Datasheet ADM1232 Datasheet (ANALOG DEVICES)

Microprocessor

T

V5V

FEATURES

Pin-compatible with MAX1232 and Dallas DS1232 Adjustable precision voltage monitor with 4.5 V and

4.75 V options

Adjustable strobe monitor with 150 ms, 600 ms, or

1.2 sec options No external components Specified from −40°C to +85°C

APPLICATIONS

Microprocessor systems Portable equipment Computers Controllers Intelligent instruments Automotive systems

GENERAL DESCRIPTION

The ADM1232 is pin-compatible with the MAX1232, DS1232LP, and DS1232. The Analog Devices, Inc., ADM1232 is a microprocessor monitoring circuit that can monitor the following:

• Microprocessor supply voltage

• Whether a microprocessor has locked up

• External interrupts

The ADM1232 is available in four packages: an 8-lead MSOP (RM-8), an 8-lead PDIP (N-8), a 16-lead wide SOIC (RW-16), and an 8-lead narrow SOIC (R-8).

V

CC

OLERANCE

PB RESET

TD

GND

GND TD TOLERANCE

Supervisory Circuit

ADM1232

FUNCTIONAL BLOCK DIAGRAM

5%/10%

TOLERANCE

SELECT

RESET

VREF

DEBOUNCE

WATCHDOG

TIME-BAS E

SELECT

Figure 1.

5

10kΩ

ADM1232

STROBE

RESET

Figure 2. Typical Supply Monitoring Application

GENERATOR

WATCHDOG

TIMER

ADM1232

MICROPROCESSOR

I/O

RESET

STROBE

07522-002

7522-001

Rev. C

Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.

ADM1232

REVISION HISTORY

12/08—Rev. B to Rev. C

Updated Format .................................................................. Universal

Changes to Table 2 ............................................................................ 4

Added Thermal Resistance Section ............................................... 4

Updated Outline Dimensions ......................................................... 7

Changes to Ordering Guide ............................................................ 9

12/97—Rev. A to Rev. B

Changes to Specifications Section .................................................. 2

x/97—Rev. 0 to Rev. A

Changes to Specifications Section .................................................. 2

7/97—Revision 0: Initial Version

Pin Configurations and Function Descriptions ............................5

Circuit Information ...........................................................................6

PB RESET

STROBE

Tolerance ........................................................................................6

RESET and

Outline Dimensions ..........................................................................7

Ordering Guide .............................................................................9

.......................................................................................6

Timeout Selection .........................................................6

RESET

Outputs .........................................................6

Rev. C | Page 2 of 12

ADM1232

SPECIFICATIONS

VCC = full operating range, TA = T

Table 1.

Parameter Min Typ Max Unit Test Conditions/Comments

TEMPERATURE −40 +85 °C TA = T POWER SUPPLY

Voltage 4.5 5.0 5.5 V

Current 20 50 μA VIL, VIH = CMOS levels. 200 500 μA VIL, VIH = TTL levels. STROBE AND PB RESET INPUTS

Input High Level 2.0 VCC + 0.3 V

Input Low Level −0.3 +0.8 V INPUT LEAKAGE CURRENT

(STROBE, TOLERANCE)

TD 1.6 μA OUTPUT CURRENT

RESET 8 10 mA VCC is at 4.5 V to 5.5 V.

RESET/RESET

OUTPUT VOLTAGE

RESET/RESET

RESET/RESET High Level

RESET/RESET Low Level

1 V OPERATION

RESET Output Voltage VCC − 0.1 V When sourcing less than 50 μA.

RESET Output Voltage

VCC TRIP POINT

5% 4.5 4.62 4.74 V TOLERANCE = GND.

10% 4.25 4.37 4.49 V TOLERANCE = VCC. CAPACITANCE

Input (STROBE, TOLERANCE)

Output (RESET, RESET)

PB RESET

Time 20 ms

Delay 1 4 20 ms RESET ACTIVE TIME 250 610 1000 ms

STROBE

Pulse Width 70 ns

Timeout Period 62.5 150 250 ms TD = 0 V. 250 600 1000 ms TD = floating. 500 1200 2000 ms TD = VCC. VCC

Fall Time 10 μs Guaranteed by design.

Rise Time 0 μs Guaranteed by design. VCC FAIL DETECT TO RESET

OUTPUT DELAY

50 μs After VCC falls below the set tolerance voltage (see Figure 9). 250 610 1000 ms After VCC rises above the set tolerance voltage.

MIN

to T

, unless otherwise noted.

MAX

MIN

to T

MAX

.

−1.0 +1.0 μA

−8 −12 mA V

V

− 0.5 VCC − 0.1 V

CC

is at 4.5 V to 5.5 V.

CC

When sourcing less than 500 μA, RESET remains within

0.5 V of V

on power-down until VCC drops below 2.0 V.

CC

When sinking less than 500 μA, RESET remains within

0.5 V of GND on power-down until V

0.4 V

2.4 V

0.1 V When sinking less than 50 μA.

5 pF T 7 pF T

= 25°C.

A

= 25°C.

A

PB RESET

must be held low for a minimum of 20 ms to

guarantee a reset.

RESET and RESET

are logically correct.

drops below 2.0 V.

CC

Rev. C | Page 3 of 12

ADM1232

ABSOLUTE MAXIMUM RATINGS

TA = 25°C unless otherwise noted.

Table 2.

Parameter Rating

VCC 5.5 V Logic Inputs −0.3 V to VCC + 0.3 V Storage Temperature Range −65°C to +150°C Lead Temperature (Soldering, 10 sec) 300°C

Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C

Power Dissipation

N-81 1000 mW RW-16, RM-82 900 mW R-82 900 μW

1

Derate by 13.5 mW/°C above 25°C.

2

Derate by 12 mW/°C above 25°C.

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages.

Table 3. Thermal Resistance

Package Type θJA Unit

8-Lead PDIP (N-8) 100 °C/W 16-Lead SOIC_W (RW-16) 73 °C/W 8-Lead MSOP (RM-8) 206 °C/W 8-Lead SOIC_N (R-8) 153 °C/W

ESD CAUTION

Rev. C | Page 4 of 12

ADM1232

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

NC

1

PB RESET

TOLERANCE

2

3

NC

4

TD

NC

5

6

7

NC

GND

8

NC = NO CONNECT

ADM1232

TOP VIEW

(Not to Scal e)

Figure 3. RW-16 Pin Configuration

16

15

14

13

12

11

10

9

NC

V

CC

NC

STROBE

NC

RESET

NC

RESET

07522-003

TD

GND

1

ADM1232

2

3

TOP VIEW

(Not to Scale)

4

PB RESET

TOLERANCE

Figure 4. RM-8 Pin Configuration

PB RESET

TOLERANCE

Figure 5. N-8 and R-8 Pin Configuration

TD

GND

1

ADM1232

2

3

TOP VIEW

(Not to Scale)

4

Table 4. Pin Function Descriptions

Pin No.

N-8, R-8,

RW-16

1, 3, 5, 7,

RM-8

NC No Connection.

Mnemonic Description

10, 12, 14, 16

2 1

PB RESET

Push-Button Reset Input. This debounced input ignores pulses of less than 1 ms and is guaranteed to respond to pulses greater than 20 ms.

4 2 TD

Time Delay Set. This input allows the user to select the maximum amount of time that the ADM1232 allows the STROBE

input to remain inactive—that is, STROBE is not receiving any high-to-low transitions—without forcing the ADM1232 to generate a RESET pulse. See the section, , and the Specifications Figure 8 STROBE

6 3 TOLERANCE

Tolerance Input. This input determines how much the supply voltage is allowed to decrease (as a percentage) before a RESET is asserted. Connect this pin to V

8 4 GND 0 V Ground Reference for All Signals. 9 5 RESET

Active High Logic Output. This pin is asserted when any of the following events occurs: V

decreases below the amount specified by the TOLERANCE input; when PB RESET is forced low;

CC

if there are no high-to-low transitions within the limits set by TD at STROBE; and during power-up.

11 6 13 7

RESET STROBE

Inverse of RESET. This pin has an open-drain output. The STROBE input is used to monitor the activity of a microprocessor. If there are no high-to-low

transitions within the time specified by TD, a reset is asserted.

15 8 VCC Power Supply Input, 5 V.

8

V

7

STROBE

RESET

6

RESET

5

V

8

STROBE

7

RESET

6

5

RESET

CC

07522-004

CC

07522-005

Timeout Selection section.

for 10% and to GND for 5%.

CC

Rev. C | Page 5 of 12

ADM1232

CIRCUIT INFORMATION

PB RESET STROBE TIMEOUT SELECTION

PB RESET

The

input makes it possible to manually reset a system using either a standard push-button switch or a logic low input. An internal debounce circuit provides glitch immunity when used with a switch, reducing the effects of glitches on the line. The debounce circuit is guaranteed to cause the ADM1232 to assert a reset if

PB RESET

is brought low for more than 20 ms and is guaranteed to ignore low inputs of less than 1 ms.

V

CC

V

CC

ADM1232

GND TOLERANCE

TD

STROBE

RESET

MICROPROCESSOR

I/O

RESETPB RESET

06

07522-0

Figure 6. Typical Push-Button Reset Application

PB RESET TIME

V

IL

PB RESET

DELAY

V

IH

RESET ACTIVE

TIME

PB RESET

TD (time delay) set is used to set the strobe timeout period. The strobe timeout period is the maximum time between high-tolow transitions that

STROBE

accepts before a reset is asserted

(see ). The strobe timeout settings are listed in . Figure 8 Table 5

Table 5. Strobe Timeout Settings

Condition Min Typ Max Unit

TD = 0 V 62.5 150 250 ms TD = Floating 250 600 1000 ms TD = VCC 500 1200 2000 ms

STROBE

PULSE WIDTH

STROBE

STROBE TIMEOUT PERIOD

STROBE

Figure 8.

Parameters

07522-008

V

CC

RESET OUTPUT DELAY

HEN V

CC

RESET

5V

IS FALLING

4.5V (5% TRIP POINT)

4.25V (10% TRIP POINT)

5V

RESET OUTPUT DE LAY WHEN VCC IS RISINGW

RESET

Figure 7.

PB RESET

07

07522-0

RESET

TOLERANCE

Figure 9. Reset Output Delay

07522-009

The TOLERANCE input is used to determine the level at which

can vary below 5 V without the ADM1232 asserting a reset.

V

CC

Connecting TOLERANCE to GND selects a −5% tolerance level and causes the ADM1232 to generate a reset if V

4.75 V. If TOLERANCE is connected to V

CC

falls below

CC

, a −10% tolerance level is selected, which causes the ADM1232 to generate a reset if V

falls below 4.5 V. See the parameters for the VCC trip point

CC

in the Specifications section for more information.

RESET AND RESET OUTPUTS

RESET is capable of sourcing and sinking current, whereas RESET

is an open-drain MOSFET that sinks current only.

Therefore, it is necessary to pull this output high.

Rev. C | Page 6 of 12

ADM1232

OUTLINE DIMENSIONS

10.50 (0.4134)

10.10 (0.3976)

BSC

9

7.60 (0.2992)

7.40 (0.2913)

8

10.65 (0.4193)

10.00 (0.3937)

2.65 (0.1043)

2.35 (0.0925)

SEATING PLANE

8° 0°

0.33 (0.0130)

0.20 (0.0079)

0 0

.

7

.

2

5

(

0

5

(

0

.

0

2

9

5

)

0

9

8

)

.

1.27 (0.0500)

0.40 (0.0157)

45°

032707-B

0.30 (0.0 118)

0.10 (0.0039)

COPLANARITY

0.10

16

1

1.27 (0.0500)

0.51 (0.0201)

0.31 (0.0122)

CONTROLL ING DIMENS IONS ARE IN MILLIM ETERS; INCH DI MENSIONS (IN PARENTHESES) ARE ROUNDED-O FF MIL LIMETE R EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRI ATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-013- AA

Figure 10. 16-Lead Standard Small Outline Package [SOIC_W]

Wide Body

(RW-16)

Dimensions shown in millimeters and (inches)

3.20

3.00

2.80

8

5

3.20

3.00

2.80

1

5.15

4.90

4.65

4

PIN 1

0.65 BSC

0.95

0.85

0.75

0.15

0.38

0.00

0.22

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-187-AA

1.10 MAX

SEATING PLANE

0.23

0.08

8° 0°

0.80

0.60

0.40

Figure 11. 8-Lead Mini Small Outline Package [MSOP]

(RM-8)

Dimensions shown in millimeters

Rev. C | Page 7 of 12

ADM1232

0.210 (5.33)

0.150 (3.81)

0.130 (3.30)

0.115 (2.92)

0.022 (0.56)

0.018 (0.46)

0.014 (0.36)

0.400 (10.16)

0.365 (9.27)

0.355 (9.02)

8

1

0.100 (2.54)

MAX

0.070 (1.78)

0.060 (1.52)

0.045 (1.14)

CONTROLL ING DIMENS IONS ARE IN INCHES; MILLIMETER DI MENSIONS (IN PARENTHESES) ARE ROUNDED-OF F INCH EQUI VALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRI ATE FOR USE IN DESIGN. CORNER LEADS MAY BE CONFIGURED AS WHOL E OR HALF LEADS.

5

0.280 (7.11)

0.250 (6.35)

0.240 (6.10)

4

BSC

0.015 (0.38) MIN

SEATING PLANE

0.005 (0.13) MIN

COMPLIANT TO JEDEC STANDARDS MS-001

0.060 (1.52) MAX

0.015 (0.38) GAUGE

PLANE

0.325 (8.26)

0.310 (7.87)

0.300 (7.62)

0.430 (10.92) MAX

0.195 (4.95)

0.130 (3.30)

0.115 (2.92)

0.014 (0.36)

0.010 (0.25)

0.008 (0.20)

070606-A

Figure 12. 8-Lead Plastic Dual In-Line Package [PDIP]

Narrow Body

(N-8)

Dimensions shown in inches and (millimeters)

5.00 (0.1968)

4.80 (0.1890)

4.00 (0.1574)

3.80 (0.1497)

0.25 (0.0098)

0.10 (0.0040)

COPLANARITY

0.10

CONTROLL ING DIMENSI ONS ARE IN MILLIMETERS; INCH DI MENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRI ATE FOR USE IN DESIGN.

85

1

1.27 (0.0500)

SEATING

PLANE

COMPLIANT TO JEDEC STANDARDS MS-012-A A

BSC

6.20 (0.2441)

5.80 (0.2284)

4

1.75 (0.0688)

1.35 (0.0532)

0.51 (0.0201)

0.31 (0.0122)

8° 0°

0.25 (0.0098)

0.17 (0.0067)

0.50 (0.0196)

0.25 (0.0099)

1.27 (0.0500)

0.40 (0.0157)

45°

012407-A

Figure 13. 8-Lead Standard Small Outline Package [SOIC_N]

Narrow Body

(R-8)

Dimensions shown in millimeters and (inches)

Rev. C | Page 8 of 12

ADM1232

ORDERING GUIDE

Temperature

Model

Range Package Description

ADM1232ARM −40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 M2A ADM1232ARM-REEL −40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 M2A ADM1232ARM-REEL7 −40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 M2A ADM1232ARMZ ADM1232ARMZ-REEL ADM1232ARMZ-REEL7

1

−40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 M4W

1

−40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 M4W

1

−40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 M4W

ADM1232AN −40°C to +85°C 8-Lead Plastic Dual In-Line Package [PDIP] N-8 ADM1232ANZ

1

−40°C to +85°C 8-Lead Plastic Dual In-Line Package [PDIP] N-8

ADM1232ARW −40°C to +85°C 16-Lead Standard Small Outline Package [SOIC_W], Wide Body RW-16 ADM1232ARW-REEL −40°C to +85°C 16-Lead Standard Small Outline Package [SOIC_W], Wide Body RW-16 ADM1232ARW-REEL7 −40°C to +85°C 16-Lead Standard Small Outline Package [SOIC_W], Wide Body RW-16

1

ADM1232ARWZ ADM1232ARWZ-REEL ADM1232ARWZ-REEL7

−40°C to +85°C 16-Lead Standard Small Outline Package [SOIC_W], Wide Body RW-16

1

−40°C to +85°C 16-Lead Standard Small Outline Package [SOIC_W], Wide Body RW-16

1

−40°C to +85°C 16-Lead Standard Small Outline Package [SOIC_W], Wide Body RW-16

ADM1232ARN −40°C to +85°C 8-Lead Standard Small Outline Package [SOIC_N] R-8 ADM1232ARN-REEL −40°C to +85°C 8-Lead Standard Small Outline Package [SOIC_N] R-8 ADM1232ARN-REEL7 −40°C to +85°C 8-Lead Standard Small Outline Package [SOIC_N] R-8 ADM1232ARNZ ADM1232ARNZ-REEL ADM1232ARNZ-REEL7

1

Z = RoHS Compliant Part.

1

−40°C to +85°C 8-Lead Standard Small Outline Package [SOIC_N] R-8

1

−40°C to +85°C 8-Lead Standard Small Outline Package [SOIC_N] R-8

1

−40°C to +85°C 8-Lead Standard Small Outline Package [SOIC_N] R-8

Package Options Branding

Rev. C | Page 9 of 12

ADM1232

NOTES

Rev. C | Page 10 of 12

ADM1232

NOTES

Rev. C | Page 11 of 12

ADM1232

NOTES

Rev. C | Page 12 of 12

Datasheet ADM1232 Datasheet (ANALOG DEVICES)

Specifications and Main Features

Frequently Asked Questions

User Manual

FEATURES

APPLICATIONS

GENERAL DESCRIPTION

FUNCTIONAL BLOCK DIAGRAM

TABLE OF CONTENTS

REVISION HISTORY

SPECIFICATIONS

ABSOLUTE MAXIMUM RATINGS

THERMAL RESISTANCE

ESD CAUTION

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

CIRCUIT INFORMATION

PB RESET STROBE TIMEOUT SELECTION

PB RESET

TOLERANCE

OUTLINE DIMENSIONS

ORDERING GUIDE