Datasheet ADM2582E, ADM2587E Datasheet (ANALOG DEVICES)

Signal and Power Isolated RS-485

V

V

Transceiver with ±15 kV ESD Protection

FEATURES

Isolated RS-485/RS-422 transceiver, configurable as half or

full duplex

isoPower® integrated isolated dc-to-dc converter
±15 kV ESD protection on RS-485 input/output pins
Complies with ANSI/TIA/EIA-485-A-98 and ISO 8482:1987(E)
ADM2582E data rate: 16 Mbps
ADM2587E data rate: 500 kbps
5 V or 3.3 V operation
Connect up to 256 nodes on one bus
Open- and short-circuit, fail-safe receiver inputs
High common-mode transient immunity: >25 kV/μs
Thermal shutdown protection
Safety and regulatory approvals (pending)

UL recognition: 2500 V rms for 1 minute per UL 1577
VDE Certificates of Conformity

DIN V VDE V 0884-10 (VDE V 0884-10):2006-12
V

= 560 V peak

IORM

Operating temperature range: −40°C to +85°C
Highly integrated, 20-lead, wide-body SOIC package

APPLICATIONS

Isolated RS-485/RS-422 interfaces
Industrial field networks
Multipoint data transmission systems

DIGITAL ISOLATION iCoupler

TxD

DE

RxD

RE

ADM2582E/ADM2587E

FUNCTIONAL BLOCK DIAGRAM

CC

isoPower DC-TO-DC CONVER TER

OSCILLATOR

ENCODE

ENCODE

DECODE

GND

1

ISOLATION

BARRIER

RECTIF IER

REGULATOR

TRANSCEIVER

DECODE D

DECODE

ENCODE

ADM2582E/ADM2587E

GND

Figure 1.

ISOOUT

2

V

ISOIN

Y

Z

R

A

B

08111-001

GENERAL DESCRIPTION

The ADM2582E/ADM2587E are fully integrated signal and
power isolated data transceivers with ±15 kV ESD protection
and are suitable for high speed communication on multipoint
transmission lines. The ADM2582E/ADM2587E include an
integrated isolated dc-to-dc power supply, which eliminates the
need for an external dc-to-dc isolation block.

They are designed for balanced transmission lines and comply
with ANSI/TIA/EIA-485-A-98 and ISO 8482:1987(E).

The devices integrate Analog Devices, Inc., iCoupler® technology to
combine a 3-channel isolator, a three-state differential line driver, a
differential input receiver, and Analog Devices isoPower dc-to­dc converter into a single package. The devices are powered by a
single 5 V or 3.3 V supply, realizing a fully integrated signal and
power isolated RS-485 solution.

Rev. 0

Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.

The ADM2582E/ADM2587E driver has an active high enable.
An active low receiver enable is also provided that causes the
receiver output to enter a high impedance state when disabled.

The devices have current limiting and thermal shutdown
features to protect against output short circuits and situations
where bus contention may cause excessive power dissipation.
The parts are fully specified over the industrial temperature
range and are available in a highly integrated, 20-lead, wide­body SOIC package.

The ADM2582E/ADM2587E contain isoPower technology that
uses high frequency switching elements to transfer power through
the transformer. Special care must be taken during printed circuit
board (PCB) layout to meet emissions standards. Refer to
Application Note AN-0971, Control of Radiated Emissions with
isoPower Devices, for details on board layout considerations.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: [phone] www.analog.com
Fax: [phone] ©2009 Analog Devices, Inc. All rights reserved.

ADM2582E/ADM2587E

TABLE OF CONTENTS

Features .............................................................................................. 1

Applications ....................................................................................... 1 

Functional Block Diagram .............................................................. 1

General Description ......................................................................... 1

Revision History ............................................................................... 2

Specifications ..................................................................................... 3

ADM2582E Timing Specifications ............................................ 4

ADM2587E Timing Specifications ............................................ 4

ADM2582E/ADM2587E Package Characteristics ................... 4

ADM2582E/ADM2587E Regulatory Information .................. 5

ADM2582E/ADM2587E Insulation and Safety-Related

Specifications ................................................................................ 5

ADM2582E/ADM2587E VDE 0884 Insulation

Characteristics (Pending) ............................................................ 5

Absolute Maximum Ratings ............................................................ 6

ESD Caution .................................................................................. 6

Pin Configuration and Function Descriptions ............................. 7

Typical Performance Characteristics ............................................. 8





Test Circuits ..................................................................................... 12

Switching Characteristics .............................................................. 13

Circuit Description......................................................................... 14

Signal Isolation ........................................................................... 14

Power Isolation ........................................................................... 14

Truth Tables................................................................................. 14

Thermal Shutdown .................................................................... 14

Open- and Short-Circuit, Fail-Safe Receiver Inputs.............. 14

DC Correctness and Magnetic Field Immunity ........................... 15

Applications Information .............................................................. 16

PCB Layout ................................................................................. 16

EMI Considerations ................................................................... 16

Insulation Lifetime ..................................................................... 16

Isolated Power Supply Considerations .................................... 17

Typical Applications ................................................................... 19

Outline Dimensions ....................................................................... 20

Ordering Guide .......................................................................... 20

REVISION HISTORY

9/09—Revision 0: Initial Version

Rev. 0 | Page 2 of 20

ADM2582E/ADM2587E

SPECIFICATIONS

All voltages are relative to their respective ground; 3.0 ≤ VCC ≤ 5.5 V. All minimum/maximum specifications apply over the entire
recommended operation range, unless otherwise noted. All typical specifications are at T

Table 1.

Parameter Symbol Min Typ Max Unit Test Conditions

ADM2587E SUPPLY CURRENT ICC

Data Rate ≤ 500 kbps 90 mA VCC = 3.3 V, 100 Ω load between Y and Z
72 mA VCC = 5 V, 100 Ω load between Y and Z
125 mA VCC = 3.3 V, 54 Ω load between Y and Z
98 mA VCC = 5 V, 54 Ω load between Y and Z

120 mA 120 Ω load between Y and Z

ADM2582E SUPPLY CURRENT ICC

Data Rate = 16 Mbps 150 mA 120 Ω load between Y and Z
230 mA 54 Ω load between Y and Z
ISOLATED SUPPLY VOLTAGE V

3.3

ISOUT

DRIVER

Differential Outputs

Differential Output Voltage, Loaded |V

| 2.0 5.0 V RL = 100 Ω (RS-422), see Figure 23

OD2

1.5 5.0 V RL = 54 Ω (RS-485), see Figure 23
|V

| 1.5 5.0 V −7 V ≤ V

OD3

Δ|VOD| for Complementary Output States Δ|VOD| 0.2 V RL = 54 Ω or 100 Ω, see Figure 23
Common-Mode Output Voltage VOC 3.0 V RL = 54 Ω or 100 Ω, see Figure 23
Δ|VOC| for Complementary Output States Δ|VOC| 0.2 V RL = 54 Ω or 100 Ω, see Figure 23
Short-Circuit Output Current IOS 200 mA

Output Leakage Current (Y, Z) IO 30 μA

−30 μA

Logic Inputs DE, RE, TxD

Input Threshold Low VIL 0.3 × VCC V
Input Threshold High VIH 0.7 × VCC V
Input Current II −10 0.01 10 μA

RECEIVER

Differential Inputs

Differential Input Threshold Voltage VTH −200 −125 −30 mV −7 V < VCM < +12 V
Input Voltage Hysteresis V

15 mV VOC = 0 V

HYS

Input Current (A, B) II 125 μA DE = 0 V, VCC = 0 V or 3.6 V, VIN = 12 V

−100 μA DE = 0 V, VCC = 0 V or 3.6 V, VIN = -7 V
Line Input Resistance RIN 96 kΩ −7 V < VCM < +12 V

Logic Outputs

Output Voltage Low VOL 0.2 0.4 V IO = 1.5 mA, VA − VB = −0.2 V
Output Voltage High VOH V

− 0.3 VCC − 0.2 V IO = −1.5 mA, VA − VB = 0.2 V

CC

Short-Circuit Current 100 mA

COMMON-MODE TRANSIENT IMMUNITY1 25 kV/μs VCM = 1 kV, transient magnitude = 800 V

1

CM is the maximum common-mode voltage slew rate that can be sustained while maintaining specification-compliant operation. VCM is the common-mode potential

difference between the logic and bus sides. The transient magnitude is the range over which the common-mode is slewed. The common-mode voltage slew rates
apply to both rising and falling common-mode voltage edges.

= 25°C, VCC = 5 V unless otherwise noted.

A

≤ 12 V, see Figure 24

TEST1

DE = 0 V, RE

= 0 V, VCC = 0 V or 3.6 V,

VIN = 12 V
DE = 0 V, RE

= 0 V, VCC = 0 V or 3.6 V,

VIN = −7 V

, TxD

DE, RE

, TxD

DE, RE

, TxD

DE, RE

Rev. 0 | Page 3 of 20

ADM2582E/ADM2587E

ADM2582E TIMING SPECIFICATIONS

TA = −40°C to +85°C.

Table 2.

Parameter Symbol Min Typ Max Unit Test Conditions

DRIVER

Maximum Data Rate 16 Mbps
Propagation Delay, Low to High t
Propagation Delay, High to Low t
Output Skew t
Rise Time/Fall Time tDR, tDF 15 ns RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 25 and Figure 29
Enable Time tZL, tZH 120 ns RL = 110 Ω, CL = 50 pF, see Figure 26 and Figure 31
Disable Time tLZ, tHZ 150 ns RL = 110 Ω, CL = 50 pF, see Figure 26 and Figure 31

RECEIVER

Propagation Delay, Low to High t
Propagation Delay, High to Low t
Output Skew1 t
Enable Time tZL, tZH 15 ns RL = 1 kΩ, CL = 15 pF, see Figure 28 and Figure 32
Disable Time tLZ, tHZ 15 ns RL = 1 kΩ, CL = 15 pF, see Figure 28 and Figure 32

1

Guaranteed by design.

ADM2587E TIMING SPECIFICATIONS

TA = −40°C to +85°C.

63 100 ns RL = 54 Ω, CL1 = C

DPLH

64 100 ns RL = 54 Ω, CL1 = C

DPHL

1 8 ns RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 25 and Figure 29

SKEW

94 110 ns CL = 15 pF, see Figure 27 and Figure 30

RPLH

95 110 ns CL = 15 pF, see Figure 27 and Figure 30

RPHL

1 12 ns CL = 15 pF, see Figure 27 and Figure 30

SKEW

= 100 pF, see Figure 25 and Figure 29

L2

= 100 pF, see Figure 25 and Figure 29

L2

Table 3.

Parameter Symbol Min Typ Max Unit Test Conditions

DRIVER

Maximum Data Rate 500 kbps
Propagation Delay, Low to High t
Propagation Delay, High to Low t
Output Skew t

250 503 700 ns RL = 54 Ω, CL1 = C

DPLH

250 510 700 ns RL = 54 Ω, CL1 = C

DPHL

7 100 ns RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 25 and Figure 29

SKEW

= 100 pF, see Figure 25 and Figure 29

L2

= 100 pF, see Figure 25 and Figure 29

L2

Rise Time/Fall Time tDR, tDF 200 1100 ns RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 25 and Figure 29
Enable Time tZL, tZH 2.5 μs RL = 110 Ω, CL = 50 pF, see Figure 26 and Figure 31
Disable Time tLZ, tHZ 200 ns RL = 110 Ω, CL = 50 pF, see Figure 26 and Figure 31

RECEIVER

Propagation Delay, Low to High t
Propagation Delay, High to Low t
Output Skew t

91 200 ns CL = 15 pF, see Figure 27 and Figure 30

RPLH

95 200 ns CL = 15 pF, see Figure 27 and Figure 30

RPHL

4 30 ns CL = 15 pF, see Figure 27 and Figure 30

SKEW

Enable Time tZL, tZH 15 ns RL = 1 kΩ, CL = 15 pF, see Figure 28 and Figure 32
Disable Time tLZ, tHZ 15 ns RL = 1 kΩ, CL = 15 pF, see Figure 28 and Figure 32

ADM2582E/ADM2587E PACKAGE CHARACTERISTICS

Table 4.

Parameter Symbol Min Typ Max Unit Test Conditions

Resistance (Input-to-Output)1 R
Capacitance (Input-to-Output)1 C
Input Capacitance2 C
Input IC Junction-to-Case Thermal Resistance θ

Output IC Junction-to-Case Thermal Resistance θ

1

Device considered a 2-terminal device: short together Pin 1 to Pin 10 and short together Pin 11 to Pin 20.

2

Input capacitance is from any input data pin to ground.

10

I-O

3 pF f = 1 MHz

I-O

4 pF

I

33 °C/W

JCI

28 °C/W

JCO

Rev. 0 | Page 4 of 20

12

Ω

Thermocouple located at center of
package underside

Thermocouple located at center of
package underside

ADM2582E/ADM2587E

ADM2582E/ADM2587E REGULATORY INFORMATION

Table 5. Pending ADM2582E/ADM2587E Approvals

Organization Approval Type Notes

UL

VDE

ADM2582E/ADM2587E INSULATION AND SAFETY-RELATED SPECIFICATIONS

Table 6.

Parameter Symbol Value Unit Conditions

Rated Dielectric Insulation Voltage 2500 V rms 1-minute duration
Minimum External Air Gap (Clearance) L(I01) >8.0 mm

Minimum External Tracking (Creepage) L(I02) >8.0 mm

Minimum Internal Gap (Internal Clearance) 0.017 min mm Insulation distance through insulation
Tracking Resistance (Comparative Tracking Index) CTI >175 V DIN IEC 112/VDE 0303-1
Isolation Group IIIa Material Group (DIN VDE 0110: 1989-01, Table 1)

To be recognized under the Component
Recognition Program of Underwriters
Laboratories, Inc.

To be certified according to
DIN V VDE V 0884-10 (VDE V 0884-10):2006-12

In accordance with UL 1577, each ADM2582E/ADM2587E is proof tested
by applying an insulation test voltage ≥ 3000 V rms for 1 second.

In accordance with VDE 0884-10, each ADM2582E/ADM2587E is proof
tested by applying an insulation test voltage ≥ 1050 V

for 1 second.

PEAK

Measured from input terminals to output terminals,
shortest distance through air

Measured from input terminals to output terminals,
shortest distance along body

ADM2582E/ADM2587E VDE 0884 INSULATION CHARACTERISTICS (PENDING)

This isolator is suitable for basic electrical isolation only within the safety limit data. Maintenance of the safety data must be ensured by
means of protective circuits.

Table 7.

Description Conditions Symbol Characteristic Unit

CLASSIFICATIONS

Installation Classification per DIN VDE 0110 for

Rated Mains Voltage
≤150 V rms I to IV
≤300 V rms I to III

≤400 V rms I to II
Climatic Classification 40/85/21
Pollution Degree DIN VDE 0110, see Table 1 2

VOLTAGE

Maximum Working Insulation Voltage V
Input-to-Output Test Voltage VPR

Method b1

Method a

After Environmental Tests, Subgroup 1 V
After Input and/or Safety Test,

Subgroup 2/Subgroup 3

Highest Allowable Overvoltage Transient overvoltage, tTR = 10 sec VTR 4000 V peak

SAFETY-LIMITING VALUES Maximum value allowed in the event of a failure

Case Temperature TS 150 °C
Input Current IS,
Output Current IS,
Insulation Resistance at TS V

560 V peak

IORM

× 1.875 = VPR, 100% production tested,

V

IORM

= 1 sec, partial discharge < 5 pC

t

m

× 1.6 = VPR, tm = 60 sec, partial discharge < 5 pC 896 V peak

IORM

× 1.2 = VPR, tm = 60 sec, partial discharge < 5 pC 672 V peak

V

IORM

= 500 V RS >109 Ω

IO

1050 V peak

265 mA

INPUT

335 mA

OUTPUT

Rev. 0 | Page 5 of 20

ADM2582E/ADM2587E

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted. All voltages are relative to
their respective ground.

Table 8.

Parameter Rating
VCC −0.5 V to +7 V
Digital Input Voltage (DE, RE, TxD)
Digital Output Voltage (RxD) −0.5 V to VDD + 0.5 V
Driver Output/Receiver Input Voltage −9 V to +14 V
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −55°C to +150°C
ESD (Human Body Model) on

A, B, Y, and Z pins
ESD (Human Body Model) on Other Pins
Lead Temperature

Soldering (10 sec) 260°C

Vapor Phase (60 sec) 215°C

Infrared (15 sec) 220°C

−0.5 V to VDD + 0.5 V

±15 kV

±2 kV

Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.

Table 9. Maximum Continuous Working Voltage

Parameter Max Unit Reference Standard

AC Voltage

Bipolar Waveform 424 V peak

Unipolar Waveform

Basic Insulation 600 V peak

Reinforced Insulation 560 V peak

DC Voltage

Basic Insulation 600 V peak

Reinforced Insulation 560 V peak

1

Refers to continuous voltage magnitude imposed across the isolation

barrier. See the Insulation Lifetime section for more details.

50-year minimum
lifetime

Maximum approved
working voltage per
IEC 60950-1 (pending)

Maximum approved
working voltage per
IEC 60950-1 and
VDE V 0884-10
(pending)

Maximum approved
working voltage per
IEC 60950-1(pending)

Maximum approved
working voltage per
IEC 60950-1 and
VDE V 0884-10
(pending)

ESD CAUTION

1

Rev. 0 | Page 6 of 20

ADM2582E/ADM2587E

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

GND

1

1

V

2

CC

GND

3

1

ADM2582E

4

RxD

ADM2587E

RE

5

TOP VIEW

6

DE

(Not to Scale)

TxD

7

V

8

CC

9

GND

1

GND

10

1

NOTES

1. PIN 12 AND PIN 19 MUST BE
CONNECT ED EXT ERNALL Y.

GND

20

2

V

19

ISOIN

A

18

17

B

GND

16

2

15

Z

GND

14

2

Y

13

12

V

ISOOUT

GND

11

2

08111-002

Figure 2. Pin Configuration

Table 10. Pin Function Description

Pin No. Mnemonic Description

1 GND1 Ground, Logic Side.
2 V

CC

Logic Side Power Supply. It is recommended that a 0.1 μF and a 10 μF decoupling capacitor be fitted between

Pin 2 and Pin 1.
3 GND1 Ground, Logic Side.
4 RxD

5

RE

Receiver Output Data. This output is high when (A − B) > 200 mV and low when (A − B) < –200 mV.

The output is tristated when the receiver is disabled, that is, when RE

is driven high.

Receiver Enable Input. This is an active-low input. Driving this input low enables the receiver; driving it

high disables the receiver.
6 DE Driver Enable Input. Driving this input high enables the driver; driving it low disables the driver.
7 TxD Driver Input. Data to be transmitted by the driver is applied to this input.
8 V

CC

Logic Side Power Supply. It is recommended that a 0.1 μF and a 0.01 μF decoupling capacitor be fitted between

Pin 8 and Pin 7.
9 GND1 Ground, Logic Side.
10 GND1 Ground, Logic Side.
11 GND2 Ground, Bus Side.
12 V

ISOOUT

Isolated Power Supply Output. This pin must be connected externally to V

. It is recommended that a reservoir

ISOIN

capacitor of 10 μF and a decoupling capacitor of 0.1 μF be fitted between Pin 12 and Pin 11.
13 Y Driver Noninverting Output
14 GND2 Ground, Bus Side.
15 Z Driver Inverting Output
16 GND2 Ground, Bus Side.
17 B Receiver Inverting Input.
18 A Receiver Noninverting Input.
19 V

ISOIN

Isolated Power Supply Input. This pin must be connected externally to V

. It is recommended that a

ISOOUT

0.1 μF and a 0.01 μF decoupling capacitor be fitted between Pin 19 and Pin 20.

20 GND2 Ground, Bus Side.

Rev. 0 | Page 7 of 20

ADM2582E/ADM2587E

TYPICAL PERFORMANCE CHARACTERISTICS

180

160

140

(mA)

120

CC

100

80

60

SUPPLY CURRENT, I

40

20

0

–40–15 1035608

= 54Ω

R

L

= 120Ω

R

L

NO LOAD

TEMPERATURE (°C)

Figure 3. ADM2582E Supply Current (ICC) vs. Temperature

(Data Rate = 16 Mbps, DE = 3.3 V, V

140

= 54Ω

120

100

(mA)

CC

80

60

40

SUPPLY CURRENT, I

20

0

–40 –15 10 35 60 85

R

L

RL = 120Ω

NO LOAD

TEMPERATURE (°C)

= 3.3 V)

CC

Figure 4. ADM2582E Supply Current (ICC) vs. Temperature

(Data Rate = 16 Mbps, DE = 5 V, V

140

120

100

(mA)

CC

80

60

40

SUPPLY CURRENT, I

20

0

–40 –15 10 35 60 85

= 54Ω

R

L

RL = 120Ω

NO LOAD

TEMPERATURE (°C)

= 5 V)

CC

Figure 5. ADM2587E Supply Current (ICC) vs. Temperature

(Data Rate = 500 kbps, DE = 5 V, V

= 5 V)

CC

5

08111-103

08111-104

08111-105

120

100

(mA)

80

CC

60

40

SUPPLY CURRENT, I

20

0

–40 –15 10 35 60 85

= 54Ω

R

L

RL = 120Ω

NO LOAD

TEMPERATURE (°C)

08111-106

Figure 6. ADM2587E Supply Current (ICC) vs. Temperature

(Data Rate = 500 kbps, DE = 3.3 V, V

72

70

68

66

64

62

60

58

56

54

DRIVER PROPAGATION DELAY (ns)

52

50

–40 –15 10 35 60 85

t

DPHL

t

DPLH

TEMPERATURE ( °C)

= 3.3 V)

CC

8111-107

Figure 7. ADM2582E Differential Driver Propagation Delay vs. Temperature

600

580

560

540

520

500

480

460

440

DRIVER PROPAGATION DELAY (ns)

420

400

–40 –15 10 35 60 85

t

DPLH

t

DPHL

TEMPERATURE (°C)

8111-108

Figure 8. ADM2587E Differential Driver Propagation Delay vs. Temperature

Rev. 0 | Page 8 of 20

ADM2582E/ADM2587E

60

TxD

1

Z

Y

3

CH1 2.0V

CH3 2.0V

CH2 2.0V

M10.00ns A CH1 1.28V

Figure 9. ADM2582E Driver Propagation Delay

1

3

CH1 2.0V

CH3 2.0V

TxD

Z

Y

CH2 2.0V M200ns A CH1 2.56V

Figure 10. ADM2587E Driver Propagation Delay

0

50

40

30

20

OUTPUT CURRENT ( mA)

10

0

08111-109

012345

OUTPUT VO LTAGE (V )

8111-112

Figure 12. Receiver Output Current vs. Receiver Output Low Voltage

4.75

4.74

4.73

4.72

4.71

4.70

4.69

4.68

OUTPUT VOLTAGE(V)

4.67

4.66

4.65

08111-110

–40 –15 10 35 60 85

TEMPERATURE (° C)

08111-113

Figure 13. Receiver Output High Voltage vs. Temperature

0.32

–10

–20

–30

–40

–50

OUTPUT CURRENT (mA)

–60

–70

012345

OUTPUT VOLT AGE (V)

Figure 11. Receiver Output Current vs. Receiver Output High Voltage

08111-111

Rev. 0 | Page 9 of 20

0.30

0.28

0.26

0.24

OUTPUT VO LTAGE (V )

0.22

0.20

–40 –15 10 35 60 85

TEMPERATURE (° C)

Figure 14. Receiver Output Low Voltage vs. Temperature

08111-114

ADM2582E/ADM2587E

G
A

A

100

B

1

3

CH1 2.0V

CH3 2.0V

A

RxD

CH2 2.0V M10.00ns A CH1 2.56V

Figure 15. ADM2582E Receiver Propagation Delay

08111-115

99

98

97

96

95

94

93

92

RECEIVER PROPAGATIO N DELAY (ns)

91

90

–40 –15 10 35 60 85

t

RPHL

t

RPLH

TEMPERATURE (°C)

Figure 18. ADM2587E Receiver Propagation Delay vs. Temperature

3.33

8111-118

A

1

3

CH1 2.0V

CH3 2.0V

CH2 2.0V M10.00ns A CH1 2.56V

B

RxD

08111-116

Figure 16. ADM2587E Receiver Propagation Delay

98

97

Y (ns)

96

t

TION DEL

95

94

93

RECEIVER PROPA

92

–40 –15 10 35 60 85

TEMPERATURE (°C)

RPHL

t

RPLH

Figure 17. ADM2582E Receiver Propagation Delay vs. Temperature

3.32

3.31

3.30

3.29

NO LOAD

= 120Ω

3.28

ISOLATED SUPPLY VOLTAGE (V)

3.27

3.26
–40–15 1035608

TEMPERATURE (°C)

R
R

L

= 54Ω

L

5

8111-119

Figure 19. ADM2582E Isolated Supply Voltage vs. Temperature

= 3.3 V, Data Rate = 16 Mbps)

(V

CC

3.36

3.35

3.34

3.33

3.32

3.31

3.30

3.29

3.28

ISOLATED SUPPLY VOLTAGE (V)

3.27

3.26
–40–15 1035608

08111-117

TEMPERATURE (°C)

NO LOAD

= 120Ω

R

L

= 54Ω

R

L

5

08111-120

Figure 20. ADM2582E Isolated Supply Voltage vs. Temperature

(V

= 5 V, Data Rate = 16 Mbps)

CC

Rev. 0 | Page 10 of 20

ADM2582E/ADM2587E

L

A

L

A

60

R

= 54Ω

50

40

30

L

R

L

= 120Ω

40

35

30

25

20

R

L

R

L

= 54Ω

= 120Ω

20

TED SUPPLY CURRENT (mA)

10

ISO

0

–40–15 1035608

NO LOAD

TEMPERATURE (°C)

Figure 21. ADM2582E Isolated Supply Current vs. Temperature

= 3.3 V, Data Rate = 16 Mbps)

(V

CC

5

08111-121

15

TED SUPPLY CURRENT (mA)

10

ISO

5

0

–40–15 1035608

NO LOAD

TEMPERATURE (°C)

Figure 22. ADM2587E Isolated Supply Current vs. Temperature

(VCC = 3.3 V, Data Rate = 500 kbps)

5

08111-122

Rev. 0 | Page 11 of 20

ADM2582E/ADM2587E

T

T

T

T

V

V

A

V

V

–

V

TEST CIRCUITS

Y

xD V

Z

OD2

Figure 23. Driver Voltage Measurement

R

L

2

R

110Ω

CC

L

08111-006

R

L

2

V

OC

08111-003

xD

DE

Y

S1 S2

Z

OUT

C
50pF

L

Figure 26. Driver Enable/Disable

Y

xD

V

OD3

Z

Figure 24. Driver Voltage Measurement

Y

xD

Z

Figure 25. Driver Propagation Delay

60Ω

R

375Ω

375Ω

V

TEST

RE

B

08111-004

V

OUT

C

L

08111-007

Figure 27. Receiver Propagation Delay

C

L

L

C

L

8111-005

+1.5

1.5

RE IN

S1

RE

C

V

L

R

OUT

CC

L

S2

8111-008

Figure 28. Receiver Enable/Disable

Rev. 0 | Page 12 of 20

ADM2582E/ADM2587E

V

A

Y

Y

V

SWITCHING CHARACTERISTICS

CC

VCC/2 VCC/2

0V

Z

V

O

Y

1/2V

t

DPLH

O

t

DPHL

DE

0.5V

t

ZL

CC

t

0.5V

LZ

CC

0V

CC

2.3V

RO

RO

RE

0V

, Z

t

2.3V

ZH

, Z

t

HZ

+ 0.5V

V

OL

VOH– 0.5V

V

OL

V

OH

08111-011

Figure 31. Driver Enable/Disable Timing

0.7V

CC

0.5V

t

ZL

t

ZH

CC

1.5V

OUTPUT LOW

OUTPUT HIGH

1.5V

t

LZ

t

HZ

0.5V

CC

V

+ 0.5V

OL

VOH– 0.5V

0.3V

CC

V

OL

V

OH

08111-012

Figure 32. Receiver Enable/Disable Timing

V

t

+V

DIFF

–V

SKEW

– B

RxD

O

O

= │t

90% POINT

10% POINT

DPHL–tDPLH

V

= V

– V

DIFF

(Y)

(Z)

t

DR

│

Figure 29. Driver Propagation Delay, Rise/Fall Timing

0V

t

RPLH

1.5V

t

= |

t

–

RPLH

t

RPHL

SKEW

Figure 30. Receiver Propagation Delay

t

|

0V

RPHL

90% POINT

10% POINT

t

DF

1.5V

08111-009

V

OH

V

OL

08111-010

Rev. 0 | Page 13 of 20

ADM2582E/ADM2587E

CIRCUIT DESCRIPTION

SIGNAL ISOLATION

The ADM2582E/ADM2587E signal isolation is implemented on
the logic side of the interface. The part achieves signal isolation
by having a digital isolation section and a transceiver section
(see Figure 1). Data applied to the TxD and DE pins and referenced
to logic ground (GND

) are coupled across an isolation barrier

1

to appear at the transceiver section referenced to isolated ground
(GND

). Similarly, the single-ended receiver output signal,

2

referenced to isolated ground in the transceiver section, is
coupled across the isolation barrier to appear at the RXD pin
referenced to logic ground.

POWER ISOLATION

The ADM2582E/ADM2587E power isolation is implemented
using an isoPower integrated isolated dc-to-dc converter. The
dc-to-dc converter section of the ADM2582E/ADM2587E works
on principles that are common to most modern power supplies.
It is a secondary side controller architecture with isolated pulse­width modulation (PWM) feedback. V

CC power is supplied to

an oscillating circuit that switches current into a chip-scale air
core transformer. Power transferred to the secondary side is
rectified and regulated to 3.3 V. The secondary (V

ISO) side

controller regulates the output by creating a PWM control
signal that is sent to the primary (V

CC) side by a dedicated

iCoupler data channel. The PWM modulates the oscillator
circuit to control the power being sent to the secondary side.
Feedback allows for significantly higher power and efficiency.

TRUTH TABLES

The truth tables in this section use the abbreviations found in
Tabl e 11 .

Table 11. Truth Table Abbreviations

Letter Description

H High level
L Low level
X Don’t care
Z High impedance (off)
NC Disconnected

Table 12. Transmitting (see Table 11 for Abbreviations)

Inputs Outputs

DE TxD Y Z

H H H L
H L L H
L X Z Z
X X Z Z
L X Z Z
X X Z Z

Table 13. Receiving (see Table 11 for Abbreviations)

Inputs Output

A − B

> −0.03 V L or NC H
< −0.2 V L or NC L

−0.2 V < A − B < −0.03 V L or NC X
Inputs open L or NC H
X H Z
X L or NC H
X L or NC L

RxD

RE

THERMAL SHUTDOWN

The ADM2582E/ADM2587E contain thermal shutdown circuitry
that protects the parts from excessive power dissipation during
fault conditions. Shorting the driver outputs to a low impedance
source can result in high driver currents. The thermal sensing
circuitry detects the increase in die temperature under this
condition and disables the driver outputs. This circuitry is
designed to disable the driver outputs when a die temperature
of 150°C is reached. As the device cools, the drivers are reenabled
at a temperature of 140°C.

OPEN- AND SHORT-CIRCUIT, FAIL-SAFE RECEIVER INPUTS

The receiver inputs have open- and short-circuit, fail-safe
features that ensure that the receiver output is high when the
inputs are open or shorted. During line-idle conditions, when no
driver on the bus is enabled, the voltage across a terminating
resistance at the receiver input decays to 0 V. With traditional
transceivers, receiver input thresholds specified between −200 mV
and +200 mV mean that external bias resistors are required on the
A and B pins to ensure that the receiver outputs are in a known
state. The short-circuit, fail-safe receiver input feature eliminates
the need for bias resistors by specifying the receiver input
threshold between −30 mV and −200 mV. The guaranteed negative
threshold means that when the voltage between A and B decays
to 0 V, the receiver output is guaranteed to be high.

Rev. 0 | Page 14 of 20

ADM2582E/ADM2587E

DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY

The digital signals transmit across the isolation barrier using
iCoupler technology. This technique uses chip-scale transformer
windings to couple the digital signals magnetically from one
side of the barrier to the other. Digital inputs are encoded into
waveforms that are capable of exciting the primary transformer
winding. At the secondary winding, the induced waveforms are
decoded into the binary value that was originally transmitted.

Positive and negative logic transitions at the isolator input cause
narrow (~1 ns) pulses to be sent to the decoder via the transformer.
The decoder is bistable and is, therefore, either set or reset by
the pulses, indicating input logic transitions. In the absence of
logic transitions at the input for more than 1 µs, periodic sets of
refresh pulses indicative of the correct input state are sent to
ensure dc correctness at the output. If the decoder receives no
internal pulses of more than approximately 5 s, the input side
is assumed to be unpowered or nonfunctional, in which case,
the isolator output is forced to a default state by the watchdog
timer circuit.

This situation should occur in the ADM2582E/ADM2587E devices
only during power-up and power-down operations. The limitation
on the ADM2582E/ADM2587E magnetic field immunity is set
by the condition in which induced voltage in the transformer
receiving coil is sufficiently large to either falsely set or reset the
decoder. The following analysis defines the conditions under
which this can occur.

The 3.3 V operating condition of the ADM2582E/ADM2587E
is examined because it represents the most susceptible mode of
operation. The pulses at the transformer output have an amplitude
of >1.0 V. The decoder has a sensing threshold of about 0.5 V,
thus establishing a 0.5 V margin in which induced voltages can
be tolerated. The voltage induced across the receiving coil is
given by

V = (−dβ/dt)Σπr

where:

β is magnetic flux density (gauss).
N is the number of turns in the receiving coil.
r

is the radius of the nth turn in the receiving coil (cm).

n

Given the geometry of the receiving coil in the ADM2582E/
ADM2587E and an imposed requirement that the induced
voltage be, at most, 50% of the 0.5 V margin at the decoder, a
maximum allowable magnetic field is calculated as shown in
Figure 33.

2; n = 1, 2, … , N

n

Rev. 0 | Page 15 of 20

100

10

1

0.1

DENSITY (kG auss)

0.01

MAXIMUM ALLOWABLE MAGNETIC FLUX

0.001
1k 10k 10M

MAGNETIC FIELD FREQUENCY (Hz)

Figure 33. Maximum Allowable External Magnetic Flux Density

1M

100M100k

08111-019

For example, at a magnetic field frequency of 1 MHz, the
maximum allowable magnetic field of 0.2 kgauss induces a
voltage of 0.25 V at the receiving coil. This is about 50% of the
sensing threshold and does not cause a faulty output transition.
Similarly, if such an event occurs during a transmitted pulse
(and is of the worst-case polarity), it reduces the received pulse
from >1.0 V to 0.75 V, which is still well above the 0.5 V sensing
threshold of the decoder.

The preceding magnetic flux density values correspond
to specific current magnitudes at given distances from the
ADM2582E/ADM2587E transformers. Figure 34 expresses
these allowable current magnitudes as a function of frequency
for selected distances. As shown in Figure 34, the ADM2582E/
ADM2587E are extremely immune and can be affected only by
extremely large currents operated at high frequency very close
to the component. For the 1 MHz example, a 0.5 kA current must
be placed 5 mm away from the ADM2582E/ADM2587E to affect
component operation.

1k

DISTANCE = 1m

100

10

DISTANCE = 100mm

1

DISTANC E = 5mm

0.1

MAXIMUM ALL OWABLE CURRENT (kA)

0.01
1k 10k 100M100k 1M 10M

MAGNETIC FIELD FREQUENCY (Hz)

Figure 34. Maximum Allowable Current for Various Current-to-

ADM2582E/ADM2587E Spacings

8111-020

Note that in combinations of strong magnetic field and high
frequency, any loops formed by printed circuit board (PCB)
traces can induce error voltages sufficiently large to trigger the
thresholds of succeeding circuitry. Take care in the layout of
such traces to avoid this possibility.

ADM2582E/ADM2587E

G

G

G

G

APPLICATIONS INFORMATION

PCB LAYOUT

The ADM2582E/ADM2587E isolated RS-422/RS-485 transceiver
contains an isoPower integrated dc-to-dc converter, requiring
no external interface circuitry for the logic interfaces. Power
supply bypassing is required at the input and output supply pins
(see Figure 35). The power supply section of the ADM2582E/
ADM2587E uses an 180 MHz oscillator frequency to pass power
efficiently through its chip-scale transformers. In addition, the
normal operation of the data section of the iCoupler introduces
switching transients on the power supply pins.

Bypass capacitors are required for several operating frequencies.
Noise suppression requires a low inductance, high frequency
capacitor, whereas ripple suppression and proper regulation
require a large value capacitor. These capacitors are connected
between Pin 1 (GND
Pin 9 (GND

) for VCC. The V

1

connected between Pin 11 (GND
Pin 19 (V

) and Pin 20 (GND2). To suppress noise and reduce

ISOIN

ripple, a parallel combination of at least two capacitors is required.
The recommended capacitor values are 0.1 µF and 10 µF. The
recommended best practice is to use a very low inductance
ceramic capacitor, or its equivalent, for the smaller value. The
total lead length between both ends of the capacitor and the
input power supply pin should not exceed 10 mm.

ND

1

V

CC

ND

1

RxD

RE

DE

TxD

V

CC

ND

1

ND

1

In applications involving high common-mode transients, ensure
that board coupling across the isolation barrier is minimized.
Furthermore, design the board layout such that any coupling
that does occur equally affects all pins on a given component
side. Failure to ensure this can cause voltage differentials between
pins exceeding the absolute maximum ratings for the device,
thereby leading to latch-up and/or permanent damage.

) and Pin 2 (VCC) and Pin 8 (VCC) and

1

and V

ISOIN

) and Pin 12 (V

2

1

2

3

4

5

6

7

8

9

10

20

19

18

17

16

15

14

13

12

11

capacitors are

ISOOUT

Figure 35. Recommended PCB Layout

ISOOUT

GND

A

B

GND

Z

GND

Y

GND

2

2

2

V

V

2

) and

ISOIN

ISOOUT

8111-125

The ADM2582E/ADM2587E dissipate approximately 650 mW
of power when fully loaded. Because it is not possible to apply
a heat sink to an isolation device, the devices primarily depend
on heat dissipation into the PCB through the GND pins. If the
devices are used at high ambient temperatures, provide a thermal
path from the GND pins to the PCB ground plane. The board
layout in Figure 35 shows enlarged pads for Pin 1, Pin 3, Pin 9,
Pin 10, Pin 11, Pin 14, Pin 16, and Pin 20. Implement multiple
vias from the pad to the ground plane to reduce the temperature
inside the chip significantly. The dimensions of the expanded
pads are at the discretion of the designer and dependent on the
available board space.

EMI CONSIDERATIONS

The dc-to-dc converter section of the ADM2582E/ADM2587E
components must, of necessity, operate at very high frequency
to allow efficient power transfer through the small transformers.
This creates high frequency currents that can propagate in circuit
board ground and power planes, causing edge and dipole radiation.
Grounded enclosures are recommended for applications that use
these devices. If grounded enclosures are not possible, good RF
design practices should be followed in the layout of the PCB.
See Application Note AN-0971, Control of Radiated Emissions
with isoPower Devices, for more information.

INSULATION LIFETIME

All insulation structures eventually break down when subjected to
voltage stress over a sufficiently long period. The rate of insulation
degradation is dependent on the characteristics of the voltage
waveform applied across the insulation. Analog Devices conducts
an extensive set of evaluations to determine the lifetime of the
insulation structure within the ADM2582E/ADM2587E.

Accelerated life testing is performed using voltage levels higher
than the rated continuous working voltage. Acceleration factors for
several operating conditions are determined, allowing calculation
of the time to failure at the working voltage of interest. The values
shown in Tab l e 9 summarize the peak voltages for 50 years of
service life in several operating conditions. In many cases, the
working voltage approved by agency testing is higher than the
50-year service life voltage. Operation at working voltages higher
than the service life voltage listed leads to premature insulation
failure.

The insulation lifetime of the ADM2582E/ADM2587E depends
on the voltage waveform type imposed across the isolation barrier.
The iCoupler insulation structure degrades at different rates,
depending on whether the waveform is bipolar ac, unipolar ac,
or dc. Figure 36, Figure 37, and Figure 38 illustrate these different
isolation voltage waveforms.

Bipolar ac voltage is the most stringent environment. A 50-year
operating lifetime under the bipolar ac condition determines
the Analog Devices recommended maximum working voltage.

Rev. 0 | Page 16 of 20

ADM2582E/ADM2587E

V

In the case of unipolar ac or dc voltage, the stress on the insulation
is significantly lower. This allows operation at higher working
voltages while still achieving a 50-year service life. The working
voltages listed in Tabl e 9 can be applied while maintaining the
50-year minimum lifetime, provided the voltage conforms to either
the unipolar ac or dc voltage cases. Any crossinsulation voltage
waveform that does not conform to Figure 37 or Figure 38 should
be treated as a bipolar ac waveform, and its peak voltage should
be limited to the 50-year lifetime voltage value listed in Tabl e 9.

RATED PEAK VOLTAGE

0V

08111-021

Figure 36. Bipolar AC Waveform

RATED PEAK VOLTAGE

0V

Figure 37. DC Waveform

RATED PEAK VOLTAGE

NOTES

1. THE VOL TAGE IS SHOWN AS SI NUSODIAL FO R ILLUST RATION
PURPOSES ONLY. IT IS MEANT TO REPRESENT ANY VOLTAGE
WAVEFORM VARYING BETW EEN 0 AND SOME L IMITI NG VALUE.
THE LIMITING VALUE CAN BE POSITIVE OR NEGATIVE, BUT THE
VOLTAG E CANNOT CROSS 0V.

0V

Figure 38. Unipolar AC Waveform

CC

GND

1

08111-023

08111-022

V

CC

isoPower DC-TO-DC CONVER TER

OSCILLATOR

ISOLATED POWER SUPPLY CONSIDERATIONS

The typical output voltage of the integrated isoPower dc-to-dc
isolated supply is 3.3 V. The isolated supply in the ADM2587E
is capable of supplying a current of 55 mA when the junction
temperature of the device is kept below 120°C. It is important
to note that the current available on the V
current available and includes the current required to supply the
internal RS-485 circuitry.

The ADM2587E can typically supply 15 mA externally on
V

when the driver is switching at 500 kbps loaded with 54 Ω,

ISOOUT

while the junction temperature of the part is less than 120°C.

Table 14. Typical Maximum External Current Available
on V

ISOOUT

External Load
Current (mA) R

15 54 Ω

System Configuration

T

Double terminated bus with

= 110 Ω

R

T

29 120 Ω Single terminated bus
46 Unloaded Unterminated bus

The ADM2582E typically has no current available externally
on V

ISOOUT

.

When external current is drawn from the V
an increased risk of generating radiated emissions due to the
high frequency switching elements used in the isoPower dc to­dc converter. Special care must be taken during PCB layout to
meet emissions standards. See Application Note AN-0971,
Control of Radiated Emissions with isoPower Devices, for details
on board layout considerations.

EXTERNAL

LOAD

GND

GND

RECTIFIER

V

ISOOUT

ISOOUT

ISOOUT

2

pin is the total

pin, there is

V

ISOIN

Y

Z

A

B

R

T

08111-038

500kbps

REGULATOR

DIGITAL ISOLATION iCoupler

TxD

V

CC

DE

RxD

RE

ENCODE

ENCODE

DECODE

GND

1

DECODE D

DECODE

ENCODE

ADM2582E/ADM2587E

ISOLATION

BARRIER

TRANSCEIVER

R

GND

2

Figure 39. ADM2587E Typical Maximum External Current Measurements

Rev. 0 | Page 17 of 20

ADM2582E/ADM2587E

3.3V/5V POWER
SUPPLY

100nF 10µF 100nF 10nF

V

V

CC

MICROCONTRO LLER

AND UART

GND

1

TxD

DE

RxD

RE

CC

iso

Power DC-TO-DC CONVERTER

OSCILLATOR

DIGITAL ISOLATIONiCoupler

ENCODE

ENCODE

DECODE

GND

1

ISOLATION

BARRIER

ADM2582E/ADM2587E

Figure 40. Example Circuit Diagram Using the ADM2582E/ADM2587E

Figure 40 is an example of a circuit diagram using the ADM2582E/ADM2587E.

RECTIFIE R

REGULATOR

DECODE

DECODE

ENCODE

GND

V

ISOOUT

TRANSCEIVER

D

2

100nF 10µF

V

ISOIN

100nF 10nF

Y

R

Z

A

R

B

T

R

T

8111-124

Rev. 0 | Page 18 of 20

ADM2582E/ADM2587E

2

TYPICAL APPLICATIONS

Figure 41 and Figure 42 show typical applications of the ADM2582E/
ADM2587E in half duplex and full duplex RS-485 network
configurations. Up to 256 transceivers can be connected to the
RS-485 bus. To minimize reflections, terminate the line at the

MAXIMUM NUMBER OF TRANSCEIVERS ON BUS = 256

ADM2582E/

RxD

RE

DE

TxD

ADM2587E

R

D

A

B

R

T

Z

Y

receiving end in its characteristic impedance, and keep stub
lengths off the main line as short as possible. For half-duplex
operation, this means that both ends of the line must be
terminated because either end can be the receiving end.

ADM2582E/

ADM2587E

A

B

R

T

Z

Y

ABZYABZY

R

RxD

RE

DE

TxD

D

NOTES

1. R

T

. ISOLATION NOT SHOWN.

RxD

RE

DE

TxD

NOTES

1. R

IS EQUAL TO THE CHARACTERISTIC I MPEDANCE OF T HE CABLE.

T

2. ISOLATION NOT SHOWN.

ADM2582E/

R

D

ADM2587E

IS EQUAL TO THE CHARACTERISTIC IM PEDANCE OF THE CABLE.

Figure 41. ADM2582E/ADM2587E Typical Half Duplex RS-485 Network

MASTER

R

D

A

R

T

B

Z

Y

MAXIMUM NUMBER OF NODES = 256

ADM2582E/

ADM2587E

A B Z Y

R

ADM2582E/

D

ADM2587E

RxD RE DE TxD

Figure 42. ADM2582E/ADM2587E Typical Full Duplex RS-485 Network

ADM2582E/

ADM2587E

R

RxD RE DE TxDRxD RE DE TxD

A B Z Y

R

RxD RE DE TxD

D

D

R

T

SLAVESLAVE

ADM2582E/
ADM2587E

Y

Z

B

A

SLAVE

D

R

ADM2582E/

ADM2587E

TxD

DE

RE

RxD

08111-027

08111-028

Rev. 0 | Page 19 of 20

ADM2582E/ADM2587E

OUTLINE DIMENSIONS

13.00 (0.5118)

12.60 (0.4961)

11

7.60 (0.2992)

7.40 (0.2913)

10

10.65 (0.4193)

10.00 (0.3937)

2.65 (0.1043)

2.35 (0.0925)

SEATING
PLANE

8°
0°

0.33 (0.0130)

0.20 (0.0079)

(

0

.

0

2

9

5

5
5

(

0

.

)

45°

0

9

8

)

0

1.27 (0.0500)

0.40 (0.0157)

060706-A

0

.

7

0

.

2

0.30 (0.0118)

0.10 (0.0039)

COPLANARITY

0.10

20

1

1.27

(0.0500)

BSC

CONTROLLING DIMENSIONS ARE IN MILLI METERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

0.51 (0.0201)

0.31 (0.0122)

COMPLIANT TO JEDEC STANDARDS MS-013-AC

Figure 43. 20-Lead Standard Small Outline Package [SOIC_W]

Wide Body

(RW-20)

Dimensions shown in millimeters and (inches)

ORDERING GUIDE

Model Data Rate (Mbps) Temperature Range Package Description Package Option

ADM2582EBRWZ1 16 −40°C to +85°C 20-Lead SOIC_W RW-20
ADM2582EBRWZ-REEL71 16 −40°C to +85°C 20-Lead SOIC_W RW-20
ADM2587EBRWZ1 0.5 −40°C to +85°C 20-Lead SOIC_W RW-20
ADM2587EBRWZ-REEL71 0.5 −40°C to +85°C 20-Lead SOIC_W RW-20
EVAL-ADM2582EEBZ1 ADM2582E Evaluation Board
EVAL-ADM2587EEBZ1 ADM2587E Evaluation Board

1

Z = RoHS Compliant Part.

©2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D08111-0-9/09(0)

Rev. 0 | Page 20 of 20