0.8% Accurate Quad Voltage Monitor
FEATURES
Powered from 2.7 V to 5.5 V on the VCC pin
Monitors 4 supplies via 0.8% accurate comparators
4 inputs can be programmed to monitor different voltage
levels with external resistor dividers
3 open-drain enable outputs (OUT1, OUT2, and OUT3)
Open-drain power-good output (PWRGD)
Internal 190 ms delay associated with assertion of PWRGD
10-lead MSOP
APPLICATIONS
Monitor and alarm functions
Telecommunications
Microprocessor systems
PC/servers
GENERAL DESCRIPTION
The ADM1184 is an integrated, 4-channel voltage-monitoring
device. A 2.7 V to 5.5 V power supply is required on the VCC pin
to power the device.
Four precision comparators monitor four voltage rails.
Each comparator has a 0.6 V reference with a worst-case
accuracy of 0.8%. Resistor networks that are external to the
VIN1, VIN2, VIN3, and VIN4 pins set the trip points for
the monitored supply rails.
The ADM1184 has four open-drain outputs. OUT1 to OUT3
can be used to enable power supplies, and PWRGD is a
common power-good output.
ADM1184
FUNCTIONAL BLOCK DIAGRAM
POWER AND
ADM1184
VIN1
REF = 0.6V
VIN2
REF = 0.6V
VIN3
REF = 0.6V
VIN4
REF = 0.6V
REFERENCE
GENERATOR
GND
Figure 1.
OUT1 to OUT3 are dependent on their associated VINx input
(that is, VIN1, VIN2, or VIN3). If a supply monitored by VINx
drops below its programmed threshold, the associated OUTx pin
and PWRGD are disabled.
PWRGD is a common power-good output indicating the status
of all monitored supplies. There is an internal 190 ms (typical)
delay associated with the assertion of the PWRGD output. If
VIN1, VIN2, VIN3, or VIN4 drops below its programmed
threshold, PWRGD is deasserted immediately.
The ADM1184 is available in a 10-lead mini small outline
package (MSOP).
INTERNAL
LOGIC
REF = 0.6V
OUT1
OUT2
OUT3
PWRGD
07352-001
Rev. 0
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rights of third parties that may result from its use. Specifications subject to change without notice. No
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Fax: 781.461.3113 ©2008 Analog Devices, Inc. All rights reserved.
ADM1184
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution.................................................................................. 4
REVISION HISTORY
2/08—Revision 0: Initial Version
Pin Configuration and Function Descriptions..............................5
Typical Perf or m an c e Charac t e r istics ..............................................6
Theory of Operation .........................................................................9
Input Configuration......................................................................9
Output Configuration...................................................................9
Voltage Monitoring and Sequencing Application.................. 11
Outline Dimensions ....................................................................... 12
Ordering Guide .......................................................................... 12
Rev. 0 | Page 2 of 12
ADM1184
SPECIFICATIONS
VCC = 2.7 V to 5.5 V, TA = −40°C to +85°C.
Table 1.
Parameter Min Typ Max Unit Conditions
VCC Pin
Operating Voltage Range, V
Supply Current, I
VCC
CC
VIN1 to VIN4 (VINx) Pins
Input Current, I
Input Threshold, V
VINLEAK
TH
OUT1 to OUT3 (OUTx), PWRGD Pins
Output Low Voltage, V
OUTL
0.4 V VCC = 1 V, I
Leakage Current, I
ALERT
VCC that Guarantees Valid Outputs 1 V
TIMING DELAYS Refer to the timing diagrams in Figure 18 and Figure 19
VIN1 to OUT1, VIN2 to OUT2, VIN3 to OUT3
Low-to-High Propagation Delay 30 μs VCC = 3.3 V
High-to-Low Propagation Delay, All Inputs 30 μs VCC = 3.3 V
All Inputs High to PWRGD Rising Delay 100 190 280 ms VCC = 3.3 V
2.7 3.3 5.5 V
24 80 μA
−20 +20 nA V
VINx
= 0.7 V
0.5952 0.6000 0.6048 V
0.4 V VCC = 2.7 V, I
−1 +1 μA
All outputs are guaranteed to be either low or to give
a valid output level from V
= 2 mA
SINK
= 100 μA
SINK
= 1 V
CC
Rev. 0 | Page 3 of 12
ADM1184
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 2.
Parameter Rating
VCC Pin −0.3 V to +6 V
VINx Pins −0.3 V to +6 V
OUTx, PWRGD Pins −0.3 V to +6 V
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −40°C to +85°C
Lead Temperature Soldering (10 sec) 300°C
Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type θ
10-Lead MSOP 137.5 °C/W
JA
Unit
ESD CAUTION
Rev. 0 | Page 4 of 12