Parameter Min Typ Max Units Test Conditions/Comments
Output Voltage Swing ±5.0 ±5.5 Volts V
CC
= 3.3 V, Three Transmitter Outputs
Loaded with 3 kΩ to Ground
±4 ±4.5 Volts V
CC
= 3.0 V, All Transmitter Outputs
Loaded into 3 kΩ to Ground
V
CC
Power Supply Current 1.3 2 mA No Load, TIN = V
CC
2.2 3.0 mA No Load,TIN = GND
Shutdown Supply Current 0.2 5 µA
SHDN = GND (ADM560); SHDN
= V
CC
(ADM561), TIN = V
CC
Input Logic Threshold Low, V
INL
0.4 V T
IN,
EN, EN, SHDN, SHDN,
Input Logic Threshold High, V
INH
2.4 V T
IN,
EN, EN, SHDN, SHDN
Logic Pullup Current 3 20 µAT
IN
= GND
EIA-232 Input Voltage Range –25 +25 V
EIA-232 Input Threshold Low 0.4 0.8 V
EIA-232 Input Threshold High 1.1 2.4 V
EIA-232 Input Hysteresis 0.3 V
EIA-232 Input Resistance 3 5 7 kΩ
CMOS Output Voltage Low, V
OL
0.4 V I
OUT
= 1.6 mA
CMOS Output Voltage High, V
OH
2.8 V I
OUT
= –40 µA
CMOS Output Leakage Current 0.05 ±5 µA
EN = VCC, EN = GND, 0 V ≤ R
OUT
≤ V
CC
Output Enable Time 200 ns
Output Disable Time 300 ns
Receiver Propagation Delay
TPHL 0.4 1 µs
TPLH 1.3 2 µs
Instantaneous Slew Rate 30 V/µsC
L
= 50 pF, RL = 3 kΩ–7 kΩ
Transition Region Slew Rate 5.0 V/µsR
L
= 3 kΩ, CL = 2500 pF
Measured from +3 V to –3 V or
–3 V to +3 V
Transmitter Output Resistance 300 Ω V
CC
= V+ = V– = 0 V, V
OUT
= ±2 V
RS-232 Output Short Circuit Current ±10 mA
Specifications subject to change without notice.
ADM560/ADM561–SPECIFICATIONS
REV. 0
–2–
(VCC = +3.3 V ±10%, C1–C4 = 1 µF. All specifications T
MIN
to T
MAX
unless otherwise noted.)
ABSOLUTE MAXIMUM RATINGS*
(TA = +25°C unless otherwise noted)
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V
V+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (V
CC
–0.3 V) to +14 V
V– . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –14 V
Input Voltages
T
IN
. . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to (V+, +0.3 V)
R
IN
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±25 V
Output Voltages
T
OUT
. . . . . . . . . . . . . . . . . . . (V+, +0.3 V) to (V–, –0.3 V)
R
OUT
. . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to (VCC +0.3 V)
Short Circuit Duration
T
OUT
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
Power Dissipation
SSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 900 mW
SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 900 mW
Operating Temperature Range
Commercial (J Version) . . . . . . . . . . . . . . . . . .0°C to +70°C
Storage Temperature Range . . . . . . . . . . . . .–65°C to +150°C
Lead Temperature (Soldering, 10 sec). . . . . . . . . . . . . +300°C
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>2000 V
*This is a stress rating only and functional operation of the device at these or any
other conditions above those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended
periods of time may affect reliability.