ANALOG DEVICES ADM2682E, ADM2687E Service Manual

5 kV rms Signal and Power Isolated
V
V
RS-485 Transceiver with ±15 kV ESD

FEATURES

5 kV rms isolated RS-485/RS-422 transceiver, configurable as
half or full duplex
isoPower integrated isolated dc-to-dc converter ±15 kV ESD protection on RS-485 input/output pins Complies with ANSI/TIA/EIA-485-A-98 and ISO 8482:1987(E) Data rate: 16 Mbps (ADM2682E), 500 kbps (ADM2687E) 5 V or 3.3 V operation Connect up to 256 nodes on one bus Open- and short-circuit, fail-safe receiver inputs High common-mode transient immunity: >25 kV/μs Thermal shutdown protection Safety and regulatory approvals
UL recognition (pending)
5000 V rms for 1 minute per UL 1577
CSA Component Acceptance Notice #5A (pending)
IEC 60601-1: 400 V rms (basic), 250 V rms (reinforced) IEC 60950-1: 600 V rms (basic), 380 V rms (reinforced)
VDE Certificates of Conformity (pending)
DIN EN 60747-5-2 (VDE 0884 Part 2): 2003-01 V
= 846 V peak
IORM
Operating temperature range: −40°C to +85°C 16-lead wide-body SOIC with >8 mm creepage and clearance

APPLICATIONS

Isolated RS-485/RS-422 interfaces Industrial field networks Multipoint data transmission systems
CC
DIGITAL ISOLATION iCou pler
TxD
DE
RxD
RE
ADM2682E/ADM2687E

FUNCTIONAL BLOCK DIAGRAM

ISOOUT
isoPower DC-TO-DC CONVERTER
OSCILLATOR
ENCODE
ENCODE
DECODE
GND
1
ISOLATION
BARRIER
Figure 1.
RECTIFIER
REGULATOR
TRANSCEIVER
DECODE D
DECODE
ENCODE
ADM2682E/ADM2687E
GND
V
ISOIN
Y
Z
R
2
A
B
09927-001

GENERAL DESCRIPTION

The ADM2682E/ADM2687E are fully integrated 5 kV rms signal and power isolated data transceivers with ±15 kV ESD protection and are suitable for high speed communication on multipoint transmission lines. The ADM2682E/ADM2687E include an integrated 5 kV rms isolated dc-to-dc power supply that eliminates the need for an external dc-to-dc isolation block.
They are designed for balanced transmission lines and comply with ANSI/TIA/EIA-485-A-98 and ISO 8482:1987(E).
The devices integrate Analog Devices, Inc., iCoupler® technology to combine a 3-channel isolator, a three-state differential line driver, a differential input receiver, and Analog Devices isoPower® dc-to-dc converter into a single package. The devices are powered by a single 5 V or 3.3 V supply, realizing a fully integrated signal and power isolated RS-485 solution.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
The ADM2682E/ADM2687E drivers have an active high enable. An active low receiver enable is also provided, which causes the receiver output to enter a high impedance state when disabled.
The devices have current limiting and thermal shutdown features to protect against output short circuits and situations where bus contention may cause excessive power dissipation. The parts are fully specified over the industrial temperature range and are available in a highly integrated, 16-lead, wide­body SOIC package with >8 mm creepage and clearance.
The ADM2682E/ADM2687E contain isoPower technology that uses high frequency switching elements to transfer power through the transformer. Special care must be taken during printed circuit board (PCB) layout to meet emissions standards. Refer to
AN-0971 Application Note, Recommendations for Control of
Radiated Emissions with isoPower Devices, for details on board layout considerations.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2011 Analog Devices, Inc. All rights reserved.
ADM2682E/ADM2687E

TABLE OF CONTENTS

Features.............................................................................................. 1
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
ADM2682E Timing Specifications ............................................ 4
ADM2687E Timing Specifications ............................................ 4
Package Characteristics ............................................................... 4
Regulatory Information............................................................... 5
Insulation and Safety-Related Specifications............................ 5
VDE 0884 Insulation Characteristics (Pending)...................... 6
Absolute Maximum Ratings............................................................ 7
ESD Caution.................................................................................. 7
Pin Configuration and Function Descriptions............................. 8
Typical Performance Characteristics ............................................. 9
Test Circuits..................................................................................... 14
Switching Characteristics .............................................................. 15
Circuit Description......................................................................... 16
Signal Isolation ........................................................................... 16
Power Isolation ........................................................................... 16
Truth Tables................................................................................. 16
Thermal Shutdown .................................................................... 16
Open- and Short-Circuit, Fail-Safe Receiver Inputs.............. 16
DC Correctness and Magnetic Field Immunity........................... 16
Applications Information.............................................................. 18
PCB Layout ................................................................................. 18
EMI Considerations................................................................... 18
Insulation Lifetime..................................................................... 19
Isolated Supply Considerations................................................ 19
Typical Applications................................................................... 20
Outline Dimensions....................................................................... 22
Ordering Guide .......................................................................... 22

REVISION HISTORY

7/11—Revision 0: Initial Version
Rev. 0 | Page 2 of 24
ADM2682E/ADM2687E

SPECIFICATIONS

All voltages are relative to their respective ground; 3.0 ≤ VCC ≤ 5.5 V. All minimum/maximum specifications apply over the entire recommended operation range, unless otherwise noted. All typical specifications are at T
Table 1.
Parameter Symbol Min Typ Max Unit Test Conditions/Comments
ADM2687E SUPPLY CURRENT ICC
Data Rate ≤ 500 kbps 90 mA VCC = 3.3 V, 100 Ω load between Y and Z 72 mA VCC = 5 V, 100 Ω load between Y and Z 125 mA VCC = 3.3 V, 54 Ω load between Y and Z 98 mA VCC = 5 V, 54 Ω load between Y and Z
140 mA 120 Ω load between Y and Z
ADM2682E SUPPLY CURRENT ICC
Data Rate = 16 Mbps 175 mA 120 Ω load between Y and Z 260 mA 54 Ω load between Y and Z
Data Rate = 16 Mbps, 4.5 ≤ VCC ≤ 5.5 V 130 mA 120 Ω load between Y and Z 200 mA 54 Ω load between Y and Z ISOLATED SUPPLY VOLTAGE V
3.3 V
ISOOUT
DRIVER
Differential Outputs
Differential Output Voltage, Loaded |V
| 2.0 3.6 V RL = 100 Ω (RS-422), see Figure 29
OD2
1.5 3.6 V RL = 54 Ω (RS-485), see Figure 29 |V
| 1.5 3.6 V −7 V ≤ V
OD3
Δ|VOD| for Complementary Output States Δ|VOD| 0.2 V RL = 54 Ω or 100 Ω, see Figure 29 Common-Mode Output Voltage VOC 3.0 V RL = 54 Ω or 100 Ω, see Figure 29 Δ|VOC| for Complementary Output States Δ|VOC| 0.2 V RL = 54 Ω or 100 Ω, see Figure 29 Short-Circuit Output Current IOS 200 mA
Output Leakage Current (Y, Z) IO 30 μA
−30 μA
Logic Inputs DE, RE, TxD
Input Threshold Low VIL 0.27 VCC V Input Threshold High VIH 0.7 VCC V Input Current II −10 0.01 10 μA
RECEIVER
Differential Inputs
Differential Input Threshold Voltage VTH −200 −125 −30 mV −7 V < VCM < +12 V Input Voltage Hysteresis V
15 mV VOC = 0 V
HYS
Input Current (A, B) II 125 μA DE = 0 V, VCC = 0 V or 3.6 V, VIN = 12 V
−100 μA DE = 0 V, VCC = 0 V or 3.6 V, VIN = −7 V Line Input Resistance RIN 96 −7 V < VCM < +12 V
Logic Outputs
Output Voltage Low VOL 0.2 0.4 V IO = 1.5 mA, VA − VB = −0.2 V Output Voltage High VOH V
− 0.3 VCC − 0.2 V IO = −1.5 mA, VA − VB = 0.2 V
CC
Short-Circuit Current 100 mA
COMMON-MODE TRANSIENT IMMUNITY1 25 kV/μs VCM = 1 kV, transient magnitude = 800 V
1
CM is the maximum common-mode voltage slew rate that can be sustained while maintaining specification-compliant operation. VCM is the common-mode potential
difference between the logic and bus sides. The transient magnitude is the range over which the common-mode is slewed. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges.
= 25°C, VCC = 5 V unless otherwise noted.
A
≤ 12 V, see Figure 30
TEST1
DE = 0 V, RE
= 0 V, VCC = 0 V or 3.6 V,
VIN = 12 V DE = 0 V, RE
= 0 V, VCC = 0 V or 3.6 V,
VIN = −7 V
, TxD
DE, RE
, TxD
DE, RE
, TxD
DE, RE
Rev. 0 | Page 3 of 24
ADM2682E/ADM2687E

ADM2682E TIMING SPECIFICATIONS

TA = −40°C to +85°C.
Table 2.
Parameter Symbol Min Typ Max Unit Test Conditions/Comments
DRIVER
Maximum Data Rate 16 Mbps Propagation Delay, Low to High t Propagation Delay, High to Low t Output Skew t Rise Time/Fall Time tDR, tDF 15 ns RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 31 and Figure 35 Enable Time tZL, tZH 120 ns RL = 110 Ω, CL = 50 pF, see Figure 32 and Figure 37 Disable Time tLZ, tHZ 150 ns RL = 110 Ω, CL = 50 pF, see Figure 32 and Figure 37
RECEIVER
Propagation Delay, Low to High t Propagation Delay, High to Low t Output Skew1 t Enable Time tZL, tZH 15 ns RL = 1 kΩ, CL = 15 pF, see Figure 34 and Figure 38 Disable Time tLZ, tHZ 15 ns RL = 1 kΩ, CL = 15 pF, see Figure 34 and Figure 38
1
Guaranteed by design.

ADM2687E TIMING SPECIFICATIONS

TA = −40°C to +85°C.
Table 3.
Parameter Symbol Min Typ Max Unit Test Conditions/Comments
DRIVER
Maximum Data Rate 500 kbps Propagation Delay, Low to High t Propagation Delay, High to Low t Output Skew t Rise Time/Fall Time tDR, tDF 200 1100 ns RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 31 and Figure 35 Enable Time tZL, tZH 2.5 μs RL = 110 Ω, CL = 50 pF, see Figure 32 and Figure 37 Disable Time tLZ, tHZ 200 ns RL = 110 Ω, CL = 50 pF, see Figure 32 and Figure 37
RECEIVER
Propagation Delay, Low to High t Propagation Delay, High to Low t Output Skew t Enable Time tZL, tZH 15 ns RL = 1 kΩ, CL = 15 pF, see Figure 34 and Figure 38 Disable Time tLZ, tHZ 15 ns RL = 1 kΩ, CL = 15 pF, see Figure 34 and Figure 38
63 100 ns RL = 54 Ω, CL1 = C
DPLH
64 100 ns RL = 54 Ω, CL1 = C
DPHL
1 8 ns RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 31 and Figure 35
SKEW
94 110 ns CL = 15 pF, see Figure 33 and Figure 36
RPLH
95 110 ns CL = 15 pF, see Figure 33 and Figure 36
RPHL
1 12 ns CL = 15 pF, see Figure 33 and Figure 36
SKEW
250 503 700 ns RL = 54 Ω, CL1 = C
DPLH
250 510 700 ns RL = 54 Ω, CL1 = C
DPHL
7 100 ns RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 31 and Figure 35
SKEW
91 200 ns CL = 15 pF, see Figure 33 and Figure 36
RPLH
95 200 ns CL = 15 pF, see Figure 33 and Figure 36
RPHL
4 30 ns CL = 15 pF, see Figure 33 and Figure 36
SKEW
= 100 pF, see Figure 31 and Figure 35
L2
= 100 pF, see Figure 31 and Figure 35
L2
= 100 pF, see Figure 31 and Figure 35
L2
= 100 pF, see Figure 31 and Figure 35
L2

PACKAGE CHARACTERISTICS

Table 4.
Parameter Symbol Min Typ Max Unit Test Conditions/Comments
Resistance (Input-to-Output)1 R Capacitance (Input-to-Output)1 C Input Capacitance2 C
1
Device considered a 2-terminal device: short together Pin 1 to Pin 8 and short together Pin 9 to Pin 16.
2
Input capacitance is from any input data pin to ground.
10
I-O
3 pF f = 1 MHz
I-O
4 pF
I
Rev. 0 | Page 4 of 24
12
Ω
ADM2682E/ADM2687E

REGULATORY INFORMATION

Table 5. ADM2682E/ADM2687E Approvals (Pending)
Organization Approval Type UL (Pending)
CSA (Pending)
VDE (Pending)

INSULATION AND SAFETY-RELATED SPECIFICATIONS

Table 6.
Parameter Symbol Value Unit Test Conditions/Comments
Rated Dielectric Insulation Voltage 5000 V rms 1-minute duration Minimum External Air Gap (Clearance) L(I01) >8.0 mm
Minimum External Tracking (Creepage) L(I02) >8.0 mm
Minimum Internal Gap (Internal Clearance) 0.017 min mm Insulation distance through insulation Tracking Resistance (Comparative Tracking Index) CTI >175 V DIN IEC 112/VDE 0303-1 Isolation Group IIIa Material Group (DIN VDE 0110:1989-01, Table 1)
To be recognized under the UL 1577 Component Recognition Program of Underwriters Laboratories, Inc. Single protection, 5000 V rms isolation voltage. In accordance with UL 1577, each ADM2682E/ADM2687E is proof tested by applying an insulation test voltage
≥ 6000 V rms for 1 second. To be approved under CSA Component Acceptance Notice #5A. Reinforced insulation per IEC 60601-1, 250 V rms (353 V peak) maximum working voltage. Basic insulation per IEC 60601-1, 400 V rms (566 V peak) maximum working voltage. Reinforced insulation per CSA 60950-1-07 and IEC 60950-1, 380 V rms (537 V peak) maximum working voltage. Basic insulation per CSA 60950-1-07 and IEC 60950-1, 600 V rms (848 V peak) maximum working voltage. To be certified according to DIN EN 60747-5-2 (VDE 0884 Part 2):2003-01. In accordance with DIN EN 60747-5-2, each ADM2682E/ADM2687E is proof tested by applying an insulation test voltage
≥1590 V peak for 1 second.
Measured from input terminals to output terminals, shortest distance through air
Measured from input terminals to output terminals, shortest distance along body
Rev. 0 | Page 5 of 24
ADM2682E/ADM2687E

VDE 0884 INSULATION CHARACTERISTICS (PENDING)

This isolator is suitable for basic electrical isolation only within the safety limit data. Maintenance of the safety data must be ensured by means of protective circuits.
Table 7.
Description Test Conditions/Comments Symbol Characteristic Unit
CLASSIFICATIONS
Installation Classification per DIN VDE 0110 for
Rated Mains Voltage ≤300 V rms I to IV ≤450 V rms I to III ≤600 V rms I to II
Climatic Classification 40/85/21 Pollution Degree Table 1 of DIN VDE 0110 2
VOLTAGE
Maximum Working Insulation Voltage V Input-to-Output Test Voltage VPR
Method b1
Method a
After Environmental Tests, Subgroup 1 V
After Input and/or Safety Test,
Subgroup 2/Subgroup 3
Highest Allowable Overvoltage Transient overvoltage, tTR = 10 sec VTR 6000 V peak
SAFETY-LIMITING VALUES Maximum value allowed in the event of a failure
Case Temperature TS 150 °C Input Current I Output Current I Insulation Resistance at TS V
846 V peak
IORM
× 1.875 = VPR, 100% production tested,
V
IORM
= 1 sec, partial discharge < 5 pC
t
m
× 1.6 = VPR, tm = 60 sec, partial discharge < 5 pC 1375 V peak
IORM
× 1.2 = VPR, tm = 60 sec, partial discharge < 5 pC 1018 V peak
V
IORM
= 500 V RS >109 Ω
IO
1590 V peak
265 mA
S, INPUT
335 mA
S, OUTPUT
Rev. 0 | Page 6 of 24
ADM2682E/ADM2687E

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted. All voltages are relative to their respective ground.
Table 8.
Parameter Rating VCC −0.5 V to +7 V Digital Input Voltage (DE, RE, TxD) Digital Output Voltage (RxD) −0.5 V to VDD + 0.5 V Driver Output/Receiver Input Voltage −9 V to +14 V Operating Temperature Range −40°C to +85°C Storage Temperature Range −55°C to +150°C ESD (Human Body Model) on
A, B, Y, and Z pins ESD (Human Body Model) on Other Pins Thermal Resistance θJA Lead Temperature
Soldering (10 sec) 260°C
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
−0.5 V to V
±15 kV
±2 kV 52°C/W
+ 0.5 V
DD
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Table 9. Maximum Continuous Working Voltage
Parameter Max Unit Reference Standard
AC Voltage
Bipolar Waveform 424 V peak
Unipolar Waveform
Basic Insulation 600 V peak Reinforced Insulation 537 V peak
DC Voltage
Basic Insulation 600 V peak Reinforced Insulation 537 V peak
1
Refers to continuous voltage magnitude imposed across the isolation
barrier. See the Insulation Lifetime section for more details.

ESD CAUTION

1
All certifications, 50-year minimum lifetime
Maximum approved working voltage per IEC 60950-1
Maximum approved working voltage per IEC 60950-1
Rev. 0 | Page 7 of 24
ADM2682E/ADM2687E

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

1
GND
1
V
2
CC
3
RxD
TxD
V
GND
NOTES
1. PIN 10 AND PIN 15 M UST BE CONNECTED EXT ERNALLY.
RE
DE
CC
1
ADM2682E/
4
ADM2687E
5
TOP VIEW
(Not to Scale)
6
7
8
16
GND
2
V
15
ISOIN
14
A
B
13
12
Z
Y
11
10
V
ISOOUT
GND
9
2
09927-002
Figure 2. Pin Configuration
Table 10. Pin Function Descriptions
Pin No. Mnemonic Description
1 GND1 Ground, Logic Side. 2 V
CC
Logic Side Power Supply. It is recommended that a 0.1 μF and a 0.01 μF decoupling capacitor be fitted between Pin 2 and Pin 1.
3 RxD
4
Receiver Enable Input. This is an active-low input. Driving this input low enables the receiver, while driving it high
RE
Receiver Output Data. This output is high when (A − B) ≥ −30 mV and low when (A − B) ≤ –200 mV. The output is tristated when the receiver is disabled, that is, when RE
is driven high.
disables the receiver. 5 DE Driver Enable Input. Driving this input high enables the driver, while driving it low disables the driver. 6 TxD Driver Input. Data to be transmitted by the driver is applied to this input. 7 V
CC
Logic Side Power Supply. It is recommended that a 0.1 μF and a 10 μF decoupling capacitor be fitted between
Pin 7 and Pin 8. 8 GND1 Ground, Logic Side. 9 GND2 Ground, Bus Side. 10 V
ISOOUT
Isolated Power Supply Output. This pin must be connected externally to V
. It is recommended that a reservoir
ISOIN
capacitor of 10 μF and a decoupling capacitor of 0.1 μF be fitted between Pin 10 and Pin 9. 11 Y Driver Noninverting Output 12 Z Driver Inverting Output 13 B Receiver Inverting Input. 14 A Receiver Noninverting Input. 15 V
ISOIN
Isolated Power Supply Input. This pin must be connected externally to V
. It is recommended that a 0.1 μF
ISOOUT
and a 0.01 μF decoupling capacitor be fitted between Pin 15 and Pin 16. 16 GND2 Ground, Bus Side.
Rev. 0 | Page 8 of 24
ADM2682E/ADM2687E

TYPICAL PERFORMANCE CHARACTERISTICS

200
180
160
140
(mA)
CC
120
100
80
60
SUPPLY CURRENT, I
40
20
0
–40 –15 10 35 60 85
Figure 3. ADM2682E Supply Current (I
(Data Rate = 16 Mbps, DE = 3.3 V, V
160
R
= 54
L
= 120
R
L
NO LOAD
TEMPERAT URE (°C)
) vs. Temperature
CC
= 3.3 V)
CC
09927-203
140
120
= 54
R
100
(mA)
CC
80
60
40
SUPPLY CURRENT, I
20
0
1 4 7 10 13 16
Figure 6. ADM2682E Supply Current (I
(T
= 25°C, DE = 5 V, VCC = 5 V)
A
120
L
= 120
R
L
NO LOAD
DATA RATE (M bps)
) vs. Data Rate
CC
09927-206
140
R
= 54
120
(mA)
CC
100
80
60
40
SUPPLY CURRENT, I
20
0
–40 –15 10 35 60 85
Figure 4. ADM2682E Supply Current (I
(Data Rate = 16 Mbps, DE = 5 V, V
180
160
140
(mA)
120
CC
100
80
60
SUPPLY CURRENT, I
40
20
0
1 4 7 10 13 16
Figure 5. ADM2682E Supply Current (I
= 25°C, DE = 3.3 V, VCC = 3.3 V)
(T
A
L
R
= 120
L
NO LOAD
TEMPERAT URE (°C)
R
= 54
L
= 120
R
L
NO LOAD
DATA RATE (M bps)
) vs. Temperature
CC
= 5 V)
CC
) vs. Data Rate
CC
100
(mA)
80
CC
60
40
SUPPLY CURRENT, I
20
0 –40 –15 10 35 60 85
09927-204
Figure 7. ADM2687E Supply Current (I
(Data Rate = 500 kbps, DE = 5 V, V
160
140
120
(mA)
CC
100
80
60
40
SUPPLY CURRENT, I
20
0
09927-205
–40 –15 10 35 60 85
Figure 8. ADM2687E Supply Current (I
(Data Rate = 500 kbps, DE = 3.3 V, V
= 54
R
L
R
= 120
L
NO LOAD
TEMPERATURE (°C)
= 54
R
L
= 120
R
L
NO LOAD
TEMPERATURE (°C)
) vs. Temperature
CC
= 5 V)
CC
) vs. Temperature
CC
= 3.3 V)
CC
09927-207
09927-208
Rev. 0 | Page 9 of 24
ADM2682E/ADM2687E
140
R
= 54
120
100
(mA)
CC
80
60
40
SUPPLY CURRENT, I
20
0
50 200125 275 350 425 500
Figure 9. ADM2687E Supply Current (I
(T
= 25°C, DE = 3.3 V, VCC = 3.3 V)
A
120
100
(mA)
80
CC
60
L
R
= 120
L
NO LOAD
DATA RATE (kbps)
= 54
R
L
R
= 120
L
) vs. Data Rate
CC
09927-209
600
580
560
540
520
500
480
460
440
DRIVER PRO PAGATI ON DELAY (ns)
420
400
–40 –15 10 35 60 85
t
DPLH
t
DPHL
TEMPERATURE (°C)
09927-108
Figure 12. ADM2687E Differential Driver Propagation Delay vs. Temperature
TxD
1
40
SUPPLY CURRENT, I
20
0
50 200125 275 350 425 500
Figure 10. ADM2687E Supply Current (I
(T
A
72
70
68
66
64
62
60
58
56
54
DRIVER PROPAGATI ON DELAY (ns)
52
50
–40 –15 10 35 60 85
t
DPHL
NO LOAD
DATA RATE (kbps)
CC
= 25°C, DE = 5 V, VCC = 5 V)
t
DPLH
TEMPERATURE (°C)
) vs. Data Rate
09927-210
09927-107
Figure 11. ADM2682E Differential Driver Propagation Delay vs. Temperature
Z
Y
3
CH1 2.0V
CH3 2.0V
CH2 2.0V
M10.00ns A CH1 1.28V
Figure 13. ADM2682E Driver Propagation Delay
1
3
CH1 2.0V
CH3 2.0V
TxD
Z
Y
CH2 2.0V M200ns A CH1 2.56V
Figure 14. ADM2687E Driver Propagation Delay
09927-109
09927-110
Rev. 0 | Page 10 of 24
ADM2682E/ADM2687E
0
0.32
–10
–20
–30
–40
–50
OUTPUT CURRENT (mA)
–60
–70
012345
OUTPUT HI GH VOLTAGE (V)
Figure 15. Receiver Output Current vs. Receiver Output High Voltage
60
50
40
30
20
OUTPUT CURRE NT (mA)
10
0.30
0.28
0.26
0.24
OUTPUT LOW VOLTAGE (V)
0.22
0.20
–40 –15 10 35 60 85
09927-111
TEMPERATURE (°C)
09927-114
Figure 18. Receiver Output Low Voltage vs. Temperature
B
1
3
A
RxD
0
012345
OUTPUT LOW VOLTAGE (V)
Figure 16. Receiver Output Current vs. Receiver Output Low Voltage
4.75
4.74
4.73
4.72
4.71
4.70
4.69
4.68
OUTPUT HIG H VOLTAG E (V)
4.67
4.66
4.65
–40 –15 10 35 60 85
TEMPERATURE (°C)
Figure 17. Receiver Output High Voltage vs. Temperature
CH1 2.0V
09927-112
CH3 2.0V
CH2 2.0V M10. 00ns A CH1 2. 56V
09927-115
Figure 19. ADM2682E Receiver Propagation Delay
A
1
3
CH1 2.0V
09927-113
CH3 2.0V
CH2 2.0V M10. 00ns A CH1 2. 56V
B
RxD
09927-116
Figure 20. ADM2687E Receiver Propagation Delay
Rev. 0 | Page 11 of 24
ADM2682E/ADM2687E
G A
A
98
97
Y (ns)
96
t
TION DEL
95
94
93
RECEIVER PRO PA
92
–40 –15 10 35 60 85
TEMPERATURE (°C)
RPHL
t
RPLH
Figure 21. ADM2682E Receiver Propagation Delay vs. Temperature
100
99
98
97
96
95
94
93
92
RECEIVER PROPAGATI ON DELAY (ns)
91
90
–40 –15 10 35 60 85
t
RPHL
t
RPLH
TEMPERATURE (°C)
Figure 22. ADM2687E Receiver Propagation Delay vs. Temperature
3.39
3.44
3.43
3.42
3.41
3.40
3.39
3.38
3.37
3.36
ISOLATED SUPPLY VOLTAGE (V)
3.35
3.34
09927-117
–40 10–15 35 60 85
RL = 120
NO LOAD
= 54
R
L
TEMPERATURE (°C)
09927-224
Figure 24. ADM2682E Isolated Supply Voltage vs. Temperature
= 5 V, Data Rate = 16 Mbps)
(V
CC
3.37
3.36
3.35
3.34
3.33
3.32
ISOLATED SUPPLY VOLTAGE (V)
3.31
3.30 –40 10–15 35 60 85
09927-118
RL = 120
NO LOAD
= 54
R
L
TEMPERATURE (°C)
09927-225
Figure 25. ADM2687E Isolated Supply Voltage vs. Temperature
(V
= 3.3 V, Data Rate = 500 kbps)
CC
3.39
3.38
NO LOAD
ISOLATED SUPPLY VOLT AGE (V)
3.37
3.36
3.35
3.34
3.33
RL = 120
= 54
R
L
–40 10–15 35 60 85
TEMPERATURE (°C)
Figure 23. ADM2682E Isolated Supply Voltage vs. Temperature
= 3.3 V, Data Rate = 16 Mbps)
(V
CC
09927-223
3.38
3.37
3.36
3.35
3.34
3.33
ISOLATED SUPPLY VOLTAGE (V)
3.32
3.31 –40 10–15 35 60 85
RL = 120
NO LOAD
R
= 54
L
TEMPERATURE (°C)
Figure 26. ADM2687E Isolated Supply Voltage vs. Temperature
= 5 V, Data Rate = 500 kbps
(V
CC
09927-226
Rev. 0 | Page 12 of 24
ADM2682E/ADM2687E
60
R
= 54
50
40
30
L
R
L
= 120
40
35
30
25
20
R
L
R
= 120
L
= 54
20
10
ISOLATED SUPPLY CURRENT (mA)
0
–40 –15 10 35 60 85
NO LOAD
TEMPERATURE (°C)
Figure 27. ADM2682E Isolated Supply Current vs. Temperature
(V
= 3.3 V, Data Rate = 16 Mbps)
CC
15
10
ISOLATED SUPPLY CURRENT (mA)
5
0 –40 –15 10 35 60 85
09927-227
NO LOAD
TEMPERATURE (°C)
09927-228
Figure 28. ADM2687E Isolated Supply Current vs. Temperature
(VCC = 3.3 V, Data Rate = 500 kbps)
Rev. 0 | Page 13 of 24
ADM2682E/ADM2687E
T
T
T
T
V
V
A
V

TEST CIRCUITS

Y
xD V
Z
OD2
Figure 29. Driver Voltage Measurement
R
L
2
R
L
2
V
OC
09927-003
xD
DE
Y
S1 S2
Z
OUT
C 50pF
L
R
110
CC
L
09927-006
Figure 32. Driver Enable/Disable
Y
xD
V
OD3
Z
375
60
375
Figure 30. Driver Voltage Measurement over Common Mode
Y
xD
Z
C
R
L
C
Figure 31. Driver Propagation Delay
V
TEST
RxD
RE
B
09927-004
V
OUT
C
L
09927-007
Figure 33. Receiver Propagation Delay
L
L
09927-005
+1.5V
1.5V
RE IN
S1
RE
RxD
C
V
L
R
OUT
CC
L
S2
09927-008
Figure 34. Receiver Enable/Disable
Rev. 0 | Page 14 of 24
ADM2682E/ADM2687E
V
A
Y
Y
V
V

SWITCHING CHARACTERISTICS

CC
VCC/2 VCC/2
0V
Z
V
O
Y
1/2V
t
DPLH
O
t
DPHL
DE
0.5V
t
ZL
CC
t
0.5V
LZ
CC
0V
CC
2.3V
+V
V
–V
t
RxD
O
DIFF
O
SKEW
– B
= t
DPHL–tDPLH
90% POINT
10% POINT
V
= V
– V
DIFF
(Y)
(Z)
t
DR
Figure 35. Driver Propagation Delay, Rise/Fall Timing
0V
t
RPHL
t
|
RPHL
t
RPLH
0V
1.5V
t
= |t
SKEW
RPLH
Figure 36. Receiver Propagation Delay
90% POINT
10% POINT
t
DF
1.5V
09927-009
V
OH
V
OL
09927-010
RE
RxD
RxD
0V
, Z
t
2.3V
ZH
, Z
t
HZ
V
+ 0.5V
OL
VOH– 0.5V
V
OL
V
OH
09927-011
Figure 37. Driver Enable/Disable Timing
IH
0.5V
t
ZL
t
ZH
CC
1.5V
OUTPUT LOW
OUTPUT HIGH
1.5V
t
t
0.5V
LZ
HZ
CC
+ 0.5V
V
OL
VOH– 0.5V
V
IL
V
OL
V
OH
09927-012
Figure 38. Receiver Enable/Disable Timing
Rev. 0 | Page 15 of 24
ADM2682E/ADM2687E

CIRCUIT DESCRIPTION

SIGNAL ISOLATION

The ADM2682E/ADM2687E signal isolation of 5 kV rms is implemented on the logic side of the interface. The part achieves signal isolation by having a digital isolation section and a trans­ceiver section (see Figure 1). Data applied to the TxD and DE pins and referenced to logic ground (GND
) are coupled across
1
an isolation barrier to appear at the transceiver section referenced to isolated ground (GND
). Similarly, the single-ended receiver
2
output signal, referenced to isolated ground in the transceiver section, is coupled across the isolation barrier to appear at the RxD pin referenced to logic ground.

POWER ISOLATION

The ADM2682E/ADM2687E power isolation of 5 kV rms is implemented using an isoPower integrated isolated dc-to-dc converter. The dc-to-dc converter section of the ADM2682E/
ADM2687E works on principles that are common to most
modern power supplies. It is a secondary side controller architecture with isolated pulse-width modulation (PWM) feedback. V
power is supplied to an oscillating circuit that
CC
switches current into a chip-scale air core transformer. Power transferred to the secondary side is rectified and regulated to
3.3 V. The secondary (V
) side controller regulates the output
ISO
by creating a PWM control signal that is sent to the primary (V
) side by a dedicated iCoupler (5 kV rms signal isolated)
CC
data channel. The PWM modulates the oscillator circuit to control the power being sent to the secondary side. Feedback allows for significantly higher power and efficiency.

TRUTH TABLES

The truth tables in this section use the abbreviations found in Tabl e 11 .
Table 11. Truth Table Abbreviations
Letter Description
H High level L Low level X Don’t care I Indeterminate Z High impedance (off) NC Disconnected
Table 12. Transmitting (see Table 11 for Abbreviations)
Inputs Outputs
DE TxD Y Z
H H H L H L L H L X Z Z X X Z Z
Table 13. Receiving (see Table 11 for Abbreviations)
Inputs Output
A − B
≥ −0.03 V L or NC H ≤ −0.2 V L or NC L
−0.2 V < A − B < −0.03 V L or NC I Inputs open L or NC H X H Z
RE
RxD

THERMAL SHUTDOWN

The ADM2682E/ADM2687E contain thermal shutdown circuitry that protects the parts from excessive power dissipation during fault conditions. Shorting the driver outputs to a low impedance source can result in high driver currents. The thermal sensing circuitry detects the increase in die temperature under this condition and disables the driver outputs. This circuitry is designed to disable the driver outputs when a die temperature of 150°C is reached. As the device cools, the drivers are reenabled at a temperature of 140°C.

OPEN- AND SHORT-CIRCUIT, FAIL-SAFE RECEIVER INPUTS

The receiver inputs have open- and short-circuit, fail-safe features that ensure that the receiver output is high when the inputs are open or shorted. During line-idle conditions, when no driver on the bus is enabled, the voltage across a terminating resistance at the receiver input decays to 0 V. With traditional transceivers, receiver input thresholds specified between −200 mV and +200 mV mean that external bias resistors are required on the A and B pins to ensure that the receiver outputs are in a known state. The short-circuit, fail-safe receiver input feature eliminates the need for bias resistors by specifying the receiver input threshold between −30 mV and −200 mV. The guaranteed negative threshold means that when the voltage between A and B decays to 0 V, the receiver output is guaranteed to be high.

DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY

The digital signals transmit across the isolation barrier using iCoupler technology. This technique uses chip-scale transformer windings to couple the digital signals magnetically from one side of the barrier to the other. Digital inputs are encoded into waveforms that are capable of exciting the primary transformer winding. At the secondary winding, the induced waveforms are decoded into the binary value that was originally transmitted.
Positive and negative logic transitions at the isolator input cause narrow (~1 ns) pulses to be sent to the decoder via the transformer. The decoder is bistable and is, therefore, either set or reset by the pulses, indicating input logic transitions. In the absence of logic transitions at the input for more than 1 μs, periodic sets of refresh pulses indicative of the correct input state are sent to ensure dc correctness at the output. If the decoder receives no internal pulses of more than approximately 5 μs, the input side
Rev. 0 | Page 16 of 24
ADM2682E/ADM2687E
is assumed to be unpowered or nonfunctional, in which case, the isolator output is forced to a default state by the watchdog timer circuit.
This situation should occur in the ADM2682E/ADM2687E devices only during power-up and power-down operations. The limitation on the ADM2682E/ADM2687E magnetic field immunity is set by the condition in which induced voltage in the transformer receiving coil is sufficiently large to either falsely set or reset the decoder. The following analysis defines the conditions under which this can occur.
The 3.3 V operating condition of the ADM2682E/ADM2687E is examined because it represents the most susceptible mode of operation. The pulses at the transformer output have an amplitude of >1.0 V. The decoder has a sensing threshold of about 0.5 V, thus establishing a 0.5 V margin in which induced voltages can be tolerated. The voltage induced across the receiving coil is given by
V = (−dβ/dt)Σπr
2
; n = 1, 2, … , N
n
where: β is magnetic flux density (gauss).
N is the number of turns in the receiving coil. r
is the radius of the nth turn in the receiving coil (cm).
n
Given the geometry of the receiving coil in the ADM2682E/
ADM2687E and an imposed requirement that the induced
voltage be, at most, 50% of the 0.5 V margin at the decoder, a maximum allowable magnetic field is calculated as shown in Figure 39.
100
For example, at a magnetic field frequency of 1 MHz, the maximum allowable magnetic field of 0.2 kgauss induces a voltage of 0.25 V at the receiving coil. This is about 50% of the sensing threshold and does not cause a faulty output transition. Similarly, if such an event occurs during a transmitted pulse (and is of the worst-case polarity), it reduces the received pulse from >1.0 V to 0.75 V, which is still well above the 0.5 V sensing threshold of the decoder.
The preceding magnetic flux density values correspond to specific current magnitudes at given distances from the
ADM2682E/ADM2687E transformers. Figure 40 expresses
these allowable current magnitudes as a function of frequency for selected distances. As shown in Figure 40, the ADM2682E/
ADM2687E are extremely immune and can be affected only by
extremely large currents operated at high frequency very close to the component. For the 1 MHz example, a 0.5 kA current must be placed 5 mm away from the ADM2682E/ADM2687E to affect component operation.
1k
DISTANCE = 1m
100
10
DISTANCE = 100mm
1
DISTANCE = 5mm
0.1
MAXIMUM ALL OWABLE CURRENT (kA)
10
1
0.1
DENSITY (kgauss)
0.01
MAXIMUM ALLOWABLE MAGNETIC FLUX
0.001 1k 10k 10M
Figure 39. Maximum Allowable External Magnetic Flux Density
MAGNETIC FIELD FREQUENCY (Hz)
1M
0.01 1k 10k 100M100k 1M 10M
Figure 40. Maximum Allowable Current for Various Current-to-
MAGNETIC F IELD FREQUENCY (Hz)
ADM2682E/ADM2687E Spacings
09927-020
Note that in combinations of strong magnetic field and high frequency, any loops formed by PCB traces can induce error voltages sufficiently large to trigger the thresholds of succeeding circuitry. Take care in the layout of such traces to avoid this possibility.
100M100k
09927-019
Rev. 0 | Page 17 of 24
ADM2682E/ADM2687E
F
F

APPLICATIONS INFORMATION

PCB LAYOUT

The ADM2682E/ADM2687E isolated RS-422/RS-485 transceiver contains an isoPower integrated dc-to-dc converter, requiring no external interface circuitry for the logic interfaces. Power supply bypassing is required at the input and output supply pins (see Figure 41). The power supply section of the ADM2682E/
ADM2687E uses an 180 MHz oscillator frequency to pass power
efficiently through its chip-scale transformers. In addition, the normal operation of the data section of the iCoupler introduces switching transients on the power supply pins.
Bypass capacitors are required for several operating frequencies. Noise suppression requires a low inductance, high frequency capacitor, whereas ripple suppression and proper regulation require a large value capacitor. These capacitors are connected between Pin 1 (GND Pin 8 (GND
) for VCC. The V
1
connected between Pin 9 (GND Pin 15 (V
) and Pin 16 (GND2). To suppress noise and reduce
ISOIN
ripple, a parallel combination of at least two capacitors is required with the smaller of the two capacitors located closest to the device. The recommended capacitor values are 0.1 μF and 10 μF for V
at Pin 9 and Pin 10 and VCC at Pin 7 and Pin 8. Capacitor
ISOOUT
values of 0.01 μF and 0.1 μF are recommended for V and Pin 16 and V practice is to use a very low inductance ceramic capacitor, or its equivalent, for the smaller value capacitors. The total lead length between both ends of the capacitor and the input power supply pin should not exceed 10 mm.
10n
GND
GND
100nF 100nF
1
V
CC
RxD
RE
DE
TxD
V
CC
1
10µF 10µF
100nF 100nF
) and Pin 2 (VCC) and Pin 7 (VCC) and
1
and V
ISOIN
) and Pin 10 (V
2
at Pin 1 and Pin 2. The recommended best
CC
1
2
3
ADM2682E/
ADM2687E
4 13
5 12
6 11
7 10
8 9
16
15
14
capacitors are
ISOOUT
10n
ISOOUT
ISOIN
GND
A
B
Z
Y
GND
) and
at Pin 15
2
2
Figure 41. Recommended PCB Layout
V
ISOIN
V
ISOOUT
09927-125
In applications involving high common-mode transients, ensure that board coupling across the isolation barrier is minimized. Furthermore, design the board layout such that any coupling that does occur equally affects all pins on a given component side. Failure to ensure this can cause voltage differentials between pins exceeding the absolute maximum ratings for the device, thereby leading to latch-up and/or permanent damage.
The ADM2682E/ADM2687E dissipate approximately 675 mW of power when fully loaded. Because it is not possible to apply a heat sink to an isolation device, the devices primarily depend on heat dissipation into the PCB through the GND pins. If the devices are used at high ambient temperatures, provide a thermal path from the GND pins to the PCB ground plane. The board layout in Figure 41 shows enlarged pads for Pin 1, Pin 8, Pin 9, and Pin 16. Implement multiple vias from the pad to the ground plane to reduce the temperature inside the chip significantly. The dimensions of the expanded pads are at the discretion of the designer and dependent on the available board space.

EMI CONSIDERATIONS

The dc-to-dc converter section of the ADM2682E/ADM2687E components must, of necessity, operate at very high frequency to allow efficient power transfer through the small transformers. This creates high frequency currents that can propagate in circuit board ground and power planes, causing edge and dipole radiation. Grounded enclosures are recommended for applications that use these devices. If grounded enclosures are not possible, good RF design practices should be followed in the layout of the PCB. See the AN-0971 Application Note, Recommendations for Control of Radiated Emissions with isoPower Devices, for more information.
Rev. 0 | Page 18 of 24
ADM2682E/ADM2687E
E
E

INSULATION LIFETIME

All insulation structures eventually break down when subjected to voltage stress over a sufficiently long period. The rate of insulation degradation is dependent on the characteristics of the voltage waveform applied across the insulation. Analog Devices conducts an extensive set of evaluations to determine the lifetime of the insulation structure within the ADM2682E/ADM2687E.
Accelerated life testing is performed using voltage levels higher than the rated continuous working voltage. Acceleration factors for several operating conditions are determined, allowing calculation of the time to failure at the working voltage of interest. The values shown in Tab l e 9 summarize the peak voltages for 50 years of service life in several operating conditions. In many cases, the working voltage approved by agency testing is higher than the 50-year service life voltage. Operation at working voltages higher than the service life voltage listed leads to premature insulation failure.
The insulation lifetime of the ADM2682E/ADM2687E depends on the voltage waveform type imposed across the isolation barrier. The iCoupler insulation structure degrades at different rates, depending on whether the waveform is bipolar ac, unipolar ac, or dc. Figure 42, Figure 43, and Figure 44 illustrate these different isolation voltage waveforms.
Bipolar ac voltage is the most stringent environment. A 50-year operating lifetime under the bipolar ac condition determines the Analog Devices recommended maximum working voltage.
In the case of unipolar ac or dc voltage, the stress on the insulation is significantly lower. This allows operation at higher working voltages while still achieving a 50-year service life. The working voltages listed in Tabl e 9 can be applied while maintaining the 50-year minimum lifetime, provided the voltage conforms to either
e unipolar ac or dc voltage cases. Any cross-insulation voltage
waveform that does not conform to thFigure 43 or Figure 44 should be treated as a bipolar ac waveform, and its peak voltage should be limited to the 50-year lifetime voltage value listed in Tabl e 9.
RATED PEAK VOLTAGE
0V
Figure 42. Bipolar AC Waveform
RATED PEAK VOLTAGE
0V
Figure 43. DC Waveform
RATED PEAK VOLTAGE
NOTES
1. THE VOL TAGE I S SHOWN AS S INUSODIAL FOR ILLUSTRAT ION PURPOSES ONLY. IT IS M EANT TO REPRESENT ANY VOLTAG WAVEFO RM VARYING BETWEEN 0 AND SOME L IMIT ING VAL UE. THE LIMITING VALUE CAN BE POSIT IVE OR NEGATIVE, BUT T H VOLTAGE CANNOT CROSS 0V.
ISOLATED SU
0V
Figure 44. Unipolar AC Waveform
PPLY CONSIDERATIONS
The typical output voltage of the integrated isoPo
09927-021
09927-023
wer dc-to-dc
09927-022
isolated supply is 3.3 V. The isolated supply in the ADM2682E/
ADM2687E is typically capable of supplying a current of 55 mA
when the junction temperature of the device is kept below 130°C. This includes the current required by the internal RS-485 circuitry, and typically, no additional current is available on V
ISOOUT
for
external applications.
Rev. 0 | Page 19 of 24
ADM2682E/ADM2687E

TYPICAL APPLICATIONS

An example application of the ADM2682E/ADM2687E for a full- duplex RS-485 node is shown in the circuit diagram of Figure 45. Refer to the PCB Layout section for the recommended placement of the capacitors shown in this circuit diagram. Placement of the R
termination resistors depends on the location of the node
T
and the network configuration. Refer to AN-960 Application Note, RS-485/RS-422 Circuit Implementation Guide, for guidance on termination.
3.3V/5V POWER SUPPLY
100nF 10µ F 100nF 10nF
Figure 46 and Figure 47 show typical applications of the
ADM2682E/ADM2687E in half duplex and full duplex RS-485
network configurations. Up to 256 transceivers can be connected to the RS-485 bus. To minimize reflections, terminate the line at the receiving end in its characteristic impedance and keep stub lengths off the main line as short as possible. For half-duplex operation, this means that both ends of the line must be terminated because either end can be the receiving end.
100nF 10 µF
V
ISOIN
100nF 10nF
Y
Z
A
R
B
T
09927-124
V
CC
MICROCONTROLL ER
AND UART
GND
1
V
CC
OSCILLATOR
DIGITAL ISOLATIONiCoupler
TxD
DE
RxD
RE
GND
iso
Power DC-TO -DC CONVERT ER
ENCODE
ENCODE
DECODE
1
ISOLATION
BARRIER
V
ISOOUT
RECTIFIER
REGULATOR
TRANSCEIVER
DECODE
DECODE
ENCODE
D
R
ADM2682E/ADM2687E
GND
2
Figure 45. Example Circuit Diagram Using the ADM2682E/ADM2687E
Rev. 0 | Page 20 of 24
ADM2682E/ADM2687E
2
RxD
RE
DE
TxD
NOTES
IS EQUAL T O THE CHARACTERIST IC IMPEDANCE OF THE CABLE.
1. R
T
. ISOLATION NOT SHOWN.
RxD
RE
DE
TxD
ADM2582E/ ADM2587E
R
D
MASTER
R
D
A
B
Z
Y
A
B
Z
Y
MAXIMUM NUMBER OF TRANSCEIVERS ON BUS = 256
R
T
ABZYABZY
ADM2682E/
ADM2687E
R
D
ADM2682E/
ADM2687E
R
RxD RE DE TxDRxD RE DE TxD
Figure 46. ADM2682E/ADM2687E Typical Half Duplex RS-485 Network
MAXIMUM NUMBER OF NODES = 256
R
T
ADM2682E/
ADM2687E
A
B
R
T
Z
Y
D
Y
Z
B
R
T
A
R
SLAVE
R
RxD
RE
DE
TxD
D
09927-027
D
TxD
DE
RE
RxD
NOTES
1. R
IS EQUAL TO THE CHARACTERISTIC IMPEDANCE OF THE CABLE.
T
2. ISOLATION NOT SHOWN.
ADM2682E/
ADM2687E
ADM2682E/
ADM2687E
A B Z Y
R
RxD RE DE TxD
D
A B Z Y
R
RxD RE DE TxD
D
SLAVESLAVE
ADM2682E/ ADM2687E
Figure 47. ADM2682E/ADM2687E Typical Full Duplex RS-485 Network
ADM2682E/
ADM2687E
09927-028
Rev. 0 | Page 21 of 24
ADM2682E/ADM2687E

OUTLINE DIMENSIONS

13.00 (0.5118)
12.60 (0.4961)
9
8
7.60 (0.2992)
7.40 (0.2913)
10.65 (0.4193)
10.00 (0.3937)
2.65 (0.1043)
2.35 (0.0925)
SEATING PLANE
8° 0°
0.33 (0.0130)
0.20 (0.0079)
0
.
0
.
7
5
2
5
(
0
.
0
2
9
0
.
0
0
9
(
1.27 (0.0500)
0.40 (0.0157)
5
)
45°
8
)
10-12-2010-A
0.30 (0.0118)
0.10 (0.0039)
COPLANARITY
0.10
16
1
1.27
(0.0500)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
0.51 (0.0201)
0.31 (0.0122)
BSC
COMPLIANT TO JEDEC STANDARDS MS-013-AC
Figure 48. 16-Lead Standard Small Outline Package with Increased Creepage [SOIC_IC]
Wide Body,
(RI-16-1)
Dimensions shown in millimeters and (inches)

ORDERING GUIDE

Model1 Data Rate (Mbps) Temperature Range Package Description Package Option
ADM2682EBRIZ 16 −40°C to +85°C 16-Lead SOIC_IC RI-16-1 ADM2682EBRIZ-RL7 16 −40°C to +85°C 16-Lead SOIC_IC RI-16-1 ADM2687EBRIZ 0.5 −40°C to +85°C 16-Lead SOIC_IC RI-16-1 ADM2687EBRIZ-RL7 0.5 −40°C to +85°C 16-Lead SOIC_IC RI-16-1 EVAL-ADM2682EEBZ ADM2682E Evaluation Board EVAL-ADM2687EEBZ ADM2687E Evaluation Board
1
Z = RoHS Compliant Part.
Rev. 0 | Page 22 of 24
ADM2682E/ADM2687E
NOTES
Rev. 0 | Page 23 of 24
ADM2682E/ADM2687E
NOTES
©2011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D09927-0-7/11(0)
Rev. 0 | Page 24 of 24
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