Datasheet ADM3053 Datasheet (ANALOG DEVICES)

Signal and Power Isolated CAN Transceiver

V

V

with Integrated Isolated DC-to-DC Converter

Data Sheet

FEATURES

2.5 kV rms signal and power isolated CAN transceiver
isoPower integrated isolated dc-to-dc converter
5 V operation on V
5 V or 3.3 V operation on V
Complies with ISO 11898 standard
High speed data rates of up to 1 Mbps
Unpowered nodes do not disturb the bus
Connect 110 or more nodes on the bus
Slope control for reduced EMI
Thermal shutdown protection
High common-mode transient immunity: >25 kV/μs
Safety and regulatory approvals

UL recognition

2500 V rms for 1 minute per UL 1577

VDE Certificate of Conformity

DIN EN 60747-5-2 (VDE 0884 Part 2): 2003-01
V

= 560 V peak

IORM

Industrial operating temperature range (−40°C to +85°C)
Available in wide-body, 20-lead SOIC package

APPLICATIONS

CAN data buses
Industrial field networks

CC

IO

ADM3053

GENERAL DESCRIPTION

The ADM3053 is an isolated controller area network (CAN)
physical layer transceiver with an integrated isolated dc-to-dc
converter. The ADM3053 complies with the ISO 11898 standard.

The device employs Analog Devices, Inc., iCoupler® technology
to combine a 2-channel isolator, a CAN transceiver, and
Analog Devices isoPower® dc-to-dc converter into a single
SOIC surface mount package. An on-chip oscillator outputs a pair
of square waveforms that drive an internal transformer to provide
isolated power. The device is powered by a single 5 V supply
realizing a fully isolated CAN solution.

The ADM3053 creates a fully isolated interface between the
CAN protocol controller and the physical layer bus. It is capable
of running at data rates of up to 1 Mbps.

The device has current limiting and thermal shutdown features
to protect against output short circuits. The part is fully specified
over the industrial temperature range and is available in a
20-lead, wide-body SOIC package.

The ADM3053 contains isoPower technology that uses high
frequency switching elements to transfer power through the
transformer. Special care must be taken during printed circuit
board (PCB) layout to meet emissions standards. Refer to the
AN-0971 Application Note, Control of Radiated Emissions with
isoPower Devices, for details on board layout considerations.

FUNCTIONAL BLOCK DIAGRAM

CC

isoPower DC-TO- DC CONVER TER

OSCILLATOR

V

IO

DIGITAL ISOLATION iCoupler

TxD

RxD

ADM3053

Rev. A

Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.

ENCODE

DECODE

GND1 GND2

LOGIC SIDE BUS SIDE

ISOLATION

BARRIER

RECTIFIER

REGULATOR

DECODE

ENCODE

ISOOUT

V

ISOIN

V

CC

TxD

R

S

SLOPE/

STANDBY

RxD

V

REF

REFERENCE

VOLTAGE

PROTECTION

DRIVER

RECEIVER

CAN TRANSCEIVER

GND2

R

S

CANH

CANL

V

REF

09293-001

Figure 1.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: [phone] www.analog.com
Fax: [phone] ©2011–2012 Analog Devices, Inc. All rights reserved.

ADM3053 Data Sheet

TABLE OF CONTENTS

Features.............................................................................................. 1

Applications....................................................................................... 1

General Description ......................................................................... 1

Functional Block Diagram .............................................................. 1

Revision History ............................................................................... 2

Specifications..................................................................................... 3

Timing Specifications .................................................................. 4

Switching Characteristics ............................................................ 4

Regulatory Information............................................................... 5

Insulation and Safety-Related Specifications............................ 5

VDE 0884 Insulation Characteristics ........................................ 6

Absolute Maximum Ratings............................................................ 7

ESD Caution.................................................................................. 7

Pin Configuration and Function Descriptions............................. 8

Typical Performance Characteristics ............................................. 9

Test Circuits..................................................................................... 12

Circuit Description......................................................................... 13

CAN Transceiver Operation..................................................... 13

Signal Isolation ........................................................................... 13

Power Isolation ........................................................................... 13

Truth Tables................................................................................. 13

Thermal Shutdown .................................................................... 13

DC Correctness and Magnetic Field Immunity........................... 13

Applications Information.............................................................. 15

PCB Layout ................................................................................. 15

EMI Considerations................................................................... 15

Insulation Lifetime..................................................................... 15

Typical Applications....................................................................... 17

Outline Dimensions....................................................................... 18

Ordering Guide .......................................................................... 18

REVISION HISTORY

3/12—Rev. 0 to Rev. A

Changes to Features Section............................................................ 1

Changes to Table 3............................................................................ 5

Changes to VDE 0884 Insulation Characteristics Section.......... 6

Changes to Figure 6.......................................................................... 9

Changes to Figure 11...................................................................... 10

Changes to Applications Information Section............................ 15

5/11—Revision 0: Initial Version

Rev. A | Page 2 of 20

Data Sheet ADM3053

SPECIFICATIONS

All voltages are relative to their respective ground; 4.5 V ≤ VCC ≤ 5.5 V; 3.0 V ≤ VIO ≤ 5.5 V. All minimum/maximum specifications apply
over the entire recommended operation range, unless otherwise noted. All typical specifications are at T
unless otherwise noted.

Table 1.

Parameter Symbol Min Typ Max Unit Test Conditions

SUPPLY CURRENT

Logic Side isoPower Current

Recessive State ICC 29 36 mA RL = 60 Ω, RS = low, see Figure 25
Dominant State ICC 195 232 mA RL = 60 Ω, RS = low, see Figure 25
TxD/RxD Data Rate 1 Mbps ICC 139 170 mA RL = 60 Ω, RS = low, see Figure 25

Logic Side iCoupler Current

TxD/RxD Data Rate 1 Mbps IIO 1.6 2.5 mA

DRIVER

Logic Inputs

Input Voltage High VIH 0.7 VIO V Output recessive
Input Voltage Low VIL 0.25 VIO V Output dominant
CMOS Logic Input Currents IIH, IIL 500 µA TxD

Differential Outputs

Recessive Bus Voltage V
CANH Output Voltage V
CANL Output Voltage V

, V

CANL

CANH

CANL

2.0 3.0 V TxD = high, RL = ∞, see Figure 22

CANH

2.75 4.5 V TxD = low, see Figure 22

0.5 2.0 V TxD = low, see Figure 22
Differential Output Voltage VOD 1.5 3.0 V TxD = low, RL = 45 Ω, see Figure 22
V
Short-Circuit Current, CANH I

−500 +50 mV TxD = high, RL = ∞, see Figure 22

OD

−200 mA V

SCCANH

−100 mA V
Short-Circuit Current, CANL I

200 mA V

SCCANL

RECEIVER

Differential Inputs

Differential Input Voltage Recessive V

Differential Input Voltage Dominant V

Input Voltage Hysteresis V

−1.0 +0.5 V

IDR

0.9 5.0 V

IDD

150 mV See Figure 3

HYS

CANH, CANL Input Resistance RIN 5 25 kΩ
Differential Input Resistance R

20 100 kΩ

DIFF

Logic Outputs

Output Low Voltage VOL 0.2 0.4 V I
Output High Voltage VOH V

− 0.3 VIO − 0.2 V I

IO

Short Circuit Current IOS 7 85 mA V

VOLTAGE REFERENCE

Reference Output Voltage V

2.025 3.025 V |I

REF

COMMON-MODE TRANSIENT IMMUNITY1 25 kV/µs VCM = 1 kV, transient magnitude = 800 V
SLOPE CONTROL

Current for Slope Control Mode I
Slope Control Mode Voltage V

1

CM is the maximum common-mode voltage slew rate that can be sustained while maintaining specification-compliant operation. VCM is the common-mode potential

difference between the logic and bus sides. The transient magnitude is the range over which the common mode is slewed. The common-mode voltage slew rates
apply to both rising and falling common-mode voltage edges.

−10 −200 µA

SLOPE

1.8 3.3 V

SLOPE

= 25°C, VCC = 5 V, VIO = 5 V

A

= −5 V

CANH

= −36 V

CANH

= 36 V

CANL

, V

−7 V < V
C

−7 V < V
C

CANL

= 15 pF

L

CANL

= 15 pF

L

= 1.5 mA

OUT

= −1.5 mA

OUT

= GND1 or VIO

OUT

= 50 µA|

REF

< +12 V, see Figure 23,

CANH

, V

< +12 V, see Figure 23,

CANH

Rev. A | Page 3 of 20

ADM3053 Data Sheet

V

TIMING SPECIFICATIONS

All voltages are relative to their respective ground; 3.0 V ≤ VIO ≤ 5.5 V; 4.5 V ≤ VCC ≤ 5.5 V. TA = −40°C to +85°C, unless otherwise noted.

Table 2.

Parameter Symbol Min Typ Max Unit Test Conditions

DRIVER

Maximum Data Rate 1 Mbps
Propagation Delay from TxD On to Bus Active t

Propagation Delay from TxD Off to Bus Inactive t

RECEIVER

Propagation Delay from TxD On to Receiver Active t
630 ns RS = 47 kΩ; see Figure 2
Propagation Delay from TxD Off to Receiver Inactive1 t
480 ns RS = 47 kΩ; see Figure 2

CANH, CANL SLEW RATE |SR| 7 V/µs RS = 47 kΩ

1

Guaranteed by design and characterization.

SWITCHING CHARACTERISTICS

IO

V

TxD

0V

0.25V

IO

90 ns

onTxD

120 ns

offTxD

200 ns RS = 0 Ω; see Figure 2

onRxD

250 ns RS = 0 Ω; see Figure 2

offRxD

0.7V

IO

= 0 Ω; see Figure 2 and Figure 24

R

S

R

= 60 Ω, CL = 100 pF

L

= 0 Ω; see Figure 2 and Figure 24

R

S

= 60 Ω, CL = 100 pF

R

L

V

V

V

DIFF

RxD

OD

0.9V

V

OR

V

IO

0V

t

onTxD

t

onRxD

V

DIFF

0.4V

= V

CANH

– V

CANL

t

offTxD

t

offRxD

0.5V

VIO – 0.3V

09293-002

Figure 2. Driver Propagation Delay, Rise/Fall Timing

Rev. A | Page 4 of 20

Data Sheet ADM3053

V

RxD

HIGH

LOW

V

HYS

0.5

0.9

Figure 3. Receiver Input Hysteresis

VID (V)

09293-004

REGULATORY INFORMATION

Table 3. ADM3053 Approvals

Organization Approval Type Notes

UL

Recognized under the Component
Recognition Program of Underwriters

In accordance with UL 1577, each ADM3053 is proof tested by applying
an insulation test voltage ≥2500 V rms for 1 second. File E214100.

Laboratories, Inc.

VDE

Certified according to DIN EN 60747-5-2 (VDE

In accordance with VDE 0884-2. File 2471900-4880-0001.

0884 Part 2): 2003-01

INSULATION AND SAFETY-RELATED SPECIFICATIONS

Table 4.

Parameter Symbol Value Unit Conditions

Rated Dielectric Insulation Voltage 2500 V rms 1-minute duration
Minimum External Air Gap (Clearance) L(I01) 7.7 mm

Minimum External Tracking (Creepage) L(I02) 7.6 mm

Minimum Internal Gap (Internal

0.017 min mm Insulation distance through insulation

Clearance)

Tracking Resistance (Comparative

CTI >175 V DIN IEC 112/VDE 0303-1

Tracking Index)

Isolation Group IIIa Material group (DIN VDE 0110: 1989-01, Table 1)

Measured from input terminals to output terminals,
shortest distance through air

Measured from input terminals to output terminals,
shortest distance along body

Rev. A | Page 5 of 20

ADM3053 Data Sheet

VDE 0884 INSULATION CHARACTERISTICS

This isolator is suitable for basic electrical isolation only within the safety limit data. Maintenance of the safety data must be ensured by
means of protective circuits.

Table 5.

Description Conditions Symbol Characteristic Unit

CLASSIFICATIONS

Installation Classification per DIN VDE 0110 for Rated

Mains Voltage
≤150 V rms I to IV
≤300 V rms I to III

≤400 V rms I to II
Climatic Classification 40/85/21
Pollution Degree DIN VDE 0110, see Table 3 2

VOLTAGE

Maximum Working Insulation Voltage V
Input-to-Output Test Voltage VPR

Method b1

Highest Allowable Overvoltage (Transient overvoltage, tTR = 10 sec) VTR 4000 V

SAFETY-LIMITING VALUES

Case Temperature TS 150 °C
Input Current I
Output Current I
Insulation Resistance at TS V

× 1.875 = VPR, 100% production tested,

V

IORM

= 1 sec, partial discharge < 5 pC

t

m

Maximum value allowed in the event of a

560 V

IORM

1050 V

PEAK

PEAK

PEAK

failure

265 mA

S, INPUT

335 mA

S, OUTPUT

= 500 V RS >109 Ω

IO

Rev. A | Page 6 of 20

Data Sheet ADM3053

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted. All voltages are relative to

their respective ground.

Table 6.

Parameter Rating

VCC −0.5 V to +6 V

VIO −0.5 V to +6 V

Digital Input Voltage, TxD −0.5 V to VIO + 0.5 V

Digital Output Voltage, RxD −0.5 V to VIO + 0.5 V

CANH, CANL −36 V to +36 V

V

−0.5 V to +6 V

REF

RS −0.5 V to +6 V

Operating Temperature Range −40°C to +85°C

Storage Temperature Range −55°C to +150°C

ESD (Human Body Model)

Lead Temperature

Soldering (10 sec) 300°C
Vapor Phase (60 sec) 215°C

Infrared (15 sec) 220°C
θJA Thermal Impedance 53°C/W
TJ Junction Temperature 130°C

3 kV

Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.

Table 7. Maximum Continuous Working Voltage

Parameter Max Unit Reference Standard

AC Voltage

Bipolar Waveform 424 V peak

Unipolar Waveform

Basic Insulation 560 V peak

DC Voltage

Basic Insulation 560 V peak

1

Refers to continuous voltage magnitude imposed across the isolation

barrier. See the Insulation Lifetime section for more details.

50 year minimum
lifetime

Maximum approved
working voltage per
VDE 0884 Part 2

Maximum approved
working voltage per
VDE 0884 Part 2

ESD CAUTION

1

Rev. A | Page 7 of 20

ADM3053 Data Sheet

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

GND1

1

NC

2

GND1

3

RxD

4

ADM3053

5

TxD

V

IO

GND1

V

CC

GND1

GND1

NOTES

1. NC = NO CONNECT. DO NOT
CONNECT TO THIS PIN.

2. PIN 12 AND PIN 19 MUST BE
CONNECTED EXTERNALLY.

TOP VIEW

6

(Not to Scale)

7

8

9

10

Figure 4. Pin Configuration

Table 8. Pin Function Descriptions

Pin No. Mnemonic Description

1 GND1 Ground, Logic Side.
2 NC

No Connect. Do not connect to this pin.
3 GND1 Ground, Logic Side.
4 RxD Receiver Output Data.
5 TxD Driver Input Data.
6 VIO

iCoupler Power Supply. It is recommended that a 0.1 F and a 0.01 F decoupling capacitor be fitted

between Pin 6 and GND1. See Figure 28 for layout recommendations.
7 GND1 Ground, Logic Side.
8 V

CC

isoPower Power Supply. It is recommended that a 0.1 F and a 10 F decoupling capacitor be fitted

between Pin 8 and Pin 9.
9 GND1 Ground, Logic Side.
10 GND1 Ground, Logic Side.
11 GND2 Ground, Bus Side.
12 V

ISOOUT

Isolated Power Supply Output. This pin must be connected externally to V

reservoir capacitor of 10 F and a decoupling capacitor of 0.1 F be fitted between Pin 12 and Pin 11.
13 GND2 Ground (Bus Side).
14 V

Reference Voltage Output.

REF

15 CANL Low-Level CAN Voltage Input/Output.
16 GND2 Ground (Bus Side).
17 CANH High-Level CAN Voltage Input/Output.
18 RS Slope Resistor Input.
19 V

ISOIN

Isolated Power Supply Input. This pin must be connected externally to V

and a 0.01 F decoupling capacitor be fitted between Pin 19 and Pin 20.
20 GND2 Ground (Bus Side).

20

19

18

17

16

15

14

13

12

11

GND2

V

ISOIN

R

S

CANH

GND2

CANL

V

REF

GND2

V

ISOOUT

GND2

09293-005

. It is recommended that a

ISOIN

. It is recommended that a 0.1 F

ISOOUT

Rev. A | Page 8 of 20

Data Sheet ADM3053

TYPICAL PERFORMANCE CHARACTERISTICS

160

180

140

120

(mA)

CC

100

80

60

40

SUPPLY CURRENT, I

20

0

100 1000

Figure 5. Supply Current, I

50

45

40

35

30

25

20

SLEW RATE (V/µs)

15

10

5

0

0 1020304050607080

Figure 6. Driver Slew Rate vs. Resistance, R

5.5

VCC = 4.5V, VIO = 5V

V

= 5V, VIO = 5V

CC

DATA RATE (kbps)

vs. Data Rate

CC

RESISTANCE, RS (kΩ)

V

= 5.5V, VIO = 5V

CC

S

175

170

165

160

VCC = 5V, VIO = 5V

155

RECEIVER INPUT HYSTERESIS (mV)

V

= 5V, VIO = 3.3V

CC

150

09293-100

–40 85603510–15

TEMPERAT URE (°C)

09293-103

Figure 8. Receiver Input Hysteresis vs. Temperature

53

52

51

V

= 5V, VIO = 3.3V

(ns)

50

onTxD

t

49

48

PROPAGATION DELAY TxD ON TO BUS ACTIVE,

47

–40 85603510–15

09293-101

CC

VCC = 5V, VIO = 5V

TEMPERAT URE (°C)

09293-104

Figure 9. Propagation Delay from TxD On to Bus Active vs. Temperature

96

4.5

(mA)

IO

3.5

2.5

= 5V

V

SUPPLY CURRENT, I

1.5

0.5
100 1000

Figure 7. Supply Current, I

IO

VIO = 3.3V

DATA RATE (kbps)

vs. Data Rate

IO

PROPAGATION DELAY TxD OFF TO BUS

09293-102

Figure 10. Propagation Delay from TxD Off to Bus Inactive vs. Temperature

Rev. A | Page 9 of 20

94

92

90

(ns)

88

offTxD

t

86

84

INACTIVE,

82

80

78

–40 85603510–15

= 5V, VIO = 3.3V

V

CC

VCC = 5V, VIO = 5V

TEMPERAT URE (°C)

09293-105

ADM3053 Data Sheet

R

R

R

R

152

150

148

146

(ns)

144

onRxD

t

142

140

ACTIVE,

138

136

PROPAGATION DELAY TxD ON TO RECEIVE

134

–40 85603510–15

= 5V, VIO = 3.3V, RS = 0Ω

V

CC

VCC = 5V, VIO = 5V, RS = 0Ω

TEMPERATURE (°C)

Figure 11. Propagation Delay from TxD Off to Bus Inactive vs. Temperature

600

= 5V, VIO = 3.3V, RS = 47kΩ

V

CC

09293-106

330

325

320

315

(ns)

310

305

offRxD

t

300

295

INACTIVE,

290

285

280

PROPAGATION DELAY TxD OFF T O RECEIVE

275

–40 85603510–15

V

= 5V, VIO = 3.3V, RS = 47kΩ

CC

VCC = 5V, VIO = 5V, RS = 47kΩ

TEMPERAT URE (°C)

Figure 14. Propagation Delay from TxD Off to Receiver Inactive vs.

Temperature

2.55

09293-109

500

VCC = 5V, VIO = 5V, RS = 47kΩ

400

(ns)

onRxD

300

t

200

ACTIVE,

100

PROPAGATION DELAY TxD ON TO RECEIVE

0

–40 85603510–15

TEMPERAT URE (°C)

Figure 12. Propagation Delay from TxD On to Receiver Active vs.

09293-107

2.50

2.45

VCC = 5V, VIO = 5V, RL = 60Ω

(V)

2.40

OD

V

2.35

2.30

DIFFERENTIAL OUTPUT VOLTAGE DOMINANT,

2.25
–40 85603510–15

VCC = 5V, VIO = 3.3V, RL = 60Ω
VCC = 5V, VIO = 5V, RL = 45Ω
VCC = 5V, VIO = 3.3V, RL = 45Ω

TEMPERATURE (° C)

Figure 15. Differential Output Voltage Dominant vs. Temperature

09293-110

Temperature

250

V

= 5V, VIO = 3.3V, RS = 0Ω

CC

200

(ns)

150

offRxD

t

100

INACTIVE,

50

PROPAGATION DELAY TxD OFF TO RECEIVE

0

–40 85603510–15

VCC = 5V, VIO = 5V, RS = 0Ω

TEMPERAT URE (°C)

09293-108

Figure 13. Propagation Delay from TxD Off to Receiver Inactive vs.

2.55

VIO = 5V, TA = 25°C, RL = 60Ω

2.50

2.45

(V)

2.40

OD

V

2.35

= 5V, TA = 25°C, RL = 45Ω

V

IO

2.30

DIFFERENTIAL OUTPUT VOLTAG E DOMINANT,

2.25

4.5 5.55.35.14.94.7

SUPPLY VOLTAGE, VCC (V)

Figure 16. Differential Output Voltage Dominant vs. Supply Voltage, V

09293-111

CC

Temperature

Rev. A | Page 10 of 20

Data Sheet ADM3053

(V)

REF

2.80

2.75

2.70

2.65

2.60

2.55

VCC = 5V, VIO = 5V, I

= 5V, VIO =5V, I

V

CC

V

= 5V, VIO = 5V, I

CC

= 5V, VIO = 5V, I

V

CC

REF

REF

REF

REF

= +50µA

= +5µA

= –5µA

= –50µA

(V)

OH

4.895

4.890

4.885

4.880

4.875

4.870

VCC = 5V, VIO = 5V, I

OUT

= –1.5mA

2.50

REFERENCE VOLTAGE, V

2.45

2.40

160

140

120

(mA)

CC

100

80

60

40

SUPPLY CURRENT, I

20

–40 85603510–15

TEMPERATURE (° C)

Figure 17. Reference Voltage vs. Temperature

VCC = 5V
V

= 5V

IO

DATA RATE = 1Mbps
R

= 60Ω

L

0

–40 85603510–15

TEMPERATURE (° C)

Figure 18. Supply Current I

CC

vs. Temperature

4.865

4.860

RECEIVER OUTPUT HIGH VOLTAGE, V

4.855
–40 85603510–15

09293-112

TEMPERAT URE (°C)

09293-115

Figure 20. Receiver Output High Voltage vs. Temperature

120

(mV)

100

OL

80

60

40

20

RECEIVER OUTPUT LOW VOLTAGE, V

0

09293-113

–40 85603510–15

TEMPERAT URE (°C)

09293-116

Figure 21. Receiver Output Low Voltage vs. Temperature

140

138

136

134

(mA)

CC

132

130

128

126

124

SUPPLY CURRE NT, I

122

120

118

4.5 5.55.45.35.25.15.04.94.84.74.6

SUPPLY VOLTAGE, VCC (V)

Figure 19. Supply Current, I

CC

VIO = 5V
T

= 25°C

A

DATA RATE = 1Mbps

vs. Supply Voltage VCC

09293-114

Rev. A | Page 11 of 20

ADM3053 Data Sheet

TEST CIRCUITS

CANH

R

TxD VODV

Figure 22. Driver Voltage Measurement

CANH

CANL

Figure 23. Receiver Voltage Measurements

L

V

CANH

2

R

L

V

OC

2

09293-006

CANH

V

ID

RxD

C

L

09293-007

TxD

R

C

L

L

CANL

RxD

15pF

Figure 24. Switching Characteristics Measurements

09293-008

V

10µF100nF

TxD

RxD

V

CC

IO

DIGITAL ISOLATION iCoupler

ADM3053

GND1 GND2

LOGIC SIDE BUS SIDE

isoPower DC-TO-DC CONVERTER

OSCILLATOR

ENCODE

DECODE

ISOLATION

BARRIER

Figure 25. Supply Current Measurement Test Circuit

RECTIFI ER

REGULATOR

DECODE

ENCODE

10µF100nF10µF100nF

V

ISOOUT

V

TxD

R

RxD

REF

S

SLOPE/

STANDBY

REFERENCE

VOLTAGE

V

PROTECTION

DRIVER

RECEIVER

CAN TRANSCEIV ER

V

ISOIN

CC

R

S

CANH

CANL

V

GND2

REF

R

S

10µF 100nF

R

L

09293-009

Rev. A | Page 12 of 20

Data Sheet ADM3053

CIRCUIT DESCRIPTION

CAN TRANSCEIVER OPERATION

A CAN bus has two states called dominant and recessive. A
dominant state is present on the bus when the differential
voltage between CANH and CANL is greater than 0.9 V. A
recessive state is present on the bus when the differential voltage
between CANH and CANL is less than 0.5 V. During a dominant
bus state, the CANH pin is high, and the CANL pin is low.
During a recessive bus state, both the CANH and CANL pins
are in the high impedance state.

Pin 18 (R

) allows two different modes of operation to be

S

selected: high-speed and slope control. For high-speed
operation, the transmitter output transistors are simply
switched on and off as fast as possible. In this mode, no
measures are taken to limit the rise and fall slopes. A shielded
cable is recommended to avoid EMI problems. High-speed
mode is selected by connecting Pin 18 to ground.

Slope control mode allows the use of an unshielded twisted pair
or a parallel pair of wires as bus lines. To reduce EMI, the rise
and fall slopes should be limited. The rise and fall slopes can be
programmed with a resistor connected from Pin 18 to ground.
The slope is proportional to the current output at Pin 18.

SIGNAL ISOLATION

The ADM3053 signal isolation is implemented on the logic side of
the interface. The part achieves signal isolation by having a
digital isolation section and a transceiver section (see Figure 1).
Data applied to the TxD pin referenced to logic ground (GND1)
are coupled across an isolation barrier to appear at the transceiver
section referenced to isolated ground (GND2). Similarly, the
single-ended receiver output signal, referenced to isolated
ground in the transceiver section, is coupled across the isolation
barrier to appear at the RxD pin referenced to logic ground
(GND1). The signal isolation is powered by the V

pin and

IO

allows the digital interface to 3.3 V or 5 V logic.

POWER ISOLATION

The ADM3053 power isolation is implemented using an
isoPower integrated isolated dc-to-dc converter. The dc-to-dc
converter section of the ADM3053 works on principles that are
common to most modern power supplies. It is a secondary side
controller architecture with isolated pulse-width modulation
(PWM) feedback. V
that switches current into a chip-scale air core transformer.
Power transferred to the secondary side is rectified and regulated to
5 V. The secondary (V
creating a PWM control signal that is sent to the primary (V
side by a dedicated iCoupler data channel. The PWM modulates
the oscillator circuit to control the power being sent to the
secondary side. Feedback allows for significantly higher power
and efficiency.

power is supplied to an oscillating circuit

CC

) side controller regulates the output by

ISO

)

CC

TRUTH TABLES

The truth tables in this section use the abbreviations found in
Tabl e 9 .

Table 9. Truth Table Abbreviations

Letter Description

H High level
L Low level
X Don’t care
Z High impedance (off)
I Indeterminate
NC Not connected

Table 10. Transmitting

Supply Status Input Outputs

VIO VCC TxD Bus State CANH CANL

On On L Dominant H L
On On H Recessive Z Z
On On Floating Recessive Z Z
Off On X Recessive Z Z
On Off L Indeterminate I I

Table 11. Receiving

Supply Status Inputs Output
VIO VCC VID = CANH − CANL Bus State RxD

On On ≥ 0.9 V
On On ≤ 0.5 V
On On 0.5 V < VID < 0.9 V
On On Inputs open
Off On X1
On Off X1

1

X = don’t care.

Dominant
Recessive

1

X
Recessive

1

X

1

X

L
H
I
H
I
H

THERMAL SHUTDOWN

The ADM3053 contains thermal shutdown circuitry that protects
the part from excessive power dissipation during fault conditions.
Shorting the driver outputs to a low impedance source can
result in high driver currents. The thermal sensing circuitry
detects the increase in die temperature under this condition and
disables the driver outputs. This circuitry is designed to disable
the driver outputs when a die temperature of 150°C is reached.
As the device cools, the drivers are reenabled at a temperature of
140°C.

DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY

The digital signals transmit across the isolation barrier using
iCoupler technology. This technique uses chip-scale transformer
windings to couple the digital signals magnetically from one
side of the barrier to the other. Digital inputs are encoded into
waveforms that are capable of exciting the primary transformer

Rev. A | Page 13 of 20

ADM3053 Data Sheet

winding. At the secondary winding, the induced waveforms are
decoded into the binary value that was originally transmitted.

Positive and negative logic transitions at the isolator input cause
narrow (~1 ns) pulses to be sent to the decoder via the transformer.
The decoder is bistable and is, therefore, either set or reset by
the pulses, indicating input logic transitions. In the absence of
logic transitions at the input for more than 1 µs, periodic sets of
refresh pulses indicative of the correct input state are sent to
ensure dc correctness at the output. If the decoder receives no
internal pulses of more than approximately 5 s, the input side
is assumed to be unpowered or nonfunctional, in which case,
the isolator output is forced to a default state by the watchdog
timer circuit.

This situation should occur in the ADM3053 devices only during
power-up and power-down operations. The limitation on the
ADM3053 magnetic field immunity is set by the condition in
which induced voltage in the transformer receiving coil is
sufficiently large to either falsely set or reset the decoder. The
following analysis defines the conditions under which this
can occur.

The 3.3 V operating condition of the ADM3053 is examined
because it represents the most susceptible mode of operation.
The pulses at the transformer output have an amplitude of >1.0 V.
The decoder has a sensing threshold of about 0.5 V, thus
establishing a 0.5 V margin in which induced voltages can be
tolerated. The voltage induced across the receiving coil is
given by

V = (−dβ/dt)Σπr

2; n = 1, 2, … , N

n

where:

β is magnetic flux density (gauss).
N is the number of turns in the receiving coil.
r

is the radius of the nth turn in the receiving coil (cm).

n

Given the geometry of the receiving coil in the ADM3053 and
an imposed requirement that the induced voltage be, at most,
50% of the 0.5 V margin at the decoder, a maximum allowable
magnetic field is calculated as shown in Figure 26.

100

For example, at a magnetic field frequency of 1 MHz, the
maximum allowable magnetic field of 0.2 kgauss induces a
voltage of 0.25 V at the receiving coil. This is about 50% of the
sensing threshold and does not cause a faulty output transition.
Similarly, if such an event occurs during a transmitted pulse
(and is of the worst-case polarity), it reduces the received pulse
from >1.0 V to 0.75 V, which is still well above the 0.5 V sensing
threshold of the decoder.

The preceding magnetic flux density values correspond
to specific current magnitudes at given distances from the
ADM3053 transformers. Figure 27 expresses these allowable
current magnitudes as a function of frequency for selected
distances. As shown in Figure 27, the ADM3053 is extremely
immune and can be affected only by extremely large currents
operated at high frequency very close to the component. For the
1 MHz example, a 0.5 kA current must be placed 5 mm away from
the ADM3053 to affect component operation.

1k

DISTANCE = 1m

100

10

DISTANCE = 100mm

1

DISTANCE = 5mm

0.1

MAXIMUM ALLOWABLE CURRENT (kA)

0.01
1k 10k 100M100k 1M 10M

MAGNETIC FIELD FREQ UENCY (Hz)

Figure 27. Maximum Allowable Current for Various Current-to-ADM3053

Spacings

Note that in combinations of strong magnetic field and high
frequency, any loops formed by the printed circuit board (PCB)
traces can induce error voltages sufficiently large to trigger the
thresholds of succeeding circuitry. Proceed with caution in the
layout of such traces to prevent this from occurring.

09293-011

10

1

0.1

DENSITY (kgauss)

0.01

MAXIMUM ALLOWABLE MAGNETIC FLUX

0.001
1k 10k 10M

Figure 26. Maximum Allowable External Magnetic Flux Density

MAGNETIC FIELD FREQUENCY (Hz)

1M

100M100k

09293-010

Rev. A | Page 14 of 20

Data Sheet ADM3053

APPLICATIONS INFORMATION

PCB LAYOUT

The ADM3053 signal and power isolated CAN transceiver
contains an isoPower integrated dc-to-dc converter, requiring
no external interface circuitry for the logic interfaces. Power
supply bypassing is required at the input and output supply pins
(see Figure 28). The power supply section of the ADM3053 uses
a 180 MHz oscillator frequency to pass power efficiently through
its chip-scale transformers. In addition, the normal operation of
the data section of the iCoupler introduces switching transients
on the power supply pins.

Bypass capacitors are required for several operating frequencies.
Noise suppression requires a low inductance, high frequency
capacitor, whereas ripple suppression and proper regulation
require a large value capacitor. These capacitors are connected
between GND1 and Pin 6 (V
a combination of 100 nF and 10 nF be placed as shown in Figure
28 (C6 and C4). It is recommended that a combination of two
capacitors, with values of 100 nF and 10 µF, are placed between
Pin 8 (V
and C1). The V

) and Pin 9 (GND1) for V

CC

and V

ISOIN

Pin 11 (GND2) and Pin 12 (V
of 100 nF and 10 µF as shown in Figure 28 (C5 and C8). Two
capacitors are recommended to be fitted Pin 19 (V
(GND2) with values of 100nF and 10nF as shown in Figure 28
(C9 and C7). The best practice recommended is to use a very low
inductance ceramic capacitor, or its equivalent, for the smaller
value. The total lead length between both ends of the capacitor
and the input power supply pin should not exceed 10 mm.

Figure 28. Recommended PCB Layout

In applications involving high common-mode transients, ensure
that board coupling across the isolation barrier is minimized.
Furthermore, design the board layout such that any coupling
that does occur equally affects all pins on a given component
side. Failure to ensure this can cause voltage differentials between

) for VIO. It is recommended that

IO

as shown in Figure 28 (C2

CC

capacitors are connected between

ISOOUT

) with recommended values

ISOOUT

) and Pin 20

ISOIN

09293-012

pins exceeding the absolute maximum ratings for the device,
thereby leading to latch-up and/or permanent damage.

The ADM3053 dissipates approximately 650 mW of power
when fully loaded. Because it is not possible to apply a heat sink
to an isolation device, the devices primarily depend on heat
dissipation into the PCB through the GND pins. If the devices
are used at high ambient temperatures, provide a thermal path
from the GND pins to the PCB ground plane. The board layout
in Figure 28 shows enlarged pads for Pin 1, Pin 3, Pin 9, Pin 10,
Pin 11, Pin 14, Pin 16, and Pin 20. Implement multiple vias from
the pad to the ground plane to reduce the temperature inside the
chip significantly. The dimensions of the expanded pads are at
the discretion of the designer and dependent on the available
board space.

EMI CONSIDERATIONS

The dc-to-dc converter section of the ADM3053 must, of
necessity, operate at very high frequency to allow efficient
power transfer through the small transformers. This creates
high frequency currents that can propagate in circuit board
ground and power planes, causing edge and dipole radiation.
Grounded enclosures are recommended for applications that
use these devices. If grounded enclosures are not possible, good
RF design practices should be followed in the layout of the PCB.
See the AN-0971 Application Note, Control of Radiated Emissions
with isoPower Devices, for more information.

INSULATION LIFETIME

All insulation structures eventually break down when subjected to
voltage stress over a sufficiently long period. The rate of insulation
degradation is dependent on the characteristics of the voltage
waveform applied across the insulation. Analog Devices conducts
an extensive set of evaluations to determine the lifetime of the
insulation structure within the ADM3053.

Accelerated life testing is performed using voltage levels higher
than the rated continuous working voltage. Acceleration factors for
several operating conditions are determined, allowing calculation
of the time to failure at the working voltage of interest. The values
shown in Tab l e 5 summarize the peak voltages for 50 years of
service life in several operating conditions. In many cases, the
working voltage approved by agency testing is higher than the 50
year service life voltage. Operation at working voltages higher than
the service life voltage listed leads to premature insulation
failure.

The insulation lifetime of the ADM3053 depends on the voltage
waveform type imposed across the isolation barrier. The iCoupler
insulation structure degrades at different rates, depending on
whether the waveform is bipolar ac, unipolar ac, or dc. Figure 29,
Figure 30, and Figure 31 illustrate these different isolation voltage
waveforms.

Rev. A | Page 15 of 20

ADM3053 Data Sheet

Bipolar ac voltage is the most stringent environment. A 50 year
operating lifetime under the bipolar ac condition determines
the Analog Devices recommended maximum working voltage.

In the case of unipolar ac or dc voltage, the stress on the insulation
is significantly lower. This allows operation at higher working
voltages while still achieving a 50 year service life. The working
voltages listed in Tabl e 5 can be applied while maintaining the
50 year minimum lifetime, provided the voltage conforms to either
the unipolar ac or dc voltage cases. Any cross insulation voltage
waveform that does not conform to Figure 30 or Figure 31 should
be treated as a bipolar ac waveform, and its peak voltage should
be limited to the 50-year lifetime voltage value listed in Tabl e 5 .

RATED PEAK VOLTAGE

0V

09293-013

Figure 29. Bipolar AC Waveform

RATED PEAK VOLTAGE

0V

Figure 30. DC Waveform

09293-014

RATED PEAK VOLTAGE

NOTES

1. THE VOLTAGE IS SHOWN AS SINUSODIAL FOR ILLUSTRATION
PURPOSES ONLY. IT IS MEANT TO REPRESENT ANY VOLTAGE
WAVEFORM VARYING BETWEEN 0 AND SOME LIMITING VALUE.
THE LIMITING VALUE CAN BE POSITIVE OR NEGATIVE, BUT THE
VOLTAGE CANNOT CROSS 0V.

0V

Figure 31. Unipolar AC Waveform

09293-015

Rev. A | Page 16 of 20

Data Sheet ADM3053

TYPICAL APPLICATIONS

Figure 32 is an example circuit diagram using the ADM3053.

5V

SUPPLY

10µF100nF

3.3V/5V

SUPPLY

CAN

CONTROLLER

RECTIFIER

DECODE

ENCODE

V

ISOOUT

V

TxD

RxD

REF

V

ISOIN

10nF

V

CC

PROTECTION

R

SLOPE/

S

STANDBY

REFERENCE

VOLTAGE

DRIVER

RECEIVER

CAN TRANSCEI VER

GND2

R

S

CANH

CANL

V

REF

100nF

R

S

CANH

R

T

CANL

BUS

CONNECTO R

09293-016

V

100nF10µF

V

IO

100nF10nF

TxD

RxD

CC

isoPowerDC-T O-DC CON VERTER

OSCILLATOR

REGULATOR

DIGITAL ISOLATI ON iCoupler

ENCODE

DECODE

ADM3053

GND1 GND2

LOGIC SIDE BUS SIDE

ISOLATION

BARRIER

Figure 32. Example Circuit Diagram Using the ADM3053

Rev. A | Page 17 of 20

ADM3053 Data Sheet

OUTLINE DIMENSIONS

13.00 (0.5118)

12.60 (0.4961)

11

7.60 (0.2992)

7.40 (0.2913)

10

10.65 (0.4193)

10.00 (0.3937)

2.65 (0.1043)

2.35 (0.0925)

SEATING
PLANE

8°
0°

0.33 (0.0130)

0.20 (0.0079)

5

(

5

0

.

(

5

0

.

)

0

2

9

45°

)

0

0

9

8

1.27 (0.0500)

0.40 (0.0157)

06-07-2006-A

0

.

7

.

2

0

0.30 (0.0118)

0.10 (0.0039)

COPLANARITY

0.10

20

1

1.27

(0.0500)

BSC

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

0.51 (0.0201)

0.31 (0.0122)

COMPLIANT TO JEDEC STANDARDS MS-013-AC

Figure 33. 20-Lead Standard Small Outline Package [SOIC_W]

Wide Body

(RW-20)

Dimensions shown in millimeters and (inches)

ORDERING GUIDE

Model1 Temperature Range Package Description Package Option

ADM3053BRWZ −40°C to +85°C 20-Lead SOIC_W RW-20
ADM3053BRWZ-REEL7 −40°C to +85°C 20-Lead SOIC_W RW-20
EVAL-ADM3053EBZ ADM3053 Evaluation Board

1

Z = RoHS Compliant Part.

Rev. A | Page 18 of 20

Data Sheet ADM3053

NOTES

Rev. A | Page 19 of 20

ADM3053 Data Sheet

NOTES

©2011–2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09293-0-3/12(A)

Rev. A | Page 20 of 20