Datasheet ADM2485 Datasheet (ANALOG DEVICES)

High Speed, Isolated RS-485 Transceiver
V
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FEATURES

Half-duplex, isolated RS-485 transceiver Integrated oscillator driver for external transformer PROFIBUS® compliant Complies with ANSI/TIA/EIA RS-485-A-98 and
ISO 8482:198 Data rate: 16 Mbps 5 V or 3.3 V operation (V 50 nodes on bus High common-mode transient immunity: >25 kV/μs Isolated DE OUT status output Thermal shutdown protection Safety and regulatory approvals
UL recognition: 2500 V rms for 1 minute per UL 1577
VDE Certificate of Conformity
DIN V VDE V 0884-10 (VDE V 0884-10):2006-12
Reinforced insulation, V Operating temperature range: –40°C to +85°C Wide-body, 16-lead SOIC package
7(E)
DD1
)
= 560 V peak
IORM
with Integrated Transformer Driver
ADM2485

FUNCTIONAL BLOCK DIAGRAM

D1 D2
RTS
TxD
RxD
RE
V
DD1
OSC
GALVANIC IS OLATIO N
GND
1
Figure 1.
DD2
ADM2485
GND
2
DE OUT
A
B
06021-001

APPLICATIONS

Isolated RS-485/RS-422 interfaces PROFIBUS networks Industrial field networks Multipoint data transmission systems

GENERAL DESCRIPTION

The ADM2485 differential bus transceiver is an integrated, galvanically isolated component designed for bidirectional data communication on multipoint bus transmission lines. It is designed for balanced transmission lines and complies with ANSI/TIA/EIA RS-485-A-98 and ISO 8482:1987(E).
The device employs Analog Devices, Inc., iC to combine a 3-channel isolator, a three-state differential line driver, and a differential input receiver into a single package. An on-chip oscillator outputs a pair of square waveforms that drive an external transformer to provide isolated power with an external transformer. The logic side of the device can be powered with either a 5 V or a 3.3 V supply, and the bus side is powered with an isolated 5 V supply.
oupler® technology
The ADM2485 driver has an active high enable. The driver dif
ferential outputs and the receiver differential inputs are connected internally to form a differential input/output port that imposes minimal loading on the bus when the driver is disabled or when V
DD1
or V
= 0 V. Also provided is an active
DD2
high receiver disable that causes the receive output to enter a high impedance state.
The device has current-limiting and thermal shutdown features
o protect against output short circuits and situations where bus
t contention might cause excessive power dissipation. The part is fully specified over the industrial temperature range and is available in a 16-lead, wide-body SOIC package.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2007 Analog Devices, Inc. All rights reserved.
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TABLE OF CONTENTS

Features .............................................................................................. 1
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Timing Specifications .................................................................. 5
Package Characteristics ............................................................... 6
Regulatory Information............................................................... 6
Insulation and Safety-Related Specifications............................ 6
VDE 0884-2 Insulation Characteristics..................................... 7
Absolute Maximum Ratings............................................................ 8
ESD Caution.................................................................................. 8
Pin Configuration and Function Descriptions............................. 9
Typical Perf or m an c e Charac t e ristic s ........................................... 10
Test Ci r c ui t s..................................................................................... 13
Circuit Description......................................................................... 14
Electrical Isolation...................................................................... 14
Truth Ta b l es................................................................................. 14
Thermal Shutdown .................................................................... 14
Receiver Fail-Safe Inputs ........................................................... 14
Magnetic Field Immunity.......................................................... 15
Applications Information.............................................................. 16
PCB Layout ................................................................................. 16
Transformer Suppliers ............................................................... 16
Applications Diagram................................................................ 16
Outline Dimensions ....................................................................... 17
Ordering Guide .......................................................................... 17

REVISION HISTORY

12/07—Rev. 0 to Rev. A
Updated Format..................................................................Universal
Changes to Features Section............................................................ 1
Changes to Table 4............................................................................ 6
Changes to VDE 0884-2 Insulation Characteristics Section ...... 7
Changes to PCB Section and Figure 34 ....................................... 16
Updated Outline Dimensions....................................................... 17
1/07—Revision 0: Initial Version
Rev. A | Page 2 of 20
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SPECIFICATIONS

2.7 V ≤ V
Table 1.
Parameter Min Typ Max Unit Test Conditions/Comments
DRIVER
Differential Outputs
Bus Enable Output
Logic Inputs
RECEIVER
Differential Inputs
RxD Logic Output
TRANSFORMER DRIVER
Oscillator Frequency 400 500 600 kHz V 230 330 430 kHz V Switch-On Resistance 0.5 1.5 Ω Start-Up Voltage 2.2 2.5 V
≤ 5.5 V, 4.75 V ≤ V
DD1
Differential Output Voltage, V
≤ 5.25 V, TA = T
DD2
OD
MIN
to T
, unless otherwise noted.
MAX
5 V R = ∞, see Figure 21
2.1 5 V R = 50 Ω (RS-422), see Figure 21
2.1 5 V R = 27 Ω (RS-485), see Figure 21
2.1 5 V V
= –7 V to +12 V, V
TST
≥ 4.75 V, see Figure 22
DD1
Δ|VOD| for Complementary Output States 0.2 V R = 27 Ω or 50 Ω, see Figure 21 Common-Mode Output Voltage, V
OC
3 V R = 27 Ω or 50 Ω, see Figure 21 Δ|VOC| for Complementary Output States 0.2 V R = 27 Ω or 50 Ω, see Figure 21 Output Short-Circuit Current, V Output Short-Circuit Current, V
Output High Voltage V V V Output Low Voltage 0.1 V I
0.1 0.3 V I
0.2 0.4 V I
Input High Voltage 0.7 V Input Low Voltage 0.25 V CMOS Logic Input Current (TxD, RTS, RE)
Differential Input Threshold Voltage, V
= High 60 200 mA −7 V ≤ V
OUT
= Low 60 200 mA −7 V ≤ V
OUT
− 0.1 V I
DD2
− 0.3 V
DD2
− 0.4 V
DD2
DD1
− 0.1 V I
DD2
− 0.2 V I
DD2
V
V
DD1
−10 +0.01 +10 μA
TH
−200 +200 mV −7 V ≤ VCM ≤ +12V
ODE
ODE
ODE
ODE
ODE
ODE
TxD, RTS, RE TxD, RTS, RE TxD, RTS, RE = V
≤ +12 V
OUT
≤ +12 V
OUT
= 20 μA = 1.6 mA = 4 mA = −20 μA = −1.6 mA = −4 mA
DD1
or 0 V
Input Hysteresis 70 mV −7 V ≤ VCM ≤ +12V Input Resistance (A, B) 20 30 −7 V ≤ VCM ≤ +12V Input Current (A, B) 0.6 mA VIN = +12 V
−0.35 mA VIN = −7 V
Output High Voltage V V Output Low Voltage 0.1 V I
0.2 0.4 V I Output Short-Circuit Current 7 85 mA V Tristate Output Leakage Current ±1 μA 0.4 V ≤ V
− 0.1 V I
DD1
− 0.4 V
DD1
− 0.2 V I
DD1
= +20 μA, VA − VB = +0.2 V
OUT
= +1.5 mA, VA − VB = +0.2 V
OUT
= −20 μA, VA − VB = −0.2 V
OUT
= −4 mA, VA − VB = −0.2 V
OUT
= GND or V
OUT
DD1
DD1
= 5.5 V = 3.3 V
≤ 2.4 V
OUT
CC
Rev. A | Page 3 of 20
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Parameter Min Typ Max Unit Test Conditions/Comments
POWER SUPPLY CURRENT
Logic Side 2.5 mA RTS = 0 V, V
2.3 mA 2.5 Mbps, V
5.0 6.5 mA 16 Mbps, V
1.26 mA RTS = 0 V, V
1.5 mA 2.5 Mbps, V
2.9 mA 16 Mbps, V Bus Side 1.7 2.5 mA RTS = 0 V
49.0 mA
2.5 Mbps, RTS = V load conditions
55.0 75.0 mA
16 Mbps, RTS = V
load conditions COMMON-MODE TRANSIENT IMMUNITY HIGH FREQUENCY COMMON-MODE
NOISE IMMUNITY
1
CM is the maximum common-mode voltage slew rate that can be sustained while maintaining specification-compliant operation. VCM is the common-mode potential
difference between the logic and bus sides. The transient magnitude is the range over which the common mode is slewed. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges.
1
25 kV/μs Transient magnitude = 800 V, VCM = 1 kV 100 mV
VHF = +5 V, −2 V < V
1 MHz < f
= 5.5 V
DD1
= 5.5 V, see Figure 23
DD1
= 5.5 V, see Figure 23
DD1
= 3.3 V
DD1
= 3.3 V, see Figure 23
DD1
= 3.3 V, see Figure 23
DD1
, see Figure 23 for
DD1
, see Figure 23 for
DD1
< +7 V,
TEST2
< 50 MHz, see Figure 24
TEST
Rev. A | Page 4 of 20
ADM2485
+
A
A
A
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TIMING SPECIFICATIONS

2.7 V ≤ V
Table 2.
Parameter Min Typ Max Unit Test Conditions/Comments
DRIVER
Maximum Data Rate 16 Mbps Propagation Delay Input-to-Output
RTS-to-DE OUT Propagation Delay 20 35 55 ns See Figure 26 Driver Output-to-Output, t Rise/Fall Time, tR, tF 5 15 ns R
Enable Time 43 53 ns See Figure 4 and Figure 27 Disable Time 43 55 ns See Figure 4 and Figure 27 Enable Skew, |t Disable Skew, |t
RECEIVER
Propagation Delay, t Differential Skew, t Enable Time 3 13 ns RL = 1 kΩ, CL = 15 pF, see Figure 5 and Figure 29 Disable Time 3 13 ns RL = 1 kΩ, CL = 15 pF, see Figure 5 and Figure 29

Timing Diagrams

3V
0V
B
A
V
OUT
0V
V
OUT
– B
≤ 5.5 V, 4.75 V ≤ V
DD1
t
, t
PLH
PHL
1/2V
OUT
V
OUT
90% POINT
10% POINT
t
AZH
AHZ
1.5V
PLH
− t
|, |t
BZL
− t
|, |t
BLZ
, t
PLH
PHL
SKEW
t
R
t
SKEW
SKEW
AZL
ALZ
− t
− t
= |t
DD2
BZH
PLH
≤ 5.25 V, TA = T
| 1 3 ns See Figure 4 and Figure 27
| 2 5 ns See Figure 4 and Figure 27
BHZ
– t
|
PHL
Figure 2. Driver Propagation Delay, Rise/Fall Timing
0V 0V
to T
MIN
25 45 55 ns R
2 5 ns R
, unless otherwise noted.
MAX
LDIFF
LDIFF
LDIFF
= 54 Ω, CL1 = CL2 = 100 pF, see Figure 25
= 54 Ω, CL1 = CL2 = 100 pF, see Figure 2 and Figure 25
= 54 Ω, CL1 = CL2 = 100 pF, see Figure 2 and Figure 25
25 45 55 ns CL = 15 pF, see Figure 3 and Figure 28 5 ns CL = 15 pF, see Figure 3 and Figure 28
1.5V
t
PHL
90% POINT
t
F
10% POINT
06021-012
RTS
– B
– B
RE
0.5V
DD1
t
ZL
2.3V
t
ZH
2.3V
Figure 4. Driver Enable/Disable Timing
0.5V
DD1
t
ZL
t
LZ
t
HZ
t
0.5V
0.5V
LZ
DD1
VOH + 0.5V
VOH – 0.5V
DD1
0.7V
0.3V
0.7
0.3V
DD1
DD1
DD1
DD1
V
OL
V
OH
0V
06021-014
RxD
t
PLH
1.5V 1.5V
t
SKEW
= |t
PLH
– t
PHL
t
PHL
V
OH
|
V
OL
06021-013
Figure 3. Receiver Propagation Delay
Rev. A | Page 5 of 20
RxD
RxD
1.5V OUTPUT LOW
t
ZH
0V
OUTPUT HIGH
1.5V
t
HZ
V
+ 0.5V
OH
VOH – 0.5V
V
OL
V
OH
06021-015
Figure 5. Receiver Enable/Disable Timing
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PACKAGE CHARACTERISTICS

Table 3.
Parameter Symbol Min Typ Max Unit Test Conditions
Resistance (Input-to-Output) Capacitance (Input-to-Output) Input Capacitance
2
Input IC Junction-to-Case Thermal Resistance θ
Output IC Junction-to-Case Thermal Resistance θ
1
Device considered a 2-terminal device: Pin 1 to Pin 8 are shorted together and Pin 9 to Pin 16 are shorted together.
2
Input capacitance is from any input data pin to ground.

REGULATORY INFORMATION

Table 4. ADM2485 Approvals
Organization Approval Type Notes
UL
VDE
Recognized under the Component Recognition
rogram of Underwriters Laboratories, Inc.
P
Certified according to DIN V VDE V 0884-10
VDE V 0884-10): 2006-12
(
1
1
R
I-O
C
I-O
C
I
JCI
JCO
1012 Ω 3 pF f = 1 MHz 4 pF 33 °C/W
28 °C/W
Thermocouple located at center of
age underside
pack Thermocouple located at center of
age underside
pack
In accordance with UL 1577, each ADM2485 is proof tested by applying an insulation test voltage ≥3000 V rms for 1 second (current leakage detection limit = 5 μA).
In accordance with DIN V VDE V 0884-10, each ADM2485 is proof tested by applying an insulation test voltage ≥1050 V peak for 1 second (partial discharge detection limit = 5 pC).

INSULATION AND SAFETY-RELATED SPECIFICATIONS

Table 5.
Parameter Symbol Value Unit Conditions
Rated Dielectric Insulation Voltage 2500 V rms 1-minute duration Minimum External Air Gap (External Clearance) L(I01) 5.15 min mm
Measured from input terminals t shortest distance through air
Minimum External Tracking (Creepage) L(I02) 5.5 min mm
Measured from input terminals t
shortest distance along body Minimum Internal Gap (Internal Clearance) 0.017 min mm Insulation distance through insulation Tracking Resistance (Comparative Tracking Index) CTI >175 V DIN IEC 112/VDE 0303-1 Isolation Group IIIa Material Group (DIN VDE 0110: 1989-01, Table 1)
o output terminals,
o output terminals,
Rev. A | Page 6 of 20
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VDE 0884-2 INSULATION CHARACTERISTICS

This isolator is suitable for basic electrical isolation only within the safety limit data. Maintenance of the safety data must be ensured by means of protective circuits.
An asterisk (*) on packages denotes DIN V VDE V 0884-10 approval.
Table 6.
Description Symbol Characteristic Unit
Installation Classification per DIN VDE 0110 for Rated Mains Voltage
≤150 V rms I to IV ≤300 V rms I to III
≤400 V rms I to II Climatic Classification 40/85/21 Pollution Degree (DIN VDE 0110: 1989-01, Table 1) 2 Maximum Working Insulation Voltage V Input-to-Output Test Voltage V
Method B1: V
Method A (After Environmental Tests, Subgroup 1): V
× 1.875 = VPR, 100% Production Tested, tm = 1 sec, Partial Discharge < 5 pC 1050 V peak
IORM
× 1.6 = VPR, tm = 60 sec,
IORM
IORM
PR
Partial Discharge <5 pC 896 V peak
Method A (After Input and/or Safety Test, Subgroup 2/3): V
Partial Discharge <5 pC Highest Allowable Overvoltage Safety-Limiting Values
2
1
Case Temperature T Input Current I Output Current I
Insulation Resistance at T
1
Transient overvoltage, tTR = 10 sec.
2
The safety-limiting value is the maximum value allowed in the event of a failure. See Figure 14 for the thermal derating curve.
3
VIO = 500 V.
3
S
× 1.2 = VPR, tm = 60 sec,
IORM
672 V peak V
TR
S
S, INPUT
S, OUTPUT
R
S
560 V peak
4000 V peak
150 °C 265 mA 335 mA
9
>10
Ω
Rev. A | Page 7 of 20
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ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted. All voltages are relative to their respective grounds.
Table 7.
Parameter Rating V
DD1
V
DD2
Digital Input Voltage (RTS, RE, TxD) Digital Output Voltage
RxD −0.5 V to V DE OUT −0.5 V to V
D1, D2 13 V Driver Output/Receiver Input Voltage −9 V to +14 V Operating Temperature Range −40°C to +85°C Storage Temperature Range −55°C to +150°C Average Output Current per Pin −35 mA to +35 mA θJA Thermal Impedance 73°C/W Lead Temperature
Soldering (10 sec) 300°C
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
−0.5 V to +6 V
−0.5 V to +6 V
−0.5 V to V
DD1
DD1
DD2
+ 0.5 V
+ 0.5 V + 0.5 V
Stresses above those listed under Absolute Maximum Ratings
y cause permanent damage to the device. This is a stress
ma rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ESD CAUTION

Rev. A | Page 8 of 20
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PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

D1
D2
ND
1
V
DD1
RxD
RE
RTS
TxD
Figure 6. Pin Configuration
Table 8. Pin Function Description
Pin No. Mnemonic Function
1 D1 Transformer Driver Terminal 1. 2 D2 Transformer Driver Terminal 2. 3 GND 4 V
DD1
1
Ground, Logic Side. Power Supply, Logic Side (3.3 V or 5 V). Decoupling capacitor to GND1 required; capacitor value should be
between 0.01 μF and 0.1 μF.
5 RxD
Receiver Output Data. This output is high when (A − B) > 200 mV and low when (A − B) < −200 mV. The output is tristated when the receiver is disabled, that is, when RE
6
RE
Receiver Enable Input. This is an active-low input. Driving this input low enables the receiver; driving it
high disables the receiver. 7 RTS 8 TxD 9, 11, 14, 15 GND
2
10 DE OUT 12 A
Driver Enable Input. Driving this input high enables the driver; driving it low disables the driver.
Driver Input. Data to be transmitted by the driver is applied to this input.
Ground, Bus Side.
Driver Enable Status Output.
Noninverting Driver Output/Receiver Input. When the driver is disabled or V
Pin A is put in a high impedance state to avoid overloading the bus. 13 B
Inverting Driver Output/Receiver Input. When the driver is disabled or V
Pin B is put in a high impedance state to avoid overloading the bus. 16 V
DD2
Power Supply, Bus Side (Isolated 5 V Supply). Decoupling capacitor to GND2 required; capacitor value
should be between 0.01 μF and 0.1 μF.
1
2
3
ADM2485
4
TOP VIEW
(Not to Scale)
5
6
7
8
16
15
14
13
12
11
10
9
V
DD2
GND
2
GND
2
B
A
GND
2
DE OUT
GND
2
06021-002
is driven high.
or V
is powered down,
DD2
is powered down,
DD2
DD1
DD1
or V
Rev. A | Page 9 of 20
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TYPICAL PERFORMANCE CHARACTERISTICS

2.40
60
2.35
2.30
2.25
2.20
2.15
SUPPLY CURRENT (mA)
2.10
2.05
2.00 –40 –20 0 20 40 60 80
I
I
_DE_ENABLE_V
DD2
_RE_ENABLE_V
DD1
TEMPERATURE (°C)
DD1
= 5.5V
DD1
= 5.5V
Figure 7. Unloaded Supply Current vs. Temperature
5.0
I
_PROFIBUS LOAD_TxD = 1 6Mbps_V
DD1
4.5
4.0
3.5 I
_NO LOAD_TxD = 16Mbps_V
DD1
3.0
2.5
2.0
SUPPLY CURRENT (mA)
1.5
DD1
I
1.0
0.5
0
Figure 8. Logic Side Supply Cu
_PROFIBUS LOAD_TxD = 2 Mbps_V
I
DD1
I
_NO LOAD_TxD = 2Mbps_V
DD1
–40 –20 0 20 40 60 80
TEMPERATURE (°C)
rrent (I
DD1
DD1
= 5.00V
DD1
DD1
= 5.00V
DD1
= 1 mA) vs. Temperature
60
I
_ PROFIBUS LOAD_TxD = 1 6Mbps_V
DD2
50
DD2
= 5.00V
= 5.00V
= 5.00V
50
40
30
20
10
DRIVER PROPAG ATION DELAY (ns)
0
–40 –20 0 20 40 60 80
06021-016
t
t
PLHA
PLHB
t
PHLB
t
PHLA
TEMPERATURE (°C)
06021-019
Figure 10. Driver Propagation Delay vs. Temperature
60
Rx PROP DELAY,
50
40
Rx PROP DELAY,
30
20
10
RECEIVER PROPAGATIO N DELAY (ns)
0
–40 –20 0 20 40 60 80
06021-017
t
= 5.00V
PLH_VDD2
t
= 5.00V
PHL_VDD2
TEMPERATURE (°C)
06021-020
Figure 11. Receiver Propagation Delay vs. Temperature
I
_PROFIBUS L OAD_TxD = 2Mb ps_V
DD2
40
30
20
SUPPLY CURRENT (mA)
DD2
I
Figure 9. Bus Side Supply Current (I
_NO LOAD_TxD = 16Mbps_V
I
DD2
10
I
_NO LOAD_TxD = 2Mbps_V
DD2
0
–40 –20 0 20 40 60 80
TEMPERATURE (°C)
DD2
DD2
= 5.00V
DD2
= 5.00V
DD2
= 5.00V
= 2 mA) vs. Temperature
06021-018
Rev. A | Page 10 of 20
3
2
DI
B
A
CH1 2.0V
CH3 2.0V
CH2 2.0V M20.0ns 1. 25GS/s
IT 8.0p s/pt
A CH3 2.60V
Figure 12. Driver/Receiver Propagation Delay, Low to High
= 54 Ω, CL1 = CL2 = 100 pF)
(R
LDIFF
6021-021
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60
50
1
3
CH1 1.0V
CH3 2.0V
CH2 1.0V M10.0ns A CH1 120mV
T 19.8000ns
Figure 13. Driver/Receiver Propagation Delay, High to Low
= 54 Ω, CL1 = CL2 = 100 pF)
(R
LDIFF
350
300
250
200
150
100
SAFETY-LIMITING CURRENT (mA)
50
SIDE 2
SIDE 1
40
30
20
OUTPUT CURRENT (mA)
10
0
012345
06021-022
OUTPUT VOLTAGE (V)
06021-025
Figure 16. Output Current vs. Receiver Output Low Voltage
4.75
4.74
4.73
4.72
4.71
4.70
OUTPUT VOLTAGE (V)
4.69
4.68
0
0
50 100 150 200
CASE TEMPERATURE ( °C)
Figure 14. Thermal Derating Curve, D
with Case Temperature per VDE 0884-2
0
–10
–20
–30
–40
–50
OUTPUT CURRENT ( mA)
–60
–70
012345
OUTPUT VOLTAGE (V)
Figure 15. Output Current vs. R
ependence of Safety-Limiting Values
eceiver Output High Voltage
4.67 –40 –20 0 20 40 60 80
06021-023
Figure 17. Receiver Output High Voltage vs. Temperature (I
TEMPERATURE (°C)
= –4 mA)
DD2
06021-031
0.32
0.30
0.28
0.26
0.24
OUTPUT VOLTAGE (V)
0.22
0.20 –40 –20 0 20 40 60 80
06021-024
Figure 18. Receiver Output Low Voltage vs. Temperature (I
TEMPERATURE (°C)
= –4 mA)
DD2
06021-032
Rev. A | Page 11 of 20
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D1
1
2
D2
CH1 2.0V CH2 2.0V M400ns 125MS/ s
8.0ns/p t
Figure 19. Switching Waveforms
(50 Ω Pul
l-Up to V
DD1
A CH2 1.52V
on D1 and D2)
1
06021-033
D1
D2
CH1 2.0V CH2 2.0V M80ns 625MS/ s
1.6ns/p t
Figure 20. Switching Waveforms
(Break
-Before-Make, 50 Ω Pull-Up to V
A CH2 1.52V
on D1 and D2)
DD1
06021-034
Rev. A | Page 12 of 20
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V
A
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TEST CIRCUITS

V
OD
R
R
Figure 21. Driver Voltage Measurement
375
V
60
OD3
375
Figure 22. Driver Voltage Measurement
RTS
TxD
RxD
RE
V
DD1
GND
GALVANIC IS OLATION
V
1
DD2
GND
Figure 23. Supply-Current Measurement Test Circuit
V
TEST
2
V
OC
DE OUT
150
V
A
B
GND
DD2
06021-003
06021-004
195
110
195
2
A
R
B
LDIFF
C
L1
C
L2
6021-007
Figure 25. Driver Propagation Delay
GND
2
DE OUT
150
A
B
50pF
06021-008
RTS
TxD
RxD
RE
GALVANIC ISOLATIO N
GND
V
DD1
1
V
DD2
Figure 26. RTS to DE OUT Propagation Delay
CC
A
TxD
06021-005
RTS
Figure 27. Driver Enable/Disable
S1
B
50pF
110
V
OUT
S2
6021-009
GND
DE OUT
V
DD2
195
A
110
B
195
GND
2
V
CM (HF)
GND
2.2k
2
RTS
TxD
RxD
RE
GALVANIC IS OLATION
100nF
GND
V
1
DD2
100nF
V
DD1
Figure 24. High Frequency, Common-Mode Noise Test Circuit
V
RE
B
OUT
C
L
06021-010
Figure 28. Receiver Propagation Delay
RE
V
CC
R
L
C
V
L
OUT
S2
06021-011
F
,
V
22k
TEST2
110nF
TEST
V
HF
+1.5
S1
–1.5V
06021-006
RE IN
50
470nF
50
2
Figure 29. Receiver Enable/Disable
Rev. A | Page 13 of 20
ADM2485
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CIRCUIT DESCRIPTION

ELECTRICAL ISOLATION

In the ADM2485, electrical isolation is implemented on the logic side of the interface. Therefore, the part has two main sections: a digital isolation section and a transceiver section (see
Figure 30). Driver input and data enable, applied to the
xD and RTS pins, respectively, and referenced to logic ground
T (GND
), are coupled across an isolation barrier to appear at the
1
transceiver section referenced to isolated ground (GND
).
2
Similarly, the receiver output, referenced to isolated ground in the transceiver section, is coupled across the isolation barrier to appear at the RxD pin referenced to logic ground.

iCoupler Technology

The digital signals are transmitted across the isolation barrier using iCoupler technology. This technique uses chip-scale transformer windings to couple the digital signals magnetically from one side of the barrier to the other. Digital inputs are encoded into waveforms that are capable of exciting the primary transformer winding. At the secondary winding, the induced waveforms are then decoded into the binary value that was originally transmitted.
V
D1 D2
DD1
ENCODE
ENCODE
DECODE
1
ISOLATION
BARRIER
OSC
TxD
RTS
RxD
RE
DIGITAL ISOLATION
GND
Figure 30. ADM2485 Digital Isolation and Transceiver Sections
DECODE
DECODE
ENCODE
V
GND
DD2
2
D
R
TRANSCEIVER
A
B
DE OUT

TRUTH TABLES

Tabl e 1 0 and Tabl e 11 use the abbreviations found in Tabl e 9.
Table 9. Truth Table Abbreviations
Letter Description
H High level I Indeterminate L Low level X Irrelevant Z High impedance (off) NC Disconnected
06021-026
Table 10. Transmitting
Supply Status Inputs Outputs
V
DD1
V
DD2
RTS TxD A B DE OUT
On On H H H L H On On H L L H H On On L X Z Z L On Off X X Z Z L Off On X X Z Z L Off Off X X Z Z L
Table 11. Receiving
Supply Status Input Outputs
V
DD1
V
DD2
A − B
RE
RxD
On On >+0.2 V L or NC H On On <–0.2 V L or NC L On On −0.2 V < A − B < +0.2 V L or NC I On On Inputs open L or NC H On On X H Z On Off X L or NC H Off On X L or NC H Off Off X L or NC L

THERMAL SHUTDOWN

The ADM2485 contains thermal shutdown circuitry that protects the part from excessive power dissipation during fault conditions. Shorting the driver outputs to a low impedance source can result in high driver currents. The thermal sensing circuitry detects the increase in die temperature under this condition and disables the driver outputs. This circuitry is designed to disable the driver outputs when a die temperature of 150°C is reached. As the device cools, the drivers are re-enabled at a temperature of 140°C.

RECEIVER FAIL-SAFE INPUTS

The receiver input includes a fail-safe feature that guarantees a Logic high RxD output when the A and B inputs are floating or open-circuited.
Rev. A | Page 14 of 20
ADM2485
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MAGNETIC FIELD IMMUNITY

Because iCouplers use a coreless technology, no magnetic components are present and the problem of magnetic saturation of the core material does not exist. Therefore, iCouplers have essentially infinite dc field immunity. The following analysis defines the conditions under which this can occur. The ADM2485
3.3 V operating condition is examined because it represents the most susceptible mode of operation.
The limitation on the iC set by the condition in which the induced error voltage in the receiving coil (the bottom coil, in this case) is made sufficiently large, either to falsely set or reset the decoder. The voltage induced across the bottom coil is given by
V
=
dt
where, if the pulses at the transformer output are greater than
1.0 V in am
plitude:
β is the magnetic flux density (gauss). N is the number of turns in the receiving coil. r
is the radius of nth turn in the receiving coil (cm).
n
The decoder has a sensing threshold of about 0.5 V; therefore, t
here is a 0.5 V margin where induced voltages can be tolerated.
Given the geometry of the receiving coil and an imposed r
equirement that the induced voltage is, at most, 50% of the
0.5 V margin at the decoder, a maximum allowable magnetic field is calculated, as shown in
100
10
1
0.1
oupler ac magnetic field immunity is
2
; n = 1, 2 … N (1)
π
r
n
Figure 31.
For example, at a magnetic field frequency of 1 MHz, the maximum allowable magnetic field of 0.2 kGauss induces a voltage of 0.25 V at the receiving coil, which is about 50% of the sensing threshold and does not cause a faulty output transition. Similarly, if such an event occurs during a transmitted pulse and it is the worst-case polarity, it reduces the received pulse from >1.0 V to 0.75 V, still well above the 0.5 V sensing threshold of the decoder.
Figure 32 shows the magnetic flux density values in terms of more
familiar quantities, such as maximum allowable current
flow at given distances from the ADM2485 transformers.
1000
100
DISTANCE = 5mm
10
0
0.1
MAXIMUM ALL OWABLE CURRENT (kA)
0.01
DISTANCE = 100mm
1k 10k 100k 100M1M 10M
MAGNETIC FIELD FREQUENCY (Hz)
Figure 32. Maximum Allowable Current for
Vari
ous Current-to-ADM2485 Spacings
DISTANCE = 1m
06021-028
At combinations of strong magnetic field and high frequency, any loops formed by printed circuit board (PCB) traces could induce sufficiently large error voltages to trigger the thresholds of succeeding circuitry. Care must be taken in the layout of such traces to avoid this possibility.
FLUX DENSIT Y (kGAUSS)
0.01
MAXIMUM ALLOWABLE MAGNETIC
0.001 1k 10k 100k 100M1M 10M
Figure 31. Maximum Allowable External Magnetic Flux Density vs.
MAGNETIC F IELD FREQUENCY (Hz)
c Field Frequency
Magneti
6021-027
Rev. A | Page 15 of 20
ADM2485
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APPLICATIONS INFORMATION

PCB LAYOUT

The ADM2485 isolated RS-485 transceiver requires no external interface circuitry for the logic interfaces. Power supply bypassing is required at the input and output supply pins (see Figure 33).
Bypass capacitors are most conveniently connected between Pin 3 an V
d Pin 4 for V
. The capacitor value must be between 0.01 μF and 0.1 μF.
DD2
and between Pin 15 and Pin 16 for
DD1
The total lead length between both ends of the capacitor and the input power supply pin must not exceed 20 mm.
Bypassing between Pin 9 and Pin 16 is also recommended
nless the ground wires on the V
u
side are connected close to
DD2
the package.
D1 D2
GND
1
V
DD1
RxD
RE
RTS
TxD
Figure 33. Recommended Printed Circuit Board Layout
ADM2485
V
DD2
GND
2
GND
2
B A GND
2
DE OUT GND
2
6021-029
In applications involving high common-mode transients, care must be taken to ensure that board coupling across the isolation barrier is minimized. Furthermore, the board layout must be designed such that any coupling that does occur equally affects all pins on a given component side.
Failure to ensure this can cause voltage differentials between
ins exceeding the device absolute maximum ratings, thereby
p leading to latch-up or permanent damage.

TRANSFORMER SUPPLIERS

The transformer primarily used with the ADM2485 must be a center-tapped transformer winding. The turns ratio of the transformer must be set to provide the minimum required output voltage at the maximum anticipated load with the minimum input voltage.
ppliers.
su
Tabl e 1 2 shows ADM2485 transformer

APPLICATIONS DIAGRAM

The ADM2485 integrates a transformer driver that, when used with an external transformer and LDO, generates an isolated 5 V power supply, to be supplied between V
D1 and D2 of the ADM2485 drive the center-tapped
ransformer T1. A pair of Schottky diodes and a smoothing
T capacitor is used to create a rectified signal from the secondary winding. The ADP3330 linear voltage regulator provides a regulated 5 V power supply to the ADM2485 bus-side circuitry (V
), as shown in Figure 34.
DD2
When the ADM2485 is powered by 3.3 V on the logic side, a
:2.2CT Transformer T1 is required to step up the 3.3 V to
1CT 6 V, ensuring enough headroom for the ADP3330 LDO to output a regulated 5 V output.
If ADM2485 is powered by 5 V on the logic side, a 1CT:1.5CT T
ransformer T1 is required, ensuring enough headroom for the
ADP3330 LDO to output a regulated 5 V output.
ISOLATION BARRIER
1N5817
V
100nF
CC
10µF
MLC
T1
1N5817
V
CC
V
D1 D2 V
DD1
ADM2485
GND
1
Figure 34. Applications Diagram
DD2
GND
22µF
ISO 5V
2
and GND2.
DD2
ERR NR
IN
OUT
ADP3330
SD
GND
100nF
5V
10µF
06021-030
Table 12. Transformer Suppliers
Manufacturer Primary Voltage 3.3 V Primary Voltage 5 V
Coilcraft DA2304-AL DA2303-AL C&D Technologies 782485/35C 782485/55C
Rev. A | Page 16 of 20
ADM2485
C
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OUTLINE DIMENSIONS

10.50 (0.4134)
10.10 (0.3976)
BSC
9
7.60 (0.2992)
7.40 (0.2913)
8
10.65 (0.4193)
10.00 (0.3937)
2.65 (0.1043)
2.35 (0.0925)
SEATING PLANE
8° 0°
0.33 (0.0130)
0.20 (0.0079)
0 0
.
7
.
2
5
(
0
5
(
0
.
0
2
9
5
)
0
0
9
8
)
.
1.27 (0.0500)
0.40 (0.0157)
45°
032707-B
0.30 (0.0 118)
0.10 (0.0039)
OPLANARIT Y
0.10
16
1
1.27 (0.0500)
0.51 (0.0201)
0.31 (0.0122)
CONTROLL ING DIMENSIONS ARE IN MILLI METERS; INCH DIMENSI ONS (IN PARENTHESES) ARE ROUNDED-O FF MILLIMET ER EQUIVALENTS FOR REFERENCE ON LY AND ARE NOT APPROPRIATE FOR USE I N DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-013- AA
Figure 35. 16-Lead Standard Small Outline Package [SOIC_W]
Wide Body
(RW-16)
Dimensions shown in millimeters and (inches)

ORDERING GUIDE

Model Data Rate (Mbps) Temperature Range Package Description Package Option
ADM2485BRWZ ADM2485BRWZ-REEL7
1
Z = RoHS Compliant Part.
1
16 −40°C to +85°C 16-Lead SOIC_W RW-16
1
16 −40°C to +85°C 16-Lead SOIC_W RW-16
Rev. A | Page 17 of 20
ADM2485
www.BDTIC.com/ADI
NOTES
Rev. A | Page 18 of 20
ADM2485
www.BDTIC.com/ADI
NOTES
Rev. A | Page 19 of 20
ADM2485
www.BDTIC.com/ADI
NOTES
©2007 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06021-0-12/07(A)
Rev. A | Page 20 of 20
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