Analog Devices ADN2809XCP-RL, ADN2809XCP Datasheet

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Multi -
Rate to 2.7Gb p s Clock and Data
Recovery IC with Limi tin g Amp li fi er
CF
Loss of lock
a
Pr eli m i n ary Tech ni c al Data ADN2809
FEATURES Meets SONET Requ i r ement s for Jitt er Transf er / Generatio n / Tolerance Quantizer Sensitiv i ty: 6 mV typi cal
Adju st able Slice Level: +/- 100 mV
1.9GHz minimum Bandwi dt h
Loss of Sign al Detect Range: 4mV to 17mV Single Reference Clock Frequenc y fo r all rates Inc l udin g 15/14 (7%) Wrapp er Rate
Cho ice of 19.44, 38.88, 77.76 or
155.52MHz LVPECL / LVDS / LVCMOS / LVTTL compati ble inp u t s (LVPECL / L VDS only at 155.52 MHz)
19.44MHz Cryst al Osci ll ato r fo r Mod u le apps Loss of Lock indicator Loop b ack mo d e for High Speed Test Data Output Squelch & Cloc k Recovery Func tio n s Single Suppl y Operatio n: 3.3 Volts (+ Low Power: 780 mW Typical Patented Clock Recovery Archit ectu re 7 x 7 mm 48 pin L FCSP
APPLICATIONS SONET OC-3/12/48, SDH STM-1/4/16, and all asso c i ated FEC rates WDM transpon ders SONET/SDH regenerato rs and test equi p m ent Backplane application s
10%)

PRODUCT DESCRIP TI O N

The ADN2809 provides the receiver functions of Quantization, Signal Level Detect and Clock and Data Recovery at rates of OC-3, OC-12, Gigabit Ethernet, OC-48 and all FEC rates. All SONET jitter requirements are met, including: Jitter Transfer; Jitter Generation; and Jitter Tolerance. All specifications are quoted for -40 to 85C ambient temperature unless otherwise noted.
The device is intended for WDM system applications and can be used with either an external reference clock or an on-chip oscillator crystal. Both native rates and 15/14 rate digital ‘wrappers’ rates are supported by the ADN2809, without any change of reference clock required.
This device together with a PIN diode and a TIA preamplifier can implement a highly integrated, low cost, low power fiber optic receiver.
The receiver front end Signal Detect circuit indicates when the input signal level has fallen below a user adjustable threshold.
The ADN2809 is available in a compact 48 pin chip scale package.
REV. PrB Sept 2001
reliable. However, no responsibility is assumed by
under any patent or patent rights of Analog Devices.

Fun ctional Block Diagram

Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 ©Analog Devi c es, Inc., 2001
Norwo o d, MA 02062-9106 U.S.A.
ADN2809
Para meter
JITTER TOLERANCE TRACKING BANDWIDTH
ADN2809 ELECTRICAL CHARACTERISTICS at T
QUANTIZE R–DC CHARACTERI STICS
Input Voltage Range Input Common Mode Voltage Input Peak-to-Peak Differential Voltage Input Sensitivity, V Input Overdrive, V
(Peak-to-Peak Differential)
SENSE
OD
Input Maximum Offset Voltage Input Current Input RMS Noise

QUANTIZE R-AC CHARACTERI STICS

Upper –3 dB Bandwidth Small Signal Gain S11 Maximum @ 2.5GHz, Figure 7 Input Resistance Input Capacitance Pulse Width Distortion

QUANTIZ E R SLIC E ADJUSTMENT

Gain (Threshold/Vin) Control Voltage Range Control Voltage Range Slice Threshold Offset

LEVEL DETECT

Level Detect Range (See Figure 4)
Response Time
Hysterises (Electrical), AC Coupled Signal
SDOUT output Logic High SDOUT output Logic Low
Level Detect Output is a logic “1” LVCMOS Compatible with no signal present.

POWER SUPPLY VOLTAGE POWER SUPPLY CURRENT PHASE-LOCKED LOOP CHARACTERISTICS

JITTER TRANSFER BANDWIDTH (See Figure 5 and Table 1)
(See Figure 5 and Table 1)
JITTER TOLERANCE (OC-48)
to T
, VCC=V
to V
A=TMIN
MAX
, VEE=0V, CF=4.7µF, 20 ohm ESR for xo unless otherwise noted
MIN
MAX
Conditions Min Typ Max Units
Single Ended, DC Coupled @ PINor N
PINor N
@
AC Coupled I/P
IN
PIN- NIN, Figure 2, BER= <1 x 10 Figure 3, BER = <1 X 10
1
-10
-10
SliceP, SliceN = VCC
-10
1 X 10
BER = <
Differential
Single-Ended
Vin = SliceP-SliceN SliceP-SliceN SliceP or SliceN Full input range
= 0
R
THRESH
R
= 10k
THRESH
R
= 200k
THRESH
DC Coupled
= 0
R
THRESH
R
= 10k
THRESH
R
= 200k
THRESH
Load = +2mA ( Load = -2mA (
to V
V
MIN
to V
V
MIN
NOTE: SONET SPECS APPEAR IN BOLD
ADN2812 Sources I) ADN2812 Sinks I)
MAX MAX
OC-48 Gigabit Ethernet OC-12 OC-3
OC-48 Gigabit Ethernet OC-12 OC-3
600 Hz 6 KHz 100 MHz 1 MHz
IN
0
0.4
1.2
1.2
2.4
10
5
6 3
0.5 10
244
µVrms
1.9 54
-15 50
0.65 10
0.131
-0.8
1.3
-1.0
2 6
15
0.1
2.7
3
8.8 17
3
5 5 5
3
0.2
0.134
0.8
VCC
1.0
4 12 21
5
7
7
7
0.4
3.0 3.6 V
140 236 380 mA
1.0
0.5
0.25
0.065
370 185
93 23
4.8
4.8
4.8
4.8
80
>20
5.5
>0.6
2
2
2000
1000
500 130
MHz MHz MHz MHz
UIp-p UIp-p UIp-p UIp-p
V V
V mV mV mV
µA
GHz
dB dB
pF ps
V/V
V
V mV
mV mV mV
µs
dB dB dB
V
V
KHz KHz KHz KHz
JITTER GENERATION
(12kHz to 20MHz)
(12kHz to 10MHz)
(12kHz to 5MHz)
(12kHz to 1.3MHz)
OC-48
Gigabit Ethernet
OC-12
OC-3
REV. PrB Oct. .2001 - 2 -
0.003
0.03
0.003
0.03
0.003
0.03
0.003
0.03
0.01
0.1
0.01
0.1
0.01
0.1
0.01
0.1
UI rms
UIp-p
UI rms
UIp-p
UI rms
UIp-p
UI rms
UIp-p
Para meter
JITTER PEAKING MAXIMUM
ADN2809 ELECTRICAL CHARACTERISTICS at T
CML OUTPUT FORMAT
Single-Ended Output Voltage Swing V Differential Output Voltage Swing V
Rise Time (t Fall Time (t
)
R
)
F
DIFF
ADN2809
to T
, VCC=V
to V
A=TMIN
MAX
Conditions Min Typ Max Units
OC-48 Gigabit Ethernet OC-12 OC-3
SE
See Figure 2 and Figure 6 See Figure 2 and Figure 6
20% - 80% 80% - 20%
, VEE=0V, CF=4.7µF, 20 ohm ESR for xo unless otherwise noted
MIN
MAX
0.1
0.1
0.1
0.1
300 600
430 860
550
1100
150 150
dB dB dB dB
mV mV
pS pS
Output High Voltage V Output Low Voltage V
OH OL
Data Setup Time T
(Figure 1)
S
Data Hold Time T
(Figure 1)
H

TEST DATA DC CHARACTERI STI CS

Input Voltage Swing V
(Figure 2)
SE
Input Voltage Range

LVTTL DC CHARACTERISTICS

Output High Voltage
V
OH
Output Low Voltage
V
OL
Input High Voltage
V
IH
Input Low Voltage
V
IL
Input High Current
I
IH
Input Low Current
I
IL

REFCL K DC CHARACTE RISTICS

Input Voltage Swing V
(Figure 2)
SE
Input Voltage Range
Note: (1) Recommended for Optimum Sensitivity. Note: (2) Equipment Limitation.
Figure 6 Figure 6
OC48 Gigabit Ethernet OC12 OC3
OC48 Gigabit Ethernet OC12 OC3
Single-Ended Single-Ended
= -100uA (ADN2809 Sources I)
I
OH
= 1.0mA (ADN2809 Sinks I)
I
OL
Vin = +2.4 V @ +25C Vin = +0.5 V @ +25C
Single-Ended Single-Ended
VCC-0.55
150 350 750
3150
150 350 750
3150
0.06
2.3
2.4
2.0
-500
0.032 0
VCC
VCC-0.32
0.8
VCC+0.4
0.5
0.8
50
VCC VCC
V V
pS pS pS pS
pS pS pS pS
V V
V V
V V
µA µA
V V

ABSOL UTE M AXIMUM RATINGS

Supply Voltage.............................................................. ...+8 V
Input Voltage (pin x or pin xto Vcc).... ........................... .TBD
Maximum Junction Temperature..............................165 deg C
Storage Temperature Range.............. -65 deg C to +150 deg C
Lead Temperature (Soldering 10 sec).. ....................300 deg C
ESD Rating (human body model)....... ........................... ..TBD
Stress above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those i ndicated in the operational sections of this s pecification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
REV. PrB Oct. .2001 - 3 -

ORDERI NG GUIDE

MODEL TEMP
RANGE
ADN2809XCP -40/+85oC LFCSP-16 CP-16
ADN2809XCP-RL -40/+85oC
Package
Descript-ion
LFCSP-16
2500 Pieces
Option
CP-16
ADN2809
Figure 2. Signal Level Definition
OC-48 2^ 23 LOS Curv e
RThresh
LOS Trip Voltag e (mV)
Figure 1. Output Timing definitions
REV. PrB Oct. .2001 - 4 -
Figure 3. Quantizer Signal Definitions
20.0
18.0
16.0
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0 0 20000 40000 60000 80000 100000 120000 140000 160000 180000 2 00 000
Figure 4. LOS Comparator Trip Point Programming
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