ANALOG DEVICES ADIS16228 Service Manual

with FFT Analysis and Storage
ADIS16228
Rev. B
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Trademarks and registered trademarks are the property of their respective owners.
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ADIS16228
RECORD
STORAGE
ALARMS
INPUT/
OUTPUT
CONTROLLER
ADC
TRIAXIAL
MEMS
SENSOR
TEMP
SENSOR
SUPPLY
POWER
MANAGEMENT
CS
SCLK
DIN
DOUT
GND
VDDRSTDIO1
CONTROL
REGISTERS
SPI
PORT
OUTPUT
REGISTERS
FILTER
WINDOW
FFT
CAPTURE
BUFFER
10069-001
DIO2
Data Sheet

FEATURES

Frequency domain triaxial vibration sensor Flat frequency response up to 5 kHz Digital acceleration data, ±18 g measurement range
Digital range settings: 0 g to 1 g/5 g/10 g/20 g Real-time sample mode: 20.48 kSPS, single-axis Capture sample modes: 20.48 kSPS, three axes
Trigger modes: SPI, timer, external
Programmable decimation filter, 11 rate settings
Multirecord capture for selected filter settings
Manual capture mode for time domain data collection FFT, 512-point, real valued, all three axes (x, y, z)
3 windowing options: rectangular, Hanning, flat top
Programmable FFT averaging: up to 255 averages Storage: 14 FFT records on all three axes (x, y, z) Programmable alarms, 6 spectral bands
2-level settings for warning and fault definition
Adjustable response delay to reduce false alarms Internal self-test with status flags Digital temperature and power supply measurements 2 auxiliary digital I/Os SPI-compatible serial interface Identification registers: serial number, device ID, user ID Single-supply operation: 3.0 V to 3.6 V Operating temperature range: −40°C to +125°C 15 mm × 24 mm × 15 mm aluminum package, flex connector

APPLICATIONS

Vibration analysis Condition monitoring Machine health Instrumentation, diagnostics Safety shutoff sensing
Digital Triaxial Vibration Sensor

GENERAL DESCRIPTION

The ADIS16228 iSensor® is a complete vibration sensing system that combines triaxial acceleration sensing with advanced time domain and frequency domain signal processing. Time domain signal processing includes a programmable decimation filter and selectable windowing function. Frequency domain processing includes a 512-point, real-valued FFT for each axis, along with FFT averaging, which reduces the noise floor variation for finer resolution. The 14-record FFT storage system offers users the ability to track changes over time and capture FFTs with multiple decimation filter settings.
The 20.48 kSPS sample rate and 5 kHz flat frequency band provide a frequency response that is suitable for many machine health applications. The aluminum core provides excellent mechanical coupling to the MEMS acceleration sensors. An internal clock drives the data sampling and signal processing system during all operations, which eliminates the need for an external clock source. The data capture function has three modes that offer several options to meet the needs of many different applications. In addition, real-time mode provides direct access to streaming data on one axis. The SPI and data buffer structure provide convenient access to data output. The ADIS16228 also offers a digital temperature sensor and digital power supply measurements.
The ADIS16228 is available in a 15 mm × 24 mm × 15 mm module with flanges, machine screw holes (M2 or 2-56), and a flexible connector that enables simple user interface and installation. It has an extended operating temperature range of −40°C to +125°C.

FUNCTIONAL BLOCK DIAGRAM

responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Spe cifications subject to change without n otice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Figure 1.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700
www.analog.com
ADIS16228 Data Sheet

TABLE OF CONTENTS

Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Timing Specifications .................................................................. 4
Absolute Maximum Ratings ............................................................ 5
ESD Caution .................................................................................. 5
Pin Configuration and Function Descriptions ............................. 6
Theory of Operation ........................................................................ 7
Sensing Element ........................................................................... 7
Signal Processing .......................................................................... 7
User Interface ................................................................................ 7
Basic Operation................................................................................. 8
SPI Write Commands .................................................................. 8
SPI Read Commands ................................................................... 8
Data Recording and Signal Processing ........................................ 11
Recording Mode ......................................................................... 11
Spectral Record Production ...................................................... 12
Sample Rate/Filtering ................................................................. 12
Dynamic Range/Sensitivity ....................................................... 14
Pre-FFT Windowing .................................................................. 15
FFT ............................................................................................... 16
Recording Times ......................................................................... 16
Data Records ............................................................................... 16
FFT Record Flash Endurance ................................................... 16
Spectral Alarms ............................................................................... 17
Alarm Definition ........................................................................ 17
Alarm Indicator Signals ............................................................. 18
Alarm Flags and Conditions ..................................................... 18
Alarm Status ................................................................................ 19
Worst -Case Condition Monitoring.......................................... 19
Reading Output Data ..................................................................... 20
Reading Data from the Data Buffer ......................................... 20
Accessing FFT Record Data ...................................................... 20
Data Format ................................................................................ 21
Real-Time Data Collection ....................................................... 21
Power Supply/Temperature ....................................................... 21
FFT Event Header ...................................................................... 22
System Tools .................................................................................... 23
Global Commands ..................................................................... 23
Status/Error Flags ....................................................................... 23
Power-Down ............................................................................... 23
Operation Managment .............................................................. 24
Input/Output Functions ............................................................ 24
Self-Tes t ....................................................................................... 25
Flash Memory Management ..................................................... 25
Device Identification .................................................................. 25
Applications Information .............................................................. 26
Interface Board ........................................................................... 26
Mating Connector ...................................................................... 26
Outline Dimensions ....................................................................... 27
Ordering Guide .......................................................................... 27

REVISION HISTORY

3/12—Rev. A to Rev. B
Changes to Recording Times Section and Table 21 ................... 16
Changes to Interface Board Section ............................................. 26
8/11—Rev. 0 to Rev. A
Changes to General Description .................................................... 1
Changes to Output Noise and Bandwidth Parameters, Table 1 .... 3
Added CAL_ENABLE Register to Table 8 .................................. 10
Changes to Real-Time Mode Section; Changes to Table 11;
Change to Figure 14 ....................................................................... 12
Changes to Figure 15 ...................................................................... 13
Added Dynamic Range/Sensitivity Section; Added Table 13, Renumbered Sequentially; Added Figure 16, Figure 17, and
Figure 18, Renumbered Sequentially ........................................... 14
Rev. B | Page 2 of 28
Change to Dynamic Range Settings Section............................... 15
Changes to Recording Times Section .......................................... 16
Changes to Figure 20 and Figure 21 ............................................ 20
Changes to Table 49, Table 50, and Table 51; Change to
Real-Time Data Collection Section ............................................. 21
Change to Power-Down Section .................................................. 23
7/11—Revision 0: Initial Version
Data Sheet ADIS16228
Bandwidth
±5% flatness,2 CAL_ENABLE[4] = 0, see Figure 17
840 Hz
FLASH MEMORY

SPECIFICATIONS

TA = −40°C to +125°C, VDD = 3.3 V, unless otherwise noted.
Table 1.
Parameter Test Conditions/Comments Min Typ Max Unit
ACCELEROMETERS
Measurement Range1 TA = 25°C ±18
Sensitivity, FFT TA = 25°C, 0 g to 20 g range setting 0.3052 mg/LSB
Sensitivity, Time Domain TA = 25°C 0.6104 mg/LSB
Sensitivity Error TA = 25°C ±6 %
Nonlinearity With respect to full scale ±0.2 ±1.25 %
Cross-Axis Sensitivity 2.6 %
Alignment Error With respect to package 1.5 Degrees
Offset Error TA = 25°C ±1
Offset Temperature Coefficient 1 mg/°C
Output Noise TA = 25°C, 20.48 kHz sample rate, time domain 12 mg rms
Output Noise Density TA = 25°C, 10 Hz to 1 kHz 0.248 mg/√Hz
±5% flatness,2 CAL_ENABLE[4] = 1, see Figure 18 5000 Hz
Sensor Resonant Frequency 5.5 kHz
LOGIC INPUTS3
Input High Voltage, V
Input Low Voltage, V
Logic 1 Input Current, I
Logic 0 Input Current, I
All Except RST
RST
−1 mA
2.0 V
INH
0.8 V
INL
VIH = 3.3 V ±0.2 ±1 µA
INH
VIL = 0 V
INL
−40 −60 µA
Input Capacitance, CIN 10 pF
DIGITAL OUTPUTS3
Output High Voltage, VOH I
Output Low Voltage, VOL I
= 1.6 mA 2.4 V
SOURCE
= 1.6 mA 0.4 V
SINK
g
g
Endurance4 10,000 Cycles
Data Retention5 TJ = 85°C, see Figure 23 20 Years
START-UP TIME6
Initial Startup 202 ms
Reset Recovery7
pulse low or GLOB_CMD[7] = 1 54 ms
RST
Sleep Mode Recovery 2.3 ms
CONVERSION RATE REC_CTRL1[11:8] = 0x1 (SR0 sample rate selection) 20.48 kSPS
Clock Accuracy 3 %
POWER SUPPLY Operating voltage range, VDD 3.0 3.3 3.6 V
Power Supply Current Record mode, TA = 25°C 40 48 mA
Sleep mode, TA = 25°C 230 µA
1
The maximum range depends on the frequency of vibration.
2
Assumes that frequency flatness calibration is enabled.
3
The digital I/O signals are 5 V tolerant.
4
Endurance is qualified as per JEDEC Standard 22, Method A117 and measured at −40°C, +25°C, +85°C, and +125°C.
5
Retention lifetime equivalent at junction temperature (TJ) = 85°C as per JEDEC Standard 22, Method A117. Retention lifetime depends on junction temperature.
6
The start-up times presented reflect the time it takes for data collection to begin.
7
RST
The
pin must be held low for at least 15 ns.
Rev. B | Page 3 of 28
ADIS16228 Data Sheet
CS
SCLK
DOUT
DIN
1 2 3 4 5 6 15 16
R/W A5A6 A4 A3 A2
D2
MSB DB14
D1 LSB
DB13 DB12 DB10DB11 DB2 LSBDB1
t
CS
t
SFS
t
DAV
t
SR
t
SF
t
DHD
t
DSU
10069-002
CS
SCLK
t
STALL
10069-003

TIMING SPECIFICATIONS

TA = 25°C, VDD = 3.3 V, unless otherwise noted.
Table 2.
Parameter Description Min1 Typ Max Unit
f
SCLK frequency 0.01 2.5 MHz
SCLK
t
Stall period between data, between 16th and 17th SCLK 16.5 µs
STAL L
tCS Chip select to SCLK edge 48.8 ns t
DOUT valid after SCLK edge 100 ns
DAV
t
DIN setup time before SCLK rising edge 24.4 ns
DSU
t
DIN hold time after SCLK rising edge 48.8 ns
DHD
tSR SCLK rise time 12.5 ns tSF SCLK fall time 12.5 ns tDF, tDR DOUT rise/fall times 5 12.5 ns t
SFS
1
Guaranteed by design, not tested.

Timing Diagrams

high after SCLK edge 5 ns
CS
Figure 2. SPI Timing and Sequence
Figure 3. DIN Bit Sequence
Rev. B | Page 4 of 28
Data Sheet ADIS16228
Any Axis, Unpowered
2000 g

ABSOLUTE MAXIMUM RATINGS

Table 3.
Parameter Rating
Acceleration
Any Axis, Powered 2000 g
VDD to GND −0.3 V to +6.0 V Digital Input Voltage to GND −0.3 V to +5.3 V Digital Output Voltage to GND −0.3 V to +3.6 V Analog Inputs to GND −0.3 V to +3.6 V Temperature
Operating Temperature Range −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Table 4. Package Characteristics
Package Type θJA θJC Device Weight
15-Lead Module 31°C/W 11°C/W 6.5 grams

ESD CAUTION

Rev. B | Page 5 of 28
ADIS16228 Data Sheet
10069-004
TOP VIEW
BOTTOM VIEW
PIN 15
PIN 15
PIN 1
PIN 1
NOTES
1. LEADS ARE E X P OSED COPPER P ADS THAT ARE LOCATED ON THE BOTTOM SIDE OF THE FLEXIBLE INTERFACE CABLE.
2. PACKAGE IS NOT SUITABLE FOR SOLDER REFLOW ASSEMBLY PROCESSES.
3. EXAMPLE MATING CONNECTOR:AVX CORPORATION
FLAT FLEXIBLE CONNECTOR (FFC) P/N: 04-6288-015-000- 846.
3, 4, 5, 8
GND S Ground.

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

Figure 4. Pin Configuration
Table 5. Pin Function Descriptions
Pin No. Mnemonic Type1 Description
1, 2 VDD S Power Supply, 3.3 V.
6, 9 DNC N/A No Connect. Do not connect to these pins. 7 DIO2 I/O Digital Input/Output Line 2. 10
I Reset, Active Low.
RST 11 DIN I SPI, Data Input. 12 DOUT O SPI, Data Output. DOUT is an output when CS is low. When CS is high,
DOUT is in a three-state, high impedance mode. 13 SCLK I SPI, Serial Clock. 14
I SPI, Chip Select.
CS
15 DIO1 I/O Digital Input/Output Line 1.
1
S is supply, O is output, I is input, and I/O is input/output.
Rev. B | Page 6 of 28
Data Sheet ADIS16228
MOVABLE FRAME
ACCELERATION
UNIT FORCING CELL
UNIT SENSING CELL
MOVING
PLATE
FIXED PLATES
PLATE CAPACITORS
ANCHOR
ANCHOR
10069-005
TRIAXIAL
MEMS
SENSOR
CLOCK
CONTROLLER
CAPTURE
BUFFER
CONTROL
REGISTERS
SPI SIGNALS
SPI PORT
OUTPUT
REGISTERS
TEMP
SENSOR
ADC
10069-006
CS SCLK DIN DOUT
NONVOLATILE
FLASH MEMORY
(NO SPI ACCESS)
MANUAL
FLASH
BACKUP
START-UP
RESET
VOLATILE
SRAM
SPI ACCESS
10069-007

THEORY OF OPERATION

The ADIS16228 is a vibration sensing system that combines a triaxial MEMS accelerometer with advanced signal processing. The SPI-compatible port and user register structure provide convenient access to frequency domain vibration data and many user controls.

SENSING ELEMENT

Digital vibration sensing in the ADIS16228 starts with a MEMS accelerometer core on each axis. Accelerometers translate linear changes in velocity into a representative electrical signal, using a micromechanical system like the one shown in Figure 5. The mechanical part of this system includes two different frames (one fixed, one moving) that have a series of plates to form a variable, differential capacitive network. When experiencing the force associated with gravity or acceleration, the moving frame changes its physical position with respect to the fixed frame, which results in a change in capacitance. Tiny springs tether the moving frame to the fixed frame and govern the relationship between acceleration and physical displacement. A modulation signal on the moving plate feeds through each capacitive path into the fixed frame plates and into a demodulation circuit, which produces the electrical signal that is proportional to the acceleration acting on the device.

SIGNAL PROCESSING

Figure 6 offers a simplified block diagram for the ADIS16228. The signal processing stage includes time domain data capture, digital decimation/filtering, windowing, FFT analysis, FFT averaging, and record storage. See Figure 14 for more details on the signal processing operation.
Figure 5. MEMS Sensor Diagram
Figure 6. Simplified Sensor Signal Processing Block Diagram

USER INTERFACE

SPI Interface

The user registers (which include both the output registers and the control registers, as shown in Figure 6) manage user access to both sensor data and configuration inputs. Each 16-bit register has its own unique bit assignment and two addresses: one for its upper byte and one for its lower byte. Table 8 provides a memory map for each register, along with its function and lower byte address. The data collection and configuration command uses the SPI, which consists of four wires. The chip select ( activates the SPI interface, and the serial clock (SCLK) synchronizes the serial data lines. Input commands clock into the DIN pin, one bit at a time, on the SCLK rising edge. Output data clocks out of the DOUT pin on the SCLK falling edge. When the SPI is used as a slave device, the DOUT contents reflect the information requested using a DIN command.

Dual-Memory Structure

The user registers provide addressing for all input/output operations in the SPI interface. The control registers use a dual-memory structure. The controller uses SRAM registers for normal operation, including user-configuration commands. The flash memory provides nonvolatile storage for control registers that have flash backup (see Table 8). Storing configuration data in the flash memory requires a manual flash update command (GLOB_CMD[6] = 1, DIN = 0xBE40). When the device powers on or resets, the flash memory contents load into the SRAM, and the device starts producing data according to the configuration in the control registers.
CS
) signal
Rev. B | Page 7 of 28
Figure 7. SRAM and Flash Memory Diagram
ADIS16228 Data Sheet
SYSTEM PROCESSOR SPI MASTER
ADIS16228
SCLK
CS
DIN DOUT
SCLK
SS
MOSI MISO
3.3V
IRQ2 IRQ1
DIO2
VDD
I/O LINES ARE COMPATIBLE WITH
3.3V OR 5V LOGIC LEVELS
14
13
11
12
7
DIO1
15
1 2
3 4 5 8
10069-008
UPPER BYTE
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
LOWER BYTE
10069-009
CS
DIN
SCLK
10069-010
DOUT = 0011 1111 0110 0100 = 0x3F64 = 16,228 = P ROD_ID
SCLK
CS
DIN
DOUT
10069-011
R/W
R/W
A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0
DB0DB1DB2DB3DB4DB5DB6DB7DB8DB9DB10DB11DB12DB13DB14DB15
NOTES
1. DOUT BITS ARE BASED ON THE PREVIOUS 16-BIT SEQUENCE (R/W = 0).
CS
SCLK
DIN
DOUT
A6 A5
DB13DB14
DB15
10069-012

BASIC OPERATION

The ADIS16228 uses a SPI for communication, which enables a simple connection with a compatible, embedded processor platform, as shown in Figure 8. The factory default configuration for DIO1 provides a busy indicator signal that transitions low when an event completes and data is available for user access. Use the DIO_CTRL register (see Table 66) to reconfigure DIO1 and DIO2, if necessary.
Figure 8. Electrical Hook-Up Diagram
Table 6. Generic Master Processor Pin Names and Functions
Pin Name Function
Slave select
SS SCLK Serial clock MOSI Master output, slave input MISO Master input, slave output IRQ1, IRQ2 Interrupt request inputs (optional)
The ADIS16228 SPI interface supports full duplex serial communication (simultaneous transmit and receive) and uses the bit sequence shown in Figure 12. Tab l e 7 provides a list of the most common settings that require attention to initialize a processor serial port for the ADIS16228 SPI interface.
Table 7. Generic Master Processor SPI Settings
Processor Setting Description
Master The ADIS16228 operates as a slave. SCLK Rate ≤ 2.5 MHz Bit rate setting. SPI Mode 3 Clock polarity/phase
(CPOL = 1, CPHA = 1). MSB First Bit sequence. 16-Bit Shift register/data length.
Tabl e 8 provides a list of user registers with their lower byte addresses. Each register consists of two bytes that each has its own unique 7-bit address. Figure 9 relates the bits of each register to their upper and lower addresses.
Figure 9. Generic Register Bit Definitions

SPI WRITE COMMANDS

User control registers govern many internal operations. The DIN bit sequence in Figure 12 provides the ability to write to these registers, one byte at a time. Some configuration changes and functions require only one write cycle. For example, set GLOB_CMD[11] = 1 (DIN = 0xBF08) to start a manual capture sequence. The manual capture starts immediately after the last bit clocks into DIN (16
th
SCLK rising edge). Other configurations may
require writing to both bytes.
Figure 10. SPI Sequence for Manual Capture Start (DIN = 0xBF08)

SPI READ COMMANDS

A single register read requires two 16-bit SPI cycles that also use the bit assignments that are shown in Figure 12. The first sequence sets (Bits[A6:A0]). Bits[D7:D0] are don’t care bit s for a read DIN sequence. DOUT clocks out the requested register contents during the second sequence. The second sequence can also use DIN to set up the next read. Figure 11 provides a signal diagram for all four SPI signals while reading the PROD_ID. In this diagram, DIN = 0x5600 and DOUT reflects the decimal equivalent of 16,228.
R
/W = 0 and communicates the target address
Figure 11. Example SPI Read, PROD_ID, Second Sequence
Figure 12. Example SPI Read Sequence
Rev. B | Page 8 of 28
Data Sheet ADIS16228
Z_BUF
Read only
No
0x18
0x8000
Output, buffer for z-axis acceleration data
See Table 51
ALM_PNTR
Read/write
Yes
0x30
0x0000
Alarm, spectral alarm band pointer
See Table 27
LOT_ID1
Read only
Yes
0x52
N/A
Lot identification code
See Table 69
REC_FLSH_CNT
Read only
No
0x5E
N/A
Record flash write/erase counter
See Table 24
Table 8. User Register Memory Map
Register Name
FLASH_CNT Read only Yes 0x00 N/A Status, flash memory write count See Table 68 X_SENS Read/write Yes 0x02 N/A X-axis accelerometer scale correction See Table 16 Y_SENS Read/write Ye s 0x04 N/A Y-axis accelerometer scale correction See Table 17 Z_SENS Read/write Ye s 0x06 N/A Z-axis accelerometer scale correction See Table 18 TEMP_OUT Read only No 0x08 0x8000 Output, temperature during capture See Table 56 SUPPLY_OUT Read only No 0x0A 0x8000 Output, power supply during capture See Table 54 FFT_AVG1 Read/write Yes 0x0C 0x0108 Control, FFT average size of 1, SR0 and SR1 See Table 19 FFT_AVG2 Read/write Yes 0x0E 0x0101 Control, FFT average size of 2, SR2 and SR3 See Table 20 BUF_PNTR Read/write No 0x10 0x0000 Control, buffer address pointer See Table 47 REC_PNTR Read/write No 0x12 0x0000 Control, record address pointer See Table 48 X_BUF Read only No 0x14 0x8000 Output, buffer for x-axis acceleration data See Table 49 Y_BUF Read only No 0x16 0x8000 Output, buffer for y-axis acceleration data See Table 50
REC_CTRL1 Read/write Yes 0x1A 0x1100 Control, Record Control Register 1 See Table 9 REC_CTRL2 Read/write Yes 0x1C 0x00FF Control, Record Control Register 2 See Table 14 REC_PRD Read/write Yes 0x1E 0x0000 Control, record period (automatic mode) See Table 10 ALM_F_LOW Read/write N/A 0x20 0x0000 Alarm, spectral band lower frequency limit See Table 28 ALM_F_HIGH Read/write N/A 0x22 0x0000 Alarm, spectral band upper frequency limit See Table 29 ALM_X_MAG1 Read/write N/A 0x24 0x0000 Alarm, x-axis, Alarm Trigger Level 1 (warning) See Table 30 ALM_Y_MAG1 Read/write N/A 0x26 0x0000 Alarm, y-axis, Alarm Trigger Level 1 (warning) See Table 31 ALM_Z_MAG1 Read/write N/A 0x28 0x0000 Alarm, z-axis, Alarm Trigger Level 1 (warning) See Table 32 ALM_X_MAG2 Read/write N/A 0x2A 0x0000 Alarm, x-axis, Alarm Trigger Level 2 (fault) See Table 33 ALM_Y_MAG2 Read/write N/A 0x2C 0x0000 Alarm, y-axis, Alarm Trigger Level 2 (fault) See Table 34 ALM_Z_MAG2 Read/write N/A 0x2E 0x0000 Alarm, z-axis, Alarm Trigger Level 2 (fault) See Table 35
Access
Flash Backup
Address Default Function Reference
ALM_S_MAG Read/write Ye s 0x32 0x0000 Alarm, system alarm level See Table 36 ALM_CTRL Read/write Yes 0x34 0x0080 Alarm, configuration See Table 26 DIO_CTRL Read/write Yes 0x36 0x000F Control, functional I/O configuration See Table 66 GPIO_CTRL Read/write Yes 0x38 0x0000 Control, general-purpose I/O See Table 67 AVG_CNT Read/write Yes 0x3A 0x9630 Control, average count for sample rate options See Table 11 DIAG_STAT Read only No 0x3C 0x0000 Status, system error flags See Table 65 GLOB_CMD Write only No 0x3E N/A Control, global command register See Table 64 ALM_X_STAT Read only N/A 0x40 0x0000 Alarm, x-axis, status for spectral alarm bands See Table 37 ALM_Y_STAT Read only N/A 0x42 0x0000 Alarm, y-axis, status for spectral alarm bands See Table 38 ALM_Z_STAT Read only N/A 0x44 0x0000 Alarm, z-axis, status for spectral alarm bands See Table 39 ALM_X_PEAK Read only N/A 0x46 0x0000 Alarm, x-axis, peak value (most severe alarm) See Table 40 ALM_Y_PEAK Read only N/A 0x48 0x0000 Alarm, y-axis, peak value (most severe alarm) See Table 41 ALM_Z_PEAK Read only N/A 0x4A 0x0000 Alarm, z-axis, peak value (most severe alarm) See Table 42 TIME_STAMP_L Read only N/A 0x4C 0x0000 Record time stamp, lower word See Table 61 TIME_STAMP_H Read only N/A 0x4E 0x0000 Record time stamp, upper word See Table 62 Reserved N/A N/A 0x50 N/A N/A
LOT_ID2 Read only Yes 0x54 N/A Lot identification code See Table 70 PROD_ID Read only Ye s 0x56 0x3F64 Product identifier; convert to decimal = 16,228 See Table 71 SERIAL_NUM Read only Ye s 0x58 N/A Serial number See Table 72 USER_ID Read/write Ye s 0x5C 0x0000 User identification register See Table 73
Reserved N/A N/A 0x62 N/A N/A Reserved N/A N/A 0x64 N/A N/A Reserved N/A N/A 0x66 N/A N/A Reserved N/A N/A 0x68 N/A N/A
Rev. B | Page 9 of 28
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