Analog Devices ADM1032ARM, ADM1032AR Datasheet

1C Remote and Local
a
FEATURES On-Chip and Remote Temperature Sensing Offset Registers for System Calibration
0.125C Resolution/1C Accuracy on Remote Channel 1C Resolution/3C Accuracy on Local Channel Fast (Up to 64 Measurements per Second) 2-Wire SMBus Serial Interface Supports SMBus Alert Programmable Over/Under Temperature Limits Programmable Fault Queue Over-Temperature Fail-Safe THERM Output Programmable THERM Limits Programmable THERM Hysteresis 170 A Operating Current
5.5 A Standby Current 3 V to 5.5 V Supply Small 8-Lead SO and Micro_SO Package
APPLICATIONS Desktop Computers Notebook Computers Smart Batteries Industrial Controllers Telecomms Equipment Instrumentation Embedded Systems

FUNCTIONAL BLOCK DIAGRAM

System Temperature Monitor
ADM1032

PRODUCT DESCRIPTION

The ADM1032 is a dual-channel digital thermometer and under/over temperature alarm, intended for use in personal computers and thermal management systems. The higher 1°C accuracy offered allows systems designers to safely reduce temperature guardbanding and increase system performance. The device can measure the temperature of a microprocessor using a diode-connected NPN or PNP transistor, which may be provided on-chip or can be a low-cost discrete device such as the 2N3906. A novel measurement technique cancels out the absolute value of the transistor’s base emitter voltage, so that no calibration is required. The second measurement channel mea­sures the output of an on-chip temperature sensor, to monitor the temperature of the device and its environment.
The ADM1032 communicates over a two-wire serial interface compatible with System Management Bus (SMBus) standards. Under and over temperature limits can be programmed into the device over the serial bus, and an ALERT output signals when the on-chip or remote temperature measurement is out of range. This output can be used as an interrupt, or as an SMBus alert. The THERM output is a comparator output that allows CPU clock throttling or on/off control of a cooling fan.
*
ON-CHIP
TEMPERATURE
SENSOR
D+
ANALOG
D–
Pentium is a registered trademark of Intel Corporation. *Patents 5,982,221, 6,097,239, 6,133,753, 6,169,442, 5,867,012.
MUX
BUSY
EXTERNAL DIODE OPEN-CIRCUIT
ADM1032
V
DD
A-TO-D
CONVERTER
GND
LOCAL TEMPERATURE
VALUE REGISTER
RUN/STANDBY
REMOTE TEMPERATURE
VALUE REGISTER
REMOTE OFFSET
REGISTER
REV. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
ADDRESS POINTER
REGISTER
CONVERSION RATE
REGISTER
LOCAL TEMPERATURE
LOW-LIMIT REGISTER
LOCAL TEMPERATURE
HIGH-LIMIT REGISTER
LIMIT
COMPARATOR
DIGITAL MUX
DIGITAL MUX
STATUS REGISTER
SMBUS INTERFACE
SDATA
REMOTE TEMPERATURE
LOW-LIMIT REGISTER
REMOTE TEMPERATURE
HIGH-LIMIT REGISTER
LOCAL THERM LIMIT
REGISTER
EXTERNAL THERM LIMIT
REGISTER
CONFIGURATION
REGISTER
SCLK
INTERRUPT
MASKING
ALERT
THERM
ADM1032–SPECIFICATIONS
(TA = T
MIN
to T
, VDD = V
MAX
MIN
to V
, unless otherwise noted.)
MAX
Parameter Min Typ Max Unit Test Conditions/Comments
POWER SUPPLY
Supply Voltage, V Average Operating Supply Current, I
DD
CC
3.0 3.30 5.5 V 170 215 µA 0.0625 Conversions/Sec Rate
1
5.5 10 µA Standby Mode
Undervoltage Lockout Threshold 2.35 2.55 2.8 V V
Input, Disables ADC, Rising Edge
DD
Power-On Reset Threshold 1 2.4 V
TEMPERATURE-TO-DIGITAL CONVERTER
Local Sensor Accuracy ± 1 ± 3 °C0 ≤ TA 100°C, VCC = 3 V to 3.6 V Resolution 1 °C Remote Diode Sensor Accuracy ± 1 °C60°C ≤ T
± 3 °C0°C T
100°C, VCC = 3 V to 3.6 V
D
120°C
D
Resolution 0.125 °C Remote Sensor Source Current 230 µA High Level, Note 2
13 µA Low Level, Note 2
Conversion Time 35.7 142.8 ms From Stop Bit to Conversion Complete
(Both Channels) One-Shot Mode with Averaging Switched On
5.7 22.8 ms One-Shot Mode with Averaging Off
(i.e., Conversion Rate = 32 or 64 Conversions per Second)
OPEN-DRAIN DIGITAL OUTPUTS (THERM, ALERT)
Output Low Voltage, V
OL
High Level Output Leakage Current, I
SMBus INTERFACE
Logic Input High Voltage, V
2
IH
OH
0.4 V I
0.1 1 µAV
= –6.0 mA
OUT
= V
OUT
2.1 V VDD = 3 V to 5.5 V
DD
2
2
SCLK, SDATA
Logic Input Low Voltage, V
IL
0.8 V VDD = 3 V to 5.5 V Hysteresis 500 mV SCLK, SDATA SMBus Output Low Sink Current 6 mA SDATA Forced to 0.6 V ALERT Output Low Sink Current 1 mA ALERT Forced to 0.4 V Logic Input Current, I
, I
IH
IL
–1 +1 µA SMBus Input Capacitance, SCLK, SDATA 5 pF SMBus Clock Frequency 100 kHz SMBus Timeout 25 64 ms Note 3 SMBus Clock Low Time, t SMBus Clock High Time, t SMBus Start Condition Setup Time, t SMBus Start Condition Hold Time, t
LOW
HIGH
SU:STA
HD:STA
4.7 µst
4 µst
4.7 µs
4 µs Time from 10% of SDATA to 90%
between 10% Points
LOW
between 90% Points
HIGH
of SCLK
SMBus Stop Condition Setup Time, t
SU:STO
4 µs Time from 90% of SCLK to 10%
of SDATA
SMBus Data Valid to SCLK Rising Edge 250 ns Time for 10% or 90% of SDATA to
Time, t
SU:DAT
SMBus Data Hold Time, t SMBus Bus Free Time, t
BUF
HD:DAT
300 µs
4.7 µs Between Start/Stop Condition
10% of SCLK
SCLK Falling Edge to SDATA 1 µs Master Clocking in Data
Valid Time, t SCLK, SDATA Rise Time, t SCLK, SDATA Fall Time, t
NOTES
1
See Table VI for information on other conversion rates.
2
Guaranteed by Design, not production tested.
3
The SMBus timeout is a programmable feature. By default it is not enabled. Details on how to enable it are available in the SMBus section of this data sheet.
Specifications subject to change without notice.
VD,DAT
R
F
1 µs 300 ns
–2–
REV. 0
ADM1032

ABSOLUTE MAXIMUM RATINGS*

Positive Supply Voltage (VDD) to GND . . . . . . –0.3 V, +5.5 V
D+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to V
+ 0.3 V
DD
D– to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.6 V
SCLK, SDATA, ALERT . . . . . . . . . . . . . . . . –0.3 V to +5.5 V
THERM . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to V
+ 0.3 V
DD
Input Current, SDATA, THERM . . . . . . . . . . . –1, +50 mA
THERMAL CHARACTERISTICS
8-Lead SO Package
θ
= 121°C/W
JA
8-Lead Micro_SO Package
= 142°C/W
θ
JA
PIN CONFIGURATION
Input Current, D– . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±1 mA
ESD Rating, All Pins (Human Body Model) . . . . . . >1000 V
Maximum Junction Temperature (T
max) . . . . . . . . . 150°C
J
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
IR Reflow Peak Temp . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
Lead Temp (Soldering 10 sec) . . . . . . . . . . . . . . . . . . . 300°C
*Stresses above those listed under Absolute Maximum Ratings may cause
permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
V
THERM
DD
D+
D–
1
2
ADM1032
TOP VIEW
3
(Not to Scale)
4
8
7
6
5
SCLK
SDATA
ALERT
GND

ORDERING GUIDE

Temperature Package Package Branding SMBus
Model Range Description Option Information Addr
ADM1032AR 0°C to 120°C 8-Lead SO Package SO-8 1032AR 4C
ADM1032ARM 0°C to 120°C 8-Lead Micro_SO Package RM-8 T2A 4C
SCLK
SDATA
t
t
BUF
PS
HD;STA
t
LOW
t
R
t
HD;DAT
t
HIGH
t
F
t
SU;DAT
t
HD;STA
t
SU;STA
S
t
SU;STO
P
Figure 1. Diagram for Serial Bus Timing
PIN FUNCTION DESCRIPTIONS
Pin
No. Mnemonic Description
1V
DD
Positive Supply, 3 V to 5.5 V. 2 D+ Positive Connection to Remote Temperature Sensor. 3 D– Negative Connection to Remote Temperature Sensor. 4 THERM Open-drain output that can be used to turn a fan on/off or throttle a CPU clock in the event of an over-
temperature condition. Requires pull-up to V
DD
.
5 GND Supply Ground Connection 6 ALERT Open-Drain Logic Output Used as Interrupt or SMBus Alert. 7 SDATA Logic Input/Output, SMBus Serial Data. Open-Drain Output. Requires pull-up resistor. 8 SCLK Logic Input, SMBus Serial Clock. Requires pull-up resistor.
REV. 0
–3–
ADM1032–Typical Performance Characteristics
20
16
12
8
4
0
4
8
TEMPERATURE ERROR C
12
16
D+ TO GND
D+ TO V
DD
0 10 100
LEAKAGE RESISTANCE – M
TPC 1. Temperature Error vs. Leakage Resistance
12
10
8
6
4
TEMPERATURE ERROR – C
2
0
10 1M
= 250mV p-p
V
IN
= 100mV p-p
V
IN
FREQUENCY – Hz
1.0
0.5
0
TEMPERATURE ERROR – C
–0.5
0 20406080100120
TEMPERATURE – C
TPC 2. Temperature Error vs. Actual Temperature Using 2N3906
18
16
14
12
10
8
6
4
TEMPERATURE ERROR – C
2
0
1 6 11 16 21 26 31
CAPACITANCE – nF
36
13
11
9
7
5
3
TEMPERATURE ERROR – C
1
–1
100k 100M1M
V
= 40mV p-p
IN
V
= 10mV p-p
IN
FREQUENCY – Hz
10M
TPC 3. Temperature Error vs. Differential Mode Noise Frequency
2.0
1.5
1.0
= 5V
V
0.5
SUPPLY CURRENT – A
0
0.01
DD
VDD = 3V
0.1 1 10 100 CONVERSION RATE – Hz
TPC 4. Temperature Error vs. Power Supply Noise Frequency
12
10
8
6
4
TEMPERATURE ERROR – C
2
0 100k 1M 10M 100M
VIN = 100mV p-p
VIN = 50mV p-p
VIN = 25mV p-p
FREQUENCY – Hz
TPC 7. Temperature Error vs.
Common-Mode Noise Frequency
TPC 5. Temperature Error vs. Capacitance between D+ and D–
80
70
60
50
40
30
20
SUPPLY CURRENT – A
10
0
1 5 10 25 50 75 100
SCLK FREQUENCY – kHz
V
5V
DD =
3.3V
V
DD =
250 500 750 1000
TPC 8. Standby Supply Current vs. Clock Frequency
TPC 6. Operating Supply Current vs. Conversion Rate
40
35
30
25
20
15
10
5
STANDBY SUPPLY CURRENT – A
0
0
1.5 2.50.5 1.0 3.0 5.03.5 4.0 4.52.0
SUPPLY VOLTAGE – V
TPC 9. Standby Supply Current vs. Supply Voltage
–4–
REV. 0
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