DC to 4.25 Gbps per port NRZ data rate
Programmable receive equalization
12 dB boost at 2 GHz
Compensates 40 inches of FR4 at 4.25 Gbps
Programmable transmit preemphasis/deemphasis
Up to 12 dB boost at 4.25 Gbps
Compensates 40 inches of FR4 at 4.25 Gbps
Low power: 130 mW per channel at 3.3 V (outputs enabled)
16 × 16, fully differential, nonblocking array
Double rank connection programming with dual
connection maps
Low jitter, typically 20 ps
Flexible I/O supply range
DC- or ac-coupled differential CML inputs
Programmable CML output levels
Per-lane input P/N pair inversion for routing ease
50 Ω on-chip I/O termination
Supports 8b/10b, scrambled or uncoded NRZ data
2
Serial (I
100-lead TQFP, Pb-free package
C slave or SPI) control interface
16 × 16, Digital Cross
FUNCTIONAL BLOCK DIAGRAM
IP[15:0]
V
TTIE
V
TTIW
IN[15:0]
RESET
UPDATE
I2C/SPI
ADDR1/SDI
ADDR0/CS
SDA/SDO
SCL/SCK
,
DV
RXTX
EQ
CONNECTION
MAP 0
CONNECTION
MAP 1
SERIAL
INTERFACE
CONTROL
LOGIC
CC
16 × 16
SWITCH
MATRIX
Figure 1.
CC
V
EE
oint Switch
ADN4604
PRE-
EMPHASIS
OUTPUT
LEVEL
HOOKUP
TABLE
PER-PORT
SETTINGS
ADN4604
OUTPUT
LEVEL
OP[15:0]
V
TTON
V
TTOS
ON[15:0]
,
07934-001
APPLICATIONS
Fiber optic network switching
High speed serial backplane routing to OC-48 with FEC
XAUI: 10GBASE-KX4
Gigabit Ethernet over backplane: 1000BASE-KX
1×, 2×, and 4× Fibre Channel
InfiniBand®
Digital video (HDMI, DVI, DisplayPort, 3G-/HD-/SD-SDI)
Data storage networks
GENERAL DESCRIPTION
The ADN4604 is a 16 × 16 asynchronous, protocol agnostic,
digital crosspoint switch, with 16 differential PECL-/CMLcompatible inputs and 16 differential CML outputs.
The ADN4604 is optimized for nonreturn-to-zero (NRZ) signaling with data rates of up to 4.25 Gbps per port. Each port
offers a fixed level of input equalization and programmable
output swing and output preemphasis.
The ADN4604 nonblocking switch core implements a 16 × 16
crossbar and supports independent channel switching through
the serial control interface. The ADN4604 has low latency and
very low channel-to-channel skew.
2
An I
C® or SPI interface is used to control the device and provide access to advanced features, such as additional levels of
preemphasis and output disable.
The ADN4604 is packaged in a 100-lead TQFP package and
operates from −40°C to +85°C.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
Data Rate (DR) per Channel (NRZ) DC 4.25 Gbps
Deterministic Jitter Data rate = 4.25 Gbps, no channel 20 ps p-p
Random Jitter RMS, no channel 1 ps rms
Residual Deterministic Jitter with
Receive Equalization
Data rate = 4.25 Gbps, 40 in. FR4, EQ boost = 12 dB 70 ps p-p
Residual Deterministic Jitter with
Transmit Preemphasis
Data rate = 4.25 Gbps, 40 in. FR4, PE boost = 6 dB 35 ps p-p
Propagation Delay Input to output, EQ boost = 12 dB 800 ps
Channel-to-Channel Skew ±50 ps
Switching Time Update logic switching to 50% output data 100 ns
Output Rise/Fall Time 20% to 80% 75 ps
INPUT CHARACTERISTICS
Differential Input Voltage Swing V
Input Voltage Range Single-ended absolute voltage level, VL V
OUTPUT CHARACTERISTICS
Output Voltage Swing Differential, PE boost = 0 dB, default output level, at dc 600 800 900 mV p-p diff
Output Voltage Range Single-ended absolute voltage level, VL V
Per-Port Output Current PE boost = 0 dB, default output level 16 mA
PE boost = 6 dB, default output level 32 mA
TERMINATION CHARACTERISTICS
Resistance Single-ended, V
Temperature Coefficient 0.025 Ω/°C
POWER SUPPLY
Operating Range
VCC V
DVCC V
V
TTIE
V
TTON
Supply Current Outputs disabled
ICC 95 110 mA
I
DVCC
I
+ I
TTIE
Supply Current All outputs enabled, ac-coupled I/O, 400 mV I/O swings
ICC 342 370 mA
I
DVCC
I
+ I
TTIE
Supply Current All outputs enabled, ac-coupled I/O, 400 mV I/O swings
ICC 486 540 mA
I
DVCC
I
+ I
TTIE
= 3.3 V, V
TTIx
= 3.3 V, DVCC = 3.3 V, VEE = 0 V, RL = 50 Ω, data rate = 4.25 Gbps, ac-coupled inputs and outputs, differential
TTOx
= 27°C, unless otherwise noted.
A
Data rate = 4.25 Gbps, 20 in. FR4, EQ boost = 12 dB 27 ps p-p
Data rate = 4.25 Gbps, 30 in. FR4, EQ boost = 12 dB 43 ps p-p
Data rate = 4.25 Gbps, 20 in. FR4, PE boost = 4.2 dB 23 ps p-p
Data rate = 4.25 Gbps, 30 in. FR4, PE boost = 6 dB 25 ps p-p
1
= VCC − 0.6 V; VCC = V
ICM
Single-ended absolute voltage level, VH V
Single-ended absolute voltage level, VH V
= 2.2 V to 3.6 V, TA = T
V
TTO
= 0 V 2.7 3.3 3.6 V
EE
= 0 V 2.7 3.3 3.6 V
EE
, V
V
TTIW
, V
V
TTOS
= 0 V 1.3 3.3 VCC + 0.3 V
EE
= 0 V 2.22 3.3 VCC + 0.3 V
EE
= 2.7 V to 3.6 V, V
CC
MIN
MIN
to V
to T
, TA = T
MAX
MAX
MIN
= 2.2 V to 3.6 V,
TTI
;
to T
200 2000 mV p-p diff
MAX
+ 1.1 V
EE
+ 0.3 V
CC
– 1.3 V
CC
+ 0.2 V
CC
44 50 56 Ω
20 35 mA
+ I
+ I
TTIW
TTON
0 10 mA
TTOS
(800 mV p-p differential), PE boost = 0 dB,
20 35 mA
+ I
+ I
TTIW
TTON
256 280 mA
TTOS
50 Ω far-end terminations
(800 mV p-p differential), PE boost = 6 dB,
20 35 mA
+ I
+ I
TTIW
TTON
512 540 mA
TTOS
50 Ω far-end terminations
Rev. 0 | Page 3 of 40
ADN4604
Parameter Conditions Min Typ Max Unit
THERMAL CHARACTERISTICS
Operating Temperature Range −40 +85 °C
θJA Still air; JEDEC 4-layer test board 24.9 °C/W
θJB Still air 11.6 °C/W
θJC At the exposed pad 0.95 °C/W
LOGIC CHARACTERISTICS
Input High Voltage Threshold (VIH) DVCC = 3.3 V 0.7 × VCC VCC V
Input Low Voltage Threshold (VIL) DVCC = 3.3 V VEE 0.3 × VCC V
Output High Voltage (VOH) 2 kΩ pull-up resistor to DVCC DVCC V
Output Low Voltage (VOL) IOL = 3 mA VEE 0.4 V
1
V
is the input common-mode voltage.
ICM
2
Minimum V
I2C TIMING SPECIFICATIONS
is only applicable for a limited range of output current settings. Refer to the Power Dissipation section.
TTO
SDA
t
SU:DAT
t
f
t
f
SCL
t
f
t
LOW
t
HD:STA
t
f
t
BUF
t
HD:STA
t
HD:DAT
t
HIGH
t
SU:STA
Figure 2. I
2
C Timing Diagram
t
SU:STO
SPSrS
07934-002
Table 2. I
2
C Timing Specifications
Parameter Symbol Min Max Unit
SCL Clock Frequency f
Hold Time for a Start Condition t
Setup Time for a Repeated Start Condition t
Low Period of the SCL Clock t
High Period of the SCL Clock t
Data Hold Time t
Data Setup Time t
Rise Time for Both SDA and SCL t
Fall Time for Both SDA and SCL t
Setup Time for Stop Condition t
Bus-Free Time Between a Stop Condition and a Start Condition t
0 400+ kHz
SCL
HD;STA
SU;STA
LOW
HIGH
HD;DAT
SU;DAT
r
f
SU;STO
BUF
0.6 μs
0.6 μs
1.3 μs
0.6 μs
0 μs
10 ns
1 300 ns
1 300 ns
0.6 μs
1 ns
Bus Idle Time After a Reset 10 ns
Reset Pulse Width 10 ns
Rev. 0 | Page 4 of 40
ADN4604
SPI TIMING SPECIFICATIONS
CS
SCK
SDI
t
1
A7
t
2
t
3
A6A5A4A3A2A1A0D7D6D5D4D3D2D1D0
t
t
5
6
t
7
SDO
t
4
XXXXXXXXXXXXXXXX
t
8
07934-003
Figure 3. SPI Write Timing Diagram
t
9
CS
SCK
SDI
SDO
t
1
A7
X
t
2
t
3
A6A5A4A3A2A1A0D7D6D5D4D3D2D1D0
X X X X X X XD7D6D5D4D3D2D1D0
t
t
5
6
t
4
t
7
t
8
07934-004
Figure 4. SPI Read Timing Diagram
Table 3. SPI Timing Specifications
Parameter Symbol Min Max Unit
SCK Clock Frequency f
CS to SCK Setup Time
0 10 MHz
SCK
10 ns
t
1
SCK High Pulse Width t2 40 ns
SCK Low Pulse Width t3 40 ns
Data Access Time After SCK Falling Edge t4 35 ns
Data Setup Time Prior to SCK Rising Edge t5 20 ns
Data Hold Time After SCK Rising Edge t6 10 ns
CS to SCK Hold Time
CS to SDO High Impedance
CS High Pulse Width
t
10
7
40
t
8
10
t
9
ns
ns
ns
Rev. 0 | Page 5 of 40
ADN4604
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter Rating
VCC to VEE 3.7 V
DVCC to VEE 3.7 V
V
, V
V
TTIE
TTIW
V
, V
TTON
V
TTOS
Internal Power Dissipation1 4.9 W
Differential Input Voltage 2.0 V
Logic Input Voltage VEE – 0.3 V < VIN < VCC + 0.6 V
Storage Temperature Range −65°C to +125°C
Lead Temperature Range 300°C
Junction Temperature 150°C
1
Internal power dissipation is for the device in free air.
T
= 27°C; θJA = 24.9°C/W in still air.
A
+ 0.6 V
CC
+ 0.6 V
CC
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
1. THE ADN4604 TQFP HAS AN EXPO SED PADDLE (EP AD) ON THE UNDERSIDE OF THE PACKAG E THAT AIDS
IN HEAT DISS IPATION. THE EPAD MUST BE E LECTRICALLY CONNECTED T O THE V
TO MEET THERMAL SPE CIFICATIONS.
2. SDA/SCL/ADDR1/0 FOR I
SCK/SDO/S DI/CS FOR S PI OPERATI ON.
2
C OPERATIO N.
SUPPLY PLANE
EE
Figure 5. Pin Configuration
SDA/SDO
IN15
IP15
V
CC
IN14
IP14
V
TTIE
IN13
IP13
V
EE
IN12
IP12
V
CC
IN11
IP11
V
EE
IN10
IP10
V
TTIE
IN9
IP9
V
CC
IN8
IP8
ADDR0/CS
07934-005
Rev. 0 | Page 7 of 40
ADN4604
Table 5. Pin Function Descriptions
Pin No. Mnemonic Type Description
1
RESET
2 IP0 Input High Speed Input.
3 IN0 Input High Speed Input Complement.
Power Positive Supply.
4, 13, 22, 35, 41, 54, 63,
V
CC
72, 85, 91
5 IP1 Input High Speed Input.
6 IN1 Input High Speed Input Complement.
7, 19 V
Power
TTIW
8 IP2 Input High Speed Input.
9 IN2 Input High Speed Input Complement.
Power Negative Supply.
10, 16, 29, 38, 47, 60, 66,
V
EE
79, 88, 97, EPAD
11 IP3 Input High Speed Input.
12 IN3 Input High Speed Input Complement.
14 IP4 Input High Speed Input.
15 IN4 Input High Speed Input Complement.
17 IP5 Input High Speed Input.
18 IN5 Input High Speed Input Complement.
20 IP6 Input High Speed Input.
21 IN6 Input High Speed Input Complement.
23 IP7 Input High Speed Input.
24 IN7 Input High Speed Input Complement.
25
26
UPDATE
I2C
/SPI
27 OP0 Output High Speed Output.
28 ON0 Output High Speed Output Complement.
30 OP1 Output High Speed Output.
31 ON1 Output High Speed Output Complement.
32, 44 V
Power Output Termination Supply (South). These pins are normally tied to the V
TTOS
33 OP2 Output High Speed Output.
34 ON2 Output High Speed Output Complement.
36 OP3 Output High Speed Output.
37 ON3 Output High Speed Output Complement.
39 OP4 Output High Speed Output.
40 ON4 Output High Speed Output Complement.
42 OP5 Output High Speed Output.
43 ON5 Output High Speed Output Complement.
45 OP6 Output High Speed Output.
46 ON6 Output High Speed Output Complement.
48 OP7 Output High Speed Output.
49 ON7 Output High Speed Output Complement.
50 ADDR1/SDI Control I2C Slave Address Bit 1 (MSB) or SPI Data Input.
51
ADDR0/CS
52 IP8 Input High Speed Input.
53 IN8 Input High Speed Input Complement.
55 IP9 Input High Speed Input.
56 IN9 Input High Speed Input Complement.
Control
Control
Control I
Control I
Configuration Registers Reset, Active Low. This pin is normally pulled up
.
to DV
CC
Input Termination Supply (West). These pins are normally tied to the
V
pins.
TTIE
Second Rank Write Enable, Active Low. This pin is normally pulled up
to DV
.
CC
2
C/SPI Control Interface Selection, I2C Active Low.
2
C Slave Address Bit 0 (LSB) or SPI Chip Select (Active Low).
Rev. 0 | Page 8 of 40
TTON
pins.
ADN4604
Pin No. Mnemonic Type Description
57, 69 V
58 IP10 Input High Speed Input.
59 IN10 Input High Speed Input Complement.
61 IP11 Input High Speed Input.
62 IN11 Input High Speed Input Complement.
64 IP12 Input High Speed Input.
65 IN12 Input High Speed Input Complement.
67 IP13 Input High Speed Input.
68 IN13 Input High Speed Input Complement.
70 IP14 Input High Speed Input.
71 IN14 Input High Speed Input Complement.
73 IP15 Input High Speed Input.
74 IN15 Input High Speed Input Complement.
75 SDA/SDO Control I2C Data or SPI Data Output.
76 SCL/SCK Control I2C Clock or SPI Clock.
77 OP8 Output High Speed Output.
78 ON8 Output High Speed Output Complement.
80 OP9 Output High Speed Output.
81 ON9 Output High Speed Output Complement.
82, 94 V
83 OP10 Output High Speed Output.
84 ON10 Output High Speed Output Complement.
86 OP11 Output High Speed Output.
87 ON11 Output High Speed Output Complement.
89 OP12 Output High Speed Output.
90 ON12 Output High Speed Output Complement.
92 OP13 Output High Speed Output.
93 ON13 Output High Speed Output Complement.
95 OP14 Output High Speed Output.
96 ON14 Output High Speed Output Complement.
98 OP15 Output High Speed Output.
99 ON15 Output High Speed Output Complement.
100 DVCC Power Digital Positive Supply.
Power Input Termination Supply (East). These pins are normally tied to the V
TTIE
Power
TTON
Output Termination Supply (North). These pins are normally tied to
TTOS
pins.
the V
TTIW
pins.
Rev. 0 | Page 9 of 40
ADN4604
V
V
V
V
V
TYPICAL PERFORMANCE CHARACTERISTICS
VCC = 3.3 V, V
input swing = 800 mV p-p, T
= 3.3 V, V
TTIx
= 3.3 V, DVCC = 3.3 V, V
TTOx
= 27°C, unless otherwise noted.
A
= 0 V, RL = 50 Ω, data rate = 4.25 Gbps, ac-coupled inputs and outputs, differential
EE
200mV/DI
0.167IU/DIV
REFERENCE EYE DIAGRAM AT TP1
DATA OUT
PATTERN
GENERATOR
50Ω CABLES
22
INPUT
PIN
ADN4604
AC-COUPLED
EVALUATION
OUTPUT
BOARD
50Ω CABLES
22
PIN
50Ω
TP2TP1
OSCILLOSCOPE
HIGH SPEED
SAMPLING
07934-006
Figure 6. Standard Test Circuit
200mV/DI
0.167IU/DIV
Figure 7. 3.25 Gbps Input Eye (TP1 from Figure 6)
07934-007
200mV/DI
0.167IU/DIV
Figure 9. 3.25 Gbps Output Eye (TP2 from Figure 6)
07934-009
200mV/DI
0.167IU/DIV
Figure 8. 4.25 Gbps Input Eye (TP1 from Figure 6)
07934-008
200mV/DI
0.167IU/DIV
Figure 10. 4.25 Gbps Output Eye (TP2 from Figure 6)
4-010
0793
Rev. 0 | Page 10 of 40
ADN4604
V
V
V
V
V
200mV/DI
RE
0.167IU/DIV
FERENCE EYE DIAGRAM AT TP1
DATA OUT
PATTERN
GENERATOR
50Ω CABLES
22
Figure 11. Equalization Test Circuit
FR4 TEST BACKP LANE
DIFFERENTIAL
STRIPLI NE TRACES
TP1
8mils WI DE, 8mils S P ACE ,
8mils DIEL ECTRIC HEI GHT