ANALOG DEVICES ADN2817 Service Manual

Continuous Rate 10 Mbps to 2.7 Gbps Clock
www.BDTIC.com/ADI

FEATURES

Serial data input: 10 Mbps to 2.7 Gbps Exceeds ITU-T jitter specifications Integrated limiting amplifier
5 mV sensitivity (ADN2817 only) Adjustable slice level: ±100 mV (ADN2817 only) Patented dual-loop clock recovery architecture Programmable LOS detect (ADN2817 only) Integrated PRBS generator and detector No reference clock required Loss of lock indicator Supports double data rate Bit error rate monitor (BERMON) or sample phase adjust options Rate selectivity without the use of a reference clock
2
I
C interface to access optional features Single-supply operation: 3.3 V Low power
650 mW (ADN2817) 600 mW (ADN2818)
5 mm × 5 mm 32-lead LFCSP

APPLICATIONS

SONET OC-1, OC-3, OC-12, OC-48, and all associated FEC rates Fibre Channel, 2× Fibre Channel, GbE, HDTV, and others WDM transponders Regenerators/repeaters Test equipment

FUNCTIONAL BLOCK DIAGRAM

REFCLKP/REFCLKN
(OPTIO NAL)
LOL
and Data Recovery ICs
ADN2817/ADN2818

GENERAL DESCRIPTION

The ADN2817/ADN2818 provide the receiver functions of quantization, signal level detect, and clock and data recovery for continuous data rates from 10 Mbps to 2.7 Gbps. The ADN2817/ ADN2818 automatically lock to all data rates without the need for an external reference clock or programming. All SONET jitter requirements are exceeded, including jitter transfer, jitter generation, and jitter tolerance. All specifications are quoted for −40°C to +85°C ambient temperature, unless otherwise noted.
This device, together with a PIN diode and a TIA preamplifier, can implement a highly integrated, low cost, and low power fiber optic receiver.
The ADN2817/ADN2818 have many optional features available through an I the data rate onto which the ADN2817 or ADN2818 is locked, or the user can set the device to lock only to one particular data rate if provisioning of data rates is required. A BERMON circuit provides an estimate of the received bit error rate (BER) without interruption of the data. Alternatively, the user can adjust the data sampling phase to optimize the received BER.
The ADN2817/ADN2818 are available in a compact 5 mm × 5 mm, 32-lead, lead frame chip scale package.
CF1 CF2
2
C® interface. For example, the user can read back
VCC VEE
SLICE
THRADJ
ADJUST
(ADN2817
ONLY)
LOS
DETECT
(ADN2817
ONLY)
LOS DATAOUTP/
PHASE
SHIFTER
DATA
RETIMING
DATAOUTN
SLICEP/
SLICEN
PIN
NIN
VREF
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
FREQ/ LOCK
DET
PHASE
DET
ΔФ
CLKOUTP/
CLKOUTN
Figure 1.
ADN2817/ADN2818
LOOP
FILTER
LOOP
FILTER
BERMON
VBER BERMODE
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2007–2008 Analog Devices, Inc. All rights reserved.
VCO
I2C
REGISTERS
SCK SDA
06001-001
ADN2817/ADN2818
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TABLE OF CONTENTS

Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Jitter Specifications ....................................................................... 4
Output and Timing Specifications ............................................. 5
Bit Error Rate Monitor Specifications ....................................... 7
Timing Characteristics ................................................................ 8
Absolute Maximum Ratings ............................................................ 9
Thermal Characteristics .............................................................. 9
ESD Caution .................................................................................. 9
Pin Configuration and Function Descriptions ........................... 10
Typical Performance Characteristics ........................................... 11
I2C Interface Timing and Internal Register Description ........... 13
Terminology .................................................................................... 17
Input Sensitivity and Input Overdrive ..................................... 17
Single-Ended vs. Differential .................................................... 17
LOS Response Time ................................................................... 17
Jitter Specifications ......................................................................... 18
Jitter Generation ......................................................................... 18
Jitter Transfer ............................................................................... 18
Jitter Tolerance ............................................................................ 18
Theory of Operation ...................................................................... 19
Functional Description .................................................................. 21
Frequency Acquisition ............................................................... 21
Lock Detector Operation .......................................................... 21
Harmonic Detector .................................................................... 22
Limiting Amplifier (ADN2817 Only) ..................................... 22
Slice Level Adjust (ADN2817 Only) ........................................ 22
Loss of Signal (LOS) Detector (ADN2817 Only) .................. 22
Sample Phase Adjust .................................................................. 23
Bit Error Rate (BER) Monitor ................................................... 23
Squelch Mode ............................................................................. 24
I2C Interface ................................................................................ 24
Reference Clock (Optional) ...................................................... 25
Additional Features Available via the I2C Interface ............... 27
Applications Information .............................................................. 29
PCB Design Guidelines ............................................................. 29
DC-Coupled Application .......................................................... 31
Coarse Data Rate Readback Look-Up Table ............................... 32
HI_CODE and LO_CODE Look-Up Table ................................ 34
Outline Dimensions ....................................................................... 37
Ordering Guide .......................................................................... 37

REVISION HISTORY

8/08—Rev. 0 to Rev. A
Changes to Features Section, General Description Section, and
Figure 1 .............................................................................................. 1
Added Bit Rate Monitor Specifications Section and Table 4;
Renumbered Sequentially ................................................................ 7
Changes to Figure 5 and Table 6 ................................................... 10
Changes to Table 7 and Table 8 ..................................................... 14
Changes to Table 14 ........................................................................ 15
Added Table 15 ............................................................................... 15
Added Table 16 ............................................................................... 16
Added Sample Phase Adjust Section and Bit Error Rate (BER)
Monitor Section .............................................................................. 23
Added Figure 32; Renumbered Sequentially .............................. 24
Changes to Figure 36 ...................................................................... 29
Added Exposed Pad Notation to Outline Dimensions ............. 37
7/07—Revision 0: Initial Version
Rev. A | Page 2 of 40
ADN2817/ADN2818
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SPECIFICATIONS

TA = T unless otherwise noted.
Table 1.
Parameter Conditions Min Typ Max Unit
QUANTIZER—DC CHARACTERISTICS
QUANTIZER—AC CHARACTERISTICS
QUANTIZER—SLICE ADJUSTMENT ADN2817 only
LOSS OF SIGNAL DETECT (LOS) ADN2817 only
R
R
R
LOSS OF LOCK DETECT (LOL)
ACQUISITION TIME
DATA RATE READBACK ACCURACY
MIN
to T
, VCC = V
MAX
MIN
to V
, VEE = 0 V, CF = 0.47 µF, SLICEP = SLICEN = VEE, input data pattern: PRBS 223 − 1,
MAX
Input Voltage Range @ PIN or NIN, dc-coupled 1.8 2.8 V Peak-to-Peak Differential Input PIN − NIN 2.0 V Input Common-Mode Level DC-coupled (see Figure 40, Figure 41, and Figure 42) 2.3 2.5 2.8 V Differential Input Sensitivity 223 − 1 PRBS, ac-coupled,1 BER = 1 × 10
−10
ADN2817 10 5 mV p-p ADN2818 200 mV p-p
Data Rate 10 2700 Mbps S11 @ 2.5 GHz −15 dB Input Resistance Differential 100 Ω Input Capacitance 0.65 pF
Gain SLICEP − SLICEN = ±0.5 V 0.10 0.11 0.13 V/V Differential Control Voltage Input SLICEP − SLICEN −0.95 +0.95 V Control Voltage Range DC level @ SLICEP or SLICEN VEE 0.95 V Slice Threshold Offset ±1 mV
Loss of Signal Detect Range (See Figure 6) R
= 0 Ω 14.2 20.0 mV
Thresh
= 100 kΩ 2.1 5.0 mV
Thresh
Hysteresis (Electrical)
OC-48 R
OC-1 R
LOS Assert Time DC-coupled LOS Deassert Time DC-coupled
= 0 Ω 6.2 8.2 dB
Thresh
= 100 kΩ 4.7 7.7 dB
Thresh
= 0 Ω 4.9 7.5 dB
Thresh
= 10 kΩ 3.0 7.3 dB
Thresh
2
2
500 ns
450 ns
VCO Frequency Error for LOL Assert With respect to nominal 1000 ppm VCO Frequency Error for LOL Deassert With respect to nominal 250 ppm LOL Response Time
OC-48 1.0 μs OC-12 1.0 μs 10 Mbps 500 μs
Lock to Data Mode
OC-48 1.3 ms OC-12 2.0 ms OC-3 3.4 ms OC-1 9.8 ms 10 Mbps 40.0 ms
Optional Lock to REFCLK Mode 10.0 ms
Coarse Readback See Tab le 19 10 % Fine Readback In addition to REFCLK accuracy 100 ppm
Rev. A | Page 3 of 40
ADN2817/ADN2818
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Parameter Conditions Min Typ Max Unit
POWER SUPPLY
Voltage 3.0 3.3 3.6 V Current
ADN2817 210 247 mA ADN2818 180 217 mA
OPERATING TEMPERATURE RANGE −40 +85 °C
1
PIN and NIN should be differentially driven and ac-coupled for optimum sensitivity.
2
When ac-coupled, the LOS assert and deassert time is dominated by the RC time constant of the ac coupling capacitor and the 50 Ω input termination of the ADN2817
input stage.

JITTER SPECIFICATIONS

TA = T unless otherwise noted.
Table 2.
Parameter Conditions Min Typ Max Unit
PHASE-LOCKED LOOP CHARACTERISTICS
1
Jitter tolerance of the ADN2817/ADN2818 at these jitter frequencies is better than what the test equipment is able to measure.
MIN
to T
, VCC = V
MAX
MIN
to V
, VEE = 0 V, CF = 0.47 F, SLICEP = SLICEN = VEE, input data pattern: PRBS 223 − 1,
MAX
Jitter Transfer Bandwidth
OC-48 548 839 kHz OC-12 93 137 kHz OC-3 30 40 kHz
Jitter Peaking
OC-48 0 0.03 dB OC-12 0 0.03 dB OC-3 0 0.03 dB
Jitter Generation
OC-48 12 kHz to 20 MHz 0.001 0.003 UI rms
0.02 0.046 UI p-p OC-12 12 kHz to 5 MHz 0.001 0.004 UI rms
0.01 0.036 UI p-p OC-3 12 kHz to 1.3 MHz 0.001 0.004 UI rms
0.01 0.023 UI p-p Jitter Tolerance 223 − 1 PRBS
OC-48 600 Hz 6 kHz
1
1
20.0 UI p-p
92.0 UI p-p
100 kHz 7.0 UI p-p 1 MHz
1
1.00 UI p-p
20 MHz 0.53 UI p-p OC-12 30 Hz 300 Hz
1
100.0 UI p-p
1
44.0 UI p-p
25 kHz 7.35 UI p-p 250 kHz
1
1.00 UI p-p
5 MHz 0.52 UI p-p OC-3 30 Hz
300 Hz
1
50.0 UI p-p
1
23.5 UI p-p
6500 Hz 6.71 UI p-p 65 kHz
1
1.00 UI p-p
130 kHz 0.54 UI p-p
Rev. A | Page 4 of 40
ADN2817/ADN2818
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OUTPUT AND TIMING SPECIFICATIONS

Table 3.
Parameter Conditions Min Typ Max Unit
CML OUPUT CHARACTERISTICS (CLKOUTP/CLKOUTN,
DATAOUTP/DATAOUTN) Single-Ended Output Swing, VSE See Figure 3 300 350 600 mV Differential Output Swing, V
See Figure 3 600 700 1200 mV
DIFF
Output Voltage
High, VOH VCC V Low, VOL VCC − 0.6 VCC − 0.35 VCC − 0.3 V
CML Outputs Timing
Rise Time 20% to 80% 80 112 ps Fall Time 80% to 20% 80 123 ps Setup Time, tS See Figure 2, OC-48 150 200 250 ps Hold Time, tH See Figure 2, OC-48 150 200 250 ps Setup Time, t Hold Time, t
See Figure 4, OC-48 140 170 200 ps
DDRS
See Figure 4, OC-48 200 230 260 ps
DDRH
I2C INTERFACE DC CHARACTERISTICS LVCMOS
Input Voltage
High, VIH 0.7 VCC V
Low, VIL 0.3 VCC V Input Current VIN = 0.1 VCC or VIN = 0.9 VCC −10.0 +10.0 μA Output Low Voltage VOL, IOL = 3.0 mA 0.4 V
I2C INTERFACE TIMING See Figure 22
SCK Clock Frequency 400 kHz SCK Pulse Width High
High, t
Low, t
600 ns
HIGH
1300 ns
LOW
Start Condition
Hold Time, t
Setup Time, t
600 ns
HD;STA
600 ns
SU;STA
Data
Setup Time, t
Hold Time, t
100 ns
SU;DAT
300 ns
HD;DAT
SCK/SDA Rise/Fall Time, tR/tF 20 + 0.1 Cb 300 ns Stop Condition Setup Time, t Bus Free Time Between a Stop and a Start, t
600 ns
SU;STO
1300 ns
BUF
REFCLK CHARACTERISTICS Optional lock to REFCLK mode
Input Voltage Range @ REFCLKP or REFCLKN
VIL 0 V
VIH VCC V Minimum Differential Input Drive 100 mV p-p Reference Frequency 10 200 MHz Required Accuracy 100 ppm
Rev. A | Page 5 of 40
ADN2817/ADN2818
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Parameter Conditions Min Typ Max Unit
LVTTL DC INPUT CHARACTERISTICS
Input Voltage
High, VIH 2.0 V Low, VIL 0.8 V
Input Current
High IIH, VIN = 2.4 V +5 μA Low IIL, VIN = 0.4 V −5 μA
LVTTL DC OUTPUT CHARACTERISTICS
Output Voltage
High VOH, IOH = −2.0 mA 2.4 V Low VOL, IOL = +2.0 mA 0.4 V
Rev. A | Page 6 of 40
ADN2817/ADN2818
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BIT ERROR RATE MONITOR SPECIFICATIONS

TA = T unless otherwise noted.
Table 4.
Parameter Conditions Min Typ Max Unit
BERMON Extrapolation Mode I2C controlled eye profiling
BERMON Voltage Output Mode Analog voltage output
Sample Phase Adjust Mode
to T
MIN
Final Computed BER Accuracy
, VCC = V
MAX
MIN
to V
, VEE = 0 V, CF = 0.47 µF, SLICEP = SLICEN = VEE, input data pattern: PRBS 223 − 1,
MAX
Input BER range 1 × 10
−3
to 1 × 10
−12
,
±1 Decades input deterministic jitter (DJ) < 0.4 UI, DJ ceiling > 1 × 10−2; asymmetry < 0.1 UI; requires external data processing algorithms to implement Q factor extrapolation
18
Number of Bits (NUMBITS)
Number of data bits to collect pseudo errors; user programmable in increment factors of
3
over the range 218 to 239
2
PBER Measurement Time
2
239 UI
Numbits/
sec
data rate BER Range 5 × 10−2 BER Sample Phase Adjust Resolution 6 Degrees Sample Phase Adjust Accuracy <6 Degrees Sample Phase Adjust Range With respect to normal sampling instant −0.5 +0.5 UI Minimum Input Signal Level Differential peak to peak 4 mV Power Increase BER enabled 160 mW BER standby 77 mW
BER Accuracy
Input BER range 1 × 10 input DJ = 0 UI, DJ ceiling > 1 × 10
−3
to 1 × 10−9,
−2
;
±1 Decades
asymmetry = 0 UI; BER is read as a voltage on the VBER pin, when the BER mode pin = VEE
−3
Input BER range 1 × 10
to 1 × 10−9,
input DJ = 0.2 UI, DJ ceiling > 1 × 10
−2
;
+1/−2 Decades
asymmetry = 0 UI; BER is read as a voltage on
the VBER pin, when the BER mode pin = VEE Numbits Number of data bits to collect pseudo errors 227 UI Measurement Time 2.5 Gbps 0.054 sec 1 Gbps 0.134 sec 155 Mbps 0.865 sec 10 Mbps 1.34 sec VBER Voltage Range Via 3 kΩ resistor to VEE 0.1 0.9 V Minimum Input Signal Level Differential peak to peak 4 mV Power Increase BER voltage mode 160 mW
Sample Phase Adjust Step Size Monotonic 6 Degrees Sample Phase Adjust Accuracy <6 Degrees Sample Phase Adjust Range With respect to normal sampling instant −0.5 +0.5 UI Power Increase 160 mW
Rev. A | Page 7 of 40
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TIMING CHARACTERISTICS

CLKOUTP
t
t
S
DATAOUTP/
DATAOUTN
Figure 2. Default Mode Output Timing
OUTP
OUTN
OUTP – OUTN
V
CML
V
0V
SE
V
DIFF
Figure 3. Single-Ended vs. Differential Output Specifications
CLKOUTP/
CLKOUTN
DATAOUT P/
CLKOUTN
t
DDRS
Figure 4. Double Data Rate Mode Output Timing
H
t
DDRH
06001-002
V
SE
06001-003
06001-042
Rev. A | Page 8 of 40
ADN2817/ADN2818
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ABSOLUTE MAXIMUM RATINGS

TA = T C
F
Table 5.
Parameter Rating
Supply Voltage (VCC) 4.2 V Input Voltage (All Inputs)
Junction Temperature, Maximum 125°C Storage Temperature Range −65°C to +150°C Lead Temperature (Soldering 10 sec) 300°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
to T
MIN
= 0.47 µF, SLICEP = SLICEN = VEE, unless otherwise noted.
Minimum VEE − 0.4 V Maximum VCC + 0.4 V
, VCC = V
MAX
MIN
to V
, VEE = 0 V,
MAX

THERMAL CHARACTERISTICS

Thermal Resistance

32-lead LFCSP, 4-layer board with exposed paddle soldered to VEE: θ
= 28°C/W.
JA

ESD CAUTION

Rev. A | Page 9 of 40
ADN2817/ADN2818
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PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

VBER
VCC
VEE
DATAOUTP
DATAOUTN
SQUELCH
CLKOUTP
CLKOUTN
25
26
27
28
29
31
30
32
VCC
VREF
NIN PIN
SLICEP
SLICEN
VEE
1 2 3 4 5 6 7 8
PIN 1 INDICATOR
ADN2817/
ADN2818
TOP VIEW
(Not to Scale)
9
11
12
10
VCC
THRADJ
REFCLKP
REFCLKN
13
VEE
BERMODE
NOTES
1. EXPOSE D PADDLE ON THE BOTTOM OF THE PACKAGE MUST BE CONNECT ED TO VEE.
24
VCC
23
VEE
22
LOS
21
SDA
20
SCK
19
SADDR5
18
VCC
17
VEE
16
15
14
CF2
CF1
LOL
06001-004
Figure 5. Pin Configuration
Table 6. Pin Function Descriptions
Pin No. Mnemonic Type1 Description
1 BERMODE DI Set this pin to logic low to enable analog voltage output mode for BER monitor. 2 VCC P Power for Input Stage, LOS. 3 VREF AO Internal VREF Voltage. Decouple to GND with a 0.1 μF capacitor. 4 NIN AI Differential Data Input. CML. 5 PIN AI Differential Data Input. CML. 6 SLICEP AI Differential Slice Level Adjust Input. 7 SLICEN AI Differential Slice Level Adjust Input. 8 VEE P GND for the Limiting Amplifier (Lim Amp), LOS. 9 THRADJ AI LOS Threshold Setting Resistor. 10 REFCLKP DI Differential REFCLK Input. 10 MHz to 200 MHz. 11 REFCLKN DI Differential REFCLK Input. 10 MHz to 200 MHz. 12 VCC P VCO Power. 13 VEE P VCO GND. 14 CF2 AO Frequency Loop Capacitor. 15 CF1 AO Frequency Loop Capacitor. 16 LOL DO Loss of Lock Indicator. Active high, LVTTL. 17 VEE P FLL Detector GND. 18 VCC P FLL Detector Power. 19 SADDR5 DI Slave Address Bit 5. 20 SCK DI I2C Clock Input. 21 SDA DI I2C Data Input. 22 LOS DO Loss of Signal Detect Output. Active high, LVTTL. 23 VEE P Output Buffer, I2C GND. 24 VCC P Output Buffer, I2C Power. 25 CLKOUTN DO Differential Recovered Clock Output. CML. 26 CLKOUTP DO Differential Recovered Clock Output. CML. 27 SQUELCH DI Disable Clock and Data Outputs. Active high, LVTLL. 28 DATAOUTN DO Differential Recovered Data Output. CML. 29 DATAOUTP DO Differential Recovered Data Output. CML. 30 VEE P Phase Detector, Phase Shifter GND. 31 VCC P Phase Detector, Phase Shifter Power. 32 VBER AO This pin represents BER when analog BERMON is enabled with 3 kΩ to VEE. EP EPAD P Connect exposed pad to VEE. Note that the exposed pad must be connected to VEE.
1
P = power, AI = analog input, AO = analog output, DI = digital input, DO = digital output.
Rev. A | Page 10 of 40
ADN2817/ADN2818
V
www.BDTIC.com/ADI

TYPICAL PERFORMANCE CHARACTERISTICS

0.020
0.018
0.016
0.014
0.012
0.010
0.008
TRIP POINT (mV p-p)
0.006
0.004
0.002
0
110100
1k 100k10k 1M
R
(Ω)
TH
Figure 6. LOS Comparator Trip Point Programming
6001-005
200mV/DI
50ps/DIV
06001-040
Figure 9. Output Eye, OC-48
5
0
–5
GAIN (dB)
–10
–15
–20
100 1k 10k 100k 1M
ADN2817
JITTER F REQUENCY (Hz)
SONET
Figure 7. Jitter Transfer, OC-1
5
0
–5
GAIN (dB)
–10
–15
–20
100 1k 10k 100k 1M 10M
ADN2817
JITTER FREQUENCY (Hz)
SONET
Figure 8. Jitter Transfer, OC-3
100
10
1
JITTER AMPL ITUDE (UI)
ADN2817 EQUIPMENT LIMIT SONET GR-253 CORE 004
0.1 10 100 1k 10k 100k 1M
6001-032
JITTER FREQUENCY (Hz)
06001-039
Figure 10. Jitter Tolerance, OC-1
100
10
1
JITTER AMPLITUDE (UI)
ADN2817 EQUIPMENT LIMIT SONET GR-253 CORE 004
0.1 10 100 1k 10k 100k 10M1M
06001-034
JITTER FREQUENCY (Hz)
06001-038
Figure 11. Jitter Tolerance, OC-3
Rev. A | Page 11 of 40
ADN2817/ADN2818
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5
0
SONET
–5
GAIN (dB)
–10
–15
–20
1k 10k 100k 1M 10M
ADN2817
JITTER F REQUENCY (Hz)
Figure 12. Jitter Transfer, OC-12
5
0
SONET
–5
GAIN (dB)
–10
ADN2817
06001-033
1000
100
10
JITTER AMP LITUDE (UI)
1
ADN2817 EQUIPMENT LIMIT SONET GR- 253 CORE 004
0.1 10 100 1k 10k 100k 10M1M
JITTER F REQUENCY (Hz)
Figure 15. Jitter Tolerance, OC-12
1000
100
10
06001-037
–15
–20
10k 100k 1M 10M 100M
JITTER FRE QUENCY (Hz)
Figure 13. Jitter Transfer, OC-48
0.70
0.65
0.60
0.55
0.50
0.45
OUTPUT SWING (V)
0.40
CLKOUTP ADN2817 BOOST
0.35
CLKOUTN ADN2817 BOOS T CLKOUTP ADN2817 NO BOOST CLKOUTN ADN2817 NO BO OST
0.30 100M 600M 1.1G 1.6G 2.1G 2.6G 3.1G
DATA RATE (Hz)
Figure 14. Output Swing vs. Data Rate
JITTER AMPLITUDE (UI)
1
ADN2817 EQUIPMENT LIMIT SONET GR- 253 CORE 004
0.1 10 100 1k 10k 100k 100M10M1M
06001-035
JITTER F REQUENCY (Hz)
06001-036
Figure 16. Jitter Tolerance, OC-48
1
0.1
0.01
0.001
0.0001
0.00001
0.000001
BIT ERROR RATE
0.0000001
0.00000001
0.000000001
06001-043
1.01.52.02.53.03.54.04.5
INPUT LEVEL (mV)
06001-041
Figure 17. Bit Error Rate vs. Input Level
Rev. A | Page 12 of 40
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