Datasheet ADMP405 Datasheet (ANALOG DEVICES)

Omnidirectional Microphone with

Data Sheet

FEATURES

Tiny 3.35 mm × 2.50 mm × 0.88 mm surface-mount package
High SNR of 62 dBA
High sensitivity of −38 dBV
Flat frequency response from 200 Hz to 15 kHz
Low current consumption: <250 μA
Single-ended analog output
High PSRR of 70 dB
Compatible with Sn/Pb and Pb-free solder processes
RoHS/WEEE compliant

APPLICATIONS

Smartphones and feature phones
Teleconferencing systems
Digital video cameras
Bluetooth headsets
Video phones
Tab le ts

Bottom Port and Analog Output

ADMP405

GENERAL DESCRIPTION

The ADMP405 is a high quality, high performance, low power,
analog output, bottom-ported omnidirectional MEMS
microphone. The ADMP405 consists of a MEMS microphone
element, an impedance converter, and an output amplifier. The

ADMP405 sensitivity specification makes it an excellent choice

for both near field and far field applications. The ADMP405 has
a high SNR and flat wideband frequency response, resulting in
natural sound with high intelligibility. The specially designed
low frequency cutoff reduces wind noise. Low current
consumption enables long battery life for portable applications.
A built-in particle filter provides high reliability. The ADMP405
complies with the TIA-920 Telecommunications Telephone

Terminal Equipment Transmission Requirements for Wideband
Digital Wireline Telephones standard.

The ADMP405 is available in an ultraminiature 3.35 mm ×

2.50 mm × 0.88 mm surface-mount package. It is reflow solder
compatible with no sensitivity degradation. The ADMP405 is
halide free.

FUNCTIONAL BLOCK DIAGRAM

OUTPUT
AMPLIFIER

ADMP405

Rev. B

Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.

OUTPUT

POWER

VDD

GND

Figure 1.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: [phone] www.analog.com
Fax: [phone] ©2010–2011 Analog Devices, Inc. All rights reserved.

09027-001

ADMP405 Data Sheet

TABLE OF CONTENTS

Features .............................................................................................. 1

Applications ....................................................................................... 1 

General Description ......................................................................... 1

Functional Block Diagram .............................................................. 1

Revision History ............................................................................... 2

Specifications ..................................................................................... 3

Absolute Maximum Ratings ............................................................ 4

ESD Caution .................................................................................. 4

Pin Configuration and Function Descriptions ............................. 5

Typical Performance Characteristics ............................................. 6

Applications Information ................................................................ 7

REVISION HISTORY

9/11—Rev. A to Rev. B

Changes to Figure 1 .......................................................................... 1

Changes to Supply Voltage Parameter, Table 1 ............................. 3

Changes to Table 3 ............................................................................ 4

Added Connecting to Analog Devices, Inc., Audio Codecs

Section and Supporting Documents Section ................................ 7

Changes to Pick and Place Equipment Section

(20 kg to 10 kg) .................................................................................. 9

Added LGA_CAV Tape and Reel Outline Dimensions,

Figure 12 .......................................................................................... 11

Connecting to Analog Devices, Inc., Audio Codecs ................7

Supporting Documents ................................................................7

PCB Land Pattern Layout .................................................................8

Handling Instructions .......................................................................9

Pick-and-Place Equipment ..........................................................9

Reflow Solder .................................................................................9

Board Wash ....................................................................................9

Reliability Specifications ................................................................ 10

Outline Dimensions ....................................................................... 11

Ordering Guide .......................................................................... 11

2/11—Rev. 0 to Rev. A

Changes to Applications Section and

General Description Section ........................................................ 1

Change to Table 1 .............................................................................. 3

Changes to Table 2 ............................................................................. 4

7/10—Revision 0: Initial Version

Rev. B | Page 2 of 12

Data Sheet ADMP405

SPECIFICATIONS

TA = 25°C, VDD = 1.8 V, unless otherwise noted. All minimum and maximum specifications are guaranteed. Typical specifications are not
guaranteed.

Table 1.

Parameter Symbol Test Conditions/Comments Min Typ Max Unit

PERFORMANCE

Directionality Omni
Sensitivity 1 kHz, 94 dB SPL −41 −38 −35 dBV
Signal-to-Noise Ratio SNR 62 dBA
Equivalent Input Noise EIN 32 dBA SPL
Dynamic Range Derived from EIN and maximum acoustic input 88 dB
Frequency Response1 Low frequency –3 dB point 200 Hz
High frequency –3 dB point 15 kHz

Total Harmonic Distortion THD 105 dB SPL 3 %
Power Supply Rejection Ratio PSRR

Maximum Acoustic Input Peak 120 dB SPL

POWER SUPPLY

Supply Voltage VDD 1.5 3.3 V
Supply Current IS 250 μA

OUTPUT CHARACTERISTICS

Output Impedance Z
Output DC Offset 0.8 V
Output Current Limit 90 μA

1

See and . Figure 4 Figure 6

OUT

Deviation limits from flat response within pass
band

217 Hz, 100 mV p-p square wave
superimposed on V

200 Ω

= 1.8 V

DD

−3/+2 dB

70 dB

Rev. B | Page 3 of 12

ADMP405 Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter Rating

Supply Voltage −0.3 V to 3.6 V
Sound Pressure Level (SPL) 160 dB
Mechanical Shock 10,000 g
Vibration

Per MIL-STD-883 Method 2007,
Test Condition B

Temperature Range −40°C to +70°C

T

P

T

L

T

SMAX

RAMP-UP

Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.

ESD CAUTION

t

P

CRITICAL Z O NE

t

L

T

TO T

L

P

T

SMIN

TEMPERATURE

t

S

PREHEAT

t

25°C

TO PEAK

TIME

RAMP-DOWN

09027-002

Figure 2. Recommended Soldering Profile Limits

Table 3. Recommended Soldering Profile Limits

Profile Feature Sn63/Pb37 Pb Free

Average Ramp Rate (TL to TP) 1.25°C/sec max 1.25°C/sec max
Preheat

Minimum Temperature (T
Maximum Temperature (T
Time (T

Ramp-Up Rate (T

SMIN

to T

), tS 60 sec to 75 sec 60 sec to 75 sec

SMAX

to TL) 1.25°C/sec 1.25°C/sec

SMAX

) 100°C 150°C

SMIN

) 150°C 200°C

SMAX

Time Maintained Above Liquidous (tL) 45 sec to 75 sec ~50 sec

Liquidous Temperature (TL) 183°C 217°C
Peak Temperature (TP) 215°C + 3°C/−3°C 245°C + 0°C/−5°C
Time Within 5°C of Actual Peak Temperature (tP) 20 sec to 30 sec 20 sec to 30 sec
Ramp-Down Rate 3°C/sec max 3°C/sec max
Time 25°C (t

) to Peak Temperature 5 minute max 5 minute max

25°C

Rev. B | Page 4 of 12

Data Sheet ADMP405

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

GND

2

ADMP405

TOP VIEW

(TERMINAL SIDE DO WN)

Not to Scale

Figure 3. Pin Configuration

1

OUTPUT

3

V

DD

Table 4. Pin Function Descriptions

Pin No. Mnemonic Description

1 OUTPUT Analog Output Signal.
2 GND Ground.
3 VDD Power Supply.

09027-003

Rev. B | Page 5 of 12

ADMP405 Data Sheet

TYPICAL PERFORMANCE CHARACTERISTICS

10

8

6

4

2

0

–2

SENSITIVITY (dB)

–4

–6

–8

–10

100

FREQUENCY (Hz )

10k1k

09027-004

Figure 4. Frequency Response Mask

0

–10

10

0

(dB)

–10

–20

100

1k 10k

FREQUENCY (Hz)

Figure 6. Typical Frequency Response (Measured)

09027-006

–20

–30

–40

PSRR (dB)

–50

–60

–70

–80

100 10k

1k

FREQUE NC Y (Hz)

Figure 5. Typical Power Supply Rejection Ratio vs. Frequency

09027-005

Rev. B | Page 6 of 12

Data Sheet ADMP405

APPLICATIONS INFORMATION

CONNECTING TO ANALOG DEVICES, INC., AUDIO CODECS

The ADMP405 output can be connected to a dedicated codec
microphone input (see Figure 7) or to a high input impedance
gain stage (see Figure 8). A 0.1 μF ceramic capacitor placed close
to the ADMP405 supply pin is used for testing and is recom­mended to adequately decouple the microphone from noise on
the power supply. A dc-blocking capacitor is required at the
output of the microphone.

0.1µF

V

DD

ADMP405

OUTPUT

GND

2.2µF

MINIMUM

Figure 7. ADMP405 Connected to the Analog Devices ADAU1761 or

ADAU1361 Codec

MICBIAS

ADAU1761

OR

ADAU1361

LINN

LINP

CM

9027-020

GAIN = (R1 + R2)/R1

V

DD

ADMP405

OUTPUT

GND

0.1µF

MINIMUM

1µF

V

REF

10kΩ

R1 R2

V

REF

OP177

V

OUT

09027-021

Figure 8. ADMP405 Connected to the OP177 Op Amp

SUPPORTING DOCUMENTS

Evaluation Board User Guide

UG-143, EVAL-ADMP405Z-FLEX: Bottom-Ported Analog

Output MEMS Microphone Evaluation Board

Application Notes

AN-1003, Recommendations for Mounting and Connecting

Analog Devices, Inc., Bottom-Ported MEMS Microphones

AN-1068, Reflow Soldering of the MEMS Microphone

AN-1112, Microphone Specifications Explained

AN-1124, Recommendations for Sealing Analog Devices, Inc.,

Bottom-Port MEMS Microphones from Dust and Liquid
Ingress

Rev. B | Page 7 of 12

ADMP405 Data Sheet

PCB LAND PATTERN LAYOUT

The recommended PCB land pattern for the ADMP405 should
be laid out to a 1:1 ratio to the solder pads on the microphone
package, as shown in Figure 9. Care should be taken to avoid
applying solder paste to the sound hole in the PCB. A suggested

0.68

solder paste stencil pattern layout is shown in Figure 10. The
diameter of the sound hole in the PCB should be larger than the
diameter of the sound port of the microphone. A minimum
diameter of 0.5 mm is recommended.

1.52

1.90

1.22
Ø1.55

Ø0.95

0.90

0.61

0.61

09027-007

Figure 9. PCB Land Pattern Layout

1.55/1.05 DI A.

2×0.8 × 0.6

1.22

0.2 × 45
TYP

Figure 10. Suggested Solder Paste Stencil Pattern Layout

0.225 CUT WIDTH (2×)

1.52mm

9027-008

Rev. B | Page 8 of 12

Data Sheet ADMP405

HANDLING INSTRUCTIONS

PICK-AND-PLACE EQUIPMENT

The MEMS microphone can be handled using standard pick­and-place and chip shooting equipment. Care should be taken
to avoid damage to the MEMS microphone structure as follows:

• Use a standard pickup tool to handle the microphone.

Because the microphone hole is on the bottom of the
package, the pickup tool can make contact with any part
of the lid surface.

• Use care during pick-and-place to ensure that no high

shock events above 10 kg are experienced because such
events may cause damage to the microphone.

• Do not pick up the microphone with a vacuum tool that

makes contact with the bottom side of the microphone.
Do not pull air out of or blow air into the microphone port.

• Do not use excessive force to place the microphone on

the PCB.

REFLOW SOLDER

For best results, the soldering profile should be in accordance
with the recommendations of the manufacturer of the solder
paste used to attach the MEMS microphone to the PCB. It is
recommended that the solder reflow profile not exceed the limit
conditions specified in Figure 2 and Ta bl e 3 .

BOARD WASH

When washing the PCB, ensure that water does not make
contact with the microphone port. Blow-off procedures and
ultrasonic cleaning must not be used.

Rev. B | Page 9 of 12

ADMP405 Data Sheet

RELIABILITY SPECIFICATIONS

The microphone sensitivity after stress must deviate by no more than ±3 dB from the initial value.

Table 5.

Stress Test Description

Low Temperature Operating Life −40°C, 500 hours, powered
High Temperature Operating Life +125°C, 500 hours, powered
Temperature Humidity Bias (THB) +65°C/85% relative humidity (RH), 500 hours, powered
Temperature Cycle −40°C/+125°C, one cycle per hour, 100 cycles
High Temperature Storage +150°C, 500 hours
Low Temperature Storage −40°C, 500 hours
Component Charge Device Model (CDM) ESD All pins, 0.5 kV
Component Human Body Model (HBM) ESD All pins, 1.5 kV
Component Machine Model (MM) ESD All pins, 0.2 kV

Rev. B | Page 10 of 12

Data Sheet ADMP405

OUTLINE DIMENSIONS

0.98

0.88

0.78

3.06 REF

P

N

I

1

TOP VIEW

3.425

3.350

3.275

2.21
REF

0.65 REF

R

E

C

O

2.575

2.500

2.425

E

N

C

E

E

F

R

E

R

R

N

1.22 BSC

0.64 REF

.

0

0.30 BSC

0

9

.

0

N

P

(

I

T

0

2

×

0.75 REF

8

6

.

0

×

)

S

3

,

1

0.54
REF

P

Y

°

5

4

1.52

1

3

BOTTOM VIEW

1.08

0.30

BSC

2

0.25 NOM

0.20 MIN

1.56 DIA.

0.95 DIA.

1.25

DIA.
THRU HOLE

(SOUND PORT)

SIDE VIEW

Figure 11. 3-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV]

2.0 ± 0.05 (SEE NOTE 3)

0.25 ±0.05

4.0 (SEE NOTE 1)

R 0.2 MAX

B

O

3.85

K

O

2.90

NOTES

1. 10 SPROCKET HOLE PIT CH CUMULATIVE TOLERANCE ±0.2.

2. CAMBER IN COMPLIANCE WI TH EIA 481.

3. POCKET POSITION RELATIVE TO SPROCKET HOLE MEASURED
AS TRUE POSITION OF POCKET, NOT POCKET HOLE.

4. A

AND BO ARE CALCULATED ON A PLANE AT A DISTANCE “R”

O

ABOVE THE BOTTOM OF THE POCKET.

0.21 REF

3.35 mm × 2.50 mm Body
(CE-3-2)

Dimensions shown in millimeters

01.5 +0.1/0. 0

0.76 MIN

A

1.25

4.0

O

R 0.3 TYP

Figure 12. LGA_CAV Tape and Reel Outline Dimensions

Dimensions shown in millimeters

A

12.0 +0.3/–0. 1

A

06-16-2010-A

1.75 ±0.1

5.5 ±0.05
(SEE NOTE 3)

1.13
POCKET HOL E
OFFSET

09027-009

ORDERING GUIDE

Model1 Temperature Range Package Description Package Option2 Ordering Quantity

ADMP405ACEZ-RL −40°C to +70°C 3-Terminal LGA_CAV, 13” Tape and Reel CE-3-2 10,000
ADMP405ACEZ-RL7 −40°C to +70°C 3-Terminal LGA_CAV, 7” Tape and Reel CE-3-2 1,000
EVAL-ADMP405Z-FLEX Evaluation Board

1

Z = RoHS Compliant Part.

2

This package option is halide free.

Rev. B | Page 11 of 12

ADMP405 Data Sheet

NOTES

©2010–2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09027-0-9/11(B)

Rev. B | Page 12 of 12