ANALOG DEVICES ADMP401 Service Manual

Omnidirectional Microphone with

OUTPUT

AMPLIFIER

ADMP401

POWER

07712-001

VDD GND

OUTPUT

Data Sheet

FEATURES

4.72 mm × 3.76 mm × 1.0 mm surface-mount package
High SNR of 62 dBA
Sensitivity of −42 dBV
Flat frequency response from 100 Hz to 15 kHz
Low current consumption of <250 μA
Single-ended analog output
High PSRR of 70 dB
Compatible with Sn/Pb and Pb-free solder processes
RoHS/WEEE compliant

APPLICATIONS

Smartphones and feature phones
Teleconferencing systems
Digital video cameras
Bluetooth headsets
Video phones
Tablets

Bottom Port and Analog Output

ADMP401

GENERAL DESCRIPTION

The ADMP401 is a high quality, high performance, low power,
analog output, bottom-ported omnidirectional MEMS
microphone. The ADMP401 consists of a MEMS microphone
element, an impedance converter, and an output amplifier. The
ADMP401 sensitivity specification makes it an excellent choice
for both near field and far field applications. The ADMP401 has
a high SNR and flat wideband frequency response, resulting in
natural sound with high intelligibility. Low current consumption
enables long battery life for portable applications. A built-in
particle filter provides for high reliability. The ADMP401
complies with the TIA-920 standard, Telecommunications

Telephone Terminal Equipment Transmission Requirements for
Wideband Digital Wireline Telephones.

The ADMP401 is available in a thin, 4.72 mm × 3.76 mm ×

1.0 mm surface-mount package. It is reflow solder compatible
with no sensitivity degradation. The ADMP401 is halide free.

FUNCTIONAL BLOCK DIAGRAM

Figure 1.

Rev. D

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ADMP401 Data Sheet

TABLE OF CONTENTS

Features .............................................................................................. 1

Applications ....................................................................................... 1

General Description ......................................................................... 1

Functional Block Diagram .............................................................. 1

Revision History ............................................................................... 2

Specifications ..................................................................................... 3

Absolute Maximum Ratings ............................................................ 4

ESD Caution .................................................................................. 4

Pin Configuration and Function Descriptions ............................. 5

Printed Circuit Board (PCB) Land Pattern Layout ...................... 6

Typical Performance Characteristics ............................................. 7

REVISION HISTORY

1/12—Rev. C to Rev. D

Updated Outline Dimensions ....................................................... 11

Changes to Figure 12 ...................................................................... 11

Added Figure 13 .............................................................................. 11

Change to Ordering Guide ............................................................ 11

8/11—Rev. B to R e v. C

Changes to Figure 1 .......................................................................... 1

Changes to Ta ble 3 ............................................................................ 4

Removed Terminal Side Down from Figure 3 .............................. 5

Changes to Bullet 2 in Pick-and-Place Equipment Section ........ 9

Changes to Ordering Guide .......................................................... 11

12/10—Rev. A t o R e v. B

Changes to Applications and General Description Sections ...... 1

Changes to Ta ble 1 ............................................................................ 3

10—Rev. 0 to Re v. A

8/

Changes to Frequency Response Parameter, Table 1 ................... 3

Changes to Supply Voltage Parameter, Table 2 ............................. 4

Changes to Applications Information Section, Figure 9, and

Figure 10 ............................................................................................ 8

Updated Outline Dimensions ....................................................... 11

4/10—Revision 0: Initial Ve rs i on

Applications Information .................................................................8

Connecting the ADMP401 to a Codec ......................................8

Connecting the ADMP401 to an Op Amp Gain Stage ............8

Handling Instructions .......................................................................9

Pick-and-Place Equipment ..........................................................9

Reflow Solder .................................................................................9

B o ar d Was h ....................................................................................9

Reliability Specifications ................................................................ 10

Outline Dimensions ....................................................................... 11

Ordering Guide .......................................................................... 11

Rev. D | Page 2 of 12

Data Sheet ADMP401

SPECIFICATIONS

TA = 25°C, VDD = 1.8 V, unless otherwise noted. All minimum and maximum specifications are guaranteed. Typical specifications are not
guaranteed.

Table 1.

Parameter Symbol Test Conditions/Comments Min Typ Max Unit

PERFORMANCE

Directionality Omni
Sensitivity 1 kHz, 94 dB SPL −45 −42 −39 dBV
Signal-to-Noise Ratio SNR 62 dBA
Equivalent Input Noise EIN 32 dBA SPL
Dynamic Range Derived from EIN and maximum acoustic input 88 dB
Frequency Response1 Low frequency, −3 dB point 100 Hz
High frequency, −3 dB point 15 kHz
Deviation limits from flat response within pass band −3/+2 dB
Total Harmonic Distortion THD 105 dB SPL 3 %
Power Supply Rejection Ratio PSRR 217 Hz, 100 mV p-p square wave superimposed on VDD = 1.8 V 70 dB
Maximum Acoustic Input Peak 120 dB SPL

POWER SUPPLY

Supply Voltage VDD 1.5 3.3 V
Supply Current IS 250 µA

OUTPUT CHARACTERISTICS

Output Impedance Z
Output DC Offset 0.8 V
Output Current Limit 90 µA

1

See Figure 6 and Figure 7.

200 Ω

OUT

Rev. D | Page 3 of 12

ADMP401 Data Sheet

07712-002

t

P

t

L

t

25°C TO PEAK

t

S

PREHEAT

CRITICAL ZONE

T

L

TO T

P

TEMPERATURE

TIME

RAMP-DOWN

RAMP-UP

T

SMIN

T

SMAX

T

P

T

L

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter Rating

Supply Voltage −0.3 V to +3.6 V
Sound Pressure Level (SPL) 160 dB
Mechanical Shock 10,000 g
Vibration

Per MIL-STD-883 Method 2007,
Tes t Condition B

Temperature Range −40°C to +70°C

Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.

ESD CAUTION

Figure 2. Recommended Soldering Profile Limits

Table 3. Recommended Soldering Profile Limits

Profile Feature Sn-Pb Pb Free

Average Ramp Rate (TL to TP) 1.25°C/sec max 1.25°C/sec max
Preheat

Minimum Temperature (T
Maximum Temperature (T
Time (T

Ramp-Up Rate (T

SMIN

to T

), tS 60 to 75 sec 60 to 75 sec

SMAX

to TL) 1.25°C/sec 1.25°C/sec

SMAX

) 100°C 100°C

SMIN

) 150°C 200°C

SMAX

Time Maintained Above Liquidous (tL) 45 to 75 sec ~50 sec

Liquidous Temperature (TL) 183°C 217°C
Peak Temperature (TP) 215°C +3°C/−3°C 245°C +0°C/−5°C
Time Within 5°C of Actual Peak Temperature (tP) 20 to 30 sec 20 to 30 sec
Ramp-Down Rate 3°C/sec max 3°C/sec max
Time 25°C (t

) to Peak Temperature 5 min max 5 min max

25°C

Rev. D | Page 4 of 12