Wideband 4 GHz, 43 dB Isolation at 1 GHz,
CMOS 1.65 V to 2.75 V, 2:1 Mux/SPDT Switches
FEATURES
Wideband switch: −3 dB @ 4 GHz
Absorptive/reflective switches
High off isolation (43 dB @ 1 GHz)
Low insertion loss (0.8 dB @1 GHz)
Single 1.65 V to 2.75 V power supply
CMOS/LVTTL control logic
8-lead MSOP and tiny 3 mm × 3 mm LFCSP packages
Low power consumption (<1 µA)
APPLICATIONS
Wireless communications
General-purpose RF switching
Dual-band applications
High speed filter selection
Digital transceiver front end switch
IF switching
Tuner modules
Antenna diversity switching
GENERAL DESCRIPTION
The ADG918/ADG919 are wideband switches using a CMOS
process to provide high isolation and low insertion loss to
1 GHz. The ADG918 is an absorptive (matched) switch having
50 Ω terminated shunt legs, while the ADG919 is a reflective
switch. These devices are designed such that the isolation is
high over the dc to 1 GHz frequency range. They have on-board
CMOS control logic, thus eliminating the need for external
controlling circuitry. The control inputs are both CMOS and
0
VDD = 2.5V
–10
= 25°C
T
A
0
2
–
–30
–40
–50
–60
ISOLATION (dB)
–70
–80
–90
–100
10k100k1M10M100M1G10G
S12
S21
FREQUENCY (Hz)
Figure 2. Off Is olation vs. Fre quency
03335-A-003
ADG918/ADG919
FUNCTIONAL BLOCK DIAGRAMS
RFC
CTRL
RFC
CTRL
LVTTL compatible. The low power consumption of these
CMOS devices makes them ideally suited to wireless
applications and general-purpose high frequency switching.
PRODUCT HIGHLIGHTS
1. –43 dB Off Isolation @ 1 GHz.
2. 0.8 dB Insertion Loss @ 1 GHz.
3. Tiny 8-Lead MSOP/LFCSP Packages.
–0.4
–0.6
.
8
0
–
–1.0
–1.2
–1.4
–1.6
–1.8
–2.0
–2.2
–2.4
INSERTION LOSS (dB)
–2.6
–2.8
VDD = 2.5V
T
= 25°C
A
–3.0
–3.2
10k100k1M10M100M1G10G
Figure 3. Insertion Loss vs. Frequency
ADG918
50Ω
ADG919
Figure 1.
FREQUENCY (Hz)
50Ω
RF1
RF2
RF1
RF2
03335-A-001
03335-A-004
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
Change to ADG9xx Evaluation Board section...……………….13
Changes to Ordering Guide…………………………………….14
8/03 Revision 0: Initial Version
Rev. A | Page 2 of 16
ADG918/ADG919
SPECIFICATIONS
Table 1. V
= 1.65 V to 2.75 V, GND = 0 V, input power = 0 dBm, all specifications T
DD
MIN
to T
, unless otherwise noted.
MAX
B Version
Parameter Symbol Conditions Min Typ
2
Max Unit
AC ELECTRICAL CHARACTERISTICS
Operating Frequency
3
DC 2 GHz
3 dB Frequency4 4 GHz
Input Power4 0 V dc Bias 7 dBm
0.5 V dc Bias 16 dBm
Insertion Loss S21, S12 DC to 100 MHz; VDD = 2.5 V ± 10% 0.4 0.7 dB
500 MHz; VDD = 2.5 V ± 10% 0.5 0.8 dB
1000 MHz; VDD = 2.5 V ± 10% 0.8 1.25 dB
Isolation—RFC to RF1/RF2 S21, S12 100 MHz 57 60 dB
(CP Package) 500 MHz 46 49 dB
1000 MHz 36 43 dB
Isolation—RFC to RF1/RF2 S21, S12 100 MHz 55 60 dB
(RM Package) 500 MHz 43 47 dB
1000 MHz 34 37 dB
Isolation—RF1 to RF2 (Crosstalk) S21, S
100 MHz 55 58
12
(CP Package) 500 MHz 41 44 1000 MHz 31 37
Isolation—RF1 to RF2 (Crosstalk) S21, S
100 MHz 54 57
12
(RM Package) 500 MHz 39 42
1000 MHz 31 33
Return Loss (On Channel)
4
S11, S22 DC to 100 MHz 21 27 dB
500 MHz 22 27 dB
1000 MHz 22 26 dB
Return Loss (Off Channel)4 S11, S22 DC to 100 MHz 18 23 dB
ADG918 500 MHz 17 21 dB
1000 MHz 16 20 dB
On Switching Time4 tON 50% CTRL to 90% RF 6.6 10 ns
Off Switching Time4 t
Rise Time4 t
Fall Time4 t
1 dB Compression4 P
50% CTRL to 10% RF 6.5 9.5 ns
OFF
10% to 90% RF 6.1 9 ns
RISE
90% to 10% RF 6.1 9 ns
FALL
1000 MHz 17 dBm
–1 dB
Third Order Intermodulation Intercept IP3 900 MHz/901 MHz, 4 dBm 30 36 dBm
Video Feedthrough
5
2.5 mV p-p
DC ELECTRICAL CHARACTERISTICS
Input High Voltage V
V
Input Low Voltage V
V
Input Leakage Current II
VDD = 2.25 V to 2.75 V 1.7 V
INH
VDD = 1.65 V to 1.95 V 0.65 VCC V
INH
VDD = 2.25 V to 2.75 V 0.7 V
INL
VDD = 1.65 V to 1.95 V 0.35 VCCV
INL
0 ≤ V
≤ 2.75 V
IN
± 0.1 ± 1 µA
CAPACITANCE4
RF1/RF2, RF Port On Capacitance CRF ON f = 1 MHz 1.6 pF
CTRL Input Capacitance C
f = 1 MHz 2 pF
CTRL
POWER REQUIREMENTS
VDD 1.65 2.75 V
Quiescent Power Supply Current IDD Digital inputs = 0 V or VDD 0.1 1 µA
1
Temperature range B Version: −40°C to +85°C.
2
Typical values are at VDD = 2.5 V and 25°C, unless otherwise stated.
3
Point at which insertion loss degrades by 1 dB.
4
Guaranteed by design, not subject to production test. 5The dc transience at the output of any port of the switch when the control voltage is switched from high to
low or low to high in a 50 Ω test setup, measured with 1 ns rise time pulses and 500 MHz bandwidth.
1
Rev. A | Page 3 of 16
ADG918/ADG919
ABSOLUTE MAXIMUM RATINGS
Table 2. (TA = 25°C, unless otherwise noted.)
Parameter Rating
VDD to GND –0.5 V to +4 V
Inputs to GND –0.5 V to VDD + 0.3 V
Continuous Current 30 mA
Input Power 18 dBm
Operating Temperature Range
Industrial (B Version) –40°C to +85°C
Storage Temperature Range –65°C to +150°C
Junction Temperature 150°C
MSOP Package
θJA Thermal Impedance
LFCSP Package
θJA Thermal Impedance (2-layer board)
θJA Thermal Impedance (4-layer board)
Lead Temperature, Soldering (10 sec) 300°C
IR Reflow, Peak Temperature (<20 sec) 235°C
ESD 1 kV
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
1
206°C/W
84°C/W
48°C/W
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause
2
permanent damage to the device. This is a stress rating only; functional
operation of the device at these or any other conditions above those listed
in the operational sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device
reliability. Only one absolute maximum rating may be applied at any one
time.
2
RF1/RF2 Off Port Inputs to Ground .............................. –0.5 V to VDD – 0.5 V
Rev. A | Page 4 of 16
ADG918/ADG919
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
V
CTRL
GND
RFC
DD
1
ADG918/
2
ADG919
3
TOP VIEW
(Not to Scale)
4
8
RF1
7
GND
6
GND
5
RF2
03335-A-002
Figure 4. 8-Lead MSOP (RM-8)
8-Lead 3 mm x 3 mm LFCSP (CP-8)
Table 3. Truth Table
CTRL Signal Path
0 RF2 to RFC
1 RF1 to RFC
Table 4. Pin Function Descriptions
Pin No. Mnemonic Function
1 VDD Power Supply Input. These parts can be operated from 1.65 V to 2.75 V, and VDD should be decoupled to GND.
2 CTRL CMOS or TTL Logic Level;
0->RF2 to RFC
1->RF1 to RFC
3, 6, 7 GND Ground Reference Point for All Circuitry on the Part
4 RFC COMMON RF Port for Switch
5 RF2 RF2 Port
8 RF1 RF1 Port
Rev. A | Page 5 of 16
ADG918/ADG919
TERMINOLOGY
Table 5. Terminology
Parameter Description
VDD Most positive power supply potential
IDD Positive supply current
GND Ground (0 V) reference
CTRL Logic control input
V
Maximum input voltage for Logic 0
INL
V
Minimum input voltage for Logic 1
INH
I
(I
) Input current of the digital input
INL
INH
CIN Digital input capacitance
tON Delay between applying the digital control input and the output switching on.
t
Delay between applying the digital control input and the output switching off.
OFF
t
Rise time. Time for the RF signal to rise from 10% to 90% of the ON level.
RISE
t
Fall time. Time for the RF signal to fall from 90% to 10% of the ON level.
FALL
Off Isolation The attenuation between input and output ports of the switch when the switch control voltage is in the OFF condition.
Insertion Loss The attenuation between input and output ports of the switch when the switch control voltage is in the ON condition.
P
–1 dB
IP3
Return Loss
Video
Feedthrough
1 dB compression point. The RF input power level at which the switch insertion loss increases by 1 dB over its low level
value. It is a measure of how much power the ON switch can handle before the insertion loss increases by 1 dB.
Third order intermodulation intercept. This is a measure of the power in false tones that occur when closely spaced tones
are passed through a switch, whereby the nonlinearity of the switch causes these false tones to be generated.
The amount of reflected power relative to the incident power at a port. Large return loss indicates good matching. By
measuring return loss the VSWR can be calculated from conversion charts. VSWR (voltage standing wave ratio) indicates
degree of matching present at a switch RF port.
Spurious signals present at the RF ports of the switch when the control voltage is switched from high to low or low to
high without an RF signal present.
Rev. A | Page 6 of 16
ADG918/ADG919
–
–
TYPICAL PERFORMANCE CHARACTERISTICS
–0.2
–0.4
–0.6
0
–
–1.0
–1.2
–1.4
–1.6
–1.8
–2.0
–2.2
–2.4
INSERTION LOSS (dB)
–2.6
–2.8
–3.0
–3.2
VDD = 2.25V
8
.
TA = 25°C
10k100k1M10M100M1G10G
FREQUENCY (Hz)
VDD = 2.5V
VDD = 2.75V
Figure 5. Insertion Loss vs. Frequency over Supplies
(RF1/RF2, S12, and S21)
0.30
–0.35
VDD = 2.5V
0
4
.
0
–
–0.45
–0.50
–0.55
–0.60
INSERTION (dB)
–0.65
–0.70
–0.75
–0.80
10k100k1M10M100M1G10G
VDD = 2.25V
TA = 25°C
FREQUENCY (Hz)
VDD = 2.75V
Figure 6. Insertion Loss vs. Frequency over Supplies (RF1/RF2,
S12, and S21) (Zoomed Figure 5 Plot)
–0.2
–0.4
–0.6
VDD = 1.8V
8
.
0
–
–1.0
–1.2
–1.4
–1.6
–1.8
–2.0
–2.2
–2.4
INSERTION LOSS (dB)
–2.6
–2.8
TA = 25°C
–3.0
–3.2
10k100k1M10M100M1G10G
FREQUENCY (Hz)
VDD= 1.65V
VDD = 1.95V
Figure 7. Insertion Loss vs. Frequency over Supplies
(RF1/RF2, S12, and S21)
03335-A-017
03335-A-019
03335-A-021
0.2
–0.4
–0.6
+25°C
8
.
0
–
–1.0
–1.2
–1.4
–1.6
–1.8
–2.0
–2.2
–2.4
INSERTION LOSS (dB)
–2.6
–2.8
VDD = 2.5V
–3.0
–3.2
10k100k1M10M100M1G10G
+85°C
FREQUENCY (Hz)
–40°C
Figure 8. Insertion Loss vs. Frequency over Temperature
(RF1/RF2, S12, and S21)
0
VDD = 1.65V TO 2.75V
= 25°C
T
–10
A
0
2
–
–30
–40
–50
ISOLATION (dB)
–60
–70
–80
–90
10k100k1M10M100M1G10G
S12
S21
FREQUENCY (Hz)
Figure 9. Isolation vs. Frequency over Supplies (RF1/RF2, ADG918)
0
VDD = 1.65V TO 2.75V
–10
T
= 25°C
A
0
2
–
–30
–40
–50
–60
–70
ISOLATION (dB)
–80
–90
–100
10k100k1M10M100M1G10G
S12
S21
FREQUENCY (Hz)
Figure 10. Isolation vs. Frequency over Supplies (RF1/RF2, ADG919)
03335-A-018
03335-A-020
03335-A-022
Rev. A | Page 7 of 16
ADG918/ADG919
–10
–10
VDD = 2.5V
0
2
–
–30
–30
–40
–40
–50
–50
–60
–60
–70
–70
ISOLATION (dB)
–80
–80
–90
–90
–100
–100
10k100k1M10M100M1G10G
Figure 11. Isolation vs. Frequency over Temperature (RF1/RF2, ADG919)
0
TA = 25°C
–5
V
DD
0
1
–
S12 (+85°C)
S12 (+25°C)
S12 (–40°C)
S21
(–40°C, +25°C, +85°C)
FREQUENCY (Hz)
= 2.5V
CH1
CH2/3
CH1 = CTRL = 1V/DIVT
CH2 = RF1 = 100mV/DIVT
03335-A-023
CH3 = RF2 = 100mV/DIV
RISE
FALL
= 6.1ns
= 6.1ns
03335-A-024
Figure 14. Switch Timing
–15
–20
–25
RETURN LOSS (dB)
–30
–35
–40
10k100k1M10M100M1G10G
OFF SWITCH (ADG918)
ON SWITCH
FREQUENCY (Hz)
Figure 12. Return Loss vs. Frequency (RF1/RF2, S11)
–10
TA = 25°C
5
1
–
= 2.5V
V
DD
–20
–25
–30
–35
–40
–45
–50
–55
X–TALK (dB)
–60
–65
–70
–75
–80
10k100k1M10M100M1G10G
FREQUENCY (Hz)
Figure 13. Crosstalk vs. Frequency (RF1/RF2, S12, S21)
CTRL
RFC
CH2 p-p
2.002mV
03335-A-026
CH1 500mV CH2 1mVΩm 10.0ns
03335-A-027
Figure 15. Video Feedt hrough
40
35
30
25
20
(dBm)
3
IP
15
10
5
0
03335-A-028
250350450550
FREQUENCY (MHz)
Figure 16. IP
vs. Frequency
3
VDD = 2.5V
= 25°C
T
A
650750850
03335-A-029
Rev. A | Page 8 of 16
ADG918/ADG919
20
18
16
14
12
(dBm)
10
–1dB
8
P
6
4
2
0
025050075010001250
FREQUENCY (MHz)
Figure 17. P
vs. Frequency
-1dB
VDD = 2.5V
= 25°C
T
A
1500
03335-A-025
Rev. A | Page 9 of 16
ADG918/ADG919
03335
009
V
TEST CIRCUITS*
V
DD
0.1µF
0.1µF
V
DD
V
DD
ADG919
R
50Ω
V
OUT
L
V
DD
V
V
CTRL
50Ω
CTRL
RFC
CTRL
RFC
CTRL
0.1µF
GND
V
DD
V
DD
ADG919
GND
CROSSTALK = 20log
Figure 21. Insertion Loss
V
R
50Ω
OUT
V
CTRL
L
V
OUT
50%50%
90%10%
t
OFF
ON
t
-A-
OFF
RFC
V
S
CTRL
RFx
GND
Figure 18. Switch Timing: tON t
V
DD
0.1µF
V
DD
V
R
50Ω
L
OUT
V
CTRL
V
OUT
50%50%
RISE
t
RISE
90%90%
, t
FALL
10%
t
FALL
10%
03335-A-010
RFC
V
S
CTRL
RFx
GND
Figure 19. Switch Timing: t
V
DD
0.1µF
RF1
50Ω
RF2
INSERTION LOSS = 20log
RF1
RF2
V
OUT
V
S
Figure 22. Crosstalk
DD
0.1µF
NETWORK
ANALYZER
50Ω
V
S
V
OUT
V
S
NETWORK
ANALYZER
50Ω
V
R
L
50Ω
OUT
03335-A-012
V
S
03335-A-013
OUT
V
50Ω
V
S
V
OUT
R
L
50Ω
OSCILLOSCOPE
NETWORK
ANALYZER
S
03335-A-011
V
RFC
CTRL
CTRL
GND
V
DD
ADG919
RF1
RF2
NC
NC
03335-A-014
Figure 23. Video Feedt hrough
V
CTRL
CTRL
RFC
GND
V
DD
ADG919
OFF ISOLATION = 20log
RF1
RF2
50Ω
Figure 20. Off Isolation
V
Rev. A | Page 10 of 16
ADG918/ADG919
V
V
0.1µF
V
RFC
CTRL
CTRL
SPECTRUM
ANALYZER
* Similar setups for ADG918
V
GND
DD
DD
ADG919
Figure 24. IP
RF1
RF2
3
50Ω
COMBINER
RF
SOURCE
RF
SOURCE
V
RFC
CTRL
CTRL
SPECTRUM
ANALYZER
03335-A-015
0.1µF
DD
V
DD
GND
Figure 25. P
ADG919
-1dB
RF1
RF2
50Ω
RF
SOURCE
V
S
03335-A-016
Rev. A | Page 11 of 16
ADG918/ADG919
APPLICATIONS
The ADG918/ADG919 are ideal solutions for low power, high
frequency applications. The low insertion loss, high isolation
between ports, low distortion, and low current consumption of
these parts make them excellent solutions for many high
frequency switching applications. The most obvious application
is in a transmit/receive block, as shown in the wireless metering
block diagram in Figure 26.
required isolation between the transmit and receive signals.
The SPDT configuration isolates the high frequency receive
signal from the high frequency transmit.
ANTENNA
ADG918
LNA
Other applications include switching between high frequency
filters, ASK generator, FSK generator, and antenna diversity
switch in many tuner modules.
ABSORPTIVE VS. REFLECTIVE
The ADG918 is an absorptive (matched) switch with 50 Ω
terminated shunt legs, and the ADG919 is a reflective switch
with 0 Ω terminated shunts to ground. The ADG918 absorptive
switch has a good VSWR on each port, regardless of the switch
mode. An absorptive switch should be used when there is a
need for a good VSWR that is looking into the port but not
passing the through signal to the common port. The ADG918 is
therefore ideal for applications that require minimum
reflections back to the RF source. It also ensures that the
maximum power is transferred to the load.
The ADG919 reflective switch is suitable for applications where
high off port VSWR does not matter and the switch has some
other desired performance feature. It can be used in many
applications, including high speed filter selection. In most cases,
an absorptive switch can be used instead of a reflective switch,
but not vice versa.
WIRELESS METERING
The ADG918 can be used in wireless metering applications. It
can be used in conjunction with the ADF7020 transceiver IC for
a utility metering transceiver application, providing the
TX/RX SWITCH
Figure 26. Wireless Metering
PA
03335-A-005
TUNER MODULES
The ADG918 can be used in a tuner module to switch between
the cable TV input and the off-air antenna.
This part is also ideal for use as an antenna diversity switch,
switching different antenna to the tuner.
VGA
ANTENNA
CABLE
ADG918/
ADG919
Figure 27. Tuner Modules
TUNER
03335-A-006
FILTER SELECTION
The ADG919 can be used as a 2:1 demultiplex to switch high
frequency signals between different filters and also to multiplex
the signal to the output.
RF
IN
RFC
RF1
RF2
Figure 28. Filter Selection
RF1
RF2
ADG919ADG919
RFC
RF
OUT
03335-A-007
Rev. A | Page 12 of 16
ADG918/ADG919
ADG9XX EVALUATION BOARD
The ADG9xx evaluation board allows designers to evaluate the
high performance wideband switches with a minimum of effort.
To prove that these devices meet the user’s requirements, the
user only requires a power supply and a network analyzer along
with the evaluation board. An application note is available with
the evaluation board and gives complete information on
operating the evaluation board.
The RFC port (see Figure 29) is connected through a 50 Ω
transmission line to the top left SMA connector J1. RF1 and
RF2 are connected through 50 Ω transmission lines to the top
two SMA connectors J2 and J3, respectively. A through
transmission line connects J4 and J5 and this transmission line
is used to estimate the loss of the PCB over the environmental
conditions being evaluated.
The board is constructed of a 4-layer, FR4 material with a
dielectric constant of 4.3 and an overall thickness of 0.062
inches. Two ground layers with grounded planes provide
ground for the RF transmission lines. The transmission lines
were designed using a coplanar waveguide with ground plane
model using a trace width of 0.052 inches, clearance to ground
plane of 0.030 inches, dielectric thickness of 0.029 inches, and a
metal thickness of 0.014 inches.
03335-A-008
Figure 29. ADG9xx Evaluation Board Top View
Rev. A | Page 13 of 16
ADG918/ADG919
OUTLINE DIMENSIONS
3.00
BSC
85
3.00
BSC
PIN 1
0.65 BSC
0.15
0.00
0.38
0.22
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187AA
Figure 30. 8-Lead Mini Small Outline Package [MSOP]
4.90
BSC
4
1.10 MAX
0.23
SEATING
PLANE
0.08
(RM-8)
Dimensions shown in millimeters
0.50
0.40
8
5
BOTTOM
VIEW
0.30
4
1
1.60
1.45
1.30
1.50
REF
PIN 1
INDICATOR
1.90
1.75
1.60
3.00
BSC SQ
PIN 1
INDICATOR
0.90
0.85
8°
0°
0.80
0.60
0.40
0.80
SEATING
PLANE
12° MAX
0.30
0.23
0.18
TOP
VIEW
0.80 MAX
0.65TYP
2.75
BSC SQ
0.20 REF
0.05 MAX
0.02 NOM
0.45
0.60 MAX
0.50
BSC
0.25
MIN
Figure 31. 8-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm x 3 mm Body
(CP-8)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option Branding
ADG918BRM –40°C to +85°C Mini Small Outline Package (MSOP) RM–8 W4B
ADG918BRM-500RL7 –40°C to +85°C Mini Small Outline Package (MSOP) RM–8 W4B
ADG918BRM-REEL –40°C to +85°C Mini Small Outline Package (MSOP) RM–8 W4B
ADG918BRM-REEL7 –40°C to +85°C Mini Small Outline Package (MSOP) RM–8 W4B
ADG918BRMZ1 –40°C to +85°C Mini Small Outline Package (MSOP) RM–8 W4C
ADG918BRMZ-REEL
ADG918BRMZ-REEL71–40°C to +85°C Mini Small Outline Package (MSOP) RM–8 W4C
ADG918BCP-500RL7 –40°C to +85°C Lead Frame Chip Scale Package (LFCSP) CP–8 W4B
ADG918BCP-REEL7 –40°C to +85°C Lead Frame Chip Scale Package (LFCSP) CP–8 W4B
ADG919BRM –40°C to +85°C Mini Small Outline Package (MSOP) RM–8 W5B
ADG919BRM-500RL7 –40°C to +85°C Mini Small Outline Package (MSOP) RM–8 W5B
ADG919BRM-REEL –40°C to +85°C Mini Small Outline Package (MSOP) RM–8 W5B
ADG919BRM-REEL7 –40°C to +85°C Mini Small Outline Package (MSOP) RM–8 W5B
ADG919BCP-500RL7 –40°C to +85°C Lead Frame Chip Scale Package (LFCSP) CP–8 W5B
ADG919BCP-REEL7 –40°C to +85°C Lead Frame Chip Scale Package (LFCSP) CP–8 W5B
EVAL-ADG918EB Evaluation Board
EVAL-ADG919EB Evaluation Board
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Z = Pb-free part.
1
–40°C to +85°C Mini Small Outline Package (MSOP) RM–8 W4C