generation/tolerance
Quantizer sensitivity: 3.3 mV typical
Adjustable slice level: ±95 mV
Patented clock recovery architecture
Loss-of-signal (LOS) detect range: 2.6 mV to 18.4 mV
Independent slice level adjust and LOS detector
No reference clock required
Loss-of-lock indicator
I2C® interface to access optional features
Single-supply operation: 3.3 V
Low power: 423 mW typical
5 mm × 5 mm, 32-lead LFCSP, Pb free
APPLICATIONS
BPON ONT
SONET OC-12
WDM transponders
Regenerators/repeaters
Test equipment
Broadband cross-connects and routers
with Integrated Limiting Amplifier
ADN2804
GENERAL DESCRIPTION
The ADN2804 provides the receiver functions of quantization,
signal level detect, clock and data recovery, and data retiming
for 622 Mbps NRZ data. The ADN2804 automatically locks to
622 Mbps data without the need for an external reference clock
or programming. In the absence of input data, the output clock
drifts no more than ±5%. All SONET jitter requirements are
met, including jitter transfer, jitter generation, and jitter
tolerance. All specifications are quoted for −40°C to +85°C
ambient temperature, unless otherwise noted.
This device, together with a PIN diode and a TIA preamplifier,
n implement a highly integrated, low cost, low power fiber
ca
optic receiver.
The receiver’s front-end loss-of-signal (LOS) detector circuit
dicates when the input signal level falls below a user-adjustable
in
threshold. The LOS detect circuit has hysteresis to prevent chatter
at the output.
The ADN2804 is available in a compact 5 mm × 5 mm,
32-lead LFCS
P.
FUNCTIONAL BLOCK DIAGRAM
REFCLKP/REFCLKN
(OPTIO NAL)
SLICEP/SLICEN
PIN
NIN
VREF
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
POWER SUPPLY VOLTAGE 3.0 3.3 3.6 V
POWER SUPPLY CURRENT Locked to 622.08 Mbps 128 mA
OPERATING TEMPERATURE RANGE –40 +85 °C
1
PIN and NIN should be differentially driven and ac-coupled for optimum sensitivity.
2
When ac-coupled, the LOS assert and deassert times are dominated by the RC time constant of the ac coupling capacitor and the 50 Ω input termination of the
Input Voltage Range @ PIN or NIN, dc-coupled 1.8 2.8 V
Peak-to-Peak Differential Input PIN − NIN 2.0 V
Input Common-Mode Level DC-coupled (see Figure 27, Figure 28, and Figure 29) 2.3 2.5 2.8 V
Differential Input Sensitivity 223 − 1 PRBS, ac-coupled,1 BER = 1 × 10
Data Rate 622 Mbps
Output Clock Range Absence of input data 622 ± 5% MHz
S11 @ 622 MHz −15 dB
Input Resistance Differential 100 Ω
Input Capacitance 0.65 pF
Gain SLICEP − SLICEN = ±0.5 V 0.10 0.11 0.13 V/V
Differential Control Voltage Input SLICEP − SLICEN −0.95 +0.95 V
Control Voltage Range DC level @ SLICEP or SLICEN VEE 0.95 V
Slice Threshold Offset 1 mV
Loss-of-Signal Detect Range (see Figure 6) R
= 0 Ω 14.9 16.7 18.4 mV
THRESH
= 100 kΩ 2.6 3.5 4.4 mV
THRESH
Hysteresis (Electrical) OC-12
= 0 Ω 6.2 6.9 7.7 dB
THRESH
= 100 kΩ 4.1 6.1 8.1 dB
THRESH
LOS Assert Time DC-coupled
LOS Deassert Time DC-coupled
2
2
500 ns
400 ns
VCO Frequency Error for LOL Assert With respect to nominal 1000 ppm
VCO Frequency Error for LOL Deassert With respect to nominal 250 ppm
LOL Response Time OC-12 200 μs
Lock to Data Mode OC-12 2.0 ms
Optional Lock to REFCLK Mode 20.0 ms
Fine Readback In addition to REFCLK accuracy OC-12 100 ppm
Rev. 0 | Page 3 of 24
ADN2804
www.BDTIC.com/ADI
JITTER SPECIFICATIONS
TA = T
unless otherwise noted.
Table 2.
Parameter Conditions Min Typ Max Unit
PHASE-LOCKED LOOP CHARACTERISTICS
30 Hz
300 Hz
25 kHz 2.5 UI p-p
250 kHz
1
Jitter tolerance of the ADN2804 at these jitter frequencies is better than what the test equipment is able to measure.
to T
MIN
Jitter Transfer Bandwidth OC-12 75 130 kHz
Jitter Peaking OC-12 0 0.03 dB
Jitter Generation OC-12, 12 kHz to 5 MHz 0.001 0.003 UI rms
Output Voltage High VOH (see Figure 3) 1475 mV
Output Voltage Low VOL (see Figure 3) 925 mV
Differential Output Swing VOD (see Figure 3) 250 320 400 mV
Output Offset Voltage VOS (see Figure 3) 1125 1200 1275 mV
Output Impedance Differential 100 Ω
LVDS Outputs’ Timing
Rise Time 20% to 80% 115 220 ps
Fall Time 80% to 20% 115 220 ps
Setup Time TS (see Figure 2), OC-12 760 800 840 ps
Hold Time TH (see Figure 2), OC-12 760 800 840 ps
I2C INTERFACE DC CHARACTERISTICS LVCMOS
Input High Voltage VIH 0.7 VCC V
Input Low Voltage VIL 0.3 VCC V
Input Current VIN = 0.1 VCC or VIN = 0.9 VCC −10.0 +10.0 μA
Output Low Voltage VOL, IOL = 3.0 mA 0.4 V
I2C INTERFACE TIMING See Figure 11
SCK Clock Frequency 400 kHz
SCK Pulse Width High t
SCK Pulse Width Low t
Start Condition Hold Time t
Start Condition Setup Time t
Data Setup Time t
Data Hold Time t
SCK/SDA Rise/Fall Time TR/TF 20 + 0.1 Cb
Stop Condition Setup Time t
Bus Free Time Between a Stop and a Start t
REFCLK CHARACTERISTICS Optional lock to REFCLK mode
Input Voltage Range @ REFCLKP or REFCLKN
V
V
Minimum Differential Input Drive 100 mV p-p
Reference Frequency 10 160 MHz
Required Accuracy 100 ppm
LVTTL DC INPUT CHARACTERISTICS
Input High Voltage VIH 2.0 V
Input Low Voltage VIL 0.8 V
Input High Current IIH, VIN = 2.4 V 5 μA
Input Low Current IIL, VIN = 0.4 V −5 μA
LVTTL DC OUTPUT CHARACTERISTICS
Output High Voltage VOH, IOH = −2.0 mA 2.4 V
Output Low Voltage VOL, IOL = +2.0 mA 0.4 V
1
Cb = total capacitance of one bus line in picofarads. If used with Hs-mode devices, faster fall times are allowed.
Supply Voltage (VCC) 4.2 V
Minimum Input Voltage (All Inputs) VEE − 0.4 V
Maximum Input Voltage (All Inputs) VCC + 0.4 V
Maximum Junction Temperature 125°C
Storage Temperature Range −65°C to +150°C
MIN
to T
, VCC = V
MAX
MIN
to V
, VEE = 0 V, CF =
MAX
Stress above those listed under Absolute Maximum Ratings may
ca
use permanent damage to the device. This is a stress rating
only; functional operation of the device at these or any other
conditions above those indicated in the operational sections of
this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
Thermal Resistance
32-lead LFCSP, 4-layer board with exposed paddle soldered to
VEE, θ
= 28°C/W.
JA
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. 0 | Page 6 of 24
ADN2804
www.BDTIC.com/ADI
TIMING CHARACTERISTICS
CLKOUTP
T
T
S
DATAOUTP/
DATAOUTN
V
OH
H
Figure 2. Output Timing
DIFFERENTIAL CLKOUTP/ N, DATAOUTP/N
05801-002
V
OS
V
OL
|VOD|
5801-032
Figure 3. Differential Output Specifications
5mA
R
LOAD
V
100Ω
5mA
SIMPLIFIED LVDS
OUTPUT STAGE
100Ω
DIFF
05801-033
Figure 4. Differential Output Stage
Rev. 0 | Page 7 of 24
ADN2804
www.BDTIC.com/ADI
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
32 TEST2
31 VCC
30 VEE
29 DATAOUTP
28 DATAOUTN
27 SQUELCH
26 CLKOUTP
25 CLKOUTN
TEST1 1
VCC 2
VREF 3
NIN 4
PIN 5
SLICEP 6
SLICEN 7
VEE 8
* THERE IS AN EXPOSED PAD ON THE BOTTOM OF
THE PACKAGE THAT MUST BE CONNECT ED TO GND.
PIN 1
INDICATOR
ADN2804*
TOP VIEW
(Not to Scale)
VCC 12
THRADJ 9
REFCLKP 10
REFCLKN 11
CF2 14
VEE 13
CF1 15
LOL 16
24 VCC
23 VEE
22 LOS
21 SDA
20 SCK
19 SADDR5
18 VCC
17 VEE
05801-004
Figure 5. Pin Configuration
Table 5. Pin Function Descriptions
Pin No. Mnemonic Type
1 TEST1 Connect to VCC.
2 VCC P Power for Limiting Amplifier, LOS.
3 VREF AO Internal VREF Voltage. Decouple to GND with a 0.1 μF capacitor.
4 NIN AI Differential Data Input. CML.
5 PIN AI Differential Data Input. CML.
6 SLICEP AI Differential Slice Level Adjust Input.
7 SLICEN AI Differential Slice Level Adjust Input.
8 VEE P GND for Limiting Amplifier, LOS.
9 THRADJ AI LOS Threshold Setting Resistor.
10 REFCLKP DI Differential REFCLK Input. 10 MHz to 160 MHz.
11 REFCLKN DI Differential REFCLK Input. 10 MHz to 160 MHz.
12 VCC P VCO Power.
13 VEE P VCO GND.
14 CF2 AO Frequency Loop Capacitor.
15 CF1 AO Frequency Loop Capacitor.
16 LOL DO Loss-of-Lock Indicator. LVTTL active high.
17 VEE P FLL Detector GND.
18 VCC P FLL Detector Power.
19 SADDR5 DI Slave Address Bit 5.
20 SCK DI I2C Clock Input.
21 SDA DI I2C Data Input.
22 LOS DO Loss-of-Signal Detect Output. Active high. LVTTL.
23 VEE P Output Buffer, I2C GND.
24 VCC P Output Buffer, I2C Power.
25 CLKOUTN DO Differential Recovered Clock Output. LVDS.
26 CLKOUTP DO Differential Recovered Clock Output. LVDS.
27 SQUELCH DI Disable Clock and Data Outputs. Active high. LVTTL.
28 DATAOUTN DO Differential Recovered Data Output. LVDS.
29 DATAOUTP DO Differential Recovered Data Output. LVDS.
30 VEE P Phase Detector, Phase Shifter GND.
31 VCC P Phase Detector, Phase Shifter Power.
32 TEST2 Connect to VCC.
Exposed Pad Pad P Connect to GND.
1
Type: P = power, AI = analog input, AO = analog output, DI = digital input, DO = digital output.
1
Description
Rev. 0 | Page 8 of 24
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