ANALOG DEVICES ADM 3311 EARSZ Datasheet

15 kV ESD Protected, 2.7 V to 3.6 V Serial

Port Transceivers with Green Idle

Rev. J Document Feedback

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C1

T

V

CC

T1

IN

T

1

O

UT

T3

IN

T2

IN

ADM3310

E/

ADM3311E

C1+

V+

C3–

C2–

V

CC

C1–

GND

C2+

SD

V–

C3+

C

1

0.1µF

T

2

OUT

T3

OUT

0.1µF

CE

RAMIC

10µF

TANTA

LUM

+

C4

0.1µF

C2

0.1

µF

ENABLE

IN

PUT

SHU

TDOWN

INPUT

C

MOS

I

NPUTS

1

CMOS

O

UTPUTS

EN

VOLTAGE

TRIPLER/

IN

VERTER

+3V TO ±9V

C3

0.1µF

C5

0.

1µF

E

IA/

TIA-

232

OUT

PUTS

EIA/TIA-232 INPUTS

2

R1

O

UT

R1

IN

R1

R3

OUT

R3

I

N

R3

R2

OUT

R2

IN

R2

R5

OUT

R5

IN

R5

R4

OUT

R4

IN

R4

T3

T1

T

2

1

INTERNAL

400kΩ

PULL-UP RES

ISTOR ON EACH CMOS INPUT

.

2

INTERNAL 5kΩ

PULL-D

OWN RESIS

TOR ON EACH

RS-

232 INPUT.

02915-002

V

CC

T1

IN

T

1

OU

T

T3

IN

T2

IN

ADM3312E/ ADM3315E

C1+

V+

C3–

C2–

V

CC

C1–

GND

C2+

SD

V–

C3+

C1

0.1

µF

T2

OUT

T3

OU

T

0.1µ

F

CE

RAMI

C

10µF

TANTALUM

+

C4

0.1µF

C

2

0.1µF

ENAB

LE

IN

PUT

SHUTD

OWN

INPUT

CMOS

I

NPUTS

1

EN

VO

LTAG

E

TR

IPLE

R/

I

NVER

TER

+3

V TO

±9V

C

3

0

.1µF

C

5

0.

1µF

CMOS

OU

TPUTS

EIA/

TIA-232

OUTPUT

S

EI

A/TIA-

232

INPUT

S

2

R1

OUT

R1

I

N

R3

OUT

R3

IN

R2

OUT

R2

IN

R

1

R3

R2

T3

T1

T2

1

IN

TERNAL 400kΩ

PULL-UP RESISTOR

ON EACH CMOS INPUT

.

2

INTERNA

L 5kΩ (22kΩ FOR ADM

3315E) PULL-DOWN R

ESISTOR O

N

EACH RS-232 INP

UT.

02915-003

Data Sheet

ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E1

FEATURES

Green Idle power-saving mode Single 2.7 V to 3.6 V power supply Operates with 3 V logic

0.1 µF to 1 µF charge pump capacitors Low EMI Low power shutdown: 20 nA Full RS-232 compliance 460 kb/s data rate One receiver active in shutdown

(ADM3307E/ADM3311E/ADM3312E/ADM3315E) Two receivers active in shutdown (ADM3310E) ESD >15 kV IEC 1000-4-2 on RS-232 I/Os ESD >15 kV IEC 1000-4-2 on CMOS and RS-232 I/Os

(ADM3307E) Qualified for automotive applications

APPLICATIONS

Mobile phone handsets/data cables Laptop and notebook computers Printers Peripherals Modems PDAs/Hand-Held Devices/Palmtop Computers

V

CC

10µF

ANTALUM

ENABLE

INPUT

FUNCTIONAL BLOCK DIAGRAMS

C2

0.1µF

CERAMIC

+

SHUTDOWN

OUTPUTS

1

INTERNAL 400kΩ PULL-UP RESISTOR ON EACH CMOS INPUT.

2

INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT.

INPU

INPUT

CMOS

TS

CMOS

0.1µF

1

C4

T1

IN

T2

IN

T3

IN

T4

IN

T5

N

I

R1

OUT

R2

OUT

R3

OUT

Figure 1. ADM3307E Functional Block Diagram

VOLTAGE

V+

TRIPLER/

V

INVERTER

CC

+3V TO ±9V

C2– C1– EN SD

T1

T2

R1

ADM3307E

C2+ C3+ C1+ C3–

V–

GND

T

3

T

4

T5

R2

R3

C3

0.1µF

C5

0.1µF

T1

OUT

T2

OUT

A-232

/TI

EIA

T3

OU

T

O

UTP

EI I

NPU

A/T

TS

IA-

UTS

232

2

02915-001

T4

OUT

T

5

OUT

R1

IN

R2

IN

R3

IN

1

Protected by U.S. Patent No. 5,606,491.

responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devi ces.

Figure 2. ADM3310E/ADM3311E Functional Block Diagram Figure 3. ADM3312E/ADM3315E Functional Block Diagram

ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E Data Sheet

TABLE OF CONTENTS

Features .............................................................................................. 1

Typical Performance Characteristics ........................................... 10

Applications ....................................................................................... 1

Functional Block Diagrams ............................................................. 1

Revision History ............................................................................... 2

General Description ......................................................................... 3

Specifications ..................................................................................... 4

Absolute Maximum Ratings ............................................................ 6

ESD Caution .................................................................................. 6

Product Selection Guide .................................................................. 7

Pin Configurations and Function Descriptions ........................... 8

REVISION HISTORY

6/15—Rev. I to Rev. J

Changed ADM33xxE to ADM3307E/ADM3310E/ADM3311E/

ADM3312E/ADM3315E .............................................. Throughout

Changes to ESD Testing (IEC 1000-4-2) Section ....................... 16

Changes to Figure 34 ...................................................................... 17

Changes to Ordering Guide .......................................................... 20

3/13—Rev. H to Rev. I

Changed CP-32-2 Package to CP-32-7 Package, Throughout .... 1

Changes to Figure 4, Figure 6, Figure 8 ......................................... 8

Changes to Figure 25 ...................................................................... 13

Updated Outline Dimensions ....................................................... 18

Changes to Ordering Guide .......................................................... 20

Added Automotive Products Section........................................... 20

1/06—Rev. G to Rev. H

Updated Formatting ................................................................. Universal

Updated Outline Dimensions .............................................................. 18

Changes to Ordering Guide ................................................................. 20

4/04—Rev. F to Rev. G

Changes to Ordering Guide ................................................................... 5

Updated Outline Dimensions .............................................................. 15

8/02—Rev. E to Rev. F

ADM3307E (REV. 0), ADM3311E (REV. E), and ADM3312E ( R EV. A) Data Sheets Merged into REV. G of ADM33xxE Universal ADM3310E (REV. PrA Now Prelims) and ADM3315E

(REV. PrA) Added .................................................................... Universal

Edits to Features ....................................................................................... 1

Edits to Applications ............................................................................... 1

Circuit Description......................................................................... 13

Enable and Shutdown ................................................................ 15

Layout and Supply Decoupling ................................................ 15

ESD/EFT Transient Protection Scheme .................................. 15

ESD Testing (IEC 1000-4-2) ..................................................... 16

Outline Dimensions ....................................................................... 18

Ordering Guide .......................................................................... 20

Automotive Products ................................................................. 20

Edits to General Description .................................................................. 1

Edits to Functional Block Diagrams ..................................................... 2

Edits to Specifications ...............................................................................

Edits to Absolute Maximum Ratings .................................................... 4

ADM33xx Product Selection Guide Added ......................................... 5

Added ADM3307E, ADM3310E, ADM3312E, and

ADM3315E Pin Configurations ............................................................ 6

Edits to Pin Function Descriptions ....................................................... 7

Added ADM3307E, ADM3310E, ADM3312E, and

ADM3315E Truth Tables ....................................................................... 7

Edits to TPCs 1–14 .................................................................................. 8

TPCs 15–18 Deleted .............................................................................. 10

Edits to Circuit Description Section ................................................... 11

Edits to Charge Pump DC-to-DC Voltage Converter Section ........ 11

Edits to How Does It Work Section .................................................... 11

Edits to Green Idle vs. Shutdown Section .......................................... 12

Edits to Doesn’t It Increase Supply Voltage Ripple? Section ............ 12

Edits to What About Electromagnetic Compatibility? Section ....... 12

Edits to Transmitter (Driver) Section ................................................. 12

Edits to Receiver Section ...................................................................... 12

Edits to Enable and Shutdown Section ............................................... 12

Edits to High Baud Rate Section.......................................................... 13

Edits to ESD/EFT Transient Protection Scheme ............................... 13

Added Figures 8a and 8b and Renumbered the Figures

that Followed .......................................................................................... 13

Edits to ESD Testing (IEC 1000-4-2) Section .................................... 14

Edits to Figure 9 ..................................................................................... 14

Deleted Table II and Table III and replaced them with Table V ..... 14

Added RU-24 Package Outline Updated CP-32, RS-28

and RU-28 ............................................................................................... 15

Rev. J | Page 2 of 20

Data Sheet ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E

GENERAL DESCRIPTION

The ADM3307E/ADM3310E/ADM3311E/ADM3312E/

ADM3315E line of driver/receiver products is designed to fully

meet the EIA-232 standard while operating with a single 2.7 V to 3.6 V power supply. The devices feature an on-board charge pump dc-to-dc converter, eliminating the need for dual power supplies. This dc-to-dc converter contains a voltage tripler and a voltage inverter that internally generates positive and negative supplies from the input 3 V power supply. The dc-to-dc converter operates in Green Idle™ mode, whereby the charge pump oscillator is gated on and off to maintain the output voltage at ±7.25 V under varying load conditions. This minimizes the power consumption and makes these products ideal for battery-powered portable devices.

The ADM3307E/ADM3310E/ADM3311E/ADM3312E/

ADM3315E devices are suitable for operation in harsh electrical

environments and contain ESD protection up to ±15 kV on their RS-232 lines (ADM3310E, ADM3311E, ADM3312E, and

ADM3315E). The ADM3307E

±15 kV on all I/O lines (CMOS, RS-232,

A shutdown facility that reduces the power consumption to 66 nW is also provided. While in shutdown, one receiver remains active (two receivers active with ADM3310E), thereby allowing monitoring of peripheral devices. This feature allows the device to be shut down until a peripheral device begins communication.

The active receiver can alert the processor, which can then take the ADM3307E/ADM3310E/ADM3311E/ADM3312E/

ADM3315E device out of the shutdown mode.

The ADM3307E contains five drivers and three receivers and is intended for mobile phone data lump cables and portable computing applications.

The ADM3311E contains three drivers and five receivers and is intended for serial port applications on notebook/laptop computers.

contains ESD protection up to

EN

, and SD).

The ADM3315E is a low current version of the ADM3312E, with a 22 kΩ receiver input resistance that reduces the drive requirements of the DTE. Its main applications are PDAs, palmtop computers, and mobile phone data lump cables.

The ADM3307E/ADM3310E/ADM3311E/ADM3312E/

ADM3315E devices are fabricated using CMOS technology for

minimal power consumption. All parts feature a high level of overvoltage protection and latch-up immunity.

All ADM3307E/ADM3310E/ADM3311E/ADM3312E/

ADM3315E devices are available in a 32-lead 5 mm × 5 mm

LFCSP_WQ and in a TSSOP (ADM3307E, ADM3310E, and

ADM3311E in a 28-lead TSSOP; ADM3312E and ADM3315E

in a 24-lead TSSOP). The ADM3311E also comes in a 28-lead SSOP.

The ADM3307E/ADM3310E/ADM3311E/ADM3312E/

ADM3315E devices are ruggedized RS-232 line

drivers/receivers that operate from a single supply of 2.7 V to

3.6 V. Step-up voltage converters coupled with level shifting transmitters and receivers allow RS-232 levels to be developed while operating from a single supply. Features include low power consumption, Green Idle operation, high transmission rates, and compatibility with the EU directive on electromagnetic compatibility. This EM compatibility directive includes protection against radiated and conducted interference, including high levels of electrostatic discharge.

All RS-232 (and CMOS, SD, and EN for ADM3307E) inputs and outputs are protected against electrostatic discharges (up to ±15 kV). This ensures compliance with IEC 1000-4-2 requirements.

These devices are ideally suited for operation in electrically harsh environments or where RS-232 cables are frequently being plugged/unplugged. They are also immune to high RF field strengths without special shielding precautions.

The ADM3310E is a low current version of the ADM3311E. This device also allows two receivers to be active in shutdown mode.

The ADM3312E contains three drivers and three receivers and is intended for serial port applications, PDAs, mobile phone data lump cables, and other hand-held devices.

Rev. J | Page 3 of 20

Emissions are also controlled to within very strict limits. CMOS technology is used to keep the power dissipation to an absolute minimum, allowing maximum battery life in portable applications.

ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E Data Sheet

ADM3310E, ADM3315E

0.35

0.85

mA

VCC = 2.7 V to 3.6 V; no load

OUT

SPECIFICATIONS

VCC = 2.7 V to 3.6 V, C1 to C5 = 0.1 µF. All specifications T

Table 1

Parameter Min Typ Max Unit Test Conditions/Comments

Operating Voltage Range 2.7 3.3 3.6 V VCC Power Supply Current

ADM3307E 0.75 1.5 mA VCC = 3.0 V to 3.6 V; no load

0.75 4.5 mA VCC = 2.7 V to 3.6 V; no load

ADM3311E, ADM3312E 0.45 1 mA No load; VCC = 3.0 V to 3.6 V; TA = 0°C to 85°C

0.45 4.5 mA No load; VCC = 2.7 V to 3.6 V; TA = − 40°C to +85°C

MIN

to T

, unless otherwise noted.

MAX

ADM3310E, ADM3311E, ADM3312E,

35 mA RL = 3 kΩ to GND on all T

OUTS

ADM3315E

Shutdown Supply Current 0.02 1 µA Input Pull-Up Current 10 25 µA TIN = GND Input Leakage Current, SD, EN Input Logic Threshold Low, V

0.8 V

INL

0.4 V Input Logic Threshold High, V

2.0 V

INH

CMOS Output Voltage Low, VOL 0.4 V I CMOS Output Voltage High, VOH VCC − 0.6 V I

0.02 ±1 µA

TIN, EN, SHDN TIN, EN, SHDN; VCC = 2.7 V TIN, EN, SHDN

= 1.6 mA = −200 µA

CMOS Output Leakage Current

ADM3307E 0.04 ±1 µA ADM3310E, ADM3311E 0.05 ±5 µA

EN

= VCC, 0 V < R

EN

= VCC, 0 V < R

< VCC < VCC

ADM3312E, ADM3315E

Charge Pump Output Voltage, V+ +7.25 V No load

ADM3307E, ADM3311E, ADM3312E

Charge Pump Output Voltage, V− −7.25 V No load

ADM3307E, ADM3311E, ADM3312E

Charge Pump Output Voltage, V+ +6.5 V No load

ADM3310E, ADM3315E

Charge Pump Output Voltage, V− −6.5 V No load

ADM3310E, ADM3315E

EIA-232 Input Voltage Range −25 +25 V EIA-232 Input Threshold Low 0.4 1.3 V EIA-232 Input Threshold High 2.0 2.4 V EIA-232 Input Hysteresis 0.14 V EIA-232 Input Resistance

ADM3307E, ADM3310E, ADM3311E,

3 5 7 kΩ

ADM3312E

ADM3315E 14 22 31 kΩ

Output Voltage Swing

ADM3310E, ADM3315E ±5.0 ±5.5 V All transmitter outputs loaded with 3 kΩ to ground

ADM3307E, ADM3311E, ADM3312E ±5.0 ±6.4 V VCC = 3.0 V

±5.5 V VCC = 2.7 V All transmitter outputs loaded with 3 kΩ to ground Transmitter Output Resistance 300 Ω VCC = 0 V, V

= ±2 V

RS-232 Output Short-Circuit Current ±15 ±60 mA

Rev. J | Page 4 of 20

Data Sheet ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E

PHL

PLH

PHL

PLH

Transition Region Slew Rate

3

18 V/µs

RL = 3 kΩ, CL = 50 pF to 1000 pF1

Parameter Min Typ Max Unit Test Conditions/Comments

Maximum Data Rate

ADM3307E 250 720 kbps RL = 3 kΩ to 7 kΩ, CL = 50 pF to 1000 pF, VCC = 2.7 V

460 920 kbps RL = 3 kΩ to 7 kΩ, CL = 50 pF to 1000 pF, VCC = 3.0 V

ADM3310E, ADM3311E, ADM3312E,

ADM3315E

Receiver Propagation Delay, T

, T

0.3 µs CL = 150 pF

0.17 1 µs CL = 150 pF; ADM3307E only Receiver Output Enable Time, tER 100 ns Receiver Output Disable Time, tDR 300 ns Transmitter Propagation Delay, T

, T

500 ns RL = 3 kΩ, CL = 1000 pF

ESD PROTECTION (I/O PINS) ±15 kV Human body model ±15 kV IEC 1000-4-2 air discharge ±8 kV IEC 1000-4-2 contact discharge2

1

Measured at +3 V to −3 V or −3 V to +3 V.

2

Includes CMOS I/O, SD, and EN for ADM3307E.

250 460 kbps RL = 3 kΩ to 7 kΩ, CL = 50 pF to 1000 pF, VCC = 3.0 V

Rev. J | Page 5 of 20

ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E Data Sheet

Output Voltages

OUT

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 2

Parameter Rating

VCC −0.3 V to +4 V V+ (VCC − 0.3 V) to +9 V V− +0.3 V to −9 V Input Voltages

TIN −0.3 V to +6 V

RIN ±30 V

T

±15 V

R

−0.3 V to (VCC + 0.3 V )

Short-Circuit Duration

T

Continuous

Thermal Impedance, θJA

LFCSP_WQ (CP-32-7) 32.5°C/W

TSSOP (RU-28) 68.0°C/W

TSSOP (RU-24) 68.0°C/W

SSOP (RS-28) 76.0°C/W Operating Temperature Range

Industrial (A Version) −40°C to +85°C Storage Temperature Range −65°C to +150°C Lead Temperature (Soldering, 10 sec) 300°C ESD Rating (IEC 1000-4-2 Air)

(RS-232 I/Os) ESD Rating (IEC 1000-4-2 Contact)

(RS-232 I/Os)

±15 kV

±8 kV

Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.

ESD CAUTION

Rev. J | Page 6 of 20

Data Sheet ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E

PRODUCT SELECTION GUIDE

Table 3. Product Selection Guide

Generic

ADM3307E 2.7 V to 3.6 V 5 3 1 1 Mbps

ADM3310E 2.7 V to 3.6 V 3 5 2 460 kbps RS-232 0.85 mA 1 µA 2 Rxs active in shutdown, Green

ADM3311E 2.7 V to 3.6 V 3 5 1 460 kbps RS-232 1 mA 1 µA ADM3312E 2.7 V to 3.6 V 3 3 1 460 kbps RS-232 1 mA 1 µA ADM3315E 2.7 V to 3.6 V 3 3 1 460 kbps RS-232 0.85 mA 1 µA 22 kΩ Rx I/P resistance, Green

1

ICC shutdown is 20 nA typically.

Supply Voltage Tx Rx

No. Rx Active in SD Speed 15 kV ESD

RS-232 CMOS, EN, and SD

I

CC

Max

1.5 mA 1 µA ±15 kV ESD protection, CMOS

ICC Shutdown

1

Max

Additional Features

on RS-232, and CMOS I/Os including SD and

Idle mode level 6 V, low power

ADM3311E

Idle mode level 6 V, low power

ADM3312E

EN

pins

Rev. J | Page 7 of 20

ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E Data Sheet

V– GND GND T1

OUT

T2

OUT

T3

OUT

T4

OUT

T5

OUT

NC

R1

OUT

R2

OUT

R3

OUT

NC

R3

IN

R2

IN

R1

IN

EN SD NC

T1

IN

T2

IN

T3

IN

T4

IN

T5

IN

02915-004

NOTES

1. THE EXPOSED PAD IS CO NNE CTED TO GRO UND.

2. NC = NO CONNECT. DO NOT CONNECT TO T HIS PIN.

1 2 3

19 17

4 5 6 7

20

21

18

1413121110

9

15

16

32

31

30

292827

26

25

22

23

24

8

ADM3307E

TOP VIEW

(Not to S cale)

C1–

C2–

V

CC

V+

C2+

C3+

C1+

C3–

1 2 3 4 5 6 7 8

9 10 11 12 13 14

28 27 26 2

5 24 23 22 21 20 19

1

8

17

16 15

V

CC

C2– C1–

T1

I

N

SD

EN

V+

C3+ C1+ C3–

T1

OUT

GND

V–

T2

IN

T3

IN

T4

IN

R3

OUT

R1

OUT

T5

IN

T2

OUT

T3

OUT

T4

OUT

R3

IN

R2

OUT

R2

IN

R1

IN

T5

OUT

C2+

ADM3307E

TOP VIEW

(Not to Scale)

02915-005

C1– SD NC T1

OUT

T2

OUT

T3

OUT

R1

IN

R2

IN

R3

OUTR4OUTR5OUT

NC

R5

INR4INR3IN

C2–

V

CC

C2+

V+

C3+

GND

C3–

V–

EN

C1+

NC

T1

IN

T2

IN

T3

IN

R1

OUT

R2

OUT

02915-006

NOTES

1. THE EXPOSED PAD IS CO NNE CTED TO GRO UND.

2. NC = NO CONNECT. DO NOT CONNECT TO T HIS PIN.

1 2 3

19 17

4 5 6 7

20

21

18

14

13

12

11

10

9

15

16

32

31

30

29

28

27

26

25

22

23

24

8

ADM3310E/

ADM3311E

TOP VIEW

(Not to S cale)

V+

1

C2+

2

V

CC

3

C2–

4

C3+

28

GND

27

C3–

2

6

V–

25

EN

5

C1+

6

T1

IN

7

C1–

24

SD

23

T1

OUT

22

T2

IN

8

T2

OUT

21

T3

IN

9

T3

OUT

20

R1

OUT

10

R1

IN

19

R2

OUT

11

R2

IN

18

R3

OUT

12

R3

IN

17

R4

OUT

13

R4

IN

16

R5

OUT

14

R5

IN

15

ADM3310E/

ADM3311E

TOP VIEW

(Not to Scale)

02915-007

C1– SD NC T1

OUT

T2

OUT

T3

OUT

NC NC

R1

OUT

R2

OUT

R3

OUT

NC

R3

IN

R2

IN

R1

IN

C2–

V

CC

C2+

V+

C3+

GND

C3–

V–

02915-008

EN

C1+

NC

T1

IN

T2

IN

T3

IN

NC NC

NOTES

1. THE EXPOSED PAD IS CO NNE CTED TO GRO UND.

2. NC = NO CONNECT. DO NOT CONNECT TO T HIS PIN.

1 2 3

19 17

4 5 6 7

20

21

18

14

13

12

11

10

9

15

16

32

31

30

29

28

27

26

25

22

23

24

8

ADM3312E/

ADM3315E

TOP VIEW

(Not to S cale)

1

2

3

4

5

6

7

8

9

10

20

21

22

23

24

19

18

17

16

15

14

13

12

11

C2+ V

CC

C2

T1

IN

C1+

EN

V+

GND C3– V–

T1

OUT

SD

C1–

T2

IN

T3

IN

R3

OUT

R2

OUT

R1

OUT

T2

OUT

T3

OUT

R3

IN

R2

IN

R1

IN

C3+

ADM3312E/

ADM3315E

TOP VIEW

(Not to Scale)

02915-009

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

Figure 4. ADM3307E LFCSP_WQ Pin Configuration Figure 5. SSOP/TSSOP Pin Configuration

Figure 6. LFCSP_WQ Pin Configuration Figure 7. SSOP/TSSOP Pin Configuration

Figure 8. LFCSP_WQ Pin Configuration Figure 9. SSOP/TSSOP Pin Configuration

Rev. J | Page 8 of 20

Data Sheet ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E

CC

OUT

R

Receiver Inputs. These inputs accept RS-232 signal levels. An internal 5 kΩ pull-down resistor (22 kΩ for ADM3315E) to GND is

OUT

For ADM3315E, R

OUT

3 is active in shutdown.

OUT

1 1 Shutdown

Disabled

OUT

1 0 Shutdown

Disabled

Enabled

Table 4. Pin Function Descriptions

Mnemonic Function

V

Power Supply Input 2.7 V to 3.6 V.

V+ Internally Generated Positive Supply, 7.25 V (6.5 V Nominal for ADM3310E, ADM3315E). Capacitor C4 is connected between

V

and V+.

V− Internally Generated Positive Supply, −7.25 V (−6.5 V Nominal for ADM3310E, ADM3315E). Capacitor C5 is connected between

GND and V−. GND Ground Pin. Must be connected to 0 V. C1+, C1− External Capacitor 1 is connected between these pins. A 0.1 µF capacitor is recommended, but larger capacitors up to 1 µF

can be used. C2+, C2− External Capacitor 2 is connected between these pins. A 0.1 µF capacitor is recommended, but larger capacitors up to 1 µF

can be used. C3+, C3− External Capacitor 3 is connected between these pins. A 0.1 µF capacitor is recommended, but larger capacitors up to 1 µF

can be used. T

Transmitter (Driver) Inputs. These inputs accept TTL/CMOS levels. An internal 400 kΩ pull-up resistor to V

IN

each input. T

Transmitter (Driver) Outputs. Typically ±5.5 V (±6.4 V for ADM3311E and ADM3312E).

IN

connected on each of these inputs. R

Receiver Outputs. These are TTL/CMOS levels.

EN

Receiver Enable. A high level three-states all the receiver outputs. SD Shutdown Control. A high level disables the charge pump and reduces the quiescent current to less than 1 µA. All

transmitters and most receivers are disabled. One receiver remains active in shutdown (two receivers are active in shutdown

for the ADM3310E). For ADM3307E, R For ADM3310E, R For ADM3311E, R For ADM3312E, R

3 is active in shutdown. 4 and R

5 are active in shutdown. 5 is active in shutdown. 3 is active in shutdown.

is connected on

CC

NC No Connect.

Table 5. ADM3307E Truth Table

SD

Status T

EN

1–5 R

1–2 R

3

0 0 Normal Operation Enabled Enabled Enabled 0 1 Normal Operation Enabled Disabled Disabled 1 0 Shutdown Disabled Disabled Enabled

Table 7. ADM3311E Truth Table

SD

Status T

EN

1–3 R

OUT

1–4 R

OUT

5

0 0 Normal Operation Enabled Enabled Enabled 0 1 Receivers

Enabled Disabled Disabled

Disabled 1 0 Shutdown Disabled Disabled Enabled 1 1 Shutdown Disabled Disabled Disabled

Table 6. ADM3310E Truth Table

SD

Status T

EN

1–3 R

4–5

0 0 Normal Operation Enabled Enabled Enabled 0 1 Receivers

Enabled Disabled Disabled

Disabled

1 1 Shutdown Disabled Disabled Disabled

Table 8. ADM3312E/ADM3315E Truth Table

SD

Status T

EN

1–3 R

OUT

1–2 R

OUT

3

0 0 Normal Operation Enabled Enabled Enabled 0 1 Normal Operation Enabled Disabled Disabled 1 0 Shutdown Disabled Disabled Enabled 1 1 Shutdown Disabled Disabled Disabled

Rev. J | Page 9 of 20

ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E Data Sheet

TYPICAL PERFORMANCE CHARACTERISTICS

9

T

HIGH

OUT

7

5

Figure 10. Charge Pump V+ Exiting Shutdown

Figure 11. Charge Pump V− Exiting Shutdown

9

7

5

3

1

–1

V+/V– (V)

–3

–5

–7

–9

0 5 10 15 20

V+

V–

LOAD CURRENT (mA)

Figure 12. Charge Pump V+/ V− vs. Load Current (VCC = 3.3 V)

SD

V–

SD V+

3

1

Tx O/P (V)

–1

–3

–5

T

LOW

OUT

–7

0 200 400 600 800 1000

02915-010

LOAD CAPACITANCE (pF)

02915-013

Figure 13. Transmitter Output vs. Load Capacitance

= 3.3 V, Data Rate = 460 kbps)

(V

CC

40

35

30

25

20

15

SLEW RATE (V/ µ s)

10

5

0

02915-011

LOAD CAPACITANCE (pF)

2500200015001000500

02915-014

Figure 14. Slew Rate vs. Load Capacitance (VCC = 3.3 V)

25

20

15

(mA)

CC

I

10

5

0

02915-012

0 200 400 600 800 1000 1200

LOAD CAPACITANCE (pF)

02915-015

Figure 15. Supply Current vs. Load Capacitance (RL = 3 kΩ)

= 3.3 V, Data Rate = 460 kbps)

(V

CC

Rev. J | Page 10 of 20

Data Sheet ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E

25

20

15

(mA)

CC

I

10

5

0

0 200 400 600 800 12001000

LOAD CAPACITANCE (pF)

Figure 16. Supply Current vs. Load Capacitance (RL = Infinite)

= 3.3 V, Data Rate = 460 kbps)

(V

CC

30 28

26

24

22 20

18

16

SUPPLY CURRENT (mA)

14

12 10

0 200 400 600 800 1000

LOAD CAPACITANCE (pF)

460kbps

250kbps

125kbps

Figure 17. Supply Current vs. Load Capacitance (VCC = 3.3 V, RL = 5 kΩ)

SD

TX O/P LOW

02915-016

02915-019

Figure 19. Transmitter Output (Low) Exiting Shutdown

10

8

6

4

2

0

VOLTAGE (V)

–2

OUT

Tx

–4

–6

–8

–10

2915-017

0 200 400 600 800 1000

LOAD CAPACITANCE (pF)

02915-020

Figure 20. Transmitter Output Voltage High/Low vs. Load Capacitance

= 3.3 V, CLK = 1 Mb/s, RL = 5 kΩ, ADM3307E)

(V

CC

300

Figure 18. Transmitter Output (High) Exiting Shutdown

SD TX O/P

HIGH

02915-018

Rev. J | Page 11 of 20

250

200

150

100

OSCILL ATOR FREQUENCY (kHz)

50

0

0 5 10 15 20

LOAD CURRENT (mA)

Figure 21. Oscillator Frequency vs. Load Current

2915-021

ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E Data Sheet

600

25

500

400

(µA)

300

CC

I

200

100

0

2.62.83.03.23.43.6 (V)

V

CC

Figure 22. ICC vs. VCC (Unloaded)

2915-022

20

15

(mA)

CC

I

10

5

0

2.6 2.8 3.0 3.2 3.4 3.6 VCC(V)

Figure 23. ICC vs. VCC (RL = 3 kΩ)

02915-023

Rev. J | Page 12 of 20

Data Sheet ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E

+

G

ND

C2

C1

S1

S2

S3

S4

C4

V

CC

S5

S6

S7

+

V+ =

3V

CC

V

C

IN

TERNA

L

O

SC

I

LLA

TO

R

V

CC

02915-024

+

GND

C3

S8

S9

S10

S11

C5

V– = –(V+)

+

GND

V+

INTERNAL

OSCILLAT

OR

FROM

VOLTAGE

TRIPLER

02915-025

CIRCUIT DESCRIPTION

The internal circuitry consists mainly of four sections. These include the following:

• A charge pump voltage converter

• 3.3 V logic to EIA-232 transmitters

• EIA-232 to 3.3 V logic receivers

• Transient protection circuit on all I/O lines

Charge Pump DC-to-DC Voltage Converter

The charge pump voltage converter consists of a 250 kHz (300 kHz for ADM3307E) oscillator and a switching matrix. The converter generates a ±9 V supply from the input 3.0 V level. This is done in two stages using a switched capacitor technique. First, the 3.0 V input supply is tripled to 9.0 V using Capacitor C4 as the charge storage element. The +9.0 V level is then inverted to generate −9.0 V using C5 as the storage element.

However, it should be noted that, unlike other charge pump dcto-dc converters, the charge pump on the ADM3307E does not run open-loop. The output voltage is regulated to ±7.25 V (or ±6.5 V for the ADM3310E and ADM3315E) by the Green Idle circuit and never reaches ±9 V in practice. This saves power as well as maintains a more constant output voltage.

During the oscillator high phase, S10 and S11 are open, while S8 and S9 are closed. C3 is charged to 3V

from the output of

CC

the voltage tripler over several cycles. During the oscillator low phase, S8 and S9 are open, while S10 and S11 are closed. C3 is connected across C5, whose positive terminal is grounded and whose negative terminal is the V− output. Over several cycles, C5 charges to −3 V

.

CC

The V+ and V− supplies may also be used to power external circuitry if the current requirements are small. See Figure 12 in the Typi cal Performance Characteristics section.

What Is Green Idle?

Green Idle is a method of minimizing power consumption under idle (no transmit) conditions while still maintaining the ability to transmit data instantly.

How Does it Work?

Charge pump type dc-to-dc converters used in RS-232 line drivers normally operate open-loop, that is, the output voltage is not regulated in any way. Under light load conditions, the output voltage is close to twice the supply voltage for a doubler and three times the supply voltage for a tripler, with very little ripple. As the load current increases, the output voltage falls and the ripple voltage increases.

Figure 24. Charge Pump Voltage Tripler

The tripler operates in two phases. During the oscillator low phase, S1 and S2 are closed and C1 charges rapidly to V S4, and S5 are open, and S6 and S7 are closed.

During the oscillator high phase, S1 and S2 are open, and S3 and S4 are closed, so the voltage at the output of S3 is 2V voltage is used to charge C2. In the absence of any discharge current, C2 charges up to 2V

after several cycles. During the

CC

oscillator high phase, as previously mentioned, S6 and S7 are closed, so the voltage at the output of S6 is 3V then used to charge C3. The voltage inverter is illustrated in Figure 25.

Figure 25. Charge Pump Voltage Inverter

CC

. This voltage is

CC

. S3,

. This

Rev. J | Page 13 of 20

Even under no-load conditions, the oscillator and charge pump operate at a very high frequency with consequent switching losses and current drain.

Green Idle works by monitoring the output voltage and maintaining it at a constant value of around 7 V voltage rises above 7.25 V voltage falls below 7 V

2

the oscillator is turned off. When the

1

, the oscillator is turned on and a burst of

1

. When the

charging pulses is sent to the reservoir capacitor. When the oscillator is turned off, the power consumption of the charge pump is virtually zero, so the average current drain under light load conditions is greatly reduced.

1

For ADM3310E and ADM3315E, replace with 6.5 V.

2

For ADM3310E and ADM3315E, replace with 6.25 V.

ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E Data Sheet

TRANSCEIVERS

S

T

ART/STOP

START/STOP

V+

V–

SHUTDOWN

CHARGE

PUMP

V– VOLTAG

E

COMPARATOR

WITH 250mV

HYS

TER

ESIS

BAND GAP

VOLTAGE

REFERENCE

V+ VOLTAG

E

COMPARATOR

WITH 250mV

HYSTERESIS

02915-026

OSC

V+

OVERSHOOT

LIGHT

LOAD

7.25V

1

7V

2

OSC

V+

7.25V

1

7V

2

OSC

V+

7.25V

1

7V

2

MEDIUM

LOAD

HEAVY

LOAD

1

FOR ADM3310E AND ADM3315E REPLACE WITH 6.5V.

2

FOR ADM3310E AND ADM3315E REPLACE WITH 6.25V.

02915-027

A block diagram of the Green Idle circuit is shown in Figure 26. Both V+ and V− are monitored and compared to a reference voltage derived from an on-chip band gap device. If either V+ or V− fall below 7 V rises above 7.25 V

1

, the oscillator starts up until the voltage

2

.

Figure 26. Block Diagram of Green Idle Circuit

The operation of Green Idle for V+ under various load conditions is illustrated in Figure 27. Under light load conditions, C1 is maintained in a charged condition, and only a single oscillator pulse is required to charge up C2. Under these conditions, V+ may actually overshoot 7.25 V

2

slightly.

Under medium load conditions, it may take several cycles for C2 to charge up to 7.25 V

2

. The average frequency of the oscillator is higher because there are more pulses in each burst and the bursts of pulses are closer together and more frequent.

Under high load conditions, the oscillator is on continuously if the charge pump output cannot reach 7.25 V

2

.

Green Idle Vs. Shutdown

Shutdown mode minimizes power consumption by shutting down the charge pump altogether. In this mode, the switches in the voltage tripler are configured so V+ is connected directly to V

. V− is zero because there is no charge pump operation to

CC

charge C5. This means there is a delay when coming out of shutdown mode before V+ and V− achieve their normal operating voltages. Green Idle maintains the transmitter supply voltages under transmitter idle conditions so this delay does not occ ur.

Doesn’t Green Idle Increase Supply Voltage Ripple?

The ripple on the output voltage of a charge pump operating in open-loop depends on three factors: the oscillator frequency, the value of the reservoir capacitor, and the load current. The value of the reservoir capacitor is fixed. Increasing the oscillator frequency decreases the ripple voltage; decreasing the oscillator frequency increases it. Increasing the load current increases the ripple voltage; decreasing the load current decreases it. The ripple voltage at light loads is naturally lower than that for high load currents.

Figure 27. Operation of Green Idle under Various Load Conditions

Using Green Idle, the ripple voltage is determined by the high and low thresholds of the Green Idle circuit. These are nominally 7 V

1

and 7.25 V2, so the ripple is 250 mV under most load conditions. With very light load conditions, there may be some overshoot above 7.25 V

2

, so the ripple is slightly greater.

Under heavy load conditions where the output never reaches

2

7.25 V

, the Green Idle circuit is inoperative and the ripple voltage is determined by the load current, the same as in a normal charge pump.

What about Electromagnetic Compatibility?

Green Idle does not operate with a constant oscillator frequency. As a result, the frequency and spectrum of the oscillator signal vary with load. Any radiated and conducted emissions also vary accordingly. Like other Analog Devices RS-232 transceiver products, the ADM3307E/ADM3310E/

ADM3311E/ADM3312E/ADM3315E devices feature slew rate

limiting and other techniques to minimize radiated and conducted emissions.

1

For ADM3310E and ADM3315E, replace with 6.5 V.

2

For ADM3310E and ADM3315E, replace with 6.25 V.

Rev. J | Page 14 of 20

Data Sheet ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E

0V

3V

EN INPUT

t

DR

V

OH

– 0.1V

V

OL

+ 0.1V

V

OH

V

OL

RECEIVER

OUTPUT

02915-028

3V

0.4V

0V

3V

t

ER

EN INPUT

V

OH

V

OL

RECEIVER

OUTPUT

02915-029

Transmitter (Driver) Section

The drivers convert 3.3 V logic input levels into EIA-232 output levels. With V voltage swing is typically ±6.4 V (or ±5.5 V for ADM3310E and

ADM3315E).

Unused inputs may be left unconnected, because an internal 400 kV pull-up resistor pulls them high forcing the outputs into a low state. The input pull-up resistors typically source 8 mA when grounded, so unused inputs should either be connected to V

or left unconnected in order to minimize power consumption.

CC

Receiver Section

The receivers are inverting level shifters that accept RS-232 input levels and translate them into 3.3 V logic output levels. The inputs have internal 5 kΩ pull-down resistors (22 kΩ for the ADM3310E) to ground and are also protected against overvoltages of up to ±30 V. Unconnected inputs are pulled to 0 V by the internal 5 kΩ (or 22 kΩ for the ADM3315E) pulldown resistor. This, therefore, results in a Logic 1 output level for unconnected inputs or for inputs connected to GND.

The receivers have Schmitt trigger inputs with a hysteresis level of 0.14 V. This ensures error-free reception for both noisy inputs and for inputs with slow transition times.

= 3.0 V and driving an EIA-232 load, the output

CC

Figure 29. Receiver Enable Timing

High Baud Rate

The ADM3307E/ADM3310E/ADM3311E/ADM3312E/

ADM3315E feature high slew rates, permitting data transmission

at rates well in excess of the EIA/RS-232E specifications. RS-232 voltage levels are maintained at data rates up to 230 kbps (460 kbps for ADM3307E) under worst-case loading conditions. This allows for high speed data links between two terminals.

LAYOUT AND SUPPLY DECOUPLING

Because of the high frequencies at which the ADM3307E/

ADM3310E/ADM3311E/ADM3312E/ADM3315E oscillator

operates, particular care should be taken with printed circuit board layout, with all traces being as short as possible and C1 to C3 being connected as close to the device as possible. The use of a ground plane under and around the device is also highly recommended.

ENABLE AND SHUTDOWN

The enable function is intended to facilitate data bus connections where it is desirable to three-state the receiver outputs. In the disabled mode, all receiver outputs are placed in a high impedance state. The shutdown function is intended to shut the device down, thereby minimizing the quiescent current. In shutdown, all transmitters are disabled. All receivers are shut down, except for Receiver R3 (ADM3307E, ADM3312E, and

ADM3315E), Receiver R5 (ADM3311E), and Receiver R4 and

Receiver R5 (ADM3310E). Note that disabled transmitters are not three-stated in shutdown, so it is not permitted to connect

When the oscillator starts up during Green Idle operation, large current pulses are taken from V

. For this reason, VCC should

CC

be decoupled with a parallel combination of 10 µF tantalum and

0.1 µF ceramic capacitors, mounted as close to the V

pin as

CC

possible.

Capacitor C1 to Capacitor C3 can have values between 0.1 µF and 1 µF. Larger values give lower ripple. These capacitors can be either electrolytic capacitors chosen for low equivalent series resistance (ESR) or nonpolarized types, but the use of ceramic types is highly recommended. If polarized electrolytic capacitors are used, polarity must be observed (as shown by C1+).

multiple (RS-232) driver outputs together.

ESD/EFT TRANSIENT PROTECTION SCHEME

The shutdown feature is very useful in battery-operated systems because it reduces the power consumption to 66 nW. During shutdown, the charge pump is also disabled. When exiting shutdown, the charge pump is restarted and it takes approximately 100 µs for it to reach its steady-state operating conditions.

Figure 28. Receiver Disable Timing

Rev. J | Page 15 of 20

The ADM3307E/ADM3310E/ADM3311E/ADM3312E/

ADM3315E use protective clamping structures on all inputs and

outputs that clamp the voltage to a safe level and dissipate the energy present in ESD (electrostatic) and EFT (electrical fast transients) discharges. A simplified schematic of the protection structure is shown in Figure 30 and Figure 31 (see Figure 32 and Figure 33 for ADM3307E protection structure).

Each input and output contains two back-to-back high speed clamping diodes. During normal operation with maximum RS-232 signal levels, the diodes have no effect as one or the other is reverse biased depending on the polarity of the signal. If, however, the voltage exceeds about ±50 V, reverse breakdown occurs and the voltage is clamped at this level. The diodes are large p-n junctions designed to handle the instantaneous current surge that can exceed several amperes.

ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E Data Sheet

The transmitter outputs and receiver inputs have a similar protection structure. The receiver inputs can also dissipate some of the energy through the internal 5 kΩ (or 22 kΩ for the ADM3310E) resistor to GND as well as through the protection diodes.

RECEIVER

INPUT

R

IN

Figure 30. Receiver Input Protection Scheme

Tx

D1

D2

Figure 31. Transmitter Output Protection Scheme

D1

D2

TRANSMITTER OUTPUT

Rx

02915-030

02915-031

The ADM3307E protection scheme is slightly different (see Figure 32 and Figure 33). The receiver inputs, transmitter inputs, and transmitter outputs contain two back-to-back high speed clamping diodes. The receiver outputs (CMOS outputs), the SD and

EN

pins, contain a single reverse biased high speed clamping diode. Under normal operation with maximum CMOS signal levels, the receiver output, SD, and

EN

protection diodes have no effect because they are reversed biased. If, however, the voltage exceeds about 15 V, reverse breakdown occurs and the voltage is clamped at this level. If the voltage reaches −0.7 V, the diode is forward biased and the voltage is clamped at this level. The receiver inputs can also dissipate some of the energy through the internal 5 kΩ resistor to GND as well as through the protection diodes.

RECEIVER

INPUT

R

IN

Figure 32. ADM3307E Receiver Input Protection Scheme

TRANSMITTER

OUTPUT

Figure 33. ADM3307E Transmitter Output Protection Scheme

D3

D4

Rx

D1

D2

Tx

D3

D1

D2

RECEIVER OUTPUT

TRANSMITTER INPUT

The protection structures achieve ESD protection up to ±15 kV on all RS-232 I/O lines (and all CMOS lines, including SD and EN

for the ADM3307E). For methods used to test the

protection scheme, see the ESD Testing (IEC 1000-4-2) section.

02915-032

02915-033

ESD TESTING (IEC 1000-4-2)

IEC 1000-4-2 (previously 801-2) specifies compliance testing using two coupling methods, contact discharge and air-gap discharge. Contact discharge calls for a direct connection to the unit being tested. Airgap discharge uses a higher test voltage but does not make direct contact with the unit under testing. With air discharge, the discharge gun is moved toward the unit under testing, which develops an arc across the air gap, thus the term air discharge. This method is influenced by humidity, temperature, barometric pressure, distance, and rate of closure of the discharge gun. The contact discharge method, while less realistic, is more repeatable and is gaining acceptance in preference to the air-gap method.

Although very little energy is contained within an ESD pulse, the extremely fast rise time coupled with high voltages can cause failures in unprotected semiconductors. Catastrophic destruction can occur immediately as a result of arcing or heating. Even if catastrophic failure does not occur immediately, the device can suffer from parametric degradation that can result in degraded performance. The cumulative effects of continuous exposure can eventually lead to complete failure.

I/O lines are particularly vulnerable to ESD damage. Simply touching or plugging in an I/O cable can result in a static discharge that can damage or completely destroy the interface product connected to the I/O port. Traditional ESD test methods, such as the MIL-STD-883B method 3015.7, do not fully test a product’s susceptibility to this type of discharge. This test was intended to test a product’s susceptibility to ESD damage during handling.

Each pin is tested with respect to ground. There are some important differences between the traditional test and the IEC test.

 The IEC test is much more stringent in terms of discharge

energy. The peak current injected is over four times greater.

 The current rise time is significantly faster in the IEC test.  The IEC test is carried out while power is applied to the

device.

It is possible that the ESD discharge could induce latch-up in the device under test. This test, therefore, is more representative of a real world I/O discharge where the equipment is operating normally with power applied. For maximum peace of mind, however, both tests should be performed, ensuring maximum protection both during handling and later during field service.

Rev. J | Page 16 of 20

Data Sheet ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E

HIGH

VOLTAGE

GENERATO R

R1

C1

ESD TEST METHOD R2 C1

HUMAN BODY MODEL ESD ASSOC. STD 55.1

IEC1000-4-2

R2

1.5kΩ 100pF

330Ω 150pF

Figure 34. ESD Test Standards

100

90

(%)

PEAK

I

36.8

10

t

RL

t

DL

Figure 35. Human Body Model ESD Current Waveform

100

90

DEVICE

UNDER TEST

TIME t

The ADM3307E/ADM3310E/ADM3311E/ADM3312E/

ADM3315E devices are tested using both of the previously

mentioned test methods. All pins are tested with respect to all other pins as per the Human Body Model, ESD Assoc. Std. 55.1 specification. In addition, all I/O pins are tested as per the IEC 1000-4-2 test specification. The products were tested under the following conditions:

02915-034

 Power-On—Normal Operation  Power-Off

There are four levels of compliance defined by IEC 1000-4-2. The ADM3307E/ADM3310E/ADM3311E/ADM3312E/

ADM3315E devices meet the most stringent compliance level

for both contact and air-gap discharge. This means the products are able to withstand contact discharges in excess of 8 kV and airgap discharges in excess of 15 kV.

Table 9. IEC 1000-4-2 Compliance Levels

Level Contact Discharge (kV) Air Discharge (kV)

2915-035

1 2 2 2 4 4 3 6 8 4 8 15

0.1ns T O 1ns

(%)

PEAK

I

10

30ns

60ns

Figure 36. IEC1000-4-2 ESD Current Waveform

TIME

t

02915-036

Rev. J | Page 17 of 20

ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E Data Sheet

COMPLI ANT TO JEDEC ST ANDARDS M O-220-WHHD.

112408-A

1

0.50

BSC

BOTT

OM VIEWTOP VIEW

PIN 1

INDIC

AT

OR

32

9

16

17

24

25

8

EXPOSED

PA

D

PIN 1 INDICATOR

3.25

3.10 SQ

2.95

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.80

0.75

0.70

FOR PROPE R CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATI ON AND FUNCTIO N DES CRIPTIONS SECTION OF THIS DATA SHEET.

0.50

0.40

0.30

0.25 MIN

COMPLIANT T

O JEDEC ST

ANDARDS MO-150-AH

060106-A

28

15

14

1

10.50

10.20

9.90

8.20

7.80

7.40

5.60

5.30

5.00

SE

ATING

PLANE

0.05 MIN

0.65 BSC

2.00 MAX

0.38

0.22

COPLANARITY

0.10

1.85

1.75

1.65

0.25

0.09

0.95

0.75

0.55

8° 4° 0°

OUTLINE DIMENSIONS

Figure 37. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

5 mm × 5 mm Body, Very Very Thin Quad

(CP-32-7)

Dimensions shown in millimeters

(RS-28)

Rev. J | Page 18 of 20

Figure 38. 28-Lead Shrink Small Outline Package [SSOP]

Data Sheet ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E

24

13

121

6.40 BSC

4.50

4.40

4.30

PIN 1

7.90

7.80

7.70

0.15

0.05

0.30

0.19

0.65 BSC

1.20

MAX

0.20

0.09

0.75

0.60

0.45

8° 0°

SEATING PLANE

0.10 COPLANARITY

COMPLIANT TO JEDEC STANDARDS MO-153-AD

COMPLIANT TO JEDEC STANDARDS MO-153-AE

28

15

141

8° 0°

SEATING

PLANE

COPLANARITY

0.10

1.20 MAX

6.40 BSC

0.65

BSC

PIN 1

0.30

0.19

0.20

0.09

4.50

4.40

4.30

0.75

0.60

0.45

9.80

9.70

9.60

0.15

0.05

Figure 39. 24-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-24)

Dimensions shown in millimeters

Figure 40. 28-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-28)

Dimensions shown in millimeters

Rev. J | Page 19 of 20

ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E Data Sheet

Model

1, 2

Temperature Range

Package Description

Package Option

ADM3310EARUZ

−40°C to +85°C

28-Lead Thin Shrink Small Outline [TSSOP]

RU-28

ADM3312EARUZ

−40°C to +85°C

24-Lead Thin Shrink Small Outline [TSSOP]

RU-24

ORDERING GUIDE

ADM3307EARU-REEL7 −40°C to +85°C 28-Lead 7” Tape and Reel RU-28 ADM3307EARUZ −40°C to +85°C 28-Lead Thin Shrink Small Outline [ TSSOP] RU-28 ADM3307EARUZ-REEL −40°C to +85°C 28-Lead 13” Tape and Reel RU-28 ADM3307EARUZ-REEL7 −40°C to +85°C 28-Lead 7” Tape and Reel RU-28 ADM3307EACPZ −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-7 ADM3307EACPZ-REEL −40°C to +85°C 32-Lead LFCSP_WQ 13” Tape and Reel CP-32-7 ADM3307EACPZ-REEL7 −40°C to +85°C 32-Lead LFCSP_WQ 7” Tape and Reel CP-32-7 ADM3307EWARUZ-RL7 −40°C to +85°C 28-Lead 7” Tape and Reel RU-28 ADM3310EARU −40°C to +85°C 28-Lead Thin Shrink Small Outline [TSSOP] RU-28

ADM3310EARUZ-REEL −40°C to +85°C 28-Lead TSSOP 13” Tape and Reel RU-28 ADM3310EARUZ-REEL7 −40°C to +85°C 28-Lead TSSOP 7” Tape and Reel RU-28 ADM3310EACPZ −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-7 ADM3310EACPZ-REEL7 −40°C to +85°C 32-Lead LFCSP_WQ 7” Tape and Reel CP-32-7 ADM3311EARS −40°C to +85°C 28-Lead Shrink Small Outline [SSOP] RS-28 ADM3311EARSZ −40°C to +85°C 28-Lead Shrink Small Outline [SSOP] RS-28 ADM3311EARSZ-REEL −40°C to +85°C 28-Lead SSOP 13” Tape and Reel RS-28 ADM3311EARSZ-REEL7 −40°C to +85°C 28-Lead SSOP 7” Tape and Reel RS-28 ADM3311EARUZ −40°C to +85°C 28-Lead Thin Shrink Small Outline [ TSSOP] RU-28 ADM3311EARUZ-REEL −40°C to +85°C 28-Lead TSSOP 13” Tape and Reel RU-28 ADM3311EARUZ-REEL7 −40°C to +85°C 28-Lead TSSOP 7” Tape and Reel RU-28 ADM3311EACPZ −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-7 ADM3311EACPZ-REEL7 −40°C to +85°C 32-Lead LFCSP_WQ 7” Tape and Reel CP-32-7 ADM3312EARU −40°C to +85°C 24-Lead Thin Shrink Small Outline [TSSOP] RU-24 ADM3312EARU-REEL7 −40°C to +85°C 24-Lead TSSOP 7” Tape and Reel RU-24

ADM3312EARUZ-REEL −40°C to +85°C 24-Lead TSSOP 13” Tape and Reel RU-24 ADM3312EARUZ-REEL7 −40°C to +85°C 24-Lead TSSOP 7” Tape and Reel RU-24 ADM3312EACPZ −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-7 ADM3312EACPZ-REEL7 −40°C to +85°C 32-Lead LFCSP_WQ 7” Tape and Reel CP-32-7 ADM3315EARU −40°C to +85°C 24-Lead Thin Shrink Small Outline [TSSOP] RU-24 ADM3315EARU-REEL −40°C to +85°C 24-Lead TSSOP 13” Tape and Reel RU-24 ADM3315EARUZ −40°C to +85°C 24-Lead Thin Shrink Small Outline [TSSOP] RU-24 ADM3315EARUZ-REEL −40°C to +85°C 24-Lead TSSOP 13” Tape and Reel RU-24 ADM3315EARUZ-REEL7 −40°C to +85°C 24-Lead TSSOP 7” Tape and Reel RU-24 ADM3315EACPZ −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-7 ADM3315EACPZ-REEL −40°C to +85°C 32-Lead LFCSP_WQ 13” Tape and Reel CP-32-7 ADM3315EACPZ-REEL7 −40°C to +85°C 32-Lead LFCSP_WQ 7” Tape and Reel CP-32-7

1

Z = RoHS Compliant Part.

2

W = Qualified for Automotive Applications.

AUTOMOTIVE PRODUCTS

The ADM3307EW model is available with controlled manufacturing to support the quality and reliability requirements of automotive applications. Note that this automotive model may have specifications that differ from the commercial models; therefore, designers should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to obtain the specific Automotive Reliability reports for this model.

registered trademarks are the property of their respective owners. D02915-0-6/15(J)

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