Analog Devices ADG901 2 a Datasheet

Wideband, 40 dB Isolation at 1 GHz, CMOS

RF2

CTRL

ADG901

RF1

50

RF2

CTRL

ADG902

RF1

1.65 V to 2.75 V, SPST Switches ADG901/ADG902

FEATURES Wideband Switch: –3 dB @ 4.5 GHz Absorptive/Reflective Switches High Off Isolation (40 dB @ 1 GHz) Low Insertion Loss (0.8 dB @1 GHz) Single 1.65 V to 2.75 V Power Supply CMOS/LVTTL Control Logic 8-Lead MSOP and Tiny 3 mm  3 mm LFCSP Packages Low Power Consumption (<1 A)

APPLICATIONS Wireless Communications General-Purpose RF Switching Dual-Band Applications High Speed Filter Selection Digital Transceiver Front End Switch IF Switching Tuner Modules Antenna Diversity Switching

GENERAL DESCRIPTION

The ADG901/ADG902 are wideband switches that use a CMOS process to provide high isolation and low insertion loss to 1 GHz. The ADG901 is an absorptive (matched) switch with 50 Ω terminated shunt legs, while the ADG902 is a reflective switch. These devices are designed such that the isolation is high over the dc to 1 GHz frequency range. They have on-board CMOS control logic, thus eliminating the need for external controlling circuitry. The control inputs are both CMOS and

FUNCTIONAL BLOCK DIAGRAMS

LVTTL compatible. The low power consumption of these CMOS devices makes them ideally suited to wireless applications and general-purpose high frequency switching.

PRODUCT HIGHLIGHTS

1. –40 dB Off Isolation @ 1 GHz

2. 0.8 dB Insertion Loss @ 1 GHz

3. Tiny 8-Lead MSOP/LFCSP Packages

TA = 25C

–10

–

–30

–40

–50

VDD = 2.5 V

FREQUENCY (Hz)

= 1.8 V

–60

ISOLATION (dB)

–70

–80

–90

–100

10k 100k 1M 10M 100M 1G 10G

Figure 1. Off Isolation vs. Frequency

REV. A

Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.

–0.4

–0.6

0.8

–

–1.0

–1.2

–1.4

–1.6

–1.8

–2.0

–2.2

INSERTION LOSS (dB)

–2.4

–2.6

VDD = 2.5V

= 25C

–2.8

–3.0

10k 100k 1M 10M 100M 1G 10G

FREQUENCY (Hz)

Figure 2. Insertion Loss vs. Frequency

(VDD = 1.65 V to 2.75 V, GND = 0 V, input power = 0 dBm,

ADG901/ADG902–SPECIFICATIONS

all specifications T

MIN

to T

, unless otherwise noted.)

MAX

B Version

Parameter Symbol Conditions Min Typ2Max Unit

AC ELECTRICAL CHARACTERISTICS

Operating Frequency –3 dB Frequency Input Power

DC 2.5 GHz

4.5 GHz 0 V dc Bias 7 dBm +0.5 V dc Bias 16 dBm

Insertion Loss S

, S

Isolation—RF1 to RF2 S21, S

DC to 100 MHz; VDD = 2.5 V ± 10% 0.4 0.7 dB

500 MHz; V 1000 MHz; V 100 MHz 60 61 dB

= 2.5 V ± 10% 0.5 0.8 dB

= 2.5 V ± 10% 0.8 1.25 dB

(CP Package) 500 MHz 43 45 dB

1000 MHz 34 40 dB

Isolation—RF1 to RF2 S

, S

100 MHz 51 60 dB

(RM Package) 500 MHz 37.5 47 dB

1000 MHz 31 37 dB DC to 100 MHz 20 28 dB

Return Loss (On Channel)

S11, S

500 MHz 23 29 dB

Return Loss (Off Channel)

S11, S

1000 MHz 25 28 dB DC to 100 MHz 18 23 dB

500 MHz 17 21 dB

On Switching Time Off Switching Time Rise Time Fall Time

1 dB Compression Third Order Intermodulation Intercept IP Video Feedthrough

t t t t P

OFF

RISE

FALL

–1 dB

1000 MHz 15 19 dB 50% CTRL to 90% RF 3.6 6 ns 50% CTRL to 10% RF 5.8 9.5 ns 10% to 90% RF 3.1 5.5 ns 90% to 10% RF 6.0 8.5 ns 1000 MHz 17 dBm 900 MHz/901 MHz, 4 dBm 30 36 dBm

2.5 mV p-p

DC ELECTRICAL CHARACTERISTICS

Input High Voltage V

Input Low Voltage V

Input Leakage Current I

CAPACITANCE

INH

INL

VDD = 2.25 V to 2.75 V 1.7 V VDD = 1.65 V to 1.95 V 0.65 V

V VDD = 2.25 V to 2.75 V 0.7 V VDD = 1.65 V to 1.95 V 0.35 VCCV 0 ≤ VIN ≤ 2.75 V ± 0.1 ±1 µA

RF1/RF2, RF Port On Capacitance CRF ON f = 1 MHz 1.2 pF CTRL Input Capacitance C

CTRL

f = 1 MHz 2.1 pF

POWER REQUIREMENTS

Quiescent Power Supply Current I

NOTES

Temperature range B Version: –40°C to +85°C.

Typical values are at VDD = 2.5 V and 25°C, unless otherwise stated.

Point at which insertion loss degrades by 1 dB.

Guaranteed by design, not subject to production test.

The dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 Ω test setup, measured with 1 ns rise time pulses and 500 MHz bandwidth.

Specifications subject to change without notice.

Digital inputs = 0 V or V

1.65 2.75 V

0.1 1 µA

REV. A–2–

ADG901/ADG902

ABSOLUTE MAXIMUM RATINGS

(TA = 25°C, unless otherwise noted.)

VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4 V

Inputs to GND . . . . . . . . . . . . . . . . . . –0.5 V to V

Continuous Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA

Input Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 dBm

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C

MSOP Package

Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206°C/W

␪

+ 0.3 V

LFCSP Package

Thermal Impedance (2-layer board) . . . . . . . . . . 84°C/W

␪

Thermal Impedance (4-layer board) . . . . . . . . . . 48°C/W

␪

Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . 300°C

IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . . 235°C

ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 kV

NOTES

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time.

RF1/2 Off Port Inputs to Ground ................................... –0.5 V to VDD – 0.5 V

ORDERING GUIDE

Model Temperature Range Package Description Package Option Branding

ADG901BRM –40°C to +85°CMini Small Outline Package (MSOP) RM-8 W6B ADG901BRM-500RL7 –40°C to +85°CMini Small Outline Package (MSOP) RM-8 W6B ADG901BRM-REEL7 –40°C to +85°CMini Small Outline Package (MSOP) RM-8 W6B ADG901BCP-500RL7 –40°C to +85°CLead Frame Chip Scale Package (LFCSP) CP-8 W6B ADG901BCP-REEL7 –40°C to +85°CLead Frame Chip Scale Package (LFCSP) CP-8 W6B ADG902BRM –40°C to +85°CMini Small Outline Package (MSOP) RM-8 W7B ADG902BRM-500RL7 –40°C to +85°CMini Small Outline Package (MSOP) RM-8 W7B ADG902BRM-REEL7 –40°C to +85°CLead Frame Chip Scale Package (LFCSP) RM-8 W7B ADG902BCP-500RL7 –40°C to +85°CLead Frame Chip Scale Package (LFCSP) CP-8 W7B ADG902BCP-REEL7 –40°C to +85°CLead Frame Chip Scale Package (LFCSP) CP-8 W7B EVAL-ADG901EB Evaluation Board EVAL-ADG902EB Evaluation Board

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG901/ADG902 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.

PIN CONFIGURATION

8-Lead MSOP (RM-8)

8-Lead 3 mm  3 mm LFCSP (CP-8)

CTRL

GND

RF1

ADG901/

ADG902

TOP VIEW

(Not to Scale)

RF2

GND

Pin No. Mnemonic Function

2 CTRL CMOS or TTL Logic Level.

PIN FUNCTION DESCRIPTIONS

Power Supply Input. These parts can be operated from 1.65 V to 2.75 V;

should be decoupled to GND.

➞

RF1 Isolated from RF2

➞

RF1 to RF2

3, 5, 6, 7 GND Ground Reference Point for All

Circuitry on the Part.

Table I. Truth Table

4 RF1 RF1 Port. 8 RF2 RF2 Port.

CTRL Signal Path

0 RF1 isolated from RF2 1 RF1 to RF2

REV. A

–3–

ADG901/ADG902

TERMINOLOGY

Parameter Description

GND Ground (0 V) reference.

CTRL Logic control input.

INL

INH

INL (IINH

OFF

RISE

FALL

) Input current of the digital input.

Off Isolation The attenuation between input and output ports of the switch when the switch control voltage is in the

Insertion Loss The attenuation between input and output ports of the switch when the switch control voltage is in the

–1 dB

Return Loss The amount of reflected power relative to the incident power at a port. Large return loss indicates good matching.

Video Feedthrough Spurious signals present at the RF ports of the switch when the control voltage is switched from high to low

Most positive power supply potential.

Positive supply current.

Maximum input voltage for Logic 0.

Minimum input voltage for Logic 1.

Digital input capacitance.

Delay between applying the digital control input and the output switching on.

Delay between applying the digital control input and the output switching off.

Rise time. Time for the RF signal to rise from 10% to 90% of the ON level.

Fall time. Time for the RF signal to fall from 90% to 10% of the ON level.

OFF condition.

ON condition.

1 dB compression point. The RF input power level at which the switch insertion loss increases by 1 dB over its low level value. It is a measure of how much power the ON switch can handle before the insertion loss increases by 1 dB.

Third order intermodulation intercept. This is a measure of the power in false tones that occur when closely spaced tones are passed through a switch, whereby the nonlinearity of the switch causes these false tones to be generated.

By measuring Return Loss the VSWR can be calculated from conversion charts. VSWR (voltage standing wave ratio) indicates degree of matching present at a switch RF port.

or low to high without an RF signal present.

REV. A–4–

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