Analog Devices ADM3491 a Datasheet

3.3 V, Full-Duplex, 840 µA,

FEATURES

Operates with 3.3 V supply EIA RS-422 and RS-485 compliant over full CM range 19 kΩ input impedance Up to 50 transceivers on bus 20 Mbps data rate Short circuit protection Specified over full temperature range Thermal shutdown Interoperable with 5 V logic 840 µA supply current 2 nA shutdown current Also available in TSSOP package Meets IEC1000-4-4 (>1 kV) 8 ns skew Upgrade for MAX 3491, SN75ALS180

APPLICATIONS

Telecommunications DTE–DCE interface Packet switching Local area networks Data concentration Data multiplexers Integrated services digital network (ISDN) AppleTalk Industrial controls

GENERAL DESCRIPTION

The ADM3491 is a low power, differential line transceiver designed to operate using a single 3.3 V power supply. Low power consumption, coupled with a shutdown mode, makes it ideal for power-sensitive applications. It is suitable for commu­nication on multipoint bus transmission lines.
20 Mbps, EIA RS-485 Transceiver
ADM3491

FUNCTIONAL BLOCK DIAGRAM

ADM3491
RO
RE
DE
DI
R
D
Figure 1.
The ADM3491 is intended for balanced data transmission and complies with both EIA Standards RS-485 and RS-422. It contains a differential line driver and a differential line receiver, making it suitable for full-duplex data transfer.
The input impedance is 19 kΩ, allowing up to 50 transceivers to be connected on the bus. Excessive power dissipation caused by bus contention or by output shorting is prevented by a thermal shutdown circuit. This feature forces the driver output into a high impedance state, if a significant temperature increase is detected in the internal driver circuitry during fault conditions.
The receiver contains a fail-safe feature that results in a logic high output state, if the inputs are unconnected (floating).
The ADM3491 is fabricated on BiCMOS, an advanced mixed technology process combining low power CMOS with fast switching bipolar technology.
The ADM3491 is fully specified over the industrial temperature range and is available in DIP and SOIC packages, as well as the space-saving TSSOP package.
A
B
Z
Y
05234-001
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
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www.analog.com
ADM3491
TABLE OF CONTENTS
Specifications..................................................................................... 3
Typical Perfor m a n c e Character i stics ..............................................9
Timing Specifications .................................................................. 4
Absolute Maximum Ratings............................................................ 5
ESD Caution.................................................................................. 5
Pin Configurations and Function Descriptions ........................... 6
Tes t Ci rc u it s ....................................................................................... 7
Switching Characteristics ................................................................ 8
REVISION HISTORY
11/04—Rev. 0 to Rev. A
Format Updated ..................................................................Universal
Changes to Specifications Section.................................................. 3
Changes to Ordering Guide.......................................................... 13
1/98—Revision 0: Initial Version
Applications Information .............................................................. 11
Differential Data Transmission ................................................ 11
Cable and Data Rate................................................................... 11
Receiver Open-Circuit Fail-Safe Feature ................................ 11
Outline Dimensions....................................................................... 12
Ordering Guide .......................................................................... 13
Rev. A | Page 2 of 16
ADM3491

SPECIFICATIONS

VCC = 3.3 V ± 0.3 V. All specifications T
Table 1.
Parameter Min Typ Max Unit Test Conditions/Comments
DRIVER
Differential Output Voltage, VOD 2.0 V RL = 100 Ω, Figure 4, VCC > 3.1 V
1.5 V RL = 54 Ω, Figure 4
1.5 V RL = 60 Ω, Figure 5, −7 V < V ∆|VOD| for Complementary Output States 0.2 V R = 54 Ω or 100 Ω, Figure 4 Common-Mode Output Voltage, VOC 3 V R = 54 Ω or 100 Ω, Figure 4 ∆|VOC| for Complementary Output States 0.2 V R = 54 Ω or 100 Ω, Figure 4 CMOS Input Logic Threshold Low, V CMOS Input Logic Threshold High, V Logic Input Current (DE, DI, RE)
Output Leakage (Y, Z) Current ±3 µA VO = –7 V or +12 V, VCC = 0 V or 3.6 V Output Short-Circuit Current ±250 mA VO = –7 V or +12 V
RECEIVER
Differential Input Threshold Voltage, VTH −0.2 +0.2 V −7 V < VCM < +12 V Input Voltage Hysteresis, ∆VTH 50 mV VCM = 0 V Input Resistance 12 19 kΩ −7 V < VCM < +12 V Input Current (A, B) 1 mA VIN = 12 V
−0.8 mA VIN = −7 V Logic Enable Input Current (RE) Output Voltage Low, VOL 0.4 V I Output Voltage High, VOH VCC – 0.4 V V I Short-Circuit Output Current ±60 mA V Three-State Output Leakage Current ±1.0 µA VCC = 3.6 V, 0 V < V
POWER SUPPLY CURRENT
ICC Outputs unloaded
0.84 1.5 mA
0.84 1.5 mA Supply Current in Shutdown 0.002 1 µA
to T
MIN
0.8 V
INL
2.0 V
INH
, unless otherwise noted.
MAX
±1.0 µA
±1 µA
= 2.5 mA
OUT
= −1.5 mA
OUT
= GND or VCC
OUT
DE = V
CC
DE = 0 V, DE = 0 V,
, RE = 0 V
RE = 0 V RE = VCC
OUT
< VCC
< +12 V
TST
Rev. A | Page 3 of 16
ADM3491

TIMING SPECIFICATIONS

VCC = 3.3 V, TA = 25°C.
Table 2.
Parameter Min Typ Max Unit Test Conditions/ Comments
DRIVER
Differential Output Delay, T
DD
Differential Output Transition Time 1 8 15 ns RL = 60 Ω, CL1 = C
Propagation Delay Input to Output, T
Driver Output to Output, T
SKEW
PLH
, T
PHL
ENABLE/DISABLE
Driver Enable to Output Valid
Driver Disable Timing
Driver Enable from Shutdown RECEIVER
Time to Shutdown 80 190 300 ns
Propagation Delay Input to Output, T
Skew, T
Receiver Enable, T
Receiver Disable, T
PLH
– T
PHL
EN
DEN
PLH
, T
PHL
Receiver Enable from Shutdown
1
35 ns RL = 60 Ω, CL1 = C
7 22 35 ns RL = 27 Ω, CL1 = C
8 ns R
= 54 Ω, CL1 = C
L
45 90 ns RL = 110 Ω, C 40 80 ns RL = 110 Ω, C 650 110 ns RL = 110 Ω, C
= 50 pF, Figure 6
L
= 50 pF, Figure 6
L
= 15 pF, Figure 6
L
25 65 90 ns C
25 50 ns C 25 45 ns C
10 ns C
500 ns C
= 15 pF, Figure 11
L
= 15 pF, Figure 11
L
= 15 pF, Figure 7
L
= 15 pF, Figure 7
L
= 15 pF, Figure 7
L
= 15 pF, Figure 8
L2
= 15 pF, Figure 8
L2
= 15 pF, Figure 9
L2
= 15 pF, Figure 9
L2
= 3.3 V ± 0.3 V, TA = T
V
CC
MIN
to T
MAX
.
Table 3.
Parameter Min Typ Max Unit Test Conditions/ Comments
DRIVER
Differential Output Delay, T
DD
Differential Output Transition Time 2 8 15 ns RL = 60 Ω, CL1 = C
Propagation Delay Input to Output, T
Driver Output to Output, T
SKEW
PLH
, T
PHL
ENABLE/DISABLE
Driver Enable to Output Valid
Driver Disable Timing
Driver Enable from Shutdown RECEIVER
Time to Shutdown 50 190 500 ns
Propagation Delay Input to Output, T
Skew, T
Receiver Enable, T
Receiver Disable, T
PLH
– T
PHL
EN
DEN
PLH
, T
PHL
Receiver Enable from Shutdown
1
70 ns RL = 60 Ω, CL1 = C
7 22 70 ns RL = 27 Ω, CL1 = C
10 ns R
= 54 Ω, CL1 = C
L
45 110 ns RL = 110 Ω, C 40 110 ns RL = 110 Ω, C 650 110 ns RL = 110 Ω, C
= 50 pF, Figure 6
L
= 50 pF, Figure 6
L
= 15 pF, Figure 6
L
25 65 115 ns C
25 50 ns C 25 50 ns C
20 ns C
600 ns C
= 15 pF, Figure 11
L
= 15 pF, Figure 11
L
= 15 pF, Figure 7
L
= 15 pF, Figure 7
L
= 15 pF, Figure 7
L
= 15 pF, Figure 8
L2
= 15 pF, Figure 8
L2
= 15 pF, Figure 9
L2
= 15 pF, Figure 9
L2
Rev. A | Page 4 of 16
ADM3491

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.
Table 4.
Parameter Min
V
CC
Inputs
Driver Input (DI) −0.3 V to VCC + 0.3 V Control Inputs (DE, RE) Receiver Inputs (A, B) −7.5 V to +12.5 V
Outputs
Driver Outputs −7.5 V to +12.5 V Receiver Output −0.5 V to VCC + 0.5 V
14-Lead DIP, Power Dissipation 800 mW
θJA, Thermal Impedance 140°C/W
14-Lead SOIC, Power Dissipation 650 mW
θJA, Thermal Impedance 115°C/W
16-Lead TSSOP, Power Dissipation 500 mW
θJA, Thermal Impedance 158°C/W
Operating Temperature Range
Industrial (A Version) −40°C to +85°C Storage Temperature Range −65°C to +150°C Lead Temperature (Soldering, 10 s) 300°C Vapor Phase (60 s) 215°C Infrared (15 s) 220°C ESD Rating >2 kV EFT Rating (IEC1000-4-4) >1 kV
7 V
−0.3 V to V
+ 0.3 V
CC
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. A | Page 5 of 16
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