Type 2 200 Mbps 8-lead Half
ADN4697E Type 2 200 Mbps 14-lead Full
Changes to Receiver Input Thresholds/Fail-Safe Section
and Figure 36....................................................................................15
Changes to Ordering Guide........................................................... 17
12/11—Revision 0: Initial Version
Rev. A | Page 2 of 20
Data Sheet ADN4691E/ADN4693E/ADN4696E/ADN4697E
SPECIFICATIONS
VCC = 3.0 V to 3.6 V; RL = 50 ; TA = T
Table 2.
Parameter Symbol Min Typ Max Unit Test Conditions/Comments
DRIVER
Differential Outputs
Differential Output Voltage Magnitude |VOD| 480 650 mV See Figure 19
∆|VOD| for Complementary Output States ∆|VOD| −50 +50 mV See Figure 19
Common-Mode Output Voltage (Steady State) V
ΔV
for Complementary Output States ΔV
OC(SS)
Peak-to-Peak VOC V
Maximum Steady-State Open-Circuit Output
Voltage
Voltage Overshoot
Low to High VPH 1.2VSS V See Figure 24, Figure 27
High to Low VPL −0.2VSS V See Figure 24, Figure 27
Output Current
Short Circuit |IOS| 24 mA See Figure 22
High Impedance State, Driver Only IOZ −15 +10 μA
Power Off I
Output Capacitance CY or CZ 3 pF
Differential Output Capacitance CYZ 2.5 pF VAB = 0.4 sin(30e6πt) V,2 DE = 0 V
Output Capacitance Balance (CY/CZ) C
Logic Inputs (DI, DE)
Input High Voltage VIH 2 VCC V
Input Low Voltage VIL GND 0.8 V
Input High Current IIH 0 10 μA VIH = 2 V
Input Low Current IIL 0 10 μA VIL = 0.8 V
RECEIVER
Differential Inputs
Differential Input Threshold Voltage
Type 1 Receiver (ADN4691E, ADN4693E) VTH −50 +50 mV See Table 3, Figure 36
Type 2 Receiver (ADN4696E, ADN4697E) VTH 50 150 mV See Table 4 , Figure 36
Input Hysteresis
Type 1 Receiver (ADN4691E, ADN4693E) V
Type 2 Receiver (ADN4696E, ADN4697E) V
Differential Input Voltage Magnitude |VID| 0.05 VCC V
Input Capacitance CA or CB 3 pF
+2.4 0 +2.4 +1.2 H
0 +2.4 −2.4 +1.2 L
+3.8 +3.65 +0.15 +3.725 H
+3.8 +3.75 +0.05 +3.775 L
−1.25 −1.4 +0.15 −1.325 H
−1.35 −1.4 +0.05 −1.375 L
TIMING SPECIFICATIONS
VCC = 3.0 V to 3.6 V; TA = T
Table 5.
Parameter Symbol Min Typ Max Unit Test Conditions/Comments
DRIVER
Maximum Data Rate 200 Mbps
Propagation Delay t
Differential Output Rise/Fall Time tR, tF 1 1.6 ns See Figure 24, Figure 27
Pulse Skew |t
PHL
– t
PLH
Part-to-Part Skew2 t
Period Jitter, RMS (1 Standard Deviation)3 t
Peak-to-Peak Jitter
3, 5
Disable Time from High Level t
Disable Time from Low Level t
Enable Time to High Level t
Enable Time to Low Level t
RECEIVER
Propagation Delay t
Rise/Fall Time tR, tF 1 2.3 ns CL = 15 pF (see Figure 30, Figure 33)
Pulse Skew |t
RPHL
– t
RPLH
Type 1 Receiver (ADN4691E,
ADN4693E)
Type 2 Receiver (ADN4696E,
ADN4697E)
Part-to-Part Skew2 t
Period Jitter, RMS (1 Standard Deviation)3 t
Peak-to-Peak Jitter
3, 5
Type 1 Receiver (ADN4691E,
ADN4693E)
Type 2 Receiver (ADN4696E,
ADN4697E)
Disable Time from High Level t
Disable Time from Low Level t
Enable Time to High Level t
Enable Time to Low Level t
1
All typical values are given for VCC = 3.3 V and TA = 25°C.
2
t
is defined as the difference between the propagation delays of two devices between any specified terminals. This specification applies to devices at the same VCC
SK(PP)
and temperature, and with identical packages and test circuits.
3
Jitter parameters are guaranteed by design and characterization. Values do not include stimulus jitter.
4
tR = tF = 0.5 ns (10% to 90%), measured over 30,000 samples.
5
Peak-to-peak jitter specifications include jitter due to pulse skew (tSK).
6
tR = tF = 0.5 ns (10% to 90%), measured over 100,000 samples.
VCC −0.5 V to +4 V
Digital Input Voltage (DE, RE, DI)
Receiver Input (A, B) Voltage
Half-Duplex (ADN4691E, ADN4696E) −1.8 V to +4 V
Full-Duplex (ADN4693E, ADN4697E) −4 V to +6 V
Receiver Output Voltage (RO) −0.3 V to +4 V
Driver Output (A, B, Y, Z) Voltage −1.8 V to +4 V
ESD Rating (A, B, Y, Z Pins)
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
−0.5 V to +4 V
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 7. Thermal Resistance
Package Type θJA Unit
8-Lead SOIC 121 °C/W
14-Lead SOIC 86 °C/W
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. A | Page 6 of 20
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