ANALOG DEVICES ADN4604 Service Manual

4.25 Gbps,
p
V

FEATURES

DC to 4.25 Gbps per port NRZ data rate Programmable receive equalization
12 dB boost at 2 GHz Compensates 40 inches of FR4 at 4.25 Gbps
Programmable transmit preemphasis/deemphasis
Up to 12 dB boost at 4.25 Gbps
Compensates 40 inches of FR4 at 4.25 Gbps Low power: 130 mW per channel at 3.3 V (outputs enabled) 16 × 16, fully differential, nonblocking array
Double rank connection programming with dual
connection maps Low jitter, typically 20 ps Flexible I/O supply range DC- or ac-coupled differential CML inputs Programmable CML output levels Per-lane input P/N pair inversion for routing ease
50 Ω on-chip I/O termination
Supports 8b/10b, scrambled or uncoded NRZ data
2
Serial (I 100-lead TQFP, Pb-free package
C slave or SPI) control interface
16 × 16, Digital Cross

FUNCTIONAL BLOCK DIAGRAM

IP[15:0]
V
TTIE
V
TTIW
IN[15:0]
RESET
UPDATE
I2C/SPI
ADDR1/SDI
ADDR0/CS
SDA/SDO
SCL/SCK
,
DV
RX TX
EQ
CONNECTION
MAP 0
CONNECTION
MAP 1
SERIAL
INTERFACE
CONTROL
LOGIC
CC
16 × 16 SWITCH MATRIX
Figure 1.
CC
V
EE
ADN4604
PRE-
EMPHASIS
OUTPUT
LEVEL
HOOKUP
TABLE
PER-PORT
SETTINGS
ADN4604
OUTPUT
LEVEL
OP[15:0] V
TTON
V
TTOS
ON[15:0]
,
07934-001

APPLICATIONS

Fiber optic network switching High speed serial backplane routing to OC-48 with FEC XAUI: 10GBASE-KX4 Gigabit Ethernet over backplane: 1000BASE-KX 1×, 2×, and 4× Fibre Channel InfiniBand® Digital video (HDMI, DVI, DisplayPort, 3G-/HD-/SD-SDI) Data storage networks

GENERAL DESCRIPTION

The ADN4604 is a 16 × 16 asynchronous, protocol agnostic, digital crosspoint switch, with 16 differential PECL-/CML­compatible inputs and 16 differential CML outputs.
The ADN4604 is optimized for nonreturn-to-zero (NRZ) sig­naling with data rates of up to 4.25 Gbps per port. Each port offers a fixed level of input equalization and programmable output swing and output preemphasis.
The ADN4604 nonblocking switch core implements a 16 × 16 crossbar and supports independent channel switching through the serial control interface. The ADN4604 has low latency and very low channel-to-channel skew.
2
An I
C® or SPI interface is used to control the device and pro­vide access to advanced features, such as additional levels of preemphasis and output disable.
The ADN4604 is packaged in a 100-lead TQFP package and operates from −40°C to +85°C.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2009 Analog Devices, Inc. All rights reserved.
ADN4604
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Electrical Specifications ............................................................... 3
I2C Timing Specifications ............................................................ 4
SPI Timing Specifications ........................................................... 5
Absolute Maximum Ratings ............................................................ 6
ESD Caution .................................................................................. 6
Pin Configuration and Function Descriptions ............................. 7
Typical Performance Characteristics ........................................... 10
Theory of Operation ...................................................................... 16
Introduction ................................................................................ 16
Receivers ...................................................................................... 16
Switch Core ................................................................................. 17
Transmitters ................................................................................ 19
Termination ................................................................................. 23
I2C Serial Control Interface ........................................................... 24
Reset ............................................................................................. 24
I2C Data Write ............................................................................. 24
I2C Data Read .............................................................................. 25
SPI Serial Control Interface .......................................................... 26
Register Map ................................................................................... 28
Applications Information .............................................................. 32
Supply Sequencing ..................................................................... 34
Power Dissipation....................................................................... 34
Output Compliance ................................................................... 34
Printed Circuit Board (PCB) Layout Guidelines ................... 36
Outline Dimensions ....................................................................... 38
Ordering Guide .......................................................................... 38

REVISION HISTORY

10/09—Revision 0: Initial Version
Rev. 0 | Page 2 of 40
ADN4604

SPECIFICATIONS

ELECTRICAL SPECIFICATIONS

VCC = 3.3 V, V input swing = 800 mV p-p, T
Table 1.
Parameter Conditions Min Typ Max Unit
DYNAMIC PERFORMANCE
Data Rate (DR) per Channel (NRZ) DC 4.25 Gbps Deterministic Jitter Data rate = 4.25 Gbps, no channel 20 ps p-p Random Jitter RMS, no channel 1 ps rms Residual Deterministic Jitter with
Receive Equalization
Data rate = 4.25 Gbps, 40 in. FR4, EQ boost = 12 dB 70 ps p-p Residual Deterministic Jitter with
Transmit Preemphasis
Data rate = 4.25 Gbps, 40 in. FR4, PE boost = 6 dB 35 ps p-p Propagation Delay Input to output, EQ boost = 12 dB 800 ps Channel-to-Channel Skew ±50 ps Switching Time Update logic switching to 50% output data 100 ns Output Rise/Fall Time 20% to 80% 75 ps
INPUT CHARACTERISTICS
Differential Input Voltage Swing V Input Voltage Range Single-ended absolute voltage level, VL V
OUTPUT CHARACTERISTICS
Output Voltage Swing Differential, PE boost = 0 dB, default output level, at dc 600 800 900 mV p-p diff Output Voltage Range Single-ended absolute voltage level, VL V
Per-Port Output Current PE boost = 0 dB, default output level 16 mA PE boost = 6 dB, default output level 32 mA
TERMINATION CHARACTERISTICS
Resistance Single-ended, V
Temperature Coefficient 0.025 Ω/°C
POWER SUPPLY
Operating Range
VCC V DVCC V V
TTIE
V
TTON
Supply Current Outputs disabled
ICC 95 110 mA I
DVCC
I
+ I
TTIE
Supply Current All outputs enabled, ac-coupled I/O, 400 mV I/O swings
ICC 342 370 mA I
DVCC
I
+ I
TTIE
Supply Current All outputs enabled, ac-coupled I/O, 400 mV I/O swings
ICC 486 540 mA I
DVCC
I
+ I
TTIE
= 3.3 V, V
TTIx
= 3.3 V, DVCC = 3.3 V, VEE = 0 V, RL = 50 Ω, data rate = 4.25 Gbps, ac-coupled inputs and outputs, differential
TTOx
= 27°C, unless otherwise noted.
A
Data rate = 4.25 Gbps, 20 in. FR4, EQ boost = 12 dB 27 ps p-p Data rate = 4.25 Gbps, 30 in. FR4, EQ boost = 12 dB 43 ps p-p
Data rate = 4.25 Gbps, 20 in. FR4, PE boost = 4.2 dB 23 ps p-p Data rate = 4.25 Gbps, 30 in. FR4, PE boost = 6 dB 25 ps p-p
1
= VCC − 0.6 V; VCC = V
ICM
Single-ended absolute voltage level, VH V
Single-ended absolute voltage level, VH V
= 2.2 V to 3.6 V, TA = T
V
TTO
= 0 V 2.7 3.3 3.6 V
EE
= 0 V 2.7 3.3 3.6 V
EE
, V
V
TTIW
, V
V
TTOS
= 0 V 1.3 3.3 VCC + 0.3 V
EE
= 0 V 2.22 3.3 VCC + 0.3 V
EE
= 2.7 V to 3.6 V, V
CC
MIN
MIN
to V
to T
, TA = T
MAX
MAX
MIN
= 2.2 V to 3.6 V,
TTI
;
to T
200 2000 mV p-p diff
MAX
+ 1.1 V
EE
+ 0.3 V
CC
– 1.3 V
CC
+ 0.2 V
CC
44 50 56 Ω
20 35 mA
+ I
+ I
TTIW
TTON
0 10 mA
TTOS
(800 mV p-p differential), PE boost = 0 dB,
20 35 mA
+ I
+ I
TTIW
TTON
256 280 mA
TTOS
50 Ω far-end terminations
(800 mV p-p differential), PE boost = 6 dB,
20 35 mA
+ I
+ I
TTIW
TTON
512 540 mA
TTOS
50 Ω far-end terminations
Rev. 0 | Page 3 of 40
ADN4604
Parameter Conditions Min Typ Max Unit
THERMAL CHARACTERISTICS
Operating Temperature Range −40 +85 °C θJA Still air; JEDEC 4-layer test board 24.9 °C/W θJB Still air 11.6 °C/W θJC At the exposed pad 0.95 °C/W
LOGIC CHARACTERISTICS
Input High Voltage Threshold (VIH) DVCC = 3.3 V 0.7 × VCC VCC V Input Low Voltage Threshold (VIL) DVCC = 3.3 V VEE 0.3 × VCC V Output High Voltage (VOH) 2 kΩ pull-up resistor to DVCC DVCC V Output Low Voltage (VOL) IOL = 3 mA VEE 0.4 V
1
V
is the input common-mode voltage.
ICM
2
Minimum V

I2C TIMING SPECIFICATIONS

is only applicable for a limited range of output current settings. Refer to the Power Dissipation section.
TTO
SDA
t
SU:DAT
t
f
t
f
SCL
t
f
t
LOW
t
HD:STA
t
f
t
BUF
t
HD:STA
t
HD:DAT
t
HIGH
t
SU:STA
Figure 2. I
2
C Timing Diagram
t
SU:STO
SPSrS
07934-002
Table 2. I
2
C Timing Specifications
Parameter Symbol Min Max Unit
SCL Clock Frequency f Hold Time for a Start Condition t Setup Time for a Repeated Start Condition t Low Period of the SCL Clock t High Period of the SCL Clock t Data Hold Time t Data Setup Time t Rise Time for Both SDA and SCL t Fall Time for Both SDA and SCL t Setup Time for Stop Condition t Bus-Free Time Between a Stop Condition and a Start Condition t
0 400+ kHz
SCL
HD;STA
SU;STA
LOW
HIGH
HD;DAT
SU;DAT
r
f
SU;STO
BUF
0.6 μs
0.6 μs
1.3 μs
0.6 μs 0 μs 10 ns 1 300 ns 1 300 ns
0.6 μs
1 ns Bus Idle Time After a Reset 10 ns Reset Pulse Width 10 ns
Rev. 0 | Page 4 of 40
ADN4604

SPI TIMING SPECIFICATIONS

CS
SCK
SDI
t
1
A7
t
2
t
3
A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0
t
t
5
6
t
7
SDO
t
4
XXXXXXXXXXXXXXX X
t
8
07934-003
Figure 3. SPI Write Timing Diagram
t
9
CS
SCK
SDI
SDO
t
1
A7
X
t
2
t
3
A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0
X X X X X X X D7D6D5D4D3D2D1 D0
t
t
5
6
t
4
t
7
t
8
07934-004
Figure 4. SPI Read Timing Diagram
Table 3. SPI Timing Specifications
Parameter Symbol Min Max Unit
SCK Clock Frequency f CS to SCK Setup Time
0 10 MHz
SCK
10 ns
t
1
SCK High Pulse Width t2 40 ns SCK Low Pulse Width t3 40 ns Data Access Time After SCK Falling Edge t4 35 ns Data Setup Time Prior to SCK Rising Edge t5 20 ns Data Hold Time After SCK Rising Edge t6 10 ns CS to SCK Hold Time CS to SDO High Impedance
CS High Pulse Width
t
10
7
40
t
8
10
t
9
ns ns ns
Rev. 0 | Page 5 of 40
ADN4604

ABSOLUTE MAXIMUM RATINGS

Table 4.
Parameter Rating
VCC to VEE 3.7 V DVCC to VEE 3.7 V V
, V
V
TTIE
TTIW
V
, V
TTON
V
TTOS
Internal Power Dissipation1 4.9 W Differential Input Voltage 2.0 V Logic Input Voltage VEE – 0.3 V < VIN < VCC + 0.6 V Storage Temperature Range −65°C to +125°C Lead Temperature Range 300°C Junction Temperature 150°C
1
Internal power dissipation is for the device in free air.
T
= 27°C; θJA = 24.9°C/W in still air.
A
+ 0.6 V
CC
+ 0.6 V
CC
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ESD CAUTION

Rev. 0 | Page 6 of 40
ADN4604

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

RESET
IP0 IN0
V
IP1 IN1
V
TTIW
IP2 IN2
V
IP3 IN3
V
IP4 IN4
V
IP5 IN5
V
TTIW
IP6 IN6
V
IP7 IN7
UPDATE
CC
OP1599ON15
DV
98
100
1
PIN 1
2 3 4
CC
5 6 7 8 9
10
EE
11 12 13
CC
14 15 16
EE
17 18 19 20 21 22
CC
23 24 25
26
27
28
29
EE
V
OP0
ON0
I2C/SPI
TTON
EE
OP1496ON1497V
95
32
30
31
OP1
ON1
TTOS
V
CC
OP1290ON1291V
OP1393ON1394V
89
92
ADN4604
TOP VIEW
(Not to Scale)
36
33
34
35
37 38
CC
V
OP2
ON2
EE
V
OP3
ON3
CC
EE
OP1187ON1188V
86
40
41
39
CC
V
OP4
ON4
TTON
OP1084ON1085V
83
42
43
44
OP5
ON5
TTOS
V
EE
OP981ON982V
80
45
46
47
EE
V
OP6
ON6
SCL/SCK77OP878ON879V
76
75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57
56
55 54
53
52 51
48
49
50
OP7
ON7
ADDR1/SDI
NOTES
1. THE ADN4604 TQFP HAS AN EXPO SED PADDLE (EP AD) ON THE UNDERSIDE OF THE PACKAG E THAT AIDS IN HEAT DISS IPATION. THE EPAD MUST BE E LECTRICALLY CONNECTED T O THE V TO MEET THERMAL SPE CIFICATIONS.
2. SDA/SCL/ADDR1/0 FOR I SCK/SDO/S DI/CS FOR S PI OPERATI ON.
2
C OPERATIO N.
SUPPLY PLANE
EE
Figure 5. Pin Configuration
SDA/SDO IN15 IP15 V
CC
IN14 IP14 V
TTIE
IN13 IP13 V
EE
IN12 IP12 V
CC
IN11 IP11 V
EE
IN10 IP10 V
TTIE
IN9 IP9 V
CC
IN8 IP8 ADDR0/CS
07934-005
Rev. 0 | Page 7 of 40
ADN4604
Table 5. Pin Function Descriptions
Pin No. Mnemonic Type Description
1
RESET
2 IP0 Input High Speed Input. 3 IN0 Input High Speed Input Complement.
Power Positive Supply.
4, 13, 22, 35, 41, 54, 63,
V
CC
72, 85, 91 5 IP1 Input High Speed Input. 6 IN1 Input High Speed Input Complement. 7, 19 V
Power
TTIW
8 IP2 Input High Speed Input. 9 IN2 Input High Speed Input Complement.
Power Negative Supply.
10, 16, 29, 38, 47, 60, 66,
V
EE
79, 88, 97, EPAD 11 IP3 Input High Speed Input. 12 IN3 Input High Speed Input Complement. 14 IP4 Input High Speed Input. 15 IN4 Input High Speed Input Complement. 17 IP5 Input High Speed Input. 18 IN5 Input High Speed Input Complement. 20 IP6 Input High Speed Input. 21 IN6 Input High Speed Input Complement. 23 IP7 Input High Speed Input. 24 IN7 Input High Speed Input Complement. 25
26
UPDATE
I2C
/SPI 27 OP0 Output High Speed Output. 28 ON0 Output High Speed Output Complement. 30 OP1 Output High Speed Output. 31 ON1 Output High Speed Output Complement. 32, 44 V
Power Output Termination Supply (South). These pins are normally tied to the V
TTOS
33 OP2 Output High Speed Output. 34 ON2 Output High Speed Output Complement. 36 OP3 Output High Speed Output. 37 ON3 Output High Speed Output Complement. 39 OP4 Output High Speed Output. 40 ON4 Output High Speed Output Complement. 42 OP5 Output High Speed Output. 43 ON5 Output High Speed Output Complement. 45 OP6 Output High Speed Output. 46 ON6 Output High Speed Output Complement. 48 OP7 Output High Speed Output. 49 ON7 Output High Speed Output Complement. 50 ADDR1/SDI Control I2C Slave Address Bit 1 (MSB) or SPI Data Input. 51
ADDR0/CS 52 IP8 Input High Speed Input. 53 IN8 Input High Speed Input Complement. 55 IP9 Input High Speed Input. 56 IN9 Input High Speed Input Complement.
Control
Control
Control I
Control I
Configuration Registers Reset, Active Low. This pin is normally pulled up
.
to DV
CC
Input Termination Supply (West). These pins are normally tied to the V
pins.
TTIE
Second Rank Write Enable, Active Low. This pin is normally pulled up to DV
.
CC
2
C/SPI Control Interface Selection, I2C Active Low.
2
C Slave Address Bit 0 (LSB) or SPI Chip Select (Active Low).
Rev. 0 | Page 8 of 40
TTON
pins.
ADN4604
Pin No. Mnemonic Type Description
57, 69 V 58 IP10 Input High Speed Input. 59 IN10 Input High Speed Input Complement. 61 IP11 Input High Speed Input. 62 IN11 Input High Speed Input Complement. 64 IP12 Input High Speed Input. 65 IN12 Input High Speed Input Complement. 67 IP13 Input High Speed Input. 68 IN13 Input High Speed Input Complement. 70 IP14 Input High Speed Input. 71 IN14 Input High Speed Input Complement. 73 IP15 Input High Speed Input. 74 IN15 Input High Speed Input Complement. 75 SDA/SDO Control I2C Data or SPI Data Output. 76 SCL/SCK Control I2C Clock or SPI Clock. 77 OP8 Output High Speed Output. 78 ON8 Output High Speed Output Complement. 80 OP9 Output High Speed Output. 81 ON9 Output High Speed Output Complement. 82, 94 V
83 OP10 Output High Speed Output. 84 ON10 Output High Speed Output Complement. 86 OP11 Output High Speed Output. 87 ON11 Output High Speed Output Complement. 89 OP12 Output High Speed Output. 90 ON12 Output High Speed Output Complement. 92 OP13 Output High Speed Output. 93 ON13 Output High Speed Output Complement. 95 OP14 Output High Speed Output. 96 ON14 Output High Speed Output Complement. 98 OP15 Output High Speed Output. 99 ON15 Output High Speed Output Complement. 100 DVCC Power Digital Positive Supply.
Power Input Termination Supply (East). These pins are normally tied to the V
TTIE
Power
TTON
Output Termination Supply (North). These pins are normally tied to
TTOS
pins.
the V
TTIW
pins.
Rev. 0 | Page 9 of 40
ADN4604
V
V
V
V
V

TYPICAL PERFORMANCE CHARACTERISTICS

VCC = 3.3 V, V input swing = 800 mV p-p, T
= 3.3 V, V
TTIx
= 3.3 V, DVCC = 3.3 V, V
TTOx
= 27°C, unless otherwise noted.
A
= 0 V, RL = 50 Ω, data rate = 4.25 Gbps, ac-coupled inputs and outputs, differential
EE
200mV/DI
0.167IU/DIV
REFERENCE EYE DIAGRAM AT TP1
DATA OUT
PATTERN
GENERATOR
50 CABLES
2 2
INPUT PIN
ADN4604
AC-COUPLED EVALUATION
OUTPUT
BOARD
50 CABLES
2 2
PIN
50
TP2TP1
OSCILLOSCOPE
HIGH SPEED
SAMPLING
07934-006
Figure 6. Standard Test Circuit
200mV/DI
0.167IU/DIV
Figure 7. 3.25 Gbps Input Eye (TP1 from Figure 6)
07934-007
200mV/DI
0.167IU/DIV
Figure 9. 3.25 Gbps Output Eye (TP2 from Figure 6)
07934-009
200mV/DI
0.167IU/DIV
Figure 8. 4.25 Gbps Input Eye (TP1 from Figure 6)
07934-008
200mV/DI
0.167IU/DIV
Figure 10. 4.25 Gbps Output Eye (TP2 from Figure 6)
4-010 0793
Rev. 0 | Page 10 of 40
ADN4604
V
V
V
V
V
200mV/DI
RE
0.167IU/DIV
FERENCE EYE DIAGRAM AT TP1
DATA OUT
PATTERN
GENERATOR
50 CABLES
2 2
Figure 11. Equalization Test Circuit
FR4 TEST BACKP LANE
DIFFERENTIAL STRIPLI NE TRACES
TP1
8mils WI DE, 8mils S P ACE , 8mils DIEL ECTRIC HEI GHT
LENGTHS = 10 INCHES, 20 INCHES , 30 INCHES, 40 I NCHES
50 CABLES
2 2
TP2
INPUT
OUTPUT
PIN
ADN4604
AC-COUPLED
EVALUATION
BOARD
2 2
PIN
50 CABLES
TP3
50
HIGH
SPEED
SAMPLING
OSCILLOSCOPE
07934-011
200mV/DI
0.167IU/DIV
Figure 12. 4.25 Gbps Input Eye, 20 Inch FR4 Input Channel
(TP2 from Figure 11)
200mV/DI
0.167IU/DIV
Figu re 13. 4.25 Gb ps Input Eye, 40-Inch FR4 Input Channel
(TP2 from Figure 11)
200mV/DI
07934-012
0.167IU/DIV
07934-014
Figure 14. 4.25 Gbps Output Eye, 20-Inch FR4 Input Channel, EQ = 12 dB
(TP3 from Figure 11)
200mV/DI
07934-013
0.167IU/DIV
07934-015
Figure 15. 4.25 Gbps Output Eye, 40-Inch FR4 Input Channel, EQ = 12 dB
(TP3 from Figure 11)
Rev. 0 | Page 11 of 40
ADN4604
V
V
V
V
V
200mV/DI
0.167IU/DIV
REFERENCE EYE DIAGRAM AT TP1
DATA OUT
PATTERN
GENERATOR
50 CABLES
2 2
Figure 16. Preemphasis Test Circuit
TP1
INPUT
OUTPUT
PIN
ADN4604
AC-COUPLED
EVALUATION
BOARD
50 CABLES
2 2
PIN
FR4 TEST BACKPLANE
DIFFERENTIAL STRIPLI NE T RACES
TP2
8mils WI DE , 8mils SP ACE, 8mils DIEL ECTRIC HEI GHT
LENGTHS = 10 INCHES, 20 INCHES, 30 INCHES, 40 INCHE S
50 CABLES
2 2
TP3
50
HIGH
SPEED
SAMPLING
OSCILLOSCOPE
07934-016
200mV/DI
0.167IU/DIV
07934-017
Figu re 17. 4.25 G bps Ou tput Eye, 20-Inch FR4 Out put Channel, PE = 0 dB
(TP3 from Figure 16)
200mV/DI
0.167IU/DIV
07934-018
Figure 18. 4.25 Gbps Output Eye, 40-Inch FR4 Input Channel, PE = 0 dB
(TP3 from Figure 16)
200mV/DI
0.167IU/DIV
07934-019
Figure 19. 4.25 Gbps Output Eye, 20-Inch FR4 Input Channel, PE = 4.2 dB
(TP3 from Figure 16)
200mV/DI
0.167IU/DIV
07934-020
Figure 20. 4.25 Gbps Output Eye, 40-Inch FR4 Input Channel, PE = 6 dB
(TP3 from Figure 16)
Rev. 0 | Page 12 of 40
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