Wideband switch: –3 dB @ 2.5 GHz
ADG904: absorptive 4:1 mux/SP4T
ADG904-R: reflective 4:1 mux/SP4T
High off isolation (37 dB @ 1 GHz)
Low insertion loss (1.1 dB dc to 1 GHz)
Single 1.65 V to 2.75 V power supply
CMOS/LVTTL control logic
20-lead TSSOP and 4 mm × 4 mm LFCSP packages
Low power consumption (1 μA maximum)
APPLICATIONS
Wireless communications
General-purpose RF switching
Dual-band applications
High speed filter selection
Digital transceiver front end switch
IF switching
Tuner modules
Antenna diversity switching
GENERAL DESCRIPTION
The ADG904 and ADG904-R are wideband analog 4:1
multiplexers that use a CMOS process to provide high isolation
and low insertion loss to 1 GHz. The ADG904 is an
absorptive/matched mux with 50 Ω terminated shunt legs; the
ADG904-R is a reflective mux. These devices are designed such
that the isolation is high over the dc to 1 GHz frequency range.
The ADG904 and ADG904-R switch one of four inputs to a
c
ommon output, RFC, as determined by the 3-bit binary
address lines A0, A1, and
the device.
–10
VDD = 2.5V
–20
–30
–40
–50
–60
INSERTION LOSS (dB)
–70
–80
Figure 3. Off Is olation v s. Frequency Figure 4. Inser tion Loss vs. Fre quency
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
. A Logic 1 on the EN pin disables
EN
S21
S12
FREQUENCY (Hz)
10G10k100k1M10M100M1G
04504-0-028
CMOS 1.65 V to 2.75 V, 4:1 Mux/SP4T
ADG904/ADG904-R
FUNCTIONAL BLOCK DIAGRAMS
RFC
ADG904-R
04504-0-001
RF1
RF2
RF3
RF4
1 OF 4 DECODER
A0 A1 EN
RFC
04504-0-012
10G10k100k1M10M100M1G
04504-0-029
ADG904
RF1
50Ω
RF2
50Ω
RF3
50Ω
RF4
50Ω
1 OF 4 DECODER
A0 A1 EN
Figure 1. Figure 2.
The parts have on-board CMOS control logic, which eliminates
t
he need for external control circuitry. The control inputs
are both CMOS and LVTTL compatible. The low power
consumption of these devices makes them ideally suited
for wireless applications and general-purpose high
frequency switching.
VDD = 1.65 V to 2.75 V, GND = 0 V, Input Power = 0 dBm, all specifications T
MIN
to T
, unless otherwise noted.
MAX
Table 1.
B Version
Parameter Symbol Conditions Min Typ2Max Unit
AC ELECTRICAL CHARACTERISTICS
Operating Frequency3 DC 2 GHz
3 dB Frequency4 2.5 GHz
Input Power
4
0 V dc bias 7 dBm
0.5 V dc bias 16 dBm
Insertion Loss S21, S12 DC to 100 MHz; VDD = 2.5 V ± 10% 0.4 0.8 dB
500 MHz; VDD = 2.5 V ± 10% 0.6 0.9 dB
1000 MHz; VDD = 2.5 V ± 10% 1.1 1.5 dB
Isolation—RFC to RF1–RF4 S21, S
100 MHz 51 60 dB
12
500 MHz 35 45 dB
1000 MHz 30 37 dB
Crosstalk S21, S
100 MHz 50 58 dB
12
500 MHz 35 32 dB
1000 MHz 30 35 dB
Return Loss (On Channel)4 S11, S
DC to 100 MHz 21 27 dB
22
500 MHz 18 26 dB
1000 MHz 15 30 dB
Return Loss (Off Channel)4 S11, S
DC to 100 MHz 18 22 dB
22
500 MHz 16 23 dB
1000 MHz 18 22 dB
On Switching Time
Off Switching Time
4
4
Transition Time t
Rise Time
Fall Time
1 dB Compression
4
4
4
Third-Order Intermodulation Intercept IP
Video Feedthrough
5
t
ON (EN)
t
OFF (EN)
TRANS
t
RISE
t
FALL
P
–1 dB
3
50% EN to 90% RF
50% EN to 10% RF
50% Ax to 10% RF 12 15 ns
10% to 90% RF 3 5 ns
90% to 10% RF 7.5 9 ns
B1000 MHz 16 dBm
900 MHz/901 MHz, 4 dBm 26.5 31 dBm
3 mV p-p
8.5 10 ns
13 16 ns
DC ELECTRICAL CHARACTERISTICS
Input High Voltage V
V
Input Low Voltage V
V
Input Leakage Current I
CAPACITANCE
4
INH
INH
INL
INL
I
VDD = 2.25 V to 2.75 V 1.7 V
VDD = 1.65 V to 1.95 V 0.65 V
CC
VDD = 2.25 V to 2.75 V 0.7 V
VDD = 1.65 V to 1.95 V 0.35 V
0 ≤ VIN ≤ 2.75 V ± 0.1 ± 1 μA
RF Port On Capacitance CRF ON f = 1 MHz 3 pF
Digital Input Capacitance C f = 1 MHz 2 pF
POWER REQUIREMENTS
V
DD
Quiescent Power Supply Current I
1
Temperature range B version: −40°C to +85°C.
2
Typical values are at VDD = 2.5 V and 25°C, unless otherwise stated.
3
Operating frequency is the point at which insertion loss degrades by 1.5 dB.
4
Guaranteed by design, not subject to production test.
5
Video feedthrough is the dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 Ω test
setup, measured with 1 ns rise time pulses and 500 MHz bandwidth.
1.65 2.75 V
DD
Digital inputs = 0 V or V
DD
0.1 1 μA
1
V
V
CC
Rev. B | Page 3 of 16
ADG904/ADG904-R
www.BDTIC.com/ADI
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 2.
Parameter Rating
VDD to GND –0.5 V to +4 V
Inputs to GND –0.5 V to VDD + 0.3 V
Continuous Current 30 mA
Input Power 18 dBm
Operating Temperature Range
Industrial (B Version) –40°C to +85°C
Storage Temperature Range –65°C to +150°C
Junction Temperature 150°C
TSSOP Package
θJA Thermal Impedance 143°C/W
LFCSP Package
θJA Thermal Impedance
(4-Layer Board)
Lead Temperature, Soldering (10 sec) 300°C
IR Reflow, Peak Temperature (<20 sec) 235°C
ESD 1 kV
1
RFx off port inputs to ground = –0.5 V to VDD – 0.5 V.
30.4°C/W
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability. Only one absolute maximum rating may be
applied at any one time.
Table 3. Truth Table
A1 A0
X X 1 None
0 0 0 RF1
0 1 0
1 0 0
1 1 0 RF4
1
Off switches have: 50 Ω termination to GND (ADG904); shunt to GND
(ADG904-R).
EN
ON Switch
RF2
RF3
1
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. B | Page 4 of 16
ADG904/ADG904-R
G
GNDG
G
G
www.BDTIC.com/ADI
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
EN
V
ND
RF1
ND
RF3
ND
ND
RFC
DD
1
2
3
ADG904
4
ADG904-R
5
TOP VIEW
(Not to Scale)
6
7
8
9
10
20
A0
19
A1
18
GND
17
RF2
16
GND
15
GND
14
RF4
13
GND
12
GND
11
GND
04504-0-002
Figure 5. 20-Lead TSSOP (RU-20) Figure 6
Table 4. Pin Function Descriptions
Pin No.
20-Lead TSSOP 20-Lead LFCSP Mnemonic Function
1 18
EN
Active Low Digital Input. When high, the device is disabled and all switches
are off. When low, Ax logic inputs determine On switches.