Reset Input, Reset Outputs
Thermal Interrupt (THERM) Output
Shutdown Mode to Minimize Power Consumption
Limit Comparison of all Monitored Values
APPLICATIONS
Network Servers and Personal Computers
Telecommunications Equipment
Test Equipment and Measuring Instruments
ADD/
NTESTOUT
ADDRES S
POINTER
REGIST ER
8KBYTE S
E2PROM
TEMP E RA TUR E
CONFIGURATION
REGIST ER
SDA3.3V M AIN
SERIAL B US
INTERFA C E
3.3VSTB Y
SCL
V
CC
PWM REGISTER
AND CONTROLLER
VALUE AND
LIMIT
REGISTE RS
LIMIT
COMPA RA TOR S
INT E R R U P T
STATUS
REGISTE RS
INT M AS K
REGISTE RS
GENERATOR
GENERATOR
3.3V M AIN
RESET
3.3V STBY
RESET
RESET IN
ADM1026
INTE RR U P T
MASKING
8-BIT ADC
CONFIGURATION
BANDGAP
REGISTE RS
ANALOG
OUTPUT REGISTE R
AND 8-BIT DAC
TO GPIO
REGISTERS
RESETM AIN
RESETST BY
PWM
CI
INT
GPIO16/THERM
DAC
AGND
REV. PrP 9/01
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
The ADM1026 is a complete system hardware monitor for microprocessor-based systems, providing measurement and limit comparison of various
system parameters. The ADM1026 has up to 19 analog measurement channels. Fifteen analog voltage inputs are provided, of which five are dedicated to monitoring +3.3V, +5V and ±12V power supplies and the processor core voltage. The ADM1026 can monitor two further power-supply
voltages by measuring its own analog and digital V
can be configured as general-purpose analog inputs to measure 0 to 2.5V, or as a second temperature sensing input.The 8 remaining inputs are
general-purpose analog inputs with a range of 0 to 2.5V or 0 to 3V. Finally, the ADM1026 has on on-chip temperature sensor.
The ADM1026 has eight pins that can be configured for fan-speed measurement or as general purpose logic I/O pins. A further 8 pins are dedicated to general-purpose logic I/O. An additional pin can be configured as a general purpose I/O or as the bidirectional THERM pin.
Measured values can be read out via a 2-wire serial System Management Bus, and values for limit comparisons can be programmed in over the
same serial bus. The high-speed successive-approximation ADC allows frequent sampling of all analog channels to ensure a fast interrupt response
to any out-of-limit measurement.
The ADM1026’s 3V to 5.5V supply voltage range, low supply current, and serial interface make it ideal for a wide range of applications. These
include hardware monitoring and protection applications in personal computers, telecommunications equipment, and office electronics.
. One input (two pins) is dedicated to a remote temperature-sensing diode. Two further pins
CC
ADM1026–SPECIFICA TIONS
(TA = T
MIN
to T
, VCC = V
MAX
MIN
to V
, unless otherwise noted)
MAX
ParameterMinTypMaxUnitsTest Conditions/Comments
POWER SUPPLY
Supply Voltage, 3.3V STBY, 3.3V MAIN3.1353.35.5V
Supply Current, I
CC
1.43.0mAInterface Inactive, ADC Active
1.0mAADC Inactive, DAC Active
250µAShutdown Mode
TEMP. -TO-DIGITAL CONVERTER
Internal Sensor Accuracy±3
Resolution±1
External Diode Sensor Accuracy±3
Resolution±1
o
C
o
C
o
C60 oC ≤ TD ≤ +100oC
o
C
Remote Sensor Source Current90µAHigh Level
5.5µΑLow Level
ANALOG-TO-DIGITAL CONVERTER
(INCLUDING MUX AND ATTENUATORS)
Total Unadjusted Error, TUE±2%See Note 3
Differential Non-Linearity, DNL±1L SB
Power Supply Sensitivity±1%/V
Conversion Time (Analog Input or Int.Temp)11.3812.06m sSee Note 4
Conversion Time (External Temperature)34.1336.18m sSee Note 4
Input Resistance (+12V, +5V, V
, AIN0 - AIN5)100140200k⍀
CCP
Input Resistance of -12V pin10k⍀
Input Resistance (AIN6 - AIN9)10 0140200k⍀
Input Resistance of V
Current Drain (when measuring)105500nAGives CR2032 Battery life > 10 years
V
BAT
V
Current Drain (when not measuring)16nA
BAT
pin97k⍀See Note 3
BAT
ANALOG OUTPUT
Output Voltage Range02.5V
Total Unadjusted Error, TUE±3%I
= 2mA
L
Full-Scale Error±1± 3%
Zero Error2LS BNo Load
Differential Non-Linearity, DNL±1L SBMonotonic by Design
Integral Non-Linearity±1LS B
Output Source Current2mA
Output Sink Current1m A
REFERENCE OUTPUT
Output Voltage1.81.821.84VBit 2 of Register 07h = 0
Output Voltage2.472.502.53VBit 2 of Register 07h = 1
Line RegulationTB D%/V
Load RegulationTB DµV/mA
Short-Circuit CurrentTB DmA
Output Current Source2mA
Output Current Sink2m A
–2–
REV. PrP
PRELIMINARY TECHNICAL DA T A
ADM1026
Specifications (Continued)
ParameterMinTy pMaxUnitsTest Conditions/Comments
FAN RPM-TO-DIGITAL CONVERTERSee Note 5
Accuracy±6%
Full-Scale Count255
FAN0 TO FAN7 Nominal Input RPM8800RPMDivisor = 1, Fan Count = 153
(Note 5)4400RPMDivisor = 2, Fan Count = 153
2200RPMDivisor = 4, Fan Count = 153
1100RPMDivisor = 8, Fan Count = 153
Internal Clock Frequency21.122.523.9kHz
OPEN-DRAIN O/P'S, PWM, GPIO0-16
Output High Voltage, V
Output Low Voltage, V
OL
OH
2.4VI
0.4VI
PWM Output Frequency75Hz
OPEN-DRAIN DIGITAL OUTPUTS
,,
INT
, RESETMAIN
,,
Output Low Voltage, V
High Level Output Leakage Current, I
,,
, RESETSTBY
,,
OL
OH
))
)
))
0.4VI
0.11µAV
RESET Pulse Width140180240ms
OPEN-DRAIN SERIAL DATA
BUS OUTPUT (SDA)
Output Low Voltage, V
High Level Output Leakage Current, I
OL
OH
0.11µAV
0.4VI
SERIAL BUS DIGITAL INPUTS
(SCL, SDA)
Input High Voltage, V
Input Low Voltage, V
IL
IH
2.2V
0.8V
Hysteresis500mV
DIGITAL INPUT LOGIC LEVELS
(ADD, CI, FAN0-7, GPIO0-16)See Notes 6 and 7
Input High Voltage, V
Input Low Voltage, V
IL
IH
2.4VVCC = 3.3V
0.8VVCC = 3.3V
Hysteresis (Fan 0 - 7)250mVVCC = 3.3V
RESETMAIN, RESETSTBY
RESETMAIN Threshold2.94VRESETMAIN triggered from AV
RESETSTBY Threshold3.08RESETSTBY triggered from DV
RESETMAIN Hysteresis60mV
RESETSTBY Hysteresis50mV
DIGITAL INPUT CURRENT
Input High Current, I
Input Low Current, I
Input Capacitance, C
IL
IN
IH
-1µAVIN = V
1µAV
20pF
EEPROM RELIABILITY
Endurance100700K cyclesSee Note 9
Data Retention10 0YearsSee Note 10
SERIAL BUS TIMING
Clock Frequency, f
Glitch Immunity, t
Bus Free Time, t
Start Setup Time, t
Start Hold Time, t
SCL Low Time, t
SCL High Time, t
SCLK
SW
BUF
SU;STA
HD;STA
LOW
HIGH
SCL, SDA Rise Time, t
SCL, SDA Fall Time, t
f
4.7µ sSee Figure 1
4.7µ sSee Figure 1
4µ sSee Figure 1
4.7µ sSee Figure 1
4µ sSee Figure 1
r
400kHzSee Figure 1
50n sSee Figure 1
1000nsSee Figure 1
300µ sSee Figure 1
= 3.0mA, VCC = 3.3V
OUT
= -3.0mA, VCC = 3.3V
OUT
= -3.0mA, VCC = 3.3V
OUT
= V
OUT
OUT
OUT
IN
CC
= -3.0mA, VCC = 3.3V
= V
CC
CC
= 0
CC
CC
REV. PrP
–3–
PRELIMINARY TECHNICAL DA T A
ADM1026
Specifications (Continued)
ParameterMinTy pMaxUnitsTest Conditions/Comments
Data Setup Time, t
Data Hold Time, t
NOTES
1
All voltages are measured with respect to GND, unless otherwise specified
2
Typicals are at TA=25°C and represent most likely parametric norm. Shutdown current typ is measured with VCC = 3.3V
3
TUE (Total Unadjusted Error) includes Offset, Gain and Linearity errors of the ADC, multiplexer and on-chip input attenuators. VBAT input is only linear for VBAT
voltages greater than 1.5V.
4
Total analog monitoring cycle time is nominally 273ms, made up of 18 ⫻ 11.38ms measurements on analog input and internal temperature channels, and 2 ⫻ 34.13ms
measurements on external temperature channels.
5
The total fan count is based on 2 pulses per revolution of the fan tachometer output. The total fan monitoring time depends on the number of fans connected and the
fan speed. See section on Fan Speed Monitoring for more details.
6
ADD is a three-state input that may be pulled high, low or left open-circuit.
7
Logic inputs will accept input high voltages up to 5V even when device is operating at supply voltages below 5V.
8
Timing specifications are tested at logic levels of V
9
Endurance is qualified to 100,000 cycles as per JEDEC Std. 22 method A117 and measured at -40°C, 25°C and 85°C. Typical Endurance at 25°C is 700,000 cycles.
10
Retention lifetime equivalent at junction temperature (Tj) = 55°C as per JEDEC Std. 22 method A117. Retention lifetime based on an activation energy of 0.6eV will
SU;DAT
HD;DAT
= 0.8V for a falling edge and V
IL
derate with junction temperature as shown in Figure 2.
ESD Rating all other pins . . . . . . . . . . . . . . . . . . . 2000 V
*Stresses above those listed under “Absolute Maximum Ratings” may cause permanent
damage to the device. This is a stress rating only; functional operation of the device
at these or any other conditions above those indicated in the operational section of this
specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
THERMAL CHARACTERISTICS
48-Pin LQFP Package:
= 50°C/Watt, θ
θ
JA
= 10°C/Watt
JC
ORDERING GUIDE
GPIO9
GPIO8
FAN0/GPIO0
FAN1/GPIO1
FAN2/GPIO2
FAN3/GPIO3
3.3V MAIN
DGND
FAN4/GPIO4
FAN5/GPIO5
FAN6/GPIO6
FAN7/GPIO7
PIN CONFIGURATION
GPIO12
GPIO13
GPIO14
46
45
ADM10 26
(Not to Scale)
16
CI
GPIO15
43
44
TOP VIEW
17
18
INT
PWM
PIN 1 IDE NT IF IER
1
2
3
4
5
6
7
8
9
10
11
12
GPIO11
GPIO10
47
48
15
14
13
SCL
SDA
ADD/NTESTOUT
THERM
GPIO16/
42
19
BY
RESETST
)
)
)
)
)
- 3V
- 3V
- 3V
- 3V
(0
IN0
A
41
20
RESETMAIN
- 3V
(0
(0
(0
(0
IN1
IN2
IN3
A
40
21
D
AGN
IN4
A
A
A
37
38
39
A
(0 - 3V )
36
IN5
(0 - 2.5V)
A
35
IN6
(0 - 2.5V)
A
34
IN7
(0 - 3V)
V
33
CCP
(0 - 16V)
+12V
32
IN
(0 - 16V)
-12V
31
IN
+5V
(0 - 6.66 V )
30
IN
+V
(0 - 4.4V)
29
BAT
(0 - 2.5 V )
D2+/A
28
IN8
(0 - 2.5V )
D2-/A
27
IN9
D1+
26
D1-/NTESTIN
25
23
22
24
C
EF
R
DA
V
3.3V STBY
TemperaturePackagePackage
ModelRangeDescriptionOption
ADM1026JST0°C to +100°C48-Pin LQFPST48
SCL
SDA
t
R
t
LOW
t
HD;STA
t
BUF
S
P
t
HD;DAT
t
HIGH
t
F
t
SU;DAT
Figure 1. Diagram for Serial Bus Timing
–4–
t
HD;STA
t
SU;STA
S
t
SU;STO
P
REV. PrP
PRELIMINARY TECHNICAL DA T A
ADM1026
PIN FUNCTION DESCRIPTION
PIN NO.MNEMONICTYPEDESCRIPTION
1GPIO9Digital I/O
2GPIO8Digital I/O
3FAN0/GPIO0Digital I/OFan tachometer input, or can be re-configured as a general purpose
4FAN1/GPIO1Digital I/OFan tachometer input, or can be re-configured as a general purpose
5FAN2/GPIO2Digital I/OFan tachometer input, or can be re-configured as a general purpose
6FAN3/GPIO3Digital I/OFan tachometer input, or can be re-configured as a general purpose
73.3V MAINAnalog InputMonitors the main 3.3V system supply. Does NOT power device.
8DGNDGroundGround pin for digital circuits.
9FAN4/GPIO4Digital I/OFan tachometer input, or can be re-configured as a general purpose
1
1
General purpose I/O pin can be configured as a digital input or output.
General purpose I/O pin can be configured as a digital input or output.
digital I/O pin. This has an internal 10k⍀ pullup resistor to 3.3VSTBY
digital I/O pin. This has an internal 10k⍀ pullup resistor to 3.3VSTBY
digital I/O pin. This has an internal 10k⍀ pullup resistor to 3.3VSTBY
digital I/O pin. This has an internal 10k⍀ pullup resistor to 3.3VSTBY
digital I/O pin. This has an internal 10k⍀ pullup resistor to 3.3VSTBY
10FAN5/GPIO5Digital I/OFan tachometer input, or can be re-configured as a general purpose
digital I/O pin. This has an internal 10k⍀ pullup resistor to 3.3VSTBY
11FAN6/GPIO6Digital I/OFan tachometer input, or can be re-configured as a general purpose
digital I/O pin. This has an internal 10k⍀ pullup resistor to 3.3VSTBY
12FAN7/GPIO7Digital I/OFan tachometer input, or can be re-configured as a general purpose
digital I/O pin. This has an internal 10k⍀ pullup resistor to 3.3VSTBY
13SCLDigital InputOpen-drain Serial Bus Clock. Requires 2.2k⍀ pullup resistor.
14SDADigital I/OSerial Bus Data. Open-drain output. Requires 2.2k⍀ pullup resistor.
15ADD/Digital InputThis is a three-state input that controls the two LSBs of the Serial Bus
NTESTOUTAddress. It also functions as the output for NAND tree testing.
16CIDigital InputAn active high input which captures a Chassis Intrusion event in Bit 6
of Status Register 4. This bit will remain set until cleared, so long as
battery voltage is applied to the V
is powered off.
17INTDigital OutputInterrupt Request (open drain). The output is enabled when Bit 1 of
the Configuration Register is set to 1. The default state is disabled.
It has an on-chip 100k⍀ pullup resistor.
18PWMDigital OutputOpen drain Pulse-width modulated output for control of fan speed.
This pin defaults to being high for 100% duty cycle for use with n-
MOS drive circuitry. If a p-MOS device is used to drive the fan the
PWM output may be inverted by setting bit 1 of Test Register 1 = 1.
input, even when the ADM1026
BAT
19RESETSTBYDigital OutputPower-on Reset. 5 mA driver (open drain), active low output with a
180 ms typical pulse width. RESETSTBY is asserted whenever
3.3VSTBY is below the reset threshold. It remains asserted for approx.
180ms after 3.3VSTBY rises above the reset threshold.
20RESETMAINDigital I/OPower-on Reset. 5 mA driver (open drain), active low output with a
180 ms typical pulse width. RESETMAIN is asserted whenever
3.3V MAIN is below the reset threshold. It remains asserted for
approx. 180ms after 3.3V MAIN rises above the reset threshold. If,
however, 3.3V STBY rises with or before 3.3V MAIN, then
RESETMAIN remains asserted for 180ms after RESETSTBY is de-
asserted. Pin 20 also functions as an active low RESET input.
REV. PrP
–5–
PRELIMINARY TECHNICAL DA T A
ADM1026
PIN FUNCTION DESCRIPTION (CONTINUED)
PIN NO.MNEMONICTYPEDESCRIPTION
21AGNDGroundGround pin for analog circuits
223.3V STBYPower SupplySupplies 3.3V power for the ADM1026. Also monitors 3.3V standby
power rail.
23DACAnalog Output0 to 2.5V output for analog control of fan speed.
24VREFAnalog OutputReference voltage output. Can be selected as 1.8V (default) or 2.5V.
25D1-/NTESTINAnalog InputConnected to cathode of 1st remote temperature sensing diode. If held
high at power up it activates NAND tree test mode.
26D1+Analog InputConnected to anode of 1st remote temperature sensing diode.
27D2-/AIN9ProgrammableConnected to cathode of 2nd remote temperature sensing diode, or
Analog Inputmay be re-configured as a 0 - 2.5V analog input
28D2+/AIN8ProgrammableConnected to anode of 2nd remote temperature sensing diode, or
Analog Inputmay be re-configured as a 0 - 2.5V analog input
29V
BAT
30+5V
31-12V
32+12V
33+V
CCP
IN
IN
IN
Analog InputMonitors battery voltage, nominally +3V.
Analog InputMonitors +5 V supply.
Analog InputMonitors -12 V supply.
Analog InputMonitors +12 V supply.
Analog InputMonitors processor core voltage (0 to 3.0V).
34AIN7Analog InputGeneral-purpose 0 to 2.5V analog input.
35AIN6Analog InputGeneral-purpose 0 to 2.5V analog input.
36AIN5Analog InputGeneral-purpose 0 to 3V analog input.
37AIN4Analog InputGeneral-purpose 0 to 3V analog input.
38AIN3Analog InputGeneral-purpose 0 to 3V analog input.
39AIN2Analog InputGeneral-purpose 0 to 3V analog input.
40AIN1Analog InputGeneral-purpose 0 to 3V analog input.
41AIN0Analog InputGeneral-purpose 0 to 3V analog input.
42GPIO16/Digital I/O
1
General purpose I/O pin can be configured as a digital input or output.
THERMCan also be configured as a bidirectional THERM pin (open drain).
43GPIO15Digital I/O
44GPIO14Digital I/O
45GPIO13Digital I/O
46GPIO12Digital I/O
47GPIO11Digital I/O
48GPIO10Digital I/O
NOTES
1
GPIO pins are open-drain and require external pullup resistors.
1
1
1
1
1
1
General purpose I/O pin can be configured as a digital input or output.
General purpose I/O pin can be configured as a digital input or output.
General purpose I/O pin can be configured as a digital input or output.
General purpose I/O pin can be configured as a digital input or output.
General purpose I/O pin can be configured as a digital input or output.
General purpose I/O pin can be configured as a digital input or output.
–6–
REV. PrP
PRELIMINARY TECHNICAL DA T A
ADM1026
FUNCTIONAL DESCRIPTION
GENERAL DESCRIPTION
The ADM1026 is a complete system hardware monitor for
microprocessor-based systems. The device communicates
with the system via a serial System Management Bus. The
serial bus controller has a hardwired address line for device
selection (ADD, pin 15), a serial data line for reading and
writing addresses and data (SDA, pin 14), and an input line
for the serial clock (SCL, pin 13). All control and programming functions of the ADM1026 are performed over
the serial bus.
MEASUREMENT INPUTS
Programmability of the analog and digital measurement
inputs makes the ADM1026 extremely flexible and versatile. The device has an 8 bit A-to-D converter, and 17
analog measurement input pins that can be configured in
different ways.
Pins 25 and 26 are dedicated temperature inputs and may
be connected to the cathode and anode of a remote temperature-sensing diode.
Pins 27 and 28 may be configured as a temperature input
and connected to a second temperature-sensing diode, or
they may be re-configured as analog inputs with a range of
0 to +2.5V.
Pins 29 to 33 are dedicated analog inputs with on-chip attenuators, configured to monitor V
and the processor core voltage V
Pins 34 to 41 are general-purpose analog inputs with a
range of 0 to +2.5V or 0 to +3V. These are mainly intended for monitoring SCSI termination voltages, but may
be used for other purposes.
The ADC also accepts input from an on-chip bandgap temperature sensor that monitors system ambient temperature.
Finally, the ADM1026 monitors the supply from which it
is powered, 3.3VSTBY, so there is no need for a separate
pin to monitor this power supply voltage.
The ADM1026 has 8 pins that are general-purpose logic
I/O pins (pins 1,2 and 43 to 48), a pin that can be configured as GPIO or as a bidirectional thermal interrupt
(THERM) pin (pin 42) and 8 pins that can be configured
for fan speed measurement or as general-purpose logic
pins (pins 3 to 6 and 9 to 12).
SEQUENTIAL MEASUREMENT
When the ADM1026 monitoring sequence is started, it
cycles sequentially through the measurement of analog inputs and the temperature sensor, while at the same time
the fan speed inputs are independently monitored. Measured values from these inputs are stored in Value Registers. These can be read out over the serial bus, or can be
compared with programmed limits stored in the Limit
Registers. The results of out of limit comparisons are
stored in the Interrupt Status Registers, and will generate
an interrupt on the INT line (pin 17).
Any or all of the Interrupt Status Bits can be masked by
appropriate programming of the Interrupt Mask Registers.
, +5V, -12V, +12V,
BAT
, respectively.
CCP
CHASSIS INTRUSION
A chassis intrusion input (pin 16) is provided to detect
unauthorised tampering with the equipment. This event is
latched in a battery-backed register bit.
RESETS
The ADM1026 has two power on reset outputs,
RESETMAIN and RESETSTBY, that are asserted when
3.3VMAIN or 3.3VSTBY fall below the reset threshold.
These give a 180ms reset pulse at power up. RESETMAIN
also functions as an active-low RESET input.
FAN SPEED CONTROL OUTPUTS
The ADM1026 has two outputs intended to control fan
speed, though they can also be used for other purposes.
Pin 18 is an open-drain pulse-width modulated (PWM)
output with a programmable duty-cycle and an output
frequency of 75Hz.
Pin 23 is connected to the output of an on-chip, 8-bit
digital-to-analog converter with an output range of zero to
2.5V.
Either or both of these outputs may be used to implement
a temperature-controlled fan by controlling the speed of a
fan dependent upon the temperature measured by the onchip temperature sensor or remote temperature sensors.
INTERNAL REGISTERS OF THE ADM1026
The ADM1026 contains a large number of data registers.
A brief description of the principal registers is given below. More detailed descriptions are given in the relevant
sections and in the tables at the end of the data sheet.
Address Pointer Register: This register contains the address
that selects one of the other internal registers. When writing to
the ADM1026, the first byte of data is always a register address, which is written to the Address Pointer Register.
Configuration Registers: Provide control and configuration
for various operating parameters of the ADM1026.
Fan Divisor Registers: Contain counter pre-scaler values
for fan speed measurement.
DAC/PWM Control Registers: Contain speed values for
PWM and DAC fan drive outputs.
GPIO Configuration Registers: These configure the
GPIO pins as input or output and for signal polarity.
Value and Limit Registers: The results of analog voltage
inputs, temperature and fan speed measurements are
stored in these registers, along with their limit values.
Status Registers: These registers store events from the
various interrupt sources.
Mask Registers: Allow masking of individual interrupt
sources.
EEPROM
The ADM1026 has 8K bytes of non-volatile, ElectricallyErasable Programmable Read-Only Memory (EEPROM),
from register addresses 8000h to 9FFFh. This may be
used for permanent storage of data that will not be lost
when the ADM1026 is powered down, unlike the data in
REV. PrP
–7–
ADM1026
PRELIMINARY TECHNICAL DA T A
the volatile registers. Although referred to as Read Only
Memory, the EEPROM can be written to (as well as read
from) via the serial bus in exactly the same way as the
other registers. The only major differences between the
E2PROM and other registers are:
1. An EEPROM location must be blank before it can be
written to. If it contains data, it must first be erased.
2. Writing to EEPROM is slower than writing to RAM.
3. Writing to the EEPROM should be restricted because
it has a limited write/cycle life of 100,000 write operations, due to the usual EEPROM wear-out
mechanisms.
2
The E
two key E
PROM in the ADM1026 has been qualified for
2
PROM memory characteristics:- memory
cycling endurance and memory data retention.
Endurance qualifies the ability of the E
2
PROM to be
cycled through many Program, Read and Erase cycles. In
real terms, a single endurance cycle is composed of four
independent, sequential events. These events are defined
as follows:
(a) initial page erase sequence
(b) read/verify sequence
(c) program sequence
(d) second read/verify sequence
In reliability qualification, every byte is cycled from 00h
to FFh until a first fail is recorded signifying the
endurance limit of the E
Retention quantifies the ability of the memory to retain its
programmed data over time. The E
2
PROM memory.
2
PROM in the
ADM1026 has been qualified in accordance with the
formal JEDEC Retention Lifetime Specification (A117) at
a specific junction temperature (Tj = 55°C). As part of
this qualification procedure, the E
2
PROM memory is
cycled to its specified endurance limit described above,
before data retention is characterized. This means that the
2
PROM memory is guaranteed to retain its data for its
E
full specified retention lifetime every time the E
2
PROM is
reprogrammed. It should be noted that retention lifetime
based on an activation energy of 0.6eV will derate with Tj
as shown in Figure 2.
Figure 2. E2PROM Memory Retention
SERIAL BUS INTERFACE
Control of the ADM1026 is carried out via the serial System Management Bus (SMBus). The ADM1026 is connected to this bus as a slave device, under the control of a
master device.
The ADM1026 has a 7-bit serial bus slave address. When
the device is powered up, it will do so with a default serial
bus address. The five MSB's of the address are set to
01011, the two LSB's are determined by the logical states
of pin 15 (ADD/NTESTOUT). This is a three-state input that can be grounded, connected to V
or left open-
CC
circuit to give three different addresses.
TABLE 1. ADDRESS PIN TRUTH TABLE
ADD PinA1A0
GND00
No Connect10
V
CC
01
SCL
SDA
STAR T BY
MASTER
SCL
(CON T IN UED)
SDA
(CON T I N U E D)
191
0
1011A1A0D7
FRAME 1
SLAVE ADDRESS
1
D6
D7
D5
D4
FRAME 3
DATA BYTE
D3
D2
R/W
D1
ACK. BY
SLAVE
D0
ACK. BY
SLAVE
Figure 3a. General SMBus Write Timing Diagram
–8–
D6
199
D7
D5D4D3
FRAME 2
COMMAND CODE
D5
D6
9
D2
D1
D0
ACK. BY
SLAVE
D4D3D2D1
FRAME N
DATA BYTE
D0
ACK. BY
SLAVE
STOP BY
MASTER
REV. PrP
PRELIMINARY TECHNICAL DA T A
ADM1026
191
SCL
0
SDA
STAR T BY
MASTER
SCL
(CON T IN UED)
SDA
(CON T I N U E D)
1011
FRAME 1
SLAVE ADDRESS
1
D6
D7
D5
D4
DATA BYTE
A1
D3
FRAME 3
A0
R/W
ACK. BY
SLAVE
D2
D1
D0
D7
ACK. BY
MASTER
Figure 3b. General SMBus Read Timing Diagram
If ADD is left open-circuit the default address will be
0101110. ADD is sampled only at power-up, so any changes
made while power is on will have no immediate effect.
The facility to make hardwired changes to device address
allows the user to avoid conflicts with other devices sharing the same serial bus, for example if more than one
ADM1026 is used in a system.
GENERAL SMBUS TIMING
Figures 3a and 3b show timing diagrams for general read
and write operations using the SMBus. The SMBus specification defines specific conditions for different types of
read and write operation, which are discussed later.
The general SMBus protocol operates as follows:
1. The master initiates data transfer by establishing a
START condition, defined as a high to low transition
on the serial data line SDA whilst the serial clock line
SCL remains high. This indicates that a data stream
will follow. All slave peripherals connected to the serial
bus respond to the START condition, and shift in the
next 8 bits, consisting of a 7-bit slave address (MSB
first) plus a R/W bit, which determines the direction of
the data transfer, i.e. whether data will be written to or
read from the slave device (0 = write, 1 = read).
The peripheral whose address corresponds to the transmitted address responds by pulling the data line low
during the low period before the ninth clock pulse,
known as the Acknowledge Bit, and holding it low during the high period of this clock pulse. All other devices on the bus now remain idle whilst the selected
device waits for data to be read from or written to it. If
the R/W bit is a 0 then the master will write to the slave
device. If the R/W bit is a 1 the master will read from
the slave device.
2. Data is sent over the serial bus in sequences of 9 clock
pulses, 8 bits of data followed by an Acknowledge Bit
from the slave device. Data transitions on the data line
must occur during the low period of the clock signal
and remain stable during the high period, as a low to
high transition when the clock is high may be interpreted as a STOP signal.
If the operation is a write operation, the first data byte
9
D6
D4D3D2D1
D5
FRAME 2
DATA BYTE
199
D7
D6
D4D3D2D1
D5
FRAME N
DATA BYTE
D0
ACK. BY
MASTER
D0
NO ACK.
STOP BY
MASTER
after the slave address is a command byte. This tells the
slave device what to expect next. It may be an instruction such as telling the slave device to expect a block
write, or it may simply be a register address that tells
the slave where subsequent data is to be written.
Since data can flow in only one direction as defined by
the R/W bit, it is not possible to send a command to a
slave device during a read operation. Before doing a
read operation, it may first be necessary to do a write
operation to tell the slave what sort of read operation to
expect and/or the address from which data is to be read.
3. When all data bytes have been read or written, stop conditions are established. In WRITE mode, the master
will pull the data line high during the 10th clock pulse
to assert a STOP condition. In READ mode, the master device will release the SDA line during the low period before the 9th clock pulse, but the slave device will
not pull it low. This is known as No Acknowledge. The
master will then take the data line low during the low
period before the 10th clock pulse, then high during the
10th clock pulse to assert a STOP condition.
Note:
If it is required to perform several read or write operations
in succession, the master can send a repeat start condition
instead of a stop condition to begin a new operation.
SMBUS PROTOCOLS FOR RAM AND EEPROM
The ADM1026 contains volatile registers (RAM) and
non-volatile EEPROM. RAM occupies address locations
from 00h to 6Fh, whilst EEPROM occupies addresses
from 8000h to 9FFFh.
Data can be written to and read from both RAM and
EEPROM as single data bytes and as block (sequential)
read or write operations of 32 data bytes, which is the
maximum block size allowed by the SMBus specification.
Data can only be written to unprogrammed EEPROM locations. To write new data to a programmed location it is
first necessary to erase it. EEPROM erasure cannot be
done at the byte level; the EEPROM is arranged as 128
pages* of 64 bytes, and an entire page must be erased.
The EEPROM has three RAM registers associated with it,
REV. PrP
–9–
ADM1026
PRELIMINARY TECHNICAL DA T A
EEPROM Registers 1, 2 and 3 at addresses 06h, 0Ch and
13h. EEPROM Registers 1 and 2 are for factory use only.
EEPROM Register 3 is used to set up the EEPROM operating mode.
Setting bit 0 of EEPROM Register 3 puts the EEPROM
into Read Mode. Setting bit 1 puts it into Programming
Mode. Setting Bit 2 puts it into Erase Mode.
One, and only one of these bits must be set before the
EEPROM may be accessed, setting no bits or more than
one of them will cause the device to respond with No Acknowledge if an EEPROM read, program or erase operation is attempted.
It is important to distinguish between SMBus write operations such as sending an address or command, and
EEPROM programming operations. It is possible to write
an EEPROM address over the SMBus whatever the state
of EEPROM register 3. However, EEPROM Register 3
must be correctly set before a subsequent EEPROM operation can be performed. For example, when reading
from the EEPROM, bit 0 of EEPROM Register 3 can be
set, even though SMBus write operations are required to
set up the EEPROM address for reading.
Bit 3 of EEPROM Register 3 is used for EEPROM write
protection. Setting this bit will prevent accidental programming or erasure of the EEPROM. If a an EEPROM
write or erase operation is attempted with this bit set, the
ADM1026 will respond with No Acknowledge. This bit is
write once and can only be cleared by power-on reset.
EEPROM Register bit 7 is used for clock extend. Programming an EEPROM byte takes approximately 250µs,
which would limit the SMBus clock for repeated or block
write operations. Since EEPROM block read/write access
is slow, it is recommended that this Clock Extend bit
normally be set to 1. This allows the ADM1026 to pull
SCL low and extend the clock pulse when it cannot accept
any more data.
*Although the EEPROM is arranged into 128 pages, only
124 pages are available to the user. The last 4 pages are
reserved for manufacturing purposes and cannot be erased/
rewritten.
ADM1026 WRITE OPERATIONS
The SMBus specification defines several protocols for different types of read and write operations. The ones used in
the ADM1026 are discussed below. The following abbreviations are used in the diagrams:
S-START
P-STOP
R-READ
W-WRITE
A-ACKNOWLEDGE
A-NO ACKNOWLEDGE
The ADM1026 uses the following SMBus write protocols:
Send Byte
In this operation the master device sends a single command byte to a slave device, as follows:
1. The master device asserts a start condition on SDA.
2. The master sends the 7-bit slave address followed by
the write bit (low).
3. The addressed slave device asserts ACK on SDA.
4. The master sends a command code.
5. The slave asserts ACK on SDA.
6. The master asserts a STOP condition on SDA and the
transaction ends.
In the ADM1026, the send byte protocol is used to write a
register address to RAM for a subsequent single byte read
from the same address or block read or write starting at
that address. This is illustrated in Figure 4a.
12 3 4 56
SLAVE
S
ADDRESS
WA
RAM
ADDRESS
(00h TO 6Fh)
AP
Figure 4a. Setting A RAM Address For Subsequent Read
If it is required to read data from the RAM immediately
after setting up the address, the master can assert a repeat
start condition immediately after the final ACK and carry
out a single byte read, block read or block write operation, without asserting an intermediate stop condition.
Write Byte/Word
In this operation the master device sends a command byte
and one or two data bytes to the slave device, as follows:
1. The master device asserts a start condition on SDA.
2. The master sends the 7-bit slave address followed by
the write bit (low).
3. The addressed slave device asserts ACK on SDA.
4. The master sends a command code.
5. The slave asserts ACK on SDA.
6. The master sends a data byte.
7. The slave asserts ACK on SDA.
8. The master sends a data byte (or may assert STOP at
this point).
9. The slave asserts ACK on SDA.
10.The master asserts a STOP condition on SDA to end
the transaction.
In the ADM1026, the write byte/word protocol is used for
four purposes. The ADM1026 knows how to respond by
the value of the command byte and EEPROM register 3.
1. Write a single byte of data to RAM. In this case the
command byte is the RAM address from 00h to 6Fh
and the (only) data byte is the actual data. This is illustrated in Figure 4b.
12 345678
SLAVE
S
ADDRESS
WA
RAM
ADDRESS
(00h TO 6Fh)
ADATA A P
Figure 4b. Single Byte Write To RAM
2. Set up a two byte EEPROM address for a subsequent
read or block read. In this case the command byte is
–10–
REV. PrP
PRELIMINARY TECHNICAL DA T A
ADM1026
the high byte of the EEPROM address from 80h to
9Fh. The (only) data byte is the low byte of the
EEPROM address. This is illustrated in Figure 4c.
12 3 4 5 6 78
SLAVE
S
ADDRESS
WA
EEPROM
ADDRESS
HIGH BYTE
(80h TO 9Fh)
EEPROM
ADDRESS
A
LOW BYTE
(00h TO FFh)
AP
Figure 4c. Setting An EEPROM Address
If it is required to read data from the EEPROM immediately after setting up the address, the master can assert a repeat start condition immediately after the final
ACK and carry out a single byte read, block read or
block write operation, without asserting an intermediate stop condition. In this case bit 0 of EEPROM Register 3 should be set.
3. Erase a page of EEPROM memory. EEPROM
memory can be written to only if it is unprogrammed.
Before writing to one or more EEPROM memory locations that are already programmed, the page or pages
containing those locations must first be erased.
EEPROM memory is erased by writing an EEPROM
page address plus an arbitrary byte of data with bit 2 of
EEPROM Register 3 set to 1.
As the EEPROM consists of 128 pages of 64 bytes, the
EEPROM page address consists of the EEPROM address high byte (from 80h to 9Fh) and the two MSB's
of the low byte. The lower 6 bits of the EEPROM address low byte only specify addresses within a page and
are ignored during an erase operation.
12 3 4 5 6 7 8 910
SLAVE
S
ADDRESS
WA
EEPROM
ADDRESS
HIGH BYTE
(80h TO 9Fh)
EEPROM
ADDRESS
A
LOW BYTE
(00h TO FFh)
ARBITRARY
A
DATA
AP
Figure 4d. EEPROM Page Erasure
Page erasure takes approximately 20ms. If the
EEPROM is accessed before erasure is complete, it
will respond with No Acknowledge.
4. Write a single byte of data to EEPROM. In this case
the command byte is the high byte of the EEPROM
address from 80h to 9Fh. The first data byte is the low
byte of the EEPROM address and the second data byte
is the actual data. Bit 1 of EEPROM Register 3 must
be set. This is illustrated in Figure 4e.
12 3 4 5 6 78910
SLAVE
S
ADDRESS
WA
EEPROM
ADDRESS
HIGH BYTE
(80h TO 9Fh)
EEPROM
ADDRESS
A
LOW BYTE
(00h TO FFh)
ADATAAP
Figure 4e. Single Byte Write To EEPROM
Block Write
In this operation the master device writes a block of data
to a slave device. The start address for a block write must
previously have been set. In the case of the ADM1026 this
is done by a Send Byte operation to set a RAM address or
a Write Byte/Word operation to set an EEPROM address.
1. The master device asserts a start condition on SDA.
2. The master sends the 7-bit slave address followed by
the write bit (low).
3. The addressed slave device asserts ACK on SDA.
4. The master sends a command code that tells the slave
device to expect a block write. The ADM1026 command code for a block write is A0h (10100000).
5. The slave asserts ACK on SDA.
6. The master sends a data byte (20h) that tells the slave
device 32 data bytes will be sent to it. The master
should always send 32 data bytes to the ADM1026.
7. The slave asserts ACK on SDA.
8. The master sends 32 data bytes.
9.The slave asserts ACK on SDA after each data byte.
10. The master sends a PEC (Packet Error Checking)
byte.
11. The ADM1026 checks the PEC byte and issues an
ACK if correct. If incorrect (NACK), the master should
resend the data bytes.
12. The master asserts a STOP condition on SDA to end
the transaction.
12 3 4 5678910
SLAVE
S
ADDRESS
COMMAND A0h
WA
(BLOCK W RITE)
BYTE
AADATA 1A
ADATA 2
COUNT
DATA
32
11
12
PEC
A
A
P
Figure 4f. Block Write To EEPROM Or RAM
When performing a block write to EEPROM, bit 1 of
EEPROM Register 3 must be set.
Unlike some EEPROM devices which limit block writes to
within a page boundary, there is no limitation on the start address when performing a block write to EEPROM, except:
1. There must be at least 32 locations from the start ad-
dress to the highest EEPROM address (9FFF), to avoiding writing to invalid addresses.
2. If the addresses cross a page boundary, both pages must
be erased before programming.
ADM1026 READ OPERATIONS
The ADM1026 uses the following SMBus read protocols:
RECEIVE BYTE
In this operation the master device receives a single byte
from a slave device, as follows:
1.The master device asserts a START condition on SDA.
2.The master sends the 7-bit slave address followed by the
read bit (high).
3.The addressed slave device asserts ACK on SDA.
4.The master receives a data byte.
5.The master asserts NO ACK on SDA.
6.The master asserts a STOP condition on SDA and the
transaction ends.
In the ADM1026, the receive byte protocol is used to read
a single byte of data from a RAM or EEPROM location
whose address has previously been set by a send byte or
REV. PrP
–11–
ADM1026
PRELIMINARY TECHNICAL DA T A
write byte/word operation. This is illustrated in Figure 4g.
When reading from EEPROM, Bit 0 of EEPROM
register 3 must be set.
12 3456
SLAVE
S
ADDRESS
RA
DATA
A P
Figure 4g. Single Byte Read From EEPROM Or RAM
BLOCK READ
In this operation the master device reads a block of data
from a slave device. The start address for a block read
must previously have been set. In the case of the
ADM1026 this is done by a Send Byte operation to set a
RAM address, or a Write Byte/Word operation to set an
EEPROM address. The block read operation itself
consists of a Send Byte operation that sends a block read
command to the slave, immediately followed by a repeated
start and a read operation that reads out multiple data
bytes, as follows:
1.The master device asserts a START condition on SDA.
2.The master sends the 7-bit slave address followed by the
write bit (low).
3.The addressed slave device asserts ACK on SDA.
4.The master sends a command code that tells the slave
device to expect a block read. The ADM1026 command
code for a block read is A1h (10100001).
5.The slave asserts ACK on SDA.
6.The master asserts a repeat start condition on SDA.
7.The master sends the 7-bit slave address followed by the
read bit (high).
8.The slave asserts ACK on SDA.
9.The ADM1026 sends a byte count data byte that tells
the master how many data bytes to expect. The ADM1026
will always return 32 data bytes (20h), which is the
maximum allowed by the SMBus 1.1 specification.
10. The master asserts ACK on SDA.
11. The master receives 32 data bytes.
12. The master asserts ACK on SDA after each data byte.
13. The ADM1026 issues a PEC byte to the master. The
master should check the PEC byte and issue another block
read if the PEC byte is incorrect.
14. A NACK is generated after the PEC byte to signal the
end of the read.
15. The master asserts a STOP condition on SDA to end
the transaction.
12 3 4 567 89101112
SLAVE
S
ADDRESS
WA
COMMAND A1h
(BLOCK READ)
SLAVE
ADDRESS
RA
BYTE
COUNT
DATA
ADATA 1
AA S
13 14
15
PEC
A
32
A P
Figure 4h. Block Read From EEPROM or RAM
When block reading from EEPROM, bit 0 of EEPROM
register 3 must be set.
–12–
Note: Although the ADM1026 supports Packet Error
Checking (PEC), its use is optional. The PEC byte is
calculated using CRC-8. The Frame Check Sequence
(FCS) conforms to CRC-8 by the polynomial:-
C(x) = x
8
+ x2 + x1 + 1
Consult SMBus 1.1 specification for more information.
MEASUREMENT INPUTS
The ADM1026 has 17 external analog measurement pins,
which can be configured to perform various functions. It
also measures two supply voltages, 3.3V MAIN and 3.3V
STBY, and the internal chip temperature.
Pins 25 and 26 are dedicated to remote temperature measurement, whilst pins 27 and 28 can be configured as analog inputs with a range of 0 to +2.5V or as inputs for a
second remote temperature sensor.
Pins 29 to 33 are dedicated to measuring V
-12V, +12V supplies and the processor core voltage V
BAT
, +5V,
CCP
.
The remaining analog inputs, pins 34 to 41 are generalpurpose analog inputs with a range of 0 to +2.5V (pins 34
and 35) or 0 to +3V (pins 36 to 41).
A TO D CONVERTER
These inputs are multiplexed into the on-chip, successive
approximation, analog-to-digital converter. This has a
resolution of 8 bits. The basic input range is zero to
+2.5V, which is the input range of A
IN6
to A
, but five of
IN9
the inputs have built-in attenuators to allow measurement
of V
V
, +5V, -12V, +12V and the processor core voltage
BAT
, without any external components. To allow for the
CCP
tolerance of these supply voltages, the A to D converter
produces an output of 3/4 full-scale (decimal 192) for the
nominal input voltage, and so has adequate headroom to
cope with overvoltages. Table 2 shows the input ranges of
the analog inputs and output codes of the A to D converter.
When the ADC is running, it samples and converts an analog or local temperature input every 711µs (typical value).
Each input is measured 16 times and the measurements
averaged to reduce noise, so the total conversion time for
each input is 11.38ms.
Measurements on the remote temperature (D1 and D2) inputs take 2.13ms. These are also measured 16 times and
averaged, so the total conversion time for a remote temperature input is 34.13ms.
INPUT CIRCUITS
The internal structure for the analog inputs are shown in
Figure 5. Each input circuit consists of an input protection diode, an attenuator, plus a capacitor to form a firstorder lowpass filter which gives the input immunity to
high frequency noise. The -12V input also has a resistor
connected to the on-chip reference to offset the negative
voltage range so that it is always positive and can be
handled by the ADC. The V
input allows the condition
BAT
of a battery such as a CMOS backup battery to be monitored. To reduce current drain from the battery, the lower
resistor of the V
when a V
battery will function in a system in excess of the expected
10 years. Note that when a measurement is not being
made of V
the current drain is reduced to 16nA typical.
BAT
Under normal operating conditions, all measurements are
made in a round-robin format, and each measurement
result is actually 16 digitally averaged measurements.
Averaging is not carried out on the V
measurement to
BAT
reduce measurement time and hence reduce the current
drain from the battery. The V
current drain when a
BAT
measurement is being made is calculated by: I = (V
For V
/100k) *(T
BAT
= 3V;
BAT
PULSE/TPERIOD
)
I = (3/100k) * (711µs/273ms) = 78nA
T
PULSE
T
PERIOD
= V
measurement time = 711µs typical
BAT
= Time to measure all analog inputs = 273ms
typical
23.3k
80k
122.2k
8
116.7k
8
8
22.7k
8
8
25pF
10pF
35pF
AIN0 - AIN5
(0 - 3V)
AIN6 - AIN9
(0 - 2.5V )
+12V
SETTING OTHER INPUT RANGES
A
IN0
to A
can easily be scaled to voltages other than
IN9
2.5V or 3V. If the input voltage range is zero to some
positive voltage, then all that is required is an input attenuator, as shown in Figure 6.
However, when scaling A
IN0
to A
, it should be noted that
IN5
these inputs already have an on-chip attenuator, as their
primary function is to monitor SCSI termination voltages.
This attenuator will load any external attenuator. The input resistance of the on-chip attenuator can be between
100k⍀ and 200k⍀. For this tolerance not to affect the accuracy, the output resistance of the external attenuator
should be very much lower than this, e.g. 1k⍀ in order to
add not more than 1% to the TUE. Alternatively, the
input can be buffered using an op-amp.
V
IN
R1
AIN(0 -9)
R2
Figure 6. Scaling AIN(0 - 9)
R1/R2 = (Vfs-3.0)/3.0 (for A
R1/R2 = (V
-2.5)/2.5 (for A
fs
IN0
IN6
to A
to A
IN5
IN9
)
)
Negative and bipolar input ranges can be accommodated
by using a positive reference voltage to offset the input
voltage range so that it is always positive.
To monitor a negative input voltage, an attenuator can be
used as shown in Figure 7.
V
REF
18.9k
8
k
8
121.1
-12V
10pF
91.6k
+5V
V
BAT
+V
CCP
8
55.2k
61.1k
8
78.8k
*SEE TEXT
23.3k
8
116.7k
8
8
8
25pF
25pF
50pF
Figure 5. Structure of Analog Inputs
MUX
+V
OS
R2
V
IN
R1
AIN(0 - 9)
Figure 7. Scaling and Offsetting AIN(0 - 9) for Negative In-
puts
This offsets the negative voltage so that the ADC always
sees a positive voltage. R1 and R2 are chosen, so that the
ADC input voltage is zero when the negative input voltage
is at its maximum (most negative) value, i.e.
R1/R2 = |V
FS-
|/V
OS
This is a simple and cheap solution, but the following
point should be noted.
1. Since the input signal is offset but not inverted, the input range is transposed. An increase in the magnitude
of the negative voltage (going more negative), will
cause the input voltage to fall and give a lower output
code from the ADC. Conversely, a decrease in the
–14–
REV. PrP
PRELIMINARY TECHNICAL DA T A
ADM1026
magnitude of the negative voltage will cause the ADC
code to increase. The maximum negative voltage corresponds to zero output from the ADC. This means
that the upper and lower limits will be transposed.
2. For the ADC output to be full-scale when the negative
voltage is zero, V
voltage of the ADC, because V
and R2. If V
must be greater than the full-scale
OS
is equal to or less than the full-scale
OS
is attenuated by R1
OS
voltage of the ADC the input range is bipolar, but not
necessarily symmetrical.
This is only a problem if the ADC output must be fullscale when the negative voltage is zero.
Symmetrical bipolar input ranges can easily be accommodated by making V
equal to the full-scale voltage of the
OS
analog input and adding a third resistor to set the positive
full-scale.
+V
OS
R2
V
IN
R1
AIN(0 - 9)
REFERENCE OUTPUT
The on-chip reference voltage is scaled and buffered at pin
24 to provide a 1.82V or 2.5V reference. This output can
source or sink a load current of 2mA. The reference voltage is set to 1.82V if bit 2 of Configuration Register 3
(address 07h) is 0, 2.5V if it is 1. The voltage reference
output can be used to provide a stable reference voltage to
external circuitry such as LDO's.
TEMPERATURE MEASUREMENT SYSTEM
LOCAL TEMPERATURE MEASUREMENT
The ADM1026 contains an on-chip bandgap temperature
sensor, whose output is digitized by the on-chip ADC.
The temperature data is stored in the Local Temperature
Value Register (address 1Fh). As both positive and negative temperatures can be measured, the temperature data is
stored in two's complement format, as shown in Table 3.
Theoretically, the temperature sensor and ADC can measure temperatures from -128
tion of 1
T
MAX
o
C. However, temperatures below T
are outside the operating temperature range of the
o
C to +127oC with a resolu-
and above
MIN
device, so local temperature measurements outside this
range are not possible. Temperature measurement from
o
C to +127oC is possible using a remote sensor.
-128
R3
Figure 8. Scaling and Offsetting AIN(0 - 9) for Bipolar Inputs
R1/R2 = |V
FS-
|/V
OS
(R3 has no effect as the input voltage at the device pin is
zero when V
= minus full-scale)
IN
R1/R3 = (V
R1/R3 = (V
FS+
FS+
-3.0)/3.0 (for A
-2.5)/2.5 (for A
IN0
IN6
to A
to
AIN9
IN5
)
)
(R2 has no effect as the input voltage at the device pin is
equal to V
when VIN = plus full-scale).
OS
REMO TE
SENSING
TRANS IST OR
I
D+
D-
DIODE
N x I
BIAS
I
BIAS
REMOTE TEMPERATURE MEASUREMENT
The ADM1026 can measure the temperature of two
remote diode sensors or diode-connected transistors, connected to pins 25 and 26 or 27 and 28.
Pins 25 and 26 are a dedicated temperature input channel.
Pins 27 and 28 can be configured to measure a diode sensor by clearing bit 3 of Configuration Register 1 (address
00h) to 0. If this bit is 1 then pins 27 and 28 are A
.
A
IN9
IN8
and
The forward voltage of a diode or diode-connected transistor, operated at a constant current, exhibits a negative
temperature coefficient of about -2mV/
the absolute value of V
, varies from device to device, and
be
o
C.Unfortunately,
individual calibration is required to null this out, so the
technique is unsuitable for mass-production.
V
DD
V
OUT+
TO ADC
V
OUT-
LOWPASS FILTER
f
= 65kHz
c
REV. PrP
Figure 9. Signal Conditioning for Remote Diode temperature Sensors
–15–
ADM1026
PRELIMINARY TECHNICAL DA T A
The technique used in the ADM1026 is to measure the
change in V
when the device is operated at two different
be
currents.
This is given by:
∆V
= KT/q x ln(N)
be
where:
K is Boltzmann’s constant
q is charge on the carrier
T is absolute temperature in Kelvins
N is ratio of the two currents
Figure 9 shows the input signal conditioning used to mea-
sure the output of a remote temperature sensor. This figure shows the external sensor as a substrate transistor,
provided for temperature monitoring on some microprocessors, but it could equally well be a discrete transistor
such as a 2N3904.
If a discrete transistor is used, the collector will not be
grounded, and should be linked to the base. If a PNP
transistor is used the base is connected to the D- input and
the emitter to the D+ input. If an NPN transistor is used,
the emitter is connected to the D- input and the base to
the D+ input.
TABLE 3. TEMPERATURE DATA FORMAT
TemperatureDigital Output
-128 °C1000 0000
and to a chopper-stabilized amplifier that performs the
functions of amplification and rectification of the waveform to produce a DC voltage proportional to ∆V
. This
be
voltage is measured by the ADC to give a temperature
output in 8-bit two’s complement format. To further reduce the effects of noise, digital filtering is performed by
averaging the results of 16 measurement cycles. A remote
temperature measurement takes nominally 2.14ms.
The results of external temperature measurements are
stored in 8 bit, twos-complement format, as illustrated in
Table 3.
LAYOUT CONSIDERATIONS
Digital boards can be electrically noisy environments, and
care must be taken to protect the analog inputs from
noise, particularly when measuring the very small voltages
from a remote diode sensor. The following precautions
should be taken:
1. Place the ADM1026 as close as possible to the remote
sensing diode. Provided that the worst noise sources
such as clock generators, data/address buses and CRTs
are avoided, this distance can be 4 to 8 inches.
2. Route the D+ and D- tracks close together, in parallel,
with grounded guard tracks on each side. Provide a
ground plane under the tracks if possible.
3. Use wide tracks to minimize inductance and reduce
noise pickup. 10 mil track minimum width and spacing
is recommended.
To prevent ground noise interfering with the measurement, the more negative terminal of the sensor is not referenced to ground, but is biased above ground by an
internal diode at the D- input.
To measure ∆V
, the sensor is switched between operat-
be
ing currents of I and N x I. The resulting waveform is
passed through a 65kHz lowpass filter to remove noise,
GND
D+
D-
GND
Figure 10. Arrangement of Signal Tracks
10 mil.
10 mil.
10 mil.
10 mil.
10 mil.
10 mil.
10 mil.
4. Try to minimize the number of copper/solder joints,
which can cause thermocouple effects. Where copper/
solder joints are used, make sure that they are in both
the D+ and D- path and at the same temperature.
Thermocouple effects should not be a major problem as
o
1
C corresponds to about 240µV, and thermocouple
voltages are about 3µV/
o
C of temperature difference.
Unless there are two thermocouples with a big temperature differential between them, thermocouple voltages
should be much less than 200µV.
5. Place a 0.1µF bypass capacitor close to the ADM1026.
6. If the distance to the remote sensor is more than 8
inches, the use of twisted pair cable is recommended.
This will work up to about 6 to 12 feet.
7. For really long distances (up to 100 feet) use shielded
twisted pair such as Belden #8451 microphone cable.
Connect the twisted pair to D+ and D- and the shield
to GND close to the ADM1026. Leave the remote end
–16–
REV. PrP
PRELIMINARY TECHNICAL DA T A
ADM1026
of the shield unconnected to avoid ground loops.
Because the measurement technique uses switched current
sources, excessive cable and/or filter capacitance can
affect the measurement. When using long cables, the filter
capacitor may be reduced or removed.
Cable resistance can also introduce errors. 1⍀ series resistance introduces about 0.5
LIMIT VALUES
Limit values for analog measurements are stored in the
appropriate limit registers. In the case of voltage measurements, high and low limits can be stored so that an interrupt request will be generated if the measured value goes
above or below acceptable values. In the case of temperature, a Hot Temperature or High Limit can be programmed, and a Hot Temperature Hysteresis or Low
Limit, which will usually be some degrees lower. This
can be useful as it allows the system to be shut down when
the hot limit is exceeded, and re-started automatically
when it has cooled down to a safe temperature.
ANALOG MONITORING CYCLE TIME
The analog monitoring cycle begins when a one is written to
the Start Bit (bit 0), and a zero to the INT_Clear Bit (bit 2)
of the Configuration Register. INT_Enable (Bit 1) should
be set to one to enable the INT output. The ADC measures
each analog input in turn, starting with remote temperature
channel 1 and ending with local temperature. As each measurement is completed the result is automatically stored in
the appropriate value register. This "round-robin" monitoring cycle continues until it is disabled by writing a 0 to bit 0
of the Configuration Register.
As the ADC will normally be left to free-run in this manner, the time taken to monitor all the analog inputs will
normally not be of interest, as the most recently measured
value of any input can be read out at any time.
For applications where the monitoring cycle time is important, it can easily be calculated.
The total number of channels measured is:
5 dedicated supply voltage inputs
10 general purpose analog inputs
3.3V
MAIN
3.3V
STBY
Local temperature
2 remote temperature
Pins 28 and 27 are measured both as analog inputs AIN8/
AIN9 and as remote temperature input D2+/D2-, irrespective of which configuration is selected for these pins.
If pins 28 and 27 are configured as AIN8/AIN9, the measurements for these channels are stored in registers 27h and
29h and the invalid temperature measurement is discarded.
On the other hand, if pins 28 and 27 are configured as
D2+/D2-, the temperature measurement is stored in register 29h and there will be no valid result in register 27h.
As mentioned previously, the ADC performs a conversion
every 711µs on the analog and local temperature inputs and
every 2.13ms on the remote temperature inputs. Each input
REV. PrP
o
C error.
–17–
is measured 16 times and averaged to reduce noise.
The total monitoring cycle time for voltage and tempera-
ture inputs is therefore nominally:
(18 ⫻ 16 ⫻ 0.711) + (2 ⫻ 16 ⫻ 2.13) = 273ms
The ADC uses the internal 22.5kHz clock, which has a
tolerance of ±6%, so the worst case monitoring cycle time
is 290ms.
The fan speed measurement uses a completely separate
monitoring loop, as described later.
INPUT SAFETY
Scaling of the analog inputs is performed on chip, so external attenuators are normally not required. However,
since the power supply voltages will appear directly at the
pins, its is advisable to add small external resistors (e.g.
500Ω) in series with the supply traces to the chip to prevent damaging the traces or power supplies should an accidental short such as a probe connect two power supplies
together.
As the resistors will form part of the input attenuators,
they will affect the accuracy of the analog measurement if
their value is too high.
The worst such accident would be connecting -12V to
+12V - a total of 24V difference, with the series resistors
this would draw a maximum current of approx. 24mA.
REFERENCE OUTPUT
The ADM1026 has a buffered reference voltage output
(pin 24), which can be programmed to 1.82V or 2.5V by
clearing or setting bit 2 of Configuration Register 3 (address 07h).
ANALOG OUTPUT
The ADM1026 has a single analog output from an unsigned 8 bit DAC which produces 0 - 2.5V (independent
of the reference voltage setting). The input data for this
DAC is contained in the DAC Control register (address
04h) The DAC Control Register defaults to FFh during
power-on reset, which produces maximum fan speed. The
analog output may be amplified and buffered with external circuitry such as an op-amp and transistor to provide
fan speed control. During automatic fan speed control, described later, the four MSBs of this register set the minimum fan speed.
Suitable fan drive circuits are given in Figures 11a to 11e.
When using any of these circuits, the following points
should be noted:
1. All of these circuits will provide an output range from
zero to almost +12V, apart from Figure 11a which
loses the base-emitter voltage drop of Q1 due to the
emitter-follower configuration.
2. To amplify the 2.5V range of the analog output up to
12V, the gain of these circuits needs to be around 4.8.
3. Care must be taken when choosing the op-amp to en-
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