rights of third parties that may result from its use. Specifications subject to change without notice. No
Trademarks and registered trademarks are the prop erty of their respective own ers.
Technical Supportwww.analog.com
FREQUENCY (Hz)
10k100k
1M10M100M1G10G
–100
–90
–70
–60
–50
–40
–30
–80
–20
–10
0
ISOLATION (dB)
S21
VDD = 2.5V
TA = 25°C
S12
03335-003
RF2
RF1
CTRL
ADG918
RFC
50Ω
50Ω
ADG919
RF2
RF1
CTRL
RFC
03335-001
FREQUENC
Y (Hz)
10k100k1M
10M100M
1G10G
–3.2
–2.8
–2.6
–2.4
–2.2
–1.8
–1.6
–1.4
–1.2
–1.0
–2.0
–3.0
–0.8
–0.6
–0.4
INSERTION LOSS (dB)
V
DD
= 2.5V
T
A
= 25°C
03335-004
Data Sheet
FEATURES
Wideband switch: −3 dB at 4 GHz
Absorptive/reflective switches
High off isolation (43 dB at 1 GHz)
Low insertion loss (0.8 dB at 1 GHz)
Single 1.65 V to 2.75 V power supply
CMOS/LVTTL control logic
8-lead MSOP and tiny 3 mm × 3 mm LFCSP
Low power consumption (<1 µA)
APPLICATIONS
Wireless communications
General-purpose RF switching
Dual-band applications
High speed filter selection
Digital transceiver front end switch
IF switching
Tuner modules
Antenna diversity switching
GENERAL DESCRIPTION
The ADG918/ADG919 are wideband switches using a CMOS
process to provide high isolation and low insertion loss to
1 GHz. The ADG918 is an absorptive (matched) switch having
50 Ω terminated shunt legs, whereas the ADG919 is a reflective
switch. These devices are designed such that the isolation is
high over the dc to 1 GHz frequency range. They have on-board
CMOS control logic, thus eliminating the need for external
controlling circuitry. The control inputs are both CMOS and
LVTTL compatible. The low power consumption of these
CMOS devices makes them ideally suited to wireless and
general-purpose high frequency switching applications.
FUNCTIONAL BLOCK DIAGRAMS
Figure 2.
PRODUCT HIGHLIGHTS
1. −43 dB off isolation at 1 GHz.
2. 0.8 dB insertion loss at 1 GHz.
3. Tiny 8-lead MSOP/LFCSP.
Figure 1. Off Isolation vs. Frequency
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Updated Format .................................................................. Universal
Change to Data Sheet Title ............................................................... 1
Change to Features ............................................................................ 1
Change to Product Highlights ......................................................... 1
Changes to Specifications ................................................................. 3
Change to ADG9xx Evaluation Board section ........................... 13
Changes to Ordering Guide .......................................................... 14
8/03—Revision 0: Initial Version
Rev. D | Page 2 of 16
Data Sheet ADG918/ADG919
(CP Package)
500 MHz
46
49 dB
(CP Package)
500 MHz
41
44
On Switching Time3
tON
50% CTRL to 90% RF
6.6
10
ns
Video Feedthrough4
2.5 mV p-p
SPECIFICATIONS
VDD = 1.65 V to 2.75 V, GND = 0 V, input power = 0 dBm, all specifications T
B Version: −40°C to +85°C.
Table 1.
B Version
Parameter Symbol Test Conditions/Comments Min Typ1 Max Unit
AC ELECTRICAL CHARACTERISTICS
Operating Frequency2 dc 2 GHz
3 dB Frequency3 4 GHz
Input Power3 0 V dc bias 7 dBm
0.5 V dc bias 16 dBm
Insertion Loss S21, S12 DC to 100 MHz; VDD = 2.5 V ± 10% 0.4 0.7 dB
500 MHz; VDD = 2.5 V ± 10% 0.5 0.8 dB
1000 MHz; VDD = 2.5 V ± 10% 0.8 1.25 dB
Isolation—RFC to RF1/RF2 S21, S12 100 MHz 57 60 dB
1000 MHz 36 43 dB
Isolation—RFC to RF1/RF2 S21, S12 100 MHz 55 60 dB
(RM Package) 500 MHz 43 47 dB
1000 MHz 34 37 dB
Isolation—RF1 to RF2 (Crosstalk) S21, S12 100 MHz 55 58
(RM Package) 500 MHz 39 42 1000 MHz 31 33
Return Loss (On Channel)3 S11, S22 DC to 100 MHz 21 27 dB
500 MHz 22 27 dB
1000 MHz 22 26 dB
Return Loss (Off Channel)3 S11, S22 DC to 100 MHz 18 23 dB
ADG918500 MHz 17 21 dB
1000 MHz 16 20 dB
Off Switching Time3 t
Rise Time3 t
Fall Time3 t
1 dB Compression3 P
50% CTRL to 10% RF 6.5 9.5 ns
OFF
10% to 90% RF 6.1 9 ns
RISE
90% to 10% RF 6.1 9 ns
FAL L
1000 MHz 17 dBm
–1 dB
Third Order Intermodulation Intercept IP3 900 MHz/901 MHz, 4 dBm 28.5 36 dBm
DC ELECTRICAL CHARACTERISTICS
Input High Voltage V
V
Input Low Voltage V
V
VDD = 2.25 V to 2.75 V 1.7 V
INH
VDD = 1.65 V to 1.95 V 0.65 VCC V
INH
VDD = 2.25 V to 2.75 V 0.7 V
INL
VDD = 1.65 V to 1.95 V 0.35 VCC V
INL
Input Leakage Current II 0 V ≤ VIN ≤ 2.75 V ± 0.1 ± 1 µA
Rev. D | Page 3 of 16
ADG918/ADG919 Data Sheet
B Version
Parameter Symbol Test Conditions/Comments Min Typ1 Max Unit
CAPACITANCE3
RF On Capacitance CRF ON f = 1 MHz 1.6 pF
CTRL Input Capacitance C
POWER REQUIREMENTS
VDD 1.65 2.75 V
Quiescent Power Supply Current IDD Digital inputs = 0 V or VDD 0.1 1 µA
1
Typical values are at VDD = 2.5 V and 25°C, unless otherwise stated.
2
Point at which insertion loss degrades by 1 dB.
3
Guaranteed by design, not subject to production test.
4
The dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 Ω test setup, measured with 1 ns
rise time pulses and 500 MHz bandwidth.
f = 1 MHz 2 pF
CTRL
Rev. D | Page 4 of 16
Data Sheet ADG918/ADG919
Inputs to GND
−0.5 V to VDD + 0.3 V
Storage Temperature Range
−65°C to +150°C
4-Layer Board
48°C/W
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 2.
Parameter Rating
VDD to GND −0.5 V to +4 V
Continuous Current 30 mA
Input Power 18 dBm
Operating Temperature Range
Industrial (B Version) −40°C to +85°C
Junction Temperature 150°C
θJA Thermal Impedance
MSOP 206°C/W
LFCSP
2-Layer Board 84°C/W
Lead Temperature, Soldering (10 sec) 300°C
IR Reflow, Peak Temperature (<20 sec) 235°C
ESD 1 kV
1
RF1 and RF2 off port inputs to ground: −0.5 V to VDD – 0.5 V.
1
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ESD CAUTION
Rev. D | Page 5 of 16
ADG918/ADG919 Data Sheet
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
1
V
DD
ADG918/
2
CTRL
GND
RFC
ADG919
3
TOP VIEW
(Not to Scale)
4
Figure 4. ADG918/ADG919 Pin Configuration (MSOP)
8
RF1
7
GND
6
GND
5
RF2
03335-002
1V
DD
ADG918/
2CTRL
ADG919
3GND
TOP VIEW
(Not to Scale)
4RFC
NOTES
1. EXPOSED PAD. TIE THE EXPOSED
PAD TO SUBS TRATE, G ND.
8RF1
7GND
6GND
5RF2
03335-030
Figure 5. ADG918/ADG919 Pin Configuration (LFCSP)
Table 3. Pin Function Descriptions
Pin No.
MSOP LFCSP
Mnemonic Function
1 1 VDD Power Supply Input. These parts can be operated from 1.65 V to 2.75 V; decouple VDD to GND.
2 2 CTRL Logic Control Input. See Table 4.
3, 6, 7 3, 6, 7 GND Ground Reference Point for All Circuitry on the Part.
4 4 RFC COMMON RF Port for Switch.
5 5 RF2 RF2 Port.
8 8 RF1 RF1 Port.
Not applicable 0 EPAD Exposed Pad. Tie the exposed pad to substrate, GND.
Table 4. Truth Table
CTRL Signal Path
0 RF2 to RFC
1 RF1 to RFC
Rev. D | Page 6 of 16
Data Sheet ADG918/ADG919
–
–
–
L
A
L
A
TYPICAL PERFORMANCE CHARACTERISTICS
0.2
–0.4
–0.6
–0.8
VDD = 2.25V
–1.0
–1.2
–1.4
–1.6
–1.8
–2.0
–2.2
–2.4
INSERTION LOSS (dB)
–2.6
–2.8
–3.0
TA = 25°C
–3.2
10k100k1M10M100M1G10G
VDD = 2.5V
FREQUENCY (Hz)
VDD = 2.75V
Figure 6. Insertion Loss vs. Frequency over Supplies
(RF1/RF2, S12, and S21)
–0.30
–0.35
–0.40
–0.45
VDD = 2.5V
FREQUENCY (Hz)
INSERTION LOSS (dB)
–0.50
–0.55
–0.60
–0.65
–0.70
–0.75
–0.80
VDD = 2.25V
TA = 25°C
10k100k1M10M100M1G10G
VDD = 2.75V
Figure 7. Insertion Loss vs. Frequency over Supplies (RF1/RF2,
S12, and S21) (Zoomed Figure 5 Plot)
0.2
–0.4
–0.6
VDD = 1.8V
–0.8
–1.0
–1.2
–1.4
–1.6
–1.8
–2.0
–2.2
–2.4
INSERTION LOSS (dB)
–2.6
–2.8
TA = 25°C
–3.0
–3.2
10k100k1M10M100M1G10G
VDD= 1.65V
VDD = 1.95V
FREQUENCY (Hz)
03335-017
03335-019
03335-021
0.2
–0.4
–0.6
+25°C
0.8
–
–1.0
–1.2
–1.4
–1.6
–1.8
–2.0
–2.2
–2.4
INSERTION LOSS (dB)
–2.6
–2.8
VDD = 2.5V
–3.0
–3.2
10k100k1M10M100M1G10G
+85°C
FREQUENCY (Hz)
–40°C
Figure 9. Insertion Loss vs. Frequency over Temperature
(RF1/RF2, S12, and S21)
0
VDD = 1.65V TO 2.75V
T
= 25°C
–10
A
–20
–30
–40
TION (dB)
–50
ISO
–60
–70
–80
–90
10k100k1M10M100M1G10G
S12
S21
FREQUENCY ( Hz )
Figure 10. Isolation vs. Frequency over Supplies (RF1/RF2, ADG918)
0
VDD = 1.65V TO 2.75V
–10
T
= 25°C
A
–20
–30
–40
–50
TION (dB)
–60
–70
ISO
–80
–90
–100
10k100k1M10M100M1G10G
S12
S21
FREQUENCY (Hz)
03335-018
03335-020
03335-022
Figure 8. Insertion Loss vs. Frequency over Supplies
Figure 11. Isolation vs. Frequency over Supplies (RF1/RF2, ADG919)
(RF1/RF2, S12, and S21)
Rev. D | Page 7 of 16
ADG918/ADG919 Data Sheet
–20
FREQUENC
Y
(Hz)
10k
100k
1M10M
100M1G
10G
V
DD
= 2.5V
S12 (+85°C)
S12 (+25°C)
S12 (–40°C)
–90
–70
–60
–50
–40
–30
–80
–10
ISOLATION (dB)
–100
S21
03335-023
(–40°C, +25° C, +85°C)
T
A
= 25°C
V
DD
= 2.5V
OFF SWITCH (ADG918)
ON SWITCH
–35
–40
–30
–25
–20
–15
–10
–5
0
RETURN LOSS ( dB)
FREQUENCY (Hz)
10k100k1M10M100M1G10G
03335-026
–15
T
A
= 25°C
V
DD
= 2.5V
–35
–30
–25
–20
–55
–50
–45
–40
–10
CROSSTALK (dB)
–70
–60
–65
–75
–80
FREQUENCY
(Hz)
10k100k1M10M100M1G
10G
03335-028
CH1 = CTRL = 1V/DIVT
RISE
= 6.1ns
CH2 = RF1 = 100mV/DI VT
FALL
= 6.1ns
CH3 = RF2 = 100mV/DI V
CH2/3
CH1
03335-024
CH1 500mV CH2 1mVΩm 10.0ns
CTRL
RFC
CH2 p-p
2.002mV
03335-027
40
35
250350450550
FREQUENCY (MHz)
650750850
30
IP
3
(dBm)
25
20
15
10
5
0
VDD = 2.5V
T
A
= 25°C
03335-029
Figure 12. Isolation vs. Frequency over Temperature (RF1/RF2, ADG919)
Figure 13. Return Loss vs. Frequency (RF1/RF2, S11)
Figure 15. Switch Timing
Figure 16. Video Feedthrough
Figure 14. Crosstalk vs. Frequency (RF1/RF2, S12, S21)
Figure 17. IP3 vs. Frequency
Rev. D | Page 8 of 16
Data Sheet ADG918/ADG919
20
025050075010001250
FREQUENCY (MHz)
1500
P
–1dB
(dBm)
2
4
6
8
10
12
14
16
18
0
VDD = 2.5V
T
A
= 25°C
03335-025
Figure 18. P
vs. Frequency
−1 dB
Rev. D | Page 9 of 16
ADG918/ADG919 Data Sheet
TERMINOLOGY
t
VDD
Most positive power supply potential.
I
DD
Positive supply current.
GND
Ground (0 V) reference.
CTRL
Logic control input.
V
INL
Maximum input voltage for Logic 0.
V
INH
Minimum input voltage for Logic 1.
I
(I
)
INL
INH
Input current of the digital input.
C
IN
Digital input capacitance.
t
ON
Delay between applying the digital control input and the output
switching on.
t
OFF
Delay between applying the digital control input and the output
switching off.
t
RISE
Rise time; time for the RF signal to rise from 10% to 90% of the
on level.
FAL L
Fall time; time for the RF signal to fall from 90% to 10% of the
on level.
Off Isolation
The attenuation between the input and output ports of the
switch when the switch control voltage is in the off condition.
Insertion Loss
The attenuation between the input and output ports of the
switch when the switch control voltage is in the on condition.
P
–1 dB
1 dB compression point. The RF input power level at which the
switch insertion loss increases by 1 dB over its low level value. It
is a measure of how much power the on switch can handle
before the insertion loss increases by 1 dB.
IP
3
Third order intermodulation intercept. This is a measure of the
power in false tones that occur when closely spaced tones are
passed through a switch, whereby the nonlinearity of the switch
causes these false tones to be generated.
Return Loss
The amount of reflected power relative to the incident power at
a port. Large return loss indicates good matching. By measuring
return loss, the VSWR (voltage standing wave ratio) can be
calculated from conversion charts. VSWR indicates the degree
of matching present at a switch RF port.
Video Feedthrough
Spurious signals present at the RF ports of the switch when the
control voltage is switched from high to low or low to high
without an RF signal present.
Rev. D | Page 10 of 16
Data Sheet ADG918/ADG919
t
ON
50%
50%
90%
10%
V
CTR
L
V
OUT
t
OFF
V
DD
V
DD
0.1µF
V
S
CTRL
RFx
RFC
GND
R
L
50Ω
V
OUT
03335-009
V
CTRL
V
OUT
50%
50%
90%90%
10%
10%
t
FALL
t
RISE
V
DD
V
DD
0.1µF
V
S
CTRL
RFx
RFC
GND
R
L
50Ω
V
OUT
03335-010
V
S
NETWORK
ANA
LYZER
V
CTRL
OFF ISOLATION = 20log
V
OUT
V
S
V
DD
0.1µF
V
DD
50Ω
V
OUT
R
L
50Ω
ADG919
RF2
RF1
CTRL
RFC
GND
50Ω
03335-011
V
S
NETWORK
ANALYZER
V
CTRL
INSERTION LOSS = 20lo
g
V
OUT
V
S
V
DD
V
DD
0.1µF
50Ω
V
OUT
R
L
50Ω
ADG919
RF2
RF1
CTRL
RFC
GND
50Ω
03335-012
V
S
NETWORK
ANA
LYZER
V
CTRL
CROSSTALK = 20log
V
OUT
V
S
V
DD
0.1µF
V
DD
50Ω
V
OUT
R
L
50Ω
ADG919
RF2
RF1
CTRL
RFC
GND
50Ω
03335-013
V
CTRL
V
DD
0.1µF
V
DD
ADG919
RF2
RF1
CTRL
RFC
GND
NC
NC
OSCILLOSCOPE
03335-014
TEST CIRCUITS
Setups for the ADG918 are similar.
Figure 19. Switch Timing: tON, t
Figure 20. Switch
OFF
Figure 22. Insertion Loss
Figure 23. Crosstalk
Figure 21. Off Isolation
Figure 24. Video Feedthrough
Rev. D | Page 11 of 16
ADG918/ADG919 Data Sheet
SPECTRUM
ANALYZER
V
CTRL
V
DD
0.1µF
V
DD
ADG919
RF2
RF1
CTRL
RFC
GND
50Ω
COMBINER
RF
SOURCE
RF
SOURCE
03335-015
SPECTRUM
ANALYZER
V
CTRL
V
DD
0.1µF
V
DD
ADG919
RF2
RF1
CTRL
RFC
GND
50Ω
RF
SOURCE
V
S
03335-016
Figure 25. IP3
Figure 26. P
−1 dB
Rev. D | Page 12 of 16
Data Sheet ADG918/ADG919
APPLICATIONS INFORMATION
The ADG918/ADG919 are ideal solutions for low power, high
frequency applications. The low insertion loss, high isolation
between ports, low distortion, and low current consumption of
these parts make them excellent solutions for many high
frequency switching applications. The most obvious application
is in a transmit/receive block, as shown in the wireless metering
block diagram in Figure 27.
Other applications include switching between high frequency
filters, an ASK generator, an FSK generator, and an antenna
diversity switch in many tuner modules.
ABSORPTIVE VS. REFLECTIVE SWITCH
The ADG918 is an absorptive (matched) switch with 50 Ω
terminated shunt legs, and the ADG919 is a reflective switch
with 0 Ω terminated shunts to ground. The ADG918 absorptive
switch has a good VSWR on each port, regardless of the switch
mode. An absorptive switch should be used when there is a need
for a good VSWR that is looking into the port but not passing
the through signal to the common port. The ADG918 is therefore ideal for applications that require minimum reflections
back to the RF source. It also ensures that the maximum power
is transferred to the load.
The ADG919 reflective switch is suitable for applications where
high off port VSWR does not matter and the switch has some
other desired performance feature. It can be used in many
applications, including high speed filter selection. In most cases,
an absorptive switch can be used instead of a reflective switch,
but not vice versa.
WIRELESS METERING
The ADG918 can be used in wireless metering applications. It
can be used in conjunction with the ADF7020 transceiver IC for
a utility metering transceiver application, providing the
required isolation between the transmit and receive signals.
The SPDT configuration isolates the high frequency receive
signal from the high frequency transmit.
ANTENNA
ADG918
TX/RX SWITCH
Figure 27. Wireless Metering
LNA
PA
03335-005
TUNER MODULES
The ADG918 can be used in a tuner module to switch between
the cable TV input and the off-air antenna. This part is also
ideal for use as an antenna diversity switch, switching different
antenna to the tuner.
VGA
ANTENNA
CABLE
ADG918/
ADG919
Figure 28. Tuner Modules
TUNER
03335-006
FILTER SELECTION
The ADG919 can be used as a 2:1 demultiplex to switch high
frequency signals between different filters and also to multiplex
the signal to the output.
RFC
RF
OUT
03335-007
RF
IN
RFC
RF1
RF2
Figure 29. Filter Selection
RF1
RF2
ADG919ADG919
Rev. D | Page 13 of 16
ADG918/ADG919 Data Sheet
ADG918/ADG919 EVALUATION BOARD
The ADG918/ADG919 evaluation board allows designers to
evaluate the high performance wideband switches with a
minimum of effort.
In addition to the evaluation board, the user requires only a
power supply and a network analyzer. An application note is
available with the evaluation board and gives complete
information about operating the evaluation board.
The RFC port (see Figure 30) is connected through a 50 Ω
transmission line to the top left SMA connector J1. RF1 and
RF2 are connected through 50 Ω transmission lines to the top
two SMA connectors, J2 and J3 respectively. A through transmission line connects J4 and J5 and is used to estimate the loss
of the PCB over the environmental conditions being evaluated.
The board is constructed of a 4-layer, FR4 material with a
dielectric constant of 4.3 and an overall thickness of 0.062
inches. Two ground layers with grounded planes provide
ground for the RF transmission lines. The transmission lines
were designed using a coplanar waveguide with ground plane
model using a trace width of 0.052 inches, a clearance to ground
plane of 0.030 inches, a dielectric thickness of 0.029 inches, and
a metal thickness of 0.014 inches.
Figure 30. ADG918/ADG919 Evaluation Board Top View
03335-008
Rev. D | Page 14 of 16
Data Sheet ADG918/ADG919
COMPLI ANT TO JEDEC STANDARDS MO-187-AA
6°
0°
0.80
0.55
0.40
4
8
1
5
0.65 BSC
0.40
0.25
1.10 MAX
3.20
3.00
2.80
COPLANARITY
0.10
0.23
0.09
3.20
3.00
2.80
5.15
4.90
4.65
PIN 1
IDENTIFIER
15° MAX
0.95
0.85
0.75
0.15
0.05
10-07-2009-B
TOP VIEW
8
1
5
4
0.30
0.25
0.20
BOTTOM VIEW
PIN 1 INDEX
AREA
SEATING
PLANE
0.80
0.75
0.70
1.55
1.45
1.35
1.84
1.74
1.64
0.203 REF
0.05 MAX
0.02 NOM
0.50 BSC
EXPOSED
PAD
3.10
3.00 SQ
2.90
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COPLANARITY
0.08
0.50
0.40
0.30
COMPLIANT
TO
JEDEC STANDARDS MO-229-WEED
12-07-2010-A
P
IN 1
INDICA
T
O
R
(
R 0
.1
5
)
OUTLINE DIMENSIONS
Figure 31. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
Figure 32. 8-Lead Lead Frame Chip Scale Package [LFCSP]
ADG918BRM –40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 W4B
ADG918BRMZ –40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 W4B#
ADG918BRMZ-500RL7 –40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 W4B#
ADG918BRMZ-REEL –40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 W4B#
ADG918BRMZ-REEL7 –40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 W4B#
ADG918BCPZ-500RL7 –40°C to +85°C 8-Lead Lead Frame Chip Scale Package [LFCSP] CP-8-13 W4B#
ADG918BCPZ-REEL7 –40°C to +85°C 8-Lead Lead Frame Chip Scale Package [LFCSP] CP-8-13 W4B#
ADG919BRMZ –40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 S1X
ADG919BRMZ-REEL7 –40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 S1X
ADG919BCPZ-REEL7 –40°C to +85°C 8-Lead Lead Frame Chip Scale Package [LFCSP] CP-8-13 S1X
EVA L-ADG918EBZ Evaluation Board
1
Z = RoHS Compliant Part, # denotes RoHS compliant product may be top or bottom marked.
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D03335-0-3/16(D)
Rev. D | Page 16 of 16
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