Data Rates up to 10.709Gb/s
Typical Rise/Fall Time 27ps
Power Dissipation 900mW (at 2V swing, 1V offset)
Programmable Modulation Voltage up to 3V
Programmable Bias Offset Voltage up to 2V
Voltage-input control for offset, modulation
Cross Point Adjust Range 30%- 85%
Selectable Data Retiming
PECL/CML Data & Clock Inputs
50Ω on Chip Data & Clock Terminations
Modulation Ebnable/Disable
|<-10dB , |S22|<-8dB at 10GHz
|S
11
Positive or negative 5.2 or 5.0V single supply operation
Available in dice and 4x4mm 24 Lead LFCSP package
The ADN2849 is a low power 10.7Gbps driver for electroabsorption modulator (EAM) applications. The modulation
voltage is programmable via an external voltage up to a
maximum swing of 3V when driving 50Ω. The bias offset
voltage and output eye cross point are also programmable. Onchip 50Ω resistor is provided for back termination of the
output. The ADN2849 is driven by AC coupled differential
CML level data and has selectable data retiming to remove jitter
from data input signal. The modulation voltage can be enabled
or disabled by driving the MOD_ENB pin with the proper logic
levels. It can operate with positive or negative (5.2V or 5.0V)
supply voltage.
The ADN284949 is available in a compact 4x4mm plastic
package or dice format.
CPAP CPAN MOD_SET
BIAS_SETVTERM
GNDMODN_TERM
ADN2849
ADN2849
DATAP
DAT AN
VBB
CLKP
CLKN
Rev. Pr. G August 2004
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Anal og Devices. Trademarks and
registered trademarks are the property of their respective owners.
Parameter Min Typ Max Unit Conditions
Bias Offset Voltage(MODP)
Bias offset voltage -0.25 -2.0 V Note 1
BIAS_SET voltage to bias offset voltage gain 0.9 1.1 V/V Ta=250C, VEE=-5.2V
Bias offset voltage drift over temperature and VEE -5 5 %
Modulation Voltage(MODP)
Modulation voltage swing 0.6 3.0 V Note1
MOD_SET voltage to modulation voltage swing gain 1.5 1.9 V/v Ta=250C, VEE=-5.2V
Modulation voltage drift over temperature and VEE -5 5 %
Back termination resistance 40 60
Ω
Rise time (20% - 80%) 27 36 ps
Fall time (20% - 80%) 27 36 ps
Random jitter 0.75 ps RMS
Total jitter 10 ps
p-p
Cross point adjust range 30 85 %
Cross point drift over temperature and VEE -5 5 %
Minimum output voltage(single ended) VEE+1.7 V Note1
|S22|
-8 dB At 10GHz
Modulation enable time 100 ns
Modulation disable time 100 ns
Data Inputs (DATAP, DATAN)
Differential Input voltage 600 1600 mV
Termination resistance 40 60
p-p
Ω
Setup time (see figure 2) 25 ps CLK_SELB=’0’
Hold time (see figure 2) 25 ps CLK_SELB=’0’
|S11| -10 DB At 10GHz
Clock Inputs (CLKP, CLKN)
Differential Input voltage 600 1600 mV
Termination resistance 40 60
p-p
Ω
|S11| -10 dBAt 10GHz
Cross point adjust (CPAN, CPAP)
Input voltage range -0.85 -1.85 V
CPAP, CPAN differential voltage 0.6 V
Input current 85 115
Logic Inputs (MOD_ENB, CLK_SELB)
V
IH
V
IL
I
IL
I
IH
VEE+2 V
VEE+0.8 V
-400
20
200
Supply
p-p
µA
µA
µA
µA
VI=VEE+0.4V
VI=VEE+2.4V
VI=0V
VEE -4.75 -5.2 -5.5 V IMOD=0
I
EE
Notes:
Minimum supply voltage and minimum output voltage determine maximum output swing and maximum bias offset that can be achieved concurrently.
Measured using the characterization circuit shown in figure 3.
52 mA V
MODP/MODN
=0
Rev. Pr. G | Page 2 of 17
Preliminary Technical Data
ADN2849
SETUPHOLD
t
S
t
H
DATAP/N
CLKP/N
Figure 2. Setup and hold time
Figure 3. High-speed characterization circuit
Rev. Pr. G | Page 3 of 17
ADN2849
Preliminary Technical Data
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Min Max Units Conditions
VEE to GND TBD TBD V
VBB to GND TBD TBD V
DATAP, DATAN to GND TBD TBD V
CLKP, CLKN to GND TBD TBD V
CPAP, CPAN to GND TBD TBD V
MOD_SET to GND TBD TBD V
BIAS_SET to GND TBD TBD V
MOD_ENB to GND TBD TBD V
CLK_SELB to GND TBD TBD V
Staorage temperature range -60 +150 0C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only;
functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is
not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability
PACKAGE THERMAL SPECIFICATIONS
Table 3.
PARAMETER MIN TYP MAX UNITS CONDITIONS/COMMENTS
θ
θ
J-TOP
J-PAD
TBD TBD TBD 0C/W Thermal resistance from junction to top of package
TBD TBD TBD 0C/W
Thermal resistance from junction to bottom of exposed pad
ORDERING GUIDE
Table 4.
Model Temperature range Package description
ADN2849ACP -400C to +850C 24 Lead LFCSP
ADN2849ACP-RL -400C to +850C 24 Lead LFCSP
ADN2849ACP-RL7 -400C to +850C 24 Lead LFCSP
ADN2849SURF -400C to +850C Bare die
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
this product features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.