Analog Devices ADN2813 pra Datasheet

Continuous Rate 12.3 Mb/s to 1.25 Gb/s Clock and
S
Preliminary Technical Data
FEATURES
Serial data input: 12.3 Mb/s to 1.25 Gb/s Exceeds SONET requirements for jitter transfer/
generation/tolerance Quantizer sensitivity: 6 mV typical Adjustable slice level: ±100 mV Patented clock recovery architecture Loss of signal (LOS) detect range: 3 mV to 15 mV Independent slice level adjust and LOS detector No reference clock required Loss of lock indicator
2
C™ interface to access optional features
I Single-supply operation: 3.3 V Low power: 350 mW typical 5 mm × 5 mm 32-lead LFCSP, Pb Free
APPLICATIONS
SONET OC-1/3/12 and all associated FEC rates Fibre Channel, GbE, HDTV, etc. WDM transponders Regenerators/repeaters Test equipment Broadband cross-connects and routers
FUNCTIONAL BLOCK DIAGRAM
Data Recovery IC with Integrated Limiting Amp
ADN2813
PRODUCT DESCRIPTION
The ADN2813 provides the receiver functions of quantization, signal level detect, and clock and data recovery for continuous data rates from 12.3 Mb/s to 1.25 Gb/s. The ADN2813 automatically locks to all data rates without the need for an external reference clock or programming. All SONET jitter requirements are met, including jitter transfer, jitter generation, and jitter tolerance. All specifications are quoted for −40°C to +85°C ambient temperature, unless otherwise noted.
This device, together with a PIN diode and a TIA preamplifier, can implement a highly integrated, low cost, low power fiber optic receiver.
The receiver front end loss of signal (LOS) detector circuit indicates when the input signal level has fallen below a user­adjustable threshold. The LOS detect circuit has hysteresis to prevent chatter at the output.
The ADN2813 is available in a compact 5 mm × 5 mm 32-lead chip scale package.
REFCLKP/N (OPTIONAL)
LOL
VCC VEECF1 CF2
LICEP/N
PIN
NIN
VREF
Rev. PrA
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
2
QUANTIZER
LOS
DETECT
PHASE
SHIFTER
DATA
RE-TIMING
2
DATAOUTP/NLOSTHRADJ CLKOUTP/N
FREQUENCY
DETECT
PHASE
DETECT
Figure 1.
LOOP
FILTER
LOOP
FILTER
2
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.326.8703 © 2004 Analog Devices, Inc. All rights reserved.
VCO
04951-0-001
ADN2813 Preliminary Technical Data
TABLE OF CONTENTS
Specifications..................................................................................... 3
Jitter Specifications....................................................................... 4
Output and Timing Specifications............................................. 5
Absolute Maximum Ratings............................................................ 6
Thermal Characteristics .............................................................. 6
ESD Caution.................................................................................. 6
Timing Characteristics..................................................................... 7
Pin Configuration and Function Descriptions............................. 8
Typical Performance Characteristics ............................................. 9
I2C Interface Timing and Internal Register Description........... 10
Terminology .................................................................................... 12
Jitter Specifications ......................................................................... 13
Jitter Generation .........................................................................13
Jitter Transfer............................................................................... 13
Jitter Tolerance............................................................................ 13
Functional Description.................................................................. 16
Frequency Acquisition............................................................... 16
Limiting Amplifier ..................................................................... 16
Slice Adjust.................................................................................. 16
Loss of Signal (LOS) Detector .................................................. 16
Lock Detector Operation .......................................................... 16
Harmonic Detector.................................................................... 17
Squelch Mode ............................................................................. 17
I2C Interface ................................................................................ 18
Reference Clock (Optional) ...................................................... 18
Applications Information.............................................................. 21
PCB Design Guidelines ............................................................. 21
DC-Coupled Application.......................................................... 23
Coarse Data Rate Readback Look-Up Table............................... 24
Outline Dimensions....................................................................... 26
Theory of Operation ...................................................................... 14
REVISION HISTORY
Revision PrA: Initial Version
Ordering Guide .......................................................................... 26
Rev. PrA | Page 2 of 28
Preliminary Technical Data ADN2813
SPECIFICATIONS
TA = T unless otherwise noted.
Table 1.
Parameter Conditions Min Typ Max Unit
QUANTIZER—DC CHARACTERISTICS
QUANTIZER—AC CHARACTERISTICS
QUANTIZER—SLICE ADJUSTMENT
LOSS OF SIGNAL DETECT (LOS)
R
R R OC-1 R R
LOSS OF LOCK DETECT (LOL)
GbE 1.0 µs ACQUISITION TIME
OC-12 2.0 ms OC-3 3.4 ms OC-1 9.8 ms
12.3 Mb/s 40.0 ms
1
PIN and NIN should be differentially driven and ac-coupled for optimum sensitivity.
2
When ac-coupled, the LOS assert and de-assert time is dominated by the RC time constant of the ac coupling capacitor and the 50 Ω input termination of the
ADN2813 input stage.
MIN
to T
, VCC = V
MAX
MIN
to V
, VEE = 0 V, CF = 0.47 µF, SLICEP = SLICEN = VEE, Input Data Pattern: PRBS 223 − 1,
MAX
Input Voltage Range @ PIN or NIN, dc-coupled 1.8 2.8 V
Peak-to-Peak Differential Input PIN – NIN 2.0 V
Input Common Mode Level
Differential Input Sensitivity 223 − 1 PRBS, ac-coupled,1 BER = 1 x 10
DC-coupled (see Figure 26, Figure 27, and Figure 28)
2.3 2.5 2.8 V
–10
10 6 mV p-p Input Overdrive (see Figure 11) 5 3 mV p-p Input Offset 500 µV Input RMS Noise BER = 1 x 10
–10
290 µV rms
Data Rate 12.3 1250 Mb/s S11 @ 2.5 GHz −15 dB Input Resistance Differential 100
Input Capacitance 0.65 pF
Gain SLICEP – SLICEN = ±0.5 V 0.08 0.1 0.12 V/V Differential Control Voltage Input SLICEP – SLICEN –0.95 +0.95 V Control Voltage Range DC level @ SLICEP or SLICEN VEE 0.95 V Slice Threshold Offset 1 mV
Loss of Signal Detect Range (see Figure 5) R
= 0 Ω 12 15 17 mV
Thresh
= 100 kΩ 2.0 3.0 4.0 mV
Thresh
Hysteresis (Electrical) GbE
= 0 Ω 5.0 6 7.0 dB
Thresh
= 100 kΩ 3.0 6 8.0 dB
Thresh
= 0 Ω 5.6 6 7.2 dB
Thresh
= 10 kΩ 2.0 4 6.7 dB
Thresh
LOS Assert Time DC-coupled2 500 ns LOS De-Assert Time DC-coupled2 400 ns
VCO Frequency Error for LOL Assert With respect to nominal 1000 ppm VCO Frequency Error for LOL De-Assert With respect to nominal 250 ppm LOL Response Time 12.3 Mb/s 4 ms OC-12 1.0 µs
Lock to Data Mode 1GbE 1.5 ms
Optional Lock to REFCLK Mode 10.0 ms
Rev. PrA | Page 3 of 28
ADN2813 Preliminary Technical Data
Parameter Conditions Min Typ Max Unit
DATA RATE READBACK ACCURACY
Coarse Readback (See Table 13) 10 % Fine Readback In addition to REFCLK accuracy Data rate < 20 Mb/s 200 ppm
Data rate > 20 Mb/s 100 ppm POWER SUPPLY VOLTAGE 3.0 3.3 3.6 V POWER SUPPLY CURRENT 106 mA OPERATING TEMPERATURE RANGE –40 +85 °C
JITTER SPECIFICATIONS
TA = T unless otherwise noted.
Table 2.
Parameter Conditions Min Typ Max Unit
PHASE-LOCKED LOOP CHARACTERISTICS
30 Hz1 100 UI p-p 300 Hz1 44 UI p-p 25 kHz 2.5 UI p-p 250 kHz1 1.0 UI p-p OC-3, 223 − 1 PRBS 30 Hz1 50 UI p-p 300 Hz1 24 UI p-p 6500 Hz 3.5 UI p-p 65 kHz 1.0 UI p-p
1
Jitter tolerance of the ADN2813 at these jitter frequencies is better than what the test equipment is able to measure.
MIN
to T
, VCC = V
MAX
MIN
to V
, VEE = 0 V, CF = 0.47 uF, SLICEP = SLICEN = VEE, Input Data Pattern: PRBS 223 − 1,
MAX
Jitter Transfer BW OC-12 71 108 kHz
OC-3 23 35 kHz
Jitter Peaking OC-12 0 0.03 dB
OC-3 0 0.03 dB
Jitter Generation OC-12, 12 kHz to 5 MHz 0.001 0.002 UI rms
0.01 0.019 UI p-p
OC-3, 12 kHz to 1.3 MHz 0.001 0.002 UI rms
0.01 0.011 UI p-p
Jitter Tolerance 1GbE, IEEE802.3
637kHz 0.749 UI p-p
OC-12, 223 − 1 PRBS
Rev. PrA | Page 4 of 28
Preliminary Technical Data ADN2813
OUTPUT AND TIMING SPECIFICATIONS
Table 3.
Parameter Conditions Min Typ Max Unit
LVDS OUPUT CHARACTERISTICS
(CLKOUTP/N, DATAOUTP/N)
Single-Ended Output Swing VSE (see Figure 3) 250 400 mV Differential Output Swing V Output Offset Voltage 1125 1200 1275 mV Output Impedance Differential 100
LVDS Ouputs Timing
Rise Time 20% to 80% TBD TBD ps Fall Time 80% to 20% TBD TBD ps Setup Time TS (see Figure 2), GbE 400 ps Hold Time TH (see Figure 2), GbE 400 ps
I2C INTERFACE DC CHARACTERISTICS LVCMOS
Input High Voltage VIH 0.7 VCC V Input Low Voltage VIL 0.3 VCC V Input Current VIN = 0.1 VCC or VIN = 0.9 VCC −10.0 +10.0 µA Output Low Voltage VOL, I
I2C INTERFACE TIMING (See Figure 10)
SCK Clock Frequency 400 kHz SCK Pulse Width High t SCK Pulse Width Low t Start Condition Hold Time t Start Condition Setup Time t Data Setup Time t Data Hold Time t SCK/SDA Rise/Fall Time TR/TF 20 + 0.1 Cb Stop Condition Setup Time t Bus Free Time between a Stop and a Start t
REFCLK CHARACTERISTICS Optional lock to REFCLK mode
Input Voltage Range @ REFCLKP or REFCLKN V V Minimum Differential Input Drive 100 mV p-p Reference Frequency 12.3 200 MHz Required Accuracy 100 ppm
LVTTL DC INPUT CHARACTERISTICS
Input High Voltage VIH 2.0 V Input Low Voltage VIL 0.8 V Input High Current IIH, VIN = 2.4 V 5 µA Input Low Current IIL, VIN = 0.4 V −5 µA
LVTTL DC OUTPUT CHARACTERISTICS
Output High Voltage VOH, IOH = −2.0 mA 2.4 V Output Low Voltage VOL, IOL = 2.0 mA 0.4 V
1
Cb = total capacitance of one bus line in pF. If mixed with Hs-mode devices, faster fall-times are allowed.
(see Figure 3) 500 800 mV
DIFF
= 3.0 mA 0.4 V
OL
600 ns
HIGH
1300 ns
LOW
600 ns
HD;STA
600 ns
SU;STA
100 ns
SU;DAT
300 ns
HD;DAT
600 ns
SU;STO
1300 ns
BUF
0 V
IL
VCC V
IH
1
300 ns
Rev. PrA | Page 5 of 28
ADN2813 Preliminary Technical Data
ABSOLUTE MAXIMUM RATINGS
TA = T µF, SLICEP = SLICEN = VEE, unless otherwise noted.
Table 4.
Parameter Rating
Supply Voltage (VCC) 4.2 V Minimum Input Voltage (All Inputs) VEE − 0.4 V Maximum Input Voltage (All Inputs) VCC + 0.4 V Maximum Junction Temperature 125°C Storage Temperature −65°C to +150°C Lead Temperature (Soldering 10 s) 300°C
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
MIN
to T
, VCC = V
MAX
MIN
to V
, VEE = 0 V, CF = 0.47
MAX
Stress above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
THERMAL CHARACTERISTICS
Thermal Resistance
32-LFCSP, 4-layer board with exposed paddle soldered to VEE
= 28°C/W.
θ
JA
Rev. PrA | Page 6 of 28
Preliminary Technical Data ADN2813
TIMING CHARACTERISTICS
CLKOUTP
T
T
S
H
DATAOUTP/N
04951-0-002
Figure 2. Output Timing
OUTP
OUTN
OUTP–OUTN
V
CML
V
0V
SE
V
DIFF
V
SE
04951-0-003
Figure 3. Single-Ended vs. Differential Output Specifications
Rev. PrA | Page 7 of 28
ADN2813 Preliminary Technical Data
*
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
32 TEST2
31 VCC
30 VEE
29 DATAOUTP
28 DATAOUTN
27 SQUELCH
26 CLKOUTP
25 CLKOUTN
TEST1 1
VCC 2
VREF 3
NIN 4
PIN 5 SLICEP 6 SLICEN 7
VEE 8
THERE IS AN EXPOSED PAD ON THE BOTTOM OF THE PACKAGE THAT MUST BE CONNECTED TO GND.
PIN 1 INDICATOR
ADN2813*
TOP VIEW
(Not to Scale)
VCC 12
THRADJ 9
REFCLKP 10
REFCLKN 11
CF2 14
VEE 13
CF1 15
LOL 16
24 VCC 23 VEE 22 LOS 21 SDA 20 SCK 19 SADDR5 18 VCC 17 VEE
04951-0-004
Figure 4. Pin Configuration
Table 5. Pin Function Descriptions
Pin No. Mnemonic Type1 Description
1 TEST1 Connect to VCC. 2 VCC P Power for Limamp, LOS. 3 VREF AO Internal VREF Voltage. Decouple to GND with a 0.1 µF capacitor. 4 NIN AI Differential Data Input. CML. 5 PIN AI Differential Data Input. CML. 6 SLICEP AI Differential Slice Level Adjust Input. 7 SLICEN AI Differential Slice Level Adjust Input. 8 VEE P GND for Limamp, LOS. 9 THRADJ AI LOS Threshold Setting Resistor. 10 REFCLKP DI Differential REFCLK Input. 12.3 MHz to 200 MHz. 11 REFCLKN DI Differential REFCLK Input. 12.3 MHz to 200 MHz. 12 VCC P VCO Power. 13 VEE P VCO GND. 14 CF2 AO Frequency Loop Capacitor. 15 CF1 AO Frequency Loop Capacitor. 16 LOL DO Loss of Lock Indicator. LVTTL active high. 17 VEE P FLL Detector GND. 18 VCC P FLL Detector Power. 19 SADDR5 DI Slave Address Bit 5. 20 SCK DI I 21 SDA DI I 22 LOS DO Loss of Signal Detect Output. Active high. LVTTL. 23 VEE P Output Buffer, I 24 VCC P Output Buffer, I 25 CLKOUTN DO Differential Recovered Clock Output. LVDS. 26 CLKOUTP DO Differential Recovered Clock Output. LVDS. 27 SQUELCH DI Disable Clock and Data Outputs. Active high. LVTLL. 28 DATAOUTN DO Differential Recovered Data Output. LVDS. 29 DATAOUTP DO Differential Recovered Data Output. LVDS. 30 VEE P Phase Detector, Phase Shifter GND. 31 VCC P Phase Detector, Phase Shifter Power. 32 TEST2 Connect to VCC. Exposed Pad Pad P Connect to GND
1
Type: P = power, AI = analog input, AO = analog output, DI = digital input, DO = digital output.
2
C Clock Input.
2
C Data Input.
2
C GND.
2
C Power.
Rev. PrA | Page 8 of 28
Preliminary Technical Data ADN2813
TYPICAL PERFORMANCE CHARACTERISTICS
16
14
12
10
8
TRIP POINT (mV p-p)
6
4
2
1 10 100
1k 10k 100k
R
()
TH
04951-0-005
Figure 5. LOS Comparator Trip Point Programming
Rev. PrA | Page 9 of 28
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