Analog Devices ADMC200 Datasheet

a
Motion Coprocessor
ADMC200
FEATURES Analog Input Block
11-Bit Resolution Analog-to-Digital (A/D) Converter 4 Single-Ended Simultaneously Sampled Analog Inputs
3.2 s Conversion Time/Channel 0 V–5 V Analog Input Range Internal 2.5 V Reference PWM Synchronized Sampling Capability
12-Bit PWM Timer Block
Three-Phase Center-Based PWM
1.5 kHz–25 kHz PWM Switching Frequency Range Programmable Deadtime Programmable Pulse Deletion PWM Synchronized Output External PWM Shutdown
Vector Transformation Block
12-Bit Vector Transformations Forward and Reverse Clarke Transformations Forward and Reverse Park Rotations
2.9 s Transformation Time
DSP & Microcontroller Interface
12-Bit Memory Mapped Registers Twos Complement Data Format
6.25 MHz to 25 MHz Operating Clock Range 68-Lead PLCC Package Single 5 V DC Power Supply Industrial Temperature Range
GENERAL DESCRIPTION
The ADMC200 is a motion coprocessor that can be used with either microcontrollers or digital signal processors (DSP). It provides the functionality that is required to implement a digital control system. In a typical application, the DSP or micro­controller performs the control algorithms (position, speed, torque and flux loops) and the ADMC200 provides the neces­sary motor control functions: analog current data acquisition, vector transformation, and PWM drive signals.
PRODUCT HIGHLIGHTS Simultaneous Sampling of Four Inputs
A four channel sample and hold amplifier allows three-phase motor currents to be sampled simultaneously, reducing errors from phase coherency. Sample and hold acquisition time is
1.6 µs and conversion time per channel is 3.2 µs (using a 12.5 MHz system clock).
FUNCTIONAL BLOCK DIAGRAM
DATABUS
RESET
WR
A0–3
RD CS
CLK
REFOUT
REFIN
CONVST
AUX
PWMSYNC
AP
BP
CP
STOP
EMBEDDED
CONTROL
SEQUENCER
INTERNAL
REFERENCE
U V
W
A
B
C
11-BIT
A/D
CONVERTER
12-BIT
PWM TIMER
BLOCK
D0 – D11
CONTROL BUS
CONTROL
REGISTERS
VECTOR
TRANSFORMATION
BLOCK
Flexible Analog Channel Sequencing
The ADMC200 support acquisition of 2, 3, or 4 channels per group. Converted channel results are stored in registers and the data can be read in any order. The sampling and conversion time for two channels is 8 µs, three channels is 11.2 µs, and four channels is 14.4 µs (using a 12.5 MHz system clock).
Embedded Control Sequencer
The embedded control sequencer off-loads the DSP or micro­processor, reducing the instructions required to read analog in­put channels, control PWM timers and perform vector trans­formations. This frees the host processor for performing control algorithms.
Fast DSP/Microprocessor Interface
The high speed digital interface allows direct connection to 16-bit digital signal processors and microprocessors. The ADMC200 has 12 bit memory mapped registers with twos complement data format and can be mapped directly into the data memory map of a DSP. This allows for a single instruction read and write interface.
Integration
The ADMC200 integrates a four channel simultaneous sam­pling analog-to-digital converter, analog reference, vector trans­formation, and three-phase PWM timers into a 68-lead PLCC. Integration reduces cost, board space, power consumption, and design and test time.
REV. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 2000
(VDD = +5 V 5%; AGND = DGND = 0 V; REFIN = 2.5 V; External Clock =
ADMC200–SPECIFICATIONS
Parameter ADMC200AP Units Conditions/Comments
ANALOG-TO-DIGITAL CONVERTER
Resolution 11 Bits Twos Complement Data Format Relative Accuracy ± 2 LSB max Integral Nonlinearity Differential Nonlinearity ±2 LSB max Bias Offset Error ± 5 LSB max Any Channel Bias Offset Match 4 LSB max Between Channels Full-Scale Error ± 6 LSB max Any Channel Full-Scale Error Match 4 LSB max Between Channels Conversion Time/Channel 40 System CLK Cycles Signal-to-Noise Ratio (SNR)
2
Channel-to-Channel Isolation Sine Wave Applied to Unselected Channels
Two-/Three-Phase Mode –58 dB max Three-/Three-Phase Mode –55 dB max
ANALOG INPUTS
Input Voltage Level 0–5 Volts Analog Input Current 100 µA max Input Capacitance 10 pF typ
TRACK AND HOLD
Aperture Delay 200 ns max Any Channel Aperture Time Delay Match 20 ns max Between Channels SHA Acquisition Time 20 System CLK Cycles Droop Rate 5 mV/ms max
REFERENCE INPUT
Voltage Level 2.5 V dc Reference Input Current 50 µA max
REFERENCE OUTPUT
Voltage Level 2.5 Volts Voltage Level Tolerance ± 5 % max Full Load Drive Capability ± 200 µA max
LOGIC
V
IL
V
IH
V
OL
V
OH
Input Leakage Current 1 µA max Three-State Leakage Current 1 µA max Input Capacitance 20 pF typ
PWM TIMERS
Resolution 12 Bits Programmable Deadtime Range 0–10.08 µs Programmable Deadtime Increments 2 System CLK Cycles 160 ns Programmable Pulse Deletion Range 0–10.16 µs Programmable Deletion Increments 1 System CLK Cycle 80 ns Minimum PWM Frequency 1.5 kHz Resolution Varies with PWM Switching Frequency
VECTOR TRANSFORMATION Park & Clarke Transformation
Radius Error 0.7 % max Angular Error 30 arc min max Reverse Transformation Time 37 System CLK Cycles Forward Transformation Time 40 System CLK Cycles
EXTERNAL CLOCK INPUT
Range 6.25–25 MHz If > 12.5 MHz, Then It Is Necessary to Divide Down
INTERNAL SYSTEM CLOCK
Range 6.25–12.5 MHz
POWER SUPPLY CURRENT
I
DD
NOTES
1
Measurements made with external reference.
2
Tested with PWM Switching Frequency of 25 kHz.
Specifications subject to change without notice.
1
60 dB min fIN = 600 Hz Sine Wave, f
0.8 V max
2.0 V min
0.4 V max I
4.5 V min I
20 mA max
12.5 MHz; TA = –40C to +85C unless otherwise noted)
SAMPLE
= 400 µA, VDD = 5 V
SINK
= 20 µA, VDD = 5 V
SOURCE
(10 MHz Clock: 20 kHz = 9 Bits, 10 kHz = 10 Bits, 5 kHz = 11 Bits, 2.5 kHz = 12 Bits). Higher Fre­quencies are Available with Lower Resolution
via SYSCTRL Register
= 55 kHz, 600 Hz
–2–
REV. B
ADMC200
Table I. Timing Specifications (VDD = 5 V 5%; TA = –4
0C to +85C)
Number Symbol Timing Requirements Min Max Units
1t 2t 3t 4t 5t 6t 7t 8t 9t 10 t 11 t 12 t 13 t 14 t 15 t
9
16 t 17 t 18 t 19 t 20 t 21 t 22 t 23 t 24 t
NOTE
1
All WRITES to the ADMC200 must occur within 1 system clock cycle (0 wait states).
clk CLK Period 40 160 ns
per
clk CLK Pulsewidth, High 20 ns
pwh
clk CLK Pulsewidth, Low 20 ns
pwl
csb_wrb CS Low before Falling Edge of WR 0ns
su
addr_wrb ADDR Valid before Falling Edge of WR 0ns
su
data_wrb DATA Valid before Rising Edge of WR 13 ns
su
wrb_data DATA Hold after Rising Edge of WR 4.5 ns
hd
wrb_addr ADDR Hold after Rising Edge of WR 4.5 ns
hd
wrb_csb CS Hold after Rising Edge of WR 4.5 ns
hd
1
wrb
pwl
1
wrb
pwh
wrb_clk_h
hd
wrb_clk_h
su
wrb_clk_l
su
clk_wrb_l
hd
csb_rdb CS Low before Falling Edge of RD 0ns
su
addr_rdb ADDR Valid before Falling Edge of RD 0ns
su
rdb_addr ADDR Hold after Rising Edge of RD 0ns
hd
rdb_csb CS Hold after Rising Edge of RD 0ns
hd
rdb RD Pulsewidth, Low 20 ns
pwl
rdb RD Pulsewidth, High 20 ns
pwh
rdb_clk_h RD Low before Rising Edge of CLK 7.5 ns
su
rdb_clk_h RD Low after Rising Edge of CLK 7.5 ns
hd
resetb RESET Pulsewidth, Low 2 × t
pwl
1
1
1
1
WR Pulsewidth, Low 20 ns WR Pulsewidth, High 20 ns WR Low after Rising Edge of CLK 7 ns WR High before Rising Edge of CLK 7 ns WR High before Falling Edge of CLK 10 ns WR High after Falling Edge of CLK 10 ns
clk ns
per
Number Symbol Switching Characteristics Min Max Units
25 t
rdb_data DATA Valid after Falling Edge of RD 23 ns
dly
26 thdrdb_data DATA Hold after Rising Edge of RD 0ns
CLK
CLK
RESET
1
2
3
Figure 1. Clock Input Timing
24
Figure 2. Reset Input Timing
CLK
12
CS
A0–A3
WR
DATA
4
NOTE: ALL WRITES TO THE ADMC200 MUST OCCUR WITHIN ONE SYSTEM CLOCK CYCLE (i.e. 0 WAIT STATES)
5
13
15
9
8
11
10
6
7
14
Figure 3. Write Cycle Timing Diagram
REV. B
–3–
ADMC200
CLK
CS
A0–A3
23
22
20
RD
DATA
16
17
25
Figure 4. Read Cycle Timing Diagram
ABSOLUTE MAXIMUM RATINGS*
Supply Voltage (VDD) . . . . . . . . . . . . . . . . . . –0.3 V to +7.0 V
Digital Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.3 V to V
Analog Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.3 V to V
Analog Reference Input Voltage . . . . . . . . . . . . –0.3 V to V
Digital Output Voltage Swing . . . . . . . . . . . . . . –0.3 V to V
Analog Reference Output Swing . . . . . . . . . . . . –0.3 V to V
DD
DD
DD
DD
DD
Operating Temperature . . . . . . . . . . . . . . . . . –40°C to +85°C
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . +280°C
*Stresses greater than those listed above may cause permanent damage to the
device. These are stress ratings only; functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
21
26
18
19
ORDERING GUIDE
Part Temperature Package Package Number Range Description Option
ADMC200AP –40°C to +85°C 68-Lead PLCC P-68A
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADMC200 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
–4–
REV. B
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